Release film for chip multilayer ceramic capacitor

Abstract

The utility model discloses a release film for a chip multilayer ceramic capacitor, which comprises a base material layer provided with a bearing surface and an inner surface opposite to each other along the layer thickness, core parts arranged along the transverse direction, and folding side edges respectively arranged at two sides of the core parts; the core ultra-light release layer is arranged corresponding to the core parts of the bearing surface and the inner surface; the side edge coating is arranged corresponding to the folded side edge of the bearing surface and is provided with first high-viscosity glue strips arranged in the transverse direction and ultra-light release strips clamped between the first high-viscosity glue strips; the second high-viscosity adhesive tape is arranged corresponding to the folding side edge of the inner surface and is opposite to the ultra-light release strip along the layer thickness direction; the side ultra-light release strips are adjacent to the second high-viscosity glue strip and are respectively arranged on two sides of the second high-viscosity glue strip; the first high-viscosity adhesive tape and the core ultra-light release layer on the bearing surface are in a coplanar state or the first high-viscosity adhesive tape and the second high-viscosity adhesive tape are in a fit state. By folding the edge of the ceramic dielectric green film wrapped by the side edge and folding the edge outwards, the two surfaces of the falling broken film chips are effectively prevented from being fixed, and the coating on the side edge adsorbs finer dust.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of release film, especially to a release film for chip multilayer ceramic capacitor. BACKGROUND

[0002] The MLCC release film is a consumable that must be used in the production process of MLCC (multilayer ceramic capacitor). In the production process of MLCC, ceramic slurry is coated on the MLCC release film, and the product needs to be stacked after drying and cutting. The MLCC release film plays a role in bottom support and surface protection in the entire production process.

[0003] With the development of high capacitance and miniaturization of MLCC, the thickness of the ceramic medium green film cast on the release film is becoming smaller and smaller. This requires the release film to be flatter, more resistant to high temperatures, and less sticky, which is conducive to the flatness during the lamination process of the ceramic medium green film and the easy peelability after production.

[0004] The patent CN114709074A discloses a ceramic diaphragm manufacturing method and a chip ceramic capacitor. The surface area of the base film is divided into a main area in the middle and an edge area on the opposite sides of the main area. A release film is laid on the main area of the base film. The prepared ceramic slurry is cast on the release film, and the ceramic slurry enters the edge area beyond the main area where the release film is located. The disadvantages are that the ceramic slurry is prone to flow at the edge of the release film, resulting in poor flatness of the ceramic medium green film. Although most of the ceramic medium green film at the edge of the release film is not easy to fall off and break into pieces, dust and broken film debris not bonded to the base film may fly to the surface of the ceramic medium green film.

[0005] Therefore, it is necessary to improve the release film for chip multilayer ceramic capacitor in the prior art. UTILITY MODEL CONTENTS

[0006] The utility model aims to overcome the defects in the prior art and provide a release film for chip multilayer ceramic capacitor. The core part arranged along the horizontal direction of the base material layer and the folded side edges arranged on both sides of the core part, combined with the core part ultra-light release layer, realize the coating and preparation of the ceramic medium green film. Combined with the side edge coating, the second high-adhesive strip, and the side edge ultra-light release strip, the folded side edges cover the edges of the ceramic medium green film and are folded outward. Not only are the two surfaces of the broken film debris effectively prevented from falling off, but also the finer dust is adsorbed and bonded by the side edge coating.

[0007] To achieve the above technical effects, the technical scheme of the utility model is as follows: a release film for chip multilayer ceramic capacitor, comprising:

[0008] A substrate layer having a supporting surface and an inner surface opposite to the supporting surface along the layer thickness, a core arranged along the transverse direction and folded side edges arranged on both sides of the core;

[0009] A core ultra-light release layer arranged corresponding to the core of the supporting surface and the inner surface;

[0010] A side coating layer arranged corresponding to the folded side edges of the supporting surface, and provided with a first high-adhesion strip arranged along the transverse direction and an ultra-light release strip arranged between the first high-adhesion strips;

[0011] A second high-adhesion strip arranged corresponding to the folded side edges of the inner surface and opposite to the ultra-light release strip along the layer thickness;

[0012] A side ultra-light release strip arranged adjacent to and on both sides of the second high-adhesion strip;

[0013] The first high-adhesion strip is coplanar with the core ultra-light release layer of the supporting surface or is in close contact with the second high-adhesion strip.

[0014] Preferably, a high-temperature resistant coating layer is arranged between the substrate layer and the core ultra-light release layer, and the width of the high-temperature resistant coating layer is consistent with the width of the substrate layer.

[0015] Preferably, the high-temperature resistant coating layer is a polyurethane modified epoxy resin coating layer.

[0016] Preferably, the material of the core ultra-light release layer, the ultra-light release strip and the side ultra-light release strip is an organic silicon release agent.

[0017] Preferably, the material of the first high-adhesion strip and the second high-adhesion strip is one of a polyurethane adhesive and an organic silicon adhesive.

[0018] Preferably, at least one of the core ultra-light release layers is provided with an antistatic protective film on the surface opposite to the substrate layer, and the width of the antistatic protective film is consistent with the width of the substrate layer.

[0019] The advantages and beneficial effects of the present application are as follows:

[0020] The release film structure for the sheet type multilayer ceramic capacitor is reasonable, the core arranged along the transverse direction of the substrate layer and the folded side edges arranged on both sides of the core are combined with the core ultra-light release layer to realize the coating and preparation of the ceramic medium green film, and the side coating layer, the second high-adhesion strip and the side ultra-light release strip are combined to realize the edge of the folded side edges coated with the ceramic medium green film and turned over, which not only effectively prevents the two surfaces of the falling and broken film debris from being fixed, but also the finer dust is adsorbed and adhered by the side coating layer. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a horizontal section schematic view of the release film for the chip multilayer ceramic capacitor of the utility model;

[0022] Figure 2 is a plan view of the release film for the chip multilayer ceramic capacitor of the utility model;

[0023] Figure 3 is a bottom view of the release film for the chip multilayer ceramic capacitor of the utility model;

[0024] Figure 4 is a schematic view of the first high adhesive strip of the release film in the state of being attached to the second high adhesive strip.

[0025] In the figure: 1, base material layer; 3, high temperature resistant coating; 11, bearing surface; 12, inner surface; 21, core ultra-light release layer; 22, side coating; 100, core; 101, folded side; 221, first high adhesive strip; 222, ultra-light release strip; 231, side ultra-light release strip; 232, second high adhesive strip. DETAILED DESCRIPTION

[0026] The specific embodiments of the utility model will be further described below in combination with the drawings and examples. The following examples are only used to more clearly illustrate the technical scheme of the utility model, and cannot limit the protection scope of the utility model.

[0027] The "inner surface", "side edge" and "core" are referenced to the normal use state of the release film for the chip multilayer ceramic capacitor, and are only used to facilitate the description of the utility model and simplify the description, and are not used to indicate or imply that the indicated device or element must have a specific orientation, structure and operation, and therefore cannot be understood as a limitation on the utility model.

[0028] In addition, the terms "first", "second" and the like are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the utility model creation, unless otherwise specified, the meaning of "multiple" is two or more.

[0029] As Figures 1-4The utility model discloses a sheet type multilayer ceramic capacitor with release film, including substrate layer 1, core ultra -light release layer 21, side edge coating 22, second high viscous adhesive strip 232, side edge ultra -light release strip 231, substrate layer 1 has along the relative bearing surface 11 and inner surface 12 of layer thickness, along the transverse arrangement core portion 100 and the folding side 101 of being divided in the both sides of core portion 100, core portion 100 is set up corresponding the core portion 100 of bearing surface 11 and inner surface 12 of release layer 21, folding side 101 of setting corresponding bearing surface 11 of side edge coating 22, is provided with along the transverse arrangement first high viscous adhesive strip 221 and the ultra -light release strip 222 of being clamped between first high viscous adhesive strip 221, second high viscous adhesive strip 233 is set up corresponding the folding side 101 of inner surface 12, and the ultra -light release strip 222 is opposite along the layer thickness direction, and the side edge ultra -light release strip 231 is adjacent with second high viscous adhesive strip 232 and is divided in its both sides, and first high viscous adhesive strip 221 is with the coplanar state or with second high viscous adhesive strip 232 and is with the state of being pasted together with the core ultra -light release layer 21 of bearing surface 11.

[0030] Through the core portion 100 along the transverse arrangement of substrate layer 1 and the folding side 101 of being divided in the both sides of core portion 100, the coating and preparation of ceramic medium green film are realized in combination with core ultra -light release layer 21, and the edge of folding side 101 is realized to the ceramic medium green film in combination with side edge coating 22, second high viscous adhesive strip 232 and side edge ultra -light release strip 231 and is turned over, not only effectively prevent the two surface fixation of the falling off broken film dust, and the more fine dust is adsorbed and adhered by side edge coating.

[0031] Second high viscous adhesive strip 232 is set up corresponding the folding side 101 of inner surface 12, to improve the adhesion firmness of first high viscous adhesive strip 221 when being with second high viscous adhesive strip 232 and being pasted together, prevent the dust adhered on side edge coating 22 from contacting ceramic medium green film due to the degumming, influence its quality, and second high viscous adhesive strip 232 is opposite along the layer thickness direction with ultra -light release strip 222, facilitate second high viscous adhesive strip 232 to be peeled off from the use of winding state.

[0032] In order to improve the high temperature resistance of the release film, prevent shrinkage during use, cause unevenness of the film surface, and have a negative impact on the quality of the ceramic medium film, a high temperature resistant coating 3 is arranged between the substrate layer 1 and the core ultra-light release layer 21, and the width of the high temperature resistant coating 3 is consistent with the width of the substrate layer 1. Further, the high temperature resistant coating 3 is a polyurethane modified epoxy resin coating. Epoxy resin itself has very strong adhesion, and after polyurethane modification, it further enhances this point, making it show better adhesion on a variety of substrates; the addition of polyurethane significantly improves the flexibility of the coating, making it less prone to cracking when bending or stretching; the modified coating has excellent resistance to most chemicals (such as acids, bases, solvents and oils); the modified coating has stronger resistance to ultraviolet light and atmospheric environment, reducing the risk of aging and discoloration; the modification of polyurethane can further improve the high temperature resistance of the coating, so that it can still maintain stability at higher temperatures. The excellent adhesion and flexibility of the coating can enhance the overall structural stability and flatness of the release film, reducing the risk of delamination or peeling.

[0033] The material of the core ultra-light release layer 21, the ultra-light release strip 222 and the side edge ultra-light release strip 231 is organic silicon release agent. Organic silicon release agent can form a thin and uniform release layer on the surface of the substrate, making the adhesive or other materials easy to separate from the substrate without leaving residues; organic silicon release agent can maintain stable performance within a wide temperature range, and can withstand temperatures as high as 200°C or even higher, which makes them perform well in high temperature processing processes (such as hot pressing, baking, etc.); organic silicon release agent has good resistance to a variety of chemicals (such as solvents, acids, bases, etc.), and will not lose its release properties when it comes into contact with these substances, making it very durable in industrial production; the coating formed by organic silicon release agent has good flexibility and is not prone to cracking or peeling, making it suitable for use on flexible substrates (such as films, paper, etc.). This makes the release film still maintain good release effect when bending or stretching.

[0034] The material of the first high adhesive strip 221 and the second high adhesive strip 232 is one of polyurethane adhesive and organic silicon glue. Polyurethane adhesive has good initial adhesion and final bonding strength; good flexibility can absorb stress and reduce the risk of adhesion failure caused by vibration or impact; it has good resistance to many solvents, acids, bases and oils, making it suitable for use in harsh environments; the viscosity range of polyurethane adhesive is wide. Organic silicon glue has excellent temperature resistance and maintains stable performance within a wide temperature range, with the most outstanding feature being its excellent high temperature resistance, which can reach more than 300°C; it has good weather resistance and chemical resistance; cured organic silicon glue has low modulus, which can absorb stress and reduce the risk of deformation and cracking of the substrate; the viscosity range of organic silicon glue is also wide.

[0035] At least one core part ultra-light release layer 21 is provided with an antistatic protective film (not shown) on the surface opposite to the substrate layer 1, and the width of the antistatic protective film is consistent with the width of the substrate layer 1.

[0036] The above only describes the preferred embodiments of the present application, and it should be pointed out that for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should be considered as the protection scope of the present application.

Claims

1. A release film for a chip multilayer ceramic capacitor, characterized by, The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core.

2. The release film for a chip multilayer ceramic capacitor according to claim 1, characterized by The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core.

3. The release film for chip multilayer ceramic capacitors according to claim 2, characterized by The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core.

4. The release film for chip multilayer ceramic capacitors according to claim 1, characterized by The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core.

5. The release film for chip multilayer ceramic capacitors according to claim 1, characterized by The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core.

6. The release film for chip multilayer ceramic capacitors according to claim 1, characterized by The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a transverse direction and folded side edges arranged on both sides of the core. The application relates to a substrate layer with a supporting surface and an inner surface, a core arranged in a trans

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