Inertial sensor module, damping structure, method, device, equipment and medium

Abstract

The invention relates to the technical field of sensor damping, in particular to an inertial sensor module, a damping structure, a damping method, a damping device, damping equipment and a medium. Performing frequency domain characteristic analysis on each first acceleration data queue, and outputting a first voltage indication for adjusting the input voltage of the damping block according to a frequency domain amplitude obtained by the frequency domain characteristic analysis; acquiring a plurality of second acceleration data queues, and determining a first phase angle according to each second acceleration data queue; and finally, superposing a first waveform opposite to the first phase angle on the first voltage indication, and outputting the superposed first waveform as a second voltage indication. According to the inertial sensor, the acceleration data value is obtained, and frequency domain analysis is performed on the data twice. According to the method, passive and active damping is adopted, so that the influence of vibration on the inertial sensor is greatly reduced.

Description

Technical Field

[0001] This invention relates to the field of sensor vibration reduction technology, and in particular to an inertial sensor module, vibration reduction structure, method, device, equipment and medium. Background Technology

[0002] MEMS inertial measurement units, or microelectromechanical systems for short, are widely used in aerospace, automotive electronics, consumer electronics, and many other fields. Leveraging their advantages of small size, low cost, and low power consumption, MEMS inertial measurement units operate based on the mechanical properties of micromechanical structures.

[0003] In real-world working environments, MEMS inertial measurement units are subject to various vibration interferences. Vibration can cause additional displacement and deformation of the microstructure of the MEMS inertial measurement unit, resulting in noise and drift in the output signal. This leads to increased error in the output signal of the MEMS inertial measurement unit, reducing measurement accuracy and reliability.

[0004] Meanwhile, with the continuous improvement of the range and speed of carriers, MEMS inertial measurement units are being used more frequently in high-overload and high-impact application environments. High-overload environments can generate impacts of several thousand to tens of thousands of grams instantaneously, which can easily lead to deformation of the external structure of the MEMS inertial measurement unit, bending of the internal circuit board, detachment of components, detachment of internal chips, breakage of bonding wires, and damage to the overall circuitry. This results in a decline in the overall performance of the MEMS inertial measurement unit or complete failure.

[0005] Therefore, effective vibration reduction measures are needed to improve the performance of MEMS inertial measurement units. Based on this, a vibration reduction structure needs to be developed and designed. Summary of the Invention

[0006] The present invention provides an inertial sensor module, a vibration damping structure, a method, an apparatus, a device, and a medium to solve the problem that MEMS inertial measurement units are prone to failure after vibration in the prior art.

[0007] In a first aspect, embodiments of the present invention provide a shock-absorbing structure, comprising: Housing, gland, and first frame; The upper surface of the housing has an opening; The first frame has multiple first damping blocks on its side and multiple second damping blocks on its upper surface. The housing has an inwardly inclined inner wall, and the first frame abuts against the inner wall of the housing through the plurality of first shock-absorbing blocks; Both the first and second damping blocks are equipped with electrostatic comb-shaped actuators. When the pressure cap presses against the opening on the upper surface of the housing, the lower surface of the pressure cap abuts against the plurality of second shock-absorbing blocks to fix the first frame inside the housing; When the input voltage of the first damping block or the input voltage of the second damping block is changed, the vibration frequency of the first damping block or the vibration frequency of the second damping block changes accordingly.

[0008] In one possible implementation, the first damping block and the second damping block each include: Electrostatic comb-shaped actuator and elastic element; The fixed end of the electrostatic comb-shaped driver is fixedly connected to the first frame, and the elastic element is fixedly connected to the moving end of the electrostatic comb-shaped driver. When the gland presses against the opening on the upper surface of the housing, the elastic element abuts against the inner wall of the housing or against the lower surface of the gland.

[0009] In a second aspect, embodiments of the present invention provide an inertial sensor module, including an inertial sensor, a control unit, and a shock-absorbing structure as described in the first aspect or any possible implementation thereof. The inertial sensor is fixedly connected to the first frame, and the inertial sensor is signal-connected to the control unit; When the control unit receives multiple acceleration data queues, the control unit generates an instruction to adjust the input voltage of the first damping block and / or the input voltage of the second damping block based on the multiple acceleration data queues.

[0010] Thirdly, embodiments of the present invention provide a vibration reduction method applied to the inertial sensor module of the second aspect, the vibration reduction method comprising: Acquire multiple first acceleration data queues, where each first acceleration data queue corresponds to a dimension. Frequency domain feature analysis is performed on each first acceleration data queue, and the first voltage indicator for adjusting the input voltage of the damping block is output based on the frequency domain amplitude obtained from the frequency domain feature analysis. Multiple second acceleration data queues are acquired, and a first phase angle is determined based on each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimensional direction; A first waveform with the opposite phase to the first phase angle is superimposed on the first voltage indicator and output as a second voltage indicator.

[0011] In one possible implementation, the step of performing frequency domain feature analysis on each first acceleration data queue and outputting a first voltage indicator to adjust the input voltage of the damper block based on the frequency domain amplitude obtained from the frequency domain feature analysis includes: For each first acceleration data queue, perform the following steps: Obtain the fundamental frequency; Based on the first acceleration data queue and multiple harmonics of the fundamental frequency, multiple frequency amplitudes are generated, wherein each frequency amplitude corresponds to a harmonic of the fundamental frequency. Select the frequency amplitude with the largest value from the plurality of frequency amplitude values ​​as the target amplitude; The harmonic corresponding to the target amplitude is taken as the target harmonic. Based on the response characteristics of the damping block and the target harmonic frequency, a first voltage indication is output, wherein the first voltage indication is positively correlated with the target harmonic frequency.

[0012] In one possible implementation, generating multiple frequency amplitudes based on a first acceleration data queue and multiple harmonics of the fundamental frequency includes: Multiple frequency amplitudes are generated based on the first formula, the first acceleration data queue, and multiple harmonics of the fundamental frequency, wherein the first formula is:

[0013] in, For the first Each frequency amplitude, For the first acceleration data queue One data point, This represents the total number of data points in the first acceleration data queue. It is a natural constant. Pi This is the fundamental frequency.

[0014] In one possible implementation, determining the first phase angle based on each second acceleration data queue includes: The first phase angle corresponding to each second acceleration data queue is determined according to the second formula, whereby the second formula is:

[0015] In the formula, The amplitude of the sine wave corresponding to the target harmonic. The cosine amplitude corresponding to the target harmonic. For the second acceleration data queue One data point, It is a sine function. This represents the total number of data points in the second acceleration data queue. Pi For target frequency multiplication, It is a cosine function. The first phase angle, For based on the input symbols The symbol denoted by gives the arctangent function of the angle in the four coordinate intervals.

[0016] Fourthly, embodiments of the present invention provide a shock-absorbing device for implementing the method described in the third aspect or any possible implementation thereof, comprising: An acceleration acquisition module is used to acquire multiple first acceleration data queues, where each first acceleration data queue corresponds to a dimension. The first damping module is used to perform frequency domain feature analysis on each first acceleration data queue, and output a first voltage indicator to adjust the input voltage of the damping block based on the frequency domain amplitude obtained from the frequency domain feature analysis. The phase determination module is used to acquire multiple second acceleration data queues and determine a first phase angle based on each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimensional direction; as well as, The second damping module is used to superimpose a first waveform, which is opposite in phase to the first phase angle, onto the first voltage indicator and output it as a second voltage indicator.

[0017] Fifthly, embodiments of the present invention provide an electronic device, including a memory and a processor, wherein the memory stores a computer program executable on the processor, and the processor executes the computer program to implement the steps of the method as described in the third aspect or any possible implementation of the third aspect above.

[0018] In a sixth aspect, embodiments of the present invention provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the method as described in the third aspect or any possible implementation thereof.

[0019] The beneficial effects of the embodiments of the present invention compared with the prior art are as follows: This invention discloses a vibration reduction method. First, it acquires multiple first acceleration data queues, each corresponding to a specific dimension. Then, it performs frequency domain feature analysis on each first acceleration data queue, outputting a first voltage indicator to adjust the input voltage of the vibration damping block based on the frequency domain amplitude obtained from the analysis. Next, it acquires multiple second acceleration data queues, determining a first phase angle for each second acceleration data queue, each corresponding to a specific dimension. Finally, it superimposes a first waveform with a phase opposite to the first phase angle onto the first voltage indicator, outputting it as a second voltage indicator. This invention obtains acceleration data values ​​from an inertial sensor, performs two frequency domain analyses on the data, obtains the vibration frequency based on the first transformation result, adjusts the stiffness of the vibration damping block according to the vibration frequency to achieve vibration reduction, and then obtains the phase angle of the vibration based on the second transformation result, generating a waveform with a phase angle opposite to the vibration on the vibration damping block to achieve vibration reduction. This method employs both passive and active vibration reduction, significantly reducing the impact of vibration on the inertial sensor. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of an inertial sensor module provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the shock-absorbing block provided in an embodiment of the present invention; Figure 3 This is a flowchart of the vibration reduction method provided by the embodiments of the present invention; Figure 4 This is a functional block diagram of the shock absorption device provided in the embodiments of the present invention; Figure 5 This is a functional block diagram of an electronic device provided in an embodiment of the present invention.

[0022] In the picture: Casing 101; Cap 102; First frame 103; Inertial sensor 104; 1031 electrostatic comb actuator; Elastic element 1032. Detailed Implementation

[0023] In the following description, specific details such as particular system structures and techniques are set forth for illustrative purposes and not for limitation, so as to provide a thorough understanding of embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0024] To make the objectives, technical solutions, and advantages of the present invention clearer, specific embodiments will be described below in conjunction with the accompanying drawings.

[0025] The embodiments of the present invention will be described in detail below. This example is implemented based on the technical solution of the present invention, and provides detailed implementation methods and specific operation processes. However, the protection scope of the present invention is not limited to the following embodiments.

[0026] The first aspect of the present invention provides a shock-absorbing structure, comprising: Housing, gland, and first frame; The upper surface of the housing has an opening; The first frame has multiple first damping blocks on its side and multiple second damping blocks on its upper surface. The housing has an inwardly inclined inner wall, and the first frame abuts against the inner wall of the housing through the plurality of first shock-absorbing blocks; Both the first and second damping blocks are equipped with electrostatic comb-shaped actuators. When the pressure cap presses against the opening on the upper surface of the housing, the lower surface of the pressure cap abuts against the plurality of second shock-absorbing blocks to fix the first frame inside the housing; When the input voltage of the first damping block or the input voltage of the second damping block is changed, the vibration frequency of the first damping block or the vibration frequency of the second damping block changes accordingly.

[0027] For example, such as Figure 1-2 As shown, the present invention provides a shock-absorbing structure that can be used to mount an inertial sensor 104. It includes a housing 101, a pressure cover 102, and a first frame 103, wherein the first frame 103 is used to fix the object to be protected by shock absorption, for example... Figure 1 An inertial sensor 104 is fixed on the first frame 103.

[0028] Shock-absorbing blocks are provided on the periphery and sides of the first frame 103.

[0029] The damping blocks are actually installed in different dimensions to achieve damping in different dimensions.

[0030] Specifically, the housing 101 is provided with an inwardly inclined inner wall, and the first frame 103 is surrounded by shock-absorbing blocks: multiple first shock-absorbing blocks abut against the inner wall, that is to say, the first shock-absorbing blocks can generate lateral support force.

[0031] The other type of damping block: the second damping block is set on the upper surface of the first frame 103. When the cover 102 is pressed against the opening on the upper surface of the housing 101, the second damping block abuts against the cover 102, thereby generating a vertical support force. That is to say, the second damping block is used to generate vertical support force and damping capacity, while the lateral damping blocks are mainly used to generate horizontal damping force, and the horizontal damping blocks are configured to correspond to different dimensional directions. For example, two blocks are configured longitudinally and two other blocks are configured laterally.

[0032] Since the damping blocks generate damping capacity in different directions, they can be configured separately to adapt to vibrations in different directions.

[0033] In the implementation of the shock absorber, the shock absorber of the present invention is provided with an electrostatic comb-shaped driver 1031. When different voltages are applied externally, the driver generates different electrostatic forces internally, so that the vibration frequency of the shock absorber changes accordingly.

[0034] In other words, by controlling the electrostatic comb-shaped actuator 1031 on the damping block, the vibration frequency of the damping block can be controlled, thereby changing its own vibration frequency according to external vibration and isolating vibration as much as possible.

[0035] In some embodiments, the first damping block and the second damping block respectively include: An electrostatic comb-shaped actuator 1031 and an elastic element 1032; The fixed end of the electrostatic comb driver 1031 is fixedly connected to the first frame 103, and the elastic element is fixedly connected to the moving end of the electrostatic comb driver 1031. When the pressure cap 102 presses against the opening on the upper surface of the housing 101, the elastic element 1032 abuts against the inner wall of the housing 101 or against the lower surface of the pressure cap 102.

[0036] For example, in some embodiments, the shock absorber includes two parts: an elastic element and an electrostatic comb actuator, which are fixed together. The elastic element part is used to abut against the housing or gland, while the electrostatic comb actuator is used to connect to the first frame.

[0037] Elastic elements can be implemented in various forms, such as sponges, rubber, or inflatable airbags. In this way, the elastic element can provide initial cushioning, followed by a second cushioning effect from an electrostatic comb actuator, and the control action of the electrostatic comb actuator can further enhance the cushioning.

[0038] A second aspect of the present invention provides an inertial sensor module, including an inertial sensor, a control unit, and a shock-absorbing structure as described in the first aspect; The inertial sensor is fixedly connected to the first frame, and the inertial sensor is signal-connected to the control unit; When the control unit receives multiple acceleration data queues, the control unit generates an instruction to adjust the input voltage of the first damping block and / or the input voltage of the second damping block based on the multiple acceleration data queues.

[0039] By way of example, a second aspect of the present invention provides an inertial sensor module, the module including an inertial sensor and a control unit, the inertial sensor being fixed to a first frame, and the control unit receiving signals from the inertial sensor and adjusting the shock absorption module according to the received acceleration signals.

[0040] In fact, when the control unit controls the vibration damping module, it uses the frequency domain analysis method of acceleration signal to analyze the frequency domain value of external vibration. First, it adjusts the stiffness of the electrostatic comb actuator to isolate the external vibration as much as possible. On this basis, a voltage signal with the same frequency and opposite phase as the frequency domain value is generated on the electrostatic comb actuator to cancel out the external vibration.

[0041] To achieve the above objectives, the present invention is described in detail from a third aspect.

[0042] Figure 3 A flowchart of a vibration reduction method provided in the third aspect of an embodiment of the present invention.

[0043] like Figure 3 As shown, a flowchart illustrating the implementation of the vibration reduction method provided by an embodiment of the present invention is presented, and is described in detail below: In step 301, a first acceleration data queue is obtained, wherein each first acceleration data queue corresponds to a dimension direction.

[0044] In step 302, frequency domain feature analysis is performed on each first acceleration data queue, and a first voltage indicator is output to adjust the input voltage of the damping block based on the frequency domain amplitude obtained from the frequency domain feature analysis.

[0045] In some implementations, the step of performing frequency domain feature analysis on each first acceleration data queue and outputting a first voltage indicator to adjust the input voltage of the damper block based on the frequency domain amplitude obtained from the frequency domain feature analysis includes: For each first acceleration data queue, perform the following steps: Obtain the fundamental frequency; Based on the first acceleration data queue and multiple harmonics of the fundamental frequency, multiple frequency amplitudes are generated, wherein each frequency amplitude corresponds to a harmonic of the fundamental frequency. Select the frequency amplitude with the largest value from the plurality of frequency amplitude values ​​as the target amplitude; The harmonic corresponding to the target amplitude is taken as the target harmonic. Based on the response characteristics of the damping block and the target harmonic frequency, a first voltage indication is output, wherein the first voltage indication is positively correlated with the target harmonic frequency.

[0046] In some implementations, generating multiple frequency amplitudes based on the first acceleration data queue and multiple harmonics of the fundamental frequency includes: Multiple frequency amplitudes are generated based on the first formula, the first acceleration data queue, and multiple harmonics of the fundamental frequency, wherein the first formula is:

[0047] in, For the first Each frequency amplitude, For the first acceleration data queue One data point, This represents the total number of data points in the first acceleration data queue. It is a natural constant. Pi This is the fundamental frequency.

[0048] For example, the present invention acquires acceleration signals from an inertial sensor. The acceleration measurement direction of the inertial sensor is consistent with the installation direction of the damping block. The acceleration data of each dimension measured by the inertial sensor forms a data queue. By processing the queue of each dimension, the frequency domain amplitude of that dimension can be obtained. Usually, only one frequency domain amplitude is the most prominent, that is, the main frequency domain amplitude. For the frequency corresponding to the frequency domain amplitude, the input voltage of the corresponding electrostatic comb driver is adjusted to achieve the purpose of eliminating vibration. On this basis, frequency domain analysis is performed again to obtain the phase of the vibration of the inertial sensor. By superimposing a waveform with the opposite phase on the input voltage of the electrostatic comb driver, the vibration cancellation effect is achieved.

[0049] To achieve the above objectives, this invention generates multiple harmonics based on the fundamental frequency, processes each queue based on these harmonics, and generates multiple frequency amplitudes. In one scenario, multiple frequency amplitudes are generated using a first formula:

[0050] in, For the first Each frequency amplitude, For the first acceleration data queue One data point, This represents the total number of data points in the first acceleration data queue. It is a natural constant. Pi This is the fundamental frequency.

[0051] The maximum amplitude among multiple frequency amplitudes is selected as the target amplitude, and the harmonic corresponding to the target amplitude is taken as the target harmonic. At this time, the input voltage of the damping block in the corresponding dimension is adjusted according to the target harmonic. For example, the above process processes the acceleration data queue in the vertical direction to obtain the target harmonic corresponding to the vertical direction. Then, the input voltage of the electrostatic comb driver of the second damping block is adjusted according to the target harmonic so that the vibration characteristics of the damping block itself are lower than the target harmonic. Usually, a coefficient is taken, for example, 0.2. The product of this coefficient and the harmonic is taken as the vibration characteristics of the damping block itself.

[0052] In step 303, multiple second acceleration data queues are acquired, and a first phase angle is determined based on each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimensional direction.

[0053] In some implementations, determining the first phase angle based on each second acceleration data queue includes: The first phase angle corresponding to each second acceleration data queue is determined according to the second formula, whereby the second formula is:

[0054] In the formula, The amplitude of the sine wave corresponding to the target harmonic. The cosine amplitude corresponding to the target harmonic. For the second acceleration data queue One data point, It is a sine function. This represents the total number of data points in the second acceleration data queue. Pi For target frequency multiplication, It is a cosine function. The first phase angle, For based on the input symbols The symbol denoted by gives the arctangent function of the angle in the four coordinate intervals.

[0055] For example, it can be understood that after the vibration characteristics of the damping block itself change, the vibration phase of the inertial sensor will also change. As mentioned above, the present invention superimposes a waveform on the input voltage of the electrostatic comb driver, and the phase of this waveform is opposite to the phase of the inertial sensor, thereby achieving the purpose of vibration reduction.

[0056] At this point, multiple acceleration data queues will be obtained again through the inertial sensor. These acceleration data queues, according to the second formula, yield the phase angle of the inertial sensor's vibration:

[0057] In the formula, The amplitude of the sine wave corresponding to the target harmonic. The cosine amplitude corresponding to the target harmonic. For the second acceleration data queue One data point, It is a sine function. This represents the total number of data points in the second acceleration data queue. Pi For target frequency multiplication, It is a cosine function. The first phase angle, For based on the input symbols The symbol denoted by gives the arctangent function of the angle in the four coordinate intervals.

[0058] It should be noted that the arctangent function in the above equation provides an angle value covering four coordinate intervals based on the signs of the two input variables; in other words, it provides... The angle between them.

[0059] In step 304, a first waveform with the opposite phase to the first phase angle is superimposed on the first voltage indicator and output as a second voltage indicator.

[0060] For example, since the target frequency is obtained from the aforementioned steps, the phase angle is superimposed with π to obtain the superimposed voltage waveform. The superimposed voltage waveform is then superimposed with the previous voltage value to achieve the purpose of active vibration reduction by the damping block.

[0061] The vibration reduction method of this invention first acquires multiple first acceleration data queues, each corresponding to a dimensional direction. Then, it performs frequency domain feature analysis on each first acceleration data queue, and outputs a first voltage indicator to adjust the input voltage of the damping block based on the frequency domain amplitude obtained from the analysis. Next, it acquires multiple second acceleration data queues, and determines a first phase angle based on each second acceleration data queue, each corresponding to a dimensional direction. Finally, it superimposes a first waveform with a phase opposite to the first phase angle onto the first voltage indicator, outputting it as a second voltage indicator. This invention obtains acceleration data values ​​from an inertial sensor, performs two frequency domain analyses on the data, obtains the vibration frequency based on the first transformation result, adjusts the stiffness of the damping block according to the vibration frequency to achieve vibration reduction, and then obtains the phase angle of the vibration based on the second transformation result, generating a waveform with a phase angle opposite to the vibration angle on the damping block to achieve vibration reduction. This invention employs passive and active vibration reduction, significantly reducing the impact of vibration on the inertial sensor.

[0062] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0063] The following are embodiments of the apparatus of the present invention. For details not described in detail, please refer to the corresponding method embodiments described above.

[0064] Figure 4 This is a functional block diagram of the shock absorption device provided in the embodiments of the present invention, with reference to... Figure 4 The vibration damping device includes: an acceleration acquisition module 401, a first vibration damping module 402, a phase determination module 403, and a second vibration damping module 404, wherein: The acceleration acquisition module 401 is used to acquire multiple first acceleration data queues, wherein each first acceleration data queue corresponds to a dimension direction; The first damping module 402 is used to perform frequency domain feature analysis on each first acceleration data queue, and output a first voltage indicator to adjust the input voltage of the damping block based on the frequency domain amplitude obtained from the frequency domain feature analysis. The phase determination module 403 is used to acquire multiple second acceleration data queues and determine a first phase angle based on each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimensional direction; as well as, The second damping module 404 is used to superimpose a first waveform that is opposite in phase to the first phase angle onto the first voltage indicator and output it as a second voltage indicator.

[0065] Figure 5 This is a functional block diagram of the electronic device provided in an embodiment of the present invention. For example... Figure 5 As shown, the electronic device 5 of this embodiment includes a processor 500 and a memory 501, wherein the memory 501 stores a computer program 502 that can run on the processor 500. When the processor 500 executes the computer program 502, it implements the steps of the various shock absorption methods and embodiments described above, for example... Figure 3 Steps 301 to 304 are shown.

[0066] For example, the computer program 502 may be divided into one or more modules / units, which are stored in the memory 501 and executed by the processor 500 to complete the present invention.

[0067] The electronic device 5 can be a desktop computer, laptop, handheld computer, cloud server, or other computing device. The electronic device 5 may include, but is not limited to, a processor 500 and a memory 501. Those skilled in the art will understand that... Figure 5 This is merely an example of electronic device 5 and does not constitute a limitation on electronic device 5. It may include more or fewer components than shown, or combine certain components, or different components. For example, electronic device 5 may also include input / output devices, network access devices, buses, etc.

[0068] The processor 500 may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0069] The memory 501 can be an internal storage unit of the electronic device 5, such as a hard disk or memory. The memory 501 can also be an external storage device of the electronic device 5, such as a plug-in hard disk, Smart Media Card (SMC), Secure Digital (SD) card, or Flash Card. Furthermore, the memory 501 can include both internal and external storage units of the electronic device 5. The memory 501 is used to store the computer program 502 and other programs and data required by the electronic device 5. The memory 501 can also be used to temporarily store data that has been output or will be output.

[0070] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the aforementioned method embodiments, and will not be repeated here.

[0071] In the above embodiments, the descriptions of each embodiment have their own emphasis. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0072] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0073] In the embodiments provided by this invention, it should be understood that the disclosed devices / electronic devices and methods can be implemented in other ways. For example, the device / electronic device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0074] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0075] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0076] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the above-described embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various methods and apparatus embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium, etc.

[0077] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A vibration damping structure, characterized in that, include: Housing, gland, and first frame; The upper surface of the housing has an opening; The first frame has multiple first damping blocks on its side and multiple second damping blocks on its upper surface. The housing has an inwardly inclined inner wall, and the first frame abuts against the inner wall of the housing through the plurality of first shock-absorbing blocks; Both the first and second damping blocks are equipped with electrostatic comb-shaped actuators. When the pressure cap presses against the opening on the upper surface of the housing, the lower surface of the pressure cap abuts against the plurality of second shock-absorbing blocks to fix the first frame inside the housing; When the input voltage of the first damping block or the input voltage of the second damping block is changed, the vibration frequency of the first damping block or the vibration frequency of the second damping block changes accordingly.

2. The damping structure according to claim 1, characterized in that, The first damping block and the second damping block each include: Electrostatic comb-shaped actuator and elastic element; The fixed end of the electrostatic comb-shaped driver is fixedly connected to the first frame, and the elastic element is fixedly connected to the moving end of the electrostatic comb-shaped driver. When the gland presses against the opening on the upper surface of the housing, the elastic element abuts against the inner wall of the housing or against the lower surface of the gland.

3. An inertial sensor module, characterized in that, Includes an inertial sensor, a control unit, and a shock-absorbing structure as described in any one of claims 1-2; The inertial sensor is fixedly connected to the first frame, and the inertial sensor is signal-connected to the control unit; When the control unit receives multiple acceleration data queues, the control unit generates an instruction to adjust the input voltage of the first damping block and / or the input voltage of the second damping block based on the multiple acceleration data queues.

4. A vibration reduction method, characterized in that, Applied to the inertial sensor module as described in claim 3, the vibration reduction method includes: Acquire multiple first acceleration data queues, where each first acceleration data queue corresponds to a dimension. Frequency domain feature analysis is performed on each first acceleration data queue, and the first voltage indicator for adjusting the input voltage of the damping block is output based on the frequency domain amplitude obtained from the frequency domain feature analysis. Multiple second acceleration data queues are acquired, and a first phase angle is determined based on each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimensional direction; A first waveform with the opposite phase to the first phase angle is superimposed on the first voltage indicator and output as a second voltage indicator.

5. The vibration reduction method according to claim 4, characterized in that, The step of performing frequency domain feature analysis on each first acceleration data queue and outputting a first voltage indicator to adjust the input voltage of the damping block based on the frequency domain amplitude obtained from the frequency domain feature analysis includes: For each first acceleration data queue, perform the following steps: Obtain the fundamental frequency; Based on the first acceleration data queue and multiple harmonics of the fundamental frequency, multiple frequency amplitudes are generated, wherein each frequency amplitude corresponds to a harmonic of the fundamental frequency. Select the frequency amplitude with the largest value from the plurality of frequency amplitude values ​​as the target amplitude; The harmonic corresponding to the target amplitude is taken as the target harmonic. Based on the response characteristics of the damping block and the target harmonic frequency, a first voltage indication is output, wherein the first voltage indication is positively correlated with the target harmonic frequency.

6. The vibration reduction method according to claim 5, characterized in that, The generation of multiple frequency amplitudes based on the first acceleration data queue and multiple harmonics of the fundamental frequency includes: Multiple frequency amplitudes are generated based on the first formula, the first acceleration data queue, and multiple harmonics of the fundamental frequency, wherein the first formula is: in, For the first Each frequency amplitude, For the first acceleration data queue One data point, This represents the total number of data points in the first acceleration data queue. It is a natural constant. Pi This is the fundamental frequency.

7. The vibration reduction method according to any one of claims 4-6, characterized in that, Determining the first phase angle based on each second acceleration data queue includes: The first phase angle corresponding to each second acceleration data queue is determined according to the second formula, whereby the second formula is: In the formula, The amplitude of the sine wave corresponding to the target harmonic. The cosine amplitude corresponding to the target harmonic. For the second acceleration data queue One data point, It is a sine function. This represents the total number of data points in the second acceleration data queue. Pi For target frequency multiplication, It is a cosine function. The first phase angle, For based on the input symbols The symbol denoted by gives the arctangent function of the angle in the four coordinate intervals.

8. A shock absorption device, characterized in that, For implementing the vibration reduction method as described in any one of claims 4-7, the vibration reduction device comprises: An acceleration acquisition module is used to acquire multiple first acceleration data queues, where each first acceleration data queue corresponds to a dimension. The first damping module is used to perform frequency domain feature analysis on each first acceleration data queue, and output a first voltage indicator to adjust the input voltage of the damping block based on the frequency domain amplitude obtained from the frequency domain feature analysis. The phase determination module is used to acquire multiple second acceleration data queues and determine a first phase angle based on each second acceleration data queue, wherein each second acceleration data queue corresponds to a dimensional direction; as well as, The second damping module is used to superimpose a first waveform, which is opposite in phase to the first phase angle, onto the first voltage indicator and output it as a second voltage indicator.

9. An electronic device comprising a memory and a processor, wherein the memory stores a computer program executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method as described in any one of claims 4 to 7 above.

10. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method as described in any one of claims 4 to 7 above.

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