Method and device for detecting defect position of tower line and medium

Abstract

The invention relates to a method and equipment for detecting a defect position of a tower line and a medium. The method comprises: acquiring a mixed voltage signal; detecting whether the target line has a defect and the defect type according to the mixed voltage signal; if the defect type of the target line is a composite defect, laser is emitted to a target insulator closest to the target line through a laser emission module, and key spectral information is acquired; determining a target carbonization depth of the target insulator according to the key spectral information, and determining a target aging grade of the target insulator according to the target carbonization depth; if the target aging grade comprises high aging, determining that the composite defect of the target line is caused by deep aging of the target insulator; otherwise, generating re-checking prompt information. The detection accuracy can be improved, the defects of manual detection are avoided, and the number of times of manual rechecking is greatly reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of fault detection, and in particular to a method, device and medium for detecting defect position of a tower line. BACKGROUND

[0002] In the maintenance of power systems, it is crucial to ensure the safe operation of overhead lines. The traditional overhead line detection method is manual inspection and simple electrical testing. In the face of strong electromagnetic interference, there are problems of low signal-to-noise ratio and high misjudgment rate, which makes it difficult to accurately locate problems such as metal fatigue and insulator degradation. Therefore, there is an urgent need in the prior art for a method that has strong anti-electromagnetic interference ability, low misjudgment rate, and can accurately locate line defects. SUMMARY

[0003] The present application relates to the technical field of fault detection, and in particular to a method, device and medium for detecting defect position of a tower line.

[0004] According to one aspect of the present application, a method for detecting defect position of a tower line is provided, the method comprising: obtaining a mixed voltage signal, wherein the mixed voltage signal is obtained by exciting a target line through a dual-frequency eddy current emission module, the two emission coils of the dual-frequency eddy current emission module are respectively connected to 800Hz and 20kHz voltages, and the two emission coils are orthogonally arranged; detecting whether the target line has defects and the type of defects according to the mixed voltage signal; if the type of defects of the target line is a composite defect, emitting laser light to the target insulator closest to the target line through a laser emission module, and obtaining key spectral information; determining the target carbonization depth of the target insulator according to the key spectral information, and determining the target aging grade of the target insulator according to the target carbonization depth; if the target aging grade includes high aging, determining that the composite defect of the target line is caused by deep aging of the target insulator; otherwise, generating a review prompt information.

[0005] According to another aspect of the present application, a computer device for detecting defect position of a tower line is provided, comprising a memory and a processor, the memory stores a computer program capable of being loaded and executed by the processor and performing the above method.

[0006] According to another aspect of the present application, a computer readable storage medium is provided, which stores a computer program capable of being loaded and executed by a processor and performing the above method.

[0007] Compared with the prior art, the application detects whether the target line has defects and the defect type through a mixed voltage signal. The detection accuracy is improved, and the defects of manual detection are avoided. The target line is excited by a dual-frequency eddy current transmission module including two transmission coils arranged orthogonally, and the anti-interference ability of the transmission coils arranged orthogonally is stronger. When the detected defect type is a composite defect, the defect is further positioned to the target insulator, the target aging grade of the target insulator is detected through acquisition of key spectral information, and the defect reason of the target line is further determined. When the target insulator has no aging problem, the user is reminded to perform manual review, and the number of manual review is greatly reduced. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 A method flow chart for detecting a defect position of a tower line is shown according to one embodiment of the application; Figure 2 A device structure schematic diagram for detecting a defect position of a tower line is shown according to one embodiment of the application; Figure 3 An exemplary system that can be used to implement various embodiments described herein is shown. DETAILED DESCRIPTION

[0009] The application will be further described in detail below with reference to the accompanying drawings.

[0010] In one typical configuration of the application, the terminal, the device of the service network and the trusted party each include one or more processors (for example, a central processing unit (CPU)), an input / output interface, a network interface and a memory.

[0011] The memory can include a non-persistent memory in a computer readable medium, a random access memory (RAM) and / or a non-volatile memory such as a read only memory (ROM) or a flash memory. The memory is an example of a computer readable medium.

[0012] Computer-readable media includes permanent and non-permanent, moveable and non- moveable media that can be implemented in any method or technology for storage of information, such as computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, without limitation, phase-change memory (PCM), programmable random access memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically-erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), digital versatile discs (DVDs) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information for access by a computing device.

[0013] The device referred to in the present application includes, but is not limited to, a terminal, a network device, or a device formed by integrating a terminal and a network device through a network. The terminal includes, but is not limited to, any kind of mobile electronic product capable of human-computer interaction (for example, human-computer interaction through a touch panel) with a user, such as a smart phone, a tablet computer, etc. The mobile electronic product can adopt any operating system, such as an Android operating system, an iOS operating system, etc. The network device includes an electronic device capable of automatically performing numerical calculation and information processing according to a pre-set or stored instruction. The hardware of the network device includes, but is not limited to, a microprocessor, an application specific integrated circuit (ASIC), a programmable logic device (PLD), a field programmable gate array (FPGA), a digital signal processor (DSP), an embedded device, etc. The network device includes, but is not limited to, a computer, a network host, a single network server, a plurality of network servers, or a cloud formed by a plurality of servers. Here, the cloud is formed by a large number of computers or network servers based on cloud computing. The cloud computing is a kind of distributed computing, which is a virtual supercomputer formed by a group of loosely coupled computer clusters. The network includes, but is not limited to, the Internet, a wide area network, a metropolitan area network, a local area network, a VPN network, a wireless Ad Hoc network, etc. Preferably, the device can also be a program running on the terminal, the network device, or a device formed by integrating a terminal and a network device, a network device, a touch terminal, or a device formed by integrating a touch terminal and a network device through a network.

[0014] Of course, those skilled in the art should understand that the above device is only an example, and other existing or future devices, such as devices that can be applicable to the present application, should also be included in the protection scope of the present application, and are hereby included by reference.

[0015] In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0016] Reference Figure 1This invention provides a flowchart of a method for detecting the location of defects in a power transmission line, comprising steps S11, S12, S13, S14, and S15. In step S11, a mixed voltage signal is acquired, wherein the mixed voltage signal is obtained by exciting the target line using a dual-frequency eddy current emission module. The two emission coils of the dual-frequency eddy current emission module are respectively supplied with voltages of 800Hz and 20kHz, and the two emission coils are orthogonally arranged. In step S12, the presence and type of defects in the target line are detected based on the mixed voltage signal. In step S13, if the defect type of the target line is a composite defect, a laser is emitted from a laser emission module towards the target insulator closest to the target line, and key spectral information is acquired. In step S14, the target carbonization depth of the target insulator is determined based on the key spectral information, and the target aging level of the target insulator is determined based on the target carbonization depth. In step S15, if the target aging level includes high aging, it is determined that the composite defect of the target line is caused by deep aging of the target insulator; otherwise, a review prompt is generated.

[0017] Specifically, in step S11, a mixed voltage signal is acquired. This mixed voltage signal is obtained by exciting the target circuit using a dual-frequency eddy current emission module. The two emission coils of the dual-frequency eddy current emission module are respectively supplied with voltages of 800Hz and 20kHz, and the two emission coils are orthogonally arranged. In some embodiments, the dual-frequency eddy current emission module includes two emission coils, one high-frequency emission coil and the other low-frequency emission coil. The high-frequency emission coil is supplied with a 20kHz voltage, and the low-frequency emission coil is supplied with an 800Hz voltage. In some embodiments, the high-frequency emission coil is horizontally arranged, making it easier to capture eddy current changes on the surface of the conductor (the splice tube is mostly located on the outside of the conductor). The low-frequency emission coil is vertically arranged, allowing the vertical magnetic field to penetrate deeper, which is suitable for detecting internal structures such as steel cores. In some embodiments, the high-frequency emission coil and the low-frequency emission coil are arranged side by side orthogonally, and their spatial orthogonality does not directly overlap. For example, the high-frequency emission coil and the low-frequency emission coil are not nested.

[0018] In step S12, the presence and type of defects in the target line are detected based on the mixed voltage signal. In some embodiments, a main voltage signal is acquired through the main receiving coil and used as the mixed voltage signal. In other embodiments, a reference coil is provided to improve the system's anti-interference capability, and a reference voltage signal is acquired through the reference coil. The reference coil is located away from the conductor and is used to sense ambient noise. The mixed voltage signal includes the difference between the main voltage signal acquired through the main receiving coil and the reference voltage signal acquired by the reference coil. In some embodiments, the main receiving coil is located adjacent to the same side of the dual-eddy current transmitting module. During detection, after the two transmitting coils of the dual-frequency eddy current transmitting module are supplied with voltages of 800Hz and 20kHz respectively, eddy currents are generated in the line under test (e.g., the target line). The eddy currents generate a mixed secondary magnetic field, which is induced by the main receiving coil, and a mixed voltage signal of two frequencies, 800Hz and 20kHz, is output through the main receiving coil. The presence and type of defects in the target line are detected based on the mixed voltage signal output by the main receiving coil (e.g., the mixed voltage signal includes the main voltage signal). In some embodiments, the defect type includes, but is not limited to, broken strands inside the conductors of the line under test, overheating of the splice tube, etc. In some embodiments, the presence and type of defects are detected by extracting the low-frequency phase value of the 800Hz component and the high-frequency phase value of the 20kHz component from the mixed voltage signal through a Fast Fourier Transform. For a detailed explanation of this part, please refer to the corresponding embodiments below; it will not be repeated here.

[0019] In step S13, if the defect type of the target line is a composite defect, a laser is emitted from the laser emitting module towards the target insulator closest to the target line, and key spectral information is acquired. Composite defects include at least two defect types. For example, defect types include internal conductor breakage, overheating of the splice tube, and composite defects. Composite defects include defects that require further verification. For example, if the defect type detected by the mixed voltage signal is a composite defect, a laser is emitted from the laser emitting module towards the target insulator closest to the target line to further detect whether the target insulator has a fault defect. In some embodiments, the laser emitting module includes, but is not limited to, a high-precision pulsed laser system (e.g., a YAG laser). For example, if the defect type is a composite defect, a laser is emitted towards the target insulator closest to the target line, and key spectral information is acquired through a spectral acquisition system. In some embodiments, key spectral information includes, but is not limited to, characteristic peaks of carbon, silicon, and oxygen elements.

[0020] In step S14, the target carbonization depth of the target insulator is determined based on key spectral information, and the target aging level of the target insulator is determined based on the target carbonization depth. For example, the target carbonization depth of the target insulator is determined based on the characteristic peaks of carbon, silicon, and oxygen. For a detailed explanation of this part, please refer to the corresponding embodiments below; it will not be repeated here.

[0021] In step S15, if the target aging level includes high aging, it is determined that the composite defect of the target line is caused by deep aging of the target insulator; otherwise, a review prompt is generated. In some embodiments, the aging level includes, but is not limited to, low aging, medium aging, and high aging. In some embodiments, if the target carbonization depth is high aging, it can be determined that the composite defect of the target line is caused by high aging of the target insulator. If the target carbonization depth is low aging or medium aging, a prompt is generated to remind the user that further review of the fault is needed. For example, it may be due to mechanical damage, lightning strikes, or other reasons. In this embodiment, the presence and type of defect in the target line are detected by a mixed voltage signal. When the defect type is a composite defect, the aging level of the target insulator is detected by acquiring key spectral information. Determining whether manual review is needed based on the aging level of the target insulator greatly reduces the number of manual reviews.

[0022] In some embodiments, step S12 includes: performing a Fast Fourier Transform on the mixed voltage signal to extract the low-frequency phase value of the 800Hz component and the high-frequency phase value of the 20kHz component from the spectrum; if the low-frequency phase value is greater than a first threshold, and / or the high-frequency phase value is greater than a second threshold, calculating the phase difference between the high-frequency phase value and the low-frequency phase value; otherwise, determining that the target line has no defects; if the low-frequency phase value is greater than the first threshold, and / or the high-frequency phase value is greater than the second threshold, determining the defect type of the target line based on the high-frequency phase value, the low-frequency phase value, and the phase difference. In some embodiments, the first threshold includes, but is not limited to, 25. 。 The second threshold includes, but is not limited to, 15. 。 For example, by performing a Fast Fourier Transform on the mixed voltage signal, the low-frequency phase value of the 800Hz component and the high-frequency phase value of the 20kHz component are extracted from the spectrum. If the low-frequency phase value is greater than a first threshold, the phase difference between the high-frequency and low-frequency phase values ​​is calculated. If the high-frequency phase value is greater than a second threshold, the phase difference between the high-frequency and low-frequency phase values ​​is calculated. If both the low-frequency and high-frequency phase values ​​are greater than the first and second thresholds, the phase difference between the high-frequency and low-frequency phase values ​​is calculated. If the low-frequency phase value is less than or equal to the first threshold, and the high-frequency phase value is less than or equal to the second threshold, the target line is determined to be defect-free.

[0023] In some embodiments, determining whether a target line has a defect based on a high-frequency phase value, a low-frequency phase value, and a phase difference includes: if the low-frequency phase value is greater than a first threshold and the phase difference is greater than the first threshold, determining the defect type of the target line as an internal conductor breakage; if the high-frequency phase difference is greater than a second threshold and the phase difference is less than a negative number of the second threshold, determining the defect type of the target line as overheating of the splice tube; if the low-frequency phase value is greater than the first threshold, and / or the high-frequency phase difference is greater than the second threshold and the phase difference is within the target range, determining the defect type of the target line as a composite defect. For example, if the low-frequency phase value is greater than 25... 。 And the phase difference is greater than 25 。 The defect type of the target line was determined to be an internal conductor breakage. If the high-frequency phase value is greater than 15... 。 And the phase difference is greater than -15. 。 The defect type of the target line was determined to be overheating of the splice tube. In some embodiments, the target range includes, but is not limited to, [-15]. 。 25 。 For example, if the low-frequency phase value is greater than the first threshold, and / or the high-frequency phase difference is greater than the second threshold, the phase difference is within [-15]. 。 25 。 Within this range, the defect type is determined to be a composite defect. For example, if only the low-frequency phase value is greater than the first threshold, and the phase difference is within the target range, the cause may be a broken strand inside the conductor of the target line or insulator deterioration indirectly causing low-frequency eddy current anomalies. Therefore, it is necessary to use a laser emitting module to emit a laser towards the target insulator closest to the target line to detect the target insulator. As another example, if only the high-frequency phase value is greater than the second threshold, and the phase difference is within the target range, the cause may be overheating of the splice tube or high-frequency signal distortion caused by contamination on the insulator surface. Therefore, it is necessary to use a laser emitting module to emit a laser towards the target insulator closest to the target line to detect the target insulator. In some embodiments, a phase difference within the target range indicates that the eddy current signal does not clearly point to a single defect, but a single phase value exceeding the threshold or all phase values ​​exceeding the threshold suggests an anomaly. Therefore, further detection of the target insulator is required.

[0024] In some embodiments, the method further includes step S16 (not shown), in which the current location is determined according to the GPS positioning system; the nearest tower to the current location is retrieved from a pre-stored route map based on the current location, and the insulator on that tower is identified as the target insulator closest to the target route. For example, the system is equipped with a GPS positioning system, and the route map includes multiple towers and the location information of each tower. The system retrieves the nearest tower to the current location from the route map based on the current location, and identifies the insulator on that tower as the target insulator closest to the target route. In some embodiments, the system presents the location information of the target insulator to the user through an interface, so that the user can easily find the target insulator based on the location information.

[0025] In some embodiments, acquiring key spectral information includes: acquiring key spectral information through a spectral acquisition system, wherein the key spectral information includes characteristic peaks of carbon, silicon, and oxygen; determining the target carbonization depth of the target insulator based on the key spectral information, and determining the target aging level of the target insulator based on the target carbonization depth, including: determining the target carbonization depth of the target insulator based on the characteristic peaks of carbon, silicon, and oxygen; and determining the target aging level of the target insulator based on the target carbonization depth. In some embodiments, the spectral acquisition system includes, but is not limited to, a laser-induced breakdown spectrometer (LIBS). In some embodiments, the aging level includes, but is not limited to, low aging, medium aging, and high aging. In some embodiments, determining the target aging level of the target insulator based on the target carbonization depth includes: determining the target aging level corresponding to the target carbonization depth based on a carbonization depth threshold reached by the target carbonization depth. For example, the system presets carbonization depth ranges, and each carbonization depth range corresponds to an aging level. The system queries the target carbonization range containing the target carbonization depth and determines the aging level corresponding to the target carbonization range as the target aging level.

[0026] In some embodiments, determining the target carbonization depth of the target insulator based on the characteristic peaks of carbon, silicon, and oxygen includes: calculating the ratio between the characteristic peaks of carbon and silicon, and the ratio between the characteristic peaks of oxygen and silicon, respectively, to obtain a first peak area ratio (Ic / Isi) and a second peak area ratio (Io / Isi); querying the database for the first and second peak area ratios, respectively, to find the first and second target intervals containing those ratios; and determining the carbonization depth corresponding to the first and second target intervals as the target carbonization depth of the target insulator. For example, the database includes multiple first and second intervals, and different combinations of first and second intervals correspond to different carbonization depths. For example, as shown in Table 1, the first target range (e.g., 0.20-0.30) where the first peak area ratio falls is retrieved from Table 1, and the second target range (e.g., 0.20-0.30) where the second peak area ratio falls is retrieved from Table 1. The carbonization depth (0.5) corresponding to the first and second target ranges is then determined as the target carbonization depth. Of course, those skilled in the art will understand that the carbonization depth tables described below are merely examples, and other existing or future carbonization depth tables that are applicable to this application are also within the scope of protection of this application and are incorporated herein by reference.

[0027] Table 1 Carbonization Depth Table Depth of carbonization (mm) First interval Second interval 0.0 0.01-0.05 0.10-0.15 0.5 0.20-0.30 0.25-0.35 1.0 0.45-0.60 0.40-0.55 Figure 2 A schematic diagram of a device structure for detecting the location of defects in a tower line according to an embodiment of this application is shown. The device includes a first module, a second module, a third module, a fourth module, and a fifth module. The first module is used to acquire a mixed voltage signal through a main receiving coil. The mixed voltage signal is acquired by exciting the target line through a dual-frequency eddy current emitting module. The two emitting coils of the dual-frequency eddy current emitting module are respectively supplied with voltages of 800Hz and 20kHz, and the two emitting coils are orthogonally arranged. The second module is used to detect whether there is a defect in the target line and the type of defect based on the mixed voltage signal. If the defect type of the target line is a composite defect, the third module is used to emit a laser to the target insulator closest to the target line through a laser emitting module and acquire key spectral information. The fourth module is used to determine the target carbonization depth of the target insulator based on the key spectral information and the target aging level of the target insulator based on the target carbonization depth. The fifth module is used to determine that if the target aging level includes high aging, the composite defect of the target line is caused by the deep aging of the target insulator; otherwise, a review prompt message is generated.

[0028] Here, the specific implementation methods corresponding to Module 1, Module 2, Module 3, Module 4, and Module 5 are the same as or similar to the specific embodiments of steps S11, S12, S13, S14, and S15 above, and therefore will not be repeated here, but are included by reference.

[0029] In addition to the methods and devices described in the above embodiments, this application also provides a computer-readable storage medium storing computer code that, when executed, performs the method described in any of the preceding embodiments.

[0030] This application also provides a computer program product that, when executed by a computer device, performs the method described in any of the preceding claims.

[0031] This application also provides a computer device, the computer device comprising: One or more processors; Memory, used to store one or more computer programs; When the one or more computer programs are executed by the one or more processors, the one or more processors cause the one or more processors to perform the method as described in any of the preceding methods.

[0032] Figure 3 Exemplary systems that can be used to implement the various embodiments described in this application are shown; like Figure 3 As shown in some embodiments, system 300 can function as any of the devices described in each of the embodiments. In some embodiments, system 300 may include one or more computer-readable media having instructions (e.g., system memory or NVM / storage device 320) and one or more processors (e.g., one or more processors 305) coupled to the one or more computer-readable media and configured to execute the instructions to implement the module and thus perform the actions described in this application.

[0033] In one embodiment, the system control module 310 may include any suitable interface controller to provide any suitable interface to at least one of the processors 305 and / or any suitable device or component communicating with the system control module 310.

[0034] The system control module 310 may include a memory controller module 330 to provide an interface to the system memory 315. The memory controller module 330 may be a hardware module, a software module, and / or a firmware module.

[0035] System memory 315 can be used, for example, to load and store data and / or instructions for system 300. In one embodiment, system memory 315 may include any suitable volatile memory, such as suitable DRAM. In some embodiments, system memory 315 may include double data rate type quad synchronous dynamic random access memory (DDR4 SDRAM).

[0036] In one embodiment, the system control module 310 may include one or more input / output (I / O) controllers to provide interfaces to the NVM / storage device 320 and (one or more) communication interfaces 325.

[0037] For example, NVM / storage device 320 may be used to store data and / or instructions. NVM / storage device 320 may include any suitable non-volatile memory (e.g., flash memory) and / or may include any suitable (one or more) non-volatile storage devices (e.g., one or more hard disk drives (HDDs), one or more optical disc drives (CDs), and / or one or more digital universal optical disc (DVD) drives).

[0038] NVM / storage device 320 may include storage resources that are physically part of a device on which system 300 is mounted, or that can be accessed by the device without necessarily being part of it. For example, NVM / storage device 320 may be accessed via a network through one or more communication interfaces 325.

[0039] One or more communication interfaces 325 may provide the system 300 with an interface to communicate over one or more networks and / or with any other suitable device. The system 300 may wirelessly communicate with one or more components of a wireless network in accordance with any of one or more wireless network standards and / or protocols.

[0040] In one embodiment, at least one of the processors 305 may be logically packaged with one or more controllers of the system control module 310 (e.g., memory controller module 330). In one embodiment, at least one of the processors 305 may be logically packaged with one or more controllers of the system control module 310 to form a system-in-package (SiP). In one embodiment, at least one of the processors 305 may be integrated with the logic of one or more controllers of the system control module 310 on the same die. In one embodiment, at least one of the processors 305 may be integrated with the logic of one or more controllers of the system control module 310 on the same die to form a system-on-a-chip (SoC).

[0041] In various embodiments, system 300 may be, but is not limited to, a server, workstation, desktop computing device, or mobile computing device (e.g., laptop computing device, handheld computing device, tablet computer, netbook, etc.). In various embodiments, system 300 may have more or fewer components and / or different architectures. For example, in some embodiments, system 300 includes one or more cameras, a keyboard, a liquid crystal display (LCD) screen (including a touchscreen display), a non-volatile memory port, multiple antennas, a graphics chip, an application-specific integrated circuit (ASIC), and a speaker.

[0042] It should be noted that this application can be implemented in software and / or a combination of software and hardware, for example, using an application-specific integrated circuit (ASIC), a general-purpose computer, or any other similar hardware device. In one embodiment, the software program of this application can be executed by a processor to implement the steps or functions described above. Similarly, the software program of this application (including related data structures) can be stored in a computer-readable recording medium, such as RAM memory, a magnetic or optical drive, a floppy disk, or similar devices. Furthermore, some steps or functions of this application can be implemented in hardware, for example, as circuitry that cooperates with a processor to perform the various steps or functions.

[0043] Furthermore, a portion of this application can be applied as a computer program product, such as computer program instructions, which, when executed by a computer, can invoke or provide the methods and / or technical solutions according to this application through the operation of the computer. Those skilled in the art will understand that the forms in which computer program instructions exist in a computer-readable medium include, but are not limited to, source files, executable files, installation package files, etc. Correspondingly, the ways in which computer program instructions are executed by a computer include, but are not limited to: the computer directly executing the instructions, or the computer compiling the instructions and then executing the corresponding compiled program, or the computer reading and executing the instructions, or the computer reading and installing the instructions and then executing the corresponding installed program. Here, the computer-readable medium can be any available computer-readable storage medium or communication medium accessible to a computer.

[0044] Communication media include media through which communication signals containing, for example, computer-readable instructions, data structures, program modules, or other data are transmitted from one system to another. Communication media can include guided transmission media (such as cables and wires (e.g., optical fibers, coaxial cables, etc.)) and wireless (unguided transmission) media capable of propagating energy waves, such as sound, electromagnetic, RF, microwave, and infrared. Computer-readable instructions, data structures, program modules, or other data can be embodied as modulated data signals in, for example, wireless media (such as carrier waves or similar mechanisms embodied as part of spread spectrum technology). The term "modulated data signal" refers to a signal whose one or more characteristics are altered or set in a manner that encodes information in the signal. Modulation can be analog, digital, or a hybrid modulation technique.

[0045] By way of example and not limitation, computer-readable storage media may include volatile and non-volatile, removable and non-removable media implemented by any method or technique for storing information such as computer-readable instructions, data structures, program modules or other data. For example, computer-readable storage media include, but are not limited to, volatile memories such as random access memory (RAM, DRAM, SRAM); and non-volatile memories such as flash memory, various read-only memories (ROM, PROM, EPROM, EEPROM), magnetic and ferromagnetic / ferroelectric memories (MRAM, FeRAM); and magnetic and optical storage devices (hard disks, magnetic tapes, CDs, DVDs); or other media now known or hereafter developed capable of storing computer-readable information / data for use by a computer system.

[0046] Herein, one embodiment of this application includes an apparatus comprising a memory for storing computer program instructions and a processor for executing the program instructions, wherein when the computer program instructions are executed by the processor, the apparatus is triggered to run a method and / or technical solution based on the foregoing embodiments of this application.

[0047] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application. No reference numerals in the claims should be construed as limiting the scope of the claims. Furthermore, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices recited in the apparatus claims may also be implemented by a single unit or device in software or hardware. The terms "first," "second," etc., are used to indicate names and do not indicate any particular order.

Claims

1. A method for detecting the location of defects in power tower lines, characterized in that, The method includes: A mixed voltage signal is acquired, wherein the mixed voltage signal is obtained by exciting the target line through a dual-frequency eddy current transmitting module, wherein the two transmitting coils of the dual-frequency eddy current transmitting module are respectively supplied with voltages of 800Hz and 20kHz, and the two transmitting coils are orthogonally arranged; The presence and type of defects in the target line are detected based on the mixed voltage signal. If the defect type of the target line is a composite defect, a laser is emitted from the laser emission module toward the target insulator closest to the target line, and key spectral information is obtained; The target carbonization depth of the target insulator is determined based on the key spectral information, and the target aging level of the target insulator is determined based on the target carbonization depth. If the target aging level includes high aging, then the composite defect of the target line is determined to be caused by the deep aging of the target insulator; otherwise, a review prompt message is generated.

2. The method according to claim 1, characterized in that, The step of detecting whether the target line has a defect and the type of defect based on the mixed voltage signal includes: Perform a Fast Fourier Transform on the hybrid voltage signal to extract the low-frequency phase value of the 800Hz component and the high-frequency phase value of the 20kHz component from the spectrum. If the low-frequency phase value is greater than a first threshold, and / or the high-frequency phase value is greater than a second threshold, calculate the phase difference between the high-frequency phase value and the low-frequency phase value; otherwise, determine that the target line has no defects. If the low-frequency phase value is greater than a first threshold, and / or the high-frequency phase value is greater than a second threshold, the defect type of the target line is determined based on the high-frequency phase value, the low-frequency phase value, and the phase difference.

3. The method according to claim 2, characterized in that, The step of determining whether the target line has a defect based on the high-frequency phase value, the low-frequency phase value, and the phase difference includes: If the low-frequency phase value is greater than a first threshold and the phase difference is greater than the first threshold, the defect type of the target line is determined to be an internal strand breakage in the conductor; if the high-frequency phase difference is greater than a second threshold and the phase difference is less than a negative number of the second threshold, the defect type of the target line is determined to be overheating of the splice tube; if the low-frequency phase value is greater than the first threshold and / or the high-frequency phase difference is greater than the second threshold and the phase difference is within the target range, the defect type of the target line is determined to be a composite defect.

4. The method according to claim 1, characterized in that, The method further includes: Determine your current location using the GPS positioning system; Based on the current location, the nearest pole to the current location is retrieved from the pre-stored route map, and the insulator on that pole is identified as the target insulator closest to the target route.

5. The method according to claim 1, characterized in that, The acquisition of key spectral information includes: The key spectral information is acquired through a spectral acquisition system, wherein the key spectral information includes characteristic peaks of carbon, silicon, and oxygen. The step of determining the target carbonization depth of the target insulator based on the key spectral information, and determining the target aging level of the target insulator based on the target carbonization depth, includes: The target carbonization depth of the target insulator is determined based on the characteristic peaks of carbon, silicon, and oxygen. The target aging level of the target insulator is determined based on the target carbonization depth.

6. The method according to claim 5, characterized in that, Determining the target carbonization depth of the target insulator based on the characteristic peaks of carbon, silicon, and oxygen includes: Calculate the ratio between the characteristic peaks of carbon and silicon, and the ratio between the characteristic peaks of oxygen and silicon, respectively, to obtain the area ratio of the first peak and the area ratio of the second peak. Based on the first peak area ratio and the second peak area ratio, query the database to find the first target interval and the second target interval where the first peak area ratio and the second peak area ratio are located; The carbonization depth corresponding to the first target interval and the second target interval is determined as the target carbonization depth of the target insulator.

7. The method according to claim 1, characterized in that, The hybrid voltage signal includes the difference between the main voltage signal obtained by the main receiving coil and the reference voltage signal obtained by the reference coil.

8. A device for detecting the location of defects in power poles and lines, characterized in that, The device includes: A module is used to acquire a mixed voltage signal, wherein the mixed voltage signal is acquired by exciting the target line through a dual-frequency eddy current transmitting module. The two transmitting coils of the dual-frequency eddy current transmitting module are respectively supplied with voltages of 800Hz and 20kHz, and the two transmitting coils are orthogonally arranged. The first and second modules are used to detect whether there are defects and the type of defects in the target line based on the mixed voltage signal; The first and third modules are used to emit lasers towards the target insulator closest to the target line through the laser emission module if the defect type of the target line is a composite defect, and to obtain key spectral information. The first four modules are used to determine the target carbonization depth of the target insulator based on the key spectral information, and to determine the target aging level of the target insulator based on the target carbonization depth.

9. A computer device, characterized in that, It includes a memory and a processor, wherein the memory stores a method for detecting the location of defects in a pole line as described in any one of claims 1 to 7, which can be loaded by the processor.

10. A computer-readable storage medium, characterized in that, The system stores a method for detecting the location of defects in pole lines as described in any one of claims 1 to 7, which can be loaded by a processor.

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