Display module and electronic equipment

Abstract

The invention discloses a display module and electronic equipment, and the display module comprises a display screen assembly, a near field communication assembly, and a flexible electric connector. The near field communication assembly is arranged between the display screen assembly and the flexible electric connecting piece; the near field communication assembly comprises a buffer layer, a near field communication wiring layer and a magnetic conductive medium layer. The near field communication wiring layer is arranged on the side, close to the display screen assembly, of the buffer layer; the magnetic conductive medium layer is arranged on the side, away from the display screen assembly, of the buffer layer; and the near field communication wiring layer is also electrically connected with the flexible electric connecting piece. According to the display screen module, the buffer protection function of the buffer layer on the display screen assembly is achieved, and the buffer layer and the NFC layer are not independently arranged any more under the condition that the near field communication function of the near field communication routing layer is achieved, so that the thickness of the display screen module is further reduced, and thinning of the whole electronic equipment is facilitated.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronic equipment, and particularly relates to a display module and electronic equipment. BACKGROUND

[0002] With the development of science and technology, display screen modules of electronic equipment such as smart watches are pursuing a trend of thinness.

[0003] However, in the related art, in order to protect the display screen assembly and implement the NFC (Near Field Communication) function, a PET (Polyethylene Terephthalate) layer for buffering and an NFC layer for implementing near field communication are superimposed, resulting in that the overall thickness of the display screen module is still relatively thick. SUMMARY

[0004] The present application aims to provide a display module and electronic equipment, which, in the case of achieving the buffering protection function of the buffer layer on the display screen assembly and the near field communication function of the near field communication trace layer, no longer independently sets the buffer layer and the NFC layer, reduces the base material layer in the NFC layer, and thus further reduces the thickness of the display screen module, which is conducive to the thinning of the entire electronic equipment.

[0005] In a first aspect, an embodiment of the present application provides a display module, comprising:

[0006] a display screen assembly and a near field communication assembly; the near field communication assembly is connected with the display screen assembly;

[0007] the near field communication assembly comprises a buffer layer, a near field communication trace layer and a magnetic guide medium layer;

[0008] the near field communication trace layer is arranged on a side of the buffer layer close to the display screen assembly; and the magnetic guide medium layer is arranged on a side of the buffer layer away from the display screen assembly.

[0009] Optionally, the display module further comprises a flexible electrical connecting piece.

[0010] the near field communication assembly is arranged between the display screen assembly and the flexible electrical connecting piece;

[0011] the near field communication trace layer is electrically connected with the flexible electrical connecting piece.

[0012] Optionally, the buffer layer comprises a trace printing part and a pad part; the trace printing part is provided with a first through hole.

[0013] the near field communication trace layer is arranged on a side of the trace printing part close to the display screen assembly.

[0014] The first end of the near field communication trace layer inside the first via hole extends to the pad part away from the display screen assembly; the second end of the near field communication trace layer outside the pad part extends to the flexible electrical connector.

[0015] Optionally, the pad part is provided with a second via hole;

[0016] The second end of the near field communication trace layer outside the pad part extends to the side of the pad part away from the display screen assembly through the second via hole; and the side of the pad part away from the display screen assembly is welded with the flexible electrical connector.

[0017] Optionally, the projection of the magnetic guide medium layer on the buffer layer and the projection of the pad part on the buffer layer do not overlap with each other.

[0018] Optionally, the display module further comprises a first adhesive layer.

[0019] The first adhesive layer is arranged between the magnetic guide medium layer and the buffer layer.

[0020] Optionally, the display screen assembly comprises a transparent cover plate, a transparent adhesive layer, a polarizing layer and a display panel.

[0021] The transparent cover plate is arranged on the side of the transparent adhesive layer away from the polarizing layer, the transparent adhesive layer is arranged on the side of the polarizing layer away from the display panel, and the polarizing layer is arranged on the side of the display panel away from the near field communication trace layer.

[0022] Optionally, the near field communication trace layer comprises a conductive layer and an ink layer, and the conductive layer is arranged between the ink layer and the buffer layer.

[0023] Optionally, the thickness of the near field communication trace layer ranges from 0.028 mm to 0.038 mm.

[0024] Optionally, the thickness of the conductive layer ranges from 0.018 mm to 0.028 mm, and the thickness of the ink layer ranges from 0.01 mm to 0.02 mm.

[0025] In a second aspect, the embodiments of the present application provide an electronic device comprising the display module.

[0026] In the embodiments of the present application, the buffer layer is used as the carrier of the near field communication trace layer and the magnetic guide medium layer. The buffer layer, the near field communication trace layer and the magnetic guide medium layer are integrated to form the innovative near field communication assembly. The buffer layer has the buffer protection function for the display screen assembly, and the near field communication trace layer has the near field communication function. The buffer layer and the NFC layer are not arranged independently, the base material layer in the NFC layer is reduced, and the thickness of the display screen module is further reduced, which is beneficial to the thinning of the whole electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is a cross-sectional schematic view of a display module provided by some embodiments of the present application;

[0028] Figure 2 is a schematic view of one side of a buffer layer close to a near field communication trace layer in a display module provided by embodiments of the present application;

[0029] Figure 3 is a schematic view of the other side of the buffer layer away from the near field communication trace layer in the display module provided by embodiments of the present application;

[0030] Figure 4 is a schematic view of the other side of the buffer layer close to the near field communication trace layer in the display module provided by embodiments of the present application;

[0031] Figure 5 is a schematic view of the near field communication trace layer passing through the first through hole in the display module provided by embodiments of the present application;

[0032] Figure 6 is a schematic view of the near field communication trace layer bypassing the buffer layer in the display module provided by embodiments of the present application;

[0033] Figure 7 is a cross-sectional view of the display module corresponding to the partial structure of position A-A in Figure 2 ;

[0034] Figure 8 is a cross-sectional view of the display module corresponding to the partial structure of position B-B in Figure 2 ;

[0035] Figure 9 is a cross-sectional schematic view of the near field communication trace layer in the display module provided by embodiments of the present application.

[0036] Explanation of reference signs:

[0037] 100 - display screen assembly, 101 - transparent cover plate, 102 - transparent adhesive layer, 103 - polarizing layer, 104 - display panel, 200 - near field communication assembly, 210 - buffer layer, 211 - trace printing portion, 2111 - first trace end portion, 2112 - first through hole, 212 - pad portion, 2121 - second trace end portion, 2122 - second through hole, 220 - near field communication trace layer, 221 - conductive layer, 222 - ink layer, 230 - magnetic permeable medium layer, 240 - first adhesive layer, 300 - flexible electrical connector. DETAILED DESCRIPTION

[0038] Embodiments of the present application will be described in detail below with reference to the drawings, in which like or similar elements always designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are for the purpose of explanation only and are not to be taken as limiting of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of the present application.

[0039] The terms "first", "second" in the specification and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0040] In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0041] In the description of the present application, it should be noted that unless specifically defined and limited otherwise, the terms "mounting", "connected", "connection" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium, or can be the internal communication of two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0042] The embodiment of the present application provides a display module, referring to Figure 1 、 Figure 7 、 Figure 8 The display module comprises a display screen assembly 100 and a near field communication assembly 200; the near field communication assembly 200 is connected with the display screen assembly 100; the near field communication assembly 200 comprises a buffer layer 210, a near field communication trace layer 220 and a magnetic guide medium layer 230; the near field communication trace layer 220 is arranged on the side of the buffer layer 210 close to the display screen assembly 100; and the magnetic guide medium layer 230 is arranged on the side of the buffer layer 210 away from the display screen assembly 100.

[0043] The display screen assembly 100 serves as a visual information output carrier to realize image and text display; the near field communication assembly 200 is connected with the display screen assembly 100, and can be used to realize near field communication, such as functions of brushing a door guard, brushing a subway gate, near field payment and the like as NFC.

[0044] In some embodiments of the present application, the buffer layer 210 can be PET or TPU (Thermoplastic Polyurethane) or the like, which can absorb external impact, protect the display screen assembly 100, and at the same time provide a support surface for the near field communication trace layer 220.

[0045] In the embodiment of the present application, the near field communication trace layer 220 can serve as an NFC antenna, the near field communication trace layer 220 is arranged on the side of the buffer layer 210 close to the display screen assembly 100, and the near field communication trace layer 220 realizes near field communication through electromagnetic induction. The near field communication trace layer 220 can be a layer of functional conductive material, which can be obtained by mixing nano-metal composite paste and polydimethylsiloxane base material, and dynamic chemical bond polymer additives. The nano-metal can be nano-copper, nano-silver, nano-gold or the like, which is not limited in the embodiment of the present application.

[0046] In the embodiment of the present application, the magnetic guide medium layer 230 is arranged on the side of the buffer layer 210 away from the display screen, and the wiring layer 220 is arranged on the opposite side of the buffer layer 210, which functions to converge the magnetic field generated by the NFC antenna, reduce the shielding effect of the metal on the magnetic field, and improve the signal strength and penetration capability. The magnetic guide medium layer 230 can improve the magnetic field strength of the NFC antenna and reduce the signal attenuation caused by the metal shell; the magnetic guide medium layer 230 also has a magnetic shielding effect, reduces the electromagnetic interference generated by the display screen backlight module or the battery, improves the signal-to-noise ratio of the NFC signal, enables the receiving end to more accurately identify and analyze the original data, reduces the signal misjudgment and data transmission error caused by noise, ensures the stability and reliability of the NFC communication process, and enhances the stability and reliability of the communication.

[0047] In the embodiment of the present application, the processing technology of the near field communication wiring layer 220 on the buffer layer 210 can be realized by combining eAMP (Electronic Additive Manufacturing Process, electronic manufacturing technology based on additive manufacturing technology), and the general process can be as follows:

[0048] First, the buffer layer 210 is prepared from PET or TPU, and is shaped into the shape of the display screen assembly by die cutting process;

[0049] Subsequently, the near field communication wiring layer 220 is printed on the surface of the buffer layer 210 by using functional conductive material by eAMP process. For example, the functional conductive material is formed on the buffer layer 210 to form the near field communication wiring layer 220 by screen printing or inkjet printing technology.

[0050] Of course, in actual application, the width and length of the wiring of the near field communication wiring layer as the NFC coil, and the number of turns of the coil, are set according to actual design requirements, and the embodiment of the present application does not limit them.

[0051] In the related art, the display module is usually stacked by a display assembly, a buffer layer, glue, an NFC layer, etc., and the NFC layer (near field communication layer) and the buffer layer are arranged separately and connected by adhesion or the like. The display module provided in the embodiment of the present application integrates the buffer layer 210 as part of the near field communication assembly 200, so that the near field communication assembly 200 not only realizes the basic function of near field communication, but also plays a certain buffering and protection role for the display screen assembly 100 as a whole, which can improve the screen stress failure problem.

[0052] The elastic material of the buffer layer 210 matches the rigid support of the magnetic guide medium layer 230. The rigid magnetic guide medium layer can reduce deformation caused by vibration, and ensure the stability of the magnetic field guiding path. The elastic buffer layer can absorb external vibration energy, reduce the amplitude of vibration transmitted to the magnetic guide medium layer and the wiring layer, avoid magnetic field distribution fluctuations caused by component vibration, maintain the stability of the near field communication signal, and reduce communication interruption or data transmission errors caused by mechanical vibration.

[0053] It should be noted that the buffer layer 210 can be made of PET, foam, TPU (Thermoplastic Polyurethane), silicone, elastic gel, rubber, and other materials with good insulation, and the surface can be printed with functional conductive materials. The near field communication wiring layer 220 can be made of electrolytic copper foil, calendered copper foil, silver nanowire, and other materials. The magnetic guide medium layer 230 can be made of ferrite material, new type of nanocrystalline magnetic film, and other materials. The flexible electrical connector 300 can be made of PI (Polyimide), LCP (Liquid Crystal Polymer), PSA (Pressure-Sensitive Adhesive), and other materials. The embodiments of the present application are not limited.

[0054] In summary, in some embodiments of the present application, the buffer layer is used as the carrier of the near field communication wiring layer and the magnetic guide medium layer. The buffer layer, the near field communication wiring layer, and the magnetic guide medium layer are integrated to form an innovative near field communication assembly. The buffer layer not only has the buffering and protecting function for the display screen assembly, but also realizes the near field communication function of the near field communication wiring layer. The buffer layer and the NFC layer are no longer independently arranged, the base material layer in the NFC layer is reduced, the thickness of the display screen module is further reduced, and the thinning of the entire electronic device is facilitated.

[0055] Optionally, the display module further comprises a flexible electrical connector 300; the near field communication assembly 200 is arranged between the display screen assembly 100 and the flexible electrical connector 300; and the near field communication wiring layer 220 is electrically connected to the flexible electrical connector 300.

[0056] The near field communication assembly 200 is arranged between the display screen assembly 100 and the flexible electrical connecting piece 300, and the flexible electrical connecting piece 300 is electrically connected to the near field communication assembly 200, so that the received induction signal of the near field communication assembly 200 can be transmitted to the processor of the electronic device for processing, or the near field communication assembly 200 can be controlled to send an induction signal based on the instruction of the processor through the flexible electrical connecting piece 300. The electrical connection between the near field communication trace layer 220 and the flexible electrical connecting piece 300 further improves the durability and reliability of the smart wearable device, improves the lightness and thinness of the display module, ensures the sensitivity of NFC, and still meets the requirements of small size, high reliability and strong communication performance of the smart wearable device.

[0057] It should be noted that in the embodiments of the present application, the flexible electrical connecting piece 300 can be an FPC, and the flexible electrical connecting piece 300 is electrically connected to the near field communication trace layer 220 to transmit the NFC signal to the processor of the electronic device. Since the FPC is easy to bend, it is convenient for assembly.

[0058] Optionally, with reference to Figure 2 , Figure 3 , Figure 5 , Figure 7 The buffer layer 210 includes a trace printing part 211 and a pad part 212; the trace printing part 211 is provided with a first through hole 2112; the near field communication trace layer 220 is arranged on the side of the trace printing part 211 close to the display screen assembly 100; the first trace end part 2111 on the inner side of the near field communication trace layer 220 passes through the first through hole 2112 and extends to the pad part 212 along the side of the trace printing part 211 away from the display screen assembly 100; the second trace end part 2121 on the outer side of the near field communication trace layer 220 extends to the pad part 212; and the pad part 212 is welded with the flexible electrical connecting piece 300.

[0059] In the embodiments of the present application, the shape of the buffer layer 210 is a regular plane, the edges are right-angled or rounded rectangular, and the size is basically matched with the display screen assembly 100 or the near field communication assembly 200, which is suitable for standardized mass production and facilitates alignment and lamination with other components in the laminated structure. Circular or strip-shaped protrusions are arranged at the corresponding positions of the pads, wire interface and other key components, and avoiding grooves are arranged at the edges of the magnetic guide medium layer 230, trace layer and other components to avoid interference. The gap between the magnetic guide medium layer 230 and the pad is reserved by the groove design to prevent damage of the components caused by hard extrusion. It can also adapt to special screens such as hole screens and notch screens, and annular protrusions are arranged around the camera and sensor openings to prevent the edges of the openings from cracking due to extrusion.

[0060] The near field communication trace layer 220 is printed on the trace printing part 211, and then the traces of the trace layer extend to the pad part 212, and the pad part 212 is welded with the FPC, so as to realize the electrical connection between the traces and the FPC.

[0061] In the embodiment of the present application, the first through hole 2112 is arranged on the wiring printing part 211, and is used to pass through the first wiring end part 2111 of the near field communication wiring layer 220 on one side of the buffer layer 210 to the other side of the buffer layer 210, and then the wiring extends to the pad part 212 on the other side. The second wiring end part 2121 outside the near field communication wiring layer 220 on one side of the buffer layer 210 extends to the pad part 212.

[0062] The pad part 212 is used as a welding part for circuit connection, so that the two ends of the near field communication wiring layer 220 can be welded with the flexible electrical connecting part 300 at the pad part 212, and electrical conduction of the signal is realized. The signal transmission path of the near field communication wiring layer 220 is divided into two paths, i.e., an inner side and an outer side. The first wiring end part 2111 on the inner side starts from the near field communication wiring layer 220, passes through the first through hole 2112 on the wiring printing part 211 downward, and then extends along the wiring printing part 211 away from the side of the display screen assembly 100, and finally reaches the pad part 212. The second wiring end part 2121 on the outer side directly extends from the near field communication wiring layer 220 to the pad part 212. After the two paths converge at the pad part 212, the signal is transmitted to the outside through welding of the pad part 212 and the flexible electrical connecting part 300.

[0063] In this way, the buffer layer 210 has the functions of mechanical buffering, wiring support and welding, and can not only absorb external impact through material elasticity to protect the display screen assembly, but also can conveniently realize the layout of the NFC coil and the electrical connection requirement of the FPC.

[0064] Optionally, referring to Figure 3 , the second through hole 2122 is arranged on the pad part 212; the second wiring end part 2121 outside the near field communication wiring layer 220 extends to the side of the pad part 212 away from the display screen assembly 100 through the second through hole 2122; and the side of the pad part 212 away from the display screen assembly 100 is welded with the flexible electrical connecting part 300.

[0065] The near field communication wiring layer 220 is an NFC wiring layer, the second through hole 2122 can realize vertical electrical connection of the near field communication wiring layer 220 and the pad part 212, replace the traditional plane wiring cross connection, and can shorten the signal path. The second wiring end part 2121 is used as a transmission carrier of the NFC signal, realizes cross-layer connection from the wiring layer to the pad part 212 through through-hole welding, and ensures normal transmission of the signal.

[0066] The second through hole 2122 vertically connects the NFC wiring layer and the solder path of the flexible electrical connector 300 from the plane to the vertical conduction, reducing the horizontal wiring space. In the smart watch display module, this design can reduce the thickness of the NFC component area, release some internal space for the battery or sensor, reduce the edge thickness of the module, and adapt to a narrower watch frame design.

[0067] In an embodiment of the present application, as shown in Figure 2 、 Figure 3 , the dashed box on the pad part 212 is the soldering area. The near field communication wiring layer 220 is arranged on the side of the wiring printing part 211 close to the display screen assembly 100, forming an NFC antenna coil. The wiring of the near field communication wiring layer 220 has two end portions. The first wiring end portion 2111 passes through the first through hole 2112 to connect the near field communication wiring layer 220, i.e. the inner side of the NFC wiring layer and the pad part 212, realizing signal cross-layer transmission. The second wiring end portion 2121 connects the outer side of the NFC wiring layer and the pad part 212, forming a complete circuit loop. The first wiring end portion 2111 passes through the first through hole 2112, extends to the pad part 212 on the side of the wiring printing part 211 away from the display screen assembly 100 for soldering. This jumper connection method avoids the detour and bending of surface wiring. The soldering surface of the pad part 212 and the flexible electrical connector 300 can be concentratedly arranged at the edge of the assembly, avoiding occupying the space below the display screen, ensuring the integrity of the signal and improving the space utilization.

[0068] The layered design of the wiring printing part 211 and the near field communication wiring layer 220 reduces the electromagnetic interference of the display screen assembly 100 on the NFC signal, ensuring the sensitivity and anti-interference ability of the near field communication. The through design of the first through hole 2112 realizes the three-dimensional layout of the wiring, avoids occupying additional space by plane wiring, and adapts to the narrow frame requirement of wearable devices. The integrated structure of the wiring printing part 211 and the pad part 212 avoids wiring breakage caused by vibration, improving the reliability of long-term use of the device.

[0069] Optionally, in another implementation, referring to Figure 4 、 Figure 6 , the second wiring end portion 2121 on the inner side of the near field communication wiring layer 220 bypasses the buffer layer 210 from the outer side of the pad part 212, and is soldered to the flexible electrical connector 300 on the side away from the display screen assembly 100.

[0070] The design bypasses the second trace end 2121 inside the near field communication trace layer 220 from the outside of the pad part 212 through the buffer layer 210, and is welded with the flexible electrical connector 300 on the side away from the display screen assembly 100, so that the display module can not only release the space below the display screen through the bypass outside to promote the lightweight design of the display module, but also reduce the electromagnetic interference of the display screen assembly 100 on the NFC signal, cooperate with the magnetic guide medium layer 230 to enhance the magnetic field coupling efficiency, and improve the stability of the near field communication.

[0071] At the same time, the outside welding path can be enhanced by the bending protection of the extension of the buffer layer 210, adapt to the dynamic use scene of the wearable device, and the welding position is exposed to the edge of the module, which is convenient for the implementation of automatic welding process, improves the yield of mass production and reduces the maintenance cost.

[0072] Optionally, as shown in Figure 8 The projection of the magnetic guide medium layer 230 on the buffer layer 210 does not overlap with the projection of the pad part 212 on the buffer layer 210.

[0073] As shown in Figure 8 , I is the projection of the pad part 212 on the buffer layer 210, and II is the projection of the magnetic guide medium layer 230 on the buffer layer 210, and the projections of the two on the buffer layer 210 do not overlap with each other.

[0074] Since the magnetic guide medium layer 230 usually has high magnetic permeability, if its projection overlaps with the pad part 212, it may interfere with the electromagnetic environment of the welding position of the pad part and the flexible electrical connector 300, resulting in that the signal transmission of the welding point is affected by the magnetic field. The separation of the projections of the two can ensure that the electrical connection area of the pad part is not disturbed by the magnetic field, so as to ensure that the conductivity of the welding point and the stability of the signal transmission are not affected.

[0075] The pad part 212 is a key area of the welding operation, which needs to be exposed on the surface of the buffer layer 210 to facilitate the alignment and operation of the welding tool. The projection of the magnetic guide medium layer 230 avoids the pad part, which can avoid the magnetic guide medium layer covering or shielding the pad part 212, so as to ensure that the pad surface can be directly contacted during welding, reduce the risk of virtual welding and welding caused by the blocking of the magnetic guide medium layer 230, and ensure the reliable welding of the flexible electrical connector 300 and the pad. At the same time, if the rigid magnetic guide medium layer 230 overlaps with the pad part 212, it may generate extrusion stress on the pad part during assembly or use, and the separation design can offset the extrusion stress through the elastic material of the buffer layer 210, thereby ensuring the integrity of the structure of the pad part 212.

[0076] In addition, after the pad portion 212 is shielded from the magnetic guide medium layer 230, the buffer layer 210 can provide more direct mechanical buffering in this area, reducing stress damage to the solder joint caused by bending, cooperating with the exposed solder position, facilitating precise positioning of automated equipment, improving yield and maintenance convenience, optimizing the uniformity of the magnetic field coupling between the magnetic guide medium layer 230 and the NFC trace layer, and further enhancing the stability of near field communication.

[0077] Referring to Figure 8 , the display module corresponds Figure 2 to the B-B position, on the side of the buffer layer close to the display screen assembly 100, the traces of the near field communication trace layer 220 can be attached to the edge of the PET. In this way, referring to Figure 8 , the lengths of the buffer layer 210, the near field communication trace layer 220, and the second adhesive layer therebetween are the same. The lengths of the magnetic guide medium layer 230 and the first adhesive layer between the near field communication trace layer 220 and the magnetic guide medium layer 230 are different, and the first adhesive layer is smaller than the lengths of the above-mentioned buffer layer 210, etc. In this way, a position for electrically connecting the near field communication trace layer 220 and the flexible electrical connecting piece 300 can be left on the side of the buffer layer 210 facing the magnetic guide medium layer 230, facilitating precise alignment during processing and improving the efficiency and reliability of assembly.

[0078] In the embodiments of the present application, the gap between the magnetic guide medium layer 230 and the pad portion 212 avoids rigid interference of the magnetic guide medium layer 230 with the stress absorption function of the buffer layer 210, so that the buffer layer 210 can fully deform to absorb impact energy when subjected to extrusion, while preventing the magnetic guide medium layer 230 from being broken due to excessive deformation, thereby improving the mechanical damage resistance of the module. The gap design between the pad portion 212 and the magnetic guide medium layer 230 not only avoids eddy current loss and magnetic interference of the ferromagnetic material on the current loop near the pad, ensuring the integrity of NFC signal transmission, but also prevents solder overflow from contaminating the magnetic guide medium layer 230, while reserving operation space for pad maintenance.

[0079] Optionally, referring to Figure 7 , Figure 8 , the display module further comprises a first adhesive layer 240.

[0080] It can be understood that the first adhesive layer 240 is a functional adhesive structure arranged between the magnetic guide medium layer 230 and the buffer layer 210, which can be an optically transparent adhesive, an acrylic pressure-sensitive adhesive, a silicone adhesive, or other adhesives suitable for electronic devices.

[0081] The adhesive of the first adhesive layer 240 has a certain flowability, and the flexible molecular chain of the first adhesive layer 240 can absorb the modulus difference stress between the magnetic guide medium layer 230 and the buffer layer 210. The elastic modulus of the adhesive layer is between the rigid magnetic guide layer and the flexible buffer layer 210, forming a gradient buffer structure.

[0082] The viscous flow characteristics of the first adhesive layer 240 can fill the micron-level grooves on the surface of the buffer layer 210, improve the flatness of the bonding of the magnetic guide medium layer 230, and avoid magnetic field leakage caused by air gaps.

[0083] Optionally, in the exposed area of the pad part 212, the first adhesive layer 240 can adopt a local thinning design to avoid interference with the welding process and ensure reliable connection of the flexible electrical connecting piece 300 and the pad.

[0084] Optionally, referring to Figure 1 、 Figure 7 The display screen assembly 100 includes a transparent cover plate 101, a transparent adhesive layer 102, a polarizing layer 103, and a display panel 104; the transparent cover plate 101 is arranged on the side of the transparent adhesive layer 102 away from the polarizing layer 103, the transparent adhesive layer 102 is arranged on the side of the polarizing layer 103 away from the display panel 104, and the polarizing layer 103 is arranged on the side of the display panel 104 away from the near-field communication trace layer 220.

[0085] The transparent cover plate 101 constitutes the outermost protective structure of the display module, bears external mechanical load, provides wear-resistant and impact-resistant surface protection, and has a certain impact resistance. The transparent adhesive layer 102 realizes optical bonding of the transparent cover plate 101 and the polarizing layer 103, and ensures optical bonding of each layer to reduce light reflection. The polarizing layer 103 controls polarized light transmission through a molecular orientation film, filters stray light, and eliminates environmental light reflection. The display panel 104 is the core component of electronic device imaging, responsible for electro-optical conversion of image signals.

[0086] The transparent cover plate 101 is arranged on the side of the transparent adhesive layer 102 away from the polarizing layer 103, the transparent adhesive layer 102 is arranged on the side of the polarizing layer 103 away from the display panel 104, and the polarizing layer 103 is arranged on the side of the display panel 104 away from the near field communication wiring layer 220. That is, from the outside of the display screen to the direction of the near field communication wiring layer 220, the transparent cover plate 101, the transparent adhesive layer 102, the polarizing layer 103, and the display panel 104 are sequentially stacked and connected with the near field communication wiring layer 220, and the light transmission, optical performance, and structural protection can be synergistically optimized. The display panel 104 and the near field communication assembly 200 are stacked, and the compact 'display-communication' integrated layout can be formed inside the display module by means of the magnetic guide medium layer 230 and the wiring layer of the near field communication assembly 200. The coupling efficiency of the near field communication signal can be enhanced by the magnetic guide medium layer 230, the electromagnetic interference can be reduced by the interlayer isolation of the display panel 104 and the near field communication assembly 200, the signal transmission path is shortened, the communication stability is improved, the stacked structure can compress the module thickness, and the light and thin demand of the electronic device can be met.

[0087] By means of the integrated arrangement of the transparent cover plate 101, the transparent adhesive layer 102, the polarizing layer 103, the display panel 104, and the near field communication assembly 200, the display panel 104 and the near field communication assembly 200 can be applied to smart phones, folding screen devices, tablet computers and other electronic devices. The display panel 104 and the near field communication assembly 200 are integrated to realize 'display+NFC payment', the user can complete the subway card swiping and mobile payment through screen touch operation, the signal transmission path is shortened to improve the communication response speed, the module thickness is compressed, and the ultra-thin body design of the mobile phone is adapted.

[0088] It can also be applied to smart watches, health monitoring bracelets, sports wearable devices and other electronic devices. The light and thin characteristics of the stacked structure meet the light weight demand of the wearable device, and the wearing comfort is not affected by the over-thick module. The integration of the near field communication assembly 200 and the display panel 104 supports the NFC access control and bus card functions, the user can directly operate through the screen interface, the signal coupling efficiency is enhanced by the magnetic guide medium layer 230, and stable communication is ensured in the complex electromagnetic environment such as wrist.

[0089] In the embodiment of the present application, the NFC coil is not arranged on the cover plate or the polarizing layer, which avoids affecting the light transmission of the cover plate or the polarizing layer, and does not affect the display performance of the display screen assembly 100. In combination with the arrangement mode of the near field communication assembly 200, the thickness of the display module can be reduced without affecting the display performance of the display screen assembly 100.

[0090] Optionally, referring to Figure 9 , the near field communication wiring layer 220 includes a conductive layer 221 and an ink layer 222, and the conductive layer 221 is located between the ink layer 222 and the buffer layer 210.

[0091] The near field communication trace layer 220 includes a conductive layer 221 and an ink layer 222. The conductive layer 221 is composed of a conductive material such as copper foil or silver paste, and is a core carrier for NFC signal transmission. The NFC antenna or signal path is formed by the layout of the trace. The ink layer 222 is insulating ink, which is covered on the outside of the conductive layer 221, and plays a role of insulation, anti-oxidation, anti-short circuit and protection of the conductive circuit.

[0092] The buffer layer 210 is composed of a flexible insulating material, which is used to buffer external stress and avoid damage to the conductive layer 221 due to extrusion and bending.

[0093] Since the conductive layer 221 is located between the ink layer 222 and the buffer layer 210, the insulating properties of the buffer layer 210 can reduce the electromagnetic coupling interference of the conductive layer 221 with the lower magnetic guide medium layer 230 or the display assembly, and the ink layer 222 can isolate the influence of external electromagnetic noise on the conductive layer 221, forming a “double shielding” effect and improving the reliability of NFC communication. For example, when the display module is close to a metal object, the insulating property of the ink layer 222 can prevent the conductive layer 221 from short-circuiting, and the buffer layer 210 can avoid the deformation of the circuit caused by metal extrusion, thereby maintaining the stability of signal transmission.

[0094] The ink layer 222 acts as a “protective layer” for the conductive layer 221, which can prevent the conductive material from failing due to oxidation, friction or liquid erosion. For example, in the bending scenario of the display module, the ink layer 222 can reduce the direct friction between the conductive layer 221 and the outside world, and avoid circuit breakage. The cooperation of the buffer layer 210 and the ink layer 222 makes the conductive layer 221 in a “sandwich” structure: the buffer layer 210 absorbs the extrusion stress from the display panel 104 or the outside world, and the ink layer 222 resists surface scratching, double protection to ensure that the NFC trace layer is not easily damaged in long-term use, and prolongs the service life of the display module.

[0095] The layered design of the conductive layer 221 and the ink layer 222 belongs to the common process of flexible printed circuit board (FPC), which can achieve micron-level trace precision through techniques such as photoetching and pressing, and adapt to the ultra-thin demand of the display module. In addition, the ink layer 222 can be printed in black or transparent color according to the appearance demand of the display module, avoiding the exposure of the conductive layer 221 trace affecting the screen display effect, and taking into account the reliability of NFC function and the beauty of equipment appearance.

[0096] Optionally, the thickness of the near field communication trace layer 220 ranges from 0.028 to 0.038 mm.

[0097] The thickness of the near field communication trace layer 220 is controlled to be 0.028-0.038 mm, which can significantly improve the integration adaptability and structural reliability of the display module. The thickness range is compatible with the conventional process precision of the flexible electrical connector 300, which can realize micron-level lamination with the display panel 104, the polarizing layer 103 and other components through ultra-thin design, avoid increasing the overall thickness of the module, and meet the light and thin demand of consumer electronic devices; and can guarantee the mechanical strength and signal transmission performance of the conductive layer 221 by means of moderate material thickness, while ensuring that the protection function of the ink layer 222 and the buffer layer 210 is not affected. Under the thickness constraint of 0.028-0.038 mm, the trace layer can accurately adapt to the bending radius requirement of the display module, and realize the balance of function and structure.

[0098] Optionally, the thickness of the conductive layer 221 is 0.018-0.028 mm, and the thickness of the ink layer 222 is 0.01-0.02 mm.

[0099] The combination of the conductive layer 221 with a thickness of 0.018-0.028 mm and the ink layer 222 with a thickness of 0.01-0.02 mm can realize the synergistic optimization of electrical performance, structural strength and lightness in the display module. The thickness of the conductive layer 221 is adapted to the standard process of 1 / 3 ounce copper foil, which can guarantee the low resistance characteristic of NFC signal transmission through sufficient metal thickness, and can meet the flexible bending requirement by a thickness of less than 0.028 mm; the thickness of 0.01-0.02 mm of the ink layer 222 forms a dense insulating protection barrier, which isolates the conductive layer 221 from oxidation and short circuit risk, and does not increase the overall burden of the module due to the light and thin thickness, i.e. the total trace layer thickness can be controlled to be less than 0.038 mm, and the thickness range is compatible with the pressing process of the buffer layer 210, which can keep the stress of each layer evenly distributed in the lamination structure, avoid electromagnetic interference or structural deformation between the display panel 104 and the near field communication assembly 200 caused by thickness deviation, and finally realize the balance between communication reliability and ultra-thin design of the display module.

[0100] In the embodiments of the present application, the size parameters of the related layers in the present application are as follows:

[0101] The near field communication trace layer 220 is adhered to the buffer layer 210 and the magnetic guide medium layer 230 respectively through a second adhesive layer, the thickness of the second adhesive layer can be 0.012mm-0.038mm, the thickness of the near field communication trace layer 220 is 0.028mm-0.038mm, the thickness of the buffer layer 210 can be 0.065mm, the thickness of the magnetic guide medium layer 230 can be 0.04mm-0.1mm, and the thickness of the PET layer is 0.065mm-0.2mm. Among them, the thickness of the ink layer in the near field communication trace layer 220 is 0.01-0.02mm, and the thickness of the conductive layer is 0.018-0.028mm. The thickness of the ferrite can be 0.04-0.1mm.

[0102] As a comparison, in the related art, the display module is usually stacked by a display component, glue, an NFC layer and the like, in order to ensure the near field communication function and drop reliability, the overall minimum thickness of the display module is about 0.1752mm. In the case that the thicknesses of the buffer layer, the first adhesive layer and the magnetic guide medium layer in the present application and the related art are the same, the present application embodiment cancels the PI substrate in the related art due to the innovative way of integrating the buffer layer 210, the near field communication trace layer 220 and the magnetic guide medium layer 230 as a near field communication component, and at least saves the thickness of the PI substrate layer of 0.0125mm, thereby the thickness of the display module can be reduced. If the thickness of the PI substrate layer is 0.025mm, the saved thickness is more.

[0103] Secondly, in the case of using the aforementioned functional conductive material, the functional conductive material replaces the copper layer composed of electroplated copper and substrate copper in the related art, and the thickness of the electroplated copper can be saved.

[0104] From the above comparison, the overall benefit thickness of the present application can save the thickness of the PI substrate layer at least when the functional conductive material is not used and the thickness of the PI substrate layer and the electroplated copper can be saved when the functional conductive material is used, and the total thickness can be reduced by at least 0.0225mm. The thickness of the display module provided by the present application embodiment can be between 0.1502mm-0.1627mm.

[0105] The present application embodiment further discloses an electronic device comprising the display module as described above.

[0106] The electronic device described above can be a wearable device, such as a smart watch, a smart bracelet, a smart ring and the like, and the present application embodiment does not limit it.

[0107] The electronic device described in the present application embodiment can achieve the same beneficial effects as the display module, which will not be described here.

[0108] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples.

[0109] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

[0110] The electronic device disclosed in the embodiments of the present application can be a smart phone, a tablet computer, an electronic book reader, a wearable device (for example, a smart watch), an electronic game machine, a VR (Virtual Reality) glasses, or the like, and the embodiments of the present application do not limit the specific type of the electronic device.

[0111] The above embodiments of the present application mainly describe the differences between the embodiments, and the different features of the embodiments can be combined to form more specific embodiments as long as they are not contradictory. In view of the brevity of the text, the combination of the different features of the embodiments will not be described here.

[0112] The embodiments of the present application are described above in combination with the drawings, but the application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative but not restrictive, and those of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the protection scope of the claims.

Claims

1. A display module, characterized in that, include: Display assembly (100) and near-field communication assembly (200); The near-field communication component (200) is connected to the display component (100); The near-field communication component (200) includes: a buffer layer (210), a near-field communication trace layer (220), and a magnetic permeable dielectric layer (230); The near-field communication trace layer (220) is disposed on the side of the buffer layer (210) close to the display assembly (100); the magnetic permeable medium layer (230) is disposed on the side of the buffer layer (210) away from the display assembly (100).

2. The display module according to claim 1, characterized in that, The display module also includes: a flexible electrical connector (300); The near-field communication component (200) is disposed between the display component (100) and the flexible electrical connector (300); The near-field communication wiring layer (220) is electrically connected to the flexible electrical connector (300).

3. The display module according to claim 1, characterized in that, The buffer layer (210) includes: a trace printing section (211) and a pad section (212); the trace printing section (211) is provided with a first through hole (2112); The near-field communication trace layer (220) is disposed on the side of the trace printing section (211) near the display assembly (100); The first trace end (2111) inside the near-field communication trace layer (220) passes through the first through hole (2112) and extends along the trace printing portion (211) away from the display assembly (100) to the pad portion (212); the second trace end (2121) outside the near-field communication trace layer (220) extends to the pad portion (212); the pad portion (212) is soldered to the flexible electrical connector (300).

4. The display module according to claim 3, characterized in that, A second through hole (2122) is provided on the pad portion (212); The second trace end (2121) on the outside of the near-field communication trace layer (220) extends through the second through hole (2122) to the side of the pad portion (212) away from the display assembly (100); the side of the pad portion (212) away from the display assembly (100) is soldered to the flexible electrical connector (300).

5. The display module according to claim 3, characterized in that, The projection of the magnetic permeable medium layer (230) onto the buffer layer (210) does not overlap with the projection of the pad portion (212) onto the buffer layer (210).

6. The display module according to any one of claims 1-5, characterized in that, Also includes: First adhesive layer (240); The first adhesive layer (240) is disposed between the magnetic permeable medium layer (230) and the buffer layer (210).

7. The display module according to any one of claims 1-5, characterized in that, The display assembly (100) includes: a transparent cover plate (101), a transparent adhesive layer (102), a polarizing layer (103), and a display panel (104); The transparent cover plate (101) is disposed on the side of the transparent adhesive layer (102) away from the polarizing layer (103), the transparent adhesive layer (102) is disposed on the side of the polarizing layer (103) away from the display panel (104), and the polarizing layer (103) is disposed on the side of the display panel (104) away from the near-field communication trace layer (220).

8. The display module according to any one of claims 1-5, characterized in that, The near-field communication trace layer (220) includes a conductive layer (221) and an ink layer (222), wherein the conductive layer (221) is located between the ink layer (222) and the buffer layer (210).

9. The display module according to claim 8, characterized in that, The thickness range of the near-field communication trace layer (220) is 0.028 to 0.038 mm.

10. The display module according to claim 9, characterized in that, The thickness of the conductive layer (221) ranges from 0.018 to 0.028 mm, and the thickness of the ink layer (222) ranges from 0.01 to 0.02 mm.

11. An electronic device, characterized in that, The display module includes any one of claims 1-10.

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