Cartridge carrier and bracket for supporting semiconductor component

Abstract

One aspect of the present disclosure is a cassette carrier. A cassette carrier includes a frame defining an interior space having a top opening and a bottom opening, the frame having a first side wall, a second side wall, a first connecting wall and a second connecting wall, with the first connecting wall and the second connecting wall extending between the first side wall and the second side wall. The cassette carrier includes a bracket disposed across the bottom opening and laterally between the first side wall and the second side wall, where a through hole is formed in the bracket, and a shaft passing through the through hole passes through the top opening and the bottom opening. The embodiment of the invention also relates to a bracket for supporting the semiconductor assembly.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a cassette carrier and a holder for supporting semiconductor components. BACKGROUND

[0002] In semiconductor processing, semiconductor components such as wafers, photomasks / reticles, thin films, or other components can be stored or carried in special containers called cassette carriers (or simply cassettes, wafer cassettes, etc.). A cassette carrier is a container used to carry and transport such semiconductor components during a manufacturing process of the semiconductor components. In some cases, the semiconductor components and the cassette carriers in which they are located are immersed in a wet solution during a wet bench process (e.g., for etching, cleaning, etc.).

[0003] However, for sensitive semiconductor components (e.g., extreme ultraviolet (EUV) thin films), the wet bench process can cause unstable fluid flow that adversely affects the semiconductor components located in the cassette. Such liquid turbulence can cause defects on the surface of the semiconductor components, such as residues. For example, a cassette holder at the base of the cassette carrier can cause turbulence, leading to defect formation on the semiconductor components such as EUV thin films.

[0004] Thus, while existing cassette carrier designs and structures have generally been adequate for their intended purposes, they have not been entirely satisfactory in every respect. SUMMARY

[0005] An aspect of embodiments of the present disclosure provides a cassette carrier, comprising: a frame defining an interior space having a top opening and a bottom opening, the frame having a first sidewall, a second sidewall, a first connecting wall, and a second connecting wall, wherein the first connecting wall and the second connecting wall extend between the first sidewall and the second sidewall; and a holder disposed across the bottom opening and laterally between the first sidewall and the second sidewall, wherein a through hole is formed in the holder, and an axis passing through the through hole passes through the top opening and the bottom opening.

[0006] Another aspect of embodiments of the present disclosure provides a support for supporting a semiconductor assembly, the support comprising: a contact portion extending longitudinally along a first direction, the contact portion having a protruding portion and a non-protruding portion, the protruding portion being adjacent to the non-protruding portion in a second direction perpendicular to the first direction, the protruding portion having a rounded top surface configured to physically support the semiconductor assembly, and the non-protruding portion having a sloped top surface sloping upward to meet a vertical side surface of the protruding portion; and a non-contact portion extending longitudinally along the first direction, the non-contact portion being adjacent to the contact portion along the second direction, the non-contact portion having a sloped top surface sloping upward to meet the contact portion.

[0007] Yet another aspect of embodiments of the present disclosure provides a cassette carrier comprising: a frame defining an interior space having a top opening and a bottom opening, the frame having a first side wall, a second side wall, a first connecting wall, and a second connecting wall, wherein the first connecting wall and the second connecting wall extend between the first side wall and the second side wall; and a pair of supports disposed across the bottom opening and laterally between the first side wall and the second side wall, wherein each support of the pair of supports comprises a contact portion and a non-contact portion, and the non-contact portion has a sloped top surface sloping upward to meet the contact portion, wherein the contact portion is configured to directly contact a semiconductor assembly, wherein one or more through holes are formed through each support of the pair of supports. BRIEF DESCRIPTION OF DRAWINGS

[0008] The present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be emphasized, however, that various modifications, additions and substitutions are also possible, without departing from the scope and spirit of the present disclosure. Moreover, the explicit disclosure herein will provide those skilled in the art with one or more means by which the

[0009] Figure 1 A wet bench cassette with cassette supports for supporting semiconductor assemblies according to embodiments of the present disclosure is shown.

[0010] Figure 2 A semiconductor assembly to be inserted into a wet bench cassette and supported by cassette supports according to embodiments of the present disclosure is shown.

[0011] Figure 3A And Figure 3BA side view and a top view of a wet bench cassette without any semiconductor components inserted therein are shown, respectively, in accordance with embodiments of the present disclosure.

[0012] Figure 4A and Figure 4B A side view and a top view of a wet bench cassette with semiconductor components inserted therein are shown, respectively, in accordance with embodiments of the present disclosure.

[0013] Figure 5 A perspective view of a wet bench cassette with a cassette holder for supporting semiconductor components is shown, in accordance with embodiments of the present disclosure.

[0014] Figure 6 A wet bench cassette immersed in a wet solution is shown, in accordance with embodiments of the present disclosure.

[0015] Figure 7 Fluid flow around a cassette holder causing a turbulent zone in an inserted semiconductor component is shown, in accordance with embodiments of the present disclosure.

[0016] Figure 8 A side view of a cassette holder is shown, in accordance with embodiments of the present disclosure, to illustrate Figure 7 further details of the turbulent zone shown.

[0017] Figure 9 A cassette holder supporting semiconductor components is shown, in accordance with embodiments of the present disclosure.

[0018] Figures 10A-10D Cross-sectional views of a cassette holder cut along line B-B’ in Figure 9 are shown, in accordance with various embodiments of the present disclosure.

[0019] Figure 11 Fluid flow through a through-hole portion of a cassette holder is shown, in accordance with embodiments of the present disclosure.

[0020] Figures 12A-12B Various dimensions of a through-hole portion of a cassette holder are shown, in accordance with embodiments of the present disclosure.

[0021] Figure 13 A cassette holder for supporting semiconductor components is shown, in accordance with another embodiment of the present disclosure.

[0022] Figure 14 Cross-sectional views of a cassette holder cut along line B-B’ in Figure 13 are shown, in accordance with various embodiments of the present disclosure.

[0023] Figures 15A-15D Various configurations of through-holes in a cassette holder are shown, in accordance with various embodiments of the present disclosure.

[0024] Figures 16A-16BVarious dimensions of the inclined ramp of the cassette holder are shown in accordance with various embodiments of the present disclosure. DETAILED DESCRIPTION

[0025] The following disclosure provides many different embodiments, or examples, for implementing different characteristics of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to limit the disclosure in any way. For example, in the following description, a first component forming over or on a second component can include embodiments where the first component and second component are in direct contact forming, and can also include embodiments where additional components can be formed between the first component and second component such that the first component and second component can not be in direct contact. Furthermore, the present disclosure can refer to a number and / or lettered reference numbers in various examples. This repetition is for simplicity and clarity and does not itself indicate a relationship between the embodiments and / or configurations discussed.

[0026] In addition, spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for ease of description to describe one element or component's relationship to another element(s) or component(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0027] Still further, when numerical or quantitative values or ranges are described herein, such terms are to be interpreted as encompassing values that are reasonably within the range of the described value, such as + / - 10% of the described value or other values as would be understood by one of skill in the art. For example, the term "about 5 nm" can encompass dimensions ranging from 4.5 nm to 5.5 nm, where + / - 10% of the manufacturing tolerances associated with deposited material layers are known to one of skill in the art. Also, when a dimension or size of a component is compared to another component, the phrases "substantially the same", "about the same", "similar size", and the like can be understood to be within + / - 10% between the compared components. Further, disclosed dimensions of different components can implicitly disclose a ratio of dimensions between the different components.

[0028] The present disclosure relates to wet bench cassettes for carrying, holding, and / or transporting semiconductor components during a wet bench process. Specifically, the present disclosure relates to a holder at a base of the cassette for physically supporting the semiconductor components. As described herein, a wet bench process can include immersing a semiconductor component and a cassette carrier in which it is located into a wet solution for cleaning or etching. For sensitive semiconductor components (e.g., extreme ultraviolet (EUV) pellicles or certain semiconductor wafers), the wet bench process can cause unstable fluid flow that adversely affects the semiconductor components located in the cassette. This liquid turbulence can cause defects, such as residue, on the surface of the semiconductor components. For example, the cassette holder at the base of the cassette carrier can cause turbulence that leads to defect formation on the semiconductor components, such as EUV pellicles. To address these and related issues, the present disclosure provides cassette holders with structural advantages to prevent dead zones and reduce fluid turbulence. This in turn prevents and reduces defect formation in the semiconductor components during the wet bench process. Some structural advantages include cassette holders with various angled and vertical surfaces to prevent fluid flow cross-over, small rounded contact portions to support the semiconductor components, and through-holes that allow liquid to pass through the holder to avoid turbulence.

[0029] The embodiments shown in the present disclosure are configured with EUV pellicles inserted into the wet bench cassettes, but the present disclosure is not limited thereto. Various other semiconductor components (e.g., semiconductor wafers) can be inserted into the wet bench cassettes. The wet bench cassettes described herein can also be referred to as cassettes, cassette carriers, EUV pellicle cassettes, EUV pellicle containers, EUV pellicle carriers, EUV pellicle trays, wafer cassettes, wafer containers, wafer carriers, wafer trays, etc.

[0030] Figure 1 A wet bench cassette 100 having a cassette holder 106 at a base of the wet bench cassette 100 for carrying and supporting semiconductor components is shown in accordance with an embodiment of the present disclosure. Figure 2 A semiconductor component, such as an EUV pellicle 200, inserted into the wet bench cassette 100 and supported by the cassette holder 106 is shown in accordance with an embodiment of the present disclosure. As shown, the EUV pellicle 200 can be inserted into the wet bench cassette 100 through a top opening 105a of the wet bench cassette 100. Figures 1-2 After insertion, the EUV pellicle 200 can be physically placed on and supported by the cassette holder 106 at the base of the wet bench cassette 100.

[0031] Reference is made to Figure 1, the wet bench cassette 100 can be similar to a front opening unified pods (FEUP). As shown, the wet bench cassette 100 includes a top opening 105a for insertion of a semiconductor assembly (e.g., the EUV membrane 200) and a cassette shelf 106 across a bottom opening 105b for supporting the inserted semiconductor assembly. The wet bench cassette 100 is used for wet processing and has an open structure to allow fluid flow and immersion. In the present embodiment, the fluid is free to flow in a vertical direction through the top opening 105a and the bottom opening 105b.

[0032] Still referring to Figure 1 , the wet bench cassette 100 has a frame 112 (or housing) that defines an interior space 107 (or cavity) in which the semiconductor assembly resides. The interior space 107 is vertically located between the top opening 105a and the bottom opening 105b and is laterally surrounded by the frame 112. The frame 112 includes sidewalls 102 (or side panels 102) that can have recesses to insert the EUV membrane 200 therein. The EUV membrane 200 can be a square or rectangular piece. The frame 112 includes connecting walls 104 (or connecting panes 104) that extend between and across the sidewalls 102. The frame 112 can also include a base extension 108 (as part of the connecting panes 104 or separate from the connecting panes 104). The base extension 108 extends longitudinally across the bottom of the interior space 107. The cassette shelf 106 can be disposed above the base extension 108 and extends longitudinally perpendicular to the base extension 108 across the bottom opening 105b. In some embodiments (as shown), there are openings in the connecting panes 104 to allow lateral fluid flow (in addition to the vertical fluid flow through the top opening 105a and the bottom opening 105b). In further embodiments, there are also openings in the side panels 102 to allow additional lateral fluid flow.

[0033] Referring to Figure 2EUV pellicle 200 is an example semiconductor component stored and carried by wet boat 100, and as described above, other semiconductor components can also be stored and carried by wet boat 100. EUV pellicle 200 includes a pellicle 202 surrounded along its perimeter by a pellicle frame 204. In this embodiment, pellicle frame 204 is a border frame adjacent to and disposed laterally on the perimeter portion of pellicle 202. Pellicle 202 can be a thin transparent film made of any suitable material, such as carbon-based or graphene-based nanomaterials. EUV pellicle 200 is used to cover an EUV reticle (also known as an EUV photomask) to protect the EUV reticle from contamination and defects during EUV lithography. However, if defects such as residue appear on pellicle 202 during wet boat processing, the EUV reticle will adversely affect the EUV processing results. For example, light sources entering and exiting pellicle 202 can encounter particle residue, causing reflected EUV light to be inaccurate, resulting in defects in the semiconductor pattern. To address these and other issues, the present disclosure provides a particular boat holder 106 that reduces and prevents residue formation on pellicle 202 during wet boat processing.

[0034] Figure 3A and Figure 3B respectively show a side view and a top view of wet boat 100 without any semiconductor components inserted therein, according to embodiments of the present disclosure. Figure 4A and Figure 4B respectively show a side view and a top view of wet boat 100 with a semiconductor component (e.g., EUV pellicle 200) inserted therein, according to embodiments of the present disclosure. Note that, Figures 3A-3B and Figures 4A-4B wet boat 100 and EUV pellicle 200 are similar to wet boat 100 and EUV pellicle 200 described with respect to Figures 1-2 Thus, for the sake of brevity, certain components are not described or labeled again.

[0035] Reference is made in common to Figures 3A-3B and Figures 4A-4BThe wet bench cassette 100 has an interior space 107 and cassette holders 106 at its base for holding EUV films 200. As described herein, the cassette holders 106 provide film support by way of example, but can also support other semiconductor components such as wafers. As shown in the side and top views, the wet bench cassette 100 has a mid-chamber portion (i.e., the interior space 107) that allows fluid to flow vertically and also laterally in at least one direction (e.g., in the y-direction, in the x-direction, or both, depending on whether there are openings in the side panels 102 and / or the connecting pane 104). As also shown, the cassette holders 106 include a hollow portion having one or more through-holes 405 that pass vertically through the cassette holder 106 along an axis that passes through the top and bottom openings 105a, 105b. The EUV film 200 (or, in particular, the film frame 204 and / or the film 202) can be positioned on the hollow portion of the cassette holder so that fluid can flow through the through-holes 405 in the vertical direction. The EUV film 200 is positioned directly over the one or more through-holes 405.

[0036] Figure 5 A perspective view of a wet bench cassette 100 having cassette holders 106 for supporting semiconductor components (e.g., EUV films 200) is shown in accordance with an embodiment of the present disclosure. Figure 5 The wet bench cassette 100 of Figures 1-2 , Figures 3A-3B and Figures 4A-4B is consistent with the wet bench cassette 100 described in and certain components are not described or labeled again for the sake of brevity. As shown, side openings 115 can be present in the connecting pane 104 and side openings 117 can be present in the side panels 102 to allow lateral fluid flow when the wet bench cassette 100 is immersed and submerged in a wet solution. It should also be noted that this embodiment shows two cassette holders 106 for EUV film support, but more or fewer cassette holders 106 are possible.

[0037] Figure 6 A wet bench cassette 100 immersed in a wet solution 302 is shown in accordance with an embodiment of the present disclosure. For example, the wet bench cassette 100 is immersed in a wet bench tank 300 as part of a wet bench process. The wet bench tank 300 includes a container 304 filled with a wet solution 302. The wet solution 302 can include a processing solution for chemical bath, rinsing, and / or coating. The wet solution 302 can be designed for acid or solvent processing. The wet solution can include an etchant (HF + H20).

[0038] Still referring to Figure 6, the bottom side of the wet bench 100 is first immersed in the wet solution 302. Thus, typically the cassette holder 106 is first immersed before the EUV film 200, particularly the film 202, is immersed. Movement of the wet bench 100 relative to the wet solution 302 will cause fluid to flow towards the film 202, which can cause turbulent flow of the fluid, resulting in defects on the surface of the EUV film 202, such as Figures 7-8 Further described.

[0039] Figure 7 Fluid flow around one or more cassette holders 106 according to embodiments of the present disclosure is shown, creating a turbulent zone 310 in the inserted semiconductor component (e.g., EUV film 202). When the wet bench 100 is immersed in the wet solution 302, the wet solution 302 can flow upwards as shown. However, in the case where the cassette holder 106 has a cylindrical shape (as shown), then the flow can wrap around the curved side surface of the holder 106 and cross at the top of the holder 106, creating a dead zone and turbulence at the base 202a of the EUV film 202. The base 202a of the EUV film 202 can cause defects and residue on its surface. The area with such defects can be referred to as the turbulent zone 310. However, as described later, the present disclosure contemplates cassette holders 106 with various vertical and inclined surfaces in inclined shapes to prevent the cross flow, for better suspension of the small top contact area of the EUV film 200, and hollow areas with through holes 405 so that fluid can flow through the holder 106 to avoid the dead zone and turbulence.

[0040] Figure 8 A side view of a cassette holder 106 according to embodiments of the present disclosure is shown to illustrate Figure 7 Further details of the turbulent zone 310 are shown. The side view is cut along the length of the cassette holder 106. As shown, both the film 202 and the film frame 204 can interface with the top face of the cassette holder 106, where the film frame 204 can be attached laterally to the film 202 along the perimeter of the film 202. When the wet bench 100 is immersed, the turbulent zone 310 at the base 202a can be larger than the turbulent zone 310 towards the top of the EUV film 202 due to the flow of fluid out of the bottom of the holder 106. As shown, from the base 202a of the EUV film 202 to the middle and top (not shown) of the EUV film 202, the defects / residue of the turbulent zone decreases. This is because the defects and turbulence can be larger towards the base 202a of the film 202 due to the cross flow around the cassette holder 106.

[0041] Figure 9 A cassette holder 106 supporting a semiconductor component (e.g., EUV film 200) according to embodiments of the present disclosure is shown. Figure 9 A cassette holder 106 of a wet bench 100 (such as previously described) is enlarged. Figure 9A pair of cassette holders 106 are shown, and the two holders can be symmetrical and mirror each other in shape in their face-to-face direction. The cassette holders 106 can comprise acid- and base-resistant materials, such as polytetrafluoroethylene (PTFE). Figures 10A-10D A cross-sectional view of the cassette holder 106 cut along line B-B’ in Figure 9 is shown. Line B-B’ cuts through the hollow region of one of the cassette holders 106, which has a through-hole 405, with the EUV film 200 placed above the through-hole 405.

[0042] Referring to Figure 10A , each of the pair of cassette holders 106 comprises various bevels and through-holes 405. The cassette holder 106 comprises a contact portion 106a and a non-contact portion 106b. In the hollow region, the contact portion 106a is separated from the non-contact portion 106b by the through-hole 405. The through-hole 405 can penetrate portions of the contact portion 106a and the non-contact portion 106b. The contact portion 106a is configured to directly contact the EUV film 200, while the non-contact portion does not contact the EUV film 200 and is only used to reduce turbulence and direct liquid flow. Each of the contact portion 106a and the non-contact portion 106b is adjacent to each other in the x-direction and extends longitudinally along the y-direction (i.e., the longitudinal direction of the cassette holder 106). Each of the contact portion 106a and the non-contact portion 106b can comprise vertical (or substantially vertical) side surfaces. These vertical side surfaces can facilitate more vertical fluid flow to prevent cross flow above the top surface of the holder 106, thereby reducing turbulence in the turbulence zone 310.

[0043] The contact portion 106a can comprise a protruding portion with a circular top surface 404, and the EUV film 200 falls on the circular top surface 404. In other words, the protruding portion of the contact portion 106a physically supports and directly contacts the EUV film 200. Note that the circular top surface 404 is the topmost surface of the cassette holder 106. The contact portion 106a can also comprise a non-protruding portion laterally adjacent to the protruding portion in the x-direction, which has an inclined top surface 402a that is inclined upward to meet the vertical side surface of the protruding portion. In the illustrated embodiment, the protruding portion of the contact portion 106a comprises a vertical side surface on both sides, and one of the vertical side surfaces is the vertical side surface of the contact portion 106a.

[0044] In the area not separated by the through hole 405, the non-contact portion 106b can include a sloped top surface 402b that slopes upward to interface with the contact portion 106a, as shown in the combination of the top view and cross-sectional view. In the illustrated embodiment, the non-contact portion 106b can span a greater width than the contact portion 106a, as the contact portion 106a can be minimized for a small surface contact area to better levitate the EUV film 200 (e.g., the small circular top surface 404 and small sloped top surface 402a). Also in the illustrated embodiment, the through hole 405 penetrates a greater portion of the non-contact portion 106b than the contact portion 106a. This is because the non-contact portion 106b is purely configured to reduce turbulence, and does not need to physically support the EUV film 200. As such, having a greater portion of the through hole 405 penetrate the non-contact portion 106b will achieve the purpose of the non-contact portion promoting a greater degree of turbulence reduction.

[0045] Still referring to Figure 10A and referring to Figure 11 In more detail, the sloped sloped top surfaces 402a and 402b and the through hole 405 smooth the flow of liquid over the surface of the film 202, reducing cross flow and turbulence. The unique shape of the pod holder 106 can provide better structural integrity and pod holder strength when handled in a wet bench. In some examples, by utilizing the pod holder 106 described herein, EUV film scrap rates can be reduced by greater than 4%.

[0046] Figures 10B-10D Similar to Figure 10A but showing additional pod holder configurations according to further embodiments of the disclosure. For example, Figure 10B showing the contact portion 106a and non-contact portion 106b flipped, mirroring Figure 10A the one shown; Figure 10C showing the contact portion 106a flipped and mirrored Figure 10B the one shown; and Figure 10D showing that the shape of the through hole 405 can be varied for non-uniform hole widths. Each of these embodiments can produce different flow depending on design needs.

[0047] Figure 11 showing fluid flow through the hollowed out portion of the pod holder 106 (including the through hole 405) according to embodiments of the disclosure. As shown, due to the bevels (top bevels 402a and 402b), the circular end of the contact portion 106a (circular top surface 404), and the through hole 405; when compared to Figure 7The fluid flow shown is more controlled and less disruptive around the semiconductor component (e.g., EUV membrane 200) and can reduce or eliminate turbulent flow regions 310. For example, the bevels (top bevels 402a and 402b) direct fluid flow to avoid crossing, and the through-holes 405 allow fluid to escape via an escape path. The combination of the beveled bevels, through-holes, and small circular contact areas promotes more vertical fluid flow, reduces dead zones, and reduces fluid turbulence.

[0048] Figures 12A-12B Various dimensions of the cassette holder 106, including the through-hole portion of the cassette holder 106, are shown in accordance with embodiments of the present disclosure. With reference to Figure 12A and Figure 12B , the cassette holder 106 has a width W1 along the x-direction; the contact portion 106a has a width W2 along the x-direction, and the through-holes 405 have a width W3 along the x-direction. In the present embodiment, 0.95W1≥W2≥0.05W1. In other words, the contact portion 106a spans a width W2 that is greater than 0.05 times the width W1 of the cassette holder 106, but less than 0.95 times the width W1 of the cassette holder 106. If the width W2 spans less than 0.05 times the width W1, the contact portion 106a will not be large enough to physically support the EUV membrane 200 while promoting proper liquid flow; however, if the width W2 spans greater than 0.95 times the width W1, the contact portion 106a will be too large and will not leave enough structural support for the non-contact portion 106b. In the present embodiment, 0.95W1≥W3≥0.05W1. In other words, the through-holes 405 span a width W3 that is greater than 0.05 times the width W1 of the cassette holder 106, but less than 0.95 times the width W1 of the cassette holder 106. If the width W3 spans less than 0.05 times the width W1, the through-holes 405 will not be large enough to allow for sufficient liquid escape paths for reducing turbulence; however, if the width W3 spans greater than 0.95 times the width W1, the through-holes will be too large and will not leave enough structural support for the contact portion 106a and the non-contact portion 106b. In the present embodiment, the width W2 of the contact portion 106a is less than the width of the non-contact portion 106b (not labeled) for reasons described previously.

[0049] With reference to Figure 12A , the through-holes 405 have a length LI in the y-direction (the longitudinal direction of the cassette holder 106). The length LI should be large enough to achieve a sufficiently smooth flow around the base 202a of the membrane 202. For example, with a thickness of the EUV membrane 200 of about 700 pm, the length LI should be at least greater than 600 pm.

[0050] Figure 13 A cassette holder 106 for supporting semiconductor components (e.g., EUV pellicle 200) according to another embodiment of the present disclosure is shown. Figure 14 A cross-sectional view of the cassette holder 106 cut along line B-B’ in Figure 13 Compared to the previous embodiments of the cassette holder 106, the sloped surfaces (e.g., various sloped and vertical surfaces) of the cassette holder 106 are omitted here, but the through-holes 405 are retained. For example, the cassette holder 106 has a cylindrical shape that does not distinguish between a contact portion or a non-contact portion, and the cassette holder 106 has through-holes 405 that penetrate the cylindrical cassette holder 106. In this embodiment, the EUV pellicle 200 can be disposed directly over the through-holes 405, and on the top surface of the cassette holder 106 that falls on both sides of the through-holes 405. As with the previous embodiments, Figure 14 The cassette holder 106 of

[0051] Figures 15A-15D Various configurations of the through-holes 405 in the cassette holder 106 according to various embodiments of the present disclosure are shown. As shown, there can be one or more through-holes 405 or continuous through-holes 405 in the cassette holder 106 depending on the number of EUV pellicles 200 placed for the wet bench process. In one embodiment (see Figures 15A-15C ), there is a corresponding through-hole 405 for each EUV pellicle 200; and the corresponding EUV pellicle 200 is placed over each corresponding through-hole 405. In another embodiment (see Figure 15D ), there can be one or more continuous through-holes 405 in which more than one EUV pellicle 200 can be placed over the continuous through-holes 405.

[0052] Figures 16A-16B Various dimensions of the sloped ramp (e.g., sloped top surface 402b) of the cassette holder 106 according to various embodiments of the present disclosure are shown. Referring to Figure 16A , the entire non-contact portion 106b has the previously described sloped top surface 402b. In other words, the sloped top surface 402b spans the entire area of the non-contact portion 106b (excluding the portion of the through-hole 405). Referring to Figure 16B , the sloped top surface 402b can span only the area 106c of the non-contact portion 106b adjacent to the through-hole 405. In other words, the sloped top surface 402b spans less than the entire area of the non-contact portion 106b. For example, since the critical part where turbulence can occur is the area around the through-hole 405 (as this is where the EUV pellicle 200 is placed), only this area needs a sloped top surface for facilitating smooth liquid flow.

[0053] While not limited, the present disclosure provides advantages for a pod holder that supports a semiconductor assembly (e.g., an EUV pellicle) in a wet bench process. One example advantage is that the pod holder includes various sloped surfaces to facilitate more streamlined fluid flow, significantly reducing or eliminating turbulent flow. Another example advantage is that the pod holder includes rounded end portions to minimize the contact area between the holder and the semiconductor assembly, thereby minimizing the interface and potential turbulent flow area. Another example advantage is having through-holes in the pod holder to allow fluid to pass through, effectively preventing or minimizing the formation of dead zones and allowing fluid to pass through to reduce turbulent flow areas. Another example advantage is that the shape of the pod holder can provide better structural integrity and pod holder strength when being processed in a wet bench.

[0054] One aspect of the present disclosure pertains to a pod carrier. The pod carrier includes a frame defining an interior space having a top opening and a bottom opening, the frame having a first sidewall, a second sidewall, a first connecting wall, and a second connecting wall, wherein the first connecting wall and the second connecting wall extend between the first sidewall and the second sidewall. The pod carrier includes a holder disposed across the bottom opening and laterally between the first sidewall and the second sidewall, wherein through-holes are formed in the holder, and an axis passing through the through-holes passes through the top opening and the bottom opening.

[0055] In an embodiment, the holder has a vertical side surface. In an embodiment, the holder has one or more sloped top surfaces.

[0056] In an embodiment, the holder has a contact portion and a non-contact portion, and the non-contact portion has a sloped top surface that slopes upwardly to meet the contact portion, wherein the contact portion is configured to directly contact the semiconductor assembly. In a further embodiment, the through-holes penetrate portions of the contact portion and portions of the non-contact portion. In a further embodiment, the contact portion further includes a protruding portion and a non-protruding portion, the protruding portion having a vertical side surface, wherein the non-protruding portion has a sloped top surface that slopes upwardly to meet the vertical side surface of the protruding portion. In a further embodiment, the protruding portion has a rounded top surface that is configured to directly contact the semiconductor assembly.

[0057] In an embodiment, the pod carrier further includes a semiconductor assembly disposed on the holder and directly above the through-holes. In a further embodiment, the semiconductor assembly is an extreme ultraviolet (EUV) pellicle having a pellicle and a perimeter frame, and the perimeter frame rests on the holder. In another embodiment, the semiconductor assembly is a semiconductor wafer.

[0058] In embodiments, the support is a first support, and the cassette support further includes a second support adjacent to the first support, the second support also disposed across the bottom opening and laterally between the first sidewall and the second sidewall, wherein a second through-hole is formed in the second support, and a shaft passing through the second through-hole passes through the top opening and the bottom opening. In further embodiments, the cassette carrier further includes a semiconductor assembly disposed on the first support and the second support, and the semiconductor assembly is disposed directly over the first through-hole and the second through-hole.

[0059] Another aspect of the present disclosure pertains to a support for supporting a semiconductor assembly. The support includes: a contact portion extending longitudinally along a first direction, the contact portion having a protruding portion and a non-protruding portion, the protruding portion being adjacent to the non-protruding portion in a second direction perpendicular to the first direction, the protruding portion having a rounded top surface configured to physically support the semiconductor assembly, and the non-protruding portion having a sloped top surface sloping upward to meet a vertical side surface of the protruding portion; and a non-contact portion extending longitudinally along the first direction, the non-contact portion being adjacent to the contact portion along the second direction, the non-contact portion having a sloped top surface sloping upward to meet the contact portion.

[0060] In embodiments, the support further includes one or more through-holes penetrating the support perpendicularly, wherein portions of the contact portion are separated from portions of the non-contact portion by the through-holes.

[0061] In embodiments, each of the one or more through-holes spans a length greater than 600 pm along the first direction.

[0062] In embodiments, each of the one or more through-holes spans a width greater than 0.05 times a total width of the support but less than 0.95 times the total width of the support along the second direction.

[0063] In embodiments, the contact portion spans a width greater than 0.05 times a total width of the support but less than 0.95 times the total width of the support along the second direction.

[0064] Another aspect of the present disclosure pertains to a cassette carrier. The cassette carrier includes: a frame defining an interior space having a top opening and a bottom opening, the frame having a first sidewall, a second sidewall, a first connecting wall, and a second connecting wall, wherein the first connecting wall and the second connecting wall extend between the first sidewall and the second sidewall; and a pair of supports disposed across the bottom opening and laterally between the first sidewall and the second sidewall. Each support of the pair of supports includes a contact portion and a non-contact portion, and the non-contact portion has a sloped top surface sloping upward to meet the contact portion, wherein the contact portion is configured to directly contact a semiconductor assembly, wherein one or more through-holes are formed through each support of the pair of supports.

[0065] In an embodiment, the sloped top surface spans the entire area of the non-contact portion. In an embodiment, the sloped top surface spans an area that is less than the entire area of the non-contact portion.

[0066] The details of the disclosure are described in the accompanying drawings. The features of several embodiments are summarized above in order to provide a better understanding of aspects of the present disclosure. Those skilled in the art will readily understand that they can readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and / or achieving the same advantages as the embodiments introduced herein. Those skilled in the art will also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and alterations thereto without departing from the spirit and scope of the present disclosure.

Claims

1. A box-type vehicle, comprising: A frame defining an interior space having a top opening and a bottom opening, the frame having a first sidewall, a second sidewall, a first connecting wall, and a second connecting wall, wherein the first connecting wall and the second connecting wall extend between the first sidewall and the second sidewall; and A bracket is provided across the bottom opening and laterally located between the first sidewall and the second sidewall, wherein a through hole is formed in the bracket, and an axis passing through the through hole passes through the top opening and the bottom opening.

2. The box-type carrier according to claim 1, wherein, The bracket has a vertical side surface.

3. The box-type carrier according to claim 1, wherein, The support has one or more inclined top surfaces.

4. The box-type carrier according to claim 1, wherein, The support has a contact portion and a non-contact portion, and the non-contact portion has an upwardly inclined top surface that intersects with the contact portion, wherein the contact portion is configured to directly contact the semiconductor assembly.

5. The box-type carrier according to claim 4, wherein, The contact portion further includes a protruding portion and a non-protruding portion, the protruding portion having a vertical side surface, wherein the non-protruding portion has an upwardly inclined top surface that intersects with the vertical side surface of the protruding portion.

6. The box-type carrier according to claim 5, wherein, The protruding portion has a circular top surface configured to directly contact the semiconductor component.

7. The box-type carrier according to claim 4, wherein, The through hole penetrates both the contact portion and the non-contact portion.

8. The box-type carrier of claim 1 further includes a semiconductor component placed on the support and directly disposed above the through hole.

9. A support for supporting a semiconductor assembly, the support comprising: The contact portion extends longitudinally along a first direction, the contact portion having a protruding portion and a non-protruding portion, the protruding portion being adjacent to the non-protruding portion in a second direction perpendicular to the first direction, the protruding portion having a circular top surface configured to physically support the semiconductor assembly, and the non-protruding portion having an upwardly inclined top surface intersecting with the vertical side surface of the protruding portion; as well as The non-contact portion extends longitudinally along the first direction and is adjacent to the contact portion along the second direction. The non-contact portion has an upwardly inclined top surface that intersects with the contact portion.

10. A box-type vehicle, comprising: A frame defining an interior space having a top opening and a bottom opening, the frame having a first sidewall, a second sidewall, a first connecting wall, and a second connecting wall, wherein the first connecting wall and the second connecting wall extend between the first sidewall and the second sidewall; and A pair of brackets are arranged across the bottom opening and laterally between the first sidewall and the second sidewall. Each of the pair of supports includes a contact portion and a non-contact portion, and the non-contact portion has an upwardly inclined top surface that intersects with the contact portion, wherein the contact portion is configured to directly contact the semiconductor assembly. One or more through holes are formed to pass through each of the pair of supports.

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