Semiconductor thermoelectric module production device

Abstract

The invention relates to the technical field of semiconductor thermoelectric modules, and particularly provides a semiconductor thermoelectric module production device which comprises a supporting piece and a pressing mechanism. The supporting piece is used for supporting the semiconductor thermoelectric module; the pressing mechanism comprises a driving piece and an abutting assembly, the abutting assembly is provided with an abutting face, and the driving piece can drive the abutting assembly to be close to the supporting piece so that the abutting face can abut against the first surface of the semiconductor thermoelectric module; the abutting face can deflect relative to the horizontal plane. In the application, when the driving piece drives the abutting assembly to abut against the semiconductor thermoelectric module, if the first surface is uneven, the abutting surface of the abutting assembly deflects under the action of the driving force provided by the driving piece and the supporting force provided by the semiconductor thermoelectric module, so that the abutting surface is automatically adjusted to be parallel to the first surface; the best fitting degree is guaranteed, it is ensured that the abutting force provided for the semiconductor thermoelectric module is always positive pressure, and it is avoided that radial shearing force is applied to the thermoelectric chip, and a core material of the thermoelectric chip cracks.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor thermoelectric modules, and specifically proposes a semiconductor thermoelectric module manufacturing apparatus. Background Technology

[0002] A semiconductor thermoelectric module is a system that operates based on the thermoelectric effect. It mainly consists of a thermoelectric chip, a cold-end heat exchanger, a hot-end heat exchanger, and connecting components. This system can achieve thermoelectric conversion, meaning it can directly convert electrical energy into a temperature difference for cooling or heating, or conversely, convert the temperature difference into electrical energy for power generation.

[0003] In actual production, the integration of semiconductor thermoelectric modules generally involves mechanically pressing the two sides of the thermoelectric chip together with the cold-end heat exchanger and the hot-end heat exchanger to form a highly efficient energy conversion system.

[0004] However, the core materials in thermoelectric chips (such as bismuth telluride) are sensitive to mechanical stress. Specifically, they have strong compressive strength in the axial direction but poor shear strength in the radial direction. When the applied pressure is deflected relative to the thermoelectric chip, the core material is prone to cracking. This not only increases thermal resistance and reduces cooling performance, but may also affect the operational stability and lifespan of the thermoelectric chip. Summary of the Invention

[0005] The purpose of this application is to solve at least some of the technical problems mentioned above, and this purpose is achieved through the following technical solutions:

[0006] This application discloses a semiconductor thermoelectric module manufacturing apparatus, including a support member and a pressing mechanism; the support member is used to support the semiconductor thermoelectric module; the pressing mechanism includes a driving member and a pressing component, the pressing component has a pressing surface, the driving member can drive the pressing component to approach the support member so that the pressing surface presses against the first surface of the semiconductor thermoelectric module; the pressing surface can be deflected relative to the horizontal plane so that the pressing surface fits against the first surface.

[0007] In some embodiments, the pressing assembly includes a connector and a pressing structure; the connector is connected to the power output portion of the drive member; the pressing structure has a pressing surface and is rotatably disposed on the connector relative to the connector.

[0008] In some embodiments, the pressing assembly further includes a shaft disposed between the connector and the pressing structure, the pressing structure being deflectable about the shaft relative to the connector.

[0009] In some embodiments, the pressing structure includes a pressing head seat and a pressing head member, the pressing head seat being rotatably connected to the connector; the pressing head member having a pressing surface and being flexibly connected to the pressing head seat.

[0010] In some embodiments, the pressing structure further comprises a buffer connected to the pressing head base and the pressing head.

[0011] In some embodiments, the pressing head comprises a cover plate connected to the pressing head base and a pressing plate provided with a pressing surface and connected to the cover plate and deflectable relative to the cover plate.

[0012] In some embodiments, the pressing head further comprises a ball provided between the cover plate and the pressing plate, and the pressing plate is deflectable relative to the cover plate about the ball.

[0013] In some embodiments, the pressing head base is connected to a plurality of pressing heads to simultaneously press a plurality of semiconductor thermoelectric modules.

[0014] In some embodiments, the support is provided with a positioning portion for positioning the semiconductor thermoelectric module.

[0015] In some embodiments, the semiconductor thermoelectric module production device further comprises a rack, and the support and the pressing mechanism are arranged in the rack.

[0016] The technical scheme provided in the present application has at least the following technical effects:

[0017] In the present application, the pressing assembly has a pressing surface, and the driving member can drive the pressing assembly to approach the support so that the pressing surface presses the first surface of the semiconductor thermoelectric module; the pressing surface is deflectably arranged relative to the horizontal plane so that the pressing surface is in contact with the first surface. That is, when the driving member drives the pressing assembly to press the semiconductor thermoelectric module, if the first surface of the semiconductor thermoelectric module is not flat, the pressing surface of the pressing assembly will deflect under the action of the driving force provided by the driving member and the support force provided by the semiconductor thermoelectric module, so as to automatically adjust the pressing surface to be parallel to the first surface, ensure the best contact degree, and ensure that the pressing force provided to the semiconductor thermoelectric module is always a positive pressure, i.e., an axial pressure, avoiding the application of a radial shear force to the thermoelectric chip, which may cause cracks in the core material; the present application has a reasonable design, can effectively improve the yield and consistency of the product, and thus the produced semiconductor thermoelectric module has good refrigeration performance, stable operation, and a long service life. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to better combine the content shown in the drawings with the content described in the specific embodiments, the drawings are briefly introduced as follows. It can be understood that the drawings mentioned below only schematically show the related technical schemes and some embodiments of the technical schemes of the present application, and under the premise of not paying creative labor, a person skilled in the art can also make drawings showing other embodiments.

[0019] Specifically, the annotations of the drawings are as follows:

[0020] Figure 1 Fig. 1 is a schematic diagram of an overall structure of a semiconductor thermoelectric module production device according to some embodiments described in the present application;

[0021] Figure 2 Fig. 2 is a schematic diagram of a partial structure of a semiconductor thermoelectric module production device according to some embodiments described in the present application;

[0022] Figure 3 Fig. 3 is a schematic diagram of an overall structure of a pressing structure according to some embodiments described in the present application;

[0023] Figure 4 Fig. 4 is a schematic diagram of a partial structure of a pressing structure according to some embodiments described in the present application.

[0024] Specifically, the annotations of the description reference signs are as follows:

[0025] 10, support; 101, positioning portion; 20, pressing mechanism; 210, driving member; 211, power output portion; 220, pressing assembly; 221, connecting member; 222, pressing structure; 223, shaft body; 201, pressing head seat; 202, pressing head member; 203, buffer member; 2021, cover plate; 2022, pressing plate; 2023, ball; 2024, pressing surface; 30, rack. DETAILED DESCRIPTION

[0026] To make the content of the embodiments of the present application more clear, the following will be described in conjunction with the drawings of the description. It can be understood that the following mentioned content is only some embodiments of the present application, and all the embodiments are enumerated in detail. Therefore, other embodiments obtained based on the following embodiments are also within the protection scope of the present application without creative labor.

[0027] It should be understood that the terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the technical solutions. For example, the terms "one", "a", and "said" used herein are not intended to exclude the possibility that a feature can be provided as a plurality in some embodiments.

[0028] It should be understood that the terms "comprise", "include" and "have" are open terms, which indicate the presence of the stated features but do not exclude the possibility that other features are also present. Similarly, the terms "first", "second", and the like used herein merely indicate the different characteristics of the features, and do not imply order or sequence unless the context clearly indicates otherwise.

[0029] It should be understood that the terms "set", "connected", "mounted" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be directly connected, or indirectly connected through a medium. For those skilled in the art, the specific meaning of the above terms in the text can be understood according to the specific circumstances.

[0030] In addition, in order to facilitate the description, the spatial relative terms will be used to explain the position of one feature relative to another feature, for example, "inner", "outer", "end", "side", "upper", "middle", "lower", "high", "low", "axial", "circumferential", "radial", "horizontal", "vertical", "first direction", "second direction", etc. It can be understood that the spatial relative relationship between two features should include other specific circumstances other than those shown in the drawings.

[0031] The embodiments of the present application will be described below in conjunction with the drawings.

[0032] Referring to Figure 1 and Figure 2 , the embodiments of the present application propose a semiconductor thermoelectric module production device, comprising a support 10 and a pressing mechanism 20; the support 10 is used to support the semiconductor thermoelectric module; the pressing mechanism 20 comprises a driving member 210 and a pressing assembly 220, the pressing assembly 220 has a pressing surface 2024, the driving member 210 can drive the pressing assembly 220 to approach the support 10, so that the pressing surface 2024 presses the first surface of the semiconductor thermoelectric module; the pressing surface 2024 is deflectably arranged relative to the horizontal plane, so that the pressing surface 2024 is in close contact with the first surface.

[0033] In the present embodiment, the pressing assembly 220 has a pressing surface 2024, the driving member 210 can drive the pressing assembly 220 to approach the support 10, so that the pressing surface 2024 presses the first surface of the semiconductor thermoelectric module; the pressing surface 2024 is deflectably arranged relative to the horizontal plane, so that the pressing surface 2024 is in close contact with the first surface. That is, when the driving member 210 drives the pressing assembly 220 to press the semiconductor thermoelectric module, if the first surface of the semiconductor thermoelectric module is not flat, the pressing surface 2024 of the pressing assembly 220 will deflect under the action of the driving force provided by the driving member 210 and the support force provided by the semiconductor thermoelectric module, so as to automatically adjust the pressing surface 2024 to be parallel to the first surface, ensure the best close contact degree, and ensure that the pressing force provided by the semiconductor thermoelectric module is always a positive pressure, i.e. axial pressure, to avoid applying radial shear force to the thermoelectric chip, which may cause cracks in the core material; the design of the present application is reasonable, which can effectively improve the yield and consistency of the product, so that the produced semiconductor thermoelectric module has good refrigeration performance, stable working stability and long service life.

[0034] Optionally, the drive component 210 may be a pneumatic cylinder, a hydraulic cylinder, or the like.

[0035] In some embodiments, refer to Figure 2 and Figure 3 The pressing component 220 includes a connector 221 and a pressing structure 222; the connector 221 is connected to the power output part 211 of the drive member 210; the pressing structure 222 is provided with a pressing surface 2024 and is rotatably disposed on the connector 221 relative to the connector 221.

[0036] In this embodiment, one implementation of the pressing component 220 is proposed. Specifically, the pressing component 220 includes a connector 221 and a pressing structure 222. The connector 221 is connected to the power output part 211 of the drive member 210. The pressing structure 222 is rotatably disposed on the connector 221 relative to the connector 221, thereby realizing the deflection adjustment of the pressing surface 2024. It can be regarded as a coarse adjustment of the deflection angle, thereby controlling the angular distribution of the pressing force.

[0037] In some embodiments, refer to Figure 2 and Figure 3 The pressing component 220 also includes a shaft 223, which is located between the connector 221 and the pressing structure 222. The pressing structure 222 can deflect relative to the connector 221 around the shaft 223.

[0038] In this embodiment, the shaft 223 is disposed between the connector 221 and the pressing structure 222. The pressing structure 222 can deflect relative to the connector 221 around the shaft 223, thereby realizing the deflection guidance of the pressing structure 222. The structure design is reasonable.

[0039] In some embodiments, refer to Figure 3 The pressure structure 222 includes a pressure head seat 201 and a pressure head member 202. The pressure head seat 201 is rotatably connected to the connector 221. The pressure head member 202 is provided with a pressure surface 2024 and is flexibly connected to the pressure head seat 201.

[0040] In this embodiment, one implementation of the pressure-reducing structure 222 is proposed. Specifically, the pressure-reducing structure 222 includes a pressure head seat 201 and a pressure head component 202. The pressure head component 202 is flexibly connected to the pressure head seat 201, thereby realizing the control of the pressure-reducing force and avoiding excessive pressure that could cause cracks in the thermoelectric chip.

[0041] In some embodiments, refer to Figure 3 The pressure structure 222 also includes a buffer 203, which is connected to the pressure head seat 201 and the pressure head 202.

[0042] In this embodiment, the buffer 203 is connected to the pressure head seat 201 and the pressure head 202, thereby enabling the pressure head 202 to be flexibly connected to the pressure head seat 201, that is, the pressure head 202 can flexibly press against the semiconductor thermoelectric module. Specifically, the buffer 203 can be a pneumatic or hydraulic buffer, or it can be formed by an elastic structure, all of which are preferred implementation methods.

[0043] In some embodiments, refer to Figure 3 and Figure 4 The pressure head component 202 includes a cover plate 2021 and a pressure plate 2022. The cover plate 2021 is connected to the pressure head seat 201. The pressure plate 2022 is provided with a pressing surface 2024 and is connected to the cover plate 2021 and can be deflected relative to the cover plate 2021.

[0044] In this embodiment, one implementation of the pressure head 202 is proposed. Specifically, the pressure head 202 includes a cover plate 2021 and a pressure plate 2022. The pressure plate 2022 is connected to the cover plate 2021 and can be deflected relative to the cover plate 2021, thereby realizing fine adjustment of the deflection of the pressure surface 2024. It works in conjunction with the coarse adjustment mentioned above to ensure better adhesion between the pressure surface 2024 and the first surface of the semiconductor thermoelectric module, and to ensure that the pressure applied to the semiconductor thermoelectric module is always positive pressure, that is, axial pressure, so as to avoid applying radial shear force to the thermoelectric chip and causing cracks in its core material.

[0045] In some embodiments, refer to Figure 4 The pressure head component 202 also includes a ball 2023, which is located between the cover plate 2021 and the pressure plate 2022. The pressure plate 2022 can deflect relative to the cover plate 2021 around the ball 2023.

[0046] In this embodiment, the pressure plate 2022 can deflect relative to the cover plate 2021 around the sphere 2023, thereby achieving fine adjustment of the deflection. Moreover, the deflection range of the sphere 2023 is relatively large, which is a reasonable design.

[0047] In some embodiments, refer to Figure 3 The pressure head base 201 is connected to multiple pressure head components 202 to simultaneously press multiple semiconductor thermoelectric modules.

[0048] In this embodiment, the pressure head base 201 is connected to multiple pressure head components 202 to simultaneously press multiple semiconductor thermoelectric modules, thereby improving production efficiency.

[0049] In some embodiments, refer to Figure 1 The support member 10 is provided with a positioning part 101, which is used to position the semiconductor thermoelectric module.

[0050] In this embodiment, the support member 10 is provided with a positioning part 101, which is used to position the semiconductor thermoelectric module, so that the semiconductor thermoelectric module is placed in an accurate position, and the semiconductor thermoelectric module will not shift during the pressing process, thus ensuring the product's qualification and consistency.

[0051] Specifically, the positioning part 101 can be formed by an adjustable lateral positioning member and a longitudinal positioning member. The lateral positioning member and the longitudinal positioning member are arranged at an angle on the support member 10 and can limit part of the edge of the semiconductor thermoelectric module.

[0052] In some embodiments, refer to Figure 1 The semiconductor thermoelectric module production apparatus also includes a frame 30, a support member 10 and a pressing mechanism 20 disposed on the frame 30.

[0053] In this embodiment, the support member 10 is adjustablely mounted on the frame 30. In addition, the frame 30 may be provided with a first space, in which the drive member 210 is housed, thereby increasing the space utilization rate and protecting the drive process of the drive member 210.

[0054] It should be noted that the semiconductor thermoelectric module production apparatus may also include other structures, such as a mechanism for leveling the support 10, a device for detecting whether the thermoelectric chip has cracks, etc. Other structures will not be described in detail here.

[0055] In particular, the term "and / or" in this application should be understood as follows:

[0056] In the first case, the term “and / or” between the first subject and the second subject includes any of the following meanings: (1) only the first subject; (2) only the second subject; and (3) both the first subject and the second subject.

[0057] In the second case, the term "and / or" between the last two of three or more subjects means including at least any one of the subjects. For example, "first subject, second subject and / or third subject" has the same meaning as "first subject and / or second subject and / or third subject", specifically including the following combinations: (1) only the first subject; (2) only the second subject; (3) only the third subject; (4) first subject and second subject and no third subject; (5) first subject and third subject and no second subject; (6) second subject and third subject and no first subject; and (7) first subject, second subject and third subject;

[0058] Furthermore, the character " / " in this application indicates that the objects before and after it are in an "or" relationship.

[0059] Furthermore, although the embodiments of this application have been described above in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the concept of this application, and such modifications and variations all fall within the scope of protection of this application.

Claims

1. A semiconductor thermoelectric module manufacturing apparatus, characterized in that, include: Support member (10) for supporting semiconductor thermoelectric module; The pressing mechanism (20) includes a driving member (210) and a pressing component (220), the pressing component (220) having a pressing surface (2024), the driving member (210) being able to drive the pressing component (220) close to the support member (10) so that the pressing surface (2024) presses against the first surface of the semiconductor thermoelectric module; The pressure surface (2024) is deflected relative to the horizontal plane so that the pressure surface (2024) fits against the first surface.

2. The semiconductor thermoelectric module production apparatus according to claim 1, characterized in that, The pressure-absorbing component (220) includes: A connector (221) is connected to the power output section (211) of the drive unit (210); The pressure-blocking structure (222) is provided with the pressure-blocking surface (2024) and is disposed on the connector (221) in a way that can be deflected relative to the connector (221).

3. The semiconductor thermoelectric module production apparatus according to claim 2, characterized in that, The pressing assembly (220) further includes a shaft (223) disposed between the connector (221) and the pressing structure (222), and the pressing structure (222) is deflectable relative to the connector (221) about the shaft (223).

4. The semiconductor thermoelectric module production apparatus according to claim 2, characterized in that, The pressure-absorbing structure (222) includes: The pressure head seat (201) is rotatably connected to the connector (221); The pressure head (202) is provided with the pressure surface (2024) and is flexibly connected to the pressure head seat (201).

5. The semiconductor thermoelectric module production apparatus according to claim 4, characterized in that, The pressure-relief structure (222) further includes a buffer (203), which is connected to the pressure head seat (201) and the pressure head (202).

6. The semiconductor thermoelectric module production apparatus according to claim 4, characterized in that, The pressure head (202) includes: The cover plate (2021) is connected to the pressure head seat (201); The pressure plate (2022) is provided with the pressure surface (2024) and is connected to the cover plate (2021), and is rotatably disposed relative to the cover plate (2021).

7. The semiconductor thermoelectric module production apparatus according to claim 6, characterized in that, The pressure head (202) also includes a ball (2023), which is disposed between the cover plate (2021) and the pressure plate (2022). The pressure plate (2022) can deflect relative to the cover plate (2021) around the ball (2023).

8. The semiconductor thermoelectric module production apparatus according to claim 4, characterized in that, The pressure head base (201) is connected to a plurality of pressure head components (202) to simultaneously press together a plurality of semiconductor thermoelectric modules.

9. The semiconductor thermoelectric module manufacturing apparatus according to any one of claims 1 to 8, characterized in that, The support member (10) is provided with a positioning part (101), which is used to position the semiconductor thermoelectric module.

10. The semiconductor thermoelectric module manufacturing apparatus according to any one of claims 1 to 8, characterized in that, The semiconductor thermoelectric module production apparatus further includes a frame (30), on which the support member (10) and the pressing mechanism (20) are disposed.

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