A spray device

Abstract

The present application relates to the technical field of spraying, in particular to a spraying device. The device comprises a spraying mechanism; the spraying mechanism comprises a heating spray pipe and a coating spray pipe. The spraying device provided by the present application sprays a preheating airflow to the paint-repairing area of the substrate by the heating spray pipe when in use, so as to raise the paint-repairing area of the substrate to a preset substrate temperature, and then sprays liquid coating adjusted to a preset coating temperature to the paint-repairing area of the substrate reaching the preset substrate temperature by the coating spray pipe. When the working environment is higher than the upper threshold value, the preset coating temperature is configured to be lower than the ambient temperature, so as to slow down the initial evaporation rate of the solvent in the coating, thereby prolonging the leveling time of the coating on the surface of the substrate. When the working environment is lower than the lower threshold value, the preset substrate temperature is configured to be higher than the preset coating temperature, so as to form a heat transfer gradient from the substrate to the coating, thereby maintaining the flowability of the coating on the surface of the substrate in the initial stage of the paint film formation.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of spraying technology, in particular to a spraying device. BACKGROUND

[0002] Touch-up painting refers to a process of cleaning, surface treatment and selective recoating of the defect area and its periphery to restore the integrity of the coating, protective function and appearance quality after local defects such as scratches, bumps, peeling and rusting occur on the surface coating of the base material. It is a key link in the full life cycle maintenance of equipment.

[0003] Compared with the original coating completed in a controlled environment, the touch-up painting scene is more diverse and uncertain. The construction environment is difficult to meet the control requirements of the factory standardized painting workshop on key process parameters such as temperature, humidity and cleanliness, so that the adhesion, weather resistance and stability of the touch-up layer are difficult to reach the level of the original coating. The performance matching between the touch-up layer and the original coating is insufficient, which easily causes delamination, blistering and accelerated aging, etc.

[0004] In practical applications, it is found that due to the low temperature environment, the viscosity of the paint is increased, which reduces the ability of the paint film to wet the substrate, and further affects the adhesion strength and durability of the touch-up layer; while the high temperature environment accelerates the evaporation of the solvent in the paint, causing the leveling time of the paint to be insufficient, resulting in the touch-up layer being prone to form orange peel or pinhole defects, thereby affecting the protection and weather resistance of the touch-up layer. SUMMARY

[0005] The present application provides a spraying device to solve the problem that due to the low temperature environment, the viscosity of the paint is increased, which reduces the ability of the paint film to wet the substrate, and further affects the adhesion strength and durability of the touch-up layer; while the high temperature environment accelerates the evaporation of the solvent in the paint, causing the leveling time of the paint to be insufficient, resulting in the touch-up layer being prone to form orange peel or pinhole defects.

[0006] To solve the above technical problems, the technical scheme provided by the present application is as follows:

[0007] A spraying device comprises:

[0008] The spraying mechanism comprises a heating nozzle and a paint nozzle; the heating nozzle has a preheating mode; in the preheating mode, the heating nozzle is configured to spray a preheating gas flow to a paint repair area on the substrate to heat the surface temperature of the paint repair area to a preset substrate temperature; the paint nozzle is configured to spray liquid paint adjusted to a preset paint temperature to the paint repair area reaching the preset substrate temperature; when the working environment is higher than the upper threshold, the preset paint temperature is configured to be lower than the ambient temperature, which is used to slow down the initial evaporation rate of the solvent in the paint to prolong the leveling time of the paint on the substrate surface; when the working environment is lower than the lower threshold, the preset substrate temperature is configured to be higher than the preset paint temperature, which is used to form a heat transfer gradient from the substrate to the paint to maintain the fluidity of the paint on the substrate surface at the initial stage of the paint film formation.

[0009] Further, the heating nozzle also has a buffer mode; in the buffer mode, the heating nozzle is configured to spray a buffer gas flow to the paint repair area of the substrate synchronously with the liquid paint to form a gaseous buffer layer between the substrate and the paint; the temperature of the gaseous buffer layer is configured to be greater than the preset paint temperature while being less than the preset substrate temperature to form a progressive heat transfer gradient from the substrate to the gaseous buffer layer and then to the paint, thereby reducing the thermal shock received by the paint when it contacts the substrate.

[0010] Further, the gas supply mechanism is also provided; the inlet of the gas supply mechanism is in communication with a compressed gas source, and the outlet is in communication with the heating nozzle for heating the flowing gas; the compressed gas source is used to output a protective gas to form a stable and dense gas film on the surface of the substrate to inhibit the disordered evaporation of the solvent in the paint and isolate oxygen.

[0011] Further, the gas supply mechanism comprises a heating structure; the heating structure comprises a heating tank, a heating pipe and a plurality of baffles; the heating pipe is arranged in the heating tank and inserted into the baffles for heating the temperature of the flowing gas; a plurality of baffles are arranged in the heating tank and arrayed along the length direction of the heating tank to form a baffling channel in the heating tank, thereby prolonging the contact time of the gas with the heating pipe.

[0012] Further, the gas supply mechanism further comprises a flow regulating structure and a gas temperature sensor; the flow regulating structure comprises a first flow regulating valve, a second flow regulating valve and a three-way exhaust; the inlet of the heating nozzle is communicated with the three-way exhaust; the gas temperature sensor is arranged between the three-way exhaust and the passageway of the heating nozzle, and is used for detecting the temperature of the gas input into the heating nozzle; one end of the first flow regulating valve is communicated with the compressed gas source, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the compressed gas source into the three-way exhaust; one end of the second flow regulating valve is communicated with the outlet of the heating structure, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the heating structure into the three-way exhaust.

[0013] Further, the gas supply mechanism further comprises a flow regulating structure and a gas temperature sensor; the flow regulating structure comprises a first flow regulating valve, a second flow regulating valve and a three-way exhaust; the inlet of the heating nozzle is communicated with the three-way exhaust; the gas temperature sensor is arranged between the three-way exhaust and the passageway of the heating nozzle, and is used for detecting the temperature of the gas input into the heating nozzle; one end of the first flow regulating valve is communicated with the compressed gas source, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the compressed gas source into the three-way exhaust; one end of the second flow regulating valve is communicated with the outlet of the heating structure, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the heating structure into the three-way exhaust.

[0014] Further, the gas supply mechanism further comprises a flow regulating structure and a gas temperature sensor; the flow regulating structure comprises a first flow regulating valve, a second flow regulating valve and a three-way exhaust; the inlet of the heating nozzle is communicated with the three-way exhaust; the gas temperature sensor is arranged between the three-way exhaust and the passageway of the heating nozzle, and is used for detecting the temperature of the gas input into the heating nozzle; one end of the first flow regulating valve is communicated with the compressed gas source, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the compressed gas source into the three-way exhaust; one end of the second flow regulating valve is communicated with the outlet of the heating structure, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the heating structure into the three-way exhaust.

[0015] Further, the gas supply mechanism further comprises a flow regulating structure and a gas temperature sensor; the flow regulating structure comprises a first flow regulating valve, a second flow regulating valve and a three-way exhaust; the inlet of the heating nozzle is communicated with the three-way exhaust; the gas temperature sensor is arranged between the three-way exhaust and the passageway of the heating nozzle, and is used for detecting the temperature of the gas input into the heating nozzle; one end of the first flow regulating valve is communicated with the compressed gas source, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the compressed gas source into the three-way exhaust; one end of the second flow regulating valve is communicated with the outlet of the heating structure, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the heating structure into the three-way exhaust.

[0016] Further, the gas supply mechanism further comprises a flow regulating structure and a gas temperature sensor; the flow regulating structure comprises a first flow regulating valve, a second flow regulating valve and a three-way exhaust; the inlet of the heating nozzle is communicated with the three-way exhaust; the gas temperature sensor is arranged between the three-way exhaust and the passageway of the heating nozzle, and is used for detecting the temperature of the gas input into the heating nozzle; one end of the first flow regulating valve is communicated with the compressed gas source, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the compressed gas source into the three-way exhaust; one end of the second flow regulating valve is communicated with the outlet of the heating structure, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the heating structure into the three-way exhaust.

[0017] Further, the gas supply mechanism further comprises a flow regulating structure and a gas temperature sensor; the flow regulating structure comprises a first flow regulating valve, a second flow regulating valve and a three-way exhaust; the inlet of the heating nozzle is communicated with the three-way exhaust; the gas temperature sensor is arranged between the three-way exhaust and the passageway of the heating nozzle, and is used for detecting the temperature of the gas input into the heating nozzle; one end of the first flow regulating valve is communicated with the compressed gas source, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the compressed gas source into the three-way exhaust; one end of the second flow regulating valve is communicated with the outlet of the heating structure, and the other end is communicated with the three-way exhaust, and is used for regulating the flow of the gas from the heating structure into the three-way exhaust.

[0018] The beneficial effects of the spraying device in the present application are analyzed as follows:

[0019] The device comprises a spraying mechanism; the spraying mechanism comprises a heating spray pipe and a coating spray pipe; the heating spray pipe has a preheating mode; in the preheating mode, the heating spray pipe is configured to spray a preheating gas flow to a to-be-repaired area on the substrate, so as to heat the surface temperature of the to-be-repaired area to a preset substrate temperature; the coating spray pipe is configured to spray liquid coating adjusted to a preset coating temperature to the to-be-repaired area reaching the preset substrate temperature; when the working environment is higher than the upper threshold, the preset coating temperature is configured to be lower than the environmental temperature, so as to slow down the initial evaporation rate of the solvent in the coating, thereby prolonging the leveling time of the coating on the substrate surface; when the working environment is lower than the lower threshold, the preset substrate temperature is configured to be higher than the preset coating temperature, so as to form a heat transfer gradient from the substrate to the coating, thereby maintaining the fluidity of the coating on the substrate surface in the initial stage of the paint film formation.

[0020] The spraying device provided by the application sprays a preheating gas flow to the to-be-repaired area of the substrate by the heating spray pipe, so that the to-be-repaired area of the substrate is raised to a preset substrate temperature, and then the liquid coating adjusted to a preset coating temperature is sprayed to the to-be-repaired area of the substrate reaching the preset substrate temperature by the coating spray pipe.

[0021] When the working environment is higher than the upper threshold, the preset coating temperature is configured to be lower than the environmental temperature, so as to slow down the initial evaporation rate of the solvent in the coating, thereby prolonging the leveling time of the coating on the substrate surface, and avoiding the orange peel or pinhole defects caused by the instantaneous evaporation of the solvent on the surface of the coating.

[0022] When the working environment is lower than the lower threshold, the preset substrate temperature is configured to be higher than the preset coating temperature, so as to form a heat transfer gradient from the substrate to the coating, thereby maintaining the fluidity of the coating on the substrate surface in the initial stage of the paint film formation, and preventing the viscosity of the coating from being too high caused by low temperature, thereby ensuring the leveling property of the coating. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the specific embodiments or related art, the following will briefly introduce the drawings needed to be used in the specific embodiments or related art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0024] Figure 1 The structural schematic diagram of the spraying device provided by the embodiment of the application is shown in the figure;

[0025] Figure 2 The front view of the spraying device provided by the embodiment of the application is shown in the figure;

[0026] Figure 3 The structural schematic diagram of the spraying mechanism provided by the embodiment of the application is shown in the figure;

[0027] Figure 4 A perspective structure explosion schematic diagram of the temperature adjusting structure is provided in the embodiment of the present application.

[0028] Figure 5 A sectional view of the gas supply mechanism is provided in the embodiment of the present application.

[0029] Figure 6 A perspective structure explosion schematic diagram of the heating structure is provided in the embodiment of the present application.

[0030] Figure 7 A perspective structure explosion schematic diagram of the mixing flow structure is provided in the embodiment of the present application.

[0031] Icon:

[0032] 100 - spraying mechanism; 110 - heating spray pipe; 120 - paint spray pipe; 121 - pipe body; 122 - three-way valve; 123 - guide pipe; 130 - temperature adjusting structure; 131 - paint storage tank; 132 - semiconductor refrigeration sheet; 133 - driving motor; 134 - stirring paddle; 135 - energy storage cover; 140 - infrared gas supply temperature sensor; 200 - gas supply mechanism; 210 - heating structure; 211 - heating tank body; 212 - heating pipe; 213 - baffle; 220 - flow adjusting structure; 221 - first flow adjusting valve; 222 - second flow adjusting valve; 223 - exhaust three-way; 230 - mixing flow structure; 231 - gas supply temperature sensor; 232 - mixing flow tank body; 233 - mixing flow spiral. DETAILED DESCRIPTION

[0033] Since the low-temperature environment can increase the viscosity of the paint, the wetting ability of the paint film to the substrate is reduced, thereby affecting the adhesion strength and durability of the touch-up layer; and the high-temperature environment can accelerate the evaporation of the solvent in the paint, causing the paint to have insufficient leveling time, resulting in the touch-up layer being prone to form orange peel or pinhole defects, thereby affecting the protection and weather resistance of the touch-up layer.

[0034] Therefore, the present application provides a spraying device, which comprises a spraying mechanism 100.

[0035] The structure and shape of the spraying device are described in detail as follows: Figures 1-7 The structure and shape of the spraying device are described in detail as follows:

[0036] The spraying mechanism 100 comprises a heating spray pipe 110 and a coating spray pipe 120; the heating spray pipe 110 has a preheating mode; in the preheating mode, the heating spray pipe 110 is configured to spray a preheating gas flow to a to-be-repaired area on a substrate to heat the surface temperature of the to-be-repaired area to a preset substrate temperature; the coating spray pipe 120 is configured to spray liquid coating adjusted to a preset coating temperature to the to-be-repaired area reaching the preset substrate temperature; when the working environment is higher than the upper threshold, the preset coating temperature is configured to be lower than the ambient temperature, for slowing down the initial evaporation rate of the solvent in the coating to prolong the leveling time of the coating on the surface of the substrate; when the working environment is lower than the lower threshold, the preset substrate temperature is configured to be higher than the preset coating temperature, for forming a heat transfer gradient from the substrate to the coating to maintain the fluidity of the coating on the surface of the substrate at the initial stage of the paint film formation.

[0037] In the embodiment, the heating spray pipe 110 sprays a preheating gas flow to the to-be-repaired area of the substrate to raise the to-be-repaired area of the substrate to the preset substrate temperature, and then the coating spray pipe 120 sprays liquid coating adjusted to the preset coating temperature to the to-be-repaired area of the substrate reaching the preset substrate temperature.

[0038] When the working environment is higher than the upper threshold (for example, the ambient temperature > 25℃), the preset coating temperature is configured to be lower than the ambient temperature, for slowing down the initial evaporation rate of the solvent in the coating to prolong the leveling time of the coating on the surface of the substrate, thereby avoiding the orange peel or pinhole defects caused by the instantaneous evaporation of the solvent on the surface of the coating.

[0039] When the working environment is lower than the lower threshold (for example, the ambient temperature < 15℃), the preset substrate temperature is configured to be higher than the preset coating temperature, for forming a heat transfer gradient from the substrate to the coating to maintain the fluidity of the coating on the surface of the substrate at the initial stage of the paint film formation, thereby preventing the viscosity of the coating from being too high caused by low temperature, and thus ensuring the leveling property of the coating.

[0040] In addition, after the surface of the substrate is heated to the preset substrate temperature, the thermal motion of the surface molecules of the substrate is enhanced, so that the surface energy of the substrate is raised, thereby improving the wettability of the liquid coating on the to-be-repaired area; at the same time, the impact of the preheating gas flow removes the impurities on the surface of the substrate, so as to reduce the influence of the impurities on the surface energy and the physical isolation, and make the coating form a uniform and continuous film on the surface of the substrate.

[0041] In addition, as the temperature of the surface of the substrate increases, the small pores on the surface of the substrate are slightly expanded by heat, so that the liquid coating can penetrate into the pores; after the substrate cools down, the coating in the pores forms a mechanical anchoring structure, thereby improving the adhesion of the coating on the surface of the substrate.

[0042] When the liquid coating at the preset coating temperature is sprayed to the area to be refinished at the preset substrate temperature, the temperature gradient formed by the heat transfer from the substrate to the coating guides the solvent in the coating to gradually evaporate from the coating-substrate interface to the coating-air interface to avoid the internal defects of the coating caused by the too fast surface film formation; meanwhile, the wetting time of the coating and the substrate is prolonged, which helps the full formation of the chemical adsorption between the paint film and the substrate, such as the hydrogen bond or van der Waals force between the polar groups, and further improves the adhesion of the coating on the substrate surface.

[0043] In order to determine that the preheating gas flow output by the heating spray pipe 110 raises the substrate surface temperature to the preset substrate temperature:

[0044] As shown in Figure 3 The spraying mechanism 100 also includes an infrared gas supply temperature sensor 140; the infrared gas supply temperature sensor 140 is connected to the heating spray pipe 110, and the direction of its detection end is the same as that of the outlet of the heating spray pipe 110, so as to measure the temperature of the substrate surface without contacting the substrate surface.

[0045] In order to maintain the atomization of the coating while ensuring the surface energy of the substrate:

[0046] As shown in Figures 1-3 The heating spray pipe 110 also has a buffer mode; in the buffer mode, the heating spray pipe 110 is configured to spray a buffer gas flow to the area to be refinished of the substrate synchronously with the liquid coating, so as to form a gaseous buffer layer between the substrate and the coating; the temperature of the gaseous buffer layer is configured to be greater than the preset coating temperature and less than the preset substrate temperature, so as to form a progressive heat transfer gradient from the substrate to the gaseous buffer layer and then to the coating, so as to reduce the thermal shock received by the coating when it contacts the substrate.

[0047] In this embodiment, because the optimal temperature of the atomization of the coating and the optimal temperature of the surface energy of the substrate have a large difference, in the case of giving consideration to the atomization of the coating and the surface energy of the substrate, the low-boiling-point solvent in the coating is easy to expand rapidly and escape disorderly, and then forms bubbles in the paint film or pinholes on the surface.

[0048] In order to solve the above problems, the heating spray pipe 110 also has a buffer mode; in the buffer mode, the heating spray pipe 110 is configured to spray a buffer gas flow to the area to be refinished of the substrate synchronously with the liquid coating, so as to form a gaseous buffer layer between the substrate and the coating, and then form a progressive heat transfer gradient from the substrate to the gaseous buffer layer and then to the coating, so as to reduce the risk of solvent explosive boiling caused by too large instantaneous temperature difference when the coating contacts the substrate, thereby reducing the thermal shock received by the coating when it contacts the substrate.

[0049] In order to avoid the disorderly evaporation of the solvent while reducing the oxidation speed of the substrate and the coating:

[0050] As shown in Figures 1-2As shown, the device further comprises a gas supply mechanism 200; the inlet of the gas supply mechanism 200 is in communication with the compressed gas source, and the outlet is in communication with the heating nozzle 110 for heating the gas flowing therethrough; the compressed gas source is used to output protective gas to form a stable and dense gas film on the surface of the substrate to inhibit the disorderly evaporation of the solvent in the paint and isolate oxygen.

[0051] In this embodiment, the protective gas output by the compressed gas source enters the gas supply mechanism 200, and the gas supply mechanism 200 heats the protective gas inside. The heated protective gas is sprayed through the heating nozzle 110 to the substrate to be repainted synchronously with the liquid paint, and the protective gas forms a dense gas film on the surface of the paint by using its high-density characteristics to make the solvent in the paint slowly diffuse and evaporate along the thickness direction of the paint film; at the same time, the protective gas replaces the air in the substrate to be repainted to reduce the oxygen content in the substrate to be repainted, slow down the speed of oxidation and deterioration of the repainted coating, the original coating and the substrate, and the type of protective gas includes but is not limited to carbon dioxide.

[0052] In order to realize the temperature adjustment of the gas flowing through the gas supply mechanism 200:

[0053] As shown in Figures 5-6 , the gas supply mechanism 200 comprises a heating structure 210; the heating structure 210 comprises a heating tank body 211, a heating pipe 212 and a plurality of baffles 213; the heating pipe 212 is arranged in the heating tank body 211 and is inserted into the baffles 213 for heating the temperature of the gas flowing therethrough; the plurality of baffles 213 are arranged in the heating tank body 211 and are arrayed along the length direction of the heating tank body 211 to form a baffle passage in the heating tank body 211, thereby prolonging the contact time of the gas with the heating pipe 212.

[0054] In order to increase the temperature range of the gas output by the gas supply mechanism 200:

[0055] As shown in Figure 5 , the gas supply mechanism 200 further comprises a flow regulating structure 220 and a gas supply temperature sensor 231; the flow regulating structure 220 comprises a first flow regulating valve 221, a second flow regulating valve 222 and an exhaust tee 223; the inlet of the heating nozzle 110 is in communication with the exhaust tee 223; the gas supply temperature sensor 231 is arranged between the exhaust tee 223 and the passage of the heating nozzle 110 for detecting the temperature of the gas input into the heating nozzle 110; one end of the first flow regulating valve 221 is in communication with the compressed gas source, and the other end is in communication with the exhaust tee 223 for regulating the flow of the gas from the compressed gas source into the exhaust tee 223; one end of the second flow regulating valve 222 is in communication with the outlet of the heating structure 210, and the other end is in communication with the exhaust tee 223 for regulating the flow of the gas from the heating structure 210 into the exhaust tee 223.

[0056] In order to improve the stability of the temperature of the gas output by the gas supply mechanism 200:

[0057] As shown in Figure 5 and Figure 7 The gas supply mechanism 200 further comprises a mixing structure 230; the mixing structure 230 comprises a gas temperature sensor 231, a mixing tank 232 and a mixing spiral 233; the gas temperature sensor 231 is installed on the outlet side of the mixing tank 232 for detecting the temperature of the gas output by the mixing tank 232; the mixing tank 232 is connected in series between the exhaust tee 223 and the heating nozzle 110; the mixing spiral 233 is arranged in the mixing tank 232 to form a threaded channel in the mixing tank 232 for promoting gas mixing.

[0058] In order to control the opening degree of the first flow valve 221 and the second flow valve 222:

[0059] The spraying device further comprises a controller; the gas temperature sensor 231 is electrically connected to the controller for transmitting gas temperature data to the controller; the controller is electrically connected to the first flow valve 221 and the second flow valve 222 for controlling the opening degree of the first flow valve 221 and the second flow valve 222 according to the gas temperature data.

[0060] In this embodiment, the compressed gas source inputs the protective gas into the heating tank 211, and the protective gas in the heating tank 211 flows along the baffle channel formed by the plurality of baffles 213; in this process, the protective gas is heated by the heating pipe 212, thereby prolonging the heating time of the gas and effectively enhancing the heat exchange efficiency between the heating pipe 212 and the protective gas.

[0061] Then the heated protective gas in the heating structure 210 enters the mixing tank 232 through the second flow valve 222 and the exhaust tee 223, and the protective gas output by the compressed gas source enters the mixing tank 232 through the first flow valve 221 and the exhaust tee 223; the heated protective gas and the normal temperature protective gas in the mixing tank 232 are mixed by the mixing spiral 233 during the flow process; the gas temperature sensor 231 detects the temperature of the mixed gas flowing to the outlet end of the mixing tank 232; the opening degree of the second flow valve 222 and the first flow valve 221 is adjusted according to the detection temperature of the gas temperature sensor 231, so as to change the mixing amount of the heated protective gas and the normal temperature protective gas, thereby quickly adjusting the temperature of the gas output by the gas supply mechanism 200, and improving the stability of the gas temperature output by the gas supply mechanism 200.

[0062] In order to provide the paint nozzle 120 with liquid paint adjusted to a preset paint temperature:

[0063] As shown in Figures 3-4As shown, the spraying mechanism 100 also includes a temperature regulating structure 130; the temperature regulating structure 130 includes a paint storage tank 131 and a semiconductor cooling chip 132; the outlet of the paint storage tank 131 is connected to the paint inlet of the paint spray pipe 120 and is used to store liquid paint; the semiconductor cooling chip 132 is attached to the paint storage tank 131 and is used to regulate the temperature of the liquid paint in the paint storage tank 131 so that the liquid paint is stabilized at a preset paint temperature when sprayed.

[0064] To increase the temperature regulation efficiency of the semiconductor cooler 132:

[0065] like Figure 4 As shown, the paint spray pipe 120 includes a pipe body 121, a three-way valve 122, and a guide pipe 123; the three-way valve 122 is located in the middle of the pipe body 121 and between the paint inlet and the airflow inlet of the pipe body 121; the inlet of the guide pipe 123 is connected to the three-way valve 122, and the outlet faces the semiconductor cooling chip 132.

[0066] To ensure the uniformity of the temperature of the liquid coating inside the paint storage tank 131:

[0067] like Figure 4 As shown, the temperature control structure 130 also includes a drive motor 133 and a stirring paddle 134; the drive motor 133 is installed in the paint storage tank 131, and its rotation shaft is connected to the stirring paddle 134; the stirring paddle 134 is located inside the paint storage tank 131 and is used to stir the liquid paint inside the paint storage tank 131.

[0068] To maintain the temperature range of the liquid coating inside paint storage tank 131:

[0069] like Figure 4 As shown, the temperature control structure 130 also includes an energy storage cover 135; the energy storage cover 135 is fitted onto the paint storage tank 131, and an energy storage medium is provided between the energy storage cover 135 and the paint storage tank 131; a semiconductor cooling chip 132 is disposed on the surface of the energy storage cover 135 for regulating the temperature of the energy storage medium.

[0070] To determine the temperature of the paint inside paint storage tank 131:

[0071] The temperature control structure 130 also includes a paint temperature sensor; the paint temperature sensor is installed in the paint storage tank 131 and is used to detect the temperature of the liquid paint in the paint storage tank 131; the paint temperature sensor is electrically connected to the controller and is used to transmit paint temperature data to the controller; the controller is electrically connected to the semiconductor cooling chip 132 and is used to control the direction and on / off of the current entering the semiconductor cooling chip 132 according to the paint temperature data.

[0072] In this embodiment, the driving motor 133 drives the stirring paddle 134 to rotate, the stirring paddle 134 drives the liquid paint to rotate in the paint storage tank 131, then the controller controls the current direction of the semiconductor refrigeration piece 132 according to the paint temperature data transmitted by the paint temperature sensor, so that the semiconductor refrigeration piece 132 enters the heating state or the refrigeration state, and then the semiconductor refrigeration piece 132 exchanges heat with the energy storage medium in the energy storage cover 135 to adjust the temperature of the energy storage medium in the energy storage cover 135, and the energy storage medium exchanges heat with the liquid paint in the paint storage tank 131 to adjust the temperature of the liquid paint in the paint storage tank 131, so that the liquid paint is sprayed at a preset paint temperature.

[0073] In the above process, the three-way valve 122 controls the communication between the pipe body 121 and the guide pipe 123, so that the gas used to drive the paint spraying in the pipe body 121 passes through the three-way valve 122 and the guide pipe 123 to the semiconductor refrigeration piece 132 in turn, and then replaces the air around the semiconductor refrigeration piece 132, so as to ensure the heat exchange rate of the semiconductor refrigeration piece 132 facing away from the surface of the energy storage cover 135.

[0074] After the temperature of the liquid paint in the paint storage tank 131 is adjusted, the three-way valve 122 controls the disconnection between the pipe body 121 and the guide pipe 123, so that the gas flow passes through the pipe body 121 quickly, and then drives the paint to be sprayed to the paint repair area of the substrate, and in this process, the energy storage medium exchanges heat with the liquid paint, and then slows down the temperature change speed of the liquid paint in the paint storage tank 131, so as to ensure the effective time of the liquid paint in the paint storage tank 131.

[0075] The application also provides a use method of the air conditioner air conveying device, which comprises the following steps:

[0076] OP1 liquid paint temperature adjustment: the temperature adjustment structure 130 adjusts the temperature of the liquid paint stored in the inside to a preset paint temperature.

[0077] In this step:

[0078] The drive motor 133 drives the agitator 134 to rotate, which in turn drives the liquid paint to rotate within the paint storage tank 131. Then, the controller controls the direction of the current entering the thermoelectric cooler 132 based on the paint temperature data transmitted from the paint temperature sensor, causing the thermoelectric cooler 132 to enter either a heating or cooling state. This allows the thermoelectric cooler 132 to exchange heat with the energy storage medium within the energy storage hood 135, thereby regulating the temperature of the energy storage medium within the hood 135. During this process, the three-way valve 122 controls the control tube 121. The gas inside the tube 121 used to drive the paint spraying is connected to the guide tube 123 so that the gas is sequentially passed through the three-way valve 122 and the guide tube 123 to the semiconductor cooling chip 132, thereby replacing the air around the semiconductor cooling chip 132. This ensures the heat exchange rate of the side of the semiconductor cooling chip 132 facing away from the energy storage cover 135. The energy storage medium exchanges heat with the rotating liquid paint through the paint storage tank 131 to evenly regulate the temperature of the liquid paint in the paint storage tank 131, so that the liquid paint is stabilized at the preset paint temperature when it is sprayed.

[0079] Preheating of the OP2 substrate area to be touched up: The compressed air source inputs protective gas into the heating nozzle 110 through the air supply mechanism 200. During this process, the air supply mechanism 200 heats the protective gas flowing through it in a manner from low to high. The protective gas in the heating nozzle 110 is sprayed onto the substrate area to be touched up in the form of a preheated airflow.

[0080] In this step:

[0081] Initially, a low-temperature preheated airflow is sprayed onto the area to be touched up through a heating nozzle 110 to separate impurities on the area to be touched up while preventing them from melting and sticking together. As the temperature of the preheated airflow sprayed from the heating nozzle 110 onto the area to be touched up gradually increases, the temperature of the area to be touched up is gradually increased to avoid damage to the original coating caused by a sudden increase in temperature, thereby raising the temperature of the area to be touched up to the preset substrate temperature.

[0082] After the substrate surface is heated to the preset substrate temperature, the thermal motion of its surface molecules is enhanced, thereby increasing the surface energy of the substrate and improving the wettability of the liquid coating in the touch-up area. At the same time, the impact generated by the preheated airflow removes impurities from the substrate surface, reducing the impact of impurities on the surface energy and creating physical isolation, so that the coating forms a uniform and continuous film on the substrate surface.

[0083] In addition, as the temperature of the substrate surface increases, the tiny pores on the substrate surface expand slightly due to heat, allowing the liquid coating to penetrate into the pores. After the substrate cools down, the coating inside the pores forms a mechanical anchoring structure, thereby improving the adhesion of the coating to the substrate surface.

[0084] In order to enable the gas supply mechanism 200 to regulate the temperature of the gas flowing through it:

[0085] The compressed gas source inputs the protective gas into the heating tank 211, and the protective gas in the heating tank 211 flows along the baffle channel formed by the plurality of baffles 213. In this process, the protective gas is heated by the heating pipe 212, thereby prolonging the heating time of the gas and effectively enhancing the heat exchange efficiency between the heating pipe 212 and the protective gas.

[0086] Then, the heated protective gas in the heating structure 210 enters the mixing tank 232 through the second flow regulating valve 222 and the exhaust tee 223, and the protective gas output by the compressed gas source enters the mixing tank 232 through the first flow regulating valve 221 and the exhaust tee 223. The heated protective gas and the normal-temperature protective gas in the mixing tank 232 are mixed by the mixing spiral 233 during the flow process. The supply gas temperature sensor 231 detects the temperature of the mixed gas flowing to the outlet end of the mixing tank 232 and transmits it to the controller. The controller adjusts the opening degree of the second flow regulating valve 222 and the first flow regulating valve 221 according to the detected temperature of the supply gas temperature sensor 231, so as to change the mixing amount of the heated protective gas and the normal-temperature protective gas, thereby quickly adjusting the temperature of the gas output by the gas supply mechanism 200, and improving the stability of the gas temperature output by the gas supply mechanism 200.

[0087] The OP3 sprays the paint to be repaired on the area to be repaired: the paint spray pipe 120 sprays the liquid paint adjusted to the preset paint temperature to the area to be repaired at the preset substrate temperature, and the heating spray pipe 110 sprays the buffer gas flow to the area to be repaired synchronously with the liquid paint, so as to form a gaseous buffer layer between the substrate and the paint.

[0088] In this step:

[0089] When the working environment is higher than the upper threshold value (for example, the environmental temperature > 25℃), the preset paint temperature of the paint is adjusted to be lower than the environmental temperature, so as to slow down the initial evaporation rate of the solvent in the paint, thereby prolonging the leveling time of the paint on the substrate surface and avoiding the orange peel or pinhole defects caused by the instantaneous evaporation of the solvent on the surface of the paint.

[0090] When the working environment is lower than the lower threshold value (for example, the environmental temperature < 15℃), the preset substrate temperature of the substrate is controlled to be higher than the preset paint temperature of the paint, so as to form a temperature gradient of heat transfer from the substrate to the paint, thereby maintaining the fluidity of the paint on the substrate surface at the initial stage of the paint film formation, preventing the viscosity of the paint from being too high due to low temperature, and thus ensuring the leveling property of the paint.

[0091] The temperature gradient of heat transfer from the substrate to the paint guides the solvent in the paint to evaporate gradually from the interface between the paint and the substrate to the interface between the paint and the air, so as to avoid the internal defects of the coating caused by the too fast film formation on the surface; at the same time, the wetting time of the paint and the substrate is prolonged, which is helpful for the full formation of the chemical adsorption between the paint film and the substrate, such as the hydrogen bond or van der Waals force between the polar groups, and further improves the adhesion of the paint on the substrate surface.

[0092] Since the temperature of the gaseous buffer layer is configured to be greater than the preset paint temperature and less than the preset substrate temperature, a progressive heat transfer gradient is formed from the substrate to the gaseous buffer layer and then to the paint, thereby reducing the risk of solvent explosion caused by excessive instantaneous temperature difference when the paint contacts the substrate.

[0093] In addition, since the gaseous buffer layer is composed of protective gas, the protective gas forms a dense gas film on the surface of the paint by virtue of its high density characteristics, so that the solvent in the paint slowly diffuses and volatilizes along the thickness direction of the paint film; at the same time, the protective gas replaces the air in the substrate area to be repainted, thereby reducing the oxygen content in the substrate area to be repainted and slowing down the speed of oxidation and deterioration of the repainted coating, the original coating and the substrate.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A spraying device, comprising: a spraying mechanism (100) ; the spraying mechanism (100) comprising a heating lance (110) and a paint lance (120) ; the heating lance (110) having a preheating mode; in the preheating mode, the heating lance (110) is configured to spray a preheating gas flow to a paint repair area on a substrate to heat the surface temperature of the paint repair area to a preset substrate temperature; the paint lance (120) is configured to spray a liquid paint adjusted to a preset paint temperature to the paint repair area reaching the preset substrate temperature; when the working environment is higher than an upper threshold, the preset paint temperature is configured to be lower than the ambient temperature, so as to slow down the initial evaporation rate of the solvent in the paint, thereby prolonging the leveling time of the paint on the surface of the substrate; when the working environment is lower than a lower threshold, the preset substrate temperature is configured to be higher than the preset paint temperature, so as to form a heat transfer gradient from the substrate to the paint, thereby maintaining the fluidity of the paint on the surface of the substrate at the initial stage of the paint film formation; the heating lance (110) further has a buffer mode; in the buffer mode, the heating lance (110) is configured to spray a buffer gas flow to the paint repair area on the substrate in synchronization with the liquid paint, so as to form a gaseous buffer layer between the substrate and the paint; the temperature of the gaseous buffer layer is configured to be greater than the preset paint temperature and less than the preset substrate temperature, so as to form a progressive heat transfer gradient from the substrate to the gaseous buffer layer and then to the paint, thereby reducing the thermal shock received by the paint when it contacts the substrate; further comprising a gas supply mechanism (200) ; the gas supply mechanism (200) has an inlet communicating with a compressed gas source and an outlet communicating with the heating lance (110), for heating the flowing gas; the compressed gas source is used to output a shielding gas to form a stable and dense gas film covering the surface of the substrate, so as to inhibit the disordered evaporation of the solvent in the paint and isolate oxygen; the gas supply mechanism (200) comprises a heating structure (210) ; the heating structure (210) comprises a heating tank (211), a heating pipe (212) and a plurality of baffles (213) ; the heating pipe (212) is arranged in the heating tank (211) and inserted into the baffles (213), for heating the temperature of the flowing gas; a plurality of baffles (213) are arranged in the heating tank (211) and arrayed along the length direction of the heating tank (211), so as to form a baffling channel in the heating tank (211), thereby prolonging the contact time of the gas with the heating pipe (212). 2.The spraying device according to claim 1, further comprising: a flow regulating structure (220) and a gas temperature sensor (231) ; the flow regulating structure (220) comprising a first flow regulating valve (221), a second flow regulating valve (222) and an exhaust tee (223) ; the inlet of the heating lance (110) communicating with the exhaust tee (223). ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The gas supply temperature sensor (231) is arranged between the exhaust tee (223) and the passage of the heating nozzle (110), and is used to detect the temperature of the gas input into the heating nozzle (110); One end of the first flow regulating valve (221) is communicated with the compressed gas source, and the other end is communicated with the exhaust tee (223), and is used to regulate the flow of the gas from the compressed gas source into the exhaust tee (223); One end of the second flow regulating valve (222) is communicated with the outlet of the heating structure (210), and the other end is communicated with the exhaust tee (223), and is used to regulate the flow of the gas from the heating structure (210) into the exhaust tee (223).

3. The spraying device according to claim 2, characterized in that: The gas supply mechanism (200) further comprises a mixing structure (230); The mixing structure (230) comprises the gas supply temperature sensor (231), a mixing tank (232) and a mixing spiral (233); The gas supply temperature sensor (231) is installed on one side of the outlet of the mixing tank (232), and is used to detect the temperature of the gas output by the mixing tank (232); The mixing tank (232) is connected in series between the exhaust tee (223) and the heating nozzle (110); The mixing spiral (233) is arranged in the mixing tank (232) to form a threaded channel in the mixing tank (232), and is used to promote the mixing of the gas.

4. The spraying device according to claim 3, characterized in that: The spraying mechanism (100) further comprises a temperature regulating structure (130); The temperature regulating structure (130) comprises a paint storage tank (131) and a semiconductor refrigerating sheet (132); The outlet of the paint storage tank (131) is communicated with the paint inlet of the coating nozzle (120), and is used to store the liquid paint; The semiconductor refrigerating sheet (132) is attached to the paint storage tank (131), and is used to regulate the temperature of the liquid paint in the paint storage tank (131) so that the liquid paint can be stably maintained at the preset paint temperature when being sprayed.

5. The spraying device according to claim 4, characterized in that: The coating nozzle (120) comprises a nozzle body (121), a tee valve (122) and a guide pipe (123); The tee valve (122) is arranged in the middle of the nozzle body (121) and is located between the paint inlet of the nozzle body (121) and the gas flow inlet of the nozzle body (121); The inlet of the guide pipe (123) is communicated with the tee valve (122), and the outlet thereof faces the semiconductor refrigerating sheet (132).

6. The spraying device according to claim 5, characterized in that: The temperature regulating structure (130) further comprises a driving motor (133) and a stirring paddle (134); The driving motor (133) is installed on the paint storage tank (131), and the rotating shaft thereof is connected with the stirring paddle (134); The stirring paddle (134) is located in the paint storage tank (131) and is used to stir the liquid paint in the paint storage tank (131).

7. The spray device of claim 6, wherein: the temperature regulating structure (130) further comprises an energy storage cover (135); the energy storage cover (135) is sleeved on the paint storage tank (131), and an energy storage medium is arranged between the energy storage cover (135) and the paint storage tank (131); the semiconductor refrigerating sheet (132) is arranged on the surface of the energy storage cover (135) and used for adjusting the temperature of the energy storage medium.

Images