Semiconductor lead frame processing equipment capable of expanding bonding wire area and product thereof

Abstract

The invention discloses semiconductor lead frame processing equipment capable of expanding a bonding wire area and a product thereof, and relates to the technical field of semiconductor lead frames, the semiconductor lead frame processing equipment comprises a moving unit, the top of the moving unit is movably provided with a processing unit, and the bottom of the moving unit is movably provided with a forming unit; the processing unit comprises an arc-shaped plate, and clamping fixed plates are symmetrically and fixedly connected to the side parts of the arc-shaped plate; residual plastic in the injection molding process of the lead frame can be eliminated through downward pressing of the arc-shaped plate and moving cooperation of the wrapping film and the supporting plate, and the surface quality and the internal filling effect of the lead frame can be further improved through moving and downward pressing of the wrapping film and the supporting plate; the wrapping film and the supporting plate protrude towards the interior of the mold cavity, and vibration is arranged at the top of the wrapping film and the supporting plate, so that the filling effect and the flowing effect of the protruding strips and the inwards-concave areas can be further enhanced, forming of the protruding strips is facilitated, and the overall strength of the lead frame is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor lead frame, and particularly relates to a semiconductor lead frame processing equipment for expanding a soldering wire area and a product thereof. BACKGROUND

[0002] In a high-precision lead frame, the soldering wire position is insufficient due to the single design of the soldering pad, thereby affecting the use of the lead frame.

[0003] In the prior art, the soldering pad is wrapped and packaged by injection molding, which meets the demand of high-precision electronic devices. However, during the injection molding process, the injection gate will be left after the injection molding is completed, and the existing lead frame has insufficient strength and is difficult to cope with subsequent complex use scenarios of the product. Therefore, how to improve the strength and surface quality of the lead frame and expand the soldering wire area is a problem to be solved in the development of the lead frame. SUMMARY

[0004] This section aims to summarize some aspects of the embodiments of the present application and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract and title of the specification to avoid obscuring the purpose of this section, the abstract and the title. Such simplifications or omissions cannot be used to limit the scope of the present application.

[0005] To solve the above technical problems, the present application provides the following technical solutions: A semiconductor lead frame processing equipment for expanding a soldering wire area, comprising: A moving unit, a processing unit movably arranged on the top of the moving unit, and a forming unit movably arranged on the bottom of the moving unit; The processing unit comprises an arc-shaped plate, symmetrical clamping fixed plates are fixedly connected to the side of the arc-shaped plate, the symmetrical clamping fixed plates are fixedly connected through a connecting flange, a wrapping film is movably arranged between the arc-shaped plate and the connecting flange at the bottom of the arc-shaped plate, and a supporting plate is wrapped in the middle of the wrapping film; The forming unit comprises a bottom mold, an upper mold is clamped on the top of the bottom mold, an outer frame sleeve is movably arranged on the outer side of the upper mold, the wrapping film is movably arranged on the top of the outer frame sleeve and the upper mold to smooth the injection molding surface on the top of the outer frame sleeve and the upper mold, and the supporting plate drives the wrapping film to press the outer frame sleeve towards the bottom mold to extrude the injection melt in the inner part of the upper mold and the bottom mold.

[0006] As a preferred scheme of the semiconductor lead frame processing equipment for expanding a soldering wire area and the product thereof, in the present application, wherein: The processing unit further comprises a top frame fixedly connected to the top of the arc-shaped plate, a feeding opening is formed in the top of the arc-shaped plate, and a feeding pipe is communicated with the top of the feeding opening; The outer side of the clamping fixed plate is movably provided with a clamping movable plate, and the opposite surfaces of the clamping fixed plate and the clamping movable plate are both provided with mounting grooves.

[0007] As a preferred scheme of the semiconductor lead frame processing equipment and product thereof, wherein: The opposite surfaces of the clamping fixed plate and the clamping movable plate are both provided with mounting grooves, and the inside of the mounting grooves is rotatably provided with a rolling roller. The connecting flaps are symmetrically arranged on the front and back sides of the clamping fixed plate, and the opposite surfaces of the connecting flaps and the arc-shaped plate are both provided with a plurality of auxiliary wheel plates, and the surfaces of the auxiliary wheel plates are rotatably embedded with rollers.

[0008] As a preferred scheme of the semiconductor lead frame processing equipment and product thereof, wherein: The bottom of the top frame is fixedly connected with frame plates, the front and back sides of the frame plates are rotatably provided with winding rollers, the central shafts of the winding rollers are fixedly connected with the output shafts of winding driving sources after penetrating through the frame plates, the winding driving sources are fixed on the surfaces of the frame plates, and the front and back sides of the wrapping film are wound on the surfaces of the symmetric winding rollers.

[0009] As a preferred scheme of the semiconductor lead frame processing equipment and product thereof, wherein: The two layers of wrapping films and the support plate constitute an isolation piece, the support plate is arranged in the middle of the two layers of wrapping films, the middle of the support plate and the wrapping films is provided with a butt joint, and the wrapping film is adhered and attached to the surface of the support plate.

[0010] As a preferred scheme of the semiconductor lead frame processing equipment and product thereof, wherein: The bottom of the top frame is fixedly connected with a vibrating table, the top of the vibrating table is provided with a vibrating driving source, the output shaft of the vibrating driving source is fixedly connected with a driving gear after penetrating through the vibrating table, the side of the driving gear is symmetrically meshed with driven gears, the middle of the driven gears is rotatably connected with a middle frame, the middle frame is fixedly connected to the bottom of the vibrating table, the outer side of the driven gears is eccentrically provided with a movable column, the outer side of the movable column is sleeved with a transmission sleeve, the bottom of the transmission sleeve is fixedly connected with a connecting rod, the bottom of the connecting rod is fixedly connected with a vibrating head, and the vibrating head is movably arranged on the top surface of the arc-shaped plate for impacting the arc-shaped plate to generate vibration.

[0011] As a preferred scheme of the semiconductor lead frame processing equipment and product thereof for expanding the wire bonding area, wherein: The forming unit further comprises a stepped groove opened on the side of the bottom mold and surrounding the outer contour of the bottom mold, the bottom of the stepped groove is provided with a plurality of elastic members, the stepped groove is elastically connected with the outer frame sleeve through the elastic members and the outer frame sleeve, and the top surface of the outer frame sleeve is higher than the top surface of the upper mold.

[0012] As a preferred scheme of the semiconductor lead frame processing equipment and product thereof for expanding the wire bonding area, wherein: An opening is formed on the top of the upper mold; The top of the upper mold is provided with an inclined opening, and the inside of the bottom mold is provided with a support frame.

[0013] As a preferred scheme of the semiconductor lead frame processing equipment and product thereof for expanding the wire bonding area, wherein: The moving unit comprises a device frame, an up-down control source is installed on the top of the device frame, the output shaft of the up-down control source is rotationally arranged on the surface of the device frame, a moving block is movably connected to the surface of the up-down control source, a transmission shaft two is transversely arranged in the middle of the moving block, a connecting plate is movably connected to the middle of the transmission shaft two, and a top frame is fixedly connected to the bottom of the connecting plate. A bottom control source is installed on the bottom of the device frame, the output shaft of the bottom control source is fixedly connected to a transmission shaft three after penetrating through the device frame, a placing plate is movably connected to the surface of the transmission shaft three, and the bottom mold is arranged in the recess on the surface of the placing plate.

[0014] Another object of the present application is to provide a semiconductor lead frame product for expanding the wire bonding area, which comprises the following steps: The top of the pad is provided with a raised area, the outside of the pad is wrapped with a special-shaped cup, the outside of the bottom of the special-shaped cup is symmetrically provided with a raised strip, the surface of the raised strip is wrapped with a foot wrapping, and the middle of the bottom of the special-shaped cup is provided with an inner recess.

[0015] The present application has the following advantages: The residual plastic of the lead frame in the injection molding process can be eliminated by the downward pressing of the arc-shaped plate and the movement of the wrapping film and the supporting plate, and the movement and downward pressing of the wrapping film and the supporting plate can further improve the surface quality and internal filling effect of the lead frame, the wrapping film and the supporting plate are protruded into the inner cavity of the mold and are provided with vibration on the top thereof, which can further strengthen the filling effect and flow effect of the raised strip and the inner recess, thereby facilitating the forming of the raised strip and improving the overall strength of the lead frame. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments description will be briefly introduced as follows: Figure 1 It is a schematic diagram of the overall structure of the present application; Figure 2 It is a schematic diagram of the overall structure of the present application; Figure 1 It is a schematic diagram of the overall structure of the present application; Figure 3 It is a schematic diagram of the overall structure of the present application; Figure 4 It is a schematic diagram of the overall structure of the present application; Figure 3 It is a schematic diagram of the overall structure of the present application; Figure 5 It is a schematic diagram of the overall structure of the present application; Figure 6 It is a schematic diagram of the overall structure of the present application; Figure 5 It is a schematic diagram of the overall structure of the present application, wherein the isolation member is arranged between the connecting flap and the arc-shaped plate; Figure 7 It is a schematic diagram of the overall structure of the present application; Figure 6 It is a schematic diagram of the overall structure of the present application, wherein the clamping moving plate and the clamping fixed plate close to clamp the wrapping film and the supporting plate; Figure 8 It is a schematic diagram of the overall structure of the present application; Figure 9 It is a schematic diagram of the overall structure of the present application; Figure 8 It is a schematic diagram of the overall structure of the present application, wherein the isolation member is arranged at the bottom of the arc-shaped plate; Figure 10 It is a schematic diagram of the overall structure of the present application; Figure 11 It is a schematic diagram of the overall structure of the present application; Figure 12 It is a schematic diagram of the overall structure of the present application; Figure 13 It is a schematic diagram of the overall structure of the present application.

[0017] In the drawings: 1, moving unit; 101, equipment rack; 1011, up-down control source; 1012, transmission shaft one; 1013, moving block; 102, mounting plate; 1021, transverse control source; 1022, transmission shaft two; 1023, connecting plate; 103, placing plate; 1031, transmission shaft three; 1032, bottom control source; 2. Processing Unit; 201. Top Frame; 202. Arc Plate; 2021. Injection Port; 2022. Clamping Fixed Plate; 2023. Clamping Moving Plate; 2024. Connecting Folding Plate; 20241. Auxiliary Wheel Plate; 2025. Mounting Slot; 2026. Rolling Roller; 203. Feed Pipe; 204. Frame Plate; 2041. Rewinding Drive Source; 2042. Rewinding Roller; 205. Isolator; 2051. Docking Interface; 2052. Wrapping Film; 2053. Support Plate; 206. Vibration Table; 2061. Vibration Drive Source; 2062. Drive Gear; 2063. Driven Gear; 20631. Movable Column; 2064. Constraint Plate; 2065. Middle Frame; 207. Vibration Head; 2071. Connecting Rod; 2072. Transmission Sleeve; 3. Molding unit; 301. Outer frame; 302. Stepped groove; 303. Bottom mold; 304. Elastic element; 305. Upper mold; 3051. Angled opening; 306. Support frame; 4. Pad; 401. Raised area; 402. Irregular cup; 403. Raised strip; 404. Concave area; 405. Foot wrap. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Example 1: This embodiment is an example Figure 1 - Figure 11 As shown, a semiconductor lead frame processing apparatus for expanding the bonding area includes: The moving unit 1 has a processing unit 2 movably disposed on its top and a forming unit 3 movably disposed on its bottom. The processing unit 2 includes an arc-shaped plate 202, and clamping plates 2022 are symmetrically fixedly connected to the sides of the arc-shaped plate 202. The symmetrical clamping plates 2022 are fixedly connected to each other by connecting folding plates 2024. A wrapping film 2052 is movably arranged between the arc-shaped plate 202 and the connecting folding plate 2024 at its bottom. A support plate 2053 is wrapped in the middle of the wrapping film 2052. The forming unit 3 comprises a bottom mold 303, the top of the bottom mold 303 is clamped with an upper mold 305, the outer side of the upper mold 305 is movably sleeved with an outer frame sleeve 301, the wrapping film 2052 is movably arranged on the top of the outer frame sleeve 301 and the upper mold 305 for leveling the injection surface on the top of the outer frame sleeve 301 and the upper mold 305, and the supporting plate 2053 drives the wrapping film 2052 to press the outer frame sleeve 301 to the bottom mold 303 for extruding the injection melt in the upper mold 305 and the bottom mold 303.

[0020] As shown in Figure 1 - Figure 4 The processing unit 2 further comprises a top frame 201 fixedly connected to the top of the arc-shaped plate 202, the top of the arc-shaped plate 202 is provided with an injection port 2021, the top of the injection port 2021 is communicated with a feeding pipe 203, and the feeding pipe 203 is communicated with an external injection molding machine. The outer side of the clamping fixed plate 2022 is movably provided with a clamping movable plate 2023, and the clamping fixed plate 2022 and the clamping movable plate 2023 are closed to clamp the side of the wrapping film 2052 and the supporting plate 2053.

[0021] As shown in Figure 5 - Figure 9 The opposite surfaces of the clamping fixed plate 2022 and the clamping movable plate 2023 are both provided with mounting grooves 2025, the inside of the mounting grooves 2025 is rotatably provided with rolling rollers 2026, and the top surface of the clamping fixed plate 2022 is provided with bolts which are threadedly connected with nuts after penetrating through the clamping movable plate 2023, so that the wrapping film 2052 and the supporting plate 2053 can move in the inside of the clamping fixed plate 2022 and the clamping movable plate 2023 after the clamping fixed plate 2022 and the clamping movable plate 2023 are closed to clamp the side of the wrapping film 2052 and the supporting plate 2053 through the design of the rolling rollers 2026. The connecting flaps 2024 are symmetrically arranged on the front and rear sides of the clamping fixed plate 2022, the cross-sectional shapes of the connecting flaps 2024, the arc-shaped plate 202 and the supporting plate 2053 are matched, the opposite surfaces of the connecting flaps 2024 and the arc-shaped plate 202 are both provided with a plurality of auxiliary wheel plates 20241, the surfaces of the auxiliary wheel plates 20241 are rotatably embedded with rollers, and the auxiliary wheel plates 20241 are preferably arranged at the bending positions of the connecting flaps 2024 and the arc-shaped plate 202.

[0022] As shown in Figure 1 - Figure 3As shown, the bottom of the top frame 201 is symmetrically fixedly connected with a frame plate 204, the front and rear sides of the frame plate 204 are symmetrically rotatably provided with winding rollers 2042, the central shafts of the winding rollers 2042 are fixedly connected with the output shafts of winding driving sources 2041 passing through the frame plate 204, the winding driving sources 2041 are fixed on the surface of the frame plate 204, the front and rear sides of the wrapping film 2052 are respectively wound on the surfaces of the symmetric winding rollers 2042, the winding driving sources 2041 are preferably servo motors and are controlled by PLC, and the shapes of the winding rollers 2042 are preferably symmetric funnel shapes or cylindrical shapes.

[0023] As shown in the figure, Figure 5 - Figure 9 As shown, the two layers of the wrapping film 2052 and the support plate 2053 constitute the isolation piece 205, and the support plate 2053 is arranged at the middle part of the two layers of the wrapping film 2052, so that the wrapping film 2052 wraps the support plate 2053, the middle part of the support plate 2053 and the wrapping film 2052 is provided with a butt joint 2051, and the wrapping film 2052 is adhered and attached to the surface of the support plate 2053.

[0024] The opposite surfaces of the two layers of the wrapping film 2052 are subjected to sandblasting treatment, so that the outer surface of the wrapping film 2052 is relatively smooth to form a low friction coefficient, and the back surface is subjected to sandblasting treatment to be rough, so that the glue is easily applied and then hot-pressed, the diameter of the butt joint 2051 is greater than the diameter of the injection port 2021, and the length of the wrapping film 2052 wound by the winding driving source 2041 is controlled, so that the butt joint 2051 moves correspondingly to the bottom of the injection port 2021; In order to reduce the wrinkles of the wrapping film 2052 during the movement at the bottom of the arc-shaped plate 202, the support plate 2053 is arranged at the middle part of the wrapping film 2052, the areas of the wrapping film 2052 on both sides which are not wrapped with the support plate 2053 are wound on the surface of the winding roller 2042, the surface of the support plate 2053 is applied with glue, and the wrapping film 2052 is attached to the surface, then the wrapping film 2052 is scraped flat by a scraping strip and subjected to hot-pressing treatment, so that the support plate 2053 is wrapped at the middle part of the two layers of the wrapping film 2052, and the composite of the wrapping film 2052 and the support plate 2053 without wrinkles on the surface is installed between the two winding rollers 2042, wherein the wrapping film 2052 is preferably a glass fiber reinforced PTFE film, so that it can work in an environment with a temperature up to 260°C while meeting the wear resistance, fully meeting the requirements of the plastic packaging process, and the friction coefficient of PTFE itself is relatively low among known materials, meeting the movement of the wrapping film 2052 between the arc-shaped plate 202 and the connecting flaps 2024, and the support plate 2053 is preferably a thin steel plate, and the outer surfaces of the arc-shaped plate 202 and the connecting flaps 2024 are wrapped with PTFE added fluororubber, which can reduce the friction and also reduce the accidental wear of the wrapping film 2052.

[0025] As Figure 5 And Figure 10 - Figure 11 As shown in the drawings, the bottom of the top frame 201 is fixedly connected with a vibrating table 206, the top of the vibrating table 206 is installed with a vibrating drive source 2061, the output shaft of the vibrating drive source 2061 is fixedly connected with a driving gear 2062 after penetrating through the vibrating table 206, the side of the driving gear 2062 is symmetrically and meshingly connected with a driven gear 2063, the middle of the driven gear 2063 is rotatably connected with a middle frame 2065, the middle frame 2065 is fixedly connected to the bottom of the vibrating table 206, the outer side of the driven gear 2063 is eccentrically installed with a movable column 20631, the outer side of the movable column 20631 is sleeved with a transmission sleeve 2072, the bottom of the transmission sleeve 2072 is fixedly connected with a connecting rod 2071, the bottom of the connecting rod 2071 is fixedly connected with a vibrating head 207, the vibrating head 207 is movably arranged on the top surface of the arc-shaped plate 202 for impacting the arc-shaped plate 202 to generate vibration, the connecting rod 2071 slides through the bottom of a constraint plate 2064, the constraint plate 2064 is fixedly connected to the bottom of the vibrating table 206, the vibrating drive source 2061 is preferably a servo motor and is controlled by PLC, and the driving gear 2062 and the driven gear 2063 are preferably bevel gears.

[0026] As Figure 5 And Figure 8 As shown in the drawings, the forming unit 3 further comprises a stepped groove 302 which is opened in the side of the bottom mold 303 and surrounds the outer contour of the bottom mold 303, the bottom of the stepped groove 302 is provided with a plurality of elastic members 304, the stepped groove 302 is elastically connected through the elastic members 304 and the outer frame sleeve 301, the top surface of the outer frame sleeve 301 is higher than the top surface of the upper mold 305, and the elastic members 304 are preferably springs.

[0027] As Figure 5 And Figure 8 As shown in the drawings, the top of the upper mold 305 is provided with an opening, and the cross section of the top opening of the upper mold 305 is consistent with the contour of the cross sections of the arc-shaped plate 202, the wrapping film 2052 and the supporting plate 2053. The top of the upper mold 305 is provided with an inclined opening 3051, and the inside of the bottom mold 303 is provided with a supporting frame 306.

[0028] It should be noted that the four corners of the upper mold 305 are butt-jointed and installed through the guide columns and the round holes in the bottom of the bottom mold 303.

[0029] As Figure 1 And Figure 2As shown, the mobile unit 1 comprises a device frame 101, the top of the device frame 101 is provided with an up-down control source 1011, the output shaft of the up-down control source 1011 is rotatably arranged on the surface of the device frame 101, the surface of the up-down control source 1011 is movably connected with a moving block 1013, the middle part of the moving block 1013 is transversely provided with a transmission shaft two 1022, the middle part of the transmission shaft two 1022 is movably connected with a connecting plate 1023, the side of the device frame 101 is provided with a slide rail, the surface of the slide rail is connected with a side plate through a sliding block, the surface of the side plate is provided with a transverse control source 1021, the output shaft of the transverse control source 1021 is rotatably connected with the transmission shaft two 1022 after penetrating through the side, so as to facilitate the adjusting position of the connecting plate 1023, the bottom of the connecting plate 1023 is fixedly connected with a top frame 201. The bottom of the device frame 101 is provided with a bottom control source 1032, the output shaft of the bottom control source 1032 is fixedly connected with a transmission shaft three 1031 after penetrating through the device frame 101, the surface of the transmission shaft three 1031 is movably connected with a placing plate 103, and the bottom mold 303 is arranged in the recess on the surface of the placing plate 103.

[0030] The up-down control source 1011, the transverse control source 1021 and the bottom control source 1032 are preferably servo motors and are controlled by PLC, the transmission shaft one 1012, the transmission shaft two 1022 and the transmission shaft three 1031 are preferably ball screws, and the moving block 1013, the connecting plate 1023 and the placing plate 103 are preferably movably connected with the ball screws through ball screw nuts and ball screw seats.

[0031] Operation process: The bottom mold 303 is placed on the recess of the top surface of the placement plate 103, and the bottom mold 303 is clamped to the top surface of the placement plate 103. The pad 4 to be processed is placed on the top of the support frame 306, so that the convex area 401 and the inner wall of the support frame 306 are matched to realize the placement of the pad 4. Of course, the support frame 306 can also be designed as a circular block, and a recessed groove for inserting the convex area 401 is formed on the top of the circular block. Similarly, the placement can also be achieved. The upper mold 305 is placed on the top of the bottom mold 303. At this time, the placement plate 103 has not been transferred to the directly below the arc-shaped plate 202. When the bottom mold 303 and the upper mold 305 are combined, the bottom control source 1032 drives the transmission shaft three 1031 to rotate, so that the transmission shaft three 1031 drives the placement plate 103 to be transferred to the below the arc-shaped plate 202. The top opening of the upper mold 305 is directly opposite to the bottom of the arc-shaped plate 202. The up-down control source 1011 is controlled to be started, so that the up-down control source 1011 drives the transmission shaft one 1012 to rotate. The transmission shaft one 1012 drives the moving block 1013 to move downward, so that when the moving block 1013 moves downward, the transmission shaft two 1022 and the connecting plate 1023 move downward, so that the arc-shaped plate 202 connected to the top frame 201 at the bottom of the connecting plate 1023 drives the isolation piece 205 to cover the top end of the top opening of the upper mold 305, and the material conveying pipe 203 and the material injection port 2021 are directly opposite to the middle part of the upper mold 305. The injection molding machine or the extruder connected with the material conveying pipe 203 is started again, so that the molten plastic passes through the material conveying pipe 203 and then enters the internal space of the bottom mold 303 and the upper mold 305 through the material injection port 2021. When a predetermined amount of raw material is injected, the raw material in the bottom mold 303 and the upper mold 305 has not contacted with the wrapping film 2052 wrapping the support plate 2053. Subsequently, the winding driving source 2041 is started to rotate the winding driving source 2041 on one side of the arc-shaped plate 202 to wind the wrapping film 2052, and the winding driving source 2041 on the other side of the arc-shaped plate 202 is reversed to release the wrapping film 2052. Thus, the wrapping film 2052 and the wrapping film 2052 wrapping the support plate 2053 are driven to pass through the bottom of the arc-shaped plate 202 by winding the wrapping film 2052, so that the wrapping film 2052 and the butt joint port 2051 formed on the surface of the support plate 2053 are away from the material injection port 2021. Thus, the residual plastic strands between the material injection port 2021 and the bottom mold 303 and the upper mold 305 are cut off, and the residual material remaining on the surface of the lead frame and the burrs in the gate area are reduced. And the wrapping film 2052 by itself relative to the low friction coefficient of metal and relative to the metal does not stick to the characteristics, when the top of the upper mold 305 slides, does not pull too much inside the upper mold 305 in the molten state of plastic, so that the top of the upper mold 305 plastic form remains relatively complete, and the top of the upper mold 305 plastic and wrapping film 2052 also have a gap, so as to further avoid the wrapping film 2052 in the movement of the top of the plastic pulling unevenly, and the wrapping film 2052 itself relative to the elastic material of the metal material, can be closed at the top of the upper mold 305 with the arc plate 202 bottom support plate 2053 cooperation, the closure refers to the top of the upper mold 305 opening is wrapped by the elastic wrapping film 2052 support plate 2053 covered and closed, improve the sealing of the injection molding environment, and the wrapping film 2052 in the middle of the support plate 2053, can further reduce the wrinkle of the wrapping film 2052 through the composite characteristics of soft - hard - soft, so that the wrapping film 2052 is supported by the support plate 2053, while the wrapping film 2052 can be more smoothly in the top of the upper mold 305 and the arc plate 202 and connecting the folding plate 2024 between the sliding; And the surface of the arc plate 202 and the connecting folding plate 2024 is wrapped with PTFE powder modified fluorine rubber, which can further reduce the wear of the wrapping film 2052 in contact with it while reducing its own friction coefficient, so that the wrapping film 2052 can be reused, and the gap between the connecting folding plate 2024 and the front and rear ends of the arc plate 202 is provided, which can also scrape the bottom surface of the wrapping film 2052 in the movement of the wrapping film 2052 and the support plate 2053, avoid the plastic residue on the surface of the wrapping film 2052, and cooperate with the artificial timing to clean the surface of the connecting folding plate 2024 and the arc plate 202 and replace the isolation piece 205, to ensure the stable operation of the equipment, and the gap between the connecting folding plate 2024 and the arc plate 202 also ensures that the wrapping film 2052 and the support plate 2053 do not appear excessive offset and wrinkle in the movement, and the isolation piece 205 recycling only needs to replace the wrapping film 2052 which has been reused, so that the new wrapping film 2052 is reattached to the surface of the support plate 2053.

[0032] When the wrapping film 2052 drives the butt joint 2051 on the top of the support plate 2053 away from the upper mold 305, the support plate 2053 and the wrapping film 2052 without the butt joint 2051 on the top move to the top of the upper mold 305, and then the upper and lower control source 1011 is started, the upper and lower control source 1011 drives the transmission shaft 1012 to rotate, so that the transmission shaft 1012 drives the moving block 1013 and the connecting plate 1023 to move down, and in the process of moving down of the connecting plate 1023, the arc-shaped plate 202 at the bottom of the connecting plate 1023 is driven to move down, so that the arc-shaped plate 202 drives the wrapping film 2052 and the support plate 2053 without the butt joint 2051 at the bottom to move down, so that the wrapping film 2052 and the support plate 2053 push the outer frame sleeve 301 to move to the bottom of the stepped groove 302, so that the elastic member 304 is compressed, and the wrapping film 2052 and the support plate 2053 move down to extrude the plastic inside the quantitative injection bottom mold 303 and the upper mold 305, so that the plastic originally injected in the part of the outer frame sleeve 301 protruding from the upper mold 305 is compressed, and then in the compression, the plastic in the molten state can be filled in the space at the bottom of the wrapping film 2052 and the support plate 2053, so that the plastic in the molten state can flow to the outside of the support plate 2053 along the arc of the support plate 2053 and the wrapping film 2052, so that the plastic in the molten state can form a protruding strip 403 on the outside of the bottom of the wrapping film 2052 and the support plate 2053, and form an inner concave area 404 in the middle of the bottom.

[0033] In the process of pressing down the wrapping film 2052 and the support plate 2053, the plastic in the molten state can be forced to fill the gap inside the upper mold 305 and the bottom mold 303, eliminating the underfilling, and the extruded protruding strip 403 can further improve the overall structural strength and bending and twisting resistance of the lead frame due to its protruding thickness. In the process of pressing down the wrapping film 2052 and the support plate 2053, the beveled opening 3051 guides the residual molten plastic on the inner surface of the outer frame sleeve 301 to be scraped, thereby reducing the residual molten plastic on the inner surface of the outer frame sleeve 301.

[0034] When the moving down of the wrapping film 2052 and the support plate 2053 is completed, the vibration driving source 2061 is started, the vibration driving source 2061 drives the driving gear 2062 to rotate, the driving gear 2062 drives the two driven gears 2063 to rotate, and the rotation of the driven gears 2063 drives the eccentric rotation of the movable column 20631, the movable column 20631 moves in the inside of the transmission sleeve 2072 with the driven gears 2063, so that the movable column 20631 drives the transmission sleeve 2072 to move up and down, so that the transmission sleeve 2072 drives the connecting rod 2071 and the vibration head 207 to move up and down on the top of the arc-shaped plate 202, so that the vibration head 207 intermittently hits the top of the arc-shaped plate 202, so that the arc-shaped plate 202 is vibrated, and the plastics in the inside of the upper mold 305 and the bottom mold 303 are further vibrated and flattened, and the arc-shaped plate 202 and the wrapping film 2052 form the inner recess area 404 to the inside of the upper mold 305, so that the vibration of the vibration head 207 can be more fully entered into the inside of the mold cavity, that is, the inside space of the upper mold 305 and the bottom mold 303, so that the distribution of the raw materials in the inside of the mold cavity is more uniform, and the vibration in the inner recess area 404 and the raised strip 403 position can be locally strengthened, so that the fluidity and filling effect of the molten plastics in this area are improved.

[0035] When the cooling after the pressing down is completed, the lead frame is preliminarily formed in the inside of the bottom mold 303 and the upper mold 305, and then the arc-shaped plate 202 is moved away from the top of the upper mold 305, so as to facilitate the demolding of the lead frame in the inside of the upper mold 305.

[0036] In summary: Through the pressing down of the arc-shaped plate 202 and the moving cooperation of the wrapping film 2052 and the support plate 2053, the residual plastics of the lead frame in the injection molding process can be eliminated, and the moving and pressing down of the wrapping film 2052 and the support plate 2053 can further improve the surface quality and internal filling effect of the lead frame, and the wrapping film 2052 and the support plate 2053 are protruded to the inside of the mold cavity and the vibration is arranged on the top thereof, so as to further strengthen the filling effect and flow effect of the raised strip 403 and the inner recess area 404, thereby facilitating the molding of the raised strip 403, and further improving the overall strength of the lead frame.

[0037] Embodiment Two: As shown in the embodiment, the embodiment provides a semiconductor lead frame product with expanded wire bonding area, which comprises: Figure 12 Figure 13 As shown in the embodiment, the embodiment provides a semiconductor lead frame product with expanded wire bonding area, which comprises: ​The top of the soldering pad 4 is provided with a raised area 401, the outer side of the soldering pad 4 is wrapped with a special-shaped cup 402, the special-shaped cup 402 is preferably made of epoxy molding material, the outer side of the bottom of the special-shaped cup 402 is symmetrically provided with a raised strip 403, the surface of the raised strip 403 is wrapped with a foot 405, and the surface of the raised strip 403 is further provided with a character groove in the middle during subsequent processing, so as to facilitate separate identification of products, the middle of the bottom of the special-shaped cup 402 is provided with an inner recess area 404, the middle of the inner recess area 404 is an injection molding area, so that the recess of the inner recess area 404 facilitates the flatness of the injection molding gate area, the protrusion of the raised strip 403 facilitates the strength of the lead frame, and the raised area 401 increases the welding range of the soldering pad 4.

Claims

1. A semiconductor lead frame processing device for expanding the bonding area, characterized in that, Include: Mobile unit (1), the top of the mobile unit (1) is movably provided with a processing unit (2), the bottom of the mobile unit (1) is movably provided with a forming unit (3); The processing unit (2) comprises an arc-shaped plate (202), the side of the arc-shaped plate (202) is fixedly connected with a clamping fixed plate (2022), the symmetric clamping fixed plates (2022) are fixedly connected through a connecting fold plate (2024), the arc-shaped plate (202) and the connecting fold plate (2024) at the bottom thereof are movably provided with a wrapping film (2052), and the middle of the wrapping film (2052) is wrapped with a supporting plate (2053); The forming unit (3) comprises a bottom mold (303), the top of the bottom mold (303) is clamped with an upper mold (305), the outer side of the upper mold (305) is movably sleeved with an outer frame sleeve (301), the wrapping film (2052) is movably arranged on the top of the outer frame sleeve (301) and the upper mold (305) for flattening the injection surface on the top of the outer frame sleeve (301) and the upper mold (305), and the supporting plate (2053) drives the wrapping film (2052) to press the outer frame sleeve (301) to be close to the bottom mold (303) for extruding the injection melt in the upper mold (305) and the bottom mold (303).

2. The expanded wire bonding area semiconductor lead frame processing equipment of claim 1, wherein: The processing unit (2) further comprises a top frame (201) fixedly connected to the top of the arc-shaped plate (202), and the top of the arc-shaped plate (202) is provided with an injection port (2021), and the top of the injection port (2021) is communicated with a material conveying pipe (203); The outer side of the clamping fixed plate (2022) is movably provided with a clamping movable plate (2023), and the clamping fixed plate (2022) and the clamping movable plate (2023) close to clamp the side of the wrapping film (2052) and the supporting plate (2053).

3. The expanded wire bonding area semiconductor lead frame processing equipment of claim 2, wherein: The opposite surfaces of the clamping fixed plate (2022) and the clamping movable plate (2023) are provided with mounting grooves (2025), the inside of the mounting grooves (2025) is rotatably provided with rolling rollers (2026), the top surface of the clamping fixed plate (2022) is provided with a bolt, and the bolt is threadedly connected with a nut after penetrating through the clamping movable plate (2023); The connecting fold plates (2024) are symmetrically arranged on the front and rear sides of the clamping fixed plate (2022), the opposite surfaces of the connecting fold plates (2024) and the arc-shaped plate (202) are provided with a plurality of auxiliary wheel plates (20241), and the surface of the auxiliary wheel plate (20241) is rotatably embedded with a rolling wheel.

4. The enlarged wire bonding area semiconductor lead frame processing apparatus according to any one of claims 2 to 3, wherein: The bottom of the top frame (201) is fixedly connected with a frame plate (204), the front and rear sides of the frame plate (204) are symmetrically provided with winding rollers (2042), the central shafts of the winding rollers (2042) are fixedly connected with the output shafts of winding driving sources (2041) penetrating through the frame plate (204), the winding driving sources (2041) are fixed on the surface of the frame plate (204), and the front and rear sides of the wrapping film (2052) are wound on the surfaces of the symmetric winding rollers (2042) respectively.

5. The enlarged wire bonding area semiconductor lead frame processing apparatus according to claim 4, wherein: Two layers of the wrapping film (2052) and the supporting plate (2053) form an isolation piece (205), the supporting plate (2053) is arranged at the middle part of the two layers of the wrapping film (2052), the middle part of the supporting plate (2053) and the wrapping film (2052) is provided with a butt joint (2051), and the wrapping film (2052) is adhered and attached to the surface of the supporting plate (2053).

6. The enlarged wire bonding area semiconductor lead frame processing apparatus according to claim 4, wherein: The bottom of the top frame (201) is fixedly connected with a vibrating table (206), the top of the vibrating table (206) is provided with a vibrating driving source (2061), the output shaft of the vibrating driving source (2061) is fixedly connected with a driving gear (2062) penetrating through the vibrating table (206), the side parts of the driving gear (2062) are symmetrically and meshingly connected with driven gears (2063), the middle parts of the driven gears (2063) are rotatably connected with middle frames (2065), the middle frames (2065) are fixedly connected to the bottom of the vibrating table (206), the outer sides of the driven gears (2063) are eccentrically provided with movable columns (20631), the outer sides of the movable columns (20631) are sleeved with transmission sleeves (2072), the bottom of the transmission sleeve (2072) is fixedly connected with a connecting rod (2071), the bottom of the connecting rod (2071) is fixedly connected with a vibrating head (207), and the vibrating head (207) is movably arranged on the top surface of the arc-shaped plate (202) and used for impacting the arc-shaped plate (202) to generate vibration.

7. The enlarged wire bonding area semiconductor lead frame processing apparatus according to claim 4, wherein: The forming unit (3) further comprises a stepped groove (302) which is arranged on the side of the bottom mold (303) and surrounds the outer contour of the bottom mold (303), the bottom of the stepped groove (302) is provided with a plurality of elastic members (304), the stepped groove (302) is elastically connected with the outer frame sleeve (301) through the elastic members (304), and the top surface of the outer frame sleeve (301) is higher than the top surface of the upper mold (305).

8. The expanded wire bonding area semiconductor lead frame processing apparatus of claim 7, wherein: An opening is arranged on the top of the upper mold (305); The top of the upper mold (305) is provided with an inclined opening (3051), and the inside of the bottom mold (303) is provided with a supporting frame (306).

9. The enlarged wire bonding area semiconductor lead frame processing apparatus according to claim 4, wherein: The mobile unit (1) includes equipment frame (101), the top of equipment frame (101) is installed up and down control source (1011), the output shaft rotation of up and down control source (1011) is arranged on the surface of equipment frame (101), the surface of up and down control source (1011) is movably connected with moving block (1013), the middle part of moving block (1013) is transversely provided with transmission shaft two (1022), the middle part of transmission shaft two (1022) is movably connected with connecting plate (1023), the bottom of connecting plate (1023) is fixedly connected with top frame (201); The bottom of equipment frame (101) is installed with bottom control source (1032), the output shaft of bottom control source (1032) is fixedly connected with transmission shaft three (1031) after passing through equipment frame (101), the surface of transmission shaft three (1031) is movably connected with placing plate (103), bottom mold (303) is arranged in the recess on the surface of placing plate (103).

10. An enlarged bonding wire area semiconductor lead frame product, applied to the enlarged bonding wire area semiconductor lead frame processing apparatus of any one of claims 1-9, characterized in that, Include: The top of the pad (4) is provided with a convex area (401), the outer side of the pad (4) is wrapped with a special-shaped cup (402), the outer side of the bottom of the special-shaped cup (402) is symmetrically provided with a convex strip (403), the surface of the convex strip (403) is wrapped with a foot wrapping (405), and the middle part of the bottom of the special-shaped cup (402) is provided with an inner recess area (404).

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