Semiconductor packaging injection mold and injection molding method
By designing a transverse and rotation mechanism for semiconductor packaging injection molds, the residual injection plastic is automatically cut off, solving the problem of uncured resin dripping from inside the injection head, improving equipment cleanliness and mold precision, and achieving a highly efficient packaging injection process.
Patent Information
- Application Number
- CN202511284211.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-09
- Publication Date
- 2025-11-07
AI Technical Summary
In existing encapsulation injection molding machines, incompletely cured epoxy resin residue inside the injection head may continue to drip, leading to decreased mold precision and reduced product yield. The hard-to-remove cured residue also affects equipment cleanliness and operation.
A semiconductor packaging injection mold was designed, employing a transverse and rotation mechanism. The mold uses an automatic baffle to block the plastic residue and a rotating cutting blade to cut it off. Combined with a sponge block adsorption and a vibration mechanism to assist in demolding, it achieves automated cleaning and protection.
It effectively cuts off residual injection molding materials, prevents equipment contamination, improves process cleanliness and equipment stability, and ensures a clean operating environment and mold precision.
Smart Images
Figure CN120902185A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor processing, and particularly relates to a semiconductor packaging injection mold and an injection method. BACKGROUND
[0002] Semiconductor is a functional material with electrical conductivity between conductor and insulator, which forms integrated circuit chips through doping and micro-nano processing, and constitutes the core of modern electronic equipment. However, the bare chip itself is extremely fragile and is easily affected by mechanical impact and moisture erosion when exposed to the external environment, leading to failure. Therefore, it is necessary to provide physical protection, electrical interconnection and heat dissipation channels through packaging injection technology, and the packaging injection machine is needed in this process.
[0003] The existing packaging injection machine is composed of an injection table, a lower mold, an upper mold, a reset part, an injection hole, a cylinder, an injection head and an injector. The working principle is as follows: first, the semiconductor to be injected is placed in the lower mold, then the cylinder drives the injection head to move down, the initial state is that the injection head is not combined with the injection hole at the top end of the upper mold, which is designed to facilitate maintenance or replacement of the injection head, then the injection head moves down to combine with the injection hole and applies downward pressure to the upper mold, the upper mold moves down to combine with the lower mold to form a sealed chamber, at this time the injector works, the hot set epoxy resin based compound is injected into the sealed chamber through the injection head, the lower mold and the upper mold heat the hot set epoxy resin based compound, after the hot set epoxy resin based compound solidifies, the cylinder drives the injection head to move up to reset, the reset part drives the upper mold to reset to complete demolding, then the semiconductor after injection is taken out and modified, and the packaging injection process of the semiconductor is completed.
[0004] After injection, the injection head separates from the injection hole, and the unhardened epoxy resin remaining in the injection head may continue to drip. The dripping material enters the lower mold cavity through the injection hole, and after long-term accumulation, it forms hardened residues that are difficult to remove, affecting the mold precision and product yield. Therefore, the present application provides a semiconductor packaging injection mold and an injection method. SUMMARY
[0005] The purpose of the present application is to solve the problem of the injection head that the unhardened epoxy resin remaining in the injection head may continue to drip.
[0006] In a first aspect, the present application provides a semiconductor packaging injection mold, which comprises a lower mold mounted at the top end of an injection table, four groups of guide rods are fixedly connected at the top end of the injection table, a horizontal plate is slidably connected outside the four groups of guide rods, an upper mold is mounted inside the horizontal plate, an injection hole is formed at the top end of the upper mold, a compression spring one is fixedly connected between the horizontal plate and the injection table, a cylinder is mounted at the top end inside the injection table, and the semiconductor packaging injection mold further comprises: The connecting plate is in transmission connection with the output end of the cylinder, the bottom end of the connecting plate is fixedly connected with an injection head, and the injection head is connected with an external injection device; The baffle is in contact with the upper mold, and a cutting circular knife is arranged in the baffle, and a sprocket one is fixedly connected to the inner wall of the baffle and rotates with the baffle; The horizontal moving mechanism is connected with the baffle, and is used for driving the baffle to move when the connecting plate moves up and down, so that the shielding of the injection hole by the baffle is ended when the injection head moves downward. The rotating mechanism is used for driving the cutting circular knife to rotate when the baffle moves, and is connected with the sprocket one. The sponge block is arranged in the baffle, the sponge block is in contact with the cutting circular knife, and a sticking mechanism is arranged on the periphery of the sponge block and is used for fixing the position of the sponge block.
[0007] Optionally, the horizontal moving mechanism comprises a pressing plate, an inclined block, a side plate, two groups of limiting rods two, a fixed plate and a compression spring three, the pressing plate is fixedly connected to the outer side of the connecting plate, the inclined block is fixedly connected to the baffle, and the pressing plate is in contact with the inclined block, the side plate is fixedly connected to the bottom end of the baffle, the two groups of limiting rods two are fixedly connected to the outer side of the upper mold, and the limiting rods two penetrate through the side plate, the fixed plate is fixedly connected to one end of the limiting rods two away from the side plate, and the compression spring three is fixedly connected between the side plate and the fixed plate.
[0008] Optionally, the rotating mechanism comprises a concave plate, a sprocket two, a spur gear one, a rack one and a chain, the concave plate is fixedly connected to the baffle, the sprocket two is rotatably connected to the inner wall of the concave plate, the spur gear one is fixedly connected to the outer side of the sprocket two, the rack one is fixedly connected to the top end of the horizontal plate, the spur gear one is in engagement with the rack one, and the chain is in engagement with the outer sides of the sprocket one and the sprocket two.
[0009] Optionally, the sticking mechanism comprises two groups of magic tapes one and two groups of magic tapes two, the two groups of magic tapes one are fixedly connected to the inner wall of the baffle, the two groups of magic tapes two are fixedly connected to the sponge block, and each group of the magic tapes one and the magic tapes two are stuck together.
[0010] Optionally, the outer side of the upper mold is provided with a rack two, the bottom end of the rack two is provided with a rack three, the bottom end of the rack three is fixedly connected with a rolling ball, the outer side of the upper mold is fixedly connected with a vibrating plate, the rolling ball is in contact with the vibrating plate, the outer periphery of the horizontal plate is provided with a vibrating mechanism, the vibrating mechanism is used for driving the rolling ball to impact the vibrating plate when the horizontal plate moves upward, so that the upper mold vibrates, demolding is facilitated, and the rack two and the rack three are provided with an anti-jamming mechanism therebetween, which is used for ending the control of the vibrating mechanism on the rolling ball when the horizontal plate moves downward.
[0011] Optionally, the vibration mechanism comprises a driving assembly and a reset assembly, wherein the driving assembly comprises two groups of L plates, a transmission rod, a spur gear two, a rack four, and a third gear, the two groups of L plates are fixedly connected to the outer side of the horizontal plate, the transmission rod is rotationally connected between the two groups of L plates, the spur gear two is fixedly connected to the outer side of the transmission rod, the rack four is fixedly connected to the injection molding table, and the rack four is engaged with the spur gear two, the third gear is fixedly connected to the outer side of the transmission rod, and the third gear is engaged with the rack two, the reset assembly comprises a square plate, two groups of limiting rods three, a top plate, and a compression spring four, the square plate is fixedly connected to the outer side of the rack three, the two groups of limiting rods three penetrate through the square plate, the top plate is fixedly connected to the top end of the horizontal plate, the top plate is fixedly connected to the top end of the two groups of limiting rods three, and the compression spring four is fixedly connected between the top plate and the square plate.
[0012] Optionally, the anti-jamming mechanism comprises a fixed ring plate one, a clamping rod, a fixed ring plate two, and a compression spring five, the fixed ring plate one is fixedly connected to the outer side of the rack two, the clamping rod is slidingly connected in the inner part of the fixed ring plate one, the diameter of the clamping rod above the fixed ring plate one is larger than the diameter of the clamping rod below and in the inner part of the fixed ring plate one, the outer side and the top end of the fixed ring plate two are fixedly connected with the rack three and the clamping rod respectively, and the compression spring five is fixedly connected between the clamping rod and the fixed ring plate two.
[0013] Optionally, the rolling ball and the vibration plate are made of high chromium cast iron, and the model number is Cr15.
[0014] Optionally, the contact surface between the baffle and the upper mold is made of silicone rubber.
[0015] In the second aspect, the application provides a semiconductor packaging injection molding method applied to the semiconductor packaging injection mold in the first aspect, and the method comprises the following steps: S1, when the connecting plate moves downward, that is, the injection head performs injection molding on the injection molding hole, the connecting plate moves downward to drive the horizontal movement mechanism to operate, the horizontal movement mechanism drives the baffle to move at this time, and the movement of the baffle ends the shielding of the injection molding hole; S2, after the injection is completed, the connecting plate drives the injection head to move upward, and after moving to a certain distance, the control of the connecting plate on the horizontal movement mechanism is completed, the horizontal movement mechanism drives the baffle to reset, and when the baffle is reset, the injection molding hole is shielded again; S3, the cutting circular knife cuts off the epoxy resin-based compound at the wire drawing position along with the resetting of the baffle, so that the epoxy resin-based compound of the wire drawing is prevented from adhering to other components, and the shielding of the cutting circular knife also protects the injection molding hole, thereby preventing dust from entering.
[0016] Compared with the prior art, the application has at least one of the following beneficial technical effects: The application realizes the automatic opening and resetting of the baffle through the transverse mechanism during the butt joint and separation process of the injection head and the injection hole, and realizes the automatic opening and resetting of the baffle through the transverse mechanism. When resetting, cooperate with the cutting circular knife to effectively cut off the residual injection plastic wire, avoid pollution of the equipment and interference with the subsequent operation; at the same time, the baffle can close the injection hole in normal state, effectively isolate dust, and improve the process cleanliness and equipment stability.
[0017] Further through the structural design of the rotating mechanism, when the baffle is reset to automatically complete the shielding, the cutting circular knife is synchronously driven to rotate through the rotating structure, and the rotating cutting circular knife improves the effect and efficiency of cutting off the residual injection plastic wire; at the same time, the rotating force winds and collects the cut-off residues outside the circular knife, prevents them from splashing or falling to pollute the equipment area, and ensures the cleanliness of the operating environment. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 It is a schematic diagram of the overall structure of a semiconductor packaging injection mold; Figure 2 It is a schematic diagram of the partial section of the injection table; Figure 3 It is a schematic diagram of the section of the horizontal plate; Figure 4 It is a schematic diagram of the structure of the connecting plate and the injection head; Figure 5 It is a schematic diagram of the structure of the connecting plate and the injection head; Figure 4 Figure 6 It is a schematic diagram of the section of the baffle; Figure 7 It is a schematic diagram of the motion state of the baffle; Figure 8 It is a schematic diagram of the structure of the rack four; Figure 9 It is a schematic diagram of the structure of the spur gear two and the one-third gear; Figure 10 It is a schematic diagram of the structure of the ball and the vibration plate; Figure 11 It is a schematic diagram of the structure of the ball and the vibration plate; Figure 10
[0019] Mark No. : 1, injection molding platform; 2, lower mold; 3, guide rod; 4, cross plate; 5, upper mold; 6, injection hole; 7, compression spring one; 8, air cylinder; 9, connecting plate; 10, injection head; 13, baffle; 14, cutting round knife; 15, chain wheel one; 16, sponge block; 17, pressing plate; 18, inclined block; 19, side plate; 20, limiting rod two; 21, fixed plate; 22, compression spring three; 23, concave plate; 24, chain wheel two; 25, spur gear one; 26, rack one; 27, chain; 28, magic tape one; 29, magic tape two; 30, rack two; 31, rack three; 32, rolling ball; 33, vibrating plate; 34, L plate; 35, transmission rod; 36, spur gear two; 37, rack four; 38, one-third gear; 39, square plate; 40, limiting rod three; 41, top plate; 42, compression spring four; 43, fixed ring plate one; 44, clamping rod; 45, fixed ring plate two; 46, compression spring five. DETAILED DESCRIPTION
[0020] In order to make the inventive purposes, features and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings of the embodiments of the present application. Obviously, the embodiments described below are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0021] In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there can be a component disposed therebetween.
[0022] The technical solutions of the present application will be further described below in conjunction with the drawings and through specific embodiments.
[0023] As Figure 1 , Figure 2 and Figure 3As shown, the present invention proposes a semiconductor packaging injection mold, including a lower mold 2 installed at the top of an injection molding platform 1. First, the semiconductor to be injection molded is placed inside the lower mold 2. Four sets of guide rods 3 are fixedly connected to the top of the injection molding platform 1. A horizontal plate 4 is slidably connected to the outer side of the four sets of guide rods 3. The horizontal plate 4 can move stably along the outer side of the guide rods 3 to avoid positional displacement. An upper mold 5 is installed inside the horizontal plate 4. When the upper mold 5 and the lower mold 2 are in contact, a sealed cavity is formed. An injection hole 6 is opened at the top of the upper mold 5, through which the semiconductor can be packaged. Injection molding is performed inside the upper mold 5. A compression spring 7 is fixed between the horizontal plate 4 and the injection table 1. A cylinder 8 is installed at the top of the injection table 1, and a connecting plate 9 is connected to the output end of the cylinder 8. An injection head 10 is fixed to the bottom of the connecting plate 9. When the cylinder 8 runs, it drives the injection head 10 to move downward through the connecting plate 9. In the initial state, the injection head 10 is not in contact with the injection hole 6 at the top of the upper mold 5, which is intended to facilitate maintenance or replacement of the injection head 10. Subsequently, the injection head 10 moves downward to contact the injection hole 6 and applies downward pressure to the upper mold 5. As mold 5 moves downward, it causes horizontal plate 4 to move downward as well. At this time, horizontal plate 4 moves downward along guide rod 3, causing upper mold 5 to fit against lower mold 2, forming a sealed chamber. As horizontal plate 4 moves downward, it compresses spring 7, causing spring 7 to deform and generate elastic potential energy. Injection head 10 is connected to an external injection molding machine, which then operates (external injection molding machines are existing and mature technology, and will not be elaborated further). Through injection head 10, thermosetting epoxy resin-based compounds are injected into the sealed chamber. Lower mold 2 and upper mold 5 then react with the thermosetting epoxy resin. The epoxy resin-based compound is heated. The heating functions of the lower mold 2 and the upper mold 5 are common knowledge in the existing injection molding process and will not be elaborated further. After the thermosetting epoxy resin-based compound solidifies, the cylinder 8 drives the injection head 10 to move upward and reset through the connecting plate 9. The injection head 10 then stops pressing on the upper mold 5, and the compression spring 7 releases its elastic potential energy. The upper mold 5 is reset through the horizontal plate 4 to complete the demolding. Then the injection-molded semiconductor is taken out and modified to complete the semiconductor encapsulation injection molding process.
[0024] As one implementation method, such as Figure 4 - Figure 7As shown, the baffle 13 in the embodiment is attached to the upper mold 5, and in the initial state, the baffle 13 shields the injection hole 6 at the top end of the upper mold 5. The baffle 13 is internally provided with a cutting circular knife 14, and the cutting circular knife 14 is internally fixedly connected with a sprocket wheel one 15 that is rotationally connected with the inner wall of the baffle 13. The cutting circular knife 14 can rotate along the inside of the baffle 13 through the sprocket wheel one 15. The transverse moving mechanism is connected with the baffle 13, and when the connecting plate 9 moves up and down, the baffle 13 is driven to move, so that when the injection head 10 moves down, the shielding of the baffle 13 to the injection hole 6 ends. When the connecting plate 9 moves down, that is, the injection head 10 performs injection molding on the injection hole 6, the connecting plate 9 moving down will drive the transverse moving mechanism to operate, and the transverse moving mechanism will drive the baffle 13 to move at this time, and the baffle 13 moving will end the shielding of the injection hole 6 (as shown in Figure 7 During the movement of the injection head 10, the injection head 10 will not touch the baffle 13. After the injection is completed, the connecting plate 9 drives the injection head 10 to move up, and after moving up to a certain distance, the control of the connecting plate 9 to the transverse moving mechanism ends, and the transverse moving mechanism drives the baffle 13 to reset. When the baffle 13 resets, the injection hole 6 is shielded again. After the injection head 10 ends the injection and moves up, the epoxy resin-based compound may be pulled into a filament, and the cutting circular knife 14 resets with the baffle 13, so that the cutting circular knife 14 can cut the epoxy resin-based compound filament, avoiding the epoxy resin-based compound filament adhering to other components. The shielding of the cutting circular knife 14 can also protect the injection hole 6 from dust.
[0025] Further, as shown in Figure 4 and Figure 5 The embodiment further includes a rotating mechanism connected with the sprocket wheel one 15 for driving the cutting circular knife 14 to rotate when the baffle 13 moves. When the baffle 13 moves, the rotating mechanism operates synchronously with the movement of the baffle 13, and the operation of the rotating mechanism drives the sprocket wheel one 15 to rotate, and the sprocket wheel one 15 rotating in turn drives the cutting circular knife 14 to rotate. At this time, when the cutting circular knife 14 cuts the epoxy resin-based compound filament, the cutting effect is better in cooperation with the rotation of the cutting circular knife 14 itself. At the same time, the rotation of the cutting circular knife 14 can also wind the excess epoxy resin-based compound outside the cutting circular knife 14, thereby avoiding the additional pollution caused by the epoxy resin-based compound.
[0026] Further, as shown in Figure 6As shown in the drawings, the embodiment also includes a sponge block 16 arranged inside the baffle 13, which is attached to the cutting circular knife 14 and rotates with the cutting circular knife 14. The sponge block 16 can adsorb the epoxy resin-based compound wound on the surface of the cutting circular knife 14. The sponge block 16 is provided with a sticking mechanism on the periphery, which is used to fix the position of the sponge block 16, and the sticking mechanism can quickly disassemble and assemble the sponge block 16, facilitating the disassembly and cleaning of the sponge block 16.
[0027] As an embodiment, as shown in Figure 4 and Figure 7 , the horizontal moving mechanism includes a pressing plate 17, an inclined block 18, a side plate 19, two sets of limiting rods 20, a fixed plate 21 and a compression spring 22. The horizontal moving mechanism is described in detail as follows: The pressing plate 17 is fixedly connected to the outer side of the connecting plate 9. When the connecting plate 9 moves downward, the pressing plate 17 moves downward synchronously. The inclined block 18 is fixedly connected to the baffle 13, and the pressing plate 17 is attached to the inclined block 18. When the pressing plate 17 moves downward, the inclined surface of the inclined block 18 is pressed. At this time, the inclined block 18 is forced to move, which drives the baffle 13 to move. When the baffle 13 moves, the baffle 13 ends the shielding of the injection hole 6, and the injection head 10 can smoothly perform the injection work. The side plate 19 is fixedly connected to the bottom end of the baffle 13. When the baffle 13 moves, the baffle 13 also drives the side plate 19 to move. The two sets of limiting rods 20 are fixedly connected to the outer side of the upper mold 5, and the limiting rods 20 penetrate through the side plate 19. The fixed plate 21 is fixedly connected to one end of the limiting rods 20 away from the side plate 19. The compression spring 22 is fixedly connected between the side plate 19 and the fixed plate 21. At this time, the side plate 19 presses the compression spring 22 along the limiting rods 20. When the compression spring 22 is forced, it deforms and generates elastic potential energy. When the injection work of the injection head 10 is completed, the connecting plate 9 drives the pressing plate 17 to move upward. During the movement, the pressing plate 17 is separated from the pressing of the inclined block 18. The compression spring 22 releases the elastic potential energy and pushes the side plate 19 to reset. When the side plate 19 resets, it drives the baffle 13 to shield the injection hole 6 again, which protects the injection hole 6 and enables the cutting circular knife 14 to cut the epoxy resin-based compound.
[0028] Further, as shown in Figure 4 and Figure 5 , the rotating mechanism includes a concave plate 23, a chain wheel 24, a spur gear 25, a rack 26 and a chain 27. The rotating mechanism is described in detail as follows: The concave plate 23 is fixedly connected with the baffle 13, when the baffle 13 moves, the baffle 13 will drive the concave plate 23 to move synchronously, the chain wheel two 24 is rotatably connected to the inner wall of the concave plate 23, the spur gear one 25 is fixedly connected to the outer side of the chain wheel two 24, and the concave plate 23 moves and drives the spur gear one 25 to move through the chain wheel two 24, the rack one 26 is fixedly connected to the top end of the horizontal plate 4, and the spur gear one 25 is engaged with the rack one 26, when the spur gear one 25 moves, because the position of the rack one 26 is fixed, the spur gear one 25 will rotate along the rack one 26, the chain 27 is engaged with the outer sides of the chain wheel one 15 and the chain wheel two 24, the spur gear one 25 rotates and drives the chain wheel one 15 to rotate through the chain 27, and the chain wheel one 15 rotates and finally drives the cutting circular knife 14 to rotate, so that the epoxy resin-based compound is cut and rotated.
[0029] Further, as shown in the drawings, Figure 6 The sticking mechanism comprises two groups of magic stickers one 28 and two groups of magic stickers two 29, and the sticking mechanism will be specifically explained as follows: The two groups of magic stickers one 28 are fixedly connected with the inner wall of the baffle 13, the two groups of magic stickers two 29 are fixedly connected with the sponge block 16, each group of magic stickers one 28 and magic stickers two 29 are stuck together, the magic stickers two 29 on the outer side of the sponge block 16 are stuck with the magic stickers one 28, the sponge block 16 can be quickly installed in the interior of the baffle 13, when the sponge block 16 is disassembled, the sponge block 16 is pulled with force, the sponge block 16 drives the magic stickers two 29 to separate from the magic stickers one 28, and the sponge block 16 can be quickly disassembled.
[0030] As an embodiment, as shown in the drawings, Figure 8 - Figure 11As shown, the outer side of the upper mold 5 is provided with a rack two 30, the bottom end of the rack two 30 is provided with a rack three 31, the bottom end of the rack three 31 is fixedly connected with a rolling ball 32, the outer side of the upper mold 5 is fixedly connected with a vibrating plate 33, the rolling ball 32 is attached to the vibrating plate 33, in the initial state, the limit distance of the rolling ball 32 downward movement slightly extrudes the vibrating plate 33, the outer periphery of the horizontal plate 4 is provided with a vibrating mechanism, the vibrating mechanism is used to drive the rolling ball 32 to impact the vibrating plate 33 when the horizontal plate 4 moves upward, so that the upper mold 5 vibrates, facilitating demolding, when the upper mold 5 and the lower mold 2 can complete injection molding, the horizontal plate 4 drives the upper mold 5 to move upward, and when the horizontal plate 4 moves upward, the vibrating mechanism operates, when the vibrating mechanism operates, the rack two 30 and the rack three 31 move upward to a specified distance, the specified distance is determined according to the actual situation, the vibrating mechanism drives the rack three 31 to move downward rapidly, when the rack three 31 moves downward, the rolling ball 32 impacts the vibrating plate 33, and the vibrating plate 33 vibrates under the force, thereby driving the entire upper mold 5 to vibrate, and the vibration of the upper mold 5 can realize vibration demolding, which assists the demolding of the upper mold 5, avoids the situation that the inner wall of the upper mold 5 and the workpiece are rubbed and the adhesion is too large to be demolded, the rack two 30 and the rack three 31 are provided with an anti-jamming mechanism, which is used to end the control of the vibrating mechanism on the rolling ball 32 when the horizontal plate 4 moves downward, when the horizontal plate 4 moves downward, because the rolling ball 32 is in the limit distance of downward movement in the initial state, with the operation of the vibrating mechanism, the anti-jamming mechanism operates, the anti-jamming mechanism can make the rack two 30 move downward a distance under the control of the vibrating mechanism on the rack two 30, it should be noted that there is a certain activity space between the rack two 30 and the rack three 31, each time the vibrating mechanism can only control the rack two 30 to move downward a distance, and then the control ends, and then the rack two 30 is controlled to move downward a distance, thereby repeating the above actions, avoiding the situation that the rolling ball 32 cannot move downward, and the vibrating mechanism continuously drives the rack two 30 to move downward, causing jamming.
[0031] Further, as shown in Figure 9 、 Figure 10 and Figure 11 , the vibrating mechanism includes a driving assembly and a reset assembly, which will be described below: The driving assembly comprises two sets of L plates 34, a transmission rod 35, a spur gear two 36, a rack four 37, a one-third gear 38, the two sets of L plates 34 are fixedly connected to the outer side of the horizontal plate 4, the transmission rod 35 is rotationally connected between the two sets of L plates 34, the L plates 34 support the transmission rod 35, the spur gear two 36 is fixedly connected to the outer side of the transmission rod 35, when the horizontal plate 4 moves, the spur gear two 36 is driven to move by the L plates 34 and the transmission rod 35, the rack four 37 is fixedly connected to the injection molding table 1 and is engaged with the spur gear two 36, when the horizontal plate 4 drives the upper mold 5 to move upward to be demolded, the spur gear two 36 moves along the outer side of the rack four 37, because the position of the rack four 37 is fixed, the spur gear two 36 rotates, the one-third gear 38 is fixedly connected to the outer side of the transmission rod 35, and the rotation of the spur gear two 36 drives the one-third gear 38 to rotate through the transmission rod 35, the one-third gear 38 is engaged with the rack two 30, and the rotation of the one-third gear 38 drives the rack two 30 to move upward, the rack two 30 moves upward and drives the rack three 31 to move upward through the anti-jamming mechanism, the rack three 31 moves upward and drives the rolling ball 32 to separate from the vibration plate 33, the reset assembly comprises a square plate 39, two sets of limiting rods three 40, a top plate 41 and a compression spring four 42, the square plate 39 is fixedly connected to the outer side of the rack three 31, and when the rack three 31 moves, the rack three 31 also drives the square plate 39 to move upward, then the one-third gear 38 is engaged with the rack three 31 moving upward, and the rack three 31 continues to move upward through rotation, the two sets of limiting rods three 40 penetrate the square plate 39, the top plate 41 is fixedly connected to the top end of the horizontal plate 4, the top plate 41 is fixedly connected to the top ends of the two sets of limiting rods three 40, the compression spring four 42 is fixedly connected between the top plate 41 and the square plate 39, and the square plate 39 moves upward and is pressed against the compression spring four 42 through the top plate 41, so that the compression spring four 42 is deformed under stress and generates elastic potential energy, when the one-third gear 38 rotates for a certain number of turns, the one-third gear 38 is disengaged from the engagement with the rack three 31, the compression spring four 42 releases the elastic potential energy, thereby pushing the rack three 31 to quickly move downward through the square plate 39, the rack three 31 moves downward and drives the rolling ball 32 to quickly impact the vibration plate 33, so that the vibration plate 33 drives the upper mold 5 to generate a vibration force, then the one-third gear 38 rotates again to be engaged with the rack two 30, thereby repeating the above actions to realize the function of intermittently generating a vibration force of the upper mold 5.
[0032] Further, as shown in Figure 10 and Figure 11 The anti-jamming mechanism comprises a fixed ring plate one 43, a clamping rod 44, a fixed ring plate two 45 and a compression spring five 46, which will be specifically described below. In the initial state, the rack two 30 is in engagement with the third gear 38, and the fixed ring plate one 43 is fixed to the outside of the rack two 30. When the horizontal plate 4 moves downward, the horizontal plate 4 drives the third gear 38 to move downward synchronously. At this time, the third gear 38 rotates clockwise as viewed from the perspective, and a group of protruding positions on the outside of the third gear 38 press the rack two 30. The clamping rod 44 is slidingly connected to the inside of the fixed ring plate one 43. The rack two 30 is forced to move the fixed ring plate one 43 downward. The fixed ring plate one 43 moves along the inside of the clamping rod 44. The diameter of the clamping rod 44 above the fixed ring plate one 43 is greater than the diameter of the clamping rod 44 below and inside the fixed ring plate one 43. The outside and top end of the fixed ring plate two 45 are fixed to the rack three 31 and the clamping rod 44, respectively. The compression spring five 46 is fixed between the clamping rod 44 and the fixed ring plate two 45. When the fixed ring plate one 43 moves, the fixed ring plate one 43 also presses the compression spring five 46, causing the compression spring five 46 to deform under stress and generate elastic potential energy. After the group of protruding positions on the third gear 38 stop pressing the rack two 30, the compression spring five 46 quickly releases the elastic potential energy, pushing the rack two 30 upward to reset through the fixed ring plate one 43. Then, the third gear 38 rotates, and the protruding positions on the outside of the third gear 38 press the rack two 30 again. The rack two 30 repeats the above actions. However, when the horizontal plate 4 moves upward, the third gear 38 rotates counterclockwise as viewed from the perspective. The third gear 38 drives the rack two 30 to move upward. The rack two 30 drives the fixed ring plate one 43 to move upward. Since the diameter of the clamping rod 44 above the fixed ring plate one 43 is greater than the diameter of the clamping rod 44 below and inside the fixed ring plate one 43, the fixed ring plate one 43 drives the fixed ring plate two 45 to move upward through the clamping rod 44. The fixed ring plate two 45 drives the rack three 31 to move upward, causing the rack three 31 to engage with the third gear 38. The rack three 31 drives the rolling ball 32 to move upward, finally achieving the function of the rolling ball 32 moving upward to reset and impact the vibration plate 33. Figure 11 Figure 11
[0033] In addition, as shown in Figure 10 , the rolling ball 32 and the vibration plate 33 are made of high-chromium cast iron material, model Cr15, with good wear resistance, suitable for the scene that needs frequent impact in this embodiment.
[0034] In addition, as shown in Figure 7 , the contact surface between the baffle 13 and the upper mold 5 is made of silicone rubber material, with good sealing performance, which can effectively prevent dust from entering.
[0035] A semiconductor packaging injection molding method, the method comprising the following steps: S1: When the connecting plate 9 moves down, that is, the injection head 10 performs injection molding on the injection hole 6, the connecting plate 9 moves down to drive the horizontal moving mechanism to move, which drives the baffle 13 to move, thereby ending the shielding of the injection hole 6; S2: After the injection is completed, the connecting plate 9 drives the injection head 10 to move up, and after moving up to a certain distance, the control of the connecting plate 9 on the horizontal moving mechanism is completed, which drives the baffle 13 to reset, and when the baffle 13 resets, the injection hole 6 is shielded again; S3: The cutting circular knife 14 cuts off the epoxy resin-based compound at the place where the epoxy resin-based compound is drawn, avoiding the epoxy resin-based compound drawn to other parts, and the shielding of the cutting circular knife 14 also protects the injection hole 6 from dust.
[0036] In this embodiment, first, the semiconductor to be injection molded is placed in the lower mold 2, and the cylinder 8 drives the injection head 10 to move down through the connecting plate 9. In the initial state, the injection head 10 is not attached to the injection hole 6 at the top of the upper mold 5, which is designed to facilitate maintenance or replacement of the injection head 10. Then, the injection head 10 moves down to attach to the injection hole 6 and exerts downward pressure on the upper mold 5. The upper mold 5 moves down to drive the horizontal plate 4 to move down. At this time, the horizontal plate 4 moves down along the guide rod 3, so that the upper mold 5 is attached to the lower mold 2 to form a sealed chamber. When the horizontal plate 4 moves down, it will compress the compression spring 1 to deform and generate elastic potential energy. Then, the external injection device works to inject the thermosetting epoxy resin-based compound into the sealed chamber through the injection head 10. The lower mold 2 and the upper mold 5 heat the thermosetting epoxy resin-based compound. After the thermosetting epoxy resin-based compound solidifies, the cylinder 8 drives the injection head 10 to move up and reset through the connecting plate 9. The injection head 10 ends the extrusion of the upper mold 5. The compression spring 1 releases the elastic potential energy, and the upper mold 5 is reset through the horizontal plate 4 to complete demolding. Then, the injection-molded semiconductor is taken out and modified, and the packaging and injection molding process of the semiconductor is completed. In the initial state, the baffle 13 shields the injection hole 6 at the top end of the upper mold 5, when the connecting plate 9 moves downward, the pressing plate 17 moves downward synchronously, and the pressing plate 17 moves downward to press the inclined surface of the inclined block 18, and the inclined block 18 is forced to move the baffle 13, and the baffle 13 moves to end the shielding of the injection hole 6, and the injection head 10 can smoothly perform the injection operation, and when the baffle 13 moves, the baffle 13 also drives the side plate 19 to move, the side plate 19 is pressed and compressed by the limiting rod two 20, the compression spring three 22 is deformed and generates elastic potential energy, and when the injection head 10 injection is completed, the connecting plate 9 drives the pressing plate 17 to move upward, the pressing plate 17 is separated from the inclined block 18, the compression spring three 22 releases the elastic potential energy, pushes the side plate 19 to reset, and the side plate 19 resets to shield the injection hole 6 again, and the cutting circular knife 14 cuts the epoxy resin-based compound for cutting operation; When the baffle 13 moves, the baffle 13 moves synchronously with the concave plate 23, and the concave plate 23 moves to drive the spur gear one 25 through the chain wheel two 24, and when the spur gear one 25 moves, the spur gear one 25 rotates along the rack one 26 because the position of the rack one 26 is fixed, and the spur gear one 25 rotates to drive the chain wheel one 15 through the chain 27, and the chain wheel one 15 rotates to finally drive the cutting circular knife 14 to rotate, so as to rotate and cut the epoxy resin-based compound, and when the cutting circular knife 14 rotates, the cutting circular knife 14 rotates with the sponge block 16, and the sponge block 16 can adsorb the epoxy resin-based compound wound on the surface of the cutting circular knife 14, and the magic tape two 29 on the outside of the sponge block 16 is pasted with the magic tape one 28, so that the sponge block 16 can be quickly installed in the inside of the baffle 13, and when the sponge block 16 is disassembled, the sponge block 16 is pulled to separate the magic tape two 29 from the magic tape one 28, so that the sponge block 16 can be quickly disassembled; In the initial state, the limit distance of the ball 32 downwardly extruding the vibration plate 33, the horizontal plate 4 in the movement, will drive the spur gear two 36 through the L plate 34 and the transmission rod 35, when the horizontal plate 4 drives the upper die 5 upwardly to demould, the spur gear two 36 will move along the outside of the rack four 37, because the position of the rack four 37 is fixed, the spur gear two 36 will rotate, and the spur gear two 36 rotates will drive the third gear 38 to rotate through the transmission rod 35, and the third gear 38 rotates will drive the rack two 30 to move upwardly, the rack two 30 moves upwardly will drive the fixed ring plate one 43 to move upwardly, because the diameter of the clamping rod 44 above the fixed ring plate one 43 is greater than the diameter below and inside the fixed ring plate one 43, the fixed ring plate one 43 will drive the fixed ring plate two 45 to move upwardly through the clamping rod 44, and the fixed ring plate two 45 moves upwardly will drive the rack three 31 to move upwardly, so that the rack three 31 is engaged with the third gear 38, the third gear 38 rotates will drive the rack three 31 to move upwardly, the rack three 31 moves upwardly will drive the ball 32 to separate from the vibration plate 33, and when the rack three 31 moves, the rack three 31 will also drive the square plate 39 to move upwardly, and the square plate 39 moves upwardly will extrude the compression spring four 42 in cooperation with the top plate 41, so that the compression spring four 42 is deformed under the force and generates elastic potential energy, when the third gear 38 rotates a certain number of turns, the third gear 38 is disengaged from the engagement with the rack three 31, the compression spring four 42 will release the elastic potential energy, so as to push the rack three 31 to move downwardly quickly through the square plate 39, the rack three 31 moves downwardly will drive the ball 32 to hit the vibration plate 33 quickly, so that the vibration plate 33 drives the upper die 5 to generate vibration force, and then the third gear 38 rotates again to engage with the rack two 30, so as to repeat the above-mentioned actions, so as to realize the function of the upper die 5 to generate vibration force intermittently, and when the horizontal plate 4 moves downwardly, the horizontal plate 4 will drive the third gear 38 to move downwardly synchronously, and the third gear 38 rotates clockwise at this time, a group of protruding positions on the outside of the third gear 38 will extrude the rack two 30, the rack two 30 is forced to move downwardly, and the fixed ring plate one 43 moves downwardly will move along the inside of the clamping rod 44, and when the fixed ring plate one 43 moves, the fixed ring plate one 43 will also extrude the compression spring five 46, so that the compression spring five 46 is deformed under the force and generates elastic potential energy, after a group of protruding positions on the third gear 38 end the extrusion of the rack two 30, the compression spring five 46 will release the elastic potential energy quickly, so as to push the rack two 30 to move upwardly through the fixed ring plate one 43, and then the third gear 38 rotates, the protruding positions on the outside of the third gear 38 will again extrude the rack two 30, and the rack two 30 repeats the above-mentioned actions, so as to avoid the ball 32 unable to move downwardly, and the vibration mechanism continuously drives the rack two 30 to move downwardly, so as to avoid the situation of jamming.
[0037] The above-described embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalent replacements; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A semiconductor packaging injection mold, comprising a lower mold (2) mounted on the top of an injection molding platform (1), four sets of guide rods (3) fixedly connected to the top of the injection molding platform (1), a horizontal plate (4) slidably connected to the outer side of the four sets of guide rods (3), an upper mold (5) installed inside the horizontal plate (4), an injection hole (6) opened at the top of the upper mold (5), a compression spring (7) fixedly connected between the horizontal plate (4) and the injection molding platform (1), and a cylinder (8) installed at the top of the inside of the injection molding platform (1), characterized in that, Also include: The connecting plate (9) is fixedly connected with the output end of the cylinder (8), the bottom end of the connecting plate (9) is fixedly connected with the injection head (10), and the injection head (10) is connected with the external injection device; The baffle (13) is attached to the upper mold (5), the inside of the baffle (13) is provided with a cutting circular knife (14), and the inside of the cutting circular knife (14) is fixedly connected with a sprocket one (15) rotatably connected with the inner wall of the baffle (13); The horizontal moving mechanism is connected with the baffle (13), which is used for driving the baffle (13) to move when the connecting plate (9) moves up and down, so that the shielding of the injection hole (6) by the baffle (13) ends when the injection head (10) moves down; The rotating mechanism is used for driving the cutting circular knife (14) to rotate when the baffle (13) moves, and is connected with the sprocket one (15); The sponge block (16) is arranged in the baffle (13), the sponge block (16) is attached to the cutting circular knife (14), and the sponge block (16) is provided with a sticking mechanism on the periphery, which is used for fixing the position of the sponge block (16).
2. The semiconductor package injection mold according to claim 1, wherein, The horizontal moving mechanism includes a pressing plate (17), an inclined block (18), a side plate (19), two groups of limiting rods two (20), a fixed plate (21) and a compression spring three (22), the pressing plate (17) is fixedly connected to the outside of the connecting plate (9), the inclined block (18) is fixedly connected with the baffle (13), and the pressing plate (17) is attached to the inclined block (18), the side plate (19) is fixedly connected with the bottom end of the baffle (13), two groups of the limiting rods two (20) are fixedly connected with the outside of the upper mold (5), and the limiting rods two (20) penetrate through the side plate (19), the fixed plate (21) is fixedly connected to one end of the limiting rods two (20) away from the side plate (19), and the compression spring three (22) is fixedly connected between the side plate (19) and the fixed plate (21).
3. The semiconductor package injection mold of claim 1, wherein, The rotating mechanism includes a concave plate (23), a sprocket two (24), a spur gear one (25), a rack one (26) and a chain (27), the concave plate (23) is fixedly connected with the baffle (13), the sprocket two (24) is rotatably connected to the inner wall of the concave plate (23), the spur gear one (25) is fixedly connected to the outside of the sprocket two (24), the rack one (26) is fixedly connected to the top end of the horizontal plate (4), and the spur gear one (25) is engaged with the rack one (26), and the chain (27) is engaged with the outside of the sprocket one (15) and the sprocket two (24).
4. The semiconductor package injection mold of claim 1, wherein, The sticking mechanism includes two groups of magic tape one (28) and two groups of magic tape two (29), two groups of the magic tape one (28) are fixedly connected with the inner wall of the baffle (13), two groups of the magic tape two (29) are fixedly connected with the sponge block (16), and each group of the magic tape one (28) and the magic tape two (29) are stuck together.
5. The semiconductor package injection mold of claim 1, wherein, The outer side of the upper mold (5) is provided with a rack two (30), the bottom end of the rack two (30) is provided with a rack three (31), the bottom end of the rack three (31) is fixedly connected with a rolling ball (32), the outer side of the upper mold (5) is fixedly connected with a vibrating plate (33), the rolling ball (32) is attached to the vibrating plate (33), the outer periphery of the transverse plate (4) is provided with a vibrating mechanism, the vibrating mechanism is used for driving the rolling ball (32) to impact the vibrating plate (33) when the transverse plate (4) moves upwards, so that the upper mold (5) vibrates, facilitating demolding, and the anti-jamming mechanism is arranged between the rack two (30) and the rack three (31), which is used for ending the control of the vibrating mechanism on the rolling ball (32) when the transverse plate (4) moves downwards.
6. The semiconductor package injection mold of claim 5, wherein, The vibrating mechanism comprises a driving assembly and a reset assembly, wherein the driving assembly comprises two groups of L plates (34), a transmission rod (35), a spur gear two (36), a rack four (37) and a one-third gear (38), the two groups of L plates (34) are fixedly connected with the outer side of the transverse plate (4), the transmission rod (35) is rotatably connected between the two groups of L plates (34), the spur gear two (36) is fixedly connected to the outer side of the transmission rod (35), the rack four (37) is fixedly connected with the injection molding table (1), and the rack four (37) is engaged with the spur gear two (36), the one-third gear (38) is fixedly connected to the outer side of the transmission rod (35), and the one-third gear (38) is engaged with the rack two (30), the reset assembly comprises a square plate (39), two groups of limiting rods three (40), a top plate (41) and a compression spring four (42), the square plate (39) is fixedly connected to the outer side of the rack three (31), the two groups of limiting rods three (40) penetrate through the square plate (39), the top plate (41) is fixedly connected to the top end of the transverse plate (4), the top plate (41) is fixedly connected with the top ends of the two groups of limiting rods three (40), and the compression spring four (42) is fixedly connected between the top plate (41) and the square plate (39).
7. The semiconductor package injection mold of claim 5, wherein, The anti-jamming mechanism comprises a fixed ring plate one (43), a clamping rod (44), a fixed ring plate two (45) and a compression spring five (46), the fixed ring plate one (43) is fixedly connected to the outer side of the rack two (30), the clamping rod (44) is slidingly connected in the inner part of the fixed ring plate one (43), the diameter of the clamping rod (44) above the fixed ring plate one (43) is greater than that below and in the inner part of the fixed ring plate one (43), the outer side and the top end of the fixed ring plate two (45) are fixedly connected with the rack three (31) and the clamping rod (44) respectively, and the compression spring five (46) is fixedly connected between the clamping rod (44) and the fixed ring plate two (45).
8. The semiconductor package injection mold of claim 5, wherein, The rolling ball (32) and the vibrating plate (33) are made of high-chromium cast iron material, and the model is Cr15.
9. The semiconductor package injection mold of claim 1, wherein, The contact surface of the baffle (13) and the upper mold (5) is made of silicone rubber material.
10. A semiconductor package injection molding method applied to the semiconductor package injection molding mold according to any one of claims 1-9, characterized in that, The method comprises the following steps: S1, when the connecting plate (9) is lowered, that is, the injection head (10) is injected into the injection hole (6), the connecting plate (9) will drive the horizontal moving mechanism to operate, which will drive the baffle (13) to move, and the movement of the baffle (13) will end the shielding of the injection hole (6); S2, after the injection is completed, the connecting plate (9) drives the injection head (10) to move upwards, and after moving to a certain distance, the control of the connecting plate (9) on the horizontal moving mechanism is ended, which will drive the baffle (13) to reset, and when the baffle (13) is reset, the injection hole (6) will be shielded again; S3, the cutting circular knife (14) cuts off the epoxy resin-based compound at the place where the epoxy resin-based compound is drawn, which avoids the epoxy resin-based compound from being attached to other parts, and the shielding of the cutting circular knife (14) also plays a protective role for the injection hole (6), which avoids the entry of dust.