Ultrasonic three-dimensional imaging method, device and equipment for tissue evaluation of closing resistor disc and storage medium

Abstract

The invention discloses an ultrasonic three-dimensional imaging method, device and equipment for tissue evaluation of a closing resistor disc and a medium, and relates to the technical field of ultrasonic nondestructive testing. The method comprises the following steps: performing ultrasonic C scanning on a target closing resistor disc to obtain a to-be-processed A scanning signal set of the target closing resistor disc; preprocessing the A scanning signal set to be processed to obtain preprocessed data; identifying the positions of interface waves and bottom surface waves, and determining an effective detection area in the closing resistor disc; storing the section image with the specified depth as a layered TIFF picture; imaging the sound velocity distribution information, and storing the sound velocity distribution information as a sound velocity distribution TIFF picture; and fusing the layered TIFF picture and the sound velocity distribution TIFF picture to generate a three-dimensional image which reflects the internal organization and sound velocity attributes of the closing resistor disc and is used for organization evaluation. According to the method, the uniformity of the internal structure of the closing resistor disc can be effectively evaluated, and the defects of the closing resistor disc can be timely and accurately found.

Description

Technical Field

[0001] This invention relates to the field of ultrasonic nondestructive testing technology, and in particular to an ultrasonic three-dimensional imaging method, apparatus, equipment, and storage medium for evaluating the structure of a closed resistor sheet. Background Technology

[0002] With the rapid development of ultra-high voltage and extra-high voltage power transmission, gas-insulated switchgear (GIS), hybrid gas-insulated switchgear (HGIS), and tank-type circuit breakers equipped with closing resistors are widely used. Closing resistors are used in these devices to limit closing overvoltage and inrush current. Due to the special internal structure and complex mechanism of the circuit breaker closing resistor, its operational reliability is not ideal. Therefore, there is an urgent need for a complete and effective inspection and testing method for the closing resistor element. Summary of the Invention

[0003] The technical problem to be solved by the present invention is how to provide a method and apparatus that can effectively evaluate the uniformity of the internal structure of the closing resistor.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: an ultrasonic three-dimensional imaging method for evaluating the structure of a closing resistor sheet, comprising the following steps:

[0005] An ultrasonic C-scan is performed on the target closing resistor to obtain the set of A-scan signals to be processed from the target closing resistor.

[0006] The A-scan signal set to be processed is preprocessed to obtain preprocessed data;

[0007] Based on the preprocessed data, all A-scan signal sets are traversed to identify the positions of interface waves and bottom waves, and to determine the effective detection area inside the closing resistor.

[0008] Extract the data within the determined effective detection area, reconstruct it into three-dimensional volume data, and save the cross-sectional image at a specified depth as a layered TIFF image;

[0009] Based on the identified positions of the interface wave and bottom wave, the sound velocity distribution inside the closing resistor is calculated, and the sound velocity distribution information is imaged and saved as a sound velocity distribution TIFF image.

[0010] By fusing layered TIFF images with sound velocity distribution TIFF images, a three-dimensional image reflecting the internal structure and sound velocity properties of the closing resistor is generated for structure evaluation.

[0011] The application further discloses a three-dimensional ultrasonic imaging device for closing resistor sheet structure evaluation.

[0012] The data acquisition module is used for performing ultrasonic C scanning on the target closing resistor sheet to obtain a set of A-scan signals of the target closing resistor sheet to be processed.

[0013] The data preprocessing module is used for preprocessing the set of A-scan signals to be processed to obtain preprocessed data.

[0014] The effective area determination module is used for identifying the positions of the interface wave and the bottom wave based on the preprocessed data, traversing all the A-scan signals, and determining an effective detection area in the closing resistor sheet.

[0015] The layered picture generation module is used for extracting data in the determined effective detection area range, reconstructing the data into three-dimensional volume data, and saving a cross-sectional image of a specified depth as a layered TIFF picture.

[0016] The distribution picture generation module is used for calculating the sound velocity distribution in the closing resistor sheet based on the identified positions of the interface wave and the bottom wave, imaging the sound velocity distribution information, and saving the sound velocity distribution information as a sound velocity distribution TIFF picture.

[0017] The three-dimensional fusion visualization module is used for fusing the layered TIFF picture and the sound velocity distribution TIFF picture to generate a three-dimensional image reflecting the internal structure and the sound velocity attribute of the closing resistor sheet, and used for structure evaluation.

[0018] The application further discloses a computer device, which comprises a memory, a processor and a computer program stored in the memory and executable on the processor, and is characterized by that the processor executes the computer program to realize the three-dimensional ultrasonic imaging method for closing resistor sheet structure evaluation.

[0019] The application further discloses a computer readable storage medium, which stores a computer program, and is characterized by that the computer program is executed by a processor to realize the three-dimensional ultrasonic imaging method for closing resistor sheet structure evaluation.

[0020] The method has the advantages that the target closing resistor sheet is scanned by ultrasonic waves, three-dimensional ultrasonic imaging of the closing resistor sheet is realized, the three-dimensional imaging is fused with the sound velocity distribution, the internal structure uniformity of the closing resistor sheet is effectively evaluated, defects in the closing resistor sheet can be found in time and accurately, and the electric appliance element with the closing resistor sheet can operate more stably. BRIEF DESCRIPTION OF DRAWINGS

[0021] The application will be described in further detail below with reference to the drawings and specific embodiments.

[0022] Figure 1 A flowchart of the ultrasonic imaging method according to an embodiment of the application;

[0023] Figure 2 An A-scan signal diagram of a certain point of the closing resistor piece obtained by a 2.25 MHz probe in the ultrasonic imaging method according to an embodiment of the application;

[0024] Figure 3 A slice result diagram of a certain layer of the closing resistor piece according to an embodiment of the application;

[0025] Figure 4 An ultrasonic three-dimensional imaging result of the closing resistor piece according to an embodiment of the application;

[0026] Figure 5 A sound velocity imaging result of the closing resistor piece according to an embodiment of the application;

[0027] Fig. 6 is an image result after fusion of the ultrasonic three-dimensional imaging and the sound velocity distribution diagram according to an embodiment of the application;

[0028] Figure 7 A principle block diagram of the ultrasonic three-dimensional imaging device according to an embodiment of the application;

[0029] Figure 8 A structural diagram of a computer device according to an embodiment of the application. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the application.

[0031] In the following description, many specific details are set forth in order to provide a thorough understanding of the application. However, the application can be practiced without the specific details, which are not described in the present application, and it can be apparent to those skilled in the art that the application can be implemented in other different ways, and therefore the application is not limited to the specific embodiments disclosed below.

[0032] As shown in the drawings, Figure 1 The application discloses an ultrasonic three-dimensional imaging method for tissue evaluation of a closing resistor piece, and the method comprises the following steps:

[0033] S101: performing ultrasonic C-scan on a target closing resistor piece to obtain a set of A-scan signals to be processed of the target closing resistor piece;

[0034] S102: Preprocessing the A-scan signal set to be processed to obtain preprocessed data;

[0035] S103: Based on the preprocessed data, traversing all A-scan signal sets to identify the positions of the interface wave and the bottom wave, and determining the effective detection area inside the closing resistor piece;

[0036] S104: Extracting data within the determined effective detection area range, reconstructing into three-dimensional volume data, and saving the cross-sectional image of the specified depth as a layered TIFF picture;

[0037] S105: Based on the identified positions of the interface wave and the bottom wave, calculating the sound velocity distribution inside the closing resistor piece, and imaging the sound velocity distribution information to save as a sound velocity distribution TIFF picture;

[0038] S106: Fusing the layered TIFF picture and the sound velocity distribution TIFF picture to generate a three-dimensional image reflecting the internal structure and sound velocity properties of the closing resistor piece, for tissue evaluation.

[0039] In this application, the target closing resistor piece is ultrasonically scanned to realize ultrasonic three-dimensional imaging of the closing resistor piece, and the three-dimensional imaging and the sound velocity distribution are fused to realize effective evaluation of the internal structure uniformity of the closing resistor piece.

[0040] In an exemplary embodiment, step S101 specifically includes: for accurate evaluation of the internal structure of the closing resistor piece and other high-attenuation materials, using a low-frequency 2.25MHz water-immersed point-focused probe, setting the probe focus to focus on the surface of the closing resistor piece for ultrasonic C-scan, setting the sampling rate fs to 125MHz, and finally obtaining an A-scan signal set;

[0041] The obtained A-scan signal set is a three-dimensional array (nx, ny, nt), where nx represents the number of scanning rows, ny represents the number of scanning columns, and nt represents the length of a single A-scan signal (i.e. the number of time sampling points). A typical A-scan signal is as shown in Figure 2 .

[0042] In an exemplary embodiment, step S102 specifically includes: preprocessing the A-scan signal set, including signal clipping, correction and normalization.

[0043] Signal clipping: according to the imaging needs of the target closing resistor piece, set the threshold value place to 1500, cut off the echoes in the non-interest area of the A-scan signal, and retain the effective signal segment containing the interface wave, the primary bottom wave and possibly the secondary bottom wave.

[0044] Signal correction: Firstly, calculate the mean value of the whole data set signal, mean_value, and set the validity determination threshold M = 1.02 * mean_value, where 1.02 is an empirical value. For each cropped signal, if max(signal) > M, it is determined that the current scanning point is located inside the workpiece, and the signal remains unchanged, otherwise it is determined that the current scanning point is located outside the workpiece or has no valid echo, and the amplitude of the sampling point of the signal is set to mean_value;

[0045] Signal normalization: Firstly, calculate the maximum amplitude Amax in all corrected signals, and perform normalization on all signals A, signal_normalized = A / (0.8*Amax), to avoid color saturation in imaging. The traditional ultrasonic detection method often adjusts the observed signal to 80% of the full screen, which is used as a reference to scale the corrected signal to the interval [-0.8, 0.8].

[0046] In an exemplary embodiment, step S103 specifically comprises: based on the preprocessed data, traversing all A-scan signals, identifying the positions of the interface wave and the bottom wave, and determining the effective detection area inside the closing resistor piece accordingly.

[0047] Firstly, traverse each A-scan signal after preprocessing. If all sampling amplitudes of the signal are mean_value, it is determined that the scanning point is located outside the closing resistor piece, and the interface wave and bottom wave search is skipped. If the signal amplitude is not all mean_value, it indicates that the scanning point is located inside the closing resistor piece, then search for the first significant amplitude extreme point in the reasonable time window of the signal, and record its position as the interface wave position pos1. Search for the second significant amplitude extreme point in the reasonable time window after pos1, and record its position as the bottom wave position pos2.

[0048] The effective detection area inside the closing resistor piece is defined as the interval from pos1 to pos2 on the time axis, and the effective interval corresponding to each scanning point (x, y) is recorded as [pos1(x, y), pos2(x, y)].

[0049] In an exemplary embodiment, step S104 specifically comprises: extracting the data in the determined effective range, reconstructing it into a three-dimensional volume data, and saving the cross-sectional image of the specified depth as a layered TIFF picture.

[0050] Calculate the maximum effective thickness: based on the interface wave position pos1 and the bottom wave position pos2 position matrix, calculate the maximum effective thickness: depth_max = max(pos2(x, y)-pos1(x, y));

[0051] Initialization of three-dimensional volume data: create an empty array with size (nx,ny,depth_max) to store the signal data in the valid region;

[0052] Reconstruction of three-dimensional volume data: traverse each scanning point (x,y), if the point is a valid point, obtain the data segment of the A-scan signal in the time point [pos1(x,y), pos2(x,y)] interval, and fill the data segment into the three-dimensional volume data;

[0053] Generation of depth axis: according to the preset material sound speed c of 4400 m / s and the sampling frequency fs of 125 MHz, the time sampling point is converted into physical depth (mm), and the minimum theoretical physical spacing (layer thickness step) of adjacent sections is: Preferably, in this example, it is 0.0176 mm;

[0054] Section image saving: in the target depth range, select the depth value according to the specified layer thickness compensation, and extract the two-dimensional slice corresponding to the depth index in the volume data;

[0055] Amplitude mapping and saving: linearly map the two-dimensional slice data to the 16-bit gray scale range (0-65535) and save it as a TIFF format. Among them Figure 3 is the imaging result of a layer slice, Figure 4 is the ultrasonic three-dimensional imaging result in this embodiment.

[0056] In an exemplary embodiment, step S105 specifically comprises: based on the positions of the identified interface wave and bottom wave, calculating the sound speed distribution inside the closing resistor piece, and imaging the sound speed distribution information and saving it as a TIFF picture, specifically comprising:

[0057] Traverse the preprocessed A-scan signal A(x,y) of each scanning point (x,y), if the A-scan signal A(x,y) is a valid point, obtain the interface wave position pos1(x,y) and the bottom wave position pos2(x,y), and the material thickness h is 26.5 mm, then the calculation formula of the position sound speed is:

[0058]

[0059] In the formula, h is the material thickness (mm), fs is the sampling frequency (MHz), and the material sound speed c (m / s) is finally calculated;

[0060] Save the processed sound speed distribution map as a TIFF picture file, Figure 5 is the sound speed imaging result of this example.

[0061] In an exemplary embodiment, step S106 specifically comprises: importing the layered TIFF picture and the sound velocity distribution TIFF picture into Avizo for three-dimensional imaging, to generate a three-dimensional image reflecting the internal organization and sound velocity properties of the closing resistor. Figure 6a is the image result of the fusion of the three-dimensional ultrasound imaging and the sound velocity distribution map of the present example. (The same function can be completed using the open source package mayavi, and the rendering effect is as shown in Figure 6b

[0062] Based on the same inventive concept, corresponding to the method described in the present application, the present embodiment also discloses an ultrasonic three-dimensional imaging device for closing resistor organization evaluation. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more ultrasonic three-dimensional imaging device embodiments for closing resistor organization evaluation provided below can be referred to the limitations of the ultrasonic three-dimensional imaging method for closing resistor organization evaluation in the above, which will not be repeated here.

[0063] As shown in Figure 7 , the ultrasonic three-dimensional imaging device comprises:

[0064] The data acquisition module 101 is configured to perform ultrasonic C-scan on the target closing resistor to obtain a set of A-scan signals of the target closing resistor to be processed.

[0065] The data preprocessing module 102 is configured to preprocess the set of A-scan signals to be processed to obtain preprocessed data.

[0066] The effective area determination module 103 is configured to traverse all A-scan signals based on the preprocessed data, identify the positions of the interface wave and the bottom wave, and determine the effective detection area inside the closing resistor.

[0067] The layered picture generation module 104 is configured to extract data in the determined effective detection area range, reconstruct the data into three-dimensional volume data, and save the cross-sectional image of a specified depth as a layered TIFF picture.

[0068] The distribution picture generation module 105 is configured to calculate the sound velocity distribution inside the closing resistor based on the identified positions of the interface wave and the bottom wave, image the sound velocity distribution information, and save the sound velocity distribution TIFF picture.

[0069] The three-dimensional fusion visualization module 106 is configured to fuse the layered TIFF picture and the sound velocity distribution TIFF picture to generate a three-dimensional image reflecting the internal organization and sound velocity properties of the closing resistor, for organization evaluation.

[0070] ​In one exemplary embodiment, the present invention also provides a computer device, which may be a server or a terminal, and its internal structure diagram may be as follows. Figure 8 As shown, the computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The database stores ultrasonic imaging data of the closing resistor. The I / O interfaces are used for information exchange between the processor and external devices. The communication interface is used for communication with external terminals via a network connection. When the computer program is executed by the processor, it implements an ultrasonic imaging method for a closing resistor.

[0071] Those skilled in the art will understand that Figure 8 The structures shown are merely block diagrams of some structures related to the present application and do not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than shown in the figures, or combine certain components, or have different component arrangements. In an exemplary embodiment, a computer device is provided, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the steps in the above-described method embodiments.

[0072] In one exemplary embodiment, the present invention also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps in the above-described method embodiments.

[0073] In one exemplary embodiment, the present invention also provides a computer program product, including a computer program that, when executed by a processor, implements the steps in the above-described method embodiments.

[0074] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0075] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments of the methods can be included. Any reference to memory, databases or other media used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (Read-Only Memory, ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive memory (ReRAM), magnetoresistive random access memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric memory (Ferroelectric Random Access Memory, FRAM), phase change memory (Phase Change Memory, PCM), graphene memory, etc. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, etc. As an illustration but not limitation, RAM can be in various forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), etc.

[0076] The database involved in the embodiments provided in the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a blockchain, etc., without being limited thereto. The processor involved in the embodiments provided in the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a data processing logic of a programmable logic device, etc., without being limited thereto.

[0077] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the present application.

[0078] The principles and implementation modes of the present application are described by applying specific examples herein. The above description of the embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed. In conclusion, the content of the present application should not be understood as a limitation.

Claims

1. An ultrasonic three-dimensional imaging method for evaluating the structure of a closing resistor, characterized by The method comprises the following steps: The target closing resistor piece is subjected to ultrasonic C scanning to obtain a set of A-scan signals of the target closing resistor piece to be processed; The set of A-scan signals to be processed is preprocessed to obtain preprocessed data; Based on the preprocessed data, all A-scan signal sets are traversed to identify the positions of the interface wave and the bottom wave and determine the effective detection region inside the closing resistor piece; Data in the determined effective detection region range is extracted, reconstructed into three-dimensional volume data, and a cross-sectional image of a specified depth is saved as a layered TIFF picture; Based on the identified positions of the interface wave and the bottom wave, the sound velocity distribution inside the closing resistor piece is calculated, and the sound velocity distribution information is imaged and saved as a sound velocity distribution TIFF picture; The layered TIFF picture and the sound velocity distribution TIFF picture are fused to generate a three-dimensional image reflecting the internal organization and sound velocity attribute of the closing resistor piece for organization evaluation.

2. The ultrasonic three-dimensional imaging method for evaluation of closing resistor organization according to claim 1, characterized in that, The method for obtaining the set of A-scan signals to be processed comprises the following steps: A low-frequency 2.25MHz water-immersed point focusing probe is used, the probe focus is set to focus on the surface of the closing resistor piece, ultrasonic C scanning is performed, the sampling rate fs is set to 125MHz, and finally the set of A-scan signals is obtained; The obtained set of A-scan signals is a three-dimensional array (nx, ny, nt), wherein nx represents the number of scanning rows, ny represents the number of scanning columns, and nt represents the length of a single A-scan signal.

3. The ultrasonic three-dimensional imaging method for evaluation of closing resistor organization according to claim 1, characterized in that, The method for preprocessing the set of A-scan signals to be processed comprises the following steps: Signal clipping: according to the imaging needs of the closing resistor piece, a threshold value place is set, the echoes of the non-interest region in the A-scan signal are cut off, and the effective signal segment including the interface wave, the primary bottom wave and the possible secondary bottom wave is reserved; Signal correction: first, the average amplitude mean_value of the entire data set signal is calculated, the validity determination threshold M is set to 1.02*mean_value, for each clipped signal signal, if max(signal)>M, it is determined that the current scanning point is located inside the workpiece, the signal remains unchanged, otherwise it is determined that the current scanning point is located outside the workpiece or has no effective echo, and the amplitude of the sampling point of the signal is set to mean_value; Signal normalization: first, the maximum amplitude Amax in all corrected signals is calculated, and normalization is performed on all signals A, signal_normalized=A / (0.8*Amax).

4. The method of ultrasonic three-dimensional imaging of the closing resistor structure evaluation according to claim 1, characterized in that, The method for determining the effective detection region inside the closing resistor piece comprises the following steps: Traverse each A-scan signal after preprocessing, if all the sampling amplitudes of the signal are mean_value, it is determined that the scanning point is located outside the workpiece, and the interface wave and the bottom wave search are skipped; if the signal amplitude is not all mean_value, it indicates that the scanning point is located inside the workpiece, then the first significant amplitude extreme point is searched in the set time window of the signal, and its position is recorded as the interface wave position pos1, and the second significant amplitude extreme point is searched in the set time window after the interface wave position pos1, and its position is recorded as the bottom wave position pos2; the effective detection area inside the closed resistance piece is defined as the interval from pos1 to pos2 on the time axis, and the effective interval corresponding to each scanning point (x, y) is recorded as [pos1 (x, y), pos2 (x, y)].

5. The method for ultrasonic three-dimensional imaging of closing resistor structure evaluation according to claim 1, characterized in that, The method for saving the section image of the specified depth as a layered TIFF picture comprises the following steps: Calculate the maximum effective thickness: based on the position matrix of the interface wave position pos1 and the bottom wave position pos2, calculate the maximum effective thickness, depth_max = max (pos2 (x, y) - pos1 (x, y)); Initialize three-dimensional volume data: create an empty array with a size of (nx, ny, depth_max) to store the signal data in the effective area; Reconstruct three-dimensional volume data: traverse each scanning point (x, y), if the point is an effective point, get the data segment of the A-scan signal in the time point [pos1 (x, y), pos2 (x, y)] interval, and fill the data segment into the three-dimensional volume data; Generating depth axis: According to the preset material sound velocity c and the sampling frequency fs, the time sampling points are converted into physical depths, so that the minimum theoretical physical interval of adjacent sections is: Section image saving: in the target depth range, select the depth value according to the specified layer thickness compensation, and extract the two-dimensional slice of the corresponding depth index in the volume data; Amplitude mapping and saving: linearly map the two-dimensional slice data to the 16-bit grayscale range, and save it as a TIFF format.

6. The method for ultrasonic three-dimensional imaging of closing resistor structure evaluation according to claim 1, characterized in that, The method for saving the sound velocity distribution TIFF picture comprises the following steps: Traverse each scanning point (x, y) of the preprocessed A-scan signal A(x, y), if the A-scan signal A(x, y) is an effective point, get the interface wave position pos1(x, y) and the bottom wave position pos2(x, y), and known material thickness h, then the calculation formula of the position sound velocity is: In the formula, h is the material thickness (mm), fs is the sampling frequency (MHz), and finally the material sound velocity c (m / s) is calculated; Save the processed sound velocity distribution map as a sound velocity distribution TIFF picture file.

7. The ultrasonic three-dimensional imaging method for evaluating the organization of the closed resistance piece according to claim 1, characterized in that: Import the layered TIFF picture and the sound velocity distribution TIFF picture into Avizo, and fuse to generate a three-dimensional image reflecting the internal organization and sound velocity properties of the closed resistance piece.

8. An ultrasonic three-dimensional imaging apparatus for evaluation of closing resistor organization, the three-dimensional imaging apparatus operating the three-dimensional imaging method according to any one of claims 1 to 7, characterized by, The device comprises: A data acquisition module for performing ultrasonic C-scan on a target closed resistance piece to obtain a set of A-scan signals of the target closed resistance piece; A data preprocessing module for preprocessing the set of A-scan signals to obtain preprocessed data; An effective area determination module is configured to traverse all A-scan signal sets based on the preprocessed data, identify positions of the interface wave and the bottom surface wave, and determine an effective detection area inside the closing resistor disc; A layered picture generation module is configured to extract data in the determined effective detection area, reconstruct the data into three-dimensional volume data, and save a cross-sectional image at a specified depth as a layered TIFF picture; A distribution picture generation module is configured to calculate a sound velocity distribution inside the closing resistor disc based on the identified positions of the interface wave and the bottom surface wave, image the sound velocity distribution information, and save the sound velocity distribution information as a sound velocity distribution TIFF picture; A three-dimensional fusion visualization module is configured to fuse the layered TIFF picture and the sound velocity distribution TIFF picture, generate a three-dimensional image reflecting the internal structure and sound velocity attribute of the closing resistor disc, and use the three-dimensional image for structure evaluation.

9. A computer device comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the ultrasonic three-dimensional imaging method for closing resistor disc structure evaluation according to any one of claims 1-7.

10. A computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the ultrasonic three-dimensional imaging method for closing resistor disc structure evaluation according to any one of claims 1-7.

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