Temperature and humidity control shunt device and gluing developing machine

Abstract

The application discloses a temperature and humidity control shunt device and a gluing developing machine, and relates to the technical field of wafer processing.The main pipeline is connected with an air outlet of the THC equipment, so that the temperature and humidity of the gas supplied into the shunt box are the same, the shunt is realized by means of the four uniformly distributed shunt pipelines, and the isogenic constant-temperature and constant-humidity gas is delivered into the four cavities by the pipelines with the same length and specification, so that the synchronous control of the temperature and humidity of the airflow supplied into the four cavities is realized, the interference on the constant-temperature and constant-humidity gas in the delivery process is reduced, the precision control of the temperature and humidity in the wafer gluing operation process is effectively improved, and the stability of the working environment of the equipment is effectively ensured, so that the application is suitable for the precise equipment with higher environmental requirements.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing, in particular to a temperature and humidity control shunt device and a glue coating and developing machine. BACKGROUND

[0002] In the semiconductor manufacturing process, the glue coating and developing machine is a key equipment in the photoetching process, which is matched with the photoetching machine. The main function is to complete a series of important process such as photoresist coating, curing, developing and hardening of the wafer. Through the glue coating device in the glue coating and developing machine, the wafer is driven to rotate at high speed, and the photoresist is uniformly sprayed on the wafer surface. During the process of coating the wafer with photoresist, the change of temperature and humidity of the working environment plays a crucial role in the spraying and film forming of the photoresist.

[0003] The glue coating and developing machine in the prior art is connected with multiple air outlets of the THC (temperature and humidity control) device through independent pipelines respectively. Although this connection method can realize the regulation of the temperature and humidity of each chamber to some extent, in the actual operation process, multiple air pipes share one control unit, and the control unit can only control the temperature and humidity of one heat preservation air pipe, and the controlled precision of the remaining heat preservation air pipes is greatly reduced. This leads to the fact that the constant temperature and humidity gas output from the multiple air outlets of the THC device is easy to be out of control during a long time operation, and due to the different distances between the multiple air outlets on the THC device and the corresponding glue coating device chambers, the differences in pipe length and pipe diameter, etc., it is impossible to ensure that the constant temperature and humidity gas output from the multiple heat preservation air pipes has the same air speed, thus leading to the fact that the difference of the gas entering different chambers is large, which easily causes the fluctuation difference of the temperature and humidity inside the chambers, and has adverse effects on the precision of the whole wafer glue coating process.

[0004] Therefore, a temperature and humidity control shunt device and a glue coating and developing machine are proposed to solve some problems existing in the prior art. SUMMARY

[0005] The purpose of the present application is to solve the problem in the prior art that the glue coating and developing machine for wafer processing uses the multiple air outlets of the THC device to be independently connected with different glue coating chambers to transport constant temperature and humidity gas for environmental temperature and humidity control, which easily causes the fluctuation difference of the temperature and humidity in different chambers, and affects the precision of the wafer glue coating process. A temperature and humidity control shunt device and a glue coating and developing machine are proposed.

[0006] In order to solve the problems existing in the prior art, the present application adopts the following technical scheme:

[0007] The temperature and humidity control shunt device and the gluing and developing machine, which comprises a machine table, a gluing area and a developing area are arranged on the machine table respectively, four gluing devices are installed in the gluing area, a plurality of developing devices are installed in the developing area, a mechanical hand is installed on the top of the machine table and located between the gluing devices and the developing devices, the gluing device comprises a cavity fixed on the top of the machine table, a rotary table is rotatably arranged in the cavity, a first servo motor is fixed in the machine table and the driving shaft of the first servo motor is in transmission connection with the rotary table, a plurality of first suction holes are evenly arranged on the top of the rotary table, a support is fixed on the top of the machine table and located outside the cavity, a first electric push rod is vertically arranged on the support, a nozzle is fixed on the extension end of the first electric push rod, a shunt device is installed on the machine table and comprises a shunt box fixed on the top of the machine table, a main pipeline is arranged on one side of the shunt box, four shunt pipelines are evenly arranged on the other side of the shunt box, the four shunt pipelines are connected with the four gluing devices respectively, and the lengths of the connecting pipelines are equal.

[0008] Preferably, a connecting arm extending to the top of the cavity is fixed on the support, a cover plate matched with the cavity is installed on the connecting arm, a through hole matched with the nozzle is arranged on the cover plate, the bottom of the support is rotatably connected with the top of the machine table, a second servo motor is fixed in the machine table and the driving shaft of the second servo motor is fixedly connected with the support.

[0009] Preferably, a spray pipe is fixed on the cover plate and arranged around, a plurality of spray holes are arranged around on the spray pipe and point to the cavity, and the spray pipes in the four gluing devices are respectively communicated with the four shunt pipelines.

[0010] Preferably, a vertical guide column is slidingly inserted on the connecting arm and fixedly connected with the cover plate at the bottom end, a first spring is movably sleeved on the outside of the guide column and elastically supported between the top of the connecting arm and the top end of the guide column, and a pressing block is fixed on the extension end of the first electric push rod.

[0011] Preferably, a second electric push rod is vertically arranged in the machine table and the extension end of the second electric push rod is movably penetrated into the rotary table, a supporting table movably arranged on the inside of the rotary table is installed on the extension end of the second electric push rod, and a plurality of second suction holes are evenly arranged on the top of the supporting table.

[0012] Preferably, the extension end of the second electric push rod is arranged in an up-down penetrating structure, a first channel vertically arranged in the shaft center of the second electric push rod is communicated with the second suction holes, and a rotary joint communicated with the first channel is rotatably installed at the bottom end of the extension end of the second electric push rod.

[0013] Preferably, a valve chamber is arranged in the support table and communicated with the second suction hole, a second channel is arranged between the first channel and the inner wall of the valve chamber, a first hole is arranged in the bottom of the support table and communicated with the valve chamber, a vertical insertion pipe is slidably inserted into the first hole, a valve plate is fixed to the top end of the insertion pipe and matched with the inner size of the valve chamber, a second hole is arranged in the inner wall of the insertion pipe and communicated with the valve chamber, a second spring is arranged above the valve plate and used for elastically supporting the valve plate, a connecting hole is arranged in the rotary table and correspondingly matched with the insertion pipe, and the connecting hole is communicated with the first suction hole.

[0014] Preferably, the rotary table is rotatably arranged on the top of the second electric push rod, and the rotary table and the support table are arranged with magnet stones which are magnetically attracted to each other.

[0015] Preferably, the humidity control shunt device is suitable for a glue coating and developing machine, the flow capacity of the main pipeline in the shunt device is set as the sum of the flow capacities of the four shunt pipelines, a cross plate is fixed in the shunt box, the shunt box is divided into four independent cavities with the same size by the cross plate, the four independent cavities are one-to-one corresponded with the four shunt pipelines respectively, and a connecting bucket connected with the corresponding shunt pipeline is fixed in each independent cavity, and the connecting bucket is in a funnel structure.

[0016] Preferably, the shunt device further comprises a pipeline assembly corresponding to the four shunt pipelines, the pipeline assembly comprises a storage box, and a shaft pipe is fixed at the center position in the storage box, a sleeve pipe is rotatably arranged on the shaft pipe and located in the storage box, a through hole is arranged in the end wall of the shaft pipe and communicated with the sleeve pipe, one end of the shaft pipe extends out of the storage box and connected with the corresponding shunt pipeline through a first hose, a second hose is fixedly connected to the sleeve pipe and coiled in the storage box, and the outer end of the second hose extends out of the storage box, a spring structure is arranged in the end wall of the second hose as a support, a clock spring is arranged in the storage box and fixedly connected with the storage box at the outer end, and the inner end of the clock spring is fixedly connected with the sleeve pipe.

[0017] Compared with the prior art, the present application has the following advantages:

[0018] 1. In the present application, the main pipeline is connected with one air outlet of the THC device, so that the temperature and humidity of the gas supplied into the shunt box are the same, the same length and specification pipeline is used for conveying, the same source constant temperature and humidity gas is conveyed into the four cavities, the temperature and humidity of the gas supplied into the four cavities are synchronously controlled, the interference on the constant temperature and humidity gas in the conveying process is reduced, the precision control of the temperature and humidity in the wafer glue coating operation process is improved, the stability of the equipment working environment is effectively ensured, and the present application is suitable for precise equipment with higher environmental requirements.

[0019] 2. In this invention, by setting the tray inside the turntable and mounting the tray on the telescopic end of the vertically positioned second electric push rod, the tray can be raised and lowered by the second electric push rod when the wafer enters or leaves the cavity. This, combined with the gripping of the wafer by the robotic arm, allows the wafer pick-up and drop operations to be completed outside the cavity, avoiding wafer pick-up and drop operations within the narrow cavity. This improves the convenience and safety of wafer pick-up and drop operations during the coating process. At the same time, by opening the second suction hole on the tray and setting the valve chamber between the second suction hole and the first suction hole, and with the elastic support of the second spring, the valve plate moves up and down in the valve chamber during the lifting and lowering of the tray. This enables the automatic switching of the external air pump to draw air from the first and second suction holes. With this combination, the stability of the wafer can be effectively ensured when it is lifted and transferred by the tray.

[0020] 3. In this invention, the flow box is divided into independent chambers corresponding to the four flow pipes by a cross plate, and the funnel-shaped receiving bucket in each independent chamber guides the flow. This can further ensure the stability and uniformity of the constant temperature and humidity gas flowing from one main pipe to the four flow pipes, which is beneficial to ensuring the stability of the device in the flow and transportation of constant temperature and humidity gas from the same source.

[0021] 4. In this invention, by connecting numerous pipe components of the same size between the diversion pipe and the corresponding nozzle, the path of the constant temperature and humidity gas delivered to the corresponding cavity by each diversion pipe is consistent, which helps to further ensure the accuracy of temperature and humidity control in each cavity. At the same time, the second hose is wound up inside the storage box by the elastic support of the spring, which can effectively organize the pipeline without changing the total length of the gas flow path, which helps to avoid the pipeline being messy on the machine and ensures the stability of the device in actual use to a certain extent. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings:

[0023] Figure 1 This is a perspective view of the coating and developing machine of the present invention;

[0024] Figure 2 This is a top view of the coating and developing machine of the present invention;

[0025] Figure 3 For the present invention Figure 2 Sectional view at point AA;

[0026] Figure 4 For the present invention Figure 3 Enlarged view of point C in the middle;

[0027] Figure 5 For the invention Figure 4 Enlarged view of D in the invention;

[0028] Figure 6 For the invention Figure 2 Sectional view of B-B in the invention;

[0029] Figure 7 Perspective view of the shunt box of the invention;

[0030] Figure 8 Split view of the shunt box and cross plate of the invention;

[0031] Figure 9 Perspective view of the shunt device of the invention;

[0032] Figure 10 Split view of the pipe assembly of the invention;

[0033] Figure 11 Top view of the shunt device of the invention;

[0034] Figure 12 Sectional view of E-E in the invention; Figure 11

[0035] Sectional view of F-F in the invention; Figure 13 Figure 11 Sectional view of G-G in the invention.

[0036] Figure 14 Figure 11

[0037] Figure number:

[0038] 1, machine table; 101, glue coating area; 102, developing area; 103, mechanical hand;

[0039] 2, cavity; 201, rotary table; 202, first servo motor; 203, first suction hole; 204, support; 205, first electric push rod; 206, spray head;

[0040] 3, connecting arm; 301, cover plate; 302, second servo motor; 303, spray pipe; 304, guide column; 305, first spring; 306, pressing block;

[0041] 4, second electric push rod; 401, support table; 402, second suction hole; 403, first channel; 404, adapter;

[0042] 5, valve chamber; 501, second channel; 502, first hole; 503, cannula; 504, valve plate; 505, second hole; 506, second spring; 507, butt joint hole;​​​

[0043] 6, the shunt box; 601, the main pipe; 602, the shunt pipe;

[0044] 7, the cross plate; 701, the guide hopper;

[0045] 8, the storage box; 801, the shaft pipe; 802, the sleeve; 803, the first hose; 804, the second hose; 805, the spring. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0047] Embodiment 1: The present embodiment provides a gumming developing machine, referring to Figure 1 - Figure 6 Specifically, it comprises a machine table 1, the machine table 1 is respectively provided with a gumming area 101 and a developing area 102, four gumming devices are installed in the gumming area 101, and a plurality of developing devices are installed in the developing area 102, a mechanical hand 103 is installed on the top of the machine table 1 between the gumming devices and the developing devices, the gumming device comprises a cavity 2 fixed on the top of the machine table 1, and a turntable 201 is rotatably arranged in the cavity 2, a first servo motor 202 is fixed in the machine table 1, and the driving shaft of the first servo motor 202 is in transmission connection with the turntable 201, a plurality of first suction holes 203 are evenly distributed on the top of the turntable 201, a support 204 is fixed on the outside of the cavity 2 on the top of the machine table 1, a first electric push rod 205 is vertically arranged on the support 204, a spray head 206 is fixed on the extension end of the first electric push rod 205, a shunt device is installed on the machine table 1, and the shunt device comprises a shunt box 6 fixed on the top of the machine table 1, a main pipe 601 is arranged on one side of the shunt box 6, four shunt pipes 602 are evenly arranged on the other side of the shunt box 6, the four shunt pipes 602 are respectively connected with the four gumming devices, and the lengths of the connecting pipes are equal.

[0048] When the device is used, the worker uses the device to perform the photoresist coating and developing operation on the wafer. The four coating devices are sequentially connected with the spray head 206. The wafer is placed into the four coating devices in the coating area 101 by the mechanical hand 103. Each coating device is provided with a plurality of spray heads 206. One of the spray heads 206 is connected with the solvent supply device to spray the solvent on the wafer surface. Another spray head 206 is connected with the photoresist supply device to spray the photoresist on the wafer surface. There are two spray heads 206 connected with the cleaning water to clean the edge position of the wafer after film forming. The two spray heads 206 for cleaning the edge position of the wafer are mounted on the extension end of the first electric push rod 205 and in the cavity 2 respectively to point to the upper and lower edge positions of the wafer. The four coating devices are connected with the airflow supply in the corresponding cavities 2 through the shunt device. The airflow sources are consistent. The airflow is evenly shunted through the communication of the shunt box 6, the main pipeline 601 and the four shunt pipelines 602. The connection pipeline lengths are equal to make the airflow temperature and humidity in the four cavities 2 consistent.

[0049] In actual operation, the wafer is grabbed by the mechanical hand 103 to control the wafer to move in and out of the four coating devices and the plurality of developing devices to perform the photoresist coating and developing operation. When the wafer is placed into the cavity 2 in the coating device, the wafer is placed on the top of the turntable 201. At this time, the air pump connected with the first suction hole 203 is started to perform the airflow suction through the first suction hole 203 to firmly connect the wafer on the top of the turntable 201. Then, the first servo motor 202 is powered to drive the turntable 201 to rotate the wafer in the cavity 2. In the rotating process, the solvent and the photoresist are coated on the wafer by the spray head 206 and the photoresist is removed from the edge position of the wafer. In the first step, the wafer is driven to rotate at a low speed by the turntable 201 and high exhaust is performed in the cavity 2. In the rotating process, the solvent is sprayed on the wafer surface by the spray head 206. In the second step, the wafer is driven to rotate at a high speed by the turntable 201 and the high exhaust is maintained in the cavity 2. In the rotating process, the photoresist is sprayed on the wafer surface by the spray head 206. In the third step, the wafer is driven to rotate at a high speed by the turntable 201 and the low exhaust is performed in the cavity 2. In the rotating process, the photoresist is uniformly coated on the wafer surface to form a film. In the fourth step, the wafer is driven to rotate at a high speed by the turntable 201. In the rotating process, the cleaning water is sprayed on the upper and lower surface edge positions of the wafer by the spray head 206 to wash the edges of the wafer.

[0050] The wafer finished with the coating operation needs to be baked, and then grabbed into a developing device for developing operation. The developing device has a structure similar to that of the coating device. After the wafer is placed on the turntable 201 in the developing device, it is driven to rotate. The spray head 206 in the developing device sprays developing liquid on the surface of the wafer to start the developing operation. After a specified developing time ends, the wafer is washed with ionized water, and finally, the wafer is spun dry through high-speed rotation of the turntable 201 in the developing device.

[0051] In the coating link of the photoetching process, the requirements for the environmental temperature and humidity are very strict. Generally, the best coating conditions are 20-25℃ for the temperature, ±1℃ for the temperature stability, 30%-50% RH for the relative air humidity, and ±0.5% RH for the humidity stability. The relative temperature and humidity have a great influence on the stability of the photoresist. In the coating link, when the environmental temperature changes and other conditions remain unchanged, the volatilization of the solvent will accelerate with the increase of the temperature, which increases the viscosity of the photoresist. Similarly, the change of the temperature of the photoresist will also cause the change of the volatilization rate of the solvent, thereby affecting the viscosity and flowability of the photoresist. The poor flowability of the photoresist will cause the poor uniformity of the film thickness. When the temperature is too high, the photoresist will dry quickly, which reduces its adhesion and quality, thereby affecting the progress of the pattern transfer. When the temperature is too low, the performance of the electronic elements and sensors of the photoetching machine may be affected and reduced.

[0052] In addition, when the environmental humidity changes, the volatilization of the solvent will accelerate with the decrease of the humidity. Generally, the influence of the humidity on the uniformity is not as obvious as that of the temperature. The main influence is on the average film thickness. If the humidity is too low, the photoresist will become too dry, which easily causes problems such as bubbles, cracks, and particles, thereby affecting the quality of the photoetching result. When the humidity is too high, the coating of the photoresist will become thick. A 1% decrease of the humidity will cause a 9% increase of the film thickness, which causes the decrease of the pattern resolution and the damage of the architecture.

[0053] In addition to the above, the change of the relative humidity will also affect the accurate size control in the subsequent production. The higher the accuracy of the temperature and humidity, the smaller the change of the environmental temperature and humidity, the more stable the system, and the higher the yield of the coating link. At the same time, it is also beneficial to the accurate size control in the subsequent production. Therefore, it is necessary to perform the coating operation of the wafer photoresist in a relatively stable environment.

[0054] In the process of solvent and photoresist brushing, the traditional wafer coating and developing device uses a special ultra-precise temperature and humidity control device (THC) for semiconductor lithography process when air flow is supplied to each coating device. The constant temperature and humidity gas in the THC device is transported to the four cavities 2 of the coating and developing machine for coating through four heat preservation air pipes. The four air pipes of the THC device share one control unit, and the control unit can only control the temperature and humidity of one heat preservation air pipe, and the remaining three heat preservation air pipes are not controlled. Therefore, the constant temperature and humidity gas output from the air outlet of the THC device is in an uncontrolled state. In addition, due to the different distances from the four different air outlets of the THC device to the air inlets of the four cavities 2 of the coating and developing machine, it is impossible to ensure that the constant temperature and humidity gas entering the four heat preservation air pipes has the same air speed, so that the gas difference when the gas enters the four cavities is large, causing the temperature and humidity fluctuation difference in the cavities to increase, which has adverse effects on the coating processing of the wafer.

[0055] When using the coating and developing machine in the present application for coating operation, the four air outlets of the THC device in the prior art are adjusted to one, which is then connected with the main pipeline 601, so that the temperature and humidity of the gas supplied into the shunt box 6 are the same, and then the gas flows out through the four evenly distributed shunt pipelines 602 and is transported into the four cavities 2 through the pipelines with the same length, realizing the synchronous control of the temperature and humidity of the air flow supplied into the four cavities 2. Compared with the prior art, the device can effectively improve the precision control of the temperature and humidity in the wafer coating operation process, and can improve the temperature precision from 0.2℃ before use to 0.05℃, and improve the humidity precision from 0.5%RH to 0.3%RH. It is a leap in the precision control of temperature and humidity, and can more effectively ensure the stability of the working environment of the device, and is suitable for precise devices with higher environmental requirements.

[0056] In the specific implementation process, for example, Figure 3 - Figure 4 and Figure 6As shown, the bracket 204 is fixed with a connecting arm 3 extending to the top of the cavity 2, and the connecting arm 3 is installed with a cover plate 301 matched with the cavity 2, the cover plate 301 is provided with a through hole matched with the nozzle 206, the bottom of the bracket 204 is rotatably connected to the top of the machine table 1, the machine table 1 is fixed with a second servo motor 302, and the driving shaft of the second servo motor 302 is fixedly connected with the bracket 204, the cover plate 301 is fixedly provided with a surrounding spray pipe 303, and the spray pipe 303 is provided with a plurality of spray holes distributed around, and the spray holes point to the cavity 2, and the spray pipes 303 in the four glue coating devices are respectively communicated with the four shunt pipes 602. When the device is used, the cover plate 301 is used to cover the top of the cavity 2, so as to block the top of the cavity 2, so as to ensure that the cavity 2 is in a relatively closed environment. Through the rotation of the driving shaft of the second servo motor 302, the bracket 204 can be controlled to rotate 90° forward and backward, so as to realize the operation of moving the nozzle 206 and the cover plate 301 away from the top of the cavity 2 or moving the nozzle 206 and the cover plate 301 to the top of the cavity 2. The operation is convenient, and the top of the cavity 2 can be made to be unobstructed by adjusting, which is beneficial to ensure the convenient and efficient of the wafer entering and leaving the cavity 2.

[0057] When the airflow is supplied to the four cavities 2 through the shunt device, the constant temperature and humidity gas is communicated with the main pipe 601 through the air outlet of the THC equipment, enters the shunt box 6, and then is evenly shunted to the four spray pipes 303 through the connection of the four shunt pipes 602, is evenly and stably sent into the cavity 2 through the spray holes arranged below the surrounding spray pipes 303, and the bottom of the cavity 2 is connected with an exhaust pipe. The air enters from the top and exits from the bottom, which can effectively ensure the constant temperature and humidity working environment in the cavity 2.

[0058] In the specific implementation process, for example, Figure 4As shown, the connecting arm 3 is slidably inserted with a vertically arranged guide column 304, and the bottom end of the guide column 304 is fixedly connected with the cover plate 301, and the outer side of the guide column 304 is movably sleeved with a first spring 305 elastically supported between the top of the connecting arm 3 and the top end of the guide column 304, and the telescopic end of the first electric push rod 205 is fixedly connected with a pressing block 306, and when the device is used, the elastic connection of the first spring 305 makes the cover plate 301 in the initial state above the upper opening of the cavity 2, and there is a height difference of 1cm between the bottom of the cover plate 301 and the upper opening of the cavity 2, when the second servo motor 302 controls the bracket 204 to rotate and moves the cover plate 301 to the top of the cavity 2, if it is necessary to close the cavity 2 for gluing work, the telescopic end of the first electric push rod 205 drives the nozzle 206 and the pressing block 306 to move downward synchronously, the pressing block 306 moves downward and presses on the top of the cover plate 301, drives the cover plate 301 to move downward and tightly press on the port of the cavity 2, and the nozzle 206 moves downward and enters the cavity 2 through the through hole formed on the cover plate 301, and the pressing block 306 provides extrusion force for the cover plate 301 from top to bottom, which can effectively guarantee the airtightness of the cover plate 301 closing the upper opening of the cavity 2.

[0059] In the specific implementation process, as shown in Figure 3 and Figure 4 As shown, the second electric push rod 4 is fixedly arranged in the machine table 1, and the telescopic end of the second electric push rod 4 movably penetrates into the rotary table 201, and the telescopic end of the second electric push rod 4 is installed with a supporting table 401 movably arranged on the inner side of the rotary table 201, and the top of the supporting table 401 is provided with a plurality of second suction holes 402 uniformly distributed, and the telescopic end of the second electric push rod 4 is arranged in an up-down penetrating structure, a first channel 403 is formed in the second electric push rod 4 at the shaft center position and arranged vertically, the second suction hole 402 is communicated with the first channel 403, and the bottom end of the telescopic end of the second electric push rod 4 is rotatably installed with an adapter 404 communicated with the first channel 403.

[0060] When the device is in use, in the process of the wafer entering and exiting the cavity 2, the second electric push rod 4 is started, and the upper and lower lifting of the supporting table 401 can be controlled by the up and down lifting of the telescopic end of the second electric push rod 4. In the process of placing the wafer into the cavity 2, the second electric push rod 4 drives the supporting table 401 to project outwards from the opening above the cavity 2. In this state, the device can place the wafer on the supporting table 401 by the mechanical hand 103. The second suction hole 402 is externally connected to the air pump, and the air flow suction is performed through the second suction hole 402. When the wafer is placed on the supporting table 401, the wafer can be stably connected to the supporting table 401 by the negative pressure adsorption formed by the air flow suction. Then, the second electric push rod 4 drives the supporting table 401 to carry the wafer to move downwards, and drives the wafer to enter the cavity 2. The supporting table 401 enters the rotary table 201, and the wafer is arranged on the rotary table 201. The wafer is stably lifted on the rotary table 201 by the air flow suction at the first suction hole 203. When the wafer needs to be taken out from the cavity 2, the wafer can be lifted to the opening of the cavity 2 only by controlling the lifting of the supporting table 401 by the second electric push rod 4. The wafer can be taken and placed outside the cavity 2 by controlling the lifting of the supporting table 401 by the second electric push rod 4 and the grasping of the wafer by the mechanical hand 103. Compared with the wafer taking and placing operation in the narrow cavity 2 by the mechanical hand 103 in the prior art, the structure is convenient and efficient, and the wafer is not easy to be damaged, which is conducive to the widespread use.

[0061] In the specific implementation process, for example, Figure 4 and Figure 5As shown, the support table 401 is provided with a valve chamber 5 communicated below the second suction hole 402, and a second channel 501 communicated between the first channel 403 and the inner wall of the valve chamber 5, and the bottom of the support table 401 is provided with a first hole 502 communicated below the valve chamber 5, and a vertically arranged insertion pipe 503 is slidingly inserted into the first hole 502, the top end of the insertion pipe 503 is fixed with a valve plate 504 matched with the internal size of the valve chamber 5, the inner wall of the insertion pipe 503 is provided with a second hole 505 communicated with the inside of the valve chamber 5, a second spring 506 is installed above the valve plate 504 for elastically supporting the valve plate 504, the rotary table 201 is provided with a corresponding butt joint hole 507, and the butt joint hole 507 is communicated with the first suction hole 203, the support table 401 is rotatably installed on the top of the extension end of the second electric push rod 4, and the rotary table 201 and the support table 401 are installed with magnetic stones magnetically attracted to each other, when the device is used, during the process of using the support table 401 to lift and assist the wafer to be placed into or taken out, if the support table 401 is controlled by the second electric push rod 4 to be lifted upward, the bottom of the support table 401 is separated from the inside of the rotary table 201, the bottom end of the insertion pipe 503 loses the extrusion of the rotary table 201, and under the elastic support of the second spring 506, the insertion pipe 503 drives the valve plate 504 to move downward to below the connection position of the second channel 501 and the valve chamber 5, in this state, the first channel 403, the second channel 501, the valve chamber 5 and the second suction hole 402 are in a communicated state, the airflow suction implemented by the air pump will act on the second suction hole 402 through the communication of the adapter 404 and the first channel 403, which facilitates the reinforcement connection when the wafer is placed on the top of the support table 401, if the support table 401 is moved downward to be retracted into the rotary table 201, the bottom of the support table 401 is attached to the inside of the rotary table 201, the bottom of the insertion pipe 503 is supported by the inside of the rotary table 201, which moves upward to overcome the elastic support of the second spring 506, the insertion pipe 503 drives the valve plate 504 to move upward to above the connection position of the second channel 501 and the valve chamber 5, in this state, the first channel 403, the second channel 501, the valve chamber 5, the second hole 505, the insertion pipe 503, the butt joint hole 507 and the first suction hole 203 are in a communicated state, the airflow suction implemented by the air pump will act on the first suction hole 203, which facilitates the reinforcement connection when the wafer is placed on the top of the rotary table 201, and at this time, the second suction hole 402 is blocked by the valve plate 504 and there is no airflow suction, which makes the device in use, through the lifting of the support table 401, the control of the airflow suction at the first suction hole 203 and the second suction hole 402 can be realized, so that when the support table 401 is lifted, the airflow suction at the first suction hole 203 is automatically interrupted, the airflow suction at the second suction hole 402 is automatically started, after the support table 401 is lowered in place, the suction at the first suction hole 203 is automatically started, and the airflow suction at the second suction hole 402 is automatically interrupted, which can effectively guarantee the stability and convenience of the wafer transferred by the support table 401.

[0062] By installing magnets with magnetic attraction in the turntable 201 and the supporting table 401, and rotatingly connecting the supporting table 401 at the top of the second electric push rod 4, the turntable 201 will not interfere with the docking of the insertion tube 503 and the docking hole 507 when rotating the wafer, which is beneficial to ensure the stability of the device during operation.

[0063] Embodiment 2: Based on embodiment 1, this embodiment further comprises: a temperature and humidity control shunt device, see Figure 1 Figure 14 , specifically, the shunt device is suitable for the glue coating and developing machine in embodiment 1, the flow capacity of the main pipeline 601 in the shunt device is set as the sum of the flow capacities of the four shunt pipelines 602, the shunt box 6 is fixed with a cross plate 7, the shunt box 6 is divided into four independent cavities of equal size by the cross plate 7, the four independent cavities are one-to-one corresponding to the four shunt pipelines 602, and each independent cavity is fixed with a connecting bucket 701 connected with the corresponding shunt pipeline 602, the connecting bucket 701 is provided in a funnel structure, when the device is used, the shunt box 6 is divided into independent cavities corresponding to the four shunt pipelines 602 by the cross plate 7, and the stability and uniformity of the constant temperature and humidity gas shunted into the four shunt pipelines 602 through the funnel structure of the connecting bucket 701 in each independent cavity can be further ensured, which is beneficial to ensure the stability of the constant temperature and humidity gas shunted and delivered by the device.

[0064] In the specific implementation process, as shown in Figure 10 and Figure 14 , the shunt device further comprises a pipeline assembly corresponding to the four shunt pipelines 602, the pipeline assembly comprises a storage box 8, and a shaft tube 801 is fixed at the center position in the storage box 8, a sleeve tube 802 located in the storage box 8 is rotatably sleeved on the shaft tube 801, a through hole is formed in the end wall of the shaft tube 801 and communicates with the sleeve tube 802, one end of the shaft tube 801 extends out of the storage box 8 and is connected with the corresponding shunt pipeline 602 through a first hose 803, the sleeve tube 802 is fixedly connected with a second hose 804 coiled in the storage box 8, and the outer end of the second hose 804 extends out of the storage box 8, a spring structure is arranged in the end wall of the second hose 804 as a support, a clock spring 805 is arranged in the storage box 8, and the outer end of the clock spring 805 is fixedly connected with the storage box 8, and the inner end of the clock spring 805 is fixedly connected with the sleeve tube 802.

[0065] ​When the device is used, the constant-temperature and constant-humidity gas is discharged through the outlet of the THC equipment, is transported through the shunt device, and is evenly and stably introduced into the cavity 2 of each gluing device. In order to ensure that the flow rates and heat losses in the gas transportation processes of each path are the same, the lengths of the pipeline assemblies connected between each shunt pipeline 602 and the gluing device are set to be the same. The gas enters the first hose 803 through the shunt pipeline 602, then enters the shaft tube 801, enters the sleeve tube 802 through the through hole, and finally flows to the gluing device through the second hose 804. The lengths and sizes of the first hose 803, the shaft tube 801, the sleeve tube 802 and the spring 805 in each pipeline assembly are consistent. This makes it possible that when each pipeline assembly is used for gas transportation, interference caused by different gas transportation paths does not occur. In the actual use process, the spring 805 is in a winding state. The second hose 804 is wound in the storage box 8 through the elastic winding of the spring 805. When different pipeline assemblies are connected to different gluing devices, the worker only needs to pull out the second hose 804 of an appropriate length according to the position of the gluing device for connection operation. In the case of not changing the total length of the gas flow path, the pipeline is effectively arranged to avoid the pipeline being in chaos on the machine 1. This is conducive to ensuring the stability of the device in actual use. The spring structure arranged in the end wall of the second hose 804 can support the end wall of the second hose 804 to avoid the second hose 804 from being crushed and collapsed when it is wound in the storage box 8. This is conducive to ensuring the stability of the pipeline assembly in transporting constant-temperature and constant-humidity gas.

[0066] Specifically, the working principle and operation method of the present application are as follows:

[0067] In the glue coating operation, the device controls the support 204 to swing counterclockwise 90° by the second servo motor 302, and the spray head 206 and the cover plate 301 are moved away from the top of the cavity 2, and then the second electric push rod 4 controls the support platform 401 to rise upward, the wafer is grabbed to the top of the support platform 401 by the mechanical hand 103, and the wafer is connected stably to the top of the support platform 401 by the air suction of the second suction hole 402, the second electric push rod 4 controls the support platform 401 to drive the wafer to enter the cavity 2 downward, and finally the wafer is parked on the turntable 201, and the wafer is connected stably to the turntable 201 by the air suction of the first suction hole 203, the second servo motor 302 controls the support 204 to rotate reversely 90°, and the spray head 206 and the cover plate 301 are reset above the cavity 2, and then the first electric push rod 205 controls the spray head 206 and the pressing block 306 to move downward, and the cover plate 301 is pressed tightly on the cavity 2, and the spray head 206 enters the cavity 2, at this time, the constant temperature and humidity gas provided by the THC device is delivered to the cavities 2 in the plurality of glue coating devices through the shunt device, and the environment in the plurality of cavities 2 is ensured to be constant, and then the first servo motor 202 starts to drive the turntable 201 to rotate with the wafer, and the operation of coating and film forming on the wafer surface is realized by the solvent, the photoresist and the cleaning water sprayed in the different spray heads 206 in turn, after the glue coating is completed, the second electric push rod 4 controls the support platform 401 to drive the wafer to rise to the outside of the cavity 2 in the state that the cover plate 301 is opened, the wafer is grabbed to the developing device by the mechanical hand 103 for developing operation, and finally the glue coating and developing processing of the wafer is realized.

[0068] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A coating and developing machine, comprising a machine base (1), characterized in that: The machine (1) is provided with a coating area (101) and a developing area (102). Four coating devices are installed in the coating area (101), and multiple developing devices are installed in the developing area (102). A robotic arm (103) is installed on the top of the machine (1) between the coating devices and the developing devices. The coating device includes a cavity (2), and a turntable (201) rotates in the cavity (2). A first servo motor (202) is fixed in the machine (1), and the drive shaft of the first servo motor (202) is connected to the turntable (201) for transmission. A number of evenly distributed first suction holes (203) are opened on the top of the turntable (201). A bracket (204) located outside the cavity (2) is fixed on the top of the machine (1), and a vertically arranged first electric push rod (205) is fixed on the bracket (204). A nozzle (206) is fixed on the telescopic end of the first electric push rod (205). The bracket (204) is fixed with a connecting arm (3) extending to the top of the cavity (2), and a cover plate (301) adapted to the cavity (2) is installed on the connecting arm (3). The cover plate (301) has a through hole adapted to the nozzle (206). The bottom of the bracket (204) is rotatably connected to the top of the machine base (1). A second servo motor (302) is fixed inside the machine base (1), and the drive shaft of the second servo motor (302) is fixedly connected to the bracket (204). A vertically arranged guide post (304) is slidably inserted on the connecting arm (3), and the bottom end of the guide post (304) is fixedly connected to the cover plate (301). A first spring (305) elastically supported between the top of the connecting arm (3) and the top of the guide post (304) is movably sleeved on the outside of the guide post (304). A pressure block (306) is fixed on the telescopic end of the first electric push rod (205). The machine base (1) is fixed with a vertically arranged second electric push rod (4), and the telescopic end of the second electric push rod (4) extends into the turntable (201). A support platform (401) is installed on the telescopic end of the second electric push rod (4) and is movably arranged inside the turntable (201). The top of the support platform (401) is provided with a number of evenly distributed second suction holes (402). The machine (1) is equipped with a diversion device, and the diversion device includes a diversion box (6). A main pipe (601) is opened on one side of the diversion box (6), and four evenly distributed diversion pipes (602) are opened on the other side of the diversion box (6). The four diversion pipes (602) are respectively connected to four glue application devices, and the length of the connecting pipes is equal. The flow rate of the main pipe (601) in the diversion device is set to the sum of the flow rates in the four diversion pipes (602). A cross plate (7) is fixed inside the diversion box (6). The diversion box (6) is divided into four independent cavities of equal size by the cross plate (7). The four independent cavities correspond one-to-one with the four diversion pipes (602). Each independent cavity is fixed with a receiving bucket (701) connected to the corresponding diversion pipe (602). The receiving bucket (701) is set as a funnel-shaped structure. The diversion device also includes a pipeline assembly corresponding to each of the four diversion pipes (602). A second hose (804) is wound inside the pipeline assembly. Different pipeline assemblies are connected to different adhesive application devices. The second hose (804) of an appropriate length is pulled out according to the position of the adhesive application device for connection. The pipeline is arranged without changing the total length of the gas flow path. A spring structure is provided in the end wall of the second hose (804) for support to prevent the second hose (804) from being squeezed and collapsed when it is wound up.

2. The coating and developing machine according to claim 1, characterized in that: The cover plate (301) is fixed with a spray pipe (303) arranged in a circle, and the spray pipe (303) has a number of spray holes arranged in a circle, and the spray holes point into the cavity (2). The spray pipes (303) in the four adhesive coating devices are respectively connected to the four diversion pipes (602).

3. The coating and developing machine according to claim 1, characterized in that: The telescopic end of the second electric actuator (4) is configured to be through the top and bottom. A vertically arranged first channel (403) is opened at the inner axis position of the second electric actuator (4). The second suction hole (402) is connected to the first channel (403). An adapter (404) connected to the first channel (403) is rotatably installed at the bottom end of the telescopic end of the second electric actuator (4).

4. A coating and developing machine according to claim 3, characterized in that: The support platform (401) has a valve chamber (5) connected to the lower part of the second suction hole (402) and a second channel (501) connected between the first channel (403) and the inner wall of the valve chamber (5). The bottom of the support platform (401) has a first hole (502) connected to the lower part of the valve chamber (5), and a vertically arranged insertion tube (503) is slidably inserted into the first hole (502). The top of the insertion tube (503) is fixed with a valve plate (504) adapted to the internal size of the valve chamber (5). The inner wall of the insertion tube (503) has a second hole (505) connected to the inside of the valve chamber (5). A second spring (506) for elastic support is installed above the valve plate (504). The turntable (201) has a docking hole (507) corresponding to the insertion tube (503), and the docking hole (507) is connected to the first suction hole (203).

5. A coating and developing machine according to claim 4, characterized in that: The support platform (401) is rotatably mounted on the top of the telescopic end of the second electric push rod (4), and magnets that attract each other are installed inside the turntable (201) and the support platform (401).

6. A temperature and humidity control diversion device, said diversion device being applicable to the coating and developing machine as described in any one of claims 1-5, characterized in that: The piping assembly in the diversion device includes a storage box (8), and a central tube (801) is fixed in the center of the storage box (8). A sleeve (802) located in the storage box (8) is rotatably sleeved on the central tube (801). A through hole communicating with the sleeve (802) is opened on the end wall of the central tube (801). One end of the central tube (801) extends to the outside of the storage box (8) and is connected to the corresponding diversion pipe (602) by a first flexible hose (803). A second flexible hose (804) is fixedly connected to the sleeve (802) and coiled in the storage box (8). The outer end of the second flexible hose (804) extends to the outside of the storage box (8). A spring (805) is provided in the storage box (8), and the outer end of the spring (805) is fixedly connected to the storage box (8). The inner end of the spring (805) is fixedly connected to the sleeve (802).

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