Memory bank heat dissipation device and electronic equipment
By incorporating a heat sink and a junction box in the memory module's cooling system to create a cooling channel, the problem of low heat dissipation efficiency in memory modules is solved, achieving efficient heat transfer and convenient installation of the memory modules.
Patent Information
- Application Number
- CN202410534342.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-29
- Publication Date
- 2025-11-07
AI Technical Summary
Current memory modules have low heat dissipation efficiency.
Design a memory module heat dissipation device, which forms a cooling channel by setting up multiple heat sinks and busbars, improves heat dissipation efficiency by connecting the branch channels and the main channel, and enhances heat transfer by using heat-conducting plates.
It improves the heat dissipation efficiency of the memory module, enhances the heat transfer effect, and makes the memory module easy and quick to install and remove.
Smart Images
Figure CN120909400A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of memory bank heat dissipation, in particular to a memory bank heat dissipation device and an electronic device. BACKGROUND
[0002] The prior art mainly uses a solid heat dissipation plate structure to dissipate heat from the memory bank, and the heat dissipation efficiency is low. SUMMARY
[0003] The present application provides a memory bank heat dissipation device and an electronic device to solve the problem of low heat dissipation efficiency of the memory bank.
[0004] The present application provides a memory bank heat dissipation device for installing a memory bank and dissipating heat from the memory bank. The memory bank heat dissipation device comprises a plurality of heat dissipation plates and two bus connectors. The plurality of heat dissipation plates are arranged at intervals along a first direction, and a containing space is defined between adjacent heat dissipation plates. The containing space is used to contain the memory bank, so that the memory bank is in heat transfer connection with the heat dissipation plates. The two ends of the plurality of heat dissipation plates along a second direction are respectively connected to the two bus connectors. The heat dissipation plate is provided with a shunt channel, and the shunt channel penetrates the heat dissipation plate along the second direction. The bus connector has a total flow channel, and the two ends of each shunt channel are respectively communicated with the total flow channels of the two bus connectors to form a cooling flow channel.
[0005] The present application forms a cooling flow channel by connecting the bus connector with the heat dissipation plate provided with a shunt channel to dissipate heat from the memory bank, and the heat dissipation efficiency is high.
[0006] In a possible implementation, the heat dissipation plate is provided with a positioning boss at each end along the second direction. The bus connector is provided with a positioning groove on the side facing the heat dissipation plate. The positioning groove cooperates with the positioning boss.
[0007] In a possible implementation, the heat dissipation plate has two end portions protruding along the second direction. The side protrusions are respectively provided on both sides of the end portion along the first direction.
[0008] The end portion and the side protrusion combine to form a cross-shaped positioning boss.
[0009] The positioning groove comprises a first groove and a plurality of second grooves.
[0010] The first groove is a strip-shaped groove extending along the first direction.
[0011] The plurality of second grooves are arranged at intervals along the first direction, and each second groove intersects with the first groove to form a cross shape.
[0012] The plurality of side protrusions are respectively matched in the first groove, and the plurality of end portions are respectively matched in the plurality of second grooves.
[0013] In a possible implementation, the surface of the side protrusion away from the end portion is recessed with a matching groove.
[0014] The memory bar is clamped between the groove bottom surfaces of the mating grooves of the mutually approaching side protrusions of the two adjacent heat sinks.
[0015] In a possible implementation, the first groove divides the portion of the bus bar near the side of the heat sink into two protrusions located on both sides of the first groove.
[0016] The plurality of second grooves respectively divide the two protrusions into a plurality of protruding blocks spaced in the first direction.
[0017] The end portion is clamped between the protruding blocks adjacent in the first direction, and the side protrusion is clamped between the protruding blocks adjacent in the insertion direction of the memory bar.
[0018] The protruding block away from the insertion position of the memory bar in the insertion direction has an abutting portion protruding toward the side close to the memory bar in the second direction.
[0019] The abutting portion is used to abut the memory bar in the insertion direction of the memory bar.
[0020] The insertion direction is perpendicular to the first direction and the second direction.
[0021] In a possible implementation, the memory bar includes a circuit board and a memory bar chip, and the memory bar chip is connected to the two side plate surfaces of the circuit board.
[0022] The memory bar heat dissipation device further includes a heat conduction sheet, which is in heat conduction connection between the memory bar chip and the heat sink.
[0023] In a possible implementation, the shunt channel at least partially overlaps the projection of the heat conduction sheet in a plane perpendicular to the first direction.
[0024] In a possible implementation, the total flow channel includes a first hole and a plurality of second holes, and the plurality of second holes respectively communicate with the first hole, and the plurality of shunt channels respectively communicate with the plurality of second holes.
[0025] The two ends of the shunt channel are respectively enlarged in the radial direction to form receiving grooves, and the memory bar heat dissipation device further includes a sealing member accommodated in the receiving grooves.
[0026] The sealing member is sealingly fitted between the heat sink and the bus bar.
[0027] In a possible implementation, the heat sink includes two sub-plates, and the sub-plates are provided with sub-plate grooves in the second direction.
[0028] The two sub-plates form the heat sink by welding, and the two sub-plate grooves form the shunt channel.
[0029] The application also provides an electronic device, comprising a mainboard, a memory bank heat dissipation device, a plurality of memory banks and a memory bank slot, the memory bank slot being arranged on the mainboard. The plurality of memory banks are respectively arranged in a plurality of accommodating spaces of the memory bank heat dissipation device, and the plurality of memory banks are respectively inserted and matched with the memory bank slot to be electrically connected to the mainboard. BRIEF DESCRIPTION OF DRAWINGS
[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. Other related drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.
[0031] Figure 1 It is an internal view of the electronic device of the embodiment of the present application;
[0032] Figure 2 It is a structural schematic view of the memory bank heat dissipation device of the embodiment of the present application installed with the memory bank;
[0033] Figure 3 It is an exploded view of Figure 2 ;
[0034] Figure 4 It is a sectional view along the line A-A of Figure 2 ;
[0035] Figure 5 It is a structural schematic view of the bus joint of the embodiment;
[0036] Figure 6 It is a structural schematic view of the heat dissipation plate of the embodiment;
[0037] Figure 7 It is an enlarged view of the C area of Figure 6 ;
[0038] Figure 8 It is a top view of the memory bank heat dissipation device of the embodiment of the present application installed with the memory bank inserted into the memory bank slot, wherein one bus joint is hidden and not shown;
[0039] Figure 9 It is an enlarged view of the D area in Figure 8 ;
[0040] Figure 10 It is an exploded view of the B area in Figure 2 ;
[0041] Figure 11 It is a side view of Figure 2 , wherein one bus joint is hidden and not shown;
[0042] Figure 12 For Figure 6 Sectional view along line E-E.
[0043] Main element symbol explanation:
[0044] Electronic device 1000
[0045] Memory bank heat dissipation device 100
[0046] Chassis 200
[0047] Mainboard 300
[0048] Memory bank slot piece 400
[0049] Slot 401
[0050] Memory bank 10
[0051] Circuit board 101
[0052] Memory bank chip 102
[0053] Heat dissipation plate 11
[0054] Shunt channel 111
[0055] End 112
[0056] Side abutting surface 1121
[0057] Side protrusion 113
[0058] Vertical abutting surface 1131
[0059] Matching groove 114
[0060] Groove bottom surface 1141
[0061] Positioning boss 115
[0062] Accommodation groove 116
[0063] Subboard 12
[0064] Subboard groove 121
[0065] Bus joint 13
[0066] Main flow channel 131
[0067] First hole channel 132
[0068] Second hole channel 133
[0069] Positioning groove 134
[0070] First groove 135
[0071] Second recess 136
[0072] Ridges 14
[0073] Bumps 141
[0074] Abutting portions 142
[0075] Accommodating space 15
[0076] Cooling flow passage 16
[0077] Thermally conductive sheet 17
[0078] Seal 18
[0079] First screw hole 191
[0080] Second screw hole 192
[0081] Screw 20
[0082] First direction X
[0083] Second direction Y
[0084] Insertion direction Z
[0085] Mounting region L DETAILED DESCRIPTION
[0086] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application.
[0087] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. When an element is referred to as being "disposed" on another element, it can be directly disposed on the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only.
[0088] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0089] Some embodiments of the present application are described in detail. The following embodiments and features of the embodiments can be combined with each other in the case of no conflict.
[0090] Embodiments
[0091] The present embodiment provides an electronic device 1000, which can be a computer host for example.
[0092] Referring to Figure 1 , the electronic device 1000 comprises a case 200, a mainboard 300, a memory slot 400, a memory heat dissipation device 100 and a plurality of memory sticks 10. The case 200 has a mounting area L, and the mainboard 300 is mounted in the mounting area L. The memory slot 400 is arranged on the mainboard 300, and the memory slot 400 has a slot 401 for connecting the memory stick 10. Each memory stick 10 has a gold finger end, and the gold finger end is directed to the slot 401 of the memory slot 400 along a plug-in direction Z. During installation, the gold finger end of the memory stick 10 is moved to the memory slot 400 along the plug-in direction Z and inserted into the slot 401. The memory stick 10 is plugged into the memory slot 400 through the gold finger end to electrically connect the memory stick 10 to the mainboard 300.
[0093] Referring to Figure 2 and Figure 3 , in the present embodiment, the memory heat dissipation device 100 comprises a plurality of heat dissipation plates 11 and two bus connectors 13. The plurality of heat dissipation plates 11 are arranged at intervals along a first direction X, and an accommodation space 15 is defined between adjacent heat dissipation plates 11 for accommodating the memory stick 10, so that the memory stick 10 is thermally connected to the heat dissipation plate 11. The two ends of the plurality of heat dissipation plates 11 along a second direction Y are respectively connected to the two bus connectors 13.
[0094] Referring to Figure 4 , in the present embodiment, the heat dissipation plate 11 is provided with a branch flow channel 111, and the branch flow channel 111 penetrates the heat dissipation plate 11 along the second direction Y. The bus connector 13 has a total flow channel 131, and the two ends of each branch flow channel 111 are respectively communicated with the total flow channels 131 of the two bus connectors 13 to form a cooling flow channel 16.
[0095] In the present embodiment, the total flow channel 131 and the branch flow channel 111 are connected at the joint of the bus connector 13 and the heat dissipation plate 11 to form a complete cooling flow channel 16.
[0096] Referring to Figure 2 and Figure 3 , in the present embodiment, the interval distance between the two adjacent heat dissipation plates 11 is the same, and the accommodation space 15 corresponds to the heat dissipation plate 11 along the first direction X. Each memory stick 10 is arranged in one accommodation space 15, and the gold finger end of the memory stick 10 protrudes out of the accommodation space 15 for easy installation.
[0097] In the embodiment, the memory stick 10 comprises a circuit board 101 and memory stick chips 102 connected to both sides of the circuit board 101. The memory stick heat dissipation device 100 further comprises a heat conduction sheet 17 connected in heat conduction between the memory stick chips 102 and the heat dissipation plate 11. The heat conduction sheet 17 is arranged on the side of the heat dissipation plate 11 facing the memory stick chips 102 along the first direction X, and the heat conduction sheet 17 corresponds to the memory stick chips 102 along the first direction X. When the memory stick 10 is arranged in the accommodating space 15, the memory stick chips 102 are attached to the heat conduction sheet 17, and heat can be transferred to the heat dissipation plate 11 through the heat conduction sheet 17.
[0098] In the embodiment, the heat conduction sheet 17 is a glue material. In other embodiments, the heat conduction sheet 17 can also be other materials with good heat conduction.
[0099] Referring to Figure 3 and Figure 4 In the embodiment, the shunt channel 111 and the projection of the heat conduction sheet 17 in the plane perpendicular to the first direction X at least partially coincide, so as to increase the heat dissipation efficiency between the shunt channel 111 and the heat conduction sheet 17.
[0100] In the embodiment, the shunt channel 111 is divided into two parallel flow channels along the second direction Y, so as to correspond to the shape of the memory stick chips 102 and increase the heat dissipation area. In other embodiments, the shunt channel can also adopt a plurality of parallel flow channels, a flow channel with a wider cross section, or other flow channels with shapes that increase heat exchange efficiency for heat dissipation.
[0101] Referring to Figure 5 , Figure 6 and Figure 7 The heat dissipation plate 11 is provided with a positioning boss 115 at both ends along the second direction Y. The side of the bus bar 13 facing the heat dissipation plate 11 is provided with a positioning recess 134, and the positioning recess 134 is matched with the positioning boss 115 to fix the heat dissipation plate 11 between the two bus bars 13.
[0102] In the embodiment, the positioning bosses 115 at both ends of the plurality of heat dissipation plates 11 along the second direction Y are matched with the two bus bars 13 respectively, so that the plurality of heat dissipation plates 11 are fixed by the two bus bars 13.
[0103] Specifically, referring to Figure 5 , Figure 6 and Figure 7 In the embodiment, the heat dissipation plate 11 has two end portions 112 protruding along the second direction Y, and two side protrusions 113 are respectively provided on both sides of the end portion 112 along the first direction X. Each side of the end portion 112 and the two side protrusions 113 form a cross-shaped positioning boss 115.
[0104] The positioning groove 134 comprises a first groove 135 and a plurality of second grooves 136. The first groove 135 is a strip-shaped groove extending along the first direction X, and the second groove 136 is a strip-shaped groove extending along the insertion direction Z. The plurality of second grooves 136 are sequentially and spacedly arranged along the first direction X, and each of the second grooves 136 intersects with the first groove 135 to form a cross-shaped groove.
[0105] A cross-shaped positioning boss 115 is matched with a cross-shaped positioning groove 134. In each of the positioning bosses 115, the end portion 112 has two side abutting surfaces 1121 along the first direction X towards two sides of the heat dissipation plate 11, and the two side abutting surfaces 1121 respectively abut two side surfaces of the second groove 136 along the second direction Y. In each of the positioning bosses 115, the side protrusion 113 has two vertical abutting surfaces 1131 along the insertion direction Z, and the two vertical abutting surfaces 1131 respectively abut two side surfaces of the first groove 135 along the insertion direction Z. Through the matching of the cross-shaped positioning boss 115 and the cross-shaped positioning groove 134, the heat dissipation plate 11 can be simultaneously limited along the first direction X and the insertion direction Z.
[0106] In the embodiment, the end surface of the side protrusion 113 along the second direction Y is flush with the end surface of the end portion 112 along the second direction Y, and the bottom surface of the first groove 135 is flush with the bottom surface of the second groove 136, so as to achieve better engagement effect.
[0107] In the embodiment, the plurality of side protrusions 113 are respectively matched with the first groove 135, and the plurality of end portions 112 are respectively matched with the plurality of second grooves 136, so as to limit the displacement of the plurality of heat dissipation plates 11 along the first direction X and the insertion direction Z.
[0108] In the embodiment, when the second groove 136 is opened, the same reference machining is used to avoid the cumulative error of the plurality of second grooves 136 during machining. For example, during machining, the first groove 135 along one end of the first direction X is taken as a reference, and the plurality of second grooves 136 are machined respectively.
[0109] Referring to Figure 5 , Figure 6 and Figure 7In the embodiment, the first groove 135 divides the part of the bus bar 13 close to the heat sink 11 into two protrusions 14 on both sides of the first groove 135. The two protrusions 14 are respectively on both sides of the first groove 135 along the insertion direction Z, and the second groove 136 further divides the protrusions 14 to form two groups of protrusions 141 distributed on both sides of the first groove 135 along the insertion direction Z. The protrusions 141 abut against the heat sink 11 along the two sides thereof along the first direction X, and the bottom surface of the protrusions 141 along the insertion direction Z abuts against the surface of the side protrusion 113 along the insertion direction Z. Each group of four protrusions 141 distributed on the four corners of the positioning boss 115 defines a heat sink 11, and the protrusions 141 adjacent along the first direction X abut against the end portion 112 respectively to limit the movement of the heat sink 11 along the first direction X. The protrusions 141 adjacent along the insertion direction Z abut against the side protrusion 113 respectively to limit the movement of the heat sink 11 along the insertion direction Z.
[0110] Referring to Figures 5 to 8 In the embodiment, the protrusions 141 have abutting portions 142 protruding toward the side close to the memory strip 10 along the second direction Y. The abutting portions 142 abut against the memory strip 10 along the insertion direction Z thereof.
[0111] In the embodiment, the memory strip 10 is inserted into the memory strip slot 400 along the insertion direction Z, and the abutting portions 142 abut against the upper side of the memory strip 10 along the insertion direction Z to effectively limit the memory strip 10 along the insertion direction Z and prevent accidental disengagement. The abutting portions 142 have small size and occupy small installation space.
[0112] Referring to Figure 7 , Figure 8 and Figure 9 In the embodiment, the surface of the side protrusion 113 away from the end portion 112 is concavely provided with a matching groove 114, and the two matching grooves 114 respectively have two groove bottom surfaces 1141 toward both sides of the heat sink 11 along the first direction X. The memory strip 10 is clamped between the groove bottom surfaces 1141 of the matching grooves 114 of the side protrusions 113 of the two adjacent heat sinks 11 close to each other.
[0113] In the embodiment, the heat conduction sheet 17 can slightly deform to tightly adhere to the memory strip chip 102 and the heat sink 11 when clamping the memory strip 10 in the matching groove 114, so that the heat conduction efficiency among the heat conduction sheet 17, the heat sink 11 and the memory strip chip 102 can be improved.
[0114] Referring to Figure 10In the embodiment, the positioning boss 115 on one side of the heat dissipation plate 11 is fixedly connected to the positioning groove 134 by two fixing screws 20, and the fixing screws 20 distributed on both sides of the positioning boss 115 along the insertion direction Z fix each heat dissipation plate 11 between two bus connectors 13 to limit the displacement of the heat dissipation plate 11 along the second direction Y.
[0115] Referring to Figure 10 and Figure 11 In the embodiment, the sealing member 18 is a sealing ring, the thickness of the sealing member 18 is greater than the depth of the accommodating groove 116, and when the screw 20 fixes the heat dissipation plate 11, the screw 20 is sequentially matched with the first screw hole 191 and the second screw hole 192 to connect and press the heat dissipation plate 11 and the bus connector 13 and the sealing member 18. The sealing member 18 can be deformed to fill the small gap under the action of external force to achieve reliable sealing effect.
[0116] In other embodiments, the sealing member can also be sealing glue or other sealing materials suitable for pipeline sealing, which is used to seal the joint of the heat dissipation plate and the bus connector.
[0117] Referring to Figure 12 In the embodiment, the heat dissipation plate 11 includes two sub-plates 12, and the sub-plate 12 is provided with a sub-plate groove 121 along the second direction Y. The two sub-plates 12 can form the heat dissipation plate 11 by welding, and the two sub-plate grooves 121 are connected to form the shunt channel 111.
[0118] In summary, the embodiment installs the memory strip 10 in the accommodation space 15 by the heat dissipation plate 11 and the bus connector 13, forms the cooling channel 16 by the shunt channel 111 in the heat dissipation plate 11 and the total flow channel 131 in the bus connector 13, which can improve the heat dissipation efficiency of the memory strip 10. Moreover, the memory strip heat dissipation device 100 in the embodiment can integrally install multiple memory strips 10, and the memory strip 10 is convenient and fast to disassemble and assemble.
[0119] The above embodiments are only used to illustrate the technical solutions of the present application and not to limit it, although the present application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.
Claims
1. A memory bar heat dissipation device for mounting and dissipating heat of a memory bar, the memory bar heat dissipation device comprising: a plurality of heat dissipation plates arranged in a first direction with a spacing therebetween, wherein the spacing between adjacent heat dissipation plates defines a receiving space for receiving the memory bar so that the memory bar is in thermal contact with the heat dissipation plates; and two bus connectors connected to the two ends of the plurality of heat dissipation plates in a second direction perpendicular to the first direction. 2.The memory bar heat dissipation device of claim 1, wherein: the two ends of the heat dissipation plates in the second direction are respectively provided with positioning bosses; the bus connectors are provided with positioning grooves on the side faces facing the heat dissipation plates; and the positioning grooves are matched with the positioning bosses. 3.The memory bar heat dissipation device of claim 2, wherein: the heat dissipation plates have two end portions protruding in the second direction, and the two end portions are respectively provided with side protrusions on the two sides thereof in the first direction; the end portions and the side protrusions combine to form the positioning bosses in a cross shape; the positioning grooves comprise a first groove and a plurality of second grooves; the first groove is a strip-shaped groove extending in the first direction; the plurality of second grooves are arranged in the first direction with a spacing therebetween, and each of the second grooves intersects with the first groove to form a cross shape; and the side protrusions are respectively matched with the first groove, and the end portions are respectively matched with the second grooves. 4.The memory bar heat dissipation device of claim 3, wherein: the side protrusions are respectively provided with matching grooves on the surfaces thereof away from the end portions; and the memory bar is clamped between the groove bottom surfaces of the matching grooves of the side protrusions of the two adjacent heat dissipation plates. 5.The memory bar heat dissipation device of claim 3, wherein: the first groove divides the portion of the bus connector close to the heat dissipation plates into two protrusions on the two sides of the first groove; the plurality of second grooves divide the two protrusions into a plurality of protrusions spaced in the first direction; the end portions are clamped between the protrusions adjacent in the first direction, and the side protrusions are clamped between the protrusions adjacent in the insertion direction of the memory bar; the protrusions away from the insertion position of the memory bar in the insertion direction are provided with abutting portions protruding toward the side close to the memory bar in the second direction; the abutting portions are used for abutting the memory bar in the insertion direction of the memory bar; and the insertion direction is perpendicular to the first direction and the second direction. 6.The memory bar heat dissipation device of claim 1, wherein: the memory bar comprises a circuit board and memory bar chips connected to the two side surfaces of the circuit board. The memory bank heat dissipation device further comprises a heat conduction sheet, which is in thermal conduction connection between the memory bank chip and the heat dissipation plate.
7. The memory bank heat dissipation device according to claim 6, wherein: The projection of the shunt channel and the heat conduction sheet in a plane perpendicular to the first direction at least partially overlaps.
8. The memory bank heat dissipation device according to claim 1, wherein: The total flow channel comprises a first hole and a plurality of second holes, and the plurality of second holes are respectively communicated with the first hole, and the plurality of shunt channels are respectively communicated with the plurality of second holes; Both ends of the shunt channel are respectively enlarged along the radial direction to form a receiving groove, and the memory bank heat dissipation device further comprises a sealing member, which is accommodated in the receiving groove; The sealing member is sealingly fitted between the heat dissipation plate and the bus joint.
9. The memory bank heat dissipation device according to claim 1, wherein: The heat dissipation plate comprises two sub-plates, and the sub-plates are provided with sub-plate grooves along a second direction; The two sub-plates are welded to form a heat dissipation plate, and the two sub-plate grooves are connected to form the shunt channel.
10. An electronic device, comprising: It comprises: a mainboard; a memory bank slot member, which is provided on the mainboard; the memory bank heat dissipation device according to any one of claims 1-9 and a plurality of memory banks; The plurality of memory banks are respectively installed in the plurality of accommodation spaces of the memory bank heat dissipation device, and the plurality of memory banks are respectively inserted and fitted into the memory bank slot to be electrically connected to the mainboard.