Isolation structure, radio frequency device and radar

Abstract

An isolation structure, a radio frequency device and a radar, the isolation structure comprises an electromagnetic gap structure used for preventing signal leakage between a first signal channel and a second signal channel, the electromagnetic gap structure comprises a plurality of metal pieces arranged periodically, and each metal piece is bent.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of radar, and particularly relates to an isolation structure, a radio frequency device and a radar. BACKGROUND

[0002] Waveguide technology is a new type of low-loss transmission line based on parallel plate waveguide, which is very suitable for millimeter wave circuit and device design. Figure 1 As shown in the drawings, if the interfaces cannot be tightly fitted during the assembly of the waveguide, there will be radio frequency signal leakage at the gap of the interface, which will further cause the deterioration of signal transmission performance. SUMMARY

[0003] The embodiment of the present disclosure provides an isolation structure, which comprises an electromagnetic gap structure for preventing signal leakage between a first signal channel and a second signal channel, and the electromagnetic gap structure comprises a plurality of periodically arranged metal pieces, each of which is in a bent shape.

[0004] Exemplarily, the total length of each metal piece is wherein n is a natural number greater than or equal to 1, and λ is the working wavelength of the transmission signal.

[0005] Exemplarily, the output waveguide port of the first signal channel is connected with the input waveguide port of the second signal channel, and a plurality of the metal pieces are arranged around the output waveguide port of the first signal channel and / or the input waveguide port of the second signal channel.

[0006] Exemplarily, the first signal channel and the second signal channel are parallel to each other, and a plurality of the metal pieces are arranged between the first signal channel and the second signal channel.

[0007] Exemplarily, the first signal channel and the second signal channel are both waveguide channels.

[0008] The embodiment of the present disclosure also provides a radio frequency device, which comprises a PCB board and a waveguide structure connected with the PCB board, at least one first waveguide channel is arranged on the PCB board, a second waveguide channel is arranged on the waveguide structure corresponding to the first waveguide channel, and the first waveguide channel and the second waveguide channel are connected to form a signal transmission path for signal transmission; the radio frequency device further comprises an isolation structure, the isolation structure is arranged around the signal transmission path, and the isolation structure comprises a plurality of periodically arranged metal pieces, each of which is in a bent shape.

[0009] The embodiment of the present disclosure further provides a radio frequency device, comprising a PCB board and a waveguide structure connected with the PCB board, at least two first waveguide channels are arranged on the PCB board, a second waveguide channel is arranged on the waveguide structure corresponding to each first waveguide channel, and the first waveguide channel and the second waveguide channel are connected one by one to form at least two signal transmission paths for signal transmission; the radio frequency device further comprises an isolation structure, the isolation structure is arranged between adjacent two signal transmission paths, and the isolation structure comprises a plurality of periodically arranged metal pieces, each metal piece is in a bent shape.

[0010] For example, the total length of each metal piece is wherein n is a natural number greater than or equal to 1, and λ is the working wavelength of the transmission signal.

[0011] For example, the isolation structure is arranged in the PCB board, one end of the metal piece is connected to the metal layer of the PCB board, and the other end is short-circuited.

[0012] For example, the metal piece is at least partially realized by the metal layer in the PCB board.

[0013] For example, the metal piece comprises a main body part, a first bent part and a second bent part connected in sequence.

[0014] For example, the PCB board comprises a plurality of metal layers and a dielectric layer arranged between adjacent metal layers, and the plurality of metal layers at least comprises a first metal layer away from the waveguide structure and a second metal layer on the outermost side of the waveguide structure.

[0015] One end of the main body part is connected to the first metal layer to realize grounding, and the other end of the main body part is connected to one end of the first bent part.

[0016] The first bent part is arranged on the second metal layer and is electrically separated from other parts of the second metal layer.

[0017] One end of the second bent part is connected to the other end of the first bent part, and the other end of the second bent part extends to the side away from the waveguide structure and the terminal end is not connected to the metal layer.

[0018] For example, the main body part and / or the second bent part are realized by a metalized via hole.

[0019] Exemplarily, the PCB board is provided with a chip package body away from one side of the waveguide structure, the chip package body is provided with an integrated circuit die inside, at least one radiation structure is arranged on the surface of the side of the chip package body close to the PCB board, the radiation structure is connected with the integrated circuit die and used for transmitting or receiving radio frequency signals; the radiation structure is arranged opposite to the input waveguide port of the first waveguide channel for signal transmission.

[0020] The radar provided by the embodiment of the present disclosure comprises the radio frequency device as described in any of the embodiments of the present disclosure.

[0021] The isolation structure, the radio frequency device and the radar provided by the embodiment of the present disclosure can reduce the size of the whole isolation structure while preventing signal leakage at the interface by making each metal piece in the electromagnetic gap structure in a bent shape, thereby expanding the use scenarios of the isolation structure and improving the usability of the isolation structure.

[0022] Other features and advantages of the present disclosure will be described in the following description, and some will become apparent from the description, or will be learned through implementation of the present disclosure. Other advantages of the present disclosure can be achieved and obtained through the solutions described in the specification and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0023] The accompanying drawings are used to provide an understanding of the technical solutions of the present disclosure, and constitute a part of the specification, and are used to explain the technical solutions of the present disclosure together with the embodiments of the present disclosure, and do not constitute a limitation on the technical solutions of the present disclosure.

[0024] Figure 1 And Figure 2 Structure schematic diagrams of two gap waveguide structures of the related art;

[0025] Figure 3 Structure schematic diagram of an isolation structure of an exemplary embodiment of the present disclosure;

[0026] Figure 4A Structure schematic diagram of another isolation structure of an exemplary embodiment of the present disclosure;

[0027] Figure 4B Top view of the isolation structure of Figure 4A

[0028] Figure 4C Structure schematic diagram of another isolation structure of an exemplary embodiment of the present disclosure;

[0029] Figure 4D Top view of the isolation structure of Figure 4C

[0030] Figures 5A-5E ​​Structure diagram of a metal piece of an exemplary embodiment of the present disclosure;

[0031] Figures 6A-6B Structure diagram of a radio frequency device of an exemplary embodiment of the present disclosure;

[0032] Figure 6C Structure diagram of another metal piece of an exemplary embodiment of the present disclosure;

[0033] Figure 6D Structure diagram of a PCB of an exemplary embodiment of the present disclosure;

[0034] Figure 6E Structure diagram of a via hole and a blind hole in a second dielectric layer of a PCB of an exemplary embodiment of the present disclosure;

[0035] Figure 7 Structure diagram of another radio frequency device of an exemplary embodiment of the present disclosure;

[0036] Figure 8 Structure diagram of a radio frequency device of an exemplary embodiment of the present disclosure; Figure 4A Structure diagram of a radio frequency device of an exemplary embodiment of the present disclosure; Figure 4C Isolation effect diagram of the isolation structure of the radio frequency device of the present disclosure. DETAILED DESCRIPTION

[0037] In order to make the objects, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail below with reference to the drawings. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other arbitrarily without conflict.

[0038] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood as the common meanings understood by those skilled in the art to which the present disclosure belongs. The terms “first”, “second” and similar terms used in the embodiments of the present disclosure do not represent any order, number or importance, but are only used to distinguish different components. The terms “include” or “contain” and similar terms mean that the components or objects before the terms cover the components or objects listed after the terms and their equivalents, and do not exclude other components or objects.

[0039] As shown in FIG. 1, the radio frequency device of the present disclosure comprises a metal piece 1, a PCB 2 and a radio frequency module 3. Figure 2As shown, to avoid signal leakage, a plurality of periodically arranged protrusions can be arranged at the interface of the upper and lower waveguide channels, the length of each protrusion is 1 / 4 working wavelength (or an integer multiple of 1 / 4 working wavelength), so that even if there is a gap between the upper and lower waveguide channels after assembly, as long as the gap height h between the top of the protrusion and the medium on the other side is less than 1 / 4 working wavelength, the radio frequency signal cannot leak out from the gap. However, since the height of the protrusion needs to be controlled to be 1 / 4 working wavelength (or an integer multiple of 1 / 4 working wavelength), the overall size is large, and in the size-limited scenario, the availability of the waveguide will be greatly reduced.

[0040] As shown in FIG. 1, the electromagnetic gap structure for preventing signal leakage between the first signal channel 10 and the second signal channel 20 includes a plurality of periodically arranged metal pieces 30. Figure 3 As shown in FIG. 1, the electromagnetic gap structure for preventing signal leakage between the first signal channel 10 and the second signal channel 20 includes a plurality of periodically arranged metal pieces 30.

[0041] The isolation structure of the embodiments of the present disclosure can reduce the height H of the metal piece 30 by making each metal piece 30 bent, which can prevent signal leakage while reducing the size of the entire isolation structure, thereby expanding the use scenarios of the isolation structure and improving the availability of the isolation structure.

[0042] In some example embodiments, the total length of each metal piece 30 is wherein n is a natural number greater than or equal to 1, and λ is the working wavelength of the transmitted signal.

[0043] Figure 3 In some example embodiments, the total length of each metal piece 30 is

[0044] In the embodiments of the present disclosure, the shapes of the metal pieces 30 do not need to be exactly the same, i.e., the shapes of different metal pieces 30 can be different. In addition, the number of metal pieces 30 can be set as needed, which is not limited by the embodiments of the present disclosure.

[0045] In the embodiments of the present disclosure, the plurality of metal pieces 30 can be arranged on the medium on one side of the first signal channel 10, or on the medium on one side of the second signal channel 20, which is not limited by the embodiments of the present disclosure.

[0046] In some example embodiments, the output waveguide port of the first signal channel 10 is connected with the input waveguide port of the second signal channel 20, and the plurality of metal pieces 30 are arranged around the output waveguide port of the first signal channel 10 and / or the input waveguide port of the second signal channel 20.

[0047] In some example embodiments, the plurality of metal pieces 30 can be arranged in N rows around the connection between the first signal channel 10 and the second signal channel 20, where N is a natural number greater than or equal to 1. Figure 3

[0048] Figure 4A FIG. 6 is a structural schematic view of another isolation structure according to an example embodiment of the present disclosure, Figure 4B FIG. 7 is a top view of the isolation structure of FIG. 6. In some example embodiments, as shown in FIG. 8, Figure 4A FIG. 9 is a top view of the isolation structure of FIG. 6. In some example embodiments, as shown in FIG. 10, Figure 4A and FIG. 11, Figure 4B the first signal channel 10 and the second signal channel 20 are parallel to each other, and the plurality of metal pieces 30 are arranged between the first signal channel 10 and the second signal channel 20.

[0049] In some example embodiments, the plurality of metal pieces 30 can be arranged in N rows around the connection between the first signal channel 10 and the second signal channel 20, where N is a natural number greater than or equal to 1. Figure 4A and FIG. 11, Figure 4B In some example embodiments, the plurality of metal pieces 30 can be arranged in multiple rows and multiple columns in the region between the first signal channel 10 and the second signal channel 20 to prevent signal leakage and signal interference between the first signal channel 10 and the second signal channel 20.

[0050] In example embodiments of the present disclosure, the bending directions of the metal pieces 30 can be the same or different, and the bending directions of the metal pieces 30 can be set arbitrarily as needed.

[0051] Figure 4C FIG. 6 is a structural schematic view of another isolation structure according to an example embodiment of the present disclosure, Figure 4D FIG. 7 is a top view of the isolation structure of FIG. 6. In some example embodiments, as shown in FIG. 8, Figure 4C FIG. 9 is a top view of the isolation structure of FIG. 6. In some example embodiments, as shown in FIG. 10, Figure 4C and FIG. 11, Figure 4D In some example embodiments, the bending directions of the metal pieces 30 in adjacent rows are opposite, Figure 4D in FIG. 8, the metal pieces 30 in the first row bend to the right, the metal pieces 30 in the second row bend to the left, the metal pieces 30 in the third row bend to the right, and the metal pieces 30 in the fourth row bend to the left.

[0052] The isolation structure according to example embodiments of the present disclosure can be applied to any occasion where it is necessary to prevent signal leakage between two signal channels or to prevent signal interference caused by signal leakage, for example, between a PCB and a PCB, between a PCB and a waveguide structure, between waveguide structures, and the like.

[0053] In some example embodiments, as shown in FIG. 12,​Figures 5A-5E As shown, at least one metal part 30 includes a main body portion 301 and a first bending portion 302 connected to each other. By providing the first bending portion 302, the height H of the metal part 30 is reduced.

[0054] In some exemplary implementations, such as Figures 5A-5E As shown, the included angle between the first bent portion 302 and the main body portion 301 is less than or equal to 90°, so as to reduce the height H of the metal part 30. In other examples, the included angle between the first bent portion 302 and the main body portion 301 may also be greater than 90°, and this embodiment of the present disclosure does not limit this.

[0055] In some exemplary implementations, such as Figures 5A-5B As shown, the shape of the first bend 302 can be a straight line.

[0056] In some exemplary implementations, such as Figure 5C As shown, the shape of the first bending portion 302 can be a curve.

[0057] In this embodiment of the disclosure, the shape of the bent portion can be a straight line or a curve, and this embodiment of the disclosure does not limit it.

[0058] In some exemplary implementations, such as Figures 5D-5E As shown, at least one metal part 30 further includes a second bent portion 303, wherein the main body part 301, the first bent portion 302, and the second bent portion 303 are connected in sequence. This disclosure further reduces the height H of the metal part 30 by providing multiple bent portions.

[0059] In some exemplary implementations, such as Figures 5D-5E As shown, the angle between the second bend 303 and the first bend 302 is less than or equal to 90°, in order to further reduce the space occupied by the metal part 30. In other examples, the angle between the second bend 303 and the first bend 302 may also be greater than 90°, and this disclosure does not limit this.

[0060] In some exemplary embodiments, both the first signal channel 10 and the second signal channel 20 may be waveguide channels. However, this disclosure does not limit this. The following description assumes that both the first signal channel 10 and the second signal channel 20 are waveguide channels.

[0061] like Figure 6A As shown, this embodiment of the present disclosure also provides a radio frequency device, including a PCB board 1 and a waveguide structure 2 connected to the PCB board 1. At least one first waveguide channel 10 is arranged on the PCB board 1, and a second waveguide channel 20 is arranged on the waveguide structure 2 at a position corresponding to the first waveguide channel 10. The first waveguide channel 10 and the second waveguide channel 20 are connected to form a signal transmission path for signal transmission.

[0062] The radio frequency device further comprises an isolation structure, which is arranged around the signal transmission path and comprises a plurality of periodically arranged metal pieces 30, each of which is in a bent shape.

[0063] The radio frequency device of the embodiments of the present disclosure can reduce the size of the entire radio frequency device while preventing signal leakage at the interface by making each metal piece in the electromagnetic gap structure in a bent shape, thereby expanding the use scenarios of the radio frequency device and improving the usability of the radio frequency device. Meanwhile, the present disclosure directly utilizes the structure in the PCB to form the bent metal piece, which is convenient to process and low in cost.

[0064] In some example embodiments, as shown in Figure 6B The PCB 1 is provided with a chip package 40 on the side away from the waveguide structure 2, the chip package 40 is provided with an integrated circuit die (not shown in the figure) inside, the surface of the side of the chip package 40 close to the waveguide structure 2 is provided with a radiation structure 41, the radiation structure 41 is connected with the integrated circuit die and is used for transmitting or receiving radio frequency signals; the radiation structure 41 is arranged opposite to the input waveguide port 101 of the first waveguide channel 10.

[0065] In the embodiments of the present disclosure, the waveguide structure 2 is arranged on the side of the PCB 1 away from the chip package 40, which can expand the distance and intensity of signal transmission. When transmitting radio frequency signals, the radio frequency signals are emitted from the radiation structure 41 and then pass through the signal transmission channel surrounded by the plurality of convex points 42, the first waveguide channel 10 and the second waveguide channel 20 in turn, and are radiated out from the output waveguide port 202 of the second waveguide channel 20. When receiving radio frequency signals, the radio frequency signals enter from the output waveguide port 202 of the second waveguide channel 20 and then pass through the second waveguide channel 20, the first waveguide channel 10 and the signal transmission channel surrounded by the plurality of convex points 42 in turn, and are received by the radiation structure 41.

[0066] In some example embodiments, as shown in Figure 6A and Figure 6B The first waveguide channel 10 is located in the PCB 1, the second waveguide channel 20 is located in the waveguide structure 2, and the metal piece 30 is at least partially arranged in the PCB 1.

[0067] The relationship between the speed of light and the medium can be represented by the following formula: wherein the speed of light c = 2.99792458 x 10 8 m / s, the vacuum permittivity ε = 8.854187817 x 10 -12 F / m, and the vacuum permeability μ = 4π x 10 -7 H / m. The relationship between the speed of light c and the air wavelength λ can be represented by the following formula: where f is frequency. Therefore, the relationship between the vacuum dielectric constant and the air wavelength is:

[0068] The relative dielectric constant of the PCB medium is ε ′ The relationship between the working wavelength λ ′ in the PCB and the air wavelength λ can be expressed as: Since ε ′ > 1, λ ′ < λ.

[0069] According to the embodiments of the present disclosure, the metal piece 30 is partially or entirely arranged in the PCB 1, and the dielectric constant of the PCB 1 is used to reduce the working wavelength of the transmission signal, thereby further reducing the height of the metal piece 30.

[0070] In some example embodiments, as shown in Figs. 1 and 2, the isolation structure is arranged in the PCB 1, one end of the metal piece 30 is connected to the metal layer of the PCB 1, and the other end is short-circuited. Figure 6A Figure 6B In some example embodiments, as shown in Figs. 3 and 4, the metal piece 30 is at least partially implemented by using the metal layer in the PCB 1.

[0071] In some example embodiments, as shown in Figs. 3 and 4, the metal piece 30 is at least partially implemented by using the metal layer in the PCB 1. Figure 6A Figure 6B In some example embodiments, as shown in Figs. 5 and 6, the metal piece 30 includes a main body portion 301, a first bending portion 302, and a second bending portion 303 connected in sequence.

[0072] In some example embodiments, as shown in Figs. 5 and 6, the metal piece 30 includes a main body portion 301, a first bending portion 302, and a second bending portion 303 connected in sequence. Figure 6A Figure 6C In some example embodiments, as shown in Figs. 7 and 8, the PCB 1 includes a plurality of metal layers and a medium layer arranged between adjacent metal layers, and the plurality of metal layers at least includes a first metal layer away from the waveguide structure 2 and a second metal layer closest to the waveguide structure 2.

[0073] In some example embodiments, as shown in Figs. 7 and 8, the PCB 1 includes a plurality of metal layers and a medium layer arranged between adjacent metal layers, and the plurality of metal layers at least includes a first metal layer away from the waveguide structure 2 and a second metal layer closest to the waveguide structure 2. Figure 6A Figure 6C One end of the main body portion 301 is connected to the first metal layer to realize grounding, the other end of the main body portion 301 extends to the side of the waveguide structure 2, and the other end of the main body portion 301 is connected to one end of the first bending portion 302.

[0074] The first bending portion 302 is arranged in the second metal layer and is electrically separated from other parts of the second metal layer.

[0075] The first bending portion 302 is arranged in the second metal layer and is electrically separated from other parts of the second metal layer.

[0076] One end of the second bending portion 303 is connected to the other end of the first bending portion 302, and the other end of the second bending portion 303 extends to the side away from the waveguide structure 2 and the end is not connected to the metal layer.

[0077] ​​​​In some example embodiments, the main body part 301 and / or the second bending part 303 can be implemented by a metalized via.

[0078] In the embodiments of the present disclosure, the main body part 301 can be a metalized via provided in the PCB board 1, the first bending part 302 can be a metal trace provided on the PCB board 1, and the second bending part 303 can be a metalized via or a metalized blind via provided in the PCB board 1.

[0079] In the embodiments of the present disclosure, a via refers to a hole that passes through a dielectric board from one side to the other side, and the via can completely penetrate the entire dielectric board. A blind via refers to a hole that only enters the dielectric board from one side and does not penetrate the entire dielectric board. As shown in Figure 6D The PCB board 1 can include a first metal layer 11, a second dielectric layer 12, and a third metal layer 13 that are sequentially stacked. The second dielectric layer 12 can include one layer of insulating layer, or multiple layers of insulating layer and metal layers provided between adjacent layers of insulating layer.

[0080] In the embodiments of the present disclosure, the preparation process of the PCB board 1 includes: (1) forming the first metal layer 11; (2) forming the second dielectric layer 12, and opening a via 121 and a blind via 122 on the second dielectric layer 12, as shown in Figure 6E (3) forming the third metal layer 13, the third metal layer 13 covering the via 121 and the blind via 122, and forming a connection trace between the via 121 and the blind via 122 (i.e., forming the first bending part 302), as shown in Figure 6D The third metal layer 13 covering the via 121 forms the main body part 301, and the third metal layer 13 covering the blind via 122 forms the second bending part 303.

[0081] In the embodiments of the present disclosure, when the second bending part 303 is a metalized via provided in the PCB board 1, the first metal layer 11 needs to be etched so that one end of the second bending part 303 away from the first bending part 302 is short-circuited (i.e., not connected to the metal layer). Since one end of the main body part 301 is connected to the first metal layer to realize grounding, the part of the first metal layer 11 corresponding to the main body part 301 does not need to be etched.

[0082] In some example embodiments, as shown in Figure 6A and Figure 6C The main body part 301 is connected to the metal layer provided on the surface of the PCB board 1 away from the waveguide structure 2, so as to be grounded.

[0083] In some example embodiments, as shown in Figure 6AAs shown, the output waveguide port of the first waveguide channel 10 is connected with the input waveguide port of the second waveguide channel 20, and the plurality of metal pieces 30 are arranged around the output waveguide port of the first waveguide channel 10 or the input waveguide port of the second waveguide channel 20.

[0084] As shown, the first waveguide channel 10 is connected with the second waveguide channel 20 to form a signal transmission path for signal transmission. Figure 7 As shown, the first waveguide channel 10 is connected with the second waveguide channel 20 to form a signal transmission path for signal transmission.

[0085] The radio frequency device further comprises an isolation structure, the isolation structure is arranged between adjacent two signal transmission paths, and the isolation structure comprises a plurality of periodically arranged metal pieces 30, each metal piece 30 is in a bent shape.

[0086] The radio frequency device of the embodiment of the present disclosure can reduce the size of the entire radio frequency device while preventing signal leakage at the interface by making each metal piece in a bent shape, thereby expanding the use scenarios of the radio frequency device and improving the usability of the radio frequency device. At the same time, the present disclosure directly utilizes the structure in the PCB to form the bent metal piece, which is convenient to process and low in cost.

[0087] In some example embodiments, the total length of each metal piece 30 is wherein n is a natural number greater than or equal to 1, and λ is the working wavelength of the transmission signal.

[0088] In some example embodiments, as shown in the figure, Figure 7 The isolation structure is arranged in the PCB 1, one end of the metal piece 30 is connected to the metal layer of the PCB 1, and the other end is short-circuited.

[0089] In some example embodiments, as shown in the figure, Figure 7 The metal piece 30 is at least partially implemented by using the metal layer in the PCB 1.

[0090] In some example embodiments, as shown in the figure, Figure 7 The metal piece 30 comprises a main body part 301, a first bending part 302 and a second bending part 303 connected in sequence.

[0091] In some example embodiments, as shown in the figure, Figure 7 The PCB 1 comprises a plurality of metal layers and a dielectric layer arranged between adjacent metal layers, and the plurality of metal layers at least comprise a first metal layer away from the waveguide structure 2 and a second metal layer closest to the outermost side of the waveguide structure 2.

[0092] One end of the main body 301 is connected to the first metal layer to achieve grounding, and the other end of the main body 301 extends toward the waveguide structure 2. The other end of the main body 301 is connected to one end of the first bent part 302.

[0093] The first bending portion 302 is disposed in the second metal layer and is electrically separated from the other parts of the second metal layer;

[0094] One end of the second bend 303 is connected to the other end of the first bend 302, and the other end of the second bend 303 extends away from the waveguide structure 2 and is not connected to the metal layer at the end.

[0095] In some exemplary embodiments, the main body portion 301 and / or the second bending portion 303 may be implemented using metallized through holes.

[0096] In some exemplary implementations, such as Figure 7 As shown, a chip package 40 is provided on the side of the PCB board 1 away from the waveguide structure 2. An integrated circuit die (not shown in the figure) is provided inside the chip package 40. A radiation structure 41 is provided on the surface of the chip package 40 near the waveguide structure 2. The radiation structure 41 is connected to the integrated circuit die and is used to transmit or receive radio frequency signals. The radiation structure 41 is positioned opposite to the input waveguide port 101 of the first waveguide channel 10.

[0097] Figure 8 This is a schematic diagram illustrating the isolation effect of the waveguide structure according to an embodiment of the present disclosure, where "no isolation structure" indicates that... Figure 1 The waveguide structure shown does not include an electromagnetic gap structure; isolation structure A represents... Figure 4A The waveguide structure shown, isolation structure B represents Figure 4C The waveguide structure shown is illustrated. This disclosure uses the 77GHz millimeter-wave band for automotive applications as an example. One-quarter of its operating wavelength is approximately 1mm. Metal components are placed on a PCB board and configured as a bent structure. The PCB board thickness is 0.2mm. Figure 7 As shown, the waveguide structure disclosed herein effectively achieves isolation between waveguide channels and reduces the degradation of isolation caused by gaps.

[0098] This disclosure also provides a radar, including a radio frequency device as described in any embodiment of this disclosure.

[0099] In some example embodiments, the radar includes a radar chip, a transmitting antenna and a receiving antenna, the transmitting antenna and the receiving antenna respectively include corresponding signal transmission paths and isolation structures, the isolation structures are arranged around the signal transmission paths, the isolation structures adopt electromagnetic gap structures, and each of the isolation structures includes a plurality of periodically arranged metal pieces, each of the metal pieces is in a bent shape. In some embodiments, the transmitting antenna and the receiving antenna can share one antenna.

[0100] The radar chip transmits a beam through the radiating structure in the transmitting antenna, when the beam encounters an obstacle, a return wave reflected by the obstacle is received through the radiating structure in the receiving antenna, transmitted to the radar chip, and the position of the target is determined by the radar chip and the relative angle between the position and the radar is calculated.

[0101] In some example embodiments, the radar chip can be a millimeter wave radar chip. The radar chip can include a data processing module for processing the received return wave signal to realize target detection and / or communication.

[0102] The radar of the embodiments of the present disclosure can reduce the size of the entire radio frequency device while preventing signal leakage by making each metal piece in the electromagnetic gap structure in a bent shape, thereby expanding the use scenarios of the radio frequency device and improving the usability of the radio frequency device.

[0103] Although the embodiments disclosed in the present disclosure are as described above, the content described is only the embodiments adopted for the purpose of facilitating the understanding of the present disclosure, and is not intended to limit the present disclosure. Any person skilled in the art of the present disclosure can make any modification and change in the form and details without departing from the spirit and scope of the present disclosure, but the protection scope of the present disclosure shall be subject to the scope defined by the appended claims.

Claims

1. An isolation structure, characterized by, The electromagnetic gap structure comprises a plurality of periodically arranged metal pieces, each of which is in a bent shape.

2. The isolation structure of claim 1, wherein The total length of each of the metal pieces is where n is a natural number greater than or equal to 1, and λ is the operating wavelength of the transmission signal.

3. The isolation structure of claim 2, wherein, The output waveguide port of the first signal channel is connected to the input waveguide port of the second signal channel, and the plurality of metal pieces are arranged around the output waveguide port of the first signal channel and / or the input waveguide port of the second signal channel.

4. The isolation structure of claim 1, wherein The first signal channel and the second signal channel are parallel to each other, and the plurality of metal pieces are arranged between the first signal channel and the second signal channel.

5. The isolation structure of claim 1, wherein The first signal channel and the second signal channel are both waveguide channels.

6. A radio frequency device, characterized by, The radio frequency device further comprises an isolation structure, which is arranged around the signal transmission path and comprises a plurality of periodically arranged metal pieces, each of which is in a bent shape. The isolation structure is arranged in the PCB board, one end of the metal piece is connected to the metal layer of the PCB board, and the other end is short-circuited.

7. The radio-frequency device according to claim 6, characterized in that The total length of each of the metal pieces is where n is a natural number greater than or equal to 1, and λ is the operating wavelength of the transmission signal.

8. The radio-frequency device according to claim 6, characterized in that The metal piece is at least partially realized by the metal layer in the PCB board.

9. The radio-frequency device according to claim 6, characterized in that The metal piece comprises a main body part, a first bent part and a second bent part connected in sequence.

10. The radio-frequency device according to claim 9, characterized in that The PCB board comprises a plurality of metal layers and a dielectric layer arranged between adjacent metal layers, and the plurality of metal layers at least comprise a first metal layer away from the waveguide structure and a second metal layer on the outermost side towards the waveguide structure.

11. The radio-frequency device according to claim 10, characterized in that One end of the main body part is connected to the first metal layer to realize grounding, and the other end of the main body part is connected to one end of the first bent part. The first bent part is arranged on the second metal layer and is electrically separated from other parts of the second metal layer. One end of the second bent part is connected to the other end of the first bent part, and the other end of the second bent part extends away from the waveguide structure and is not connected to a metal layer at the end. The main body part and / or the second bent part are realized by a metalized via hole.

12. The radio-frequency device according to claim 10, characterized in that The side of the PCB board away from the waveguide structure is provided with a chip package, the chip package is provided with an integrated circuit die, the surface of the side of the chip package close to the PCB board is provided with at least one radiation structure connected to the integrated circuit die for emitting or receiving radio frequency signals; the radiation structure is arranged opposite to the input waveguide port of the first waveguide channel for signal transmission.

13. The radio frequency device of any one of claims 6 to 12, wherein, The radio frequency device further comprises an isolation structure, which is arranged around the signal transmission path and comprises a plurality of periodically arranged metal pieces, each of which is in a bent shape.

14. A radio frequency device, characterized by ​ The radio frequency device further comprises an isolation structure arranged between two adjacent signal transmission paths, the isolation structure comprising a plurality of periodically arranged metal pieces, each of the metal pieces being in a bent shape.

15. The radio-frequency device according to claim 14, characterized in that The total length of each of the metal pieces is where n is a natural number greater than or equal to 1, and λ is the operating wavelength of the transmission signal.

16. The radio-frequency device according to claim 14, characterized in that The isolation structure is arranged in the PCB board, one end of the metal piece is connected to the metal layer of the PCB board, and the other end is short-circuited.

17. The radio-frequency device according to claim 14, characterized in that The metal piece is at least partially implemented by the metal layer in the PCB board.

18. The radio-frequency device according to claim 17, characterized in that The metal piece comprises a main body portion, a first bent portion and a second bent portion connected in sequence.

19. The radio-frequency device according to claim 18, characterized in that The PCB board comprises a plurality of metal layers and a dielectric layer arranged between adjacent metal layers, the plurality of metal layers at least comprising a first metal layer away from the waveguide structure and a second metal layer closest to the outer side of the waveguide structure. One end of the main body portion is connected to the first metal layer to realize grounding, and the other end of the main body portion is connected to one end of the first bent portion. The first bent portion is arranged in the second metal layer and is electrically separated from other parts of the second metal layer. One end of the second bent portion is connected to the other end of the first bent portion, and the other end of the second bent portion extends away from the waveguide structure and is not connected to the metal layer at the end.

20. The radio-frequency device according to claim 18, characterized in that The main body portion and / or the second bent portion are implemented by a metalized via hole.

21. The radio frequency device of any one of claims 14 to 20, wherein, The side of the PCB board away from the waveguide structure is provided with a chip package, the chip package is provided with an integrated circuit die, and the surface of the side of the chip package close to the PCB board is provided with at least one radiation structure connected to the integrated circuit die for transmitting or receiving radio frequency signals; the radiation structure is arranged opposite to the input waveguide port of the first waveguide channel for signal transmission.

22. A radar, characterized by The radio frequency device comprises the radio frequency device according to any one of claims 6 to 21. The radio frequency device comprises the radio frequency device according to any one of claims 6 to 21.

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