Circuit board integrated with flexible buffer anti-vibration structure

Abstract

The invention provides a circuit board integrated with a flexible buffer anti-vibration structure, and particularly relates to the technical field of circuit boards. The circuit board comprises a circuit board body and further comprises a composite buffer mechanism which is arranged at the bottom of the circuit board body and used for buffering vibration force, and the composite buffer mechanism is composed of a first buffer structure and a second buffer structure. According to the scheme, through contact of four right-angle small-area brackets of the first buffer structure, a large-area conduction path of the vibration force is cut off; meanwhile, in cooperation with horizontal dispersion conduction of the second buffer structure and non-contact repulsive force supporting of the center buffer assembly, after vibration force is weakened layer by layer, the amplitude of transmitting the vibration force to the circuit board body is remarkably reduced, the problems that element welding spots fall off, a chip is damaged and the like are effectively solved, and the safety of the circuit board is effectively protected.

Description

TECHNICAL FIELD

[0001] The application provides a circuit board integrated with a flexible buffer anti-vibration structure, and particularly relates to the technical field of circuit boards. BACKGROUND

[0002] The buffer structure of the circuit board refers to an electronic component that is additionally provided on the basis of a traditional line board main body to weaken external vibration force, and is widely applied to scenarios such as industrial control equipment, consumer electronic products, vehicle-mounted equipment and the like that are easily affected by vibration. The core requirement of such a circuit board is to protect fragile elements such as chips and solder joints on the board through the buffer structure - because the elements of the line board are mostly precision structures, external vibration (such as equipment running jitter, carrying bumping) is easy to cause the elements to fall off and the solder joints to crack, thereby causing equipment failure, so the buffer anti-vibration structure is a key component part.

[0003] In the prior art (such as the patent with the authorized announcement number CN106604579B which discloses a ring-shaped circuit board buffer anti-vibration structure and the patent with the authorized announcement number CN221264062U which discloses a line board with a buffer shock-absorbing structure); such a circuit board with a buffer function has obvious defects: on the one hand, most of them adopt a design of large-area rigid contact between the line board main body and the support structure, and only a simple buffer pad is arranged at the local (such as the bottom two sides), and the vibration force is easy to be directly transmitted to the line board through the large-area contact, because the vibration transmission efficiency is high, the buffer effect is limited; on the other hand, although it has a certain buffer effect, it is designed only for single-direction vibration, and cannot cope with complex vibration such as horizontal and torsional vibration in actual application, or it adopts a large-area contact structure, which causes the heat dissipation of the bottom of the line board to be blocked, and finally affects the reliability and service life of the circuit board.

[0004] Therefore, the application provides a circuit board integrated with a flexible buffer anti-vibration structure to improve the shortcomings of the prior art. SUMMARY

[0005] In view of the defects of the prior art, the application provides a circuit board integrated with a flexible buffer anti-vibration structure, which can effectively solve the technical problem of high vibration transmission efficiency and poor buffer effect.

[0006] To achieve the above purpose, the application is implemented by the following technical scheme: The application discloses a circuit board integrated with a flexible buffer anti-vibration structure, which comprises a line board main body. Further comprising a composite buffer mechanism arranged at the bottom of the line board main body and used for buffering vibration force. The composite buffer mechanism is composed of a first buffer structure and a second buffer structure, wherein the first buffer structure is connected with four right-angle parts of the line board main body, and the second buffer structure is connected below the first buffer structure. The first buffering structure comprises a cross bottom plate, an extended square plate, a buffering column, and a corner groove seat. The four end portions of the cross bottom plate are fixedly provided with the extended square plates. The buffering column is provided with at least four buffering columns which are distributed on the four sides of the top of the extended square plate. The corner groove seat is fixed on the top of each buffering column on the same extended square plate. The corner groove seat is provided with four corner groove seats which correspond to the positions of the four right-angle parts of the circuit board body respectively and are connected with the circuit board body through a threaded connection structure. Each corner groove seat is provided with a supporting groove which is matched with the right-angle part of the circuit board body. The right-angle part of the circuit board body is horizontally arranged in the supporting groove. The first buffering structure is used to form a small-area rigid support structure based on the four right-angle parts at the bottom of the circuit board body so as to reduce the direct transmission of the vibration force from the bottom to the circuit board body. The second buffering structure is matched with the first buffering structure and is used to disperse and conduct the vibration force received by the first buffering structure to the horizontal direction.

[0007] As a preferred, the threaded connection structure is configured as a connecting hole which is arranged on the bottom groove surface of the supporting groove of each corner groove seat and a fastening bolt which is arranged on the four right-angle parts of the circuit board body. The fastening bolt is threadedly connected with the connecting hole and is used to fasten and connect the circuit board body on each corner groove seat.

[0008] As a preferred, a buffering pad is embedded on the bottom groove surface of the supporting groove of each corner groove seat. The buffering pad is made of silica gel.

[0009] As a preferred, a countersunk hole plate is fixedly arranged on one side of each extended square plate. The countersunk hole plate is provided with a countersunk hole.

[0010] As a preferred, the second buffering structure comprises a rectangular groove, a rectangular groove block, a combined movable frame, and a spring array. The rectangular groove is arranged on the top surface of the extended square plate and the bottom surface of the corner groove seat respectively. The rectangular groove is provided with two rectangular grooves on the corner groove seat and the extended square plate. The rectangular groove block is slidably arranged in each rectangular groove. The rectangular groove block is provided with four rectangular groove blocks which are symmetrically distributed in two groups. The combined movable frame is hingedly connected between the upper and lower rectangular groove blocks. The spring array is elastically connected between each rectangular groove block and the groove surface of the rectangular groove. The second buffering structure disperses the vibration force transmitted by the first buffering structure to the horizontal direction through the sliding of the rectangular groove block, the cross rotation of the combined movable frame, and the elastic deformation of the spring array so as to avoid the concentrated effect of the vibration force on the bottom of the circuit board body.

[0011] As a preferred, the two side end portions of the rectangular groove block are provided with dovetail-shaped sliding portions. The two side groove surfaces of the rectangular groove are provided with dovetail-shaped sliding grooves which are matched with the sliding of the sliding portions.

[0012] As preferred, the combination movable frame is composed of two cross-rotating connected movable arms.

[0013] As preferred, each spring array is composed of at least three springs, each spring being connected between the side wall of each rectangular groove block and the groove surface of the rectangular groove.

[0014] As preferred, a center buffer assembly is jointly arranged between the top center of the cross bottom plate and the bottom of the circuit board main body, the center buffer assembly comprising a first groove disc, a first magnet array, a second groove disc and a second magnet array, the first groove disc being fixedly arranged at the top center of the cross bottom plate, the first magnet array being clamped in the first groove disc, the second groove disc being fixedly arranged at the bottom of the circuit board main body and corresponding to the first magnet array in position, the second magnet array being clamped in the second groove disc, and the N pole of the second magnet array corresponding to the N pole of the first magnet array.

[0015] As preferred, the first magnet array and the second magnet array are each composed of a plurality of array distributed cylindrical magnets.

[0016] Compared with the known prior art, the technical scheme provided by the application has the following beneficial effects: Compared with the large-area rigid contact between the circuit board and the support structure in the prior art, the vibration force is easily directly conducted to the elements, while the present scheme cuts off the large-area conduction path of the vibration force through the "four right-angle small-area supporting groove contact" of the first buffer structure; At the same time, in cooperation with the "horizontal dispersion conduction" of the second buffer structure and the "non-contact repulsion support" of the center buffer assembly, the vibration force is gradually weakened layer by layer before being transmitted to the circuit board main body, thereby significantly reducing the amplitude and effectively avoiding problems such as element solder point falling off and chip damage, and effectively protecting the safety of the circuit board; In addition, the traditional buffer structure is only improved for single-direction vibration and cannot cope with complex vibrations such as horizontal and torsional vibrations in actual use of the equipment; in the present scheme, the second buffer structure can simultaneously adapt to vertical and horizontal vibrations through the sliding of the rectangular groove block and the rotation of the combination movable frame, and the cross bottom plate assists in dispersing the torsional force; the center buffer assembly further supplements the buffer blank in the vertical direction, forming multi-directional buffer coverage, thereby avoiding the limitations of traditional single-direction buffer and improving the effectiveness of the buffer; In addition, the circuit board in the prior art is easily affected by the increased contact area to affect heat dissipation, while the center buffer assembly of the present scheme adopts a non-contact support mode of "like magnetic repulsion", which not only makes up for the defect of the four-corner support center being suspended, but also does not block the heat dissipation area of the bottom of the circuit board main body; in cooperation with the small-area contact design of the first buffer structure, most of the bottom of the circuit board main body remains exposed, thereby ensuring normal heat dissipation. In the first buffer structure, the gap between the buffer pad and the fastening bolt is designed to avoid rigid extrusion of the circuit board by the bolt and maintain the connection stability through the elasticity of the silica gel. The dovetail-shaped sliding groove of the second buffer structure cooperates with the sliding part to prevent the buffer failure caused by the offset of the groove block. The ring-shaped layout of the magnet array of the central buffer assembly ensures uniform distribution of magnetic force and avoids local stress concentration. The overall structure reduces the risk of structural loosening and failure during long-term use, prolonging the service life of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a front perspective structure diagram of the present application; Figure 2 is a bottom perspective structure diagram of the present application; Figure 3 is a partial perspective structure diagram of the related components at the main body of the circuit board and the cross bottom plate in the present application; Figure 4 is a partial perspective structure diagram of the related components at the main body of the circuit board and the cross bottom plate in the present application; Figure 3 is a partial enlarged perspective structure diagram of position A in the present application; Figure 5 is a partial perspective structure diagram of the related components at the corner groove seat in the present application; Figure 6 is a partial perspective structure diagram of the related components at the corner groove seat in the present application; Figure 7 is a partial exploded perspective structure diagram of the related components at the combined movable frame in the present application; Figure 8 is a partial perspective structure diagram of the related components at the first groove disc in the present application; Figure 9 is a partial exploded perspective structure diagram of the related components at the first groove disc in the present application.

[0018] The numbers in the figure respectively represent: 1, main body of circuit board; composite buffer mechanism: first buffer structure: 21, cross bottom plate; 22, extended square plate; 221, countersunk hole plate; 23, buffer column; 24, corner groove seat; 241, buffer pad; 242, connecting hole; 243, fastening bolt; second buffer structure: 25, rectangular groove; 26, rectangular groove block; 27, combined movable frame; 28, spring array; central buffer assembly: 31, first groove disc; 32, first magnet array; 33, second groove disc; 34, second magnet array. DETAILED DESCRIPTION

[0019] The present application will be further described below in conjunction with examples.

[0020] Example one: As Figures 1 to 4 shown, a circuit board integrated with a flexible buffering anti-vibration structure, comprising a circuit board body 1; Further comprising, a composite buffering mechanism arranged at the bottom of the circuit board body 1, for buffering the vibration force; The composite buffering mechanism is composed of a first buffering structure and a second buffering structure, wherein the first buffering structure is connected with four right-angled parts of the circuit board body 1; The first buffering structure comprises a cross bottom plate 21, an extended square plate 22, a buffering column 23, and a corner groove seat 24, the four ends of the cross bottom plate 21 are fixedly provided with the extended square plate 22, the buffering column 23 is at least provided with four, and is made of silica gel material, and is distributed on the four sides of the top of the extended square plate 22, the corner groove seat 24 is fixed on the top of each buffering column 23 on the same extended square plate 22, the corner groove seat 24 is provided with four, and corresponds to the positions of the four right-angled parts of the circuit board body 1 respectively, and is connected with the circuit board body 1 through a threaded connection structure, each corner groove seat 24 is provided with a supporting groove matched with the right-angled part of the circuit board body 1, and the right-angled part of the circuit board body 1 is horizontally arranged in the supporting groove; The first buffering structure is used to form a small-area rigid support structure based on the four right-angled parts at the bottom of the circuit board body 1, so as to reduce the direct transmission of the vibration force from the bottom to the circuit board body 1; compared with the large-area rigid contact mode in the prior art, the four supporting grooves are used to contact with the right-angled parts of the circuit board body 1, the vibration transmission efficiency is reduced, and the probability of damaging the elements on the circuit board body 1 due to the vibration force is reduced.

[0021] In specific implementation, the threaded connection structure is configured as a connecting hole 242 opened on the bottom groove surface of the supporting groove of each corner groove seat 24, and a fastening bolt 243 penetrating the four right-angled parts of the circuit board body 1, the fastening bolt 243 is threadedly connected with the connecting hole 242, and is used to fasten and connect the circuit board body 1 on each corner groove seat 24.

[0022] In specific implementation, a buffering pad 241 is embedded on the bottom groove surface of the supporting groove of each corner groove seat 24, the buffering pad 241 is made of silica gel material, a circular hole is arranged on the buffering pad 241 for the fastening bolt 243 to penetrate, a gap of 0.1-0.2mm is reserved between the circular hole and the fastening bolt 243, so that the bolt can be smoothly penetrated, and the elastic deformation of the silica gel buffering pad is used to absorb the slight vibration transmission between the bolt and the groove seat.

[0023] Specific implementation, each side of the extension plate 22 is fixedly provided with a countersunk hole plate 221, the countersunk hole plate 221 is provided with a countersunk hole, for inserting a fastener, the composite buffer mechanism and the circuit board body 1 are connected with the equipment; the countersunk hole plate 221 is designed, the head of the fastener can be completely embedded in the plate, avoid the equipment installation after the protruding, lead to the circuit board and the shell of the equipment additional vibration gap.

[0024] Example two: As Figures 5 to 7 The circuit board further comprises a second buffer structure connected below the first buffer structure, which cooperates with the first buffer structure in example one to disperse and conduct the vibration force received by the first buffer structure horizontally. The rectangular groove 25, the rectangular groove block 26, the combined movable frame 27 and the spring array 28 are arranged, the rectangular groove 25 is arranged on the top surface of the extension plate 22 and the bottom surface of the corner groove seat 24 respectively, and two rectangular grooves 25 are arranged on the corner groove seat 24 and the extension plate 22 respectively, the rectangular groove block 26 is slidably arranged in each rectangular groove 25, and four rectangular groove blocks 26 are arranged, which are symmetrically distributed in two groups, the combined movable frame 27 is hingedly connected between the upper and lower rectangular groove blocks 26, and the combined movable frame 27 is composed of two cross-rotating movable arms. The spring array 28 is elastically connected between each rectangular groove block 26 and the groove surface of the rectangular groove 25. The second buffer structure disperses the vibration force transmitted by the first buffer structure horizontally through the sliding of the rectangular groove block 26, the cross-rotation of the combined movable frame 27 and the elastic deformation of the spring array 28, so as to avoid the vibration force from concentrating on the bottom of the circuit board body 1; when the circuit board is vertically vibrated downward, the combined movable frame 27 drives the upper and lower rectangular groove blocks 26 to slide to the two sides of the rectangular groove 25, stretches the spring array 28 and disperses the vibration force; if horizontally vibrated, the rectangular groove block 26 slides along the dovetail-shaped sliding groove, compresses the unilateral spring array 28, and offsets the horizontal vibration by using the reverse elastic force of the spring.

[0025] Specific implementation, the two side ends of the rectangular groove block 26 are provided with dovetail-shaped sliding parts, and the two groove surfaces of the rectangular groove 25 are provided with dovetail-shaped sliding grooves matched with the sliding parts.

[0026] Specific implementation, each spring array 28 is composed of at least three springs, and each spring is connected between the side wall of each rectangular groove block 26 and the groove surface of the rectangular groove 25; the cooperation of the dovetail-shaped sliding part and the sliding groove can limit the rectangular groove block 26 to slide only in the horizontal direction, so as to avoid the offset of the groove block during vibration transmission, resulting in the failure of the buffer structure.

[0027] Example three: As Figure 2 , Figure 8 ,Figure 9 As shown in the above circuit board, further comprising a center buffer assembly arranged together between the top center of the cross bottom plate 21 and the bottom of the circuit board body 1, the center buffer assembly comprising a first slot disc 31, a first magnet array 32, a second slot disc 33, and a second magnet array 34, the first slot disc 31 is fixedly arranged at the top center of the cross bottom plate 21, the first magnet array 32 is clamped in the first slot disc 31, the second slot disc 33 is fixedly arranged at the bottom of the circuit board body 1 and corresponds to the position of the first magnet array 32 up and down, and the second magnet array 34 is clamped in the second slot disc 33, and the N pole of the second magnet array 34 corresponds to the N pole of the first magnet array 32; When the circuit board body 1 is subjected to vertical vibration, the same magnetic repulsion force of the center buffer assembly can cooperate with the mechanical buffering of the first and second buffer structures in embodiments one and two to play a central support and buffering role without contacting the bottom of the circuit board body 1; at the same time, cooperating with the small-area rigid contact mode of the first buffer structure, the heat dissipation effect of the circuit board body 1 is maximized.

[0028] Specifically, the first magnet array 32 and the second magnet array 34 are each composed of a plurality of arrayed cylindrical magnets; the cylindrical magnets are arranged in a "ring-shaped interval layout", which makes the magnetic force distribution more uniform, covers the central area of the circuit board body 1, and makes up for the possible central vibration transmission risk of the four-corner support.

[0029] The principles of the above embodiments one, two and three are as follows: The circuit board with the integrated flexible buffer anti-vibration structure realizes efficient weakening of vibration force through "layered buffering + multi-component cooperation", and its use principle revolves around the vertical vibration, horizontal vibration and extreme vibration scenarios that may occur during equipment operation or handling, as follows: When the circuit board is put into use with the equipment, first, the composite buffer mechanism is fixed as a whole with the circuit board body 1 inside the equipment through the countersunk hole plate 221 on the extended square plate 22, and the design of the countersunk hole ensures that the fastener does not protrude, avoiding the introduction of additional vibration interference due to installation gap.

[0030] When the vibration force is generated during equipment operation or handling, the vibration force is first transmitted to the extended square plate 22, and then the layered buffering logic is started: Vertical vibration scenario: the vibration force is transmitted to the second buffer structure along the extending square plate 22, at this time the combined movable frame 27 is subjected to a vertical force and rotates crosswise, driving the upper and lower rectangular blocks 26 to slide along the dovetail-shaped sliding groove to both sides of the rectangular groove 25, compressing the spring array 28 and preliminarily dispersing the vertical vibration force through elastic deformation and converting it into a dispersed force in the horizontal direction; the remaining vibration force after dispersion by the second buffer structure is transmitted to the first buffer structure, and the buffer column 23 further weakens the vibration by flexible deformation, while the corner groove seat 24 holds the silica gel buffer pad 241 in the groove, absorbing the slight vibration between the fastening bolt 243 and the groove seat, avoiding direct transmission of vibration caused by rigid connection; If the vertical vibration amplitude is large, the central buffer assembly at the bottom of the circuit board body 1 is activated, and the repulsive force of the same magnet array 32 and the second magnet array 34 changes dynamically with the distance, providing elastic support for the center of the circuit board body 1 under the premise of not contacting, offsetting part of the impact vibration force in the vertical direction.

[0031] Horizontal vibration scenario: the horizontal vibration force is transmitted to the extending square plate 22 and directly acts on the rectangular block 26 of the second buffer structure, the rectangular block 26 slides along the dovetail-shaped sliding groove in the vibration direction, compressing the unilateral spring array 28 and offsetting the horizontal vibration force through the reverse elastic force, while the dovetail-shaped sliding part and the sliding groove cooperate to limit the block offset, ensuring that the horizontal vibration is only absorbed by the spring deformation and is not transmitted to the first buffer structure and the circuit board body 1; if the horizontal vibration is accompanied by slight torsion, the overall rigid structure of the cross bottom plate 21 can assist in dispersing the torsion force, avoiding uneven stress on the four corners of the circuit board body 1.

[0032] Extreme vibration such as falling and strong impact scenario: at this time, the spring array 28 of the second buffer structure and the combined movable frame 27 form a double protection, the crosswise rotation angle of the combined movable frame 27 is limited by the rectangular groove 25 to avoid excessive deformation leading to structural failure; the buffer column 23 of the first buffer structure absorbs the impact by flexible deformation to the maximum extent, while the repulsive force of the magnet of the central buffer assembly instantaneously increases to provide emergency support for the center of the circuit board body 1, preventing the circuit board from being damaged by bending due to the center being suspended.

[0033] The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent substitutions for part of the technical features; and these modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An integrated flexible cushioning anti-vibration structure circuit board comprising a circuit board main body (1), characterized by, Further comprising, a composite buffering mechanism arranged at the bottom of the circuit board body (1) for buffering the vibration force; The composite buffering mechanism is composed of a first buffering structure and a second buffering structure, wherein the first buffering structure is connected with the four right-angled parts of the circuit board body (1), and the second buffering structure is connected below the first buffering structure; The first buffering structure comprises a cross bottom plate (21), an extended square plate (22), a buffering column (23), and a corner groove seat (24), the four end portions of the cross bottom plate (21) are fixedly provided with the extended square plates (22), the buffering columns (23) are at least four in number and are distributed on the four sides of the top of the extended square plate (22), the corner groove seat (24) is fixed on the top of each buffering column (23) on the same extended square plate (22), there are four corner groove seats (24) in total, which correspond to the positions of the four right-angled parts of the circuit board body (1) respectively, and are connected with the circuit board body (1) through a threaded connection structure, each corner groove seat (24) is provided with a supporting groove matched with the right-angled part of the circuit board body (1), and the right-angled part of the circuit board body (1) is horizontally arranged in the supporting groove; The first buffering structure is used to form a small-area rigid support structure based on the four right-angled parts at the bottom of the circuit board body (1) to reduce the direct transmission of the vibration force from the bottom to the circuit board body (1); The second buffering structure cooperates with the first buffering structure to disperse and conduct the vibration force received by the first buffering structure to the horizontal direction.

2. The circuit board integrated with the flexible cushioning vibration isolation structure according to claim 1, wherein, The threaded connection structure is configured as a connecting hole (242) opened on the bottom groove surface of the supporting groove of each corner groove seat (24), and a fastening bolt (243) penetrating through the four right-angled parts of the circuit board body (1), the fastening bolt (243) is threadedly connected with the connecting hole (242) to fasten and connect the circuit board body (1) on each corner groove seat (24).

3. The circuit board integrated with the flexible cushioning vibration isolation structure according to claim 1 or 2, characterized in that, A buffering pad (241) is embedded on the bottom groove surface of the supporting groove of each corner groove seat (24), and the buffering pad (241) is made of silica gel.

4. The circuit board integrated with the flexible cushioning vibration isolation structure according to claim 1, wherein, A countersunk hole plate (221) is fixedly arranged on one side of each extended square plate (22), and the countersunk hole plate (221) is provided with a countersunk hole.

5. The circuit board integrated with the flexible cushioning anti-vibration structure according to claim 1, wherein, The second buffering structure comprises a rectangular groove (25), a rectangular groove block (26), a combined movable frame (27), and a spring array (28), the rectangular grooves (25) are respectively arranged on the top surface of the extended square plate (22) and the bottom surface of the corner groove seat (24), and there are two rectangular grooves (25) on the corner groove seat (24) and the extended square plate (22), the rectangular groove blocks (26) are slidably arranged in the rectangular grooves (25), there are four rectangular groove blocks (26) in total, which are symmetrically distributed in two groups, the combined movable frame (27) is hingedly connected between the upper and lower rectangular groove blocks (26), and the spring array (28) is elastically connected between each rectangular groove block (26) and the groove surface of the rectangular groove (25); The second buffering structure disperses the vibration force transmitted by the first buffering structure to the horizontal direction by sliding of the rectangular groove blocks (26), cross rotation of the combined movable frame (27) and elastic deformation of the spring array (28), so as to avoid the vibration force from concentrating on the bottom of the circuit board main body (1).

6. The circuit board integrated with the flexible cushioning vibration isolation structure according to claim 5, wherein, The two side ends of the rectangular groove block (26) are provided with dovetail-shaped sliding parts, and the two side groove surfaces of the rectangular groove (25) are provided with dovetail-shaped sliding grooves matched with the sliding parts.

7. The circuit board integrated with a flexible cushioning vibration isolation structure according to claim 5, wherein, The combined movable frame (27) is composed of two cross-rotating movable arms.

8. The circuit board integrated with a flexible cushioning vibration isolation structure according to claim 5, wherein, Each spring array (28) is composed of at least three springs, and each spring is connected between the side wall of each rectangular groove block (26) and the groove surface of the rectangular groove (25).

9. The circuit board integrated with the flexible cushioning vibration isolation structure according to claim 1, wherein, The center buffering assembly is arranged between the top center of the cross bottom plate (21) and the bottom of the circuit board main body (1), and the center buffering assembly comprises a first groove disc (31), a first magnet array (32), a second groove disc (33) and a second magnet array (34). The first groove disc (31) is fixedly arranged at the top center of the cross bottom plate (21), the first magnet array (32) is clamped in the first groove disc (31), the second groove disc (33) is fixedly arranged at the bottom of the circuit board main body (1) and corresponds to the position of the first magnet array (32) in up and down directions, the second magnet array (34) is clamped in the second groove disc (33), and the N-pole of the second magnet array (34) corresponds to the N-pole of the first magnet array (32).

10. The circuit board integrated with the flexible cushioning vibration isolation structure according to claim 9, wherein, The first magnet array (32) and the second magnet array (34) are each composed of a plurality of arrayed cylindrical magnets.

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