A circuit board pressing and wiping device
The automated design of the circuit board pin insertion and wiping device solves the uncertainty problem of manual operation in the process of circuit board pin insertion and soldering, realizes efficient and precise automated production, and improves product quality and production process stability.
Patent Information
- Application Number
- CN202511433899.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-09
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2045-10-09
AI Technical Summary
In the existing technology, the uncertainty of manual operation in the pin insertion and soldering process of circuit boards increases the risk of poor soldering of the solder joints, affecting the reliability and stability of the products, and making it difficult to guarantee the accuracy and consistency of the production process.
Design a circuit board pin insertion and wiping device, including an X-axis conveying module and a Y-axis conveying module. The device achieves automatic insertion and surface wiping of PIN pins through automated pressing and wiping modules, and optimizes the automated production process by combining it with an unloading module.
It improves circuit board production efficiency and surface quality, ensures product reliability and stability, reduces human error, and enhances the automation level and safety of the production process.
Smart Images

Figure CN120916356B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of line board pressing needle and wiping board device, and particularly relates to a line board pressing needle and wiping board device. BACKGROUND
[0002] At present, in a process of producing a digital tube, PIN needles are generally manually inserted into corresponding insertion holes of a PCB line board, then the PIN needles are pressed flat so that one end of the PIN needle is flat with one surface of the PCB line board, and the other end of the PIN needle passing through the insertion hole is also aligned with each other, and then the PCB line board and the PIN needle are welded.
[0003] The oxidation or contamination layer on the surface of the PCB line board can significantly affect the welding, which increases the risk of virtual welding of the welding joint, which not only affects the reliability and stability of the product, but also can cause the overall quality of the product to decrease. The existing manual pin pressing and manual scrubbing not only increases the human error in the production process, but also makes it difficult to guarantee the accuracy and consistency of the entire production process, thereby not only affecting the reliability and stability of the product, but also causing the overall quality of the product to decrease. SUMMARY
[0004] The main purpose of the present application is to provide a line board pressing needle and wiping board device, which avoids the uncertainty of manual operation, improves the production efficiency and surface quality of the line board, and guarantees the reliability and stability of the product.
[0005] To achieve the above purpose, the present application provides a line board pressing needle and wiping board device, which comprises:
[0006] An operation platform is fixedly connected with a sliding seat, the sliding seat is slidably connected with a first mold base for positioning the line board;
[0007] An X-axis conveying module is arranged along the long side direction of the sliding seat, the X-axis conveying module comprises a bearing plate, a pressing plate module is connected to the bearing plate for pressing the needle of the line board on the first mold base, the pressing plate module comprises a positioning plate and a pressing cover plate which slide relative to each other, the positioning plate is fixedly connected with the bearing plate, and the pressing cover plate is raised and lowered based on the positioning plate;
[0008] A Y-axis conveying module is arranged along the wide side direction of the sliding seat, a wiping plate module is connected to the Y-axis conveying module for automatically scrubbing the line board after the needle pressing;
[0009] A second mold base is fixedly connected to the operation platform, and the second mold base is arranged on one side of the wiping plate module.
[0010] In a possible implementation, the pressing plate module further comprises:
[0011] The first cylinder is fixedly connected to the receiving plate, and the telescopic shaft of the first cylinder is in sliding connection with the pressing plate;
[0012] The first suction disc is elastically arranged on the pressing plate;
[0013] The second cylinder is fixedly connected to the positioning plate, and a telescopic column is fixedly connected to the telescopic shaft of the second cylinder, and the other end of the telescopic column is fixedly connected to the first suction disc.
[0014] In a possible implementation, the wiping plate module comprises:
[0015] The limiting block is fixedly connected to the Y-axis conveying module, a positioning block is in sliding connection with the limiting block, a plurality of brush discs are fixedly connected to the lower side of the positioning block and used for wiping and washing the surface of the circuit board, a third cylinder is fixedly connected to the limiting block, and the telescopic shaft of the third cylinder is fixedly connected to the positioning block.
[0016] In a possible implementation, the operation platform is provided with a discharging module for automatically discharging the wiped and washed circuit board, and the discharging module comprises:
[0017] The conveying table is arranged along the conveying direction of the sliding seat, and the discharging bin is in sliding connection with the conveying table;
[0018] The lifting table is fixedly connected to the Y-axis conveying module, and the lifting plate is in lifting connection with the lifting table, and the second suction disc is fixedly connected to the lower side of the lifting plate.
[0019] In a possible implementation, the discharging bin is in sliding connection with the placing plate, the lower side of the placing plate is in abutment with the dial, the dial is rotatably connected to the discharging bin, the motor is fixedly connected to the outer wall of the discharging bin, and the driving shaft of the motor is coaxially fixedly connected to the dial.
[0020] In a possible implementation, the discharging plate is elastically connected to the placing plate, and the weight detection module is fixedly connected between the placing plate and the discharging plate.
[0021] In a possible implementation, the upper side of the sliding seat is in sliding connection with two clamping plates, and the limiting plate is fixedly connected between the two clamping plates and used for limiting the distance between the two clamping plates, and the clamping groove is arranged in each clamping plate.
[0022] The lower side of the sliding seat is in sliding connection with the transmission plate driven by the cylinder, and the bent part of the transmission plate is in abutment with the inner wall of each clamping groove.
[0023] The technical scheme of the present application through the wiping plate template not only significantly improves the automation level of the production line, but also comprehensively optimizes the production process. By ensuring efficient cooperation between each link, the wiping plate module can achieve precise control and fast operation, thereby improving production efficiency and effectively ensuring safety during the production process. The design of the X-axis conveying module further widens the sliding stroke of the wiping plate module, enabling it to flexibly cope with circuit boards of different lengths, providing higher flexibility and adaptability. Not only does it improve the overall applicability of the production line, but it also ensures efficient operation of the equipment under various product specifications. At the same time, the cooperation of the wiping plate module and the Y-axis conveying module enables the surface of the circuit board 1 to be precisely and automatically wiped. This automated process avoids the uncertainty of manual operation, improves the production efficiency and surface quality of the circuit board, and ensures the reliability and stability of the product. Each operation step is completed by program control, completely eliminating errors that may be caused by human factors, ensuring the smooth operation of the pressing needle and wiping plate. This high degree of automation and precise control not only ensures the improvement of production efficiency, but also plays a positive role in subsequent circuit board welding processes. By ensuring the standardization and high-precision execution of each processing link, the stability of the circuit board welding quality is improved. This means that each link in the entire production process is under fine control, providing a more reliable guarantee for the quality of the final product and ensuring efficient and stable production line operation. BRIEF DESCRIPTION OF DRAWINGS
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, a brief introduction to the drawings needed to be used in the embodiments or prior art description will be given below. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings from the structures shown in these drawings without creative labor.
[0025] Figure 1 is a schematic diagram of a circuit board pressing and wiping device of the present application Figure 1 ;
[0026] Figure 2 is an enlarged schematic diagram of A in Figure 1 ;
[0027] Figure 3 is a schematic diagram of a circuit board pressing and wiping device of the present application
[0028] Figure 4 is a schematic diagram of a circuit board pressing and wiping device of the present application Figure 2 ;
[0029] Figure 5 is an enlarged schematic diagram of B in Figure 4 ;
[0030] Figure 6 A schematic view of a pressing plate assembly of a circuit board pressing and wiping device Figure 1 ;
[0031] Figure 7 A schematic view of a pressing plate assembly of a circuit board pressing and wiping device Figure 2 .
[0032] BRIEF DESCRIPTION OF DRAWINGS
[0033] 1, circuit board; 11, operation platform; 12, sliding seat; 13, first mold base; 14, X-axis conveying module; 15, receiving plate; 16, Y-axis conveying module; 17, second mold base; 18, unloading module; 21, positioning plate; 22, pressing cover plate; 23, first air cylinder; 24, first suction cup; 25, second air cylinder; 26, telescopic column; 31, limiting block; 32, positioning block; 33, brush disc; 34, third air cylinder; 41, conveying table; 42, unloading bin; 43, lifting table; 44, lifting plate; 45, second suction cup; 46, storage plate; 461, dial; 47, motor; 48, unloading plate; 51, clamping plate; 52, limiting plate; 53, clamping groove; 54, transmission plate.
[0034] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION
[0035] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.
[0036] The present application provides a circuit board pressing and wiping device.
[0037] Referring to Figures 1 to 7 , including circuit board 1, operation platform 11, sliding seat 12, first mold base 13, X-axis conveying module 14, receiving plate 15, Y-axis conveying module 16, second mold base 17, positioning plate 21, pressing cover plate 22, sliding seat 12 is fixedly connected to operation platform 11, first mold base 13 is connected to sliding seat 12 through sliding, first mold base 13 has a notch with the same shape as circuit board 1, which is used for embedding circuit board 1 in the notch, in addition, first mold base 13 also has two long slot notches for better placing circuit board 1 by the user, and the long slot notches can also be used for limiting the bottom of the pin needle for positioning circuit board 1.
[0038] The X-axis conveying module 14 is arranged in the long side direction of the slide 12, and the X-axis conveying module 14 comprises a receiving plate 15, and the pressing plate module is connected to the receiving plate 15, and the receiving plate 15 moves along with the linear motor on the X-axis conveying module 14, so as to compensate the sliding stroke of the pressing plate module, press the pins on the circuit board 1 on the first mold base 13, and move the circuit board 1, so that the circuit board 1 is automatically transferred after being pressed. The pressing plate module comprises a positioning plate 21 and a pressing cover plate 22 which slide relative to each other, the positioning plate 21 is fixedly connected to the receiving plate 15, and the pressing cover plate 22 is raised and lowered based on the positioning plate 21. Through the relative movement of the two, the circuit board 1 on the first mold base 13 is extruded, so that the pin on the circuit board 1 is fixed on the circuit board 1.
[0039] The Y-axis conveying module 16 is the same as the X-axis conveying module 14, and is driven by a linear motor, so as to control the movement of the wiping plate module. The Y-axis conveying module 16 is arranged in the wide side direction of the slide 12, and the wiping plate module is connected to the Y-axis conveying module 16, so as to automatically wipe the surface of the circuit board 1 after being pressed. The second mold base 17 is fixedly connected to the operation platform 11, and the second mold base 17 is arranged on one side of the wiping plate module. The second mold base 17 is used for placing the circuit board 1 after being pressed, so as to prevent the circuit board 1 from sliding randomly. Preferably, a plurality of long slot openings are formed on the surface of the second mold base 17. Through the slot openings, the pin tail on the back of the circuit board 1 can be clamped in the slot openings, so that when the wiping plate module wipes the circuit board 1, the circuit board 1 can remain stable and slide relative to the wiping plate module, thereby ensuring the wiping effect of the wiping plate module.
[0040] The wiping plate module not only significantly improves the automation level of the production line, but also optimizes the production process comprehensively. By ensuring efficient cooperation between each link, the wiping plate module can achieve precise control and fast operation, thereby improving production efficiency and effectively ensuring safety during the production process. The design of the X-axis conveying module 14 further expands the sliding stroke of the wiping plate module, enabling it to flexibly handle line boards 1 of different lengths, providing higher flexibility and adaptability. Not only does it improve the overall applicability of the production line, but it also ensures efficient operation of the equipment under various product specifications. At the same time, the cooperation between the wiping plate module and the Y-axis conveying module 16 enables the surface of the line board 1 to be precisely and automatically wiped. This automated process avoids the uncertainty of manual operation, improves the production efficiency and surface quality of the line board 1, and ensures the reliability and stability of the product. Each operation step is completed by program control, completely eliminating errors that may be caused by human factors, ensuring smooth operation of the pressing needle and wiping plate. This high degree of automation and precise control not only ensures the improvement of production efficiency, but also positively affects the subsequent line board welding process. By ensuring standardization and high-precision execution of each processing link, the stability of line board welding quality is improved. This means that every link in the entire production process is finely controlled, providing more reliable protection for the quality of the final product and ensuring efficient and stable production line operation.
[0041] Referring to Figures 1 to 3 , the unloading module 18 is arranged on the operation platform 11 and is used for automatically unloading the wiped line board 1. The unloading module 18 comprises a conveying table 41, an unloading bin 42, and a lifting table 43. The conveying table 41 is arranged along the conveying direction of the sliding seat 12. The unloading bin 42 is slidably connected to the conveying table 41. The lifting table 43 is fixedly connected to the Y-axis conveying module 16. The lifting table 43 is connected to a lifting plate 44 in a lifting manner. The second suction disc 45 is fixedly connected to the lower side of the lifting plate 44. The addition of the unloading module 18 enables the processed line board 1 to be stably collected and transferred without returning through the X-axis conveying module 14 and the pressing plate assembly, so that the subsequent line board 1 can be quickly fed, thereby improving the production efficiency of the production line.
[0042] Referring to Figures 1 to 3 , the placing plate 46 is slidably connected to the unloading bin 42. The dial 461 is abutted to the lower side of the placing plate 46. The dial 461 is rotatably connected to the unloading bin 42. The outer wall of the unloading bin 42 is fixedly connected to the motor 47. The driving shaft of the motor 47 is fixedly connected to the dial 461 in a coaxial manner.
[0043] In order to improve the transportation cost of the finished product circuit board 1, that is, to reduce the moving frequency of the discharge bin 42, so that the discharge bin 42 can collect more circuit boards 1 in the same period of time, at this time, either enlarge the volume of the discharge bin 42, or increase the depth of the discharge bin 42, and the circuit board 1 is a product that needs to be carefully protected, so when it is transported into the discharge bin 42 by the discharge module 18, it needs to be adjusted according to the storage depth of the discharge bin 42, so that the circuit board 1 can be stably placed in the discharge bin 42, which increases the working pressure of the discharge module 18, so that the placing plate 46 placed on the circuit board 1 can be stably lifted according to the production line processing efficiency, thereby reducing the working pressure of the discharge module 18 and improving the production efficiency of the production line.
[0044] Referring to Figures 1 to 3 , the discharge plate 48 is elastically connected to the placing plate 46, and a spring with damping is arranged between the placing plate 46 and the discharge plate 48, so that the two are elastically connected, and then a weight detection module is added on this basis, and the weight detection module is arranged between the placing plate 46 and the discharge plate 48 for real-time detection of the weight of the material;
[0045] The weight detection module arranged between the placing plate 46 and the discharge plate 48 detects the circuit board 1 placed on the discharge plate 48 in real time, and then adjusts the relative position of the placing plate 46 in the discharge bin 42 according to the weight, so that the user can adjust the efficiency of other processes without affecting the lifting speed and lifting frequency of the placing plate 46, thereby improving the automation of the entire production line.
[0046] Referring to Figures 4 to 7 , on the basis of the above, the pressing plate module further comprises a first air cylinder 23, a first suction cup 24 and a second air cylinder 25, the first air cylinder 23 is fixedly connected to the receiving plate 15, the telescopic shaft of the first air cylinder 23 is slidingly connected with the pressing cover plate 22, the relative sliding of the pressing cover plate 22 and the positioning plate 21 is controlled by the first air cylinder 23, and the sliding distance is accurately controlled, so that the circuit board 1 with different pressing needle requirements can be pressed. The first suction cup 24 is elastically arranged on the pressing cover plate 22, and when the pressing cover plate 22 is pressed, the first suction cup 24 is reset upward to adsorb the circuit board 1 on the first mold base 13, the second air cylinder 25 is fixedly connected to the positioning plate 21, the telescopic shaft of the second air cylinder 25 is fixedly connected with the telescopic column 26, the telescopic column 26 enables the pressing cover plate 22 and the positioning plate 21 to stably operate when they slide relative to each other, and the other end of the telescopic column 26 is fixedly connected with the first suction cup 24;
[0047] The pressing plate template is driven by the first cylinder 23 to drive the pressing plate 22 to slide up and down under the reference of the positioning plate 21. When the circuit board 1 arranged on the first mold base 13 moves to the lower side of the pressing plate 22, the pressing force applied by the pressing plate 22 can ensure that the pins on the circuit board 1 are fixed to the circuit board 1, thereby completing the pin pressing operation. Subsequently, the first cylinder 23 drives the pressing plate 22 to move upwards, and the elastically arranged first suction cup 24 protrudes from the lower side of the pressing plate 22 to quickly adsorb the circuit board 1, thereby completing the grasping of the circuit board 1 after the pin pressing. Then, with the driving of the second cylinder 25, the suction cup moves the circuit board 1, which has completed the pin pressing operation, to the direction of the second mold base 17, and finally stably arranges the circuit board 1 on the second mold base 17. In this process, the first suction cup 24 stops adsorbing, and the circuit board 1 stably falls into the second mold base 17 by gravity, thereby realizing accurate positioning and smooth transfer. Through the cooperation of the pin pressing operation of the pressing plate module and the suction cup transfer, the pressing plate module can not only automatically perform the pin pressing operation of the circuit board 1, but also automatically grasp and transfer the circuit board 1 after the operation is completed, thereby greatly improving the processing efficiency. This automatic process reduces the need for manual intervention and improves the work efficiency of the production line. It is worth mentioning that between the sliding seat 12 and the second mold base 17, a transportation line perpendicular to the long side of the sliding seat 12 is designed. This transportation line is used to move the circuit board 1 processed by the pressing plate module to another station through the conveying system, and further into other pressing plate modules for processing. It is worth mentioning that the pressing plate modules on these stations are controlled by a Y-axis conveying module 16, which ensures accurate conveying and cooperation. In this way, the X-axis conveying module 14 can be used with multiple pressing plate modules, greatly improving the flexibility and expandability of the production line, reducing production costs, and further improving the production efficiency of the production line. Overall, the pressing plate module not only improves the automation level of the production line, but also optimizes the production process, ensuring efficient cooperation at each link, thereby realizing accurate control and rapid operation, and further improving production efficiency and ensuring production safety.
[0048] With reference to Figures 4 to 5 The pressing plate module includes a limiting block 31 fixedly connected with the Y-axis conveying module 16, the limiting block 31 is in sliding connection with a positioning block 32, a plurality of brush discs 33 are fixedly connected to the lower side of the positioning block 32, the brush disc 33 is in a cylindrical shape, and a plurality of soft fiber bristles are arranged thereon. When the brush disc 33 is used to scrub the surface of the circuit board 1, the soft fiber bristles can remove the waste and will not cause wear to the surface of the circuit board 1. In addition, the brush disc 33 can be rotatably arranged on the lower side of the positioning block 32, so that the brush disc 33 is in a rotating state during the scrubbing process. When the bristles on the brush disc 33 are entangled with the surface of the circuit board 1, the rotation of the brush disc 33 can buffer and guide the pulling force, thereby reducing the direct force of the bristles on the surface of the circuit board 1. The limiting block 31 is fixedly connected with a third cylinder 34, and the telescopic shaft of the third cylinder 34 is fixedly connected with the positioning block 32.
[0049] The several brush plates 33 in the wiping plate module reciprocate along with the Y-axis conveying module 16, and then under the accurate control of the third cylinder 34, the distance between the brush plate 33 and the upper surface of the circuit board 1 is kept at a set value, and thus the pressure of the brush plate 33 on the circuit board 1 is accurately controlled, which not only ensures that the brush plate 33 can automatically wipe the surface of the circuit board 1 after the pressing plate, improves the automation of the production line, improves the production efficiency of the product, and reduces the labor intensity of the workers.
[0050] Referring to Figures 1 to 3 Both the clamping plates 51 are slidably connected to the upper side of the sliding seat 12, the limiting plate 52 is fixedly connected between the two clamping plates 51, and is used for limiting the distance between the two clamping plates 51, the clamping groove 53 is arranged on the clamping plate 51, the transmission plate 54 driven by the cylinder is slidably connected to the lower side of the sliding seat 12, the upper side of the transmission plate 54 is bent, and the bent part is in abutment with the inner wall of each clamping groove 53, the two sides of the transmission plate 54 are bent upward, and the transmission plate 54 is embedded in the clamping plate 51 through the bent part, so that the movement of the transmission plate 54 drives the movement of the clamping plate 51.
[0051] Here, only one preferred measure for the movement of the transmission plate 54 is described, and other measures, such as the cooperation of a motor and a lead screw, or a cylinder drive, can also accurately control the movement of the transmission plate 54.
[0052] Compared with driving the pressing plate assembly by the X-axis conveying module 14 to press and cover and adsorb the circuit board 1 on the first mold base 13 at a fixed position, the transmission plate 54 driven by the cylinder is used to make the transmission plate 54 in abutment with the inner wall of the clamping groove 53 through the bent part, so that the clamping plate 51 is driven to move, and the first mold base 13 clamped between the two clamping plates 51 is moved, so that the pressing action of the pressing plate assembly on the circuit board 1 is away from the feeding position, and the worker can normally observe the circuit board 1, so as to prevent the worker from being injured by the pressing plate assembly due to accidental touch or other bad behaviors, and ensure the safety of the worker.
[0053] The same or similar reference signs in the drawings of the embodiments correspond to the same or similar parts; in the description of the present application, it should be understood that the orientation or position relationship indicated by the terms “upper”, “lower”, “left”, “right” and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, therefore the terms describing the position relationship in the drawings are only used for exemplary description, and cannot be understood as a limitation on the present patent, and for ordinary skilled persons in the art, the specific meaning of the above terms can be understood according to the specific circumstances.
[0054] The above merely provides preferred embodiments of the present application, and is not used to limit the present application. Any modification, equivalent replacement, and improvement made in the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A circuit board pressure pin wiping device, characterized in that, Include: Operation platform (11), the operation platform (11) is fixedly connected with a sliding seat (12), the sliding seat (12) is slidably connected with a first die holder (13), for positioning the circuit board (1); X-axis conveying module (14), the X-axis conveying module (14) is arranged along the long side direction of the sliding seat (12), and the X-axis conveying module (14) includes a bearing plate (15), the bearing plate (15) is connected with a pressing plate module, for pressing the circuit board (1) on the first die holder (13), the pressing plate module includes a positioning plate (21) and a pressing cover plate (22) that slide relative to each other, the positioning plate (21) is fixedly connected with the bearing plate (15), and the pressing cover plate (22) is raised and lowered based on the positioning plate (21); Y-axis conveying module (16), the Y-axis conveying module (16) is arranged along the wide side direction of the sliding seat (12), and the Y-axis conveying module (16) is connected with a wiping plate module, for automatically wiping the circuit board (1) after pressing; Second die holder (17), the second die holder (17) is fixedly connected on the operation platform (11), and the second die holder (17) is arranged on the side of the wiping plate module.
2. The line board pin pressing squeegee device according to claim 1, wherein, The pressing plate module further includes: A first air cylinder (23) is fixedly connected to the bearing plate (15), and the first air cylinder (23) is slidably connected to the pressing cover plate (22); A first suction disc (24) is elastically arranged on the pressing cover plate (22); A second air cylinder (25) is fixedly connected to the positioning plate (21), and a telescopic column (26) is fixedly connected to the telescopic shaft of the second air cylinder (25), and the other end of the telescopic column (26) is fixedly connected to the first suction disc (24).
3. The line board pin pressing and erasing device according to claim 2, characterized in that, The wiping plate module includes: A limiting block (31) is fixedly connected to the Y-axis conveying module (16), and a positioning block (32) is slidably connected to the limiting block (31), a plurality of brush discs (33) are fixedly connected to the lower side of the positioning block (32), for wiping the surface of the circuit board (1), a third air cylinder (34) is fixedly connected to the limiting block (31), and the telescopic shaft of the third air cylinder (34) is fixedly connected to the positioning block (32).
4. The line board pin pressing squeegee device according to claim 1, wherein, The operation platform (11) is provided with a discharging module (18) for automatically discharging the wiped circuit board (1), and the discharging module (18) includes: A conveying table (41) is arranged along the conveying direction of the sliding seat (12), and a discharging bin (42) is slidably connected to the conveying table (41); A lifting table (43) is fixedly connected to the Y-axis conveying module (16), and a lifting plate (44) is connected to the lifting table (43), and a second suction disc (45) is fixedly connected to the lower side of the lifting plate (44).
5. The line board pin pressing squeegee device according to claim 4, wherein, The discharging bin (42) is slidably connected with a storage plate (46), the lower side of the storage plate (46) is abutted with a dial (461), the dial (461) is rotationally connected with the discharging bin (42), the outer wall of the discharging bin (42) is fixedly connected with a motor (47), and the driving shaft of the motor (47) is coaxially fixedly connected with the dial (461).
6. The line board pin pressing squeegee device according to claim 5, wherein, The storage plate (46) is elastically connected with a discharging plate (48), and the storage plate (46) and the discharging plate (48) are fixedly connected with a weight detection module.
7. The line board pin pressing squeegee device of claim 1, wherein, The upper side of the sliding seat (12) is slidably connected with two clamping plates (51), the two clamping plates (51) are fixedly connected with a limiting plate (52) between them, for limiting the distance between the two clamping plates (51), and each clamping plate (51) is provided with a clamping groove (53); The lower side of the sliding seat (12) is slidably connected with a transmission plate (54) driven by a gas cylinder, and the bending part of the transmission plate (54) is abutted with the inner wall of each clamping groove (53).
Citation Information
Patent Citations
Automatic pin pressing and board wiping device for circuit board
CN105813402A
Board wiping machine for cleaning surface of circuit board
CN212812194U