Composition for protective film of conductive layer

Abstract

The present invention provides a composition capable of forming a protective (sealing) film which, when protecting (sealing) a conductive layer constituting a conductive substrate, gives consideration to transparency, adhesion strength, and bending resistance, and which is capable of suppressing changes in surface resistivity of the conductive substrate and migration of a conductor. This composition for a protective film for a conductive layer of a conductive substrate comprises (A) a crosslinked polymer having an isobutylene-isoprene copolymer chain, and the conductive layer is composed of a conductive material comprising at least one type selected from the group consisting of metal nanowires, metal meshes, metal nanoparticles, and conductive polymers.

Description

TECHNICAL FIELD

[0001] The present application relates to a composition for protecting (sealing) a conductive layer constituting a conductive substrate. BACKGROUND

[0002] Development of a conductive substrate using metal nanowires, metal mesh, metal nanoparticles, and a conductive polymer as a conductor is in progress, and is expected to be applied to electrode materials for displays, electrode materials for touch panels, electromagnetic shielding materials, and the like. However, these conductors have the following problem: corrosion due to moisture occurs in a high-temperature high-humidity environment, resulting in an increase in surface resistance. In order to obtain a substrate that exhibits stable conductivity even in a high-temperature high-humidity environment, sealing with a sealing sheet is required. For example, in Patent Literature 1, a method of using a protective layer containing a chelating material on a conductive layer containing silver nanowires is described. In addition, in Patent Literature 2, a resin composition of an acrylic polymer is described as an adhesive layer for bonding a metal mesh wiring and a substrate on which silver nanowires are formed.

[0003] However, in Patent Literature 1, an acrylic resin composition is selected for forming a protective layer, and UV irradiation is required in order to function. In addition, since the water vapor permeability of the resin is also high, in a long-term high-temperature high-humidity test, sufficient function as a protective layer cannot be exerted. In addition, in Patent Literature 2, while migration of metal to the adhesive layer can be suppressed and adhesion can be achieved, there is no mention of flexibility.

[0004] PRIOR ART DOCUMENTS PATENT LITERATURE Patent Literature 1: Japanese Patent No. 7030277 Patent Literature 2: Japanese Patent Application Laid-Open No. 2021-195449. SUMMARY

[0005] PROBLEMS TO BE SOLVED BY THE INVENTION The present application was made in view of the above-described circumstances, and aims to provide a composition that can form a protective (sealing) film that, when protecting (sealing) a conductive layer constituting a conductive substrate, takes into account transparency, adhesion strength, and flexibility, and can suppress changes in the surface resistivity of the conductive substrate and migration of the conductor.

[0006] MEANS FOR SOLVING THE PROBLEMS The present inventors conducted intensive research in order to solve the above-described problems, and as a result, found that, in a composition for protecting (sealing) a conductive layer constituting a conductive substrate, by being configured as follows, a protective (sealing) film that takes into account transparency, adhesion strength, and flexibility, and can suppress changes in the surface resistivity of the conductive substrate and migration of the conductor can be formed, thereby completing the present application.

[0007] That is, the present application has the following features.

[0008] [1] A composition for a protective film of a conductive layer of a conductive substrate, The composition comprises: (A) a crosslinked polymer having isobutylene-isoprene copolymer chains, The conductive layer is composed of a conductive material selected from one or more of metal nanowires, metal mesh, metal nanoparticles, and conductive polymers.

[0009] [2] The composition according to [1], wherein the (A) crosslinked polymer having isobutylene-isoprene copolymer chains is at least one selected from the reaction product of an isobutylene-isoprene copolymer having an epoxy group and an olefin-based polymer having a carboxyl group and / or an anhydride group, and the reaction product of an isobutylene-isoprene copolymer having a carboxyl group and / or an anhydride group and an olefin-based polymer having an epoxy group.

[0010] [3] The composition according to [1] or [2], wherein the content of the (A) component is 10 to 75 mass% with respect to 100 mass% of the non-volatile components of the composition.

[0011] [4] The resin composition according to any one of [1] to [3], further comprising: (B) a liquid polyolefin-based resin and / or a liquid rubber.

[0012] [5] The composition according to [4], wherein the content of the (B) component is 5 to 50 mass% with respect to 100 mass% of the non-volatile components of the composition.

[0013] [6] The composition according to any one of [1] to [5], further comprising: (C) a hygroscopic inorganic filler.

[0014] [7] The composition according to [6], wherein the (C) hygroscopic inorganic filler is one or more selected from uncalcined hydrotalcite and semi-calcined hydrotalcite.

[0015] [8] The composition according to [6] or [7], wherein the content of the (C) component is 1 to 60 mass% with respect to 100 mass% of the non-volatile components of the composition.

[0016] [9] The composition according to any one of [1] to [8], wherein the metal constituting the metal nanowires, the metal mesh, and / or the metal nanoparticles is one or more selected from silver, copper, gold, nickel, platinum, palladium, iron, cobalt, and tin.

[0017]

[10] The composition according to any one of [1] to [9], wherein the electrically conductive polymer is one or more selected from the group consisting of poly(3,4-ethylenedioxythiophene) (PEDOT), polypyrrole, polythiophene, graphene, polyacetylene, poly(p-phenylene), poly(p-phenylenevinylene), and polyaniline.

[0018] Effects of Invention According to the present application, it is possible to provide a composition capable of forming a protective (sealing) film that, when protecting (sealing) an electrically conductive layer constituting an electrically conductive substrate, takes into account transparency, adhesion strength, and bending resistance, and can suppress changes in the surface resistivity of the electrically conductive substrate and migration of the electrically conductive body. DETAILED DESCRIPTION

[0019] Hereinafter, the present application will be described according to preferred embodiments of the present application.

[0020] [Composition for protective film of electrically conductive layer of electrically conductive substrate] The composition of the present application is used for a protective film of an electrically conductive layer of an electrically conductive substrate, The composition comprises: (A) a crosslinked polymer having isobutylene-isoprene copolymer chains, The electrically conductive layer is constituted by an electrically conductive material comprising one or more selected from the group consisting of metal nanowires, metal mesh, metal nanoparticles, and electrically conductive polymers.

[0021] <(A) component: crosslinked polymer having isobutylene-isoprene copolymer chains> The (A) component is a crosslinked polymer having isobutylene-isoprene copolymer (i.e., butyl rubber) chains. The (A) component can be used alone or in combination with two or more. By using the (A) component, it is possible to suppress an increase in the surface resistivity of the electrically conductive substrate (while exhibiting low moisture permeability, it is possible to prevent the intrusion of oxygen or ions, which are the main causes of an increase in the surface resistivity), and it is possible to form a protective (sealing) film that is excellent in bending resistance.

[0022] The (A) component can be formed by reacting an isobutylene-isoprene copolymer having a reactive functional group (hereinafter sometimes referred to as "first reactive functional group") (i.e., butyl rubber having a first reactive functional group) with an olefin-based polymer having a reactive functional group that can react with the first reactive functional group (hereinafter sometimes referred to as "second reactive functional group"). Here, the "olefin-based polymer" refers to a polymer in which a constitutional unit derived from an olefin (hereinafter sometimes simply referred to as "olefin unit") is the main constitutional unit (i.e., the amount of the olefin unit is the largest among all constitutional units). Note that the "constitutional unit derived from butene" and the like as the olefin unit are sometimes simply referred to as "butene unit" and the like.

[0023] As the olefin, a mono-olefin having one olefinic carbon-carbon double bond and / or a di-olefin having two olefinic carbon-carbon double bonds are preferred. As the mono-olefin, for example, α-olefins such as ethylene, propylene, 1-butene, isobutene (isobutylene), 1-pentene, 1-hexene, 1-heptene, 1-octene, and the like can be mentioned. As the di-olefin, for example, 1,3-butadiene, isoprene, 1,3-pentadiene, 2,3-dimethylbutadiene, and the like can be mentioned.

[0024] The olefin-based polymer can be a homopolymer or a copolymer. The copolymer can be a random copolymer or a block copolymer. In addition, the olefin-based polymer can be a copolymer of an olefin and a monomer other than an olefin. As the olefin-based copolymer, for example, ethylene-non-conjugated diene copolymers, ethylene-propylene copolymers, ethylene-propylene-non-conjugated diene copolymers, ethylene-butene copolymers, propylene-butene copolymers, propylene-butene-non-conjugated diene copolymers, styrene-isobutene copolymers, styrene-isobutene-styrene copolymers, isobutene-isoprene copolymers (i.e., butyl rubber), and the like can be mentioned.

[0025] The olefin-based polymer having the second reactive functional group is preferably a butene-based polymer having the second reactive functional group. Here, the "butene-based polymer" means a polymer having butene units as the main constituent units (i.e., the amount of butene units is the largest among all the constituent units). As the butene, for example, 1-butene, isobutene, and the like can be mentioned. As the butene-based polymer, for example, polybutene, isobutene-isoprene copolymers, and the like can be mentioned. The polybutene can be a homopolymer (e.g., 1-butene homopolymer, isobutene homopolymer) or a copolymer (e.g., copolymer of 1-butene and isobutene).

[0026] In order to form the component (A), the isobutene-isoprene copolymer having the first reactive functional group and the olefin-based polymer having the second reactive functional group can each be used singly or in combination of two or more.

[0027] As the combination of the first reactive functional group and the second reactive functional group, for example, there can be mentioned: a combination of an epoxy group and a carboxyl group and / or an anhydride group (i.e., carbonyloxy carbonyl group (-CO-O-CO-)), a combination of a carboxyl group and / or an anhydride group and an epoxy group, a combination of an epoxy group and an amino group, a combination of an amino group and an epoxy group, a combination of a hydroxyl group and an isocyanate group (i.e., isocyanate group), a combination of an isocyanate group and a hydroxyl group, a combination of functional groups having a double bond (e.g., vinyl group or (meth)acryloyl group) with each other, and the like. Among these, from the viewpoint of water resistance, a combination of an epoxy group and a carboxyl group and / or an anhydride group, and a combination of a carboxyl group and / or an anhydride group and an epoxy group are preferred, and a combination of an epoxy group and an anhydride group, and a combination of an anhydride group and an epoxy group are more preferred. Note that in the combination, the reactive functional group of the former represents the first reactive functional group, and the reactive functional group of the latter represents the second reactive functional group.

[0028] In one aspect of the present application, the (A) component is preferably at least one selected from the group consisting of a reaction product of an isobutylene-isoprene copolymer having an epoxy group and an olefin-based polymer having a carboxyl group and / or an anhydride group, and a reaction product of an isobutylene-isoprene copolymer having a carboxyl group and / or an anhydride group and an olefin-based polymer having an epoxy group. In the aspect, the olefin-based polymer is preferably a butene-based polymer, and more preferably polybutene or an isobutylene-isoprene copolymer. In the aspect, the carboxyl group and / or the anhydride group is preferably an anhydride group.

[0029] In one aspect of the present application, the (A) component is preferably a reaction product of an isobutylene-isoprene copolymer having an epoxy group and a polybutene having a carboxyl group and / or an anhydride group. In the aspect, the carboxyl group and / or the anhydride group is preferably an anhydride group.

[0030] In one aspect of the present application, the (A) component is preferably a reaction product of an isobutylene-isoprene copolymer having an epoxy group and an isobutylene-isoprene copolymer having a carboxyl group and / or an anhydride group. In the aspect, the carboxyl group and / or the anhydride group is preferably an anhydride group.

[0031] The amount of use of the isobutylene-isoprene copolymer having a reactive functional group (e.g., an epoxy group, a carboxyl group, and / or an anhydride group) is preferably 15 to 100% by mass, more preferably 20 to 100% by mass, and further preferably 30 to 100% by mass, relative to the total amount of use of the polymers used to form the (A) component (e.g., the total amount of use of the isobutylene-isoprene copolymer having the first reactive functional group and the olefin-based polymer having the second reactive functional group). Note that in the case where the isobutylene-isoprene copolymer having the first reactive functional group and the isobutylene-isoprene copolymer having the second reactive functional group are used to form the (A) component, the "amount of use of the isobutylene-isoprene copolymer having a reactive functional group" means the "total amount of use of the isobutylene-isoprene copolymer having the first reactive functional group and the isobutylene-isoprene copolymer having the second reactive functional group".

[0032] The number average molecular weight of the isobutylene-isoprene copolymer having a reactive functional group (e.g., an epoxy group, a carboxyl group, and / or an anhydride group) used to form the (A) component is preferably 5,000 to 500,000, more preferably 10,000 to 400,000, and further preferably 20,000 to 300,000. Note that the number average molecular weight in the present application is measured by the gel permeation chromatography (GPC) method (polystyrene conversion value). Specifically, the number average molecular weight based on the GPC method can be measured using "LC-9A / RID-6A" manufactured by Shimadzu Corporation as the measuring device, "Shodex K-800P / K-804L / K-804L" manufactured by Showa Denko K.K. as the column, and toluene or the like as the mobile phase at a column temperature of 40°C, and the calibration curve of a standard polystyrene is used for the calculation.

[0033] The number average molecular weight of the olefin-based polymer having the second reactive functional group (e.g., an epoxy group, a carboxyl group, and / or an anhydride group) other than the isobutylene-isoprene copolymer used to form the (A) component is preferably 500 to 500,000, more preferably 1,000 to 300,000, and further preferably 1,500 to 200,000.

[0034] From the viewpoint of the bending resistance, the amount of isobutylene units in the isobutylene-isoprene copolymer having a reactive functional group (e.g., an epoxy group, a carboxyl group, and / or an anhydride group) used to form the (A) component is preferably 0.1 to 20% by mass, more preferably 0.3 to 10% by mass, and further preferably 0.5 to 15% by mass, relative to the total amount of isobutylene units and isoprene units. Note that the amount of isoprene units is based on the isobutylene units and isoprene units excluding the modified moieties (e.g., moieties derived from maleic anhydride for introducing an anhydride group).

[0035] The epoxy group concentration in the olefin-based polymer having an epoxy group (e.g., isobutylene-isoprene copolymer having an epoxy group, polybutene having an epoxy group) used to form the (A) component is preferably 0.01 to 10 mmol / g, more preferably 0.05 to 5 mmol / g. The epoxy group concentration is determined from the epoxy equivalent obtained based on JIS K 7236-1995.

[0036] The carboxyl group concentration in the olefin-based polymer having a carboxyl group (e.g., isobutylene-isoprene copolymer having a carboxyl group, polybutene having a carboxyl group) used to form the (A) component is preferably 0.01 to 10 mmol / g, more preferably 0.05 to 5 mmol / g. The carboxyl group concentration is determined from the acid value as described in JIS K 2501, which is defined as the mg number of potassium hydroxide required to neutralize the acid present in 1 g of resin.

[0037] The acid anhydride group concentration in the olefin-based polymer having an acid anhydride group (e.g., isobutylene-isoprene copolymer having an acid anhydride group, polybutene having an acid anhydride group) used to form the (A) component is preferably 0.01 to 10 mmol / g, more preferably 0.05 to 5 mmol / g. The acid anhydride group concentration is determined from the acid value as described in JIS K 2501, which is defined as the mg number of potassium hydroxide required to neutralize the acid present in 1 g of resin.

[0038] The total of the carboxyl group concentration and the acid anhydride group concentration in the olefin-based polymer having a carboxyl group and an acid anhydride group (e.g., isobutylene-isoprene copolymer having a carboxyl group and an acid anhydride group, polybutene having a carboxyl group and an acid anhydride group) used to form the (A) component is preferably 0.01 to 10 mmol / g, more preferably 0.05 to 5 mmol / g.

[0039] The amount of the isobutylene-isoprene copolymer having an epoxy group and the amount of the olefin-based polymer having a carboxyl group (e.g., isobutylene-isoprene copolymer having a carboxyl group, polybutene having a carboxyl group) used to form the (A) component is not particularly limited as long as the (A) component can be formed as a crosslinked polymer, and the ratio of the amount (mol) of the epoxy group to the amount (mol) of the carboxyl group (i.e., the amount (mol) of the epoxy group : the amount (mol) of the carboxyl group) is preferably 100:10 to 100:500, more preferably 100:25 to 100:475, and further preferably 100:40 to 100:450.

[0040] The amount of use of the isobutylene-isoprene copolymer having an epoxy group and the olefin-based polymer having an anhydride group (e.g., isobutylene-isoprene copolymer having an anhydride group, polybutene having an anhydride group) is not particularly limited as long as the (A) component as a crosslinked polymer can be formed, and the ratio of the amount (mol) of the epoxy group to the amount (mol) of the anhydride group (i.e., the amount (mol) of the epoxy group : the amount (mol) of the anhydride group) is preferably 100 : 10 to 100 : 500, more preferably 100 : 25 to 100 : 475, and further preferably 100 : 40 to 100 : 450.

[0041] The amount of use of the isobutylene-isoprene copolymer having an epoxy group and the olefin-based polymer having a carboxyl group and an anhydride group (e.g., isobutylene-isoprene copolymer having a carboxyl group and an anhydride group, polybutene having a carboxyl group and an anhydride group) is not particularly limited as long as the (A) component as a crosslinked polymer can be formed, and the ratio of the amount (mol) of the epoxy group to the total amount (mol) of the carboxyl group and the anhydride group (i.e., the amount (mol) of the epoxy group : (the amount (mol) of the carboxyl group + the amount (mol) of the anhydride group)) is preferably 100 : 10 to 100 : 500, more preferably 100 : 25 to 100 : 475, and further preferably 100 : 40 to 100 : 450.

[0042] The olefin-based polymer having an epoxy group (e.g., isobutylene-isoprene copolymer having an epoxy group, polybutene having an epoxy group) can be obtained by graft-modifying the olefin-based polymer with an unsaturated compound having an epoxy group (e.g., glycidyl (meth)acrylate, 4-hydroxybutyl acrylate glycidyl ether, allyl glycidyl ether) under radical reaction conditions.

[0043] The olefin-based polymer having an epoxy group can be used commercially available products. As commercially available products of isobutylene-isoprene copolymers having an epoxy group, for example, "ER866" (glycidyl methacrylate modified butyl rubber, epoxy group concentration: 1.63 mmol / g, number average molecular weight: 113,000) manufactured by Zeon Corporation, "ER850" (glycidyl methacrylate modified butyl rubber, epoxy group concentration: 0.65 mmol / g, number average molecular weight: 99,200) manufactured by Zeon Corporation, and the like can be given. As commercially available products of olefin-based polymers (excluding isobutylene-isoprene copolymers) having an epoxy group, for example, "T-YP341" (glycidyl methacrylate modified propylene-butylene random copolymer, epoxy group concentration: 0.64 mmol / g, number average molecular weight: 155,000) manufactured by Zeon Corporation, "T-YP276" (glycidyl methacrylate modified propylene-butylene random copolymer, epoxy group concentration: 0.64 mmol / g, number average molecular weight: 57,000) manufactured by Zeon Corporation, "T-YP313" (glycidyl methacrylate modified propylene-butylene random copolymer, epoxy group concentration: 0.64 mmol / g, number average molecular weight: 155,000) manufactured by Zeon Corporation, and the like can be given.

[0044] The olefin-based polymer having a carboxyl group and / or an anhydride group (for example, isobutylene-isoprene copolymer having a carboxyl group and / or an anhydride group, polybutene having a carboxyl group and / or an anhydride group) can be obtained by graft-modifying an olefin-based polymer with an unsaturated compound having a carboxyl group and / or an anhydride group (for example, maleic anhydride) under radical reaction conditions.

[0045] As commercially available products of the olefin-based polymer having a carboxyl group and / or an anhydride group, for example, "ER661" (maleic anhydride-modified butyl rubber, anhydride group concentration: 0.77 mmol / g, number average molecular weight: 40,000) manufactured by Zeon Corporation, "ER641" (maleic anhydride-modified butyl rubber, anhydride group concentration: 0.46 mmol / g, number average molecular weight: 57,000) manufactured by Zeon Corporation, and the like can be given. As commercially available products of the olefin-based polymer having a carboxyl group and / or an anhydride group (in which the isobutylene-isoprene copolymer is excluded), for example, "HV-300M" (maleic anhydride-modified polybutene, anhydride group concentration: 1.16 mmol / g, number average molecular weight: 2,100) manufactured by Toho Chemical Industry Co., Ltd., "T-YP279" (maleic anhydride-modified propylene-butylene random copolymer, anhydride group concentration: 0.46 mmol / g, number average molecular weight: 35,000) manufactured by Zeon Corporation, "T-YP312" (maleic anhydride-modified propylene-butylene random copolymer, anhydride group concentration: 0.46 mmol / g, number average molecular weight: 60,900) manufactured by Zeon Corporation, "Lucant A-5260" (maleic anhydride-modified ethylene-a-olefin random copolymer, anhydride group concentration: 0.44 mmol / g, number average molecular weight: 5,400) manufactured by Mitsui Chemicals, Inc., "Lucant A-5320" (maleic anhydride-modified ethylene-a-olefin random copolymer), and the like can be given.

[0046] The content of the (A) component in the composition layer is preferably 10% by mass or more, more preferably 12.5% by mass or more, and further preferably 15% by mass or more, relative to 100% by mass of the nonvolatile component of the composition, from the viewpoint of the bending resistance, and is preferably 75% by mass or less, more preferably 70% by mass or less, and further preferably 65% by mass or less, from the viewpoint of the water repellency. In one embodiment of the present application, the content of the (A) component is preferably 10 to 75% by mass, and more preferably 12.5 to 70% by mass, relative to 100% by mass of the nonvolatile component of the composition.

[0047] (B) component: liquid polyolefin-based resin and / or liquid rubber The composition of the present application can contain a liquid polyolefin-based resin and / or a liquid rubber. In the present application, "liquid" means a viscosity of 5,000 Pa-s or less at 25°C. In addition, in the present application, "viscosity at 25°C" means a viscosity calculated by multiplying the dynamic viscosity at 25°C measured using a dynamic viscoelasticity measuring device by the density. As the dynamic viscoelasticity measuring device, for example, a rheometer (trade name: DISCOVERY HR-2) manufactured by TA Instruments, Inc. or the like can be given.

[0048] With respect to the (B) component of the present application, "liquid polyolefin-based resin" means an olefin-based polymer having a viscosity of 5,000 Pa-s or less at 25°C and being incapable of forming a rubbery elastomer by crosslinking, and "liquid rubber" means a rubber having a viscosity of 5,000 Pa-s or less at 25°C and being capable of forming a rubbery elastomer by crosslinking. For example, liquid polyisoprene is classified as a liquid rubber because it is capable of forming a rubbery elastomer by crosslinking.

[0049] The viscosity at 40°C of the liquid polyolefin-based resin and the liquid rubber is preferably 5 to 5,000 Pa-s, more preferably 10 to 4,000 Pa-s, and further preferably 20 to 3,000 Pa-s, respectively.

[0050] The (B) component can be used alone or in combination with two or more. By using the (B) component, good adhesion (particularly adhesion at high temperatures) can be achieved, and the viscoelasticity of the composition can be controlled. In addition, the composition of the present application can contain a hygroscopic inorganic filler described below, but if a large amount of the hygroscopic inorganic filler is used, the adhesion of the protective (sealing) film decreases. In this regard, by using the (B) component, even if a large amount of the hygroscopic inorganic filler is used, good adhesion can be achieved.

[0051] The number average molecular weight of the liquid polyolefin-based resin is preferably 500 to 15,000, more preferably 750 to 12,500, and further preferably 1,000 to 10,000. In addition, the number average molecular weight of the liquid rubber is 500 to 15,000, more preferably 750 to 12,500, and further preferably 1,000 to 10,000.

[0052] The liquid polyolefin-based resin and / or the liquid rubber is preferably one or more selected from the group consisting of a liquid polybutene, a hydrogenated polybutadiene, a butadiene-based liquid rubber, and a liquid polyisoprene, more preferably one or more selected from the group consisting of a liquid polybutene and a hydrogenated polybutadiene, and further preferably a liquid polybutene. The liquid polybutene can be a homopolymer (for example, a 1-butene homopolymer or an isobutylene homopolymer) or a copolymer (for example, a copolymer of 1-butene and isobutylene).

[0053] The liquid polyolefin-based resin and / or the liquid rubber can use a commercially available product. As a commercially available product of the liquid polyolefin-based resin, for example, "HV-300" (liquid polybutene) manufactured by ENEOS Corporation, "HV-1900" (liquid polybutene) manufactured by ENEOS Corporation, "HV-50" (liquid polybutene) manufactured by ENEOS Corporation, "HV-35" (liquid polybutene) manufactured by ENEOS Corporation, "950 MW" (liquid polybutene) manufactured by Kothari Corporation, "2400 MW" manufactured by Kothari Corporation, "H-1900" (liquid polybutene) manufactured by INEOS Corporation, "H-6000" (liquid polybutene) manufactured by INEOS Corporation, "H-18000" (liquid polybutene) manufactured by INEOS Corporation, "200N" (liquid polybutene) manufactured by Nippon Oil Corporation, "BI-2000" (hydrogenated polybutadiene) manufactured by Nippon Zeon Corporation, "BI-3000" (hydrogenated polybutadiene) manufactured by Nippon Zeon Corporation, "GI-3000" (hydrogenated polybutadiene) manufactured by Nippon Zeon Corporation, "Lucant LX100" (liquid olefin-based polymer) manufactured by Mitsui Chemicals, Inc., "Lucant LX400" (liquid olefin-based polymer) manufactured by Mitsui Chemicals, Inc., and the like can be mentioned.

[0054] As a commercially available product of the liquid rubber, for example, "Poly bd R-45HT" (butadiene-based liquid rubber) manufactured by Showa Shell Sekiyu K.K., "Poly bd R-15HT" (butadiene-based liquid rubber) manufactured by Showa Shell Sekiyu K.K., "Poly ip" (liquid polyisoprene) manufactured by Showa Shell Sekiyu K.K., "B-1000" (liquid polybutadiene) manufactured by Nippon Zeon Corporation, "B-3000" (liquid polybutadiene) manufactured by Nippon Zeon Corporation, "G-3000" (liquid polybutadiene) manufactured by Nippon Zeon Corporation, "LIR-30" (liquid polyisoprene) manufactured by Zeon Corporation, "LIR-390" (liquid polyisoprene) manufactured by Zeon Corporation, "IR-290" (liquid polyisoprene) manufactured by Zeon Corporation, "LBR-302" (liquid polybutadiene) manufactured by Zeon Corporation, "LBR-305" (liquid polybutadiene) manufactured by Zeon Corporation, "LBR-361" (liquid polybutadiene) manufactured by Zeon Corporation, "L-SBR-820" (liquid styrene-butadiene random copolymer) manufactured by Zeon Corporation, "Ricon 154" (liquid butadiene) manufactured by Kravetz Corporation, "Ricon 184" (liquid styrene-butadiene random copolymer) manufactured by Kravetz Corporation, and the like can be mentioned.

[0055] Regarding the content of component (B) in the composition (in the case of using both liquid polyolefin resin and liquid rubber, the total of these contents), from the viewpoint of adhesion, it is preferably 5% by mass or more, more preferably 7.5% by mass or more, and even more preferably 10% by mass or more, relative to 100% by mass of the non-volatile components of the composition. From the viewpoint of adhesion at high temperatures, it is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less. In one embodiment of the present invention, the content of component (B) is preferably 5 to 50% by mass, more preferably 7.5 to 40% by mass, relative to 100% by mass of the non-volatile components in the composition.

[0056] <(C) Composition: Hygroscopic inorganic filler> The composition of the present invention may contain a hygroscopic inorganic filler. Component (C) may be used alone or in combination with two or more. By using component (C), good water resistance can be achieved, and by capturing ionic impurities, the increase in surface resistivity under high temperature and high humidity environments can be suppressed, while maintaining conductivity.

[0057] Examples of component (C) include: uncalcined hydrotalcite, semi-calcined hydrotalcite, calcined hydrotalcite, calcium oxide, magnesium oxide, calcined dolomite (a mixture containing calcium oxide and magnesium oxide), calcium hydride, strontium oxide, aluminum oxide, barium oxide, molecular sieves, zeolites, and silicon dioxide. Component (C) is preferably selected from one or more of uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite, and more preferably from one or more of uncalcined hydrotalcite and semi-calcined hydrotalcite.

[0058] Hydrotalcite can be classified into uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite.

[0059] Uncalcined hydrotalcite is, for example, natural hydrotalcite (Mg6Al2(OH)2). 16 Metal hydroxides with layered crystal structures, such as CO3·4H2O, are examples of those with layers [Mg] forming the basic framework. 1-x Al x (OH)2] x+ and the intermediate layer [(CO3)] x / 2 ·mH2O] x- Composition. Uncalcined hydrotalcite is a concept that includes hydrotalcite-like compounds such as synthetic hydrotalcite. Examples of hydrotalcite-like compounds include compounds represented by formulas (I) and (II) below.

[0060] [M 2+ 1-x M 3+ x (OH)2] x+ ·[(A n- )x / n • mH2O x- (I) (In the formula, M 2+ represents Mg 2+ , Zn 2+ , etc., 2-valent metal ions, M 3+ represents Al 3+ , Fe 3+ , etc., 3-valent metal ions, A n- represents CO3 2- , Cl - , NO3 - , etc., n-valent anions, 0 < x < 1, 0 ≤ m < 1, and n is a positive number.) In formula (I), M 2+ is preferably Mg 2+ , and M 3+ is preferably Al 3+ . A n- is preferably CO3 2- .

[0061] M 2+ x Al2(OH) 2x+6-nz (A n- ) z • mH2O (II) (In formula (II), M 2+ represents Mg 2+ , Zn 2+ , etc., 2-valent metal ions, A n- represents CO3 2- , Cl - , NO3 - , etc., n-valent anions, x is a positive number of 2 or more, z is a positive number of 2 or less, m is a positive number, and n is a positive number.) In formula (II), M 2+ is preferably Mg 2+ , and A n- is preferably CO3 2- .

[0062] The semi-calcined hydrotalcite refers to a metal hydroxide having a layered crystal structure in which the amount of interlayer water is reduced or lost, obtained by calcining the uncalcined hydrotalcite. If the composition formula is used for the explanation, the "interlayer water" refers to "H2O" described in the composition formula of the uncalcined natural hydrotalcite and the hydrotalcite-like compound described above.

[0063] On the other hand, the calcined hydrotalcite refers to a metal oxide having an amorphous structure in which not only the interlayer water is lost but also the hydroxyl groups are lost due to condensation dehydration, obtained by calcining the uncalcined hydrotalcite or the semi-calcined hydrotalcite.

[0064] The uncalcined hydrotalcite, the semi-calcined hydrotalcite and the calcined hydrotalcite can be distinguished by the saturated water absorption. The saturated water absorption of the semi-calcined hydrotalcite is 1 mass% or more and less than 20 mass%. On the other hand, the saturated water absorption of the uncalcined hydrotalcite is less than 1 mass%, and the saturated water absorption of the calcined hydrotalcite is 20 mass% or more.

[0065] The "saturated water absorption" means the rate of increase in mass with respect to the initial mass, which is calculated by the following equation (i) after the initial mass of a sample (e.g., semi-calcined hydrotalcite) of 1.5 g is measured with a balance, and the sample is left in a small environmental test chamber (SH-222 manufactured by ESPEKE Corporation) set at 60°C and 90% RH (relative humidity) under atmospheric pressure for 200 hours: Saturated water absorption (mass%) = 100 x (mass after moisture absorption - initial mass) / initial mass (i) The saturated water absorption of the semi-calcined hydrotalcite is preferably 3 mass% or more and less than 20 mass%, and more preferably 5 mass% or more and less than 20 mass%.

[0066] In addition, the uncalcined hydrotalcite, the semi-calcined hydrotalcite and the calcined hydrotalcite can be distinguished by the thermal weight loss rate measured by thermal gravimetric analysis. The thermal weight loss rate of the semi-calcined hydrotalcite at 280°C is less than 15 mass%, and the thermal weight loss rate thereof at 380°C is 12 mass% or more. On the other hand, the thermal weight loss rate of the uncalcined hydrotalcite at 280°C is 15 mass% or more, and the thermal weight loss rate of the calcined hydrotalcite at 380°C is less than 12 mass%.

[0067] The thermal gravimetric analysis can be performed using TG / DTA EXSTAR 6300 manufactured by Hitachi High-Tech Science Corporation, weighing 5 mg of hydrotalcite on an aluminum sample pan, and heating from 30°C to 550°C at a temperature increasing rate of 10°C / minute in an atmosphere of nitrogen gas flow of 200 mL / minute in an open state without covering the lid. The thermal weight loss rate can be calculated by the following equation (ii): Thermal weight loss rate (mass%) = 100 x (mass before heating - mass at a prescribed temperature) / mass before heating (ii) Further, the uncalcined hydrotalcite, the semi-calcined hydrotalcite and the calcined hydrotalcite can be distinguished by the peak and the relative intensity ratio determined by powder X-ray diffraction. The semi-calcined hydrotalcite shows a peak split into two or a peak having a shoulder synthesized from two peaks in the vicinity of 8 to 18° by powder X-ray diffraction, and the relative intensity ratio of the diffraction intensity of the peak or shoulder appearing on the low angle side (=diffraction intensity on the low angle side) to the diffraction intensity of the peak or shoulder appearing on the high angle side (=diffraction intensity on the high angle side) is 0.001 to 1,000. On the other hand, the uncalcined hydrotalcite has only one peak in the vicinity of 8 to 18° or the relative intensity ratio of the diffraction intensity of the peak or shoulder appearing on the low angle side to the diffraction intensity of the peak or shoulder appearing on the high angle side is outside the range. The calcined hydrotalcite has no characteristic peak in the region of 8 to 18° and has a characteristic peak at 43°. The powder X-ray diffraction measurement is performed by a powder X-ray diffractometer (manufactured by PANalytical, Empyrean) under the conditions of cathode CuKα (1.5405 A), voltage: 45 V, current: 40 mA, sampling width: 0.0260°, scanning speed: 0.0657° / s, measurement range of diffraction angle (2θ): 5.0131 to 79.9711°. The peak search is performed using the peak search function of the software attached to the diffraction device under the conditions of "minimum significance: 0.50, minimum peak tip: 0.01°, maximum peak tip: 1.00°, peak bottom width: 2.00°, method: 2 times differential minimum value".

[0068] The BET specific surface area of the semi-calcined hydrotalcite is preferably 1 to 250 m 2 / g, more preferably 5 to 200 m 2 / g. These BET specific surface areas are calculated using the BET multipoint method using a specific surface area measuring device (Macsorb HM Model 1210, manufactured by Mountech) by adsorbing nitrogen gas to the surface of the sample.

[0069] The particle diameter of the uncalcined hydrotalcite, the semi-calcined hydrotalcite and the calcined hydrotalcite is preferably 1 to 1,000 nm, more preferably 10 to 800 nm from the viewpoint of transparency. These particle diameters are the median particle diameters of the particle size distribution when the particle size distribution is produced on a volume basis by laser diffraction scattering particle size distribution measurement (JIS Z8825).

[0070] The uncalcined hydrotalcite, the semi-calcined hydrotalcite and the calcined hydrotalcite can use a hydrotalcite subjected to surface treatment using a surface treatment agent. As the surface treatment agent for surface treatment, for example, a higher fatty acid, an alkylsilane, a silane coupling agent or the like can be used, of which a higher fatty acid and an alkylsilane are preferred. One or two or more kinds of surface treatment agents can be used.

[0071] The uncalcined hydrotalcite can be used as a commercially available product. As the commercially available product thereof, for example, "DHT-4A" (particle diameter (median particle diameter): 370 nm), "ALCAMIZER" (particle diameter (median particle diameter): 620 nm), "MAGCELER 1" (particle diameter (median particle diameter): 470 nm) manufactured by Kyowa Chemical Industry Co., Ltd.; "STABIACE HT-1", "STABIACE HT-7", "STABIACE HT-P" manufactured by Sakai Chemical Industry Co., Ltd., and the like can be given.

[0072] The semi-calcined hydrotalcite can be used as a commercially available product. As the commercially available product thereof, for example, "DHT-4C" (particle diameter (median particle diameter): 400 nm), "DHT-4A-2" (particle diameter (median particle diameter): 400 nm) manufactured by Kyowa Chemical Industry Co., Ltd., and the like can be given.

[0073] The calcined hydrotalcite can be used as a commercially available product. As the commercially available product thereof, for example, "KW-2200" (particle diameter (median particle diameter): 400 nm), "KW-2200" (particle diameter (median particle diameter): 400 nm) manufactured by Kyowa Chemical Industry Co., Ltd., and the like can be given.

[0074] The calcium oxide can be used as a commercially available product. As the commercially available product thereof, for example, "QC-X" manufactured by Inoue Lime Industry Co., Ltd.; "MOIS TOP #10" manufactured by Sanryo Powder Co., Ltd.; "HAL-G", "HAL-J", "HAL-F" manufactured by Gijyze Lime Industry Co., Ltd.; "CaO Nano Powder" manufactured by Filgen, and the like can be given.

[0075] The particle diameter of the calcium oxide and the particle diameter of the mixture containing the calcium oxide are each preferably 0.03 to 10 μm, more preferably 0.05 to 5 μm, and further preferably 0.1 to 3 μm. These particle diameters are the median particle diameters when the particle size distribution is made on a volume basis by laser diffraction scattering particle size distribution measurement (JIS Z8825).

[0076] Regarding the content of the (C) component in the composition, relative to 100 mass% of the non-volatile component of the composition, it is preferably 1 mass% or more from the viewpoint of waterproofness, more preferably 2.5 mass% or more, and further preferably 5.0 mass% or more, and it is preferably 60 mass% or less from the viewpoint of adhesiveness and flexibility, more preferably 55 mass% or less, and further preferably 50 mass% or less.

[0077] The composition can also contain an ingredient other than the (A) component and the (C) component (hereinafter sometimes referred to as "other ingredient") within a range that does not hinder the effects of the present application. As the other ingredient, for example, a tackifier, a curing accelerator, an antioxidant, a plasticizer, a metal complex in which a bidentate ligand having both of the coordination atoms as oxygen atoms and a monodentate ligand having a coordination atom as an oxygen atom are bonded to a central metal, and the like can be given. Each of these can be used alone or two or more of them can be used in combination.

[0078] The tackifier is an ingredient that imparts adhesiveness to the protective (sealing) film and improves the sealing property. In the present application, the tackifier is not particularly limited, and a known tackifier can be used.

[0079] From the viewpoint of the heat resistance and the like of the protective (sealing) film, the softening point of the tackifier is preferably from 50 to 200°C, more preferably from 90 to 180°C, and further preferably from 100 to 150°C. Note that the softening point is measured by the ball method according to JIS K2207.

[0080] The tackifier can be used as a commercially available product. As the commercially available product, for example, "ARKON P-90", "ARKON P-100", "ARKON P-115", "ARKON P-125", "ARKON P-140", "ARKON M-90", "ARKON M-100", "ARKON M-115", and "ARKON M-135" (all of which are hydrogenated petroleum resins containing a cyclohexane ring) manufactured by Arakawa Chemical Industries, Ltd. can be given.

[0081] From the viewpoint of the adhesiveness and the sealing property of the protective (sealing) film, the content of the tackifier is preferably from 0 to 30% by mass, more preferably from 0 to 25% by mass, and further preferably from 0 to 22.5% by mass, relative to 100% by mass of the non-volatile component of the composition.

[0082] As the curing accelerator, for example, an imidazole compound, a tertiary / quaternary amine-based compound, a dimethyl urea compound, an organic phosphine compound, and the like can be given.

[0083] As the imidazole compound, for example, 1H-imidazole, 2-methylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-undecylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 2-phenyl-4,5-bis(hydroxymethyl)imidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-phenylimidazole, 2-dodecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and the like can be given. As specific examples of the imidazole compound, CUREZOL 2MZ, 2P4MZ, 2E4MZ, 2E4MZ-CN, C11Z, C11Z-CN, C11Z-CNS, C11Z-A, 2PHZ, 1B2MZ, 1B2PZ, 2PZ, C17Z, 1.2DMZ, 2P4MHZ-PW, 2MZ-A, 2MA-OK (all manufactured by Shikoku Chemicals Corporation), and the like can be given.

[0084] As the tertiary / quaternary amine-based compound, there is no particular limitation, and for example, quaternary ammonium salts such as tetramethylammonium bromide, tetrabutylammonium bromide, and the like; diazabicyclo compounds such as DBU (1,8-diazabicyclo[5.4.0]undec-7-ene), DBN (1,5-diazabicyclo[4.3.0]non-5-ene), DBU-phenol salt, DBU-octanoate, DBU-p-toluenesulfonate, DBU-formate, DBU-phenol novolak resin salt, and the like; tertiary amines or salts thereof such as benzyldimethylamine, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol (TAP), and the like, aromatic dimethylurea, aliphatic dimethylurea, and the like; and the like can be given.

[0085] As the dimethylurea compound, for example, aromatic dimethylureas such as DCMU (3-(3,4-dichlorophenyl)-1,1-dimethylurea), U-CAT3512T (manufactured by SAN APRO Co., Ltd.), and the like; aliphatic dimethylureas such as U-CAT3503N (manufactured by SAN APRO Co., Ltd.), and the like can be given. Among them, from the viewpoint of curability, it is preferable to use an aromatic dimethylurea.

[0086] As the organic phosphine compound, for example, triphenylphosphine, tetraphenylphosphonium tetra-p-tolylborate, tetraphenylphosphonium tetraphenylborate, tri-tert-butylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, triphenylphosphine triphenylborane, and the like can be given. As specific examples of the organic phosphine compound, TPP, TPP-MK, TPP-K, TTBuP-K, TPP-SCN, TPP-S (all manufactured by Hokuhou Chemical Industry Co., Ltd.), and the like can be given.

[0087] In the case of using a curing accelerator, as to the content thereof, it is preferably 0.0001 to 0.1% by mass, more preferably 0.0002 to 0.075% by mass, further preferably 0.0002 to 0.05% by mass, with respect to 100% by mass of the nonvolatile component of the composition, in order to promote the formation of the (A) component (i.e., the crosslinked polymer having isobutylene-isoprene copolymer chains) and the like.

[0088] In the present application, the antioxidant is not particularly limited, and a known antioxidant can be used. In the case of using an antioxidant, as to the content thereof, it is preferably 0.01 to 0.5% by mass, more preferably 0.05 to 0.4% by mass, further preferably 0.1 to 0.3% by mass, with respect to 100% by mass of the nonvolatile component of the composition.

[0089] As the plasticizer, for example, mineral oils such as paraffin-based process oil, naphthenic-based process oil, liquid paraffin, and vaseline, and vegetable oils such as castor oil, cottonseed oil, rapeseed oil, soybean oil, palm oil, coconut oil, and olive oil can be mentioned.

[0090] In order to improve the adhesion and the bending resistance of the protective (sealing) film, a metal complex in which a bidentate ligand having both of the coordination atoms as oxygen atoms (hereinafter sometimes referred to as "oxygen-bidentate ligand") and a monodentate ligand having the coordination atom as an oxygen atom (hereinafter sometimes referred to as "oxygen-monodentate ligand") are bonded to a central metal can also be used.

[0091] The metal complex is preferably a metal complex represented by the following formula (1) (hereinafter referred to as "metal complex (1)").

[0092] In formula (1), M is a central metal of the metal complex, and represents a metal of the 2nd to 6th period of the periodic table, R1and R3independently represent a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, an alkoxy group, an alkenyloxy group, an aryloxy group, or an aralkyloxy group, R2represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, an alkoxy group, an alkenyloxy group, an aryloxy group, an aralkyloxy group, an alkoxycarbonyl group, or an alkenyloxycarbonyl group, X represents an oxygen-monodentate ligand, the solid line between the oxygen atom (O) within the [ ] and M represents a covalent bond, the dotted line between the oxygen atom (O) within the [ ] and M represents a coordination bond, and m represents an integer of 3 or 4, n represents an integer of 1 to 3, and m > n.

[0093] M in formula (1) is preferably a metal of Group 3 to Group 5, more preferably Al, Ti, Mn, Fe, Co, Ni, Cu, Zn, Ge, Zr, In or Sn, further preferably Al, Ti or Zr.

[0094] In the present specification, as the halogen atom, for example, a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom can be given.

[0095] In the present specification, the alkyl group can be either linear or branched. The number of carbons of the alkyl group is preferably from 1 to 20, further preferably from 1 to 10, particularly preferably from 1 to 6. As the alkyl group, for example, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec-butyl group, a t-butyl group, a pentyl group, an isopentyl group, a neopentyl group, a 1-ethylpropyl group, a hexyl group, an isohexyl group, a 1,1-dimethylbutyl group, a 2,2-dimethylbutyl group, a 3,3-dimethylbutyl group, a 2-ethylbutyl group, or the like can be given. The alkyl group can have a substituent. As the substituent thereof, for example, a halogen atom, a hydroxyl group, an amino group which can have a substituent, or the like can be given.

[0096] In the present specification, the alkenyl group can be either linear or branched. The number of carbons of the alkenyl group is preferably from 2 to 20. As the alkenyl group, for example, an ethenyl group (i.e., a vinyl group), a 1-propenyl group, a 2-propenyl group, a 2-methyl-1-propenyl group, a 1-butenyl group, a 2-butenyl group, a 3-butenyl group, a 3-methyl-2-butenyl group, a 1-pentenyl group, a 2-pentenyl group, a 3-pentenyl group, a 4-pentenyl group, a 4-methyl-3-pentenyl group, a 1-hexenyl group, a 3-hexenyl group, a 5-hexenyl group, an octadecenyl group (e.g., a 9-octadecenyl group), or the like can be given. As the substituent which the alkenyl group can have, for example, a halogen atom, a hydroxyl group, an amino group which can have a substituent, or the like can be given.

[0097] In the present specification, the alkynyl group can be either linear or branched. The number of carbons of the alkynyl group is preferably from 2 to 10, more preferably from 2 to 6. For example, an ethynyl group, a 1-propynyl group, a 2-propynyl group, a 1-butynyl group, a 2-butynyl group, a 3-butynyl group, a 1-pentynyl group, a 2-pentynyl group, a 3-pentynyl group, a 4-pentynyl group, a 1-hexynyl group, a 2-hexynyl group, a 3-hexynyl group, a 4-hexynyl group, a 5-hexynyl group, a 4-methyl-2-pentynyl group, or the like can be given. As the substituent which the alkynyl group can have, for example, a halogen atom, a hydroxyl group, an amino group which can have a substituent, or the like can be given.

[0098] In the present specification, the number of carbon atoms of an aryl group is preferably from 6 to 18, more preferably from 6 to 14. As the aryl group, for example, a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a 1-anthryl group, a 2-anthryl group, a 9-anthryl group, and the like can be given. The aryl group can have a substituent. As the substituent thereof, for example, a halogen atom, a hydroxyl group, an alkyl group which can have a substituent, an alkenyl group which can have a substituent, an alkynyl group which can have a substituent, an amino group which can have a substituent, and the like can be given.

[0099] In the present specification, the number of carbon atoms of an aralkyl group is preferably from 7 to 16. As the aralkyl group, for example, a benzyl group, a phenylethyl group, a naphthylmethyl group, a phenylpropyl group, and the like can be given. The aralkyl group can have a substituent. As the substituent thereof, for example, a halogen atom, a hydroxyl group, an amino group which can have a substituent, and the like can be given.

[0100] In the present specification, as the amino group which can have a substituent, for example, an amino group, a mono- or di-alkylamino group (for example, a methylamino group, a dimethylamino group, an ethylamino group, a diethylamino group, a propylamino group, a dibutylamino group), a mono- or di-cycloalkylamino group (for example, a cyclopropylamino group, a cyclohexylamino group), a mono- or di-arylaminogroup (for example, a phenylamino group), a mono- or di-aralkylamino group (for example, a benzylamino group, a dibenzylamino group), a heterocyclic amino group (for example, a pyridylamino group), and the like can be given.

[0101] In the present specification, the description of an alkyl group in an alkoxy group (that is, an alkyl-oxy group) is the same as the description of the above-mentioned alkyl group. The alkoxy group can have a substituent. As the substituent thereof, for example, a halogen atom, a hydroxyl group, an amino group which can have a substituent, and the like can be given.

[0102] In the present specification, the description of an alkenyl group in an alkenyloxy group is the same as the description of the above-mentioned alkenyl group. The alkenyloxy group can have a substituent. As the substituent thereof, for example, a halogen atom, a hydroxyl group, an amino group which can have a substituent, and the like can be given.

[0103] In the present specification, the description of an aryl group in an aryloxy group is the same as the description of the above-mentioned aryl group. The aryloxy group can have a substituent. As the substituent thereof, for example, a halogen atom, a hydroxyl group, an alkyl group which can have a substituent, an alkenyl group which can have a substituent, an alkynyl group which can have a substituent, an amino group which can have a substituent, and the like can be given.

[0104] In the present specification, the description of an aralkyl group in an aralkyloxy group is the same as the description of the above-mentioned aralkyl group. The aralkyloxy group can have a substituent. As the substituent thereof, for example, a halogen atom, a hydroxyl group, an amino group which can have a substituent, and the like can be given.

[0105] In the present specification, the description of an alkyl group in an alkoxycarbonyl group (that is, an alkyl-oxy-carbonyl group) is the same as the description of the above-mentioned alkyl group. The alkoxycarbonyl group can have a substituent. As the substituent thereof, for example, a halogen atom, a hydroxyl group, an amino group which can have a substituent, and the like can be given.

[0106] In the present specification, the description of the alkenyl group in the alkynyloxy group is the same as the above description of the alkenyl group. The alkynyloxy group can have a substituent. As the substituent thereof, for example, a halogen atom, a hydroxyl group, an amino group which can have a substituent, and the like can be given.

[0107] The oxygen-monodentate ligand represented by X in formula (1) is usually a conjugate base of a Bronsted acid, and for example, RO - (R: organic group), RCOO - (R: organic group), and the like.

[0108] RO - The organic group R can be any one of an aliphatic group or an aromatic group. In addition, the aliphatic group can be any one of a saturated aliphatic group or an unsaturated aliphatic group. The carbon number of the organic group R is preferably from 1 to 20, further preferably from 1 to 10, and particularly preferably from 1 to 6. As RO

[0109] RCOO - The organic group R can be any one of an aliphatic group or an aromatic group. In addition, the aliphatic group can be any one of a saturated aliphatic group or an unsaturated aliphatic group. The carbon number of the organic group R is preferably from 1 to 20, further preferably from 1 to 10, and particularly preferably from 1 to 6. As RCOO - , for example, anions corresponding to carboxylic acids such as acetic acid, propionic acid, and benzoic acid, and the like can be given.

[0110] The oxygen-bidentate ligand in [ ] in formula (1) is represented by the following formula (2). As the oxygen-bidentate ligand, for example, acetylacetone, 3-methyl-2,4-pentanedione, acetylacetaldehyde, 2,4-hexanedione, 2,4-heptanedione, 5-methyl-2,4-hexanedione, 5,5-dimethyl-2,4-hexanedione, benzoylacetone, benzoylphenylethanone, salicylaldehyde, 1,1,1-trifluoroacetylacetone, 1,1,1,5,5,5-hexafluoroacetylacetone, 3-methoxy-2,4-pentanedione, 3-cyano-2,4-pentanedione, 3-nitro-2,4-pentanedione, 3-chloro-2,4-pentanedione, acetoacetic acid, methyl acetoacetate, ethyl acetoacetate, propyl acetoacetate, salicylic acid, methyl salicylate, malonic acid, dimethyl malonate, diethyl malonate, and the like can be given. In the state of being coordinated to the central metal, the oxygen-bidentate ligand becomes a structure from which one or more protons are removed.

[0111] As the metal complex (1) in which the central metal M is Al, for example, acetylacetonate diisopropoxyaluminum, acetylacetonate di-n-butoxyaluminum, acetylacetonate di-n-butoxyaluminum, acetylacetonate di-n-butoxyaluminum, acetylacetonate di-n-butoxyaluminum, and the like can be given.

[0112] As the metal complex (1) in which the central metal M is Ti, for example, acetylacetonate titanium triisopropoxide, titanium di-n-butoxide (bis-2,4-pentanedionate), titanium diisopropoxide bis(tetramethylheptanedionate), titanium diisopropoxide bis(acetylacetonate), titanium methaphenoxide, titanium oxide bis(pentanedionate), and the like can be given.

[0113] As the metal complex (1) in which the central metal M is Zr, for example, acetylacetonate zirconium triisopropoxide, zirconium di-n-butoxide (bis-2,4-pentanedionate), zirconium diisopropoxide (bis-2,4-pentanedionate), zirconium diisopropoxide bis(tetramethylheptanedionate), zirconium diisopropoxide bis(acetylacetonate), zirconium butoxide (acetylacetonate) (bis-acetylacetonate), zirconium tributoxy monoacetylacetone, and the like can be given.

[0114] In the case of using the metal complex (1) in which the oxygen-bidentate ligand and the oxygen-monodentate ligand are bonded to the central metal, the content thereof is preferably 0.05 to 5.0 mass%, more preferably 0.1 to 4.0 mass%, and further preferably 0.15 to 3.0 mass% with respect to 100 mass% of the nonvolatile component of the composition.

[0115] <Conductive layer of conductive substrate> The conductive layer of the conductive substrate protected (sealed) by the composition of the present application is composed of a conductive material containing one or more selected from the group consisting of metal nanowires, metal mesh, metal nanoparticles, and conductive polymers. The metal constituting the metal nanowires, the metal mesh, and / or the metal nanoparticles is not particularly limited, and is, for example, one or more selected from the group consisting of silver, copper, gold, nickel, platinum, palladium, iron, cobalt, and tin, and is preferably silver, copper, gold, and nickel. The conductive polymer is not particularly limited, and is, for example, one or more selected from the group consisting of poly(3,4-ethylenedioxythiophene) (PEDOT), polypyrrole, polythiophene, graphene, polyacetylene, poly(p-phenylene), poly(p-phenylenevinylene), and polyaniline, and is preferably PEDOT. In a preferred embodiment of the present application, the conductive layer of the conductive substrate is composed of a conductive material containing silver nanowires.

[0116] [Method for producing the composition] The method for producing the composition of the present application is not particularly limited, and methods in which, for example, a solvent or the like is added as necessary to the above-mentioned admixture components, and mixing is performed using a kneader or a rotary mixer or the like can be given.

[0117] [Method for forming protective (sealing) film] The method for forming a protective (sealing) film on the conductive layer of the conductive substrate (protecting (sealing) the conductive layer) is not particularly limited, and for example, the following methods can be mentioned: Method (1) in which a varnish of the composition is applied to the conductive layer and dried to form a protective (sealing) film; Method (2) in which a sealing sheet having a composition layer on a support is prepared, the composition layer of the sealing sheet is attached to the conductive layer, and the support is peeled off to form a protective (sealing) film.

[0118] Method (1) can be performed, for example, as follows: a composition made into a varnish by blending an organic solvent is applied to the conductive layer using a die coater or the like, and the resulting coating film is dried by heating or blowing hot air or the like to form a protective (sealing) film on the conductive layer.

[0119] As the organic solvent, for example, the following can be mentioned: ketones such as acetone, methyl ethyl ketone (hereinafter also referred to as "MEK"), and cyclohexanone; acetate esters such as ethyl acetate, butyl acetate, cellulose solvent acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitols such as cellulose solvent and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; and dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. Each of the organic solvents can be used alone as one kind, or two or more kinds can be used in combination.

[0120] The drying conditions are not particularly limited, but generally, drying is preferably performed at around 50 to 100°C for around 3 to 15 minutes.

[0121] The thickness of the protective (sealing) film after drying is generally in the range of 3 to 200 μm, preferably 5 to 100 μm, and more preferably 5 to 50 μm.

[0122] Method (2) can be performed, for example, as follows: a composition made into a varnish by blending an organic solvent is applied to the support using a die coater or the like, and the resulting coating film is dried by heating or blowing hot air or the like to prepare a sealing sheet having a composition layer formed on the support; then, the composition layer of the sealing sheet is attached to the conductive layer by batch method, continuous method using a roll laminator, vacuum laminator, or the like, and the support is peeled off to form a protective (sealing) film on the conductive layer.

[0123] As the support, for example, polyethylene, polypropylene, polyvinyl chloride, and the like polyolefins, cyclic olefin polymer, polyethylene terephthalate (hereinafter sometimes referred to as "PET"), polyethylene naphthalate, and the like polyesters, polycarbonate, polyimide, and the like plastic films can be mentioned. As the plastic film, PET is particularly preferable. In addition, the support can also be a metal foil such as an aluminum foil, a stainless steel foil, or a copper foil. The surface of the support on which the composition layer is to be formed can also be subjected to a release treatment based on a silicone resin-based release agent, an alkyd resin-based release agent, a fluorine resin-based release agent, or the like, a matting treatment, a corona treatment, and the like. In the present application, in the case where the support has a release layer, the release layer is also considered to be a part of the support. The thickness of the support is not particularly limited, and from the viewpoint of workability, a thickness of 20 to 200 μm is preferable, and a thickness of 20 to 125 μm is more preferable.

[0124] The organic solvent, the drying conditions, and the thickness of the protective (sealing) film after drying are the same as in the above-described method (1).

[0125] [Use] The composition of the present application can be used to protect (seal) a conductive layer of a conductive substrate using metal nanowires, a metal mesh, metal nanoparticles, a conductive polymer, and particularly a conductive substrate using metal nanowires and metal nanoparticles as a conductive body. Examples

[0126] Hereinafter, the present application will be described more specifically by citing examples, but the present application is not limited by the following examples, and can be appropriately changed within a range capable of conforming to the gist of the above and below, and these are included in the technical scope of the present application. Note that, unless otherwise specified, "parts" and "%" in the amount of components mean "mass parts" and "mass%", respectively.

[0127] <Components> The components used in the production examples are shown below.

[0128] (A) Ingredient: "ER866" (manufactured by Star Polymers Co., Ltd., glycidyl methacrylate-modified butyl rubber (glycidyl methacrylate-modified isobutylene-isoprene copolymer), epoxy group concentration: 1.63 mmol / g, number average molecular weight: 113,000, isobutylene unit / isoprene unit: 98.9% / 1.1%) "ER661" (manufactured by Star Polymers Co., Ltd., maleic anhydride-modified butyl rubber (maleic anhydride-modified isobutylene-isoprene copolymer), anhydride group concentration: 0.77 mmol / g, number average molecular weight: 40,000, isobutylene unit / isoprene unit: 98.9% / 1.1%) (B) Ingredient: "HV-300M" (manufactured by TOHB CHEMICAL INDUSTRY CO., LTD., maleic anhydride-modified liquid polybutene, anhydride group concentration: 0.77 mmol / g, number average molecular weight: 2,100) "HV-1900" (manufactured by ENEOS Corporation, liquid polybutene, number average molecular weight: 2,900, viscosity at 25°C: 460 Pa-s) (C) Ingredient: semi-calcined hydrotalcite (manufactured by KOHYO CHEMICAL INDUSTRY CO., LTD., "DHT-4C", particle diameter (median particle diameter): 400 nm, BET specific surface area: 15 m 2 / g) un-calcined hydrotalcite (manufactured by KOHYO CHEMICAL INDUSTRY CO., LTD., "DHT-4A", particle diameter (median particle diameter): 370 nm, BET specific surface area: 11 m 2 / g) Other ingredients: "ARKON P-125" (tackifier: manufactured by ARAKAWA CHEMICAL INDUSTRIES, LTD., hydrogenated petroleum resin containing a cyclohexane ring, softening point: 125°C) "PLENACT Al-M" (metal complex: manufactured by Ajinomoto Fine Techno Co., Inc., (octadecenyl acetoacetate)diisopropoxyaluminum) 2,4,6-tris(dimethylaminomethyl)phenol (curing accelerator: hereinafter referred to as "TAP") (manufactured by AKZO Chemicals) Comparative ingredient: "KR-3700" (manufactured by SHIN-ETUCHI CHEMICAL CO., LTD., solvent addition type silicone adhesive) "CAT-PL-50T" (manufactured by SHIN-ETUCHI CHEMICAL CO., LTD., toluene solution of divinyltetramethyldisiloxane complex of chloroplatinic acid) "PARACRON S-2012" (manufactured by KUNSHO INDUSTRIES CO., LTD., thermoplastic acrylic resin, weight average molecular weight: 0.9 million, hydroxyl value: 6.5 KOH mg / g, toluene solvent, solid content: 34.5% by weight) "STABio D-376" (manufactured by MITSUI CHEMICALS, INC., isocyanate curing agent, NCO%: 24%) "ZX-1059" (manufactured by NIPPON STEEL CHEMICAL CO., LTD., liquid hydrogenated bisphenol A and F type epoxy resin, epoxy equivalent: 165 g / eq) "TOPR-300" (manufactured by NIPPON STEEL CHEMICAL CO., LTD., solid epoxy resin) "YX7200B35" (manufactured by MITSUBISHI CHEMICAL, phenoxy resin solution, solvent: MEK, non-volatile content: 35%) "TBPDA" (manufactured by Hokuetsu-chemical Industry Co., Ltd., ion liquid curing agent) <Substrate> Polyethylene terephthalate (PET) film: manufactured by TOYOBO CO., LTD., Lumirror R80, 38 μm, water vapor permeability 20 g / m 2 / day (40°C - 90% RH, MOCON method) Waterproof film: manufactured by LUMIRROR CO., LTD., Verreal 38UD001, 38 μm, water vapor permeability 5 x 10 -4 g / m 2 / day (40°C - 90% RH, MOCON method) <Manufacturing method of sealing sheet> <Manufacturing Example 1> A varnish of the blending ratio shown in Table 1 was prepared by the following steps, and a sealing sheet was prepared using the obtained varnish. Note that the use amount (parts) of each component described in the following table indicates the amount of non-volatile components of each component in the varnish.

[0129] Specifically, in a Swasol solution (non-volatile components: 60%) of a hydrogenated petroleum resin containing a cyclohexane ring (adhesion promoter, "ARKON P-125" manufactured by ARKRAY CHEMICAL INDUSTRIES CO., LTD.), a toluene solution (non-volatile components: 25%) of maleic anhydride-modified liquid polybutene ("HV-300M" manufactured by TOBATA CHEMICAL CO., LTD.), polybutene ("HV-1900" manufactured by ENEOS CORPORATION), and glycidyl methacrylate-modified butyl rubber ("ER866" manufactured by SEIKO PMC CO., LTD.), a toluene solution (non-volatile components: 35%) of maleic acid-modified butyl rubber ("ER661" manufactured by SEIKO PMC CO., LTD.), a curing accelerator (TAP, manufactured by KAYAKU NOURYON CORPORATION), and toluene were blended, and the obtained mixture was uniformly dispersed with a high-speed rotation mixer, to obtain a varnish of the composition. The obtained varnish was uniformly applied to the release-treated surface of a polyethylene terephthalate (PET) film ("SP4020" manufactured by TOYO CLOTH CO., LTD., thickness of the PET film: 50 μm) treated with a silicone-based release agent using a slit coater, and heated at 130°C for 30 minutes, to obtain a sealing sheet having a composition layer with a thickness of 20 μm.

[0130] <Manufacturing Example 2> To a Swasol solution (non-volatile component: 60%) of a hydrogenated petroleum resin (tackifier, "ARKON P-125" manufactured by Arakawa Chemical Industries, Ltd.) containing a cyclohexane ring, maleic anhydride-modified liquid polybutene ("HV-300M" manufactured by Toho Chemical Industry Co., Ltd.), polybutene ("HV-1900" manufactured by ENEOS Corporation), uncalcined hydrotalcite ("DHT-4A" manufactured by Kyowa Chemical Industry Co., Ltd.), and a metal complex ("PLENACT Al-M" manufactured by Ajinomoto Fine Techno Co., Inc.) were dispersed with 3 rolls to obtain a mixture. To the obtained mixture, glycidyl methacrylate-modified butyl rubber ("ER866" manufactured by Stella PMC Co., Ltd.), maleic acid-modified butyl rubber ("ER661" manufactured by Stella PMC Co., Ltd.), a curing accelerator (TAP, manufactured by KAYAKU NOURYON CORPORATION), and toluene were mixed, and the obtained mixture was uniformly dispersed with a high-speed rotary mixer to obtain a varnish of the composition. The obtained varnish was uniformly applied to a release-treated surface of a polyethylene terephthalate (PET) film ("SP4020" manufactured by TOYO CLOTH CO., LTD., thickness of the PET film: 50 μm) treated with a silicone-based release agent, and heated at 130°C for 30 minutes to obtain a sealing sheet having a composition layer with a thickness of 20 μm.

[0131] <Manufacturing Example 3> A varnish of the composition and a sealing sheet having a composition layer with a thickness of 20 μm were obtained by the same method as in Manufacturing Example 2, except that the uncalcined hydrotalcite was changed to a semi-calcined hydrotalcite ("DHT-4C" manufactured by Kyowa Chemical Industry Co., Ltd.).

[0132] <Manufacturing Example 4> To a solvent addition type silicone adhesive ("KR-3700" manufactured by Shin-Etsu Chemical Co., Ltd., 60% by weight of solid component in toluene) was added a divinyltetramethyldisiloxane complex of chloroplatinic acid ("CAT-PL-50T" manufactured by Shin-Etsu Chemical Co., Ltd.), and the obtained mixture was stirred with a high-speed rotary mixer to obtain a varnish of the composition. The obtained varnish was uniformly applied to a release-treated surface of a PET film ("SS1A" manufactured by NIPPA Co., Ltd.) treated with a fluorine-based release agent, and heated at 150°C for 1 minute to obtain a sealing sheet having a composition layer with a thickness of 20 μm.

[0133] <Manufacturing Example 5> To a thermoplastic acrylic resin ("PARACRON S-2012" manufactured by Shin-Etsu Chemical Co., Ltd., solid content: 34.5 mass%, toluene solvent) was added an isocyanate curing agent ("STABio D-376" manufactured by Mitsui Chemicals, Inc.), and the resulting mixture was stirred with a high-speed rotary mixer to obtain a varnish of the composition. The resulting varnish was uniformly applied to a release-treated surface of a PET film ("SP4020" manufactured by TOYO CLOTH CO., LTD., thickness of the PET film: 50 μm) treated with a silicone-based release agent, and heated at 130°C for 30 minutes to obtain a sealing sheet having a composition layer with a thickness of 20 μm.

[0134] <Manufacturing Example 6> After a mixture of a liquid hydrogenated bisphenol A-type and F-type epoxy resin ("ZX-1059" manufactured by Mitsubishi Chemical Corporation) and a solid epoxy resin ("TOPR-300" manufactured by Nippon Steel Chemical Co., Ltd.) was prepared, a phenoxy resin solution ("YX7200B35" manufactured by Mitsubishi Chemical Corporation, solvent: MEK, non-volatile content: 35%) and an ionic liquid curing agent ("TBPDA" manufactured by Hokuhou Chemical Industry Co., Ltd.) were mixed and uniformly dispersed with a high-speed rotary mixer to obtain a varnish of the composition. The resulting varnish was uniformly applied to a release-treated surface of a PET film ("NS80A" manufactured by Fujimori Kogyo Co., Ltd., thickness of the PET film: 38 μm) treated with an alkyd-based release agent, and heated at 130°C for 30 minutes to obtain a sealing sheet having a composition layer with a thickness of 20 μm.

[0135] <Method for Measuring Haze and Total Light Transmittance of Composition Layer> The haze (%) and total light transmittance (%) were measured in accordance with JIS 7136. Specifically, the sealing sheet of Manufacturing Examples 1 to 6 prepared in the above-described method was cut into a square of 40 mm x 40 mm, and the composition layer was attached to an alkali-free glass ("OA-10G" manufactured by Nippon Electric Glass Co., Ltd., thickness: 700 μm) of 50 mm x 50 mm square using a vacuum laminator ("V-160" manufactured by Nikko-Materials Co., Ltd., temperature: 80°C, 0.3 MPa, 30 seconds) to prepare a measurement sample. Note that the sealing sheet of Manufacturing Example 6 was cured by peeling off the PET film and heating at 100°C for 60 minutes after attachment. Next, the haze (%) and total light transmittance (%) of the prepared measurement sample were measured using a haze meter HZ-V3 (halogen lamp) manufactured by SUGA Tester Co., Ltd., with air as a reference, using D65 light. The results are shown in Table 1.

[0136] <Method for Measuring Adhesion Strength of Composition Layer> The sealing sheet produced in Production Examples 1 to 6 was cut into a length of 50 mm and a width of 20 mm. Next, using a batch-type vacuum laminator ("Morton-724" manufactured by Nichigo-Morton Co., Ltd.), an aluminum foil layer of a composite film (manufactured by Toho Aluminum Sales Co., Ltd., "AL30 with PET", thickness of aluminum foil: 30 μm, thickness of PET film: 25 μm) having an aluminum foil and a polyethylene terephthalate (PET) film was laminated on the composition layer of the sealing sheet. The lamination was performed under conditions of a temperature of 80°C, a time of 30 seconds, and a pressure of 0.3 MPa. Next, the PET film was peeled from the sealing sheet, and a polyimide film ("UPILEX-S" manufactured by Ube Industries, Ltd., thickness: 50 μm) was laminated on the exposed composition layer under the same conditions as described above, to obtain a laminate having a "composite film / composition layer / polyimide film" stacked structure. Note that the sealing sheet of Production Example 6 was subjected to a curing treatment by peeling the PET film after being attached, and laminating the polyimide film under the same conditions as described above, and then heating at 100°C for 60 minutes. The adhesion strength when the "composite film / composition layer" was peeled from the polyimide film at room temperature (room temperature adhesion strength) was measured for the obtained laminate at a direction of 180 degrees with respect to the length direction of the aluminum foil, with a tensile speed of 300 mm / minute. In addition, the adhesion strength when the laminate produced by the same operation as described above was similarly peeled at 60°C (high temperature adhesion strength) was measured. The results are shown in Table 1.

[0137] Evaluation of Surface Resistivity of Sealed Silver Nanowire Laminated Conductive Film An A5-sized silver nanowire laminated conductive film (NovaFilm-AgNW; silver nanowire coated transparent conductive film (PET substrate)) manufactured by Novarials Co., Ltd. was prepared. The sealing sheet produced in Production Examples 1 to 6 was processed into an A5 size, and the composition layer was attached to the substrate described in Table 2 using a vacuum laminator ("V-160" manufactured by Nikko-Materials Co., Ltd., 80°C, 0.3 MPa, 30 seconds). Thereafter, the PET film was peeled from the sealing sheet, and the exposed composition layer was attached to the silver nanowire layer of the silver nanowire laminated conductive film under the same conditions as described above, to prepare an evaluation sample. Note that, in Comparative Example 3 of Production Example 6, the composition layer was attached to the silver nanowire layer, and a curing treatment was performed by heating at 100°C for 60 minutes after the attachment.

[0138] The initial surface resistivity (Ω / Sq.) of the sealed silver nanowire laminated conductive film was measured with a eddy current sheet resistance meter ("Eddy Cus T F Portable 1010" manufactured by SURAGUS). Thereafter, the sealed silver nanowire laminated conductive film was stored in a constant temperature and humidity test machine (85°C, 85%RH), and the surface resistivity (Ω / Sq.) was measured again using the above-mentioned eddy current sheet resistance meter after 100 hours.

[0139] Change rate (%) = [(surface resistivity after storage at 85°C, 85%RH for 100 hours) / (initial surface resistivity)] x 100 - 100 The change rate of the surface resistivity was calculated as above, and evaluated in accordance with the following standards. The results are shown in Table 2.

[0140] (Evaluation standards for surface resistivity) ◎ Change rate of surface resistivity is less than 0% 〇 Change rate of surface resistivity is 0% or more and less than 20% × Change rate of surface resistivity is 20% or more <Resistance to bending> The sealed sheet on which the PET film was peeled off, which was produced in Production Examples 1 to 6, was used, and a polyimide film (manufactured by UNITIKA, 25 μm) was attached to both sides of the composition layer with a vacuum laminator (80°C, 0.3 MPa, 30 seconds) to produce an evaluation sample composed of a structure of "polyimide (PI) film / composition layer / polyimide (PI) film".

[0141] The obtained evaluation sample was set in a clamshell type bending test device "CL40R type-E02" (manufactured by YUASA SYSTEM Co., Ltd.), and the evaluation sample was bent 100,000 times under conditions of a temperature of 60°C, a humidity of 90%RH, a radius of curvature (R) of 2.0 mm, and a speed of 60 rpm. After bending, the evaluation sample was observed using a digital microscope "VHX-5000" (magnification: 20 times) manufactured by KEYENCE, and the resistance to bending was evaluated in accordance with the following standards. The results are shown in Table 2.

[0142] (Evaluation standards for resistance to bending) O (Yes): Not peeled off X (No): Peeling and bubble generation [Table 1] [Table 2] From the results of Tables 1 and 2, it is found that the haze, total light transmittance, and adhesion strength values of Examples 1 to 4 are good, and the surface resistivity and the evaluation of the bending resistance are good.

[0143] Industrial applicability The composition of the present application can form a protective (sealing) film that, when protecting (sealing) a conductive layer constituting a conductive substrate, takes into account transparency, adhesion strength, and bending resistance, and can suppress changes in the surface resistivity of the conductive substrate and the migration of the conductor, and thus can be used to protect (seal) a conductive layer of a conductive substrate using metal nanowires, metal mesh, metal nanoparticles, conductive polymers, and in particular, metal nanowires and metal nanoparticles as conductors.

[0144] This application is based on Japanese Patent Application No. 2023-052198 filed in Japan, the contents of which are incorporated herein in its entirety.

Claims

1. A composition for a protective film of a conductive layer of an electrically conductive substrate, The composition comprises: (A) a crosslinked polymer having isobutylene-isoprene copolymer chains, The conductive layer is composed of a conductive material selected from one or more of metal nanowires, metal mesh, metal nanoparticles, and electrically conductive polymers.

2. The composition of claim 1, wherein, The crosslinked polymer having isobutylene-isoprene copolymer chains of (A) is at least one selected from the group consisting of a reaction product of an isobutylene-isoprene copolymer having an epoxy group and an olefin-based polymer having a carboxyl group and / or an anhydride group, and a reaction product of an isobutylene-isoprene copolymer having a carboxyl group and / or an anhydride group and an olefin-based polymer having an epoxy group.

3. The composition of claim 1, wherein, The content of the component (A) is 10 to 75 mass% with respect to 100 mass% of the non-volatile component of the composition.

4. The resin composition according to claim 1, further comprising: (B) a liquid polyolefin-based resin and / or a liquid rubber.

5. The composition of claim 4, wherein, The content of the component (B) is 5 to 50 mass% with respect to 100 mass% of the non-volatile component of the composition.

6. The composition according to claim 1, further comprising: (C) a hygroscopic inorganic filler.

7. The composition of claim 6, wherein, The hygroscopic inorganic filler of (C) is one or more selected from uncalcined hydrotalcite and semi-calcined hydrotalcite.

8. The composition of claim 6, wherein, The content of the component (C) is 1 to 60 mass% with respect to 100 mass% of the non-volatile component of the composition.

9. The composition of claim 1, wherein, The metal constituting the metal nanowires, the metal mesh, and / or the metal nanoparticles is one or more selected from silver, copper, gold, nickel, platinum, palladium, iron, cobalt, and tin.

10. The composition of claim 1, wherein, The electrically conductive polymer is one or more selected from poly(3,4-ethylenedioxythiophene) (PEDOT), polypyrrole, polythiophene, graphene, polyacetylene, poly(p-phenylene), poly(p-phenylenevinylene), and polyaniline.

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