Optical element assembly and method for producing optical element assembly

Abstract

A method for manufacturing an optical element assembly (100) and an optical element assembly (100) for limiting tilt. The method includes inserting an optical component (150) into a recess (115) of a substrate (110), the optical component (100) having at least one optical device (170) and a susceptor (154); sliding an optical component (100) along a bottom surface of the recess (115) until at least a portion of the base (154) contacts a side wall of the recess (115), the optical component (100) sliding substantially parallel to the bottom surface of the recess (115); a fixing agent (118) is applied in the recess (115). The optical element assembly (100) includes: an optical component (150) including a base (154), a support member (160) extending from the base (154), and at least one optical device (170); and a substrate (110) having at least one recess (115) defined therein, the optical component (150) being accommodated in the recess (115) of the substrate (110), at least a portion of the susceptor (154) being in contact with a side wall of the recess (115), the optical component (150) being fixed in the recess (115) by a fixing agent (118).

Description

[0001] Cross-references to related applications

[0002] This is the first application filed with respect to the technology disclosed herein. Technical Field

[0003] This disclosure generally relates to an optical element assembly and a method for manufacturing the optical element assembly. Background Technology

[0004] In optical transceivers, coupling optical signals into optical fibers, fiber array units (FAUs), and / or embedded waveguides (WGs) of silicon photonic devices can be an extremely challenging, time-consuming, and costly problem.

[0005] When light is coupled into the optical fiber or embedded waveguide of a silicon photonic device, it is necessary to maximize the coupling power (also known as coupling efficiency). The key to maximizing coupling efficiency is to reduce the total insertion loss from the source to the output destination. Insertion loss can be affected by a variety of factors, including misalignment caused by physical tolerances and manufacturing or assembly variations, thermomechanical stress, incompatible mode field diameter (MFD), Fresnel effects, scattering, beam cutoff, etc.

[0006] Therefore, systems and methods are needed for optical transceiver components to minimize insertion loss. Summary of the Invention

[0007] For the purposes of this disclosure (i.e., a general purpose of this disclosure), is to provide an optical element assembly and a method for manufacturing the optical element assembly, which addresses the misalignment loss problem in optical transceivers and similar free-space-to-fiber couplings.

[0008] While misalignment can be reduced by limiting the movement of the lens along all six axes (X-axis, Y-axis, Z-axis, tilt axis, yaw axis, and pitch axis), the inventors have noted that misalignment and the resulting insertion loss are extremely sensitive to pitch movement (i.e., tilting along the Z-axis). Therefore, this technique aims to reduce tilt error to help reduce total insertion loss.

[0009] According to the present technology, an optical component assembly is formed from an optical piece having a base, a generally upwardly extending support member, and one or more optical elements supported by the support member. According to some embodiments, the optical elements, support member, and base are integrally formed such that relative movement or misalignment between the base and the optical elements is not possible. The assembly further includes a substrate having at least one recess for receiving the base of the optical piece. The substrate can then also receive other optical elements that are coupled such that the optical elements (e.g., lenses) are rigidly aligned with other optical elements (e.g., optical fibers) thereby preventing tilt misalignment. To manufacture the assembly, the base is disposed in the recess and then translated until at least one point on the base contacts a side of the recess. A fixing agent is applied which in turn fixes the optical piece to the substrate. By placing a flat base on a flat bottom surface of the recess and then sliding the base to abut the recess, tilt is minimized during manufacture and the relative position between the substrate and optical piece is then maintained by the fixing agent (e.g., epoxy).

[0010] According to one aspect of the present technology, a method for manufacturing an optical component assembly is provided, the method comprising: inserting an optical piece into a recess of a substrate, the optical piece having at least one optical device and a base; sliding the optical piece along a bottom surface of the recess until at least a portion of the base contacts a sidewall of the recess, the optical piece sliding generally parallel to the bottom surface of the recess; and applying a fixing agent in the recess to connect the optical piece to the substrate.

[0011] In some embodiments, the method further comprises: curing the fixing agent.

[0012] In some embodiments, the method further comprises: applying a bonding material to the bottom surface of the recess prior to inserting the optical piece into the recess.

[0013] In some embodiments, applying the bonding material comprises: applying a eutectic adhesive.

[0014] In some embodiments, the method further comprises: curing the bonding material to connect the base to the bottom surface of the recess after inserting the optical piece into the recess.

[0015] In some embodiments, the method further comprises: forming the recess in the substrate prior to inserting the optical piece into the recess.

[0016] In some embodiments, the substrate is a silicon substrate and forming the recess comprises: etching the recess in the silicon substrate.

[0017] In some embodiments, applying the fixing agent in the recess comprises: backfilling a space in the recess around the optical piece.

[0018] In some embodiments, the sliding the optical component until at least a portion of the base contacts the sidewall includes sliding the optical component until a top corner of the base contacts the sidewall, the sidewall of the recess being undercut.

[0019] According to another aspect of the present technology, there is provided an optical element assembly including: an optical component including a base, a support member connected to the base and extending from the base, and at least one optical device connected to the support member; and a substrate configured for mounting in an optical system, the substrate having at least one recess defined therein, the optical component being received in the at least one recess of the substrate, at least a portion of the base being in contact with a sidewall of the at least one recess, the optical component being fixed in the at least one recess by a fixing agent applied in the at least one recess.

[0020] In some embodiments, the base, the support member, and the at least one optical device are integrally formed.

[0021] In some embodiments, the base, the support member, and the at least one optical device are formed of one of glass, silica, and fused silica.

[0022] In some embodiments, the base and the support member are integrally formed; and the at least one optical device includes at least one mirror formed on a surface of the support member.

[0023] In some embodiments, the at least one optical device includes a micro-optical lens array connected to the support member.

[0024] In some embodiments, the at least one optical device includes at least one lens; the at least one lens includes a first surface formed on a first side of the support member and a second surface formed on a second side of the support member, the second side being disposed opposite to the first side; and the at least one lens has an optical axis defined by normals of the first surface and the second surface.

[0025] In some embodiments, the optical axis of the at least one lens extends parallel to a bottom surface of the base.

[0026] In some embodiments, the optical element assembly further includes a bonding layer disposed between the base and a bottom surface of the at least one recess.

[0027] In some embodiments, the bonding layer is formed of a eutectic adhesive layer.

[0028] In some embodiments, the sidewall of the at least one recess is undercut; and the fixing agent backfills a space between the at least one recess and the base.

[0029] In some embodiments, the at least one recess includes a plurality of recesses defined in the substrate.

[0030] It will be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements can be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.).

[0031] The terminology used herein is for the purpose of describing particular representative embodiments or implementations only and is not intended to be limiting of the present technology. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0032] It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present technology. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0033] Furthermore, all descriptions herein of principles, aspects, embodiments and implementations of the present technology, and specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Thus, for example, any present technology described herein in terms of function comprising particular features of functional means and / or elements can be encompassed by structural features that perform the required functions, and / or equivalents of such structural features, even though structural features can not be shown in the drawings. Similarly, where processes described herein can include a plurality of steps, these processes can be interpreted as including any combination of steps, and / or equivalents thereof, even though not all of the steps can be recited in the description of the processes. BRIEF DESCRIPTION OF DRAWINGS

[0034] The features and advantages of the present technology will become apparent from the following detailed description in conjunction with the drawings in which:

[0035] Figure 1 is a cross-sectional view of an optical element assembly according to one non-limiting embodiment of the present technology;

[0036] Figure 2 is a perspective view of an optical component of the optical element assembly of Figure 1 ​

[0037] Figure 3 is a perspective view of an optical component of another non-limiting embodiment of an optical element assembly according to the present technology;

[0038] Figure 4 is a top plan view of an example implementation of an optical transceiver arrangement using Figure 1 the optical element assembly of

[0039] Figure 5 is a flowchart illustrating a method for manufacturing the optical element assembly of Figure 1 according to some implementations of the present technology;

[0040] Figure 6 is a cross-sectional view of a substrate of another embodiment of an optical element assembly according to the present technology;

[0041] Figure 7 is a perspective view of an optical component of another non-limiting embodiment of an optical element assembly according to the present technology;

[0042] Figure 8 is a cross-sectional view of an optical element assembly according to another non-limiting embodiment of the present technology.

[0043] It should be understood that like drawing reference numerals identify identical structural elements or components, throughout the several views, of the drawings, and that elements having similar names describe similar elements. Further, it is to be understood that the appended drawings and the following description are not identical to the scope of the claims. The drawings can not be to scale. DETAILED DESCRIPTION

[0044] Various representative embodiments and implementations of the described technology will be described more fully below with reference to the accompanying drawings, in which representative embodiments and implementations are shown. The present technological concept may, however, be embodied in many different forms and should not be construed as limited to the representative embodiments and implementations set forth herein. Rather, these representative embodiments and implementations are provided so that this disclosure will be thorough and complete, and fully convey the scope of the present technology to those skilled in the art. In the drawings, the size and relative sizes of layers and regions can be exaggerated for clarity. Like reference numerals indicate like elements throughout the several views.

[0045] Referring now to the drawings, Figure 1 depicts one non-limiting embodiment of an optical element assembly 100 according to the present technology. A method 200 for manufacturing the optical element assembly 100 will be described in more detail below.

[0046] The optical element assembly 100 (also referred to herein as assembly 100) includes a substrate 110 configured for mounting in an optical system. The substrate 110 has one or more recesses 115 defined therein. In the present embodiment, the substrate 110 has one recess. In Figure 6 Another non-limiting embodiment is shown in FIG. 3, in which a substrate 310 for another embodiment of the assembly has a plurality of recesses 315 defined therein. While there are three recesses 315, this is not meant to be limiting, and it is contemplated that more or fewer recesses can be defined therein. As shown in Figure 1 and Figure 6 Each recess 115, 315 has a flat bottom surface that is parallel to the bottom surface of the substrate 110, 310. While the recesses 115, 315 are shown in cross-section only, it should be noted that the shape or profile of the recesses 115, 315 is not particularly limited, so long as the dimensions and shape of the recesses 115, 315 allow for entry of the corresponding optical component (described below). It should also be noted that an assembly including a substrate 310 with a plurality of recesses 315 can include one optical component or a plurality of optical components, depending on the particular embodiment.

[0047] As previously mentioned, the assembly 100 also includes an optical component 150 that is connected to the substrate 100 and disposed in the recess 115. The optical component 150 is shown in more detail in Figure 2 The optical component 150 includes a base 154 and a support member 160 that is connected to and extends generally upwardly from the base 154. According to the present technology, the base 154 and the support member 160 are integrally formed. The base 154 has a flat bottom surface that is disposed on the flat bottom surface of the recess 115 when the optical component 150 is disposed in the recess 115. In the illustrated embodiment, the base 154 is wider than the support member 160 along the direction of light propagation to provide mechanical stability against tilting misalignment. In different embodiments, the specific dimensions of the base 154 and the aspect ratio between the base 154 and the support member 160 can vary.

[0048] The optical component 150 also includes one or more optical devices 170 (i.e., one or more optical elements 170) that are connected to the support member 160. The optical devices 170 are disposed in the recess 115 when the optical component 150 is disposed in the recess 115. In the illustrated embodiment, the optical devices 170 are disposed in the support member 160. In different embodiments, the optical devices 170 can be disposed in the base 154 or in both the base 154 and the support member 160. Figure 1In the illustrated embodiment, the optical device 170 is specifically a lens 170 having an optical axis 173 defined thereby. As illustratively shown, the optical axis 173 extends generally parallel to the bottom surface of the base 154. In accordance with the present technology, the lens 170 is integrally formed with the support member 160 and the base 154, with the lens 170 being formed by two lens surfaces 172 formed by opposing surfaces on the support member 160. Thus, the optical component 150 is formed from a material suitable for a lens, including but not limited to various types of silica and fused silica. By integrally forming the lens 170 with the support member 160 and the base 154, the optical axis 173 maintains its parallel relationship with the base 154, thereby eliminating the possibility of a tilted misalignment with the base 154.

[0049] It is contemplated that the optical device 170 can vary in different embodiments of the assembly 100, including transmissive-based optical elements and reflective-based optical elements. Figure 3 Another non-limiting embodiment of the optical component 150' is shown, in which the optical device 170' is specifically a mirror 170' formed on one surface of the support member 160. In this case, the integrally formed base 154 and support member 160 can be formed from different materials, such as opaque plastic, silica, glass, and / or metal. It is also contemplated that the optical device of the optical component 150 can be multiple optical devices or an array of optical devices. Figure 7 Another non-limiting embodiment of the optical component 150" is shown, in which the optical device 170" is specifically a micro-optical lens array 170" connected to and integrally formed with the support member 160.

[0050] Returning to Figure 1 To form the assembly 100, the optical component 150 is received in the recess 115 of the substrate 110. The base 154 is disposed in the recess 115 such that at least one portion or component of the base 154 is in contact with the sidewall of the recess 115. The optical component 150 is then secured in the recess 115 by the application of a securing agent 118 in the recess 115. In different embodiments, the material of the securing agent 118 can vary, including but not limited to: UV-cured and / or non-conductive polymer epoxy.

[0051] In the present embodiment, the sidewall 116 of the recess 115 is undercut, i.e., the sidewall 116 extends downward and outward from the opening of the recess 115. The securing agent 118 then backfills the space between the recess 115 and the base 154. In different embodiments, the specific angle and severity of the undercut can vary. It is also contemplated that in at least some embodiments, the sidewall can not be undercut. Figure 8Another non-limiting embodiment of the present technology is shown, wherein component 400 includes substrate 410. Substrate 410 includes an uncut recess 415 having generally vertical sidewalls 416.

[0052] Including Figure 1 In at least some embodiments of the illustrated examples, component 100 further includes a bonding layer 120 disposed between the base 154 and the bottom surface of the recess 115. It should be noted that the application of the bonding layer 120 will require fine control to ensure that parallel alignment is maintained between the base 154 and the bottom surface of the recess 115. In at least some embodiments, this can be achieved by the bonding layer 120. The bonding layer 120 may include a variety of materials or bonding types, including but not limited to eutectic bonding with proprietary metallization stacks and / or custom-formulated polymer adhesives to ensure constant bond line thickness and desired post-bonding performance.

[0053] Reference Figure 4 This illustration shows a non-limiting example implementation of component 100 in a transceiver system, specifically two implementations of optical components 101 and 102 (otherwise identical to component 100). The substrate 110 of component 101 is also connected to an optical fiber 104 for carrying an optical signal to be transmitted in free space to component 102. Component 101 is arranged to collimate the signal from optical fiber 104 using a lens 170 to allow the signal to propagate into free space in component 102. Similarly, component 102 has a coupling arrangement using a lens 170 to couple the collimated signal to an optical fiber 106 connected to its substrate. Compared to prior art transceiver systems, insertion loss and alignment costs are typically reduced by using an integrally connected base 154, a fixed relationship between the support member 160 and the lens 170, and a tilt-reducing arrangement of the optical components 150 fixed to the substrate 110.

[0054] exist Figure 5 The diagram schematically illustrates a method 200 for manufacturing component 100.

[0055] Method 200 begins at step 210, wherein an optical component 150 is inserted into a substrate recess 115. A base 154 is disposed in the recess 115 and received on the bottom surface of the recess 115. Within the scope of this art, various processes and actions can be contemplated before inserting the component 150 into the recess 115. For example, in at least some embodiments, method 200 may include forming the recess 115 in the substrate 110 before inserting the optical component 150. If the substrate 110 is a silicon substrate 110, forming the recess 115 may include etching the recess 115 in the silicon substrate 110.

[0056] In some embodiments, the method 200 includes applying the bonding material 120 to the bottom surface of the recess 115 prior to inserting the optical component 150 into the recess 115. In at least some embodiments of the method 200, applying the bonding layer 120 includes applying a eutectic adhesive layer 120. In some embodiments, the method 200 can further include curing the bonding material 120 to connect the pedestal 154 to the bottom surface of the recess 115 after inserting the optical component 150 into the recess 115.

[0057] The method 200 continues at step 220 with sliding the optical component 150 along the bottom surface of the recess 115 until at least a portion of the pedestal 154 contacts one sidewall 116 of the recess 115. The optical component 150 is slid generally parallel to the bottom surface of the recess 115 in order to maintain smooth contact and proper alignment of the optical device 170. In embodiments in which the undercut sidewall 116 partially defines the recess 115, the optical component 150 is translated until the top corner of the pedestal 154 contacts the sidewall 116.

[0058] The method 200 continues at step 230 with applying the fixative 118 in the recess 115 to connect and secure the optical component 150 to the substrate 110. In some embodiments, such as in embodiments in which the recess 115 is undercut, the fixative 118 can be applied to the sidewall 116 of the recess 115. Figure 1 In the manufacture of the assembly 100, applying the fixative 118 in the recess 115 can include backfilling the space in the recess 115 around the optical component 150.

[0059] In some embodiments, the method 200 can further include curing the fixative. For example, in such cases, the fixative is a UV-cured and / or custom polymer-based formulation that meets the desired rheology and post-build performance. Initial curing and post-alignment final curing can include proprietary thermal curing profiles and equipment sets.

[0060] It should also be understood that, even though a particular feature or aspect of the implementations herein has been described in relation to a particular feature or aspect, individual features or aspects can be taken or left independent of one another, without departing from the scope of the present disclosure. Thus, the specification and drawings are to be regarded as illustrative only, and it is intended that the scope of the disclosure be defined by the claims, and that they be construed as covering all modifications and equivalents thereunder.

Claims

1. A method for manufacturing an optical component assembly, the method comprising: inserting an optical part into a recess of a substrate, the optical part having a base and at least one optical device; sliding the optical part along a bottom surface of the recess until at least a portion of the base contacts a sidewall of the recess, the optical part sliding generally parallel to the bottom surface of the recess; and applying a fixing agent in the recess to connect the optical part to the substrate. curing the fixing agent.

2. The method of claim 1, further comprising: applying a bonding material to the bottom surface of the recess prior to inserting the optical part into the recess.

3. The method of claim 1 or 2, further comprising: applying the bonding material includes applying a eutectic adhesive.

4. The method of claim 3, wherein, curing the bonding material to connect the base to the bottom surface of the recess after inserting the optical part into the recess.

5. The method of claim 3 or 4, further comprising: forming the recess in the substrate prior to inserting the optical part into the recess.

6. The method of claim 1, further comprising: the substrate is a silicon substrate and forming the recess includes etching the recess in the silicon substrate.

7. The method of claim 6, wherein, applying the fixing agent in the recess includes backfilling a space in the recess around the optical part.

8. The method of claim 1, wherein, sliding the optical part until at least a portion of the base contacts the sidewall includes sliding the optical part until a top corner of the base contacts the sidewall, the sidewall of the recess being undercut.

9. The method of claim 1, wherein, 10. An optical component assembly comprising: an optical part, the optical part comprising: a base, a support member connected to and extending from the base, and at least one optical device connected to the support member; and a substrate configured for mounting in an optical system, the substrate having at least one recess defined therein, the optical part is housed in the at least one recess of the substrate, at least a portion of the base being in contact with a sidewall of the at least one recess, the optical part is secured in the at least one recess by a fixing agent applied in the at least one recess. the base, the support member, and the at least one optical device are integrally formed.

11. The optical element assembly of claim 10, wherein, the base, the support member, and the at least one optical device are formed of one of glass, silica, and fused silica.

12. The optical element assembly of claim 11, wherein, 13. The optical component assembly of claim 10, wherein: the base and the support member are integrally formed; and the at least one optical device includes at least one mirror formed on a surface of the support member. the at least one optical device includes a micro-optical lens array connected to the support member.

14. The optical element assembly according to any one of claims 10 to 12, wherein, 15. The optical component assembly of any one of claims 10 to 12, wherein: the at least one optical device includes at least one lens; the at least one lens includes: a first surface formed on a first side of the support member, and a second surface formed on a second side of the support member, the second side being disposed opposite the first side; and the at least one lens has an optical axis defined by normals of the first surface and the second surface. the optical axis of the at least one lens extends parallel to a bottom surface of the base.

16. The optical element assembly of claim 15, wherein, the optical axis of the at least one lens extends parallel to a bottom surface of the base.

17. The optical element assembly of any one of claims 10 to 16, further comprising: a bonding layer disposed between the base and a bottom surface of the at least one recess.

18. The optical element assembly of claim 17, wherein, The bonding layer is formed of a eutectic adhesive layer.

19. The optical element assembly of any of claims 10-18, wherein: a sidewall of the at least one recess is undercut; and the fixative backfills a space between the at least one recess and the base.

20. The optical element assembly of claim 10, wherein, The at least one recess comprises a plurality of recesses defined in the base plate.

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