Porous showerhead for substrate processing system

Abstract

The porous showerhead includes a porous top surface, a porous bottom surface, and a plurality of layers. The layers are stacked between the porous top surface and the porous bottom surface. The layers are arranged to be connected to a distribution plate of a showerhead assembly of a substrate processing system. An uppermost layer of the layers has the porous top surface. A bottommost layer of the layers has the porous bottom surface. Each of the layers contains particles that are partially melted to form pores. The pores of the layers satisfy at least one of lateral alignment with pores in one or more adjacent ones of the layers and fluid coupling with pores in one or more adjacent ones of the layers to provide extended pores. The extending pores extend from the porous top surface to the porous bottom surface.

Description

Cross Reference to Related Applications

[0001] This application claims priority to U.S. Provisional Application No. 63 / 452,401, filed March 15, 2023. The entire disclosure of the above application is incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to a showerhead of a substrate processing system, and in particular to a showerhead formed using an additive manufacturing process. BACKGROUND

[0003] The background description provided here is for the purpose of generally presenting the context of the disclosure. The work of the presently designated inventors, to the extent the work is

[0004] Substrate processing systems generally include a plurality of processing chambers (also referred to as processing modules) that perform deposition, etching, and other processing on substrates such as semiconductor wafers. For example, deposition can be performed using chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), atomic layer deposition (ALD), plasma-enhanced ALD (PEALD), and / or other deposition processes to deposit a conductive film, a dielectric film, or other types of films. During deposition, a substrate is disposed on a substrate support (e.g., a susceptor), and during one or more processing steps, one or more precursor gases can be supplied to the processing chamber using a gas distribution apparatus (e.g., a showerhead). In PECVD or PEALD processing, a plasma is used during deposition to initiate chemical reactions within the processing chamber. Additional examples of processes that can be performed on a substrate include, but are not limited to, dielectric etching, chemical etching, plasma etching, reactive ion etching, and cleaning processes. During deposition and etching processes, a gas mixture is introduced into the processing chamber via a showerhead, and a plasma is ignited to initiate chemical reactions. During cleaning processes, a gas can also be introduced via the showerhead. SUMMARY

[0005] A porous showerhead is disclosed and includes a porous top surface, a porous bottom surface, and a plurality of layers. The layers are stacked between the porous top surface and the porous bottom surface. The layers are configured to be connected to a distribution plate of a showerhead assembly of a substrate processing system. An uppermost layer of the layers has the porous top surface. A lowermost layer of the layers has the porous bottom surface. Each of the layers includes particles that are partially fused to form pores. The pores of the layers satisfy at least one of being laterally aligned with pores in one or more adjacent layers of the layers and being fluidically coupled with pores in one or more adjacent layers of the layers to provide extended pores. The extended pores extend from the porous top surface to the porous bottom surface.

[0006] In other features, the extended pores are not exclusive but share the pores of the layers. In other features, a thickness of each of the layers is equal to 1-3 times a diameter of the particles of the layer. In other features, a maximum thickness of each of the layers is twice a maximum diameter of the particles of the layer. In other features, a thickness of each of the layers is 30-100 pm.

[0007] In other features, each of the particles has a diameter of 20-100 pm. In other features, the particles are spherical particles. In other features, the particles are silicon particles.

[0008] In other features, the layers include more than 1,000 extended pores per square centimeter. In other features, an overall thickness of the layers is greater than 5 mm. In other features, a resistivity of the layers is 0.5 mW-cm to 3 W-cm. In other features, a doping level of the particles is 2.32E+20 atoms / cm 3 to 4.55E+15 atoms / cm 3 .

[0009] In other features, each of the layers includes an annular outer portion having a higher density and a lower porosity than another portion that is radially inside the annular outer portion. In other features, the layers include an annular outer portion and a circular inner portion that is disposed radially inside the annular outer portion and has a lower density and a higher porosity than the annular outer portion. In other features, the annular outer portion includes holes for connecting the layers to the distribution plate.

[0010] In other features, the layers include: first annular portions; and second annular portions each configured between two of the first annular portions, the second annular portions having a lower density and a lower porosity than the first annular portions. In other features, the layers include a circular inner portion radially inward of the first annular portions and having the same density and porosity as the second annular portions. In other features, the first annular portions include holes for connecting the layers to the distribution plate.

[0011] In other features, the layers include vertical porous regions each between a pair of non-porous regions. In other features, the layers include diagonal porous regions each between a pair of non-porous regions.

[0012] In other features, the layers include: a grid having a first density and a first porosity; and columns defined by the grid. The columns have a second density and a second porosity. The second density is less than the first density. The second porosity is greater than the first porosity.

[0013] In other features, the layers include vertical porous regions extending from the top surface to the bottom surface. In other features, the layers include diagonal porous regions extending from the top surface to the bottom surface.

[0014] In other features, a showerhead assembly is provided and includes: the porous showerhead; and the distribution plate connected to the porous showerhead and arranged to distribute fluid to the uppermost of the layers.

[0015] In other features, the distribution plate includes: a body; and an annular outer member extending downward from the body and defining a cavity between the body and the porous showerhead. In other features, the distribution plate includes holes extending downward from a top of the distribution plate to a bottom of the distribution plate and arranged to supply fluid to the cavity.

[0016] In other features, the porous showerhead includes an annular outer portion laterally aligned with and connected to the annular outer member. In other features, the annular outer portion is not porous.

[0017] In other features, the distribution plate includes: a body; and an annular member extending downward from the body and defining a cavity between the body and the porous showerhead. In other features, the annular member extends downward to a porous portion of the porous showerhead.

[0018] In other features, the annular members extend down to and are connected to first annular portions of the multi-orifice showerhead. In other features, the distribution plate includes holes that extend from a top of the distribution plate down to a bottom of the distribution plate and are configured to supply fluid to a cavity defined at least in part by the annular members.

[0019] In other features, the multi-orifice showerhead includes second annular portions, each of the second annular portions being disposed between two of the first annular portions and being multi-orificed. In other features, the distribution plate further includes lateral members that extend down from the body to the multi-orifice showerhead. In other features, the distribution plate includes holes that extend from a top of the distribution plate down to a bottom of the distribution plate and are configured to supply fluid to a cavity defined at least in part by the lateral members.

[0020] In other features, the showerhead assembly further includes a thermally conductive layer disposed between the distribution plate and the multi-orifice showerhead. In other features, the showerhead assembly further includes a plenum connected to the distribution plate and configured to supply fluid to the distribution plate. In other features, a substrate processing system is disclosed and includes the showerhead assembly and a substrate support configured to support a substrate below the showerhead assembly.

[0021] In other features, a three-dimensional printing method for fabricating a multi-orifice showerhead is disclosed. The method includes loading a powder bed of a three-dimensional printing system with silicon powder; increasing a temperature of a substrate on a build plate of the three-dimensional printing system; transferring a layer of silicon from the powder bed to the substrate; fusing the layer of silicon on the substrate to form a buffer layer on the substrate; and printing layers on the buffer layer to form a multi-orifice showerhead for a substrate processing system. Each of the layers includes particles that are partially fused to form pores. The pores of the layers satisfy at least one of being laterally aligned with pores in one or more adjacent ones of the layers and being fluidically coupled to the pores in one or more adjacent ones of the layers. The method further includes separating the multi-orifice showerhead from the substrate along the buffer layer.

[0022] In other features, the temperature of the substrate is increased to 200-1,100 °C prior to printing the layers. In other features, the method further includes annealing the multi-orifice showerhead prior to separating the multi-orifice showerhead from the substrate.

[0023] In other features, the method further includes decreasing a temperature of the multi-orifice showerhead prior to separating the multi-orifice showerhead from the substrate. In other features, the extended pores are not mutually exclusive but share the pores of the layers.

[0024] In other features, each of the layers has a thickness equal to 1-3 times a diameter of a particle of the layer. In other features, each of the layers has a maximum thickness that is twice a maximum diameter of a particle of the layer. In other features, each of the layers has a thickness of 30-100 pm. In other features, each of the particles has a diameter of 20-100 pm. In other features, the particles are spherical particles. In other features, the particles are silicon particles. In other features, the layers comprise more than 1,000 extended porosities per square centimeter.

[0025] In other features, the layers have an overall thickness greater than 5 mm. In other features, the layers have a resistivity of 0.5 mW-cm to 3 W-cm. In other features, the particles have a doping level of 2.32E+20 atoms / cm 3 to 4.55E+15 atoms / cm 3 .

[0026] In other features, each of the layers comprises an annular outer portion having a higher density and a lower porosity than another portion located radially inside the annular outer portion. In other features, the layers comprise: an annular outer portion; and a circular inner portion configured radially inside the annular outer portion and having a lower density and a higher porosity than the annular outer portion. In other features, the annular outer portion comprises holes for connecting the layers to a distribution plate of a showerhead assembly of the substrate processing system.

[0027] In other features, the layers comprise: first annular portions; and second annular portions each configured between two of the first annular portions. The second annular portions have a lower density and a lower porosity than the first annular portions. In other features, the layers comprise a circular inner portion located radially inside the first annular portions and having the same density and porosity as the second annular portions. In other features, the first annular portions comprise holes for connecting the layers to the distribution plate.

[0028] In other features, the layers comprise vertical porous regions each located between a pair of non-porous regions. In other features, the layers comprise diagonal porous regions each located between a pair of non-porous regions.

[0029] In other features, the method further comprises, during printing of each of the layers, forming a lattice having a first density and a first porosity, and a column defined by the lattice. The column has a second density and a second porosity. The second density is less than the first density. The second porosity is greater than the first porosity.

[0030] In other features, the layers include vertically porous regions extending from a top of the porous showerhead to a bottom of the porous showerhead. In other features, the layers include diagonally porous regions extending from a top of the porous showerhead to a bottom of the porous showerhead.

[0031] In other features, a three-dimensional printing system is disclosed and includes at least one laser, a powder bed configured to store powder, a build plate configured to support a substrate, an actuator assembly configured to adjust a height of the powder bed and the build plate, a powder wiper configured to wipe a layer of powder from the powder bed to the substrate, and a controller. The controller is configured to control the actuator assembly and the powder wiper to wipe a layer of powder from the powder bed to the substrate and control the at least one laser to fuse the layer of powder to form a buffer layer, followed by sequentially wiping layers of powder onto the buffer layer to form layers of a porous showerhead. The porous showerhead is configured to be coupled to a distribution plate of a showerhead assembly of a substrate processing system. The controller is further configured to, during formation of the layers of the porous showerhead, control the at least one laser to partially fuse portions of each of the layers of the porous showerhead to form voids in each of the layers of the porous showerhead. The voids form extended voids that extend from a top of the porous showerhead to a bottom of the porous showerhead.

[0032] In other features, the three-dimensional printing system further includes at least one heater. The controller is configured to increase a temperature of the substrate to 200-1100 °C prior to printing the layers of the porous showerhead. In other features, the controller is configured to anneal the porous showerhead prior to decoupling the porous showerhead from the substrate. In other features, the controller is configured to decrease a temperature of the porous showerhead prior to decoupling the porous showerhead from the substrate.

[0033] In other features, the extended voids are not mutually exclusive, but share a void of the layers of the porous showerhead. In other features, a thickness of each of the layers of the porous showerhead is equal to 1-3 times a diameter of a particle of the layer.

[0034] In other features, a maximum thickness of each of the layers of the porous showerhead is twice a maximum diameter of a particle of the layer. In other features, a thickness of each of the layers is 30-100 pm. In other features, a particle of each of the layers of the porous showerhead has a diameter of 20-100 pm. In other features, the particles of the layers of the porous showerhead are spherical particles. In other features, the particles of the layers of the porous showerhead are silicon particles.

[0035] In other features, the layers of the porous showerhead each comprise more than 1,000 extended porosities per square centimeter. In other features, the layers of the porous showerhead each have an overall thickness of greater than 5 mm. In other features, the layers of the porous showerhead each have a resistivity of 0.5 mΩ-cm to 3 Ω-cm. In other features, the layers of the porous showerhead each have a doping level of the grains of 2.32E+20 atoms / cm 3 to 4.55E+15 atoms / cm 3 .

[0036] In other features, each of the layers of the porous showerhead comprises an annular outer portion having a higher density and a lower porosity than another portion located radially inside the annular outer portion. In other features, the layers of the porous showerhead comprise: an annular outer portion; and a circular inner portion configured radially inside the annular outer portion and having a lower density and a higher porosity than the annular outer portion. In other features, the annular outer portion comprises a hole for connecting the layers of the porous showerhead to the distribution plate.

[0037] In other features, the layers of the porous showerhead comprise: a first annular portion; and a second annular portion each configured between two of the first annular portions. The second annular portion has a lower density and a lower porosity than the first annular portion.

[0038] In other features, the layers comprise a circular inner portion located radially inside the first annular portion and having the same density and porosity as the second annular portion. In other features, the first annular portion comprises a hole for connecting the layers of the porous showerhead to the distribution plate. In other features, the layers of the porous showerhead comprise vertical porous regions each located between a pair of non-porous regions. In other features, the layers of the porous showerhead comprise diagonal porous regions each located between a pair of non-porous regions.

[0039] In other features, the three-dimensional printing system further comprises, during printing of each of the layers, forming a grid having a first density and a first porosity, and a column defined by the grid. The column has a second density and a second porosity. The second density is less than the first density. The second porosity is greater than the first porosity.

[0040] In other features, the layers comprise vertical porous regions extending from a top of the porous showerhead to a bottom of the porous showerhead. In other features, the layers comprise diagonal porous regions extending from a top of the porous showerhead to a bottom of the porous showerhead.

[0041] The further scope of the applicability of this disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are for illustrative purposes only and are not intended to limit the scope of this disclosure. Attached Figure Description

[0042] This disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0043] Figure 1 This is a close-up view of a cross-sectional portion of a multi-hole nozzle, illustrating the paths of several extending pores, in accordance with this disclosure.

[0044] Figure 2A This is a bottom view of a nozzle assembly including a multi-hole nozzle and a single-zone distribution plate, in accordance with this disclosure.

[0045] Figure 2B According to this disclosure, relative to the inflation part and the rod (or syringe) Figure 2A A cross-sectional side view of the nozzle assembly;

[0046] Figure 3A This is a bottom view of a portion of another nozzle assembly, including a multi-hole nozzle and a multi-zone distribution plate, having an annular member, in accordance with the present disclosure.

[0047] Figure 3B for Figure 3A A cross-sectional side view of the nozzle assembly;

[0048] Figure 4A This is a bottom view of a portion of another nozzle assembly, including a multi-zone multi-orifice nozzle and a corresponding multi-zone distribution plate, according to the present disclosure. The multi-zone multi-orifice nozzle has an annular portion, and the multi-zone distribution plate has an annular member.

[0049] Figure 4B for Figure 4A A cross-sectional side view of the nozzle assembly;

[0050] Figure 5A This is a cross-sectional side view of a portion of another nozzle assembly, including a multi-zone multi-orifice nozzle and a multi-zone distribution plate, which has an annular member and a cross member, in accordance with the present disclosure.

[0051] Figure 5B for Figure 5A A top view of the cross section at point AA in the online database;

[0052] Figure 5C for Figure 5A A top view of the nozzle assembly;

[0053] Figure 6A side view of a 3D printing system for manufacturing a multi-hole showerhead according to the present disclosure;

[0054] Figure 7 A functional block diagram of a substrate processing system including a showerhead assembly including a multi-hole showerhead according to the present disclosure;

[0055] Figure 8 A method for manufacturing a multi-hole showerhead according to the present disclosure is shown;

[0056] Figure 9 A bottom view of another multi-hole showerhead including a solid grid and a multi-hole post according to the present disclosure;

[0057] Figure 10 A side cross-sectional view of a portion of a multi-hole showerhead according to the present disclosure showing an overall thickness and a layer thickness;

[0058] Figure 11 A side cross-sectional view of another multi-hole showerhead including a vertical multi-hole region according to the present disclosure; and

[0059] Figure 12 A side cross-sectional view of another multi-hole showerhead including a diagonal multi-hole region according to the present disclosure.

[0060] In the drawings, reference numerals can be repeated among the figures for like and / or identical elements. DETAILED DESCRIPTION

[0061] Subtractive machining (or subtractive manufacturing) methods can be used to remove selected portions of a silicon bulk to manufacture a showerhead. It can be difficult, infeasible, and / or physically impossible to manufacture a showerhead including a large number of holes and / or complex features (e.g., curved gas holes) using subtractive machining methods. Material utilization can also be poor using subtractive machining methods because a large portion of the bulk of material is selectively removed to manufacture the final showerhead. For example, to manufacture a silicon showerhead, a silicon ingot is first cast and then cut into circular plates. Each circular plate is machined to provide the final showerhead. Holes are drilled on the circular plates using electrical discharge machining (EDM), laser drilling, diamond bit drilling, or ultrasonic impact grinding. The more holes drilled on each circular plate, the longer the subtractive machining method is performed.

[0062] Conventional showerheads (also referred to as “showerhead electrodes”) have fewer than 5000 gas holes. Most conventional showerheads have fewer than 1000 gas holes. The diameter of the gas holes is generally greater than 300 micrometers (pm). The diameter of most of the gas holes is slightly greater than 500 pm. These holes are linear pass through holes that do not have any material.

[0063] Manufacturing requirements for three-dimensional (3D)-NAND memory devices include the following: increasing the number of device layers, higher RF power, and high aspect ratio (HAR) of the via holes and slits in the multi-layer stack. This requires higher conductance showerheads and HAR etching. At current hole diameters of, for example, ~500 pm, light up can occur in the showerhead gas holes and behind at high RF power levels. When the showerhead has a conventional number of gas holes (e.g., 300-2000 holes, where each hole has a diameter of ~500 pm), the substrate being processed can also experience gas non-uniformity issues despite the high flow conductance.

[0064] It is not possible and / or feasible to use conventional subtractive machining methods to manufacture a showerhead to obtain a high density of holes (e.g., more than 100,000 holes per showerhead). For example, it is not possible to drill one million holes in a 300 millimeter (mm) diameter silicon plate because the hole size required is so small. Moreover, it would take a long time to drill such a large number of holes and result in a large amount of silicon material being wasted.

[0065] Several methods that can be used to manufacture a large number of holes in a silicon plate include wet chemical etching and dry etching, respectively. The etch rates of wet chemical etching and dry etching are low, especially for high aspect ratio holes. It is also difficult to use wet chemical etching or dry etching to create vias in a silicon plate having a thickness of less than or equal to 10 mm.

[0066] Examples listed herein include porous showerheads (e.g., silicon porous showerheads) formed using additive manufacturing processes. Each additive manufacturing process includes 3D printing layers to form a stack that is annealed, cooled, and machined to provide a final showerhead. Each porous showerhead includes a number of extended apertures. Each porous showerhead includes a number of extended apertures. Each showerhead can include more than 100,000 extended apertures and up to 10 million or more extended apertures that can be provided on, for example, a 300 mm diameter showerhead having a thickness of 10 mm. In one embodiment, there are more than 1,000 extended apertures per square centimeter (cm 2 ) of the showerhead. In another embodiment, the inner diameter of each extended aperture is less than 70 pm and can be controlled as described below. In contrast to using subtractive manufacturing methods to manufacture holes, using the additive manufacturing methods disclosed herein, the more extended apertures per showerhead, the less time it takes for the disclosed additive manufacturing processes to manufacture the showerhead.

[0067] As used herein, "pore" refers to an opening or space between particles of a layer of a porous showerhead. As disclosed herein, each layer of a porous showerhead includes particles that have been partially fused during fabrication to form pores. The pores of each layer are laterally aligned with and fluidly coupled to the pores in one or more adjacent layers to provide an extended pore. An extended pore is one that extends from a top surface of the porous showerhead to a bottom surface of the porous showerhead. Each extended pore is a path for fluid to travel from the top surface, where the fluid is received, to the bottom surface, where the fluid is output from the porous showerhead. The path can be straight, curved, and / or have a "zigzag" pattern. Figure 1 An exemplary close-up (or magnified) view of a cross-sectional portion 100 of a showerhead including spherical silicon particles 102 is shown. Gaps exist between the particles 102 that collectively provide a connected pore that extends from a top 104 to a bottom 106 of the showerhead. Arrows 110 represent possible flow paths of fluid through the cross-sectional portion 100. There are many possible paths from the top 104 to the bottom 106. Each path is not mutually exclusive, but rather shares path segments with other paths.

[0068] Figure 2A With 2B A showerhead assembly 200 is shown that includes a porous showerhead 202, a single-zone distribution plate 204, and a plenum 206. The showerhead assembly 200 receives fluid (e.g., process gas) from a stem (or syringe) 208 shown in dashed lines. The porous showerhead 202 can be formed using the 3D printing methods disclosed herein and can be constructed as shown in Figure 2A With 2B shown, or can be constructed as shown in Figures 3A-5C and / or as described with respect to any of the porous showerheads mentioned herein. In the example shown in Figure 2A , 2B The porous showerhead 202 includes an inner portion 209 having a first porosity and a first density, and an outer portion 210 having a second porosity and a second density. The inner portion 209 is circular and is used to spread fluid toward a substrate being processed. In an embodiment, the first porosity is greater than the second porosity, and the first density is less than the second density. In an embodiment, the outer portion 210 is solid, and thus not porous, for mounting purposes, and has increased strength. The outer portion 210 is annular and is used to mount the porous showerhead 202 to the distribution plate 204. The outer portion 210 is radially outward of the inner portion 209 and is in contact with the inner portion 209. The outer portion 210 is integrally formed as a single piece with the inner portion 209. The porous showerhead 202 can be formed of silicon.

[0069] The distribution plate 204 can be formed of aluminum and includes a body 212 and an annular member 214 extending downward from the body 212. The distribution plate 204 can be secured directly to the multi-orifice showerhead 202 or a thermally conductive layer 216 can be disposed between the distribution plate 204 and the multi-orifice showerhead 202. The thermally conductive layer 216 can be implemented as a thermally conductive paste or a thermally conductive glue and can be formed of, for example, aluminum, rubber, and / or other suitable thermally conductive material. The distribution plate 204 includes holes 220 configured throughout the body 212. The body 212 can have any number of holes. The holes 220 extend from a top of the distribution plate 204 to a bottom of the distribution plate 204 and facilitate distribution of fluid received from the plenum 206 to the multi-orifice showerhead 202. A cavity 221 exists between the body 212 and the inner portion 209. The cavity 221 allows fluid to be distributed evenly to and throughout the inner portion 209. The distribution plate 204 facilitates more uniform temperature of the multi-orifice showerhead 202.

[0070] The multi-orifice showerhead 202 and / or the distribution plate 204 can include holes 230, 232 for securing the multi-orifice showerhead 202 to the distribution plate 204 via fasteners. For example, a screw can extend through the hole 230 and be screwed into the hole 232, which can have threads. The hole 230 is laterally aligned with the hole 232.

[0071] Figure 3A With 3B A portion 300 of a showerhead assembly including a multi-orifice showerhead 302 and a multi-zone distribution plate 304 is shown. The multi-orifice showerhead 302 includes an inner portion 309 having a first porosity and a first density and an outer portion 310 having a second porosity and a second density. The inner portion 309 is circular and is used to spread fluid toward a substrate being processed. In one embodiment, the first porosity is greater than the second porosity and the first density is less than the second density. In one embodiment, the outer portion 310 is solid and thus not multi-orificed. The outer portion 310 is annular and is used to mount the multi-orifice showerhead 302 to the distribution plate 304. The outer portion 310 is radially outward of the inner portion 309 and in contact with the inner portion 309. The outer portion 310 is integrally formed with the inner portion 309 as a single plate. The multi-orifice showerhead 302 can be formed of silicon.

[0072] The distribution plate 304 can be formed of aluminum and includes a body 312 and annular members 313, 314, 315 extending downward from the body 312. The annular members 313, 314, 315 define three annular cavities 316, 317, 318 that provide three corresponding annular zones in the multi-orifice showerhead 302. Fluid flows through holes 320 in the body 312 and corresponding porosities in the annular zones of the inner portion 309.

[0073] The distribution plate 304 can be directly fastened to the multi-orifice showerhead 302, or a thermally conductive layer (one example of which is shown in Figure 2B FIG. 19) can be disposed between the distribution plate 304 and the multi-orifice showerhead 302. The distribution plate 304 includes holes 320 that are configured throughout the body 312. The body 312 can have any number of holes. The holes 320 are disposed above the cavities 316, 317, 318, extend from the top of the distribution plate 304 to the bottom of the distribution plate 304, and facilitate distribution of fluid received from within the plenum (e.g., the plenum 206) to the multi-orifice showerhead 302. The cavities 316, 317, 318 allow fluid provided to the annular region to be evenly distributed throughout the annular region. Figure 2B

[0074] The multi-orifice showerhead 302 and / or the distribution plate 304 can include holes 330, 332 for fastening the multi-orifice showerhead 302 to the distribution plate 304 via fasteners. For example, a screw can extend through the hole 330 and be screwed into the hole 332, which can have threads. The hole 330 is laterally aligned with the hole 332.

[0075] Figure 4A With 4B A portion 400 of a showerhead assembly including a multi-zone multi-orifice showerhead 402 and a corresponding multi-zone distribution plate 404 having the same number of zones as the multi-zone multi-orifice showerhead 402 is shown. The multi-orifice showerhead 402 includes first annular portions 409, 410, 411; an inner portion 412; and second annular portions 413, 414. The first annular portions 409, 410, 411 can have a first density and a first porosity. The inner portion 412 and the second annular portions 413, 414 can have a second density and a second porosity. In one embodiment, the second density is greater than the first density and the second porosity is less than the first porosity. In another embodiment, the inner portion 412 and the second annular portions 413, 414 are solid and thus not porous. The inner portion 412 is radially inward of the annular portions 409, 410, 411, 413, 414. The annular portion 413 is between the annular portions 409 and 410. The annular portion 414 is between the annular portions 410, 411. The annular portion 409 is radially inward of the annular portion 410, and the annular portion 410 is radially inward of the annular portion 411. The annular portions 409, 410, 411, 413, 414 are concentric.

[0076] ​The annular portions 409, 410, 411 are used to mount the multi-orifice showerhead 402 to the distribution plate 404. The annular portions 409, 410, 411 are in contact with the inner portion 412 and the annular portions 413, 414. The annular portions 409, 410, 411, the inner portion 412, and the annular portions 413, 414 are integrally formed as a single plate. The multi-orifice showerhead 402 can be formed of silicon.

[0077] The distribution plate 404 can be formed of aluminum and includes a body 432 and annular members 433, 434, 435 extending downwardly from the body 432. The annular members 433, 434, 435 define three annular cavities 436, 437, 438 and are concentric. The annular members 433, 434, 435 are laterally aligned with the annular portions 409, 410, 411, which define three annular zones corresponding to the cavities 436, 437, 438. Fluid flows through holes 440 in the body 432 into the cavities 436, 437, 438 and through the apertures in the annular zones of the portions 412, 413, 414.

[0078] The distribution plate 404 can be directly fastened to the multi-orifice showerhead 402 or a thermally conductive layer, an example of which is shown in Figure 2B , can be disposed between the distribution plate 404 and the multi-orifice showerhead 402. The distribution plate 404 includes holes 440, which are disposed throughout the body 432. The body 432 can have any number of holes. The holes 440 are disposed above the cavities 436, 437, 438, extend from the top of the distribution plate 404 to the bottom of the distribution plate 404, and facilitate the distribution of fluid received from within the plenum (e.g., the plenum 206) to the multi-orifice showerhead 402. The cavities 436, 437, 438 allow the fluid provided to the annular zones to be evenly distributed throughout the annular zones. Figure 2B

[0079] The multi-orifice showerhead 402 and / or the distribution plate 404 can include holes 450, 452 for fastening the multi-orifice showerhead 402 to the distribution plate 404 via fasteners. For example, a screw can extend through the hole 450 and be screwed into the hole 452, which can have threads. The hole 450 is laterally aligned with the hole 452.

[0080] Figures 5A-5C ​A portion 500 of a nozzle assembly including a multi-zone porous nozzle 502 and a multi-zone distribution plate 504 is shown. The porous nozzle 502 may be formed of silicon and includes annular portions 510, 511, 512; a circular portion 513; and annular portions 514, 515. The annular portions 510, 511, 512 have a first density and a first porosity. The distribution plate 504 is configured differently from the distribution plate 404 of FIG. 4. The distribution plate 504 may be formed of aluminum and includes a body 532 and annular members 533, 534, 535 and transverse members 536, 537, 538, 539, 540, 541 extending downward from the body 532. The transverse members 536, 537 extend across the body 532 and extend through the annular members 533, 534. Transverse members 538, 539, 540, and 541 extend from annular member 533, pass through annular member 534, and reach annular member 535. Transverse members 538, 539, 540, and 541 do not extend across the portion of the distribution plate 504 located radially inside annular member 533.

[0081] Annular members 533, 534, 535 and transverse members 536, 537, 538, 539, 540, 541 define arched cavities (some of which are designated 550) and fan-shaped cavities 552. Regions 513, 514, 515 located below the arched cavities and fan-shaped cavities 552 may have a second density and a second porosity. In one embodiment, the second density is less than the first density, and the second porosity is greater than the first porosity. In another embodiment, the annular portions 510, 511, 512 are solid and therefore not porous. The annular portions 510, 511, 512 and the transverse members 536, 537, 538, 539, 540, 541 define and provide an increased number of zones to improve fluid flow adjustability.

[0082] The distribution plate 504 can be directly fastened to the perforated nozzle 502, or the thermally conductive layer (one example of which is shown) can be used instead. Figure 2B A nozzle (550, 552) is disposed between a distribution plate 504 and a multi-hole nozzle 502. The distribution plate 504 includes holes 560 disposed throughout the body 532. The body 532 may have any number of holes. The holes 560 are positioned above the cavities 550, 552, extending from the top to the bottom of the distribution plate 504, and facilitate the extraction of air from the inflation section (e.g., the multi-hole nozzle 502). Figure 2B The fluid received within the inflation section 206 is distributed to the orifice nozzle 502. The annular portions 510, 511, 512 and the cavities 550, 552 define the arched and fan-shaped areas of the orifice nozzle 502. Fluid is supplied to the cavities 550, 552 through the orifices 560 and is evenly distributed throughout the arched and fan-shaped areas within the cavities 550, 552.

[0083] The porous showerhead 502 and / or the distribution plate 504 can include holes 570, 572 for fastening the porous showerhead 502 to the distribution plate 504 via fasteners. For example, a screw can extend through the hole 570 and be screwed into the hole 572, which can have threads. The hole 570 is laterally aligned with the hole 572.

[0084] While certain exemplary showerhead assemblies having certain porous showerheads and certain distribution plates are shown in Figures 2A-5C other showerhead assemblies including other porous showerheads and distribution plates can be formed using the methods disclosed herein, some of which are described below.

[0085] Figure 6 A 3D printing system 600 for manufacturing a porous showerhead 601 (e.g., any of the porous showerheads disclosed herein) is shown. The 3D printing system 600 can be implemented as a thermal inert 3D printer. The 3D printing system 600 includes a vacuum chamber 602. The vacuum chamber 602 includes a first (or build) plate 604 and a second plate (or powder bed) 606. The first plate 604 supports a substrate 608 on which the showerhead is printed layer by layer. The second plate 606 is used to store a non-metallic material 609, such as silicon powder. In one embodiment, the second plate 606 holds silicon powder that includes spherical particles each having an outer diameter of 20-100 pm. The plates 604, 606 are moved vertically up and down via respective first and second actuator assemblies 610, 612 and via respective shafts 614, 616.

[0086] A dosing rod (or powder wiper) 618 feeds the non-metallic material 609 to the substrate 608 prior to printing each layer. The vacuum chamber 602 also includes a viewing window 620, which can be coated with a film to reduce heat loss. An external heater 622 is configured above the substrate 608 and is used to heat a region 624 above the substrate 608 and to help provide uniform heating to the layer being printed, prevent temperature gradients, and help prevent cracking of the resulting part (e.g., the porous showerhead) being formed. Another heater 626 is configured on the build plate 604. The heaters 622 and 626 can be used to heat the substrate 608 and the layers formed thereon. An insulator 628 is configured between the heater 626 and the build plate 604. The insulator 628 can be a rigid carbon insulator.

[0087] The 3D printing system 600 also includes a laser assembly 629, which includes one or more lasers 630 that project laser beams 632 onto the layers of the porous showerhead being formed during printing. Each laser beam 632 can pass through one or more lenses 634 and be reflected downward by a mirror 636 toward the layer of the porous showerhead being formed. Because the mirror 636 moves and is used to scan the laser beams 632 in X and Y horizontal (or lateral) directions across the upper surface of the porous showerhead 601, it can be referred to as an X-Y scan mirror. The laser beams 632 provide localized heating to partially or fully melted portions of each layer being printed to form the porous showerhead 601. A motor 637 can be included to adjust the tilt angle of the mirror 636.

[0088] When two laser beams are produced, one laser beam can operate at a high energy level (2-12 microjoules (μJ) per μm 2 ) and is used to melt and solidify silicon particles together, while the other laser can operate at a low energy level (0.2-10 microjoules (μJ) per μm 2 ) and is used to partially melt to provide a porous region. When partially melted, the particles are melted enough to partially bond together, and at the same time leave gaps between the particles to form pores in the layers being formed and extended pores in the stack of layers being formed to provide a porous showerhead. The more solidified, the lower the porosity and the higher the density of the region.

[0089] The actuator assemblies 610, 612, the powder wiper 618, the heaters 622, 626, the lasers 630, the motor 637, and the video camera 638 are controlled by a controller 640. The video camera 638 monitors the position of the laser beams 632 on the top surface of the porous showerhead 601. The controller 640 controls the raising and lowering of the second plate 606 relative to the vertical position of the build plate 604 to adjust the vertical position of the second plate 606 and thereby the amount of material being wiped from the second plate 606 to the build plate 604.

[0090] The operation of the 3D printing system is further explained below with respect to the method of Figure 8 .

[0091] Figure 7 A substrate processing system 700 is shown, which includes a substrate support 701 (which is shown as an electrostatic chuck), and a showerhead assembly 702. The substrate support 701 can include a cooling assembly 703, and the showerhead assembly 702 can include a temperature control assembly 704, which includes one or more cold (or cooling) plates (one cold plate 705 is shown) and one or more hot plates (one hot plate 706 is shown).

[0092] Although Figure 7A capacitively coupled plasma (CCP) system is shown, although the embodiments disclosed herein can be applied to transformer coupled plasma (TCP) systems, inductively coupled plasma (ICP) systems, and / or other processing systems including a substrate support and a plasma source. The substrate processing system can be applied to dry etch processing systems and other processing including a showerhead and / or substrate support. In the example shown, the substrate support 701 includes a body 707. The body 707 can be formed of different materials and / or different ceramic compositions. The body 707 can include, for example, aluminum, aluminum alloy, aluminum nitride (AIN3), aluminum oxide (AI2O3), and / or aluminum oxynitride (AI ON).

[0093] The substrate processing system 700 includes a processing chamber 708. The substrate support 701 is enclosed within the processing chamber 708. The processing chamber 708 also encloses other components, such as an upper electrode (or a perforated showerhead) 709, and houses an RF plasma. During operation, a substrate 710 is disposed on and electrostatically clamped to the substrate support 701.

[0094] The showerhead assembly 702 includes a plenum 711 and a distribution plate 712 that introduce and distribute a gas via the perforated showerhead 709. The perforated showerhead 709 can be provided as any of the perforated showerheads disclosed herein, such as Figure 2B shown. The plenum 711 can be provided as any of the plenums disclosed herein, such as Figures 2A-5C shown. The distribution plate 712 can be provided as any of the distribution plates disclosed herein, such as Figures 2A-5C shown.

[0095] The showerhead assembly 702 also includes a stem portion 713 that includes one end that is connected to a top surface of the processing chamber 708. The plenum 711, the distribution plate 712, and the showerhead 709 collectively form a cylinder. The showerhead 709 extends radially outward at a location that is at an end of the stem portion 713 that is opposite the top surface of the processing chamber 708. The showerhead 709 includes extended apertures through which process gas or purge gas and / or other fluids flow. The showerhead assembly 702 can include a hot plate 706 that is disposed on the distribution plate 712. A cold plate 705 can be disposed on the hot plate 706.

[0096] In one embodiment, the substrate support 701 can include one or more gas passages 714 for flowing a backside gas to a backside of the substrate 710. The cooling assembly 703 receives coolant from a pump 716. The cold plate 705 can also receive coolant from the pump 716.

[0097] A temperature controller 715 controls the operation of a pump 716, thereby controlling the flow and temperature of coolant to and from the cooling assembly 703 and the cold plate 705. The pump 716 can circulate coolant between i) a reservoir 717 and ii) the cooling assembly 703 and the cold plate 705. Although a single pump 716 is shown, two or more pumps can be included. In one embodiment, each of the cooling assembly 703 and the cold plate 705 includes a single coolant input and a single coolant output. In other embodiments, each of the cooling assembly 703 and the cold plate 705 includes multiple coolant inputs and outputs. A valve assembly 718 can be disposed between the pump 716 and the cooling assembly 703 and the cold plate 705 and controlled by the temperature controller 715. Multiple pairs of supply and return lines can be connected between (i) one or more pumps and the cooling assembly 703 and the cold plate 705, and / or (ii) the valve assembly 718 and the cooling assembly 703 and the cold plate 705.

[0098] An RF generation system 720 generates RF voltages and outputs the RF voltages to the upper electrode 709 and one or more lower electrodes 719 in the substrate support 701. One of the upper electrode 709 and the substrate support 701 can be DC grounded, AC grounded, or at a floating potential. By way of example only, the RF generation system 720 can include one or more RF generators 722 (e.g., capacitively coupled plasma RF power generators, bias RF power generators, and / or other RF power generators) that generate RF voltages that are fed to the upper electrode 709 and / or the substrate support 701 through one or more matching and distribution networks 724. An electrode that receives RF signals, RF voltages, and / or RF power is referred to as an RF electrode. For example, a plasma RF generator 723, a bias RF generator 725, a plasma RF matching network 727, and a bias RF matching network 729 are shown. The plasma RF generator 723 can be a high power RF generator that generates, for example, 6-10 kilowatts (kW) or more. The bias RF matching network supplies power to an RF electrode, such as the RF electrode 719.

[0099] The gas delivery system 730 includes one or more gas sources 732-1, 732-2,... and 732-N (collectively, gas sources 732), where N is an integer greater than zero. The gas sources 732 supply one or more precursors and gas mixtures thereof. The gas sources 732 can also supply etching gases, carrier gases, and / or purge gases. Vaporized precursors can also be used. The gas sources 732 are connected to a manifold 740 by valves 734-1, 734-2,... and 734-N (collectively, valves 734) and mass flow controllers 736-1, 736-2,... and 736-N (collectively, mass flow controllers 736). The output of the manifold 740 is fed to the processing chamber 708. By way of example only, the output of the manifold 740 is fed to a showerhead.

[0100] Although shown separate from the system controller 760, the temperature controller 715 can be implemented as part of the system controller 760. The substrate support 701, the cooling assembly 703, the temperature control assembly 704 can include multiple temperature control zones, where each zone includes a temperature sensor and a set of channels. The temperature controller 715 can monitor the temperature as indicated by the temperature sensors and adjust the flow rate and / or temperature of the coolant circulating through one or more sets of channels to adjust the temperature to a target temperature. The temperature sensors, as well as other temperature sensors, are represented by temperature sensors 743. Although the temperature sensors 743 are shown as connected to the processing chamber 708, at least some of the temperature sensors 743 are disposed within the processing chamber 708. The temperature sensors 743 can include resistance temperature devices, thermocouples, digital temperature sensors, and / or other suitable temperature sensors.

[0101] The substrate processing system 700 can also include a power supply 744 that provides power, including high voltage, to the clamp electrode 731 to electrostatically clamp the substrate 710 to the substrate support 701. The clamp electrode receives power to electrostatically clamp the substrate 710 down on the substrate support 701 and can receive RF signals, RF voltages, and / or RF power. The power supply 744 can be controlled by the system controller 760.

[0102] The substrate processing system 700 can also include a backside vacuum controller 752. The backside vacuum controller 752 can receive gas from the manifold 740 and supply the gas to the channels 714 and / or the pump 758. This improves the transfer of heat between the substrate support 701 and the substrate 710. Backside gas can also be provided to improve substrate edge cleaning and vacuum tracking of the position of the substrate. The channels 714 can be supplied by one or more injection ports. In an implementation, multiple injection ports are included to improve cooling. By way of example, the backside gas can include helium.

[0103] A temperature controller 715 can control operation of the pump 716 and / or other coolant circulation pumps and / or valve assembly 718 based on detected parameters from some of the temperature sensors 743 within the processing chamber 708. A backside vacuum controller 752 controls the flow rate of backside gas (e.g., helium) to the passages 714 by controlling the flow from one or more of the gas sources 732 to the passages 714 to cool the substrate 710. The backside vacuum controller 752 controls the pressure and flow rate of the gas supplied to the passages 714 based on detected parameters from the temperature sensors 743. In one implementation, the temperature controller 715 and the backside vacuum controller 752 are implemented as a combined single controller. During deposition processing, the substrate 710 can be heated in the presence of a high power plasma. The flow of gas through the gas passages 714 can reduce the temperature of the substrate 710.

[0104] Valves 756 and pumps 758 can be used to evacuate reactants from the processing chamber 708. A system controller 760 can control components of the substrate processing system 700, including controlling the level of RF power supplied, the pressure and flow rate of gases supplied, RF matching, etc. The system controller 760 controls the state of the valves 756 and pumps 758. A robot 764 can be used to transport substrates onto the substrate support 701 and remove substrates from the substrate support. For example, the robot 764 can carry substrates between the substrate support 701 and a load lock 766. The robot 764 can be controlled by the system controller 760. The system controller 760 can control operation of the load lock 766.

[0105] Valves, gas pumps, power supplies, RF generators, etc. referred to herein can be referred to as actuators. Passages, gas passages, etc. referred to herein can be referred to as temperature adjustment elements.

[0106] In the example shown, the electrodes 719, 731 are configured in the uppermost of the layers of the substrate support 701. The cooling assembly 703 is configured in one or more of the other layers of the layers. Although a single cooling assembly is shown, the body 707 can include any number of cooling assemblies and / or passage assemblies configured in any number of passage layers, where each layer can include any number of passages having various sizes, shapes, layout patterns, and dimensions.

[0107] Figure 8 A method for manufacturing a porous showerhead is shown, which can be performed by Figure 6The 3D printing system 600 of FIG. 1 can be used to form a porous nozzle. The porous nozzle can be formed by the controller 640 of FIG. 1 executing the method of FIG. 8. The porous nozzle can be any of the porous nozzles described above and / or any of the porous nozzles described below. The overall thickness of the porous nozzle can be 3-30 mm. The overall outer diameter of the porous nozzle can be 150-450 mm. For example, if the overall outer diameter of the porous nozzle is 300 mm and the overall thickness is 10 mm, then the porous nozzle can have more than 10 million extended pores. The operations of FIG. 8 can be performed repeatedly and can be performed by the controller 640 of FIG. 1. Figure 6

[0108] At 800, to form the porous nozzle, a computer aided design (CAD) file can be loaded into the controller 640. The file can include nozzle dimensions, layer thickness, number of layers, inner diameter of pores (or extended pores), porosity and / or density levels of different regions, laser energy density values, laser beam exposure time for each layer being formed, temperature of the region above the nozzle being formed, temperature of the substrate 608, and / or the like.

[0109] The pore size (inner diameter of each pore and / or extended pore) of each layer and / or the entire nozzle (which can be 0-70 μιη) and the porosity level (e.g., 0-20%) can be controlled by i) the diameter of the silicon particles used, ii) the laser energy density, and / or iii) the amount of silicon powder surface melting. In an embodiment, the pore size is 0-60 μιη. For example, smaller diameter powder and lower laser energy density can be used to obtain smaller pore size and greater porosity. Larger diameter powder particles and higher laser energy density can be used to obtain large pore size and smaller porosity. Higher laser energy density can be used to melt the silicon powder to provide a thicker solidified "skin" layer to obtain small pore size and small porosity. The skin layer refers to the uppermost solidified layer. As another example, by partially melting silicon spherical particles having a diameter of 20-60 μιη, the pore size can be 10-40 μιη. As yet another example, by partially melting silicon spherical particles having a diameter of 45-90 μιη, a pore size of 30-60 μιη can be provided.

[0110] At 802, silicon powder is loaded onto the second plate 606. The silicon powder can include silicon particles having a diameter of 20-100 μιη. At 804, if the substrate 608 is not already on the build plate 604, the substrate can be placed on the build plate 604. The substrate 608 can be formed of silicon. At 806, the controller 640 increases the temperature of the substrate 608 to 200-1 100 °C at a set ramp rate.

[0111] At 808, the controller 640 scrapes a layer of silicon powder from the powder bed onto the substrate 608. This can include raising the powder bed 606 and lowering the build plate 604.​

[0112] At 810, the controller 640 forms a buffer layer by fusing a layer of silicon powder on the substrate 608 to print the buffer layer on the substrate 608.

[0113] At 812, the controller 640 scrapes another layer of silicon powder from the powder bed 606 to the build plate 604. This can include raising the powder bed 606 and lowering the build plate 604.

[0114] At 814, the controller 640 prints a component (or ejection) layer on the buffer layer or a previously formed component layer. This is done by at least partially fusing and fully melting selected portions of the last coated layer of silicon powder. Different energy levels are used for partial fusion and full fusion. The one or more lasers 630 can scan the entire coated silicon layer in the X and / or Y direction in a predetermined pattern and have an energy level of 0.2-12 μJ / μm 2 , to at least partially fuse the surface of the coated layer in the area receiving the corresponding one or more laser beams. For example, the temperature of the silicon when fused can be 1400 °C. In the area receiving the one or more laser beams, the silicon particles can partially or fully fuse together. The gaps between the silicon particles become pores and / or further extend the current extended pores. For the subsequently formed component layers, the pores of each layer are laterally aligned with the pores of each previous layer to provide connected (or extended) pores. The extended pores allow fluid, including gas and liquid, to travel from the top side of the resulting porous ejection to the bottom side of the resulting porous ejection.

[0115] At 816, the controller 640 determines whether another component layer is to be printed. If yes, operation 814 is repeated, otherwise operation 818 is performed. Operations 814 and 816 are repeatedly repeated until all of the component layers are formed.

[0116] At 818, the controller 640 anneals the resulting porous ejection at a temperature of 1000-1300 °C. This can be done while the porous ejection is on the build plate.

[0117] At 820, the controller 640 reduces the temperature of the porous ejection to ambient temperature at a set cooling rate. For example, the cooling rate can be less than 200 °C per hour.

[0118] At 822, the porous ejection is removed from the substrate 608 along the buffer layer. At 824, the porous ejection can be machined and cleaned to provide a finished ejection that can be implemented as an ejection electrode in a substrate processing system.

[0119] The above operations can be modified and / or replaced with other operations. See the following exemplary alternatives. An alternative to using a laser beam includes using an electron beam to partially melt or fully melt a spherical dense silicon powder in a layer-by-layer fashion to form a porous showerhead electrode. As another alternative, the heaters 622, 626 of Figure 6

[0120] As another alternative, instead of silicon powder, a laser 3D printing can be used with spherical dense quartz or alumina powder to form a porous showerhead. As yet another alternative, the silicon porous showerhead is formed with a set resistivity.

[0121] For example, the porous showerheads referred to herein can be formed with a resistivity of 0.5 milli-Ohm-centimeter (mΩ-cm) to 3 Ω-cm and a doping level of, for example, 2.32E+20 atoms / cm 3 to 4.55E+15 atoms / cm 3 The resistivity levels described can be provided in place of a high resistivity (e.g., greater than 10 Ohm-cm) and a doping level of, for example, 1.32E+15 atoms / cm 3 In an embodiment, the doping level refers to the concentration level of boron provided in the silicon powder to the 3D printing system 600 used to form the porous showerhead.

[0122] In an embodiment, a uniform porous showerhead is formed. One alternative to forming a uniform porous showerhead is to form a porous showerhead by forming and stacking dense solid lattices or concentric rings to divide the porous showerhead into a number of zones. The solid lattices or concentric rings provide increased mechanical strength and a number of thermal contacts with the distribution plate. During 3D printing, threaded holes can be formed in the dense solid lattices or rings. An electron beam can be used as the printing energy source in place of a laser beam. A printer that generates a laser beam or an electron beam can be used as the energy source for pre-heating, post-heating, and annealing the porous part. The material used to form the porous showerhead can include spherical dense quartz or alumina powder.

[0123] Figure 9 ​A porous showerhead 900 is shown that includes a solid grid 902 with grid lines 903 and porous columns 904. Each layer of the porous showerhead 900 includes a solid grid and a plurality of porous columns. The solid grids of the layers of the porous showerhead 900 are laterally aligned with each other and stacked to provide the solid grid 902 that extends from the top of the porous showerhead 900 to the bottom of the porous showerhead 900. Likewise, the porous regions (or portions) of the layers between the grid lines of the grids are laterally aligned with each other and stacked to provide the columns 904. The solid grid 902 has a low porosity and a high density, while the columns 904 have a high porosity and a low density. In one embodiment, the porous columns 904 have a cross-sectional area of 100 μm x 100 μm.

[0124] The porous showerhead 900 includes an annular outer portion 910 and a circular inner portion 912 that includes the solid grid 902 and the columns 904. The annular outer portion 910 can be solid, and thus not porous, and includes holes 914 for connecting the porous showerhead 900 to a distribution plate. The columns 904 can be spaced 200 μm apart from each other, for example.

[0125] The method of Figure 8 may be used to form the porous showerhead 900, where each layer includes the formation of the grid lines and the column regions between the grid lines. For example, a first laser with a first energy setting can be used to form the grid lines, and a second laser with a second energy setting can be used to form the column regions, the second energy setting being lower than the first energy setting. To form the layers of the porous showerhead 900, the temperature of the substrate 608 of Figure 6 may be set to 700 °C - 1000 °C. For example, when a single laser is used, each layer can be formed by scanning columns, and then scanning rows of the layer. When scanning the columns, a first column is scanned with a first energy setting, and then the next column is scanned with a second energy setting. This alternating process is continued for additional columns, and then similarly repeated to form the rows by scanning in a direction perpendicular to the columns. The first energy setting can be used to form the solid grid lines, and the second energy setting can be used to form the porous column regions of each layer.

[0126] Figure 10A side cross-sectional view of a portion 1000 of a porous showerhead showing an overall thickness Tl and a layer thickness T2. The portion 1000 shows layers 1002 that are partially fused together during formation. The portion 1000 can represent a portion of any of the porous showerheads disclosed herein. The portion 1000 can have any number of layers. For example, the thickness Tl can be greater than 5 mm. By way of example, the thickness Tl can be 10 mm or greater. The thickness T2 of each layer depends on the size (or diameter) of the particles used to form each layer. For example, the thickness T2 can be 1-3 times the maximum diameter of the particles. As another example, the thickness T2 can be greater than the maximum diameter of the particles but less than twice the maximum diameter. In one embodiment, the thickness T2 is 30-100 μm, where the diameter of the portion is 20 μm-100 μm. In another embodiment, the thickness T2 is 30 μm.

[0127] The layers 1002 include an uppermost layer 1004 and a bottommost layer 1006. The uppermost layer 1004 includes a porous upper surface 1008 and the bottommost layer 1006 includes a porous bottom surface 1010. The dashed lines 1012 are provided to show the different layers 1002, but after bonding, the layers 1002 form a single structure.

[0128] Figure 11 A side cross-sectional view of a porous showerhead 1100 including vertical porous regions 1102 that include partially fused particles and a number of extended pores extending from a top surface 1104 to a bottom surface 1106. The vertical porous regions 1102 are located between non-porous regions 1108. The porous showerhead 1100 can be formed using the method of Figure 8 wherein each of the regions 1102, 1108 is formed layer-by-layer. For example, each of the regions 1102, 1108 can have a width of 100 μm.

[0129] Figure 12 A side cross-sectional view of a porous showerhead 1200 including diagonal (or zigzag) porous regions 1202 that include partially fused particles and a number of extended pores extending from a top surface 1204 to a bottom surface 1206. The diagonal porous regions 1202 are located between non-porous regions 1208. The porous showerhead 1200 can be formed using the method of Figure 8 wherein each of the regions 1202, 1208 is formed layer-by-layer. For example, each of the regions 1202, 1208 can have a width of 100 μm.

[0130] The above disclosed examples provide a porous showerhead with a large number of extended apertures. The extended apertures are defined by partially fused particles. The extended apertures can be uniformly distributed across each porous showerhead and / or portions of each porous showerhead. As another example, a porous showerhead can have a diameter of 300 mm and be 10 mm thick, and have an aperture size of less than 40 pm. A porous showerhead can have more than 1 million extended apertures. The porous showerhead does not exhibit residual stress and is crack resistant. The porous showerhead can be utilized in a dielectric etch chamber and / or other processing chambers. The porous showerhead can be used for high power applications.

[0131] The above 3D printing method allows for the formation of thick porous showerheads (e.g., greater than 5 mm thickness) by repeated layer-by-layer partial fusion processing, which is limited only by the depth of the powder bed. The disclosed method overcomes the limitations of chemical etching, which is extremely difficult to implement to form apertures with high aspect ratios. The disclosed porous showerheads reduce the risk of light emission for high power plasma etching applications. This is because the porous showerheads allow gas molecules to pass through, but block emitted light and are very effective at absorbing free electrons. The porous showerheads help to deliver gas uniformly across the entire substrate being processed and reduce the pressure differential between the top and bottom sides of the porous showerhead. The porous showerheads with a solid center grid or concentric rings that divide the porous showerhead into multiple zones provide improved mechanical strength, more thermal contact, and gas flow tunability, which compensates for critical dimension non-uniformity of the substrate and non-uniformity of the plasma.

[0132] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, specification, and claims. It should be understood that one or more steps within a method can be executed in different order (or concurrently) without altering the principles of the

[0133] Various terminology is used to describe spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) as well as relationships between elements. The terms "connected," "coupled," "adjacent," "next to," "on top of," "above," and "below" are used broadly and encompass both direct and indirect spatial and functional relationships. Unless the context clearly dictates otherwise, the relationship between first and second elements described in the above disclosure can be a direct relationship, in which no other intervening elements are present between the first and second elements, but can also be an indirect relationship, in which one or more intervening elements are present between the first and second elements (spatially or functionally). As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logical (OR) using non-exclusive logical OR (A or B or C), and should not be interpreted to mean "at least one of A, and at least one of B, and at least one of C."

[0134] In some implementations, a controller is part of a system, which can be part of the above-described examples. Such systems can include semiconductor processing equipment including one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems etc.). These systems can be integrated with electronics for controlling the operations of the systems before, during, and after processing of semiconductor wafers or substrates. The electronics can be referred to as the "controller," which can control various components of the system or subsystems thereof. The controller can be programmed to control any of the processes disclosed herein including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfer into and out of the tool and other transfer tools and / or load locks connected to or interfaced with the specific system.

[0135] Generally, a controller can be defined as electronics having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpointing measurements, and the like. The integrated circuits can include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions can be instructions (or software) that define the operations of the controller, and are typically stored in memory (e.g., RAM, flash, etc.). The software can be stored in non-volatile memory during manufacturing of the controller, and then transferred to volatile memory during use. The software can include instructions for enabling the controller to control the processing of a substrate, such as a semiconductor wafer. The software can include instructions that define the processing parameters for one or more processing steps, including the parameters for the operation of the processing tool, the parameters for the operation of the substrate handling equipment, and the parameters for the processing of the substrate during a given process step. The software can include instructions for enabling the controller to control the processing of multiple substrates through multiple process steps and / or multiple processing tools. The software can include instructions for enabling the controller to receive input from an operator, such as the selection of a process recipe for processing one or more substrates. The software can include instructions for enabling the controller to communicate with one or more of the components of the processing tool, the substrate handling equipment, and the measurement tools. The software can include instructions for enabling the controller to monitor the processing of one or more substrates through multiple process steps and / or multiple processing tools.

[0136] In some implementations, the controller can be part of, or coupled to, a computer that is integrated with, coupled to, otherwise networked to, or a combination thereof, the system. For example, the controller can be in the "cloud" or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer can enable remote access to the system to monitor the current progress of manufacturing operations, examine a history of past manufacturing operations, examine performance standards or trends of multiple manufacturing operations, to change parameters of current processing, set processing steps to follow a current processing, or to start a new processing. In some examples, a remote computer (e.g., a server) can provide processing recipes to the system over a network, which can include a local network or the Internet. The remote computer can include a user interface that enables entry or programming of parameters and / or settings, which are then transmitted to the system from the remote computer. In some examples, the controller receives instructions in the form of data that specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters can be specific to the type of process being performed and the type of tool that the controller is configured to interface with or control. Thus as described above, the controller can be distributed, such as by including one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such a purpose would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located off the chamber, such as in a remote location, that combine to control processing on the chamber.

[0137] An exemplary system can include, but is not limited to, a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that can be associated with or used in the fabrication and / or manufacturing of semiconductor wafers.

[0138] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.

Claims

1. A porous showerhead comprising: a porous top surface; a porous bottom surface; and a plurality of layers stacked between the porous top surface and the porous bottom surface, the plurality of layers configured to be connected to a distribution plate of a showerhead assembly of a substrate processing system, an uppermost layer of the plurality of layers having the porous top surface, a lowermost layer of the plurality of layers having the porous bottom surface, each layer of the plurality of layers comprising particles partially fused to form pores, the pores of the plurality of layers satisfying at least one of lateral alignment with pores in one or more adjacent layers of the plurality of layers and fluidic coupling with pores in one or more adjacent layers of the plurality of layers to provide an extended pore, and the extended pore extending from the porous top surface to the porous bottom surface.

2. The porous showerhead of claim 1, wherein the extended pore is not mutually exclusive but shares the pores of the plurality of layers.

3. The porous showerhead of claim 1, wherein at least one of: a thickness of each layer of the plurality of layers is equal to 1-3 times a diameter of a particle of the layer; and a maximum thickness of each layer of the plurality of layers is twice a maximum diameter of a particle of the layer.

4. The porous showerhead of claim 1, wherein at least one of: a thickness of each layer of the plurality of layers is 30 pm-100 pm; and each particle of the particles has a diameter of 20 pm-100 pm.

5. The porous showerhead of claim 1, wherein the particles are at least one of spherical particles and silicon particles.

6. The porous showerhead of claim 1, wherein the plurality of layers comprises more than 1,000 extended pores per square centimeter.

7. The porous showerhead of claim 1, wherein an overall thickness of the plurality of layers is greater than 5 mm.

8. The porous showerhead of claim 1, wherein at least one of: a resistivity of the plurality of layers is 0.5 mW-cm to 3 W-cm; and The particles have a doping level of 2.32E+20 atoms / cm 3 from 4.55E+15 atoms / cm 3 .

9. The multi-hole showerhead of claim 1, wherein the doping level of the grains is 2.32E+20 atoms / cm 3 to 4.55E+15 atoms / cm 3 .

10. The porous showerhead of claim 1, wherein each layer of the plurality of layers comprises an annular outer portion having a higher density and a lower porosity than another portion located radially inward of the annular outer portion.

11. The porous showerhead of claim 1, wherein: the plurality of layers comprises: an annular outer portion, and a circular inner portion configured radially inward of the annular outer portion and having a lower density and a higher porosity than the annular outer portion; and the annular outer portion comprises a hole for connecting the plurality of layers to the distribution plate.

12. The porous showerhead of claim 1, wherein the plurality of layers comprises: a first plurality of annular portions; and a second plurality of annular portions each configured between two of the first plurality of annular portions, the second plurality of annular portions having a lower density and a lower porosity than the first plurality of annular portions.

13. The porous showerhead of claim 12, wherein the plurality of layers includes a circular inner portion that is radially inward of the first plurality of annular portions and has the same density and porosity as the second plurality of annular portions.

14. The porous showerhead of claim 12, wherein the first plurality of annular portions includes holes for connecting the plurality of layers to the distribution plate.

15. The porous showerhead of claim 1, wherein the plurality of layers includes a plurality of porous regions, each of the plurality of porous regions being between a pair of non- porous regions.

16. The porous showerhead of claim 1, wherein the plurality of layers includes: a grid having a first density and a first porosity; and a plurality of columns defined by the grid, the plurality of columns having a second density and a second porosity, the second density being less than the first density and the second porosity being greater than the first porosity.

17. The porous showerhead of claim 1, wherein the plurality of layers includes at least one of i) vertical porous regions and ii) oblique porous regions that extend from the porous top surface to the porous bottom surface.

18. A showerhead assembly comprising: the porous showerhead of claim 1; and the distribution plate connected to the porous showerhead and arranged to distribute fluid to the uppermost of the plurality of layers.

19. The showerhead assembly of claim 18, wherein the distribution plate includes: a body; and an annular outer member extending downward from the body and defining a cavity between the body and the porous showerhead.

20. The showerhead assembly of claim 19, wherein the distribution plate includes a plurality of holes extending downward from a top of the distribution plate to a bottom of the distribution plate and arranged to supply fluid to the cavity.

21. The showerhead assembly of claim 19, wherein: the porous showerhead includes an annular outer portion that is laterally aligned with and connected to the annular outer member; and the annular outer portion is not porous.

22. The showerhead assembly of claim 18, wherein the distribution plate includes: a body; and a plurality of annular members extending downward from the body and defining a cavity between the body and the porous showerhead.

23. The showerhead assembly of claim 22, wherein the plurality of annular members extend downward to a porous portion of the porous showerhead.

24. The showerhead assembly of claim 22, wherein the plurality of annular members extend downward to and are connected to a first plurality of annular portions of the porous showerhead.

25. The showerhead assembly of claim 24, wherein the distribution plate includes a plurality of holes extending downward from a top of the distribution plate to a bottom of the distribution plate and arranged to supply fluid to a plurality of cavities defined by the plurality of annular members. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 26. The showerhead assembly of claim 24, wherein the porous showerhead includes a second plurality of annular portions, each of the second plurality of annular portions is configured between two of the first plurality of annular portions, and is porous.

27. The showerhead assembly of claim 22, wherein: the distribution plate further includes a plurality of cross members extending downward from the body to the porous showerhead; and the distribution plate includes a plurality of holes extending downward from a top of the distribution plate to a bottom of the distribution plate and arranged to supply fluid to a plurality of cavities at least partially bounded by the plurality of cross members.

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