Measurement device and measurement method

Abstract

A measuring device is provided. The measurement apparatus includes: a virtual image generation unit configured to generate a virtual image based on a plurality of layers shown in a design drawing; a reference measurement region determination unit for determining a reference measurement region to be measured in the virtual image; a target measurement region detection unit for detecting a target measurement region corresponding to the reference measurement region from a measurement target including a plurality of layers patterned based on the design drawing; and a measurement unit for measuring the target measurement region on the basis of the reference measurement region.

Description

TECHNICAL FIELD

[0001] The disclosure relates to a measurement device and a measurement method. BACKGROUND

[0002] With the rapid spread of information media such as computers, electronic devices or semiconductor devices are also rapidly developing. Manufacturing technology for semiconductor devices is continuously developed so that integration, reliability, response time, etc. are improved. According to this trend, each unit process is being developed to secure a high yield, and at the same time, methods and devices for measuring process errors in each unit process are being researched in order to enhance competitiveness in the semiconductor industry. SUMMARY

[0003] [TECHNICAL PROBLEM]

[0004] The disclosure to be solved is to provide a measurement device and a measurement method capable of saving manufacturing costs and time and having reliability.

[0005] The tasks of the present invention are not limited to the above-mentioned tasks, and other technical tasks not mentioned will be clearly understood by those skilled in the art from the following description.

[0006] [TECHNICAL SOLUTION]

[0007] A measurement device for solving the problem according to one embodiment of the disclosure includes a virtual image generator configured to generate a virtual image based on a plurality of layers shown in a layout map; a reference measurement area determiner configured to determine a reference measurement area to be measured in the virtual image; a target measurement area detector configured to detect a target measurement area corresponding to the reference measurement area from a measurement target including a plurality of layers patterned based on the layout map; and a measurer configured to measure the target measurement area based on the reference measurement area.

[0008] The virtual image generator can be configured to pre-process an image including the plurality of layers shown in the layout map to generate a pre-processed image, capture an image of the plurality of layers stacked based on the layout map to acquire an actually captured image, and generate a first virtual image based on the pre-processed image and the actually captured image.

[0009] The virtual image generator can generate the first virtual image by adjusting a loss of the pre-processed image and a loss of the actually captured image such that a loss of the first virtual image is reduced, as represented in the following equation:

Equation

[0010] wherein L denotes a loss of the first virtual image, a denotes a weight of the pre-processed image, L1 denotes a loss of the pre-processed image, β denotes a weight of the actually captured image, and L2 denotes a loss of the actually captured image.

[0011] The target measurement region detector can detect a target measurement region corresponding to the reference measurement region of the first virtual image from the measurement target in which the photoresist is developed.

[0012] The virtual image generator can extract a two-dimensional image by separating the plurality of layers shown in the layout from each other, can integrate the two-dimensional image, can classify the integrated two-dimensional image by type of different overlay layers, and can perform image mapping for each of the different overlay layers to generate the second virtual image.

[0013] The virtual image generator can generate the second virtual image by performing image mapping and then performing blur processing for each of the different overlay layers.

[0014] The target measurement region detector can detect a target measurement region corresponding to the reference measurement region of the second virtual image from the measurement target after etching of the measurement target is completed using the developed photoresist and the photoresist has been washed.

[0015] The target measurement region detector can perform pattern matching of the measurement target based on the reference measurement region to detect a target measurement region satisfying a predetermined degree of matching.

[0016] The measurer can perform pattern measurement of at least one of coverage, refractive index, and thickness based on the reference measurement region to measure a line width, a hole, or an area of the target measurement region.

[0017] The target measurement region detector can remove noise from the actually captured image of the measurement target, and can detect a target measurement region corresponding to the reference measurement region from the actually captured image after the noise is removed.

[0018] A measurement method for solving a problem according to one embodiment of the disclosure includes generating a virtual image based on a plurality of layers shown in a layout, determining a reference measurement region to be measured in the virtual image, detecting a target measurement region corresponding to the reference measurement region from a measurement target including a plurality of layers patterned based on the layout, and measuring the target measurement region based on the reference measurement region.

[0019] Generating the virtual image can include pre-processing an image including the plurality of layers shown in the layout to generate a pre-processed image, capturing an image of the plurality of layers stacked based on the layout to obtain an actually captured image, and generating a first virtual image based on the pre-processed image and the actually captured image.

[0020] Generating the virtual image can include generating the first virtual image by adjusting a loss of the pre-processed image and a loss of the actually captured image such that the loss of the first virtual image is reduced, as expressed in the following equation: [Equation]

[0021] where L denotes the loss of the first virtual image, a denotes a weight of the pre-processed image, L1 denotes the loss of the pre-processed image, β denotes a weight of the actually captured image, and L2 denotes the loss of the actually captured image.

[0022] Detecting the target measurement region can include detecting a target measurement region corresponding to a reference measurement region of the first virtual image from a measurement target in which a photoresist is developed.

[0023] Generating the virtual image can include extracting a two-dimensional image by separating a plurality of layers shown in a layout map from each other, integrating the two-dimensional image to classify the integrated two-dimensional image by type of different overlaid layers, and performing image mapping for each of the different overlaid layers to generate a second virtual image.

[0024] Generating the virtual image can include generating the second virtual image by performing image mapping and then performing blur processing for each of the different overlaid layers.

[0025] Detecting the target measurement region can include detecting a target measurement region corresponding to a reference measurement region of the second virtual image from a measurement target after etching of the measurement target is completed using the developed photoresist and the photoresist has been cleaned.

[0026] Detecting the target measurement region can include performing pattern matching of the measurement target based on the reference measurement region to detect a target measurement region satisfying a predetermined degree of matching.

[0027] The measurement target measurement region can include pattern measurement of at least one of a coverage, a refractive index, and a thickness based on the reference measurement region to measure a line width, a hole, or an area of the measurement target measurement region.

[0028] Detecting the target measurement region can include removing noise from an actually captured image of the measurement target and detecting a target measurement region corresponding to the reference measurement region from the actually captured image after the noise is removed.

[0029] Specific details of other embodiments are included in the detailed description and the accompanying drawings.

[0030] [Technical Effects]

[0031] According to the measurement apparatus and the measurement method according to the embodiments, generating a virtual image to determine a reference measurement region can be completed before measurement, and after development inspection (ADI) and after cleaning inspection (ACI) can be repeated for each layer during a manufacturing process. Accordingly, the measurement apparatus and the measurement method can save manufacturing costs and time and have reliability.

[0032] Effects according to the embodiments are not limited to those described above, and include more various effects in the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is a block diagram for illustrating a measurement apparatus according to an embodiment of the present disclosure.

[0034] Figure 2 is a flowchart for illustrating a measurement process according to an embodiment of the present disclosure.

[0035] Figure 3 is a flowchart for illustrating a measurement process according to another embodiment of the present disclosure.

[0036] Figure 4 is a flowchart for illustrating a measurement process according to still another embodiment of the present disclosure.

[0037] Figure 5 is a flowchart for illustrating a process of generating a first virtual image in a measurement process according to an embodiment.

[0038] Figure 6 is a flowchart for illustrating a process of generating a second virtual image in a measurement process according to an embodiment.

[0039] Figure 7 is a view for illustrating a process of measuring a target measurement region during a measurement process according to an embodiment.

[0040] Figure 8 is a flowchart for illustrating a measurement process according to still another embodiment of the present disclosure. DETAILED DESCRIPTION

[0041] The advantages and features of the present application and methods for achieving them will become apparent from the embodiments described below in detail in conjunction with the accompanying drawings. However, the present application is not limited to the embodiments disclosed below, but can be implemented in various different forms, and these embodiments are provided only to make the disclosure of the present application complete and to fully convey the scope of the present application to those skilled in the art, and the present application is only limited by the scope of the claims.

[0042] When an element or layer is referred to as being "on" another element or layer, this includes all cases where the other layer or element is directly inserted onto or between the other element. Throughout the specification, the same reference numerals refer to the same parts. The shapes, sizes, ratios, angles, quantities, etc., disclosed in the drawings for illustrating embodiments are examples, and therefore the invention is not limited to what is shown.

[0043] Although the terms "first," "second," etc., are used to describe various components, these components are certainly not limited by these terms. These terms are only used to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below can also be the second component within the technical concept of this invention.

[0044] Each of the features in the various embodiments of the present invention may be combined in part or in whole or in combination with each other, and various technical connections and operations are possible, and each embodiment may be implemented independently of each other or may be implemented together in an associated relationship.

[0045] The specific implementation method will now be described with reference to the accompanying drawings.

[0046] Figure 1 This is a block diagram illustrating a measuring device according to an embodiment of the present disclosure. Figure 2 This is a flowchart illustrating a measurement process according to an embodiment of the present disclosure.

[0047] refer to Figure 1 and Figure 2 The measuring device 10 can measure the patterning results during a photomask-based manufacturing process. The measuring device 10 can predict the patterning results during a process for manufacturing an electronic device, semiconductor device, or battery. For example, the electronic device or semiconductor device can be a mobile phone, smartphone, tablet PC, mobile communication terminal, e-notebook, e-reader, portable multimedia player (PMP), navigation device, and ultra-mobile PC (UMPC). For another example, the electronic device or semiconductor device can be used as a display unit for a television, laptop computer, monitor, electronic billboard, or Internet of Things (IoT). For yet another example, the electronic device or semiconductor device can be a wearable device such as a smartwatch, watch phone, glasses display, and head-mounted display (HMD) device.

[0048] The measuring device 10 may include a virtual image generator 100, a reference measurement area determiner 200, a target measurement area detector 300, and a measuring device 400.

[0049] The virtual image generator 100 can generate a virtual image based on at least one layer shown in a layout map (step S100). The layout map can include a layout map of each of a plurality of layers. The virtual image generator 100 can generate a virtual image in an order in which the plurality of layers are sequentially stacked. The plurality of layers can include at least one metal layer and at least one organic layer. For example, the virtual image generator 100 can generate a virtual image including a first layer, a virtual image including a first layer and a second layer, and a virtual image including a first layer to a third layer. Accordingly, the virtual image generator 100 can generate a virtual image based on a layout map without a real object in which at least one layer is actually stacked.

[0050] The reference measurement region determiner 200 can determine a reference measurement region in a virtual image to measure the reference measurement region (step S200). The reference measurement region determiner 200 can receive a plurality of virtual images from the virtual image generator 100, and can determine a reference measurement region for each of the plurality of virtual images. The reference measurement region determiner 200 can determine a plurality of reference measurement regions for each virtual image. For example, the reference measurement region determiner 200 can determine a reference measurement region by receiving an input of a user, but the present disclosure is not limited thereto. The reference measurement region can include at least one region defined by at least one metal line, at least one hole, or a layer.

[0051] The measurement target can include at least one layer patterned based on a layout map, and can be prepared for measurement (step S300). The measurement target can be prepared during a process of manufacturing an electronic device or a semiconductor device.

[0052] The target measurement region detector 300 can capture an image of the measurement target, and can detect a target measurement region corresponding to the reference measurement region from the measurement target (step S400). The target measurement region detector 300 can perform pattern matching of the measurement target based on the reference measurement region, and can detect a target measurement region satisfying a predetermined matching degree. The matching degree of a pattern can be a numerical value indicating similarity between the reference measurement region and the target measurement region. For example, if the matching degree of a pattern is equal to or greater than 85%, the target measurement region detector 300 can detect a target measurement region. However, it should be understood that the criterion for the matching degree is not limited thereto.

[0053] The measurer 400 can measure the target measurement region based on the reference measurement region (step S500). The measurer 400 can measure the size of the line width, the position of the hole, and the shape and size of the target measurement region. The measurer 400 can perform critical dimension measurement based on the reference measurement region. For example, the measurer 400 can perform pattern measurement of at least one of overlay, refractive index, and thickness based on the reference measurement region to measure the line width, the hole, or the area of the target measurement region. The measurer 400 can measure the overlay of the pattern to measure the misalignment of the line.

[0054] If the measurement target satisfies the measurement standard, the process of manufacturing the electronic device or the semiconductor device can be continued. If the manufacturing process is further performed, the measurement device 10 can measure the measurement target again. Accordingly, the measurement device 10 can measure all of the patterning results during the manufacturing process, and can ensure the reliability of the measurement target.

[0055] If the measurement target does not satisfy the measurement standard, the subsequent manufacturing process of the measurement target can be interrupted.

[0056] Figure 3 is a flowchart for illustrating a measurement process according to another embodiment of the disclosure.

[0057] Referring to Figure 3 The virtual image generator 100 can generate virtual images with respect to the first layer to the n-th layer shown in the layout map, respectively (step S110). The layout map can include a layout map of each of the first layer to the n-th layer. The virtual image generator 100 can generate the virtual images in an order in which the layers are sequentially stacked. For example, the virtual image generator 100 can generate a virtual image including the first layer to a virtual image including the first layer to the n-th layer. Accordingly, the virtual image generator 100 can generate the virtual images based on the layout map without a real object in which the first layer to the n-th layer are actually stacked.

[0058] The reference measurement region determiner 200 can determine a reference measurement region in each of the virtual images of the first layer to the n-th layer to be measured (step S210). The reference measurement region determiner 200 can receive the plurality of virtual images from the virtual image generator 100, and can determine the reference measurement region with respect to each of the plurality of virtual images. The reference measurement region determiner 200 can determine a plurality of reference measurement regions of each virtual image. For example, the reference measurement region determiner 200 can determine the reference measurement region by receiving an input of a user, but the disclosure is not limited thereto. The reference measurement region can include at least one region defined by at least one metal line, at least one hole, or a layer.

[0059] The measurement target can include k layers patterned based on the layout map, and can be prepared for measurement (step S310), where k is an integer from 1 to n. The measurement target can be prepared during a process of manufacturing an electronic device or a semiconductor device.

[0060] The target measurement area detector 300 can capture an image of the measurement target including the k layers, and can detect a target measurement area of the measurement target corresponding to the reference measurement area (step S410). The target measurement area detector 300 can perform pattern matching of the measurement target based on the reference measurement area, and can detect a target measurement area satisfying a predetermined degree of matching. The degree of matching of the pattern can be a numerical value indicating similarity between the reference measurement area and the target measurement area. For example, if the degree of matching of the pattern is equal to or greater than 85%, the target measurement area detector 300 can detect the target measurement area. However, it should be understood that the criterion for the degree of matching is not limited thereto.

[0061] The measurer 400 can measure the target measurement area based on the reference measurement area (step S510). The measurer 400 can measure the size of the line width, the position of the hole, and the shape and size of the target measurement area. The measurer 400 can perform a critical dimension measurement based on the reference measurement area. For example, the measurer 400 can perform pattern measurement of at least one of the coverage, the refractive index, and the thickness based on the reference measurement area to measure the line width, the hole, or the area of the target measurement area. The measurer 400 can measure the coverage of the pattern to measure misalignment of the line.

[0062] If the measurement target including the k layers satisfies the measurement criterion, the process of manufacturing the electronic device or the semiconductor device can continue. For example, if the measurement target including the first layer satisfies the measurement criterion, the measurement target can additionally have the second layer stacked thereon, and the measurement device 10 can perform measurement on the measurement target including the first and second layers. If the measurement target including the first and second layers satisfies the measurement criterion, the measurement target can additionally have the third layer stacked thereon, and the measurement device 10 can perform measurement on the measurement target including the first to third layers. In this way, the measurement device 10 can perform measurement of the measurement target including the first to n-th layers. Accordingly, the measurement device 10 can measure all of the patterning results during the manufacturing process, and can ensure reliability of the measurement target.

[0063] The measurement device 10 can pre-acquire the virtual images based on the layout map, and can eliminate the process of setting a reference measurement region by capturing a real object in which layers are actually stacked each time a process is performed. Accordingly, the measurement device 10 can complete generating the virtual images S110 and determining the reference measurement region S210 before performing the measurement, and can repeat only preparing the measurement target S310, detecting the target measurement region S410, and performing the measurement S510 when a manufacturing process is performed. Accordingly, the measurement device 10 can save manufacturing costs and time and have reliability.

[0064] Figure 4 is a flowchart for illustrating a measurement process according to still another embodiment of the disclosure.

[0065] Referring to Figure 4 The virtual image generator 100 can generate a first virtual image and a second virtual image based on at least one layer shown in a layout map (step S120). The layout map can include a layout map of each of a plurality of layers. The virtual image generator 100 can generate the virtual images in an order in which the plurality of layers are sequentially stacked. The plurality of layers can include at least one metal layer and at least one organic layer. For example, the first virtual image can be used for after development inspection (ADI). The after development inspection (ADI) can measure a measurement target in which a photoresist is developed on at least one layer. Accordingly, the virtual image generator 100 can generate the first virtual image based on the layout map without a real object in which the photoresist is actually stacked.

[0066] For example, the second virtual image can be used for after cleaning inspection (ACI). The after cleaning inspection (ACI) can be performed after a measurement target is etched using a developed photoresist, and then the photoresist disposed on the measurement target is cleaned. Accordingly, the virtual image generator 100 can generate the second virtual image based on the layout map without a real object that is etched and cleaned.

[0067] The reference measurement region determiner 200 can determine a reference measurement region of each of the first virtual image and the second virtual image (step S220). The reference measurement region determiner 200 can receive a plurality of first virtual images and a plurality of second virtual images from the virtual image generator 100, and can determine a reference measurement region on each of the first virtual images and a reference measurement region on each of the second virtual images.

[0068] The measurement target can include a developed photoresist based on the layout map, and can be prepared for measurement (step S321). The photoresist can be patterned on a layer to be etched.

[0069] The target measurement area detector 300 can capture an image of the measurement target, and can detect a target measurement area corresponding to the reference measurement area of the first virtual image from the measurement target (step S421). The target measurement area detector 300 can perform pattern matching of the measurement target based on the reference measurement area, and can detect a target measurement area satisfying a predetermined matching degree.

[0070] The measurer 400 can measure the target measurement area based on the reference measurement area of the first virtual image (step S521). The measurer 400 can perform an after development inspection (ADI) based on the first virtual image. Accordingly, the measurer 400 can determine whether the photoresist is developed correctly on the measurement target.

[0071] If the measurement target satisfies the measurement standard, a process of manufacturing the electronic device or the semiconductor device can be continued. The photoresist after development can be used to etch the measurement target, and the photoresist disposed on the measurement target can be cleaned to prepare for measurement (step S322). Accordingly, the measurement target can include a patterned layer.

[0072] The target measurement area detector 300 can capture an image of the measurement target, and can detect a target measurement area corresponding to the reference measurement area of the second virtual image from the measurement target (step S422). The target measurement area detector 300 can perform pattern matching of the measurement target based on the reference measurement area, and can detect a target measurement area satisfying a predetermined matching degree.

[0073] The measurer 400 can measure the target measurement area based on the reference measurement area of the second virtual image (step S522). The measurer 400 can perform an after cleaning inspection (ACI) based on the second virtual image. Accordingly, the measurer 400 can determine whether the layer is patterned correctly on the measurement target.

[0074] The measurement device 10 can pre-acquire a first virtual image for an after development inspection (ADI) and a second virtual image for an after cleaning inspection (ACI) based on the layout, and can eliminate a process of setting a reference measurement area by capturing a real measurement target every time a process is performed. Accordingly, the measurement device 10 can complete generation of the first virtual image and the second virtual image (step S120) and determination of the reference measurement area (step S220) before measurement is performed, and as a manufacturing process is performed, an after development inspection (ADI) and an after cleaning inspection (ACI) for each layer can be repeated. Accordingly, the measurement device 10 can save manufacturing costs and time and have reliability.

[0075] Figure 5 FIG. 17 is a flowchart illustrating a process of generating a first virtual image in a measurement process according to an embodiment.

[0076] Referring to Figure 5 , the virtual image generator 100 can generate a pre-processed image based on at least one layer drawn in a layout map (step S121). The layout map can include a layout map including a plurality of layers, and the plurality of layers can be represented as overlapping lines. The plurality of layers can include at least one metal layer and at least one organic layer. The virtual image generator 100 can generate the pre-processed image by adding a style of a captured image to the layout map. Herein, the style of the captured image can represent a texture of an actually captured image generated by a geometry of a captured object. Accordingly, the virtual image generator 100 can generate the pre-processed image similar to the actually captured image.

[0077] The virtual image generator 100 can acquire the actually captured image by capturing a plurality of layers stacked based on the layout map (step S122). For example, the virtual image generator 100 can acquire the actually captured image in advance before measurement is performed, but the present disclosure is not limited thereto.

[0078] The virtual image generator 100 can generate a first virtual image based on the pre-processed image and the actually captured image (step S123). The virtual image generator 100 can generate the first virtual image capable of reducing a loss by using a pre-trained convolutional neural network. For example, the virtual image generator 100 can generate the first virtual image using the following equation: < Equation 1 >

[0079] wherein L denotes a loss of the first virtual image, α denotes a weight of the pre-processed image, L1 denotes a loss of the pre-processed image, β denotes a weight of the actually captured image, and L2 denotes a loss of the actually captured image.

[0080] The virtual image generator 100 can determine the weight (α) of the pre-processed image and the weight (β) of the actually captured image that can reduce the loss of the first virtual image. Accordingly, the virtual image generator 100 can generate the first virtual image for after-development inspection (ADI) by applying a style of the actually captured image to the pre-processed image generated based on the layout map.

[0081] Figure 6 is a flowchart illustrating a process of generating a second virtual image in a measurement process according to an embodiment.

[0082] Referring to Figure 6 , the virtual image generator 100 can prepare a layout map including a plurality of layers (step S124). The layout map can include overlapping lines to represent the plurality of layers. The plurality of layers can include at least one metal layer and at least one organic layer.

[0083] The virtual image generator 100 can extract a two-dimensional image from each of the layers (step S125). The virtual image generator 100 can add colors to the separated layers. The two-dimensional image can represent a pattern of each layer. The plurality of layers can be represented in different colors.

[0084] The virtual image generator 100 can integrate the two-dimensional images (step S126). The two-dimensional images at this step can not represent the overlap of the plurality of layers.

[0085] The virtual image generator 100 can represent different overlapped layers in different colors based on the type of the layers (step S127). The virtual image generator 100 can identify the type of the overlapped layers based on the lines and colors.

[0086] The virtual image generator 100 can identify the type of the overlapped layers based on the lines and regions of the layers, and can perform image mapping on each of the different overlapped layers (step S128). For example, the virtual image generator 100 can perform image mapping on each of a first region in which a source layer and a gate layer are stacked, a second region in which a gate layer and a source metal layer are stacked, a third region in which a source layer, a gate layer, and a source metal layer are stacked, and a fourth region in which a source layer and a source metal layer are stacked.

[0087] The virtual image generator 100 can perform blur processing for each of the different overlapped layers (step S129). Since the layers are actually stacked and include a geometric structure, if the layers are directly captured, the focus can be affected by the geometric structure. Accordingly, the virtual image generator 100 can generate a second virtual image for after cleaning inspection (ACI) by performing blur processing to apply an actual focus change.

[0088] Figure 7 is a view illustrating a process of measuring a target measurement region during a measurement process according to an embodiment.

[0089] Referring to Figure 7 , the measurer 400 can measure the target measurement region based on the reference measurement region. The measurer 400 can measure the size of the line width of the CD target, the position of the hole, and the shape and size of the target measurement region. The measurer 400 can perform a critical dimension (CD) check based on the reference measurement region. To perform the CD check, an edge of a layer can be detected, and measurement can be performed based on the edge of the layer. For example, the measurer 400 can perform pattern measurement of at least one of a coverage, a refractive index, and a thickness based on the reference measurement region. The measurer 400 can measure the coverage of the pattern to measure misalignment of a line. Accordingly, the measurer 400 can measure the line width of the CD target, the hole, or the region.

[0090] Figure 8is a flowchart for illustrating a measurement process according to still another embodiment of the disclosure.

[0091] Referring to Figure 8 , the virtual image generator 100 can generate a virtual image based on at least one layer shown in a layout map (step S130). The layout map can include a layout map of each of a plurality of layers. The virtual image generator 100 can generate a virtual image in an order in which the plurality of layers are sequentially stacked. The virtual image can not include a texture or a pattern. Figure 8 The virtual image generator 100 of Figure 5 may omit the preprocessing process shown in Figure 6 (step S121) and the blurring process shown in (step S129). Accordingly, the virtual image generator 100 can generate a virtual image that does not include a texture or a pattern based on a layout map.

[0092] Referring to the reference measurement region determiner 200, the reference measurement region determiner 200 can determine a reference measurement region in a virtual image to measure the reference measurement region (step S230). The reference measurement region determiner 200 can receive a plurality of virtual images from the virtual image generator 100, and can determine a reference measurement region for each of the plurality of virtual images.

[0093] The measurement target can include at least one layer that is patterned based on a layout map, and can be prepared for measurement (step S330). The measurement target can be prepared during a process of manufacturing an electronic device or a semiconductor device.

[0094] The target measurement region detector 300 can capture an image of the measurement target, and can remove noise from the actually measured image (step S431). For example, the target measurement region detector 300 can partially remove a texture of an actually captured image through primary noise removal, and can remove a remaining texture through secondary noise removal. The target measurement region detector 300 can simplify the actually captured image by removing noise from the actually captured image.

[0095] The target measurement region detector 300 can detect a target measurement region corresponding to a reference measurement region from the simplified actually captured image (step S432). The target measurement region detector 300 can perform pattern matching of the measurement target based on the reference measurement region, and can detect a target measurement region that satisfies a predetermined degree of matching.

[0096] The measurer 400 can measure the target measurement area based on the reference measurement area (step S530). The measurer 400 can measure the size of the line width, the position of the hole, and the shape and size of the target measurement area. The measurer 400 can perform a critical dimension measurement based on the reference measurement area. For example, the measurer 400 can perform a pattern measurement of at least one of a coverage, a refractive index, and a thickness based on the reference measurement area to measure the line width, the hole, or the area of the target measurement area. The measurer 400 can measure the coverage of the pattern to measure misalignment of the line.

[0097] The measurement device 10 can pre-acquire a virtual image based on a layout map, and can eliminate a process of setting a reference measurement area by capturing a real object in which layers are actually stacked every time a process is performed. The measurement device 10 can simplify a process of generating a virtual image by simplifying an actually captured image. Accordingly, the measurement device 10 can save manufacturing costs and time and have reliability.

[0098] Although embodiments of the present application have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that the present application can be embodied in other specific forms without changing the technical idea or essential characteristics of the present application. Therefore, it should be understood that the above-described embodiments are exemplary in all aspects and are non-limiting.

Claims

1. A measurement apparatus comprising: a virtual image generator configured to generate a virtual image based on a plurality of layers shown in a layout map; a reference measurement area determiner configured to determine a reference measurement area to be measured in the virtual image; a target measurement area detector configured to detect a target measurement area corresponding to the reference measurement area from a measurement target including a plurality of layers patterned based on the layout map; and a measurer configured to measure the target measurement area based on the reference measurement area. The virtual image generator is configured to:

2. The measuring device of claim 1, wherein, pre-process an image including the plurality of layers shown in the layout map to generate a pre-processed image; capture an image of a plurality of layers stacked based on the layout map to obtain an actually captured image; and generate a first virtual image based on the pre-processed image and the actually captured image. The virtual image generator generates the first virtual image by adjusting a loss of the pre-processed image and a loss of the actually captured image such that a loss of the first virtual image is reduced, as represented in the following equation: 【Equation】 3. The measuring device of claim 2, wherein, wherein L denotes the loss of the first virtual image, α denotes a weight of the pre-processed image, L1 denotes the loss of the pre-processed image, β denotes a weight of the actually captured image, and L2 denotes the loss of the actually captured image. The target measurement area detector detects a target measurement area corresponding to a reference measurement area of the first virtual image from a measurement target in which a photoresist is developed. The virtual image generator extracts two-dimensional images by separating the plurality of layers shown in the layout map from each other, integrates the two-dimensional images, classifies the integrated two-dimensional images by different types of overlapping layers, and performs image mapping for each of the different overlapping layers to generate a second virtual image.

4. The measuring device of claim 2, wherein, The virtual image generator generates the second virtual image by performing the image mapping and then performing blur processing for each of the different overlapping layers.

5. The measuring device of claim 1, wherein, The target measurement area detector detects a target measurement area corresponding to a reference measurement area of the second virtual image from a measurement target after etching of the measurement target is completed using a developed photoresist and the photoresist has been cleaned.

6. The measuring device of claim 5, wherein, The target measurement area detector performs pattern matching of the measurement target based on the reference measurement area to detect the target measurement area satisfying a predetermined matching degree.

7. The measuring device of claim 5, wherein, The measurer performs pattern measurement of at least one of a coverage, a refractive index, and a thickness based on the reference measurement area to measure a line width, a hole, or an area of the target measurement area.

8. The measuring device of claim 1, wherein, The target measurement area detector removes noise from an actually captured image of the measurement target, and detects a target measurement area corresponding to the reference measurement area from the actually captured image after the noise is removed.

9. The measuring device of claim 1, wherein, 11.A measurement method comprising:

10. The measuring device of claim 1, wherein, generating a virtual image based on a plurality of layers shown in a layout map; determining a reference measurement area to be measured in the virtual image; ​ ​ detecting a target measurement region corresponding to the reference measurement region from a measurement target, the measurement target including a plurality of layers patterned based on the layout map; and measuring the target measurement region based on the reference measurement region.

12. The method of claim 11, wherein, generating the virtual image includes: pre-processing images of the plurality of layers shown in the layout map to generate pre-processed images; capturing images of the plurality of layers stacked based on the layout map to obtain actually captured images; and generating a first virtual image based on the pre-processed images and the actually captured images.

13. The method of claim 12, wherein, generating the virtual image includes generating the first virtual image by adjusting a loss of the pre-processed images and a loss of the actually captured images such that a loss of the first virtual image is reduced, as represented by the following equation: [Equation] where L represents the loss of the first virtual image, a represents a weight of the pre-processed images, L1 represents the loss of the pre-processed images, b represents a weight of the actually captured images, and L2 represents the loss of the actually captured images.

14. The method of claim 12, wherein, detecting the target measurement region includes detecting a target measurement region corresponding to a reference measurement region of the first virtual image from a measurement target in which a photoresist is developed.

15. The method of claim 11, wherein, generating the virtual image includes: extracting two-dimensional images by separating the plurality of layers shown in the layout map from each other, integrating the two-dimensional images to classify the integrated two-dimensional images by different types of overlapping layers; and image mapping each of the different overlapping layers to generate a second virtual image.

16. The method of claim 15, wherein, generating the virtual image includes generating the second virtual image by performing the image mapping and then performing blur processing on each of the different overlapping layers.

17. The method of claim 15, wherein, detecting the target measurement region includes detecting a target measurement region corresponding to a reference measurement region of the second virtual image from a measurement target after etching of the measurement target is completed using a developed photoresist and the photoresist has been cleaned.

18. The method of claim 11, wherein, detecting the target measurement region includes performing pattern matching of the measurement target based on the reference measurement region to detect the target measurement region satisfying a predetermined matching degree.

19. The method of claim 11, wherein, measuring the target measurement region includes performing pattern measurement of at least one of a coverage, a refractive index, and a thickness based on the reference measurement region to measure a line width, a hole, or an area of the target measurement region.

20. The method of claim 11, wherein, detecting the target measurement region includes: removing noise from actually captured images of the measurement target; and detecting a target measurement region corresponding to the reference measurement region from the actually captured images after the noise is removed.

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