Structured grinding wheel laser in-situ repair method
By using a structured grinding wheel laser in-situ repair device and leveraging the linkage control of a multi-vision tool setting module and a laser processing module, the problem of insufficient positioning accuracy caused by microgroove wear on the structured grinding wheel surface is solved. This achieves high-precision laser repair and online real-time monitoring, avoids clamping errors, and improves grinding accuracy and efficiency.
Patent Information
- Application Number
- CN202510987308.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-17
- Publication Date
- 2025-11-11
AI Technical Summary
In existing technologies, after long-term service, the surface microgrooves of structured grinding wheels degrade due to wear, resulting in geometric degradation. Laser restructuring processes suffer from problems such as difficulty in matching the laser processing path with the original structure of the grinding wheel surface and insufficient positioning accuracy.
A structured grinding wheel laser in-situ repair device is adopted. The in-situ marking points of the grinding wheel are obtained through a multi-vision tool setting module. The grinding wheel is driven to rotate to align with the laser processing end, the distance information of the laser focusing spot is determined, and the machine tool speed is controlled to link the laser processing module to perform the repair operation, ensuring precise positioning of laser repair.
It achieves precise matching between the morphological features of the laser-repaired grinding wheel and the reconstructed processing position, avoiding structural misalignment during secondary processing, improving repair accuracy and work efficiency, and ensuring that the grinding wheel always maintains a high-efficiency working state.
Smart Images

Figure CN120920883A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of grinding wheel repair technology, and in particular to a structured grinding wheel laser in-situ repair method. Background Technology
[0002] In grinding, traditional grinding wheels are prone to workpiece surface burns and wheel thermal damage in the grinding arc zone due to high temperature buildup and poor chip removal. To address this technical bottleneck, researchers have proposed structured grinding wheel technology. This technology involves machining specific grooves on the grinding wheel surface to create periodically distributed contact and non-contact zones. The contact zones directly participate in grinding, removing workpiece material, while the non-contact zones handle grinding fluid delivery and chip storage. This improves heat dissipation efficiency in the grinding arc zone, reduces grinding heat, significantly improves workpiece surface quality, and extends grinding wheel life.
[0003] However, after prolonged service, the microgrooves on the surface of structured grinding wheels undergo geometric degradation due to continuous wear, specifically manifested as reduced groove depth, decreased chip space, and blunting of the abrasive cutting edges. This morphological deterioration directly weakens the penetration of grinding fluid and the chip removal capacity of the grinding wheel, leading to problems such as high grinding temperatures and decreased machining stability, especially when the groove depth is less than 500 μm. To restore the performance of the grinding wheel, its surface features need to be reconstructed through a restructuring process. However, existing technologies have the following limitations: firstly, during restructuring repair, it is difficult to match the laser processing path with the original structure of the grinding wheel surface; secondly, insufficient repeatability accuracy causes structural misalignment during secondary processing. Summary of the Invention
[0004] The purpose of this application is to provide a structured grinding wheel laser in-situ repair method to solve the problems of existing laser restructuring processes, such as the difficulty in matching the laser processing path with the original structure of the grinding wheel surface and insufficient positioning accuracy.
[0005] To achieve the above objectives, this application provides a method for in-situ laser repair of structured grinding wheels, which utilizes a structured grinding wheel laser in-situ repair device for in-situ repair of grooves on structured grinding wheels on machine tools. The structured grinding wheel laser in-situ repair device includes a groove wear detection module, a laser processing module, and a multi-vision tool setting module, respectively arranged on one side of the machine tool. The groove wear detection module is used to acquire wear information on the outer peripheral surface of the grinding wheel. The laser processing end of the laser processing module faces the outer peripheral surface of the grinding wheel, and the multiple image acquisition ends of the multi-vision tool setting module face the end face and the outer peripheral surface of the grinding wheel, respectively. The structured grinding wheel laser in-situ repair method includes: The in-situ marking point on the end face of the grinding wheel is obtained by the multi-vision tool setting module, and then the grinding wheel is driven to rotate by a preset angle so that the in-situ marking point is aligned with the laser processing end. The in-situ marking point corresponds to the processing origin of the grinding wheel groove in the circumferential direction of the grinding wheel. The multi-vision tool setting module determines the first distance information of the laser focused spot formed by the laser processing module relative to the outer peripheral surface of the grinding wheel and the second distance information of the laser focused spot relative to the contour edge of the grinding wheel. Based on the first distance information, the second distance information, and the wear amount information, the laser focusing spot is controlled to move to the bottom of the groove and align with the preset repair starting point; The machine tool is controlled to drive the grinding wheel to rotate at a preset speed, and the laser processing module is controlled to perform laser in-situ repair operations in conjunction with the preset speed.
[0006] As a further improvement to the above technical solution: Optionally, the multi-vision tool setting module includes a first camera acquisition module, wherein the image acquisition end of the first camera acquisition module faces the end face of the grinding wheel; The step of acquiring the in-situ marking point on the end face of the grinding wheel through the multi-vision tool setting module, and then driving the grinding wheel to rotate by a preset angle so that the in-situ marking point is aligned with the laser processing end includes: The first image information is acquired by the first camera acquisition module, and the in-situ mark point on the end face of the grinding wheel is obtained based on the first image information; Determine the angle information between the first radial direction of the grinding wheel passing through the in-situ mark point and the second radial direction of the grinding wheel passing through the laser processing end; The grinding wheel is driven to rotate by the preset angle according to the included angle information, so that the projection of the first radial direction where the in-situ mark point is located and the second radial direction on the axial direction of the grinding wheel coincide, wherein the preset angle is consistent with the included angle value in the included angle information.
[0007] Optionally, the multi-vision tool setting module includes a first camera acquisition module and a second camera acquisition module, wherein the image acquisition end of the first camera acquisition module faces the end face of the grinding wheel, and the image acquisition end of the second camera acquisition module faces the outer peripheral surface of the grinding wheel; The determination of the first distance information of the laser focused spot formed by the laser processing module relative to the outer peripheral surface of the grinding wheel and the determination of the second distance information of the laser focused spot relative to the contour edge of the grinding wheel through the multi-vision tool setting module include: The first camera acquisition module acquires second image information, and determines the first distance information of the laser focused spot relative to the outer peripheral surface of the grinding wheel based on the second image information; The second camera acquisition module acquires third image information, and determines the second distance information of the laser focused spot relative to the contour edge of the grinding wheel based on the third image information.
[0008] Optionally, the wear detection module includes a laser ranging device, the laser detection end of which is arranged facing the outer peripheral surface of the grinding wheel, and the wear information is the depth value of the groove.
[0009] Optionally, the structured grinding wheel laser in-situ repair method further includes: The height difference between the bottom of the groove and the grinding surface of the grinding wheel is detected by the laser ranging device, and the height difference is the depth value of the groove; Repair is initiated when the depth value is less than the preset value.
[0010] Optionally, the preset value is H, where H < 500 μm or H ≥ 500 μm.
[0011] Optionally, controlling the machine tool to drive the grinding wheel to rotate at a preset speed, and controlling the laser processing module to perform laser repair operations in conjunction with the preset speed further includes: The laser processing module controls the light emission interval and processing path so that the scanning trajectory of the laser beam skips the grinding surface of the grinding wheel.
[0012] Optionally, the preset repair starting point is the intersection of the lower edge of the bottom of the trench and the side edge of one side of the trench.
[0013] Optionally, the radial direction of the grinding wheel through the horizontal plane is defined as the X-axis direction, the axial direction of the grinding wheel is defined as the Y-axis direction, and the vertical direction is defined as the Z-axis direction; the laser processing module includes: Femtosecond lasers are used to emit femtosecond laser beams. The galvanometer module, optically connected to the emitter of the femtosecond laser, is used for laser scanning in the YZ plane; and A motion platform drives the galvanometer module, which is connected to the galvanometer module and is used to drive the galvanometer module to move along the X-axis.
[0014] Optionally, controlling the laser focusing spot to move to the bottom of the trench and align it with a preset repair starting point based on the first distance information, the second distance information, and the wear amount information includes: Based on the first distance information and the wear information, the galvanometer module is driven to move along the X-axis by controlling the motion platform so that the laser focused spot moves to the bottom of the groove; and based on the second distance information, the galvanometer module is controlled to move in the YZ plane so that the laser focused spot moves to the preset repair starting point.
[0015] Compared to existing technologies, the beneficial effects of this application are: This application provides a structured grinding wheel laser in-situ repair method. The method involves acquiring in-situ marker points on the end face of the grinding wheel using a multi-vision tool setting module, then driving the grinding wheel to rotate by a preset angle to align the in-situ marker points with the laser processing end. The in-situ marker points correspond to the processing origin of the grinding wheel groove in the circumferential direction. The multi-vision tool setting module determines a first distance information between the laser focused spot formed by the laser processing module and the outer circumferential surface of the grinding wheel, and a second distance information between the laser focused spot and the contour edge of the grinding wheel. Based on the first distance information, the second distance information, and wear information, the laser focused spot is controlled to move to the bottom of the groove and align with a preset repair starting point. The machine tool is controlled to drive the grinding wheel to rotate at a preset speed, and the laser processing module is linked to perform the laser repair operation according to the preset speed. Thus, the structured grinding wheel laser in-situ repair method provided in this application, through the first distance information, second distance information, and wear amount information determined by the multi-vision tool setting module, accurately positions the laser focusing spot generated by the laser processing module to the preset repair starting point on the bottom of the groove, thereby completing automatic vision tool setting with high positioning accuracy and avoiding structural misalignment during secondary processing; furthermore, during repair, the machine tool is controlled to drive the grinding wheel to rotate at a preset speed, and the laser processing module is linked to perform laser repair operations according to the preset speed, thus ensuring that the morphological features of the laser-repaired grinding wheel are precisely matched with the reconstructed processing position, improving repair accuracy and restoring better.
[0016] Furthermore, the structured grinding wheel laser in-situ repair method provided in this application directly restructures and repairs the grinding wheel on the machine tool in situ, enabling online real-time monitoring and repair without disassembling the grinding wheel, thus avoiding clamping errors caused by secondary clamping. At the same time, it also saves the grinding wheel disassembly and assembly process, improves work efficiency, and ensures that the grinding wheel is always kept in a high-efficiency working state. Attached Figure Description
[0017] Figure 1 A flowchart of a structured grinding wheel laser in-situ repair method provided in an embodiment of this application is shown; Figure 2 This illustration shows a schematic diagram of the layout structure of each module in a structured grinding wheel laser in-situ repair device provided in an embodiment of this application; Figure 3A schematic diagram of the structure of the structured grinding wheel laser in-situ repair device provided in an embodiment of this application is shown; Figure 4 This diagram illustrates the second image information acquired by the first camera acquisition module in the structured grinding wheel laser in-situ repair device shown. Figure 5 This illustration shows a state in which the laser focusing spot of the laser processing module in the structured grinding wheel laser in-situ repair device provided in this application moves to the bottom of the groove and is aligned with the preset repair starting point; Figure 6 The image shows a comparison of the three-dimensional microstructure of the bottom of the groove of the grinding wheel before repair ① and after repair ② using the structured grinding wheel laser in-situ repair method in an embodiment of this application. Figure 7 The image shows a microscopic morphology of the bottom of the groove of a grinding wheel after repair by the structured grinding wheel laser in-situ repair method provided in this application embodiment.
[0018] Explanation of key component symbols: 10. Groove wear detection module; 20. Laser processing module; 21. Femtosecond laser; 22. Galvanometer module; 23. Motion platform; 30. Multi-view tool setting module; 31. First camera acquisition module; 32. Second camera acquisition module; 40. Grinding wheel; 40a. In-situ marking point; 41. Groove; 42. Grinding surface; A1, laser focused spot; A2, laser processed spot; B, laser repair area; C, laser unrepaired area; L, first distance information. Detailed Implementation
[0019] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature. Example
[0024] Please see Figure 1 and Figure 2 This embodiment provides a structured grinding wheel laser in-situ repair method, which uses a structured grinding wheel laser in-situ repair device to repair the grooves 41 of the grinding wheel 40 on the machine tool in situ, thereby restoring the grooves 41 on the outer circumferential surface of the grinding wheel 40 to their original depth.
[0025] Among them, the grinding wheel 40 to be repaired on the machine tool is a resin CBN grinding wheel or a resin diamond grinding wheel.
[0026] Please refer to the following: Figure 3In this embodiment, a structured grinding wheel laser in-situ repair device is also provided. The structured grinding wheel laser in-situ repair device includes a groove wear detection module 10, a laser processing module 20, and a multi-vision tool setting module 30, each arranged on one side of the machine tool. The groove wear detection module 10 is used to acquire wear information on the outer peripheral surface of the grinding wheel 40. The laser processing end of the laser processing module 20 faces the outer peripheral surface of the grinding wheel 40 and is used to perform laser repair processing on the grooves 41 of the grinding wheel 40. Multiple image acquisition ends of the multi-vision tool setting module 30 face the end face and outer peripheral surface of the grinding wheel 40, respectively.
[0027] Please see Figure 1 , Figure 2 and Figure 3 Specifically, in this embodiment, the structured grinding wheel laser in-situ repair method includes the following steps: S100: The in-situ mark point 40a on the end face of the grinding wheel 40 is obtained through the multi-vision tool setting module 30, and then the grinding wheel 40 is driven to rotate by a preset angle so that the in-situ mark point 40a is aligned with the laser processing end. The in-situ mark point 40a corresponds to the processing origin of the groove 41 of the grinding wheel 40 in the circumferential direction of the grinding wheel 40. If the machine tool cannot control the rotation speed of the grinding wheel 40, a controller or speed-regulating motor module can also be configured on the machine tool to control the rotation speed of the grinding wheel 40.
[0028] The in-situ marker 40a is a point set during the initial laser-structured machining of the grinding wheel 40, and can also be a point marked subsequently. Thus, using this in-situ marker 40a as the machining origin for the repair of the groove 41 on the grinding wheel 40 ensures high positioning accuracy, effectively avoids damage to the grinding surface 42 of the grinding wheel 40, thereby improving repair accuracy and resulting in better restoration after repair.
[0029] Furthermore, when acquiring the in-situ marker point 40a, the machine tool is first stopped, the grinding wheel 40 stops rotating, and the grinding wheel 40 is lifted away from the workpiece surface. This ensures that the outer circumferential surface (machined surface) and cross-section of the grinding wheel 40 are exposed within the recognition range of the groove wear detection module 10 and the multi-vision tool setting module 30.
[0030] S200: The first distance information (e.g., the distance between the laser focused spot A1 formed by the laser processing module 20 and the outer peripheral surface of the grinding wheel 40) is determined by the multi-vision tool setting module 30. Figure 4 As shown, L represents the first distance information and the second distance information for determining the contour edge of the laser focusing spot A1 relative to the grinding wheel 40.
[0031] The laser focused spot A1 is the spot generated when the laser beam emitted by the laser processing module 20 ionizes the air. This laser focused spot A1 is not focused on the outer peripheral surface of the grinding wheel 40. Therefore, the multi-vision tool setting module 30 needs to determine the positional relationship between the laser focused spot A1 and the grinding wheel 40.
[0032] S300: Based on the first distance information, the second distance information, and the wear amount information, control the laser focusing spot A1 to move to the bottom of the groove 41 and align it with the preset in-situ repair starting point.
[0033] It should be noted that, since this embodiment mainly involves in-situ structural repair of the groove 41 of the grinding wheel 40, the laser focusing spot A1 of the laser processing module 20 needs to be moved to the bottom of the groove 41 and aligned with the preset in-situ repair starting point. This in-situ repair starting point is aligned with the processing starting point when the grinding wheel 40 is initially structured. In this way, when performing laser repair, the energy of the laser focusing spot A2 emitted by the laser processing module 20 can be better concentrated on the bottom of the groove 41 to achieve in-situ laser repair of the groove 41. At the same time, it is necessary to avoid the laser focusing spot A2 from processing the grinding surface 42 of the grinding wheel 40.
[0034] S400: Controls the machine tool to drive the grinding wheel 40 to rotate at a preset speed, and controls the laser processing module 20 to perform laser repair operations according to the preset speed.
[0035] Specifically, the control system of the structured grinding wheel laser in-situ repair device can be made to communicate with the control system of the machine tool to achieve signal transmission and thus establish linkage control.
[0036] It should be noted that when the height difference between the groove 41 of the grinding wheel 40 and the grinding surface 42 is small, for example, less than 500 μm, when using the ordinary laser reciprocating surface scanning method to repair the structured grinding wheel, the laser focused spot A2 will also ablate the grinding surface 42 when it sweeps across it, failing to achieve selective ablation and thus preventing in-situ repair of the structured grinding wheel. However, this invention, by establishing communication linkage, can match the rotational speed of the grinding wheel 40 and the frequency emitted by the laser from the laser processing module 20, as well as the position of the laser spot aligned with the repair starting point, so that the laser focused spot A2 generated by the laser processing module 20 only scans within the groove 41. In other words, it prevents the laser focused spot A2 from falling onto the grinding surface 42 of the grinding wheel 40, avoiding accidental damage to the grinding surface 42. The scanning path setting for the in-situ laser restructuring repair of the structured grinding wheel can refer to the laser scanning path setting during the initial structuring of the grinding wheel 40.
[0037] The structured grinding wheel laser in-situ repair method provided in this embodiment uses the first distance information, the second distance information, and the wear amount information determined by the multi-vision tool setting module 30 to accurately position the laser focusing spot A1 generated by the laser processing module 20 to the preset repair starting point on the bottom of the groove 41, thereby completing automatic vision tool setting with high positioning accuracy and avoiding structural misalignment during secondary processing. During repair, the machine tool drives the grinding wheel 40 to rotate at a preset speed, and the laser processing module 20 is linked to perform laser repair operations according to the preset speed. This ensures that the morphological features of the laser-repaired grinding wheel 40 are accurately matched with the reconstructed processing position, improving repair accuracy and restoring better performance.
[0038] Please refer to the following: Figure 6 This image shows a comparison of the three-dimensional microstructure of the bottom of the groove 41 of the grinding wheel 40 before and after repair using the structured grinding wheel laser in-situ repair device provided in this embodiment. The laser-repaired area is designated B, and the unrepaired area is designated C. Figure 6 A comparison between before repair ① and after repair ② shows that the depth of the bottom of groove 41 after laser repair was restored from 215 μm to the original depth of 219 μm. Furthermore, as... Figure 7 The groove 41 shown after laser in-situ repair has obvious traces of ablation removal of the resin binder, and some abrasive particles have also fallen off and cracked.
[0039] On the other hand, the structured grinding wheel laser in-situ repair method provided in this embodiment directly restructures and repairs the grinding wheel 40 on the machine tool in situ, realizing online real-time monitoring and repair without disassembling the grinding wheel 40, avoiding clamping errors caused by secondary clamping, ensuring that the grinding wheel 40 is always maintained in the high-efficiency working range, which is conducive to ensuring grinding processing accuracy and improving production efficiency.
[0040] Furthermore, the multi-vision tool setting module 30 includes a first camera acquisition module 31, with the image acquisition end of the first camera acquisition module 31 facing the end face of the grinding wheel 40.
[0041] Please refer to the following: Figure 4 and Figure 5 In step S100 above, the in-situ mark point 40a on the end face of the grinding wheel 40 is obtained through the multi-vision tool setting module 30, and then the grinding wheel 40 is driven to rotate by a preset angle so that the in-situ mark point 40a is aligned with the laser processing end. S110: First image information is acquired through the first camera acquisition module 31, and the in-situ mark point 40a on the end face of the grinding wheel 40 is obtained based on the first image information.
[0042] S120: Determine the angle information between the first radial direction of the grinding wheel 40 passing through the in-situ mark point 40a and the second radial direction of the grinding wheel 40 passing through the laser processing end.
[0043] S130: Drive the grinding wheel 40 to rotate by a preset angle according to the included angle information, so that the projection of the first radial direction where the in-situ mark 40a is located coincides with the projection of the second radial direction onto the axial direction of the grinding wheel 40. The preset angle is consistent with the included angle value in the included angle information. In other words, by controlling the grinding wheel 40 to rotate by a preset angle, the in-situ mark 40a on the end face of the grinding wheel 40 will be rotated to correspond with the laser processing end. At this time, it can be ensured that the in-situ repair starting point at the bottom of the groove 41 of the grinding wheel 40 corresponds with the laser processing end, so as to facilitate subsequent tool setting.
[0044] Please refer to the following: Figure 4 and Figure 5 The multi-vision tool setting module 30 also includes a second camera acquisition module 32, the image acquisition end of which faces the outer peripheral surface of the grinding wheel 40.
[0045] In step S200 above, determining the first distance information of the laser focused spot A1 formed by the laser processing module 20 relative to the outer peripheral surface of the grinding wheel 40 and determining the second distance information of the laser focused spot A1 relative to the contour edge of the grinding wheel 40 through the multi-vision tool setting module 30 includes: S210: Acquire second image information through the first camera acquisition module 31, and determine the first distance information of the laser focused spot A1 relative to the outer peripheral surface of the grinding wheel 40 based on the second image information.
[0046] S220: Acquire third image information through the second camera acquisition module 32, and determine the second distance information of the laser focused spot A1 relative to the contour edge of the grinding wheel 40 based on the third image information.
[0047] Optionally, both the first camera acquisition module 31 and the second camera acquisition module 32 can be CCD cameras or CMOS monochrome cameras.
[0048] In some embodiments, the multi-vision tool setting module 30 also includes a light source module. The light source module employs a ring light source. This effectively eliminates directional shadows caused by microstructures such as abrasive grains and grooves 41; especially when inspecting wear grooves 41, its coaxial diffuse reflection light highlights the edge contours of the grooves 41. Furthermore, traditional light sources irradiating the grinding wheel bond or abrasive grains easily produce strong reflections, leading to image overexposure. The ring light source, with its low-angle incident diffuse light design, and optimized optical path, can reduce specular reflection intensity by 60-80%, preventing highly reflective areas from obscuring defects such as abrasive grain detachment or microcracks.
[0049] Furthermore, to improve the recognition accuracy of image information by the first camera acquisition module 31 and the second camera acquisition module 32, preprocessing such as threshold segmentation and noise reduction is performed on the image information during image processing. Gamma correction is used to adjust the contrast and brightness of the image to enhance image details. The image is segmented into a binary image based on the grayscale value of the pixels. Bilateral filtering combined with the Canny algorithm is used to reduce noise while preserving edge gradient information, further improving the accuracy of edge detection. After threshold segmentation, a closing operation is performed to obtain the edge coordinate information of the target object. Among them, the light spot image information (laser focused light spot A1) is obtained by adjusting the camera exposure time and turning off the camera light to obtain the laser ionization point image. The ionization point is the light spot generated by the laser ionizing the air, and this light spot is defined as laser focused light spot A1.
[0050] The wear detection module includes a laser rangefinder. The laser detection end of the laser rangefinder is arranged facing the outer peripheral surface of the grinding wheel 40. The wear information is the depth value of the groove 41, so the wear degree of the grinding wheel 40 can be judged based on the depth value of the groove 41.
[0051] In this embodiment, the structured grinding wheel laser in-situ repair method further includes: The height difference between the bottom of the groove 41 and the grinding surface 42 of the grinding wheel 40 is detected by a laser rangefinder. This height difference is the depth value of the groove 41. When the depth value is less than a preset value, repair is initiated. In this way, the grinding condition of the grinding wheel 40 can be monitored in real time, and the repair is initiated after the grinding degree reaches the preset value.
[0052] Optionally, the preset value is H, where H can be less than 500 μm. Of course, in-situ laser repair of grooves 41 with H greater than or equal to 500 μm can also be achieved.
[0053] The above step S400, which controls the machine tool to drive the grinding wheel 40 to rotate at a preset speed and controls the laser processing module 20 to perform laser repair operations according to the preset speed, also includes: The scanning trajectory of the processing laser beam emitted by the laser processing module 20 is controlled to skip the grinding surface 42 of the grinding wheel 40. This ensures that the laser focusing spot A2 will not damage the grinding surface 42, and only the groove 41 is repaired in situ.
[0054] In this embodiment, the preset repair starting point is the intersection of the lower edge of the bottom of the groove 41 and the side edge of one side of the groove 41. Specifically, this point is also the starting point for the initial structuring of the grinding wheel. For example... Figure 5 The lower right corner of the central groove 41 is the starting point for processing. Of course, the starting point for processing can also be the lower left corner, the upper right corner, or the upper left corner. It should be understood that the above is only an example and is not intended to limit the scope of protection of this application.
[0055] Please see Figure 1 , Figure 2 and Figure 3 Furthermore, the radial direction of the grinding wheel 40 through the horizontal plane is defined as the X-axis direction, the axial direction of the grinding wheel 40 is defined as the Y-axis direction, and the vertical direction is defined as the Z-axis direction.
[0056] The laser processing module 20 includes a femtosecond laser 21, a galvanometer module 22, and a motion platform 23. The femtosecond laser 21 emits femtosecond laser light; the galvanometer module 22 is optically connected to the emitting end of the femtosecond laser 21 and is used to perform laser scanning in the YZ plane to scan and repair the grooves 41 of the grinding wheel 40. The optical path includes optical components arranged along the direction of light propagation, such as mirrors.
[0057] The motion platform 23 is used to drive the galvanometer module 22 to move along the X-axis, thereby adjusting the distance between the laser focusing spot A2 of the laser processing module 20 and the grinding wheel 40. This, in conjunction with the scanning function and tool setting function of the galvanometer module 22 in the YZ plane, enables control of the spatial position of the laser focusing spot A2, so that the laser focusing spot A2 is roughly aligned with the groove 41 on the grinding wheel 40.
[0058] Furthermore, in step S300 above, controlling the laser focusing spot A1 to move to the bottom of the trench 41 and align it with the preset repair starting point based on the first distance information, the second distance information, and the wear amount information includes: Based on the first distance information and wear information, the galvanometer module 22 is driven to move along the X-axis by controlling the motion platform 23 so that the laser focusing spot A1 moves to the bottom of the groove 41; and based on the second distance information, the galvanometer module 22 is controlled to move in the YZ plane so that the laser focusing spot A1 moves to the preset repair starting point.
[0059] In some embodiments, the efficiency of laser restructuring can be improved by adding a wire brush to assist in the removal of abrasive particles that are about to detach.
[0060] It should be noted that the spatial coordinates of the grinding wheel 40 and the laser focusing spot A1 in the circumferential, radial, and axial directions can be determined through the in-situ marker point 40a, the first camera acquisition module 31, and the second camera acquisition module 32. This positional coordinate information enables precise positioning of the laser focusing spot A1 within the groove 41. The subsequent laser in-situ repair path is then formulated based on the pattern of the initial (original) structural design of the grinding wheel. The galvanometer module 22 controls the rapid scanning of the laser focusing spot A2 in the YZ plane, matching the rotational speed control of the grinding wheel 40 in the circumferential direction, thus achieving control over the processing pattern and path.
[0061] The structured laser in-situ repair method for grinding wheels provided in this application directly performs online laser repair on the grinding wheel 40 on the machine tool, realizing online real-time monitoring and repair without disassembling the grinding wheel 40, avoiding clamping errors caused by secondary clamping; at the same time, it also saves the disassembly and assembly process of the grinding wheel 40, improves work efficiency, and ensures that the grinding wheel 40 is always maintained in a high-efficiency working state.
[0062] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0063] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. A method for in-situ laser repair of structured grinding wheels, characterized in that, A structured grinding wheel laser in-situ repair device is applied to repair the grooves of grinding wheels on machine tools in situ. The structured grinding wheel laser in-situ repair device includes a groove wear detection module, a laser processing module, and a multi-vision tool setting module, which are respectively arranged on one side of the machine tool. The groove wear detection module is used to acquire wear information on the outer peripheral surface of the grinding wheel. The laser processing end of the laser processing module faces the outer peripheral surface of the grinding wheel. The multiple image acquisition ends of the multi-vision tool setting module face the end face and the outer peripheral surface of the grinding wheel, respectively. The structured grinding wheel laser in-situ repair method includes: The in-situ marking point on the end face of the grinding wheel is obtained by the multi-vision tool setting module, and then the grinding wheel is driven to rotate by a preset angle so that the in-situ marking point is aligned with the laser processing end. The in-situ marking point corresponds to the processing origin of the grinding wheel groove in the circumferential direction of the grinding wheel. The multi-vision tool setting module determines the first distance information of the laser focused spot formed by the laser processing module relative to the outer peripheral surface of the grinding wheel and the second distance information of the laser focused spot relative to the contour edge of the grinding wheel. Based on the first distance information, the second distance information, and the wear amount information, the laser focusing spot is controlled to move to the bottom of the groove and align with the preset repair starting point; The machine tool is controlled to drive the grinding wheel to rotate at a preset speed, and the laser processing module is controlled to perform laser repair operations in conjunction with the preset speed.
2. The structured grinding wheel laser in-situ repair method according to claim 1, characterized in that, The multi-vision tool setting module includes a first camera acquisition module, wherein the image acquisition end of the first camera acquisition module faces the end face of the grinding wheel; The step of acquiring the in-situ marking point on the end face of the grinding wheel through the multi-vision tool setting module, and then driving the grinding wheel to rotate by a preset angle so that the in-situ marking point is aligned with the laser processing end includes: The first image information is acquired by the first camera acquisition module, and the in-situ mark point on the end face of the grinding wheel is obtained based on the first image information; Determine the angle information between the first radial direction of the grinding wheel passing through the in-situ mark point and the second radial direction of the grinding wheel passing through the laser processing end; The grinding wheel is driven to rotate by the preset angle according to the included angle information, so that the projection of the first radial direction where the in-situ mark point is located and the second radial direction on the axial direction of the grinding wheel coincide, wherein the preset angle is consistent with the included angle value in the included angle information.
3. The structured grinding wheel laser in-situ repair method according to claim 1, characterized in that, The multi-vision tool setting module includes a first camera acquisition module and a second camera acquisition module. The image acquisition end of the first camera acquisition module faces the end face of the grinding wheel, and the image acquisition end of the second camera acquisition module faces the outer peripheral surface of the grinding wheel. The determination of the first distance information of the laser focused spot formed by the laser processing module relative to the outer peripheral surface of the grinding wheel and the determination of the second distance information of the laser focused spot relative to the contour edge of the grinding wheel through the multi-vision tool setting module include: The first camera acquisition module acquires second image information, and determines the first distance information of the laser focused spot relative to the outer peripheral surface of the grinding wheel based on the second image information; The second camera acquisition module acquires third image information, and determines the second distance information of the laser focused spot relative to the contour edge of the grinding wheel based on the third image information.
4. The structured grinding wheel laser in-situ repair method according to claim 1, characterized in that, The wear detection module includes a laser ranging device, the laser detection end of which is arranged facing the outer circumferential surface of the grinding wheel, and the wear amount information is the depth value of the groove.
5. The structured grinding wheel laser in-situ repair method according to claim 4, characterized in that, The structured grinding wheel laser in-situ repair method also includes: The height difference between the bottom of the groove and the grinding surface of the grinding wheel is detected by the laser ranging device, and the height difference is the depth value of the groove; Repair is initiated when the depth value is less than the preset value.
6. The structured grinding wheel laser in-situ repair method according to claim 5, characterized in that, The preset value is H, where H < 500 μm or H ≥ 500 μm.
7. The structured grinding wheel laser in-situ repair method according to claim 1, characterized in that, Controlling the machine tool to drive the grinding wheel to rotate at a preset speed, and controlling the laser processing module to perform laser repair operations in conjunction with the preset speed, further includes: The laser processing module controls the light emission interval and processing path so that the scanning trajectory of the laser beam skips the grinding surface of the grinding wheel.
8. The structured grinding wheel laser in-situ repair method according to claim 1, characterized in that, The preset repair starting point is the intersection of the lower edge of the bottom of the trench and the side edge of one side of the trench.
9. The method for in-situ laser repair of structured grinding wheels according to any one of claims 1 or 7-8, characterized in that, The radial direction of the grinding wheel through the horizontal plane is defined as the X-axis direction, the axial direction of the grinding wheel is defined as the Y-axis direction, and the vertical direction is defined as the Z-axis direction; the laser processing module includes: Femtosecond lasers are used to emit femtosecond laser beams. The galvanometer module, optically connected to the emitter of the femtosecond laser, is used for laser scanning in the YZ plane; and A motion platform drives the galvanometer module, which is connected to the galvanometer module and is used to drive the galvanometer module to move along the X-axis.
10. The structured grinding wheel laser in-situ repair method according to claim 9, characterized in that, The step of controlling the laser focusing spot to move to the bottom of the trench and align it with the preset repair starting point based on the first distance information, the second distance information, and the wear amount information includes: Based on the first distance information and the wear information, the galvanometer module is driven to move along the X-axis by controlling the motion platform so that the laser focused spot moves to the bottom of the groove; and based on the second distance information, the galvanometer module is controlled to move in the YZ plane so that the laser focused spot moves to the preset repair starting point.