Silicon material polishing carrier

Abstract

The invention provides a silicon material polishing carrier which is arranged between a sun gear and a gear ring and meshed with the sun gear and the gear ring, a working hole penetrating through the carrier and a plurality of supporting parts are arranged on the carrier, the supporting parts are installed on the inner wall of the working hole and extend in the radial direction of the working hole, and the supporting parts are detachably connected with the carrier; the buffer layer is detachably installed on the supporting end of the supporting part, the supporting end is close to one side of the axis of the working hole, the buffer layer abuts against the peripheral wall of the to-be-polished piece, and the supporting end of the supporting part abuts against the peripheral wall of the to-be-polished piece, so that the contact area between the peripheral wall of the to-be-polished piece and the inner wall of the working hole is reduced, and the friction time of the peripheral wall of the to-be-polished piece is shortened; the risk of generation of bright marks is reduced; the buffer layer is installed at the supporting end of the supporting part and makes flexible contact with the peripheral wall of the to-be-polished piece, relative movement of the supporting part and the peripheral wall of the to-be-polished piece is reduced, and generation of bright marks is further reduced.

Description

Technical Field

[0001] This application relates to the field of silicon product polishing, and more particularly to a silicon material polishing carrier. Background Technology

[0002] In the semiconductor wafer processing, double-sided polishing machines and single-sided polishing machines are used for double-sided polishing or single-sided polishing, depending on different needs.

[0003] The double-sided polishing machine includes a sun gear, an internal gear ring, and a carrier that meshes synchronously with the sun gear and the internal gear ring. The workpiece to be polished passes through the carrier and contacts the polishing discs on the upper and lower sides respectively. While the carrier drives the workpiece to be polished to rotate around the sun gear, it also rotates axially. At this time, the workpiece to be polished rotates relative to the upper and lower polishing discs, thereby achieving the polishing of the workpiece.

[0004] Specifically, the carrier has a through working hole. During the polishing process, the outer peripheral wall of the workpiece to be polished comes into contact with the inner wall of the working hole, generating significant friction. This results in bright marks on the peripheral wall of the workpiece, which in turn affects the quality of the workpiece.

[0005] Therefore, how to design a polishing carrier that reduces the risk of bright marks appearing on the periphery of the workpiece to be polished has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] This application provides a silicon material polishing carrier to at least solve the above-mentioned technical problems existing in the prior art.

[0007] A silicon material polishing carrier is provided, which is disposed between a sun gear and a gear ring and meshes with each other. The carrier has a working hole that penetrates through the carrier. The support section is provided in several parts. The support section is installed on the inner wall of the working hole and extends radially along the working hole. The support section is detachably connected to the carrier. The buffer layer is detachably installed on the support end of the support part, with the support end close to the axis of the working hole. The buffer layer abuts against the peripheral wall of the workpiece to be polished.

[0008] In one embodiment, the inner wall of the working hole is provided with an insertion interface extending radially along the working hole, and the side of the support portion away from the support end is provided with an insertion end, which is inserted into the insertion interface.

[0009] In one embodiment, the inner wall of the plug-in interface is provided with a damping block, the plug end is plate-shaped and plugged into the plug-in interface, the side wall of the plug end abuts against the inner wall of the plug-in interface, and the plug end contacts the damping block to limit the radial sliding of the support part along the working hole.

[0010] In one possible implementation, the support end is one of a hemispherical, columnar, frustum-shaped, or wavy curved surface.

[0011] In one embodiment, the side wall of the support end is provided with an outwardly opening insertion groove, and the buffer layer is provided with insertion ribs. The insertion ribs are inserted into the insertion groove and wrap around the support end.

[0012] In one embodiment, the first axis of the working hole is offset from the second axis of the carrier.

[0013] In one embodiment, the insertion interfaces are not uniformly distributed on the peripheral wall of the working hole, and the number of insertion interfaces on the peripheral wall of the working hole closer to the second axis is less than the number of insertion interfaces on the peripheral wall of the working hole farther from the second axis.

[0014] In one embodiment, a flow guide hole is also included. The flow guide hole is disposed on the carrier and penetrates the upper and lower walls of the carrier. The thickness of the workpiece to be polished is greater than the thickness of the carrier.

[0015] In one embodiment, the axis of the workpiece to be polished lies on the plane formed by the first axis and the second axis, with the axis of the workpiece to be polished and the second axis located on opposite sides of the first axis.

[0016] In one embodiment, a lower polishing disc is rotatably connected below the carrier, and an upper polishing disc is provided above the carrier in the opposite direction of rotation to the lower polishing disc. The upper polishing disc is provided with a plurality of polishing liquid injection holes.

[0017] Compared with the prior art, the silicon material polishing carrier of this application has the following beneficial effects: This application provides a support portion on the inner wall of the working hole, and the support end of the support portion abuts against the peripheral wall of the workpiece to be polished, thereby reducing the contact area between the peripheral wall of the workpiece to be polished and the inner wall of the working hole, reducing the friction time of the peripheral wall of the workpiece to be polished, and reducing the risk of bright marks. The buffer layer is installed at the support end of the support and forms a flexible contact with the peripheral wall of the workpiece to be polished, reducing the relative movement between the support and the peripheral wall of the workpiece to be polished, and further reducing the generation of bright marks. The buffer layer and the support end are detachably connected, which makes it easy to replace the buffer layer and reduces the polishing cost of the parts to be polished. The detachable connection between the support and the carrier allows for the selection of a support of appropriate length when installing the workpiece to be polished, thereby adapting to the installation of different types of workpieces and broadening the applicability of the carrier.

[0018] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0019] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily apparent from the following detailed description taken in conjunction with the accompanying drawings. Several embodiments of this application are illustrated in the drawings by way of example and not limitation, in which: In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0020] Figure 1 This application shows a schematic diagram of the carrier installation location structure; Figure 2 A schematic diagram of the unfolded structure of this application is shown; Figure 3 This diagram shows the structural schematic of the relative positions of the carrier, gear ring, and sun gear in this application; Figure 4 A schematic diagram of the overall structure of the carrier of this application is shown; Figure 5 A cross-sectional view of the carrier of this application is shown; Figure 6 A schematic diagram of the support section of this application is shown; Figure 7 A schematic diagram of the buffer layer structure of this application is shown; Figure 8 A schematic diagram showing the distribution of the interfaces of this application is provided; Figure 9 A schematic diagram of the installation of the buffer layer of this application is shown; Figure 10 A schematic diagram of the area to be polished in this application is shown. Figure 11 This diagram illustrates the first installation state of the part to be polished according to this application; Figure 12 A schematic diagram of the second installation state of the part to be polished according to this application is shown.

[0021] Explanation of the labels in the diagram: 100. Part to be polished; 101. Sun gear; 102. Gear ring; 103. Upper polishing disc; 1031. Polishing fluid injection hole; 104. Lower polishing disc; 105. Support frame; 110. First axis; 120. Second axis; 1. Carrier; 10. Working hole; 2. Support section; 21. Support end; 211. Insertion slot; 22. Insertion end; 3. Buffer layer; 31. Insertion ribs; 4. Connector; 41. Damping block; 5. Guide hole; 6. Polishing area; 61. First scan line; 62. Second scan line. Detailed Implementation

[0022] To make the objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] In the existing technology, double-sided polishing machines are usually used to complete double-sided polishing of products such as silicon wafers, silicon materials, crystal wafers, and glass devices.

[0024] Figure 1 The main principle of the double-sided polishing machine is as follows: It includes a sun gear 101 and a gear ring 102 sleeved on the outside of the sun gear 101. Here, the gear ring 102 refers to the internal gear ring. The gear ring 102 and the sun gear 101 are coaxially arranged. The sun gear 101 and the gear ring 102 are driven by independent drive mechanisms. Here, independent drive motors can be used to drive the sun gear 101 and the gear ring 102 to rotate respectively. The rotation directions of the sun gear 101 and the gear ring 102 can be the same or opposite.

[0025] The double-sided polishing machine also includes a carrier 1, such as Figure 1 and Figure 2 As shown, the outer edge of the carrier 1 is provided with a toothed groove. The carrier 1 is placed between the sun gear 101 and the gear ring 102. The toothed groove on the carrier 1 meshes synchronously with the sun gear 101 and the gear ring 102. When the sun gear 101 or the gear ring 102 rotates, it can drive the carrier 1 to rotate around the axis of the sun gear 101. At the same time, the carrier 1 will rotate around its own axis.

[0026] It is worth noting that, in order to achieve product polishing, a working hole 10 is provided on the carrier 1. The working hole 10 penetrates the upper and lower end walls of the carrier 1 to form a through hole. To further explain, the upper and lower refer to the double-sided polishing machine being placed on a horizontal ground, with the upper side being the side away from the ground and the lower side being the side close to the ground. The workpiece 100 to be polished is installed in the working hole 10 of the carrier 1 to achieve the installation of the workpiece 100 to be polished.

[0027] In addition, to achieve double-sided polishing, a lower polishing disc 104 and an upper polishing disc 103 are also included. The lower polishing disc 104 is rotatably mounted below the carrier 1, and the upper polishing disc 103 is rotatably mounted above the carrier 1. The axes of the upper polishing disc 103 and the lower polishing disc 104 coincide with the axis of the sun gear 101. The upper polishing disc 103 and the lower polishing disc 104 use independent drive sources to make the upper polishing disc 103 and the lower polishing disc 104 rotate in opposite directions, thereby completing the polishing of the workpiece 100 to be polished on the carrier 1.

[0028] like Figure 1 As shown, the double-sided polishing machine also includes a support frame 105, wherein the gear ring 102 is fixedly installed on the top wall of the support frame 105, and the lower polishing disc 104 is rotatably installed on the support frame 105. After the carrier 1 is placed between the sun gear 101 and the gear ring 102, the lower polishing disc 104 can support the carrier 1, avoiding the situation where the carrier 1 cannot mesh with the sun gear 101 and the gear ring 102.

[0029] In this application, the workpiece 100 to be polished is mounted on the working hole 10 of the carrier 1. When polishing the workpiece 100, polishing fluid needs to be supplied to the workpiece 100; see reference Figure 1 and Figure 2 As shown, a plurality of polishing liquid injection holes 1031 are provided at the upper polishing disc 103. The polishing liquid is delivered to the polishing liquid injection holes 1031 through the delivery pipe so as to wet the polishing cloth on the upper polishing disc 103, thereby delivering polishing liquid to the polishing surface of the workpiece 100 to be polished and improving the polishing effect of the workpiece 100.

[0030] Furthermore, the polishing slurry injection holes 1031 are evenly distributed on the upper polishing disk 103 to achieve uniform distribution of the polishing slurry.

[0031] In order to enable the installation of the carrier 1 and the workpiece 100 to be polished or to be removed from the double-sided polishing machine, the double-sided polishing machine in this application also includes a lifting mechanism. The upper polishing disc 103 is installed on the output end of the lifting mechanism. The upper polishing disc 103 is driven to move up and down by the lifting mechanism, thereby changing the relative position of the upper polishing disc 103 and the lower polishing disc 104, so as to facilitate the loading and unloading of the carrier 1 and the workpiece 100 to be polished.

[0032] Since the workpiece 100 to be polished is set inside the working hole 10, the upper polishing disc 103 and the lower polishing disc 104 rotate in opposite directions. The carrier 1 revolves around the sun gear 101. While rotating around its own axis, the workpiece 100 to be polished moves relative to the carrier 1. At this time, the peripheral wall of the workpiece 100 to be polished rubs against the inner wall of the working hole 10. During the polishing process, the peripheral wall of the workpiece 100 to be polished forms bright marks due to friction, which will affect the quality of the workpiece 100 to be polished.

[0033] Example 1: To address the issue of bright marks forming on the 100mm perimeter of the workpiece to be polished, such as... Figure 3 and Figure 4 As shown, The peripheral wall of the working hole 10 of the carrier 1 is provided with a plurality of support portions 2 extending radially along the working hole 10. Here, the end of the support portion 2 near the axis of the working hole 10 is defined as the support end 21. After the workpiece 100 to be polished is placed in the working hole 10, the support end 21 abuts against the peripheral wall of the workpiece 100 to be polished, thereby replacing the scheme in which the peripheral wall of the working hole 10 directly contacts the workpiece 100 to be polished.

[0034] The full contact between the peripheral wall of the workpiece 100 to be polished and the inner wall of the working hole 10 is the main factor in the formation of bright marks. However, in this embodiment, by using the support end 21 of the support part 2 to contact the workpiece 100 to be polished, the contact area between the workpiece 100 to be polished and the inner wall of the working hole 10 is reduced, thereby controlling the factors that cause bright marks from the source and reducing the risk of bright marks.

[0035] In this embodiment, the end of the support end 21 adopts a columnar structure. The columnar support end 21 forms a line contact with the surface of the workpiece 100 to be polished. This solution can solve the problem that excessive contact between the peripheral wall of the workpiece 100 to be polished and the support end 21 increases the risk of bright marks. Compared with the point contact between the peripheral wall of the workpiece 100 to be polished and the support end 21, it also reduces the risk of scratches forming on the peripheral wall of the workpiece 100 to be polished.

[0036] Furthermore, in this embodiment, the support end 21 can be hemispherical or frustum-shaped, and the surface of the support end 21 can also be a wavy curved surface.

[0037] Since the carrier 1 and the support 2 are usually made of hard materials, when the workpiece to be polished 100 rotates, the support 2 and the workpiece to be polished 100 form hard contact, which easily forms scratches on the peripheral wall of the workpiece to be polished 100. Therefore, further optimization of Embodiment 1 is required.

[0038] Example 2: This embodiment is based on Embodiment 1, and further optimizes the solution of Embodiment 1, such as... Figure 5 As shown, a buffer layer 3 is installed on the support end 21 of the support part 2. The buffer layer 3 is made of a flexible material. By using the contact between the buffer layer 3 and the peripheral wall of the workpiece 100 to be polished, the hard contact between the support end 21 and the workpiece 100 to be polished is changed to a flexible contact. This can reduce the risk of relative movement between the workpiece 100 to be polished and the support end 21, thereby reducing the relative friction between the workpiece 100 to be polished and the support end 21, and further reducing the generation of bright marks.

[0039] In this embodiment, the buffer layer 3 can be made of silicone material, which can alleviate the impact of the workpiece 100 to the support 2.

[0040] In this embodiment, the buffer layer 3 is used to contact the workpiece 100 to be polished. After a long polishing operation, the buffer layer 3 is worn and damaged, so the buffer layer 3 needs to be replaced.

[0041] Therefore, the installation method of buffer layer 3 needs to be optimized to reduce the polishing cost of the workpiece 100.

[0042] Example 3: This embodiment is an optimization based on embodiment 2, which solves the problems of high replacement cost when the buffer layer 3 is damaged, and the problem of processing polished parts 100 of different sizes.

[0043] like Figure 6 and Figure 7 As shown, the buffer layer 3 and the support end 21 of the support part 2 are detachably connected. When the buffer layer 3 on the support part 2 is damaged by the impact or friction of the workpiece 100 to be polished, the corresponding buffer layer 3 can be removed, thereby reducing the replacement cost of the buffer layer 3.

[0044] Specifically, such as Figure 6 As shown, a insertion groove 211 is provided on the side wall of the support end 21. The cross-section of the insertion groove 211 is arc-shaped, as shown in the figure. Figure 7 As shown, the inner wall of the buffer layer 3 is provided with an integrally formed insertion rib 31. The insertion rib 31 of the buffer layer 3 is inserted into the insertion groove 211. The insertion rib 31 is pushed into the insertion groove 211 so that the buffer layer 3 wraps around the support end 21, thereby completing the installation of the buffer layer 3 so that the buffer layer 3 can be replaced later.

[0045] Specifically, in this embodiment, the longitudinal section of the buffer layer 3 is I-shaped, and the shape of the insertion groove 211 matches the shape of the insertion rib 31 of the buffer layer 3, reducing the risk of the buffer layer 3 falling off from the insertion groove 211. The state in which the buffer layer 3 is installed on the support 2 is as follows. Figure 9 As shown.

[0046] like Figure 6 As shown, the two ends of the insertion groove 211 are provided with insertion interfaces, which facilitates the insertion of the insertion rib 31. The shape of the insertion groove 211 is used to shape the buffer layer 3 so as to realize the wrapping of the buffer layer 3 on the side wall of the support end 21.

[0047] To facilitate the replacement of the support part 2, in this embodiment, as follows: Figure 8As shown, the peripheral wall of the working hole 10 is provided with several insertion interfaces 4, wherein the support part 2 and the insertion interface 4 are connected by insertion to complete the detachable installation of the support part 2 and the carrier 1, thereby facilitating the replacement of the support part 2.

[0048] Specifically, in this embodiment, the insertion interface 4 extends radially along the working hole 10. When the support part 2 is inserted into the insertion interface 4, the support end 21 of the support part 2 points to the axis of the working hole 10, which facilitates the fixing of the workpiece 100 to be polished.

[0049] Furthermore, such as Figure 5 and Figure 6 As shown, a plug-in end 22 is provided on the side of the support part 2 away from the support end 21. When the support part 2 is installed, the plug-in end 22 is plugged into the plug interface 4. At this time, the end wall of the plug-in end 22 abuts against the bottom wall of the plug interface 4, thereby fixing the support part 2. It is worth noting that the side wall of the plug-in end 22 abuts against the side wall of the plug interface 4 to limit the plug-in end 22 from shaking inside the plug interface 4, thereby improving the stability of the support part 2.

[0050] Since the support part 2 and the carrier 1 are supported by rigid materials, when the insertion end 22 is inserted into the insertion interface 4, the support part 2 tends to move radially towards the workpiece 100 to be polished along the working hole 10. To solve this problem, in this embodiment, as follows... Figure 5 As shown, damping blocks 41 are provided on both the bottom and top walls of the insertion interface 4. The insertion end 22 passes through the gap between the two damping blocks 41 and is inserted into the insertion interface 4. At this time, the outer wall of the insertion end 22 abuts against the damping block 41, thereby increasing the friction between the insertion end 22 and the damping block 41 and reducing the risk of the support part 2 moving radially along the working hole 10.

[0051] It is worth noting that the damping block 41 is an elastic rubber pad.

[0052] When it is necessary to push and position the polished parts 100 of different sizes, simply replace the support parts 2 of different lengths.

[0053] Example 4: This embodiment is a further optimization based on embodiment 3, which solves the problem of partial wear of the upper polishing layout of the upper polishing disk 103 and the lower polishing disk 104.

[0054] In an embodiment, such as Figure 5 As shown, the axis of the working hole 10 is the first axis 110, and the axis of the carrier 1 is the second axis 120.

[0055] During the polishing process, after the polishing part 100 is installed, such as Figure 10As shown, the line swept around the axis of the sun gear 101 by the point of the workpiece to be polished 100 closest to the axis of the sun gear 101 is the first scan line 61, and the line swept around the axis of the sun gear 101 by the point of the workpiece to be polished 100 farthest from the axis of the sun gear 101 is the second scan line 62. The area enclosed by the first scan line 61 and the second scan line 62 is the polishing area 6.

[0056] For a carrier 1 with a working hole 10, the axis of the working hole 10 coincides with the axis of the carrier 1. When the axis of the workpiece 100 to be polished coincides with the axis of the working hole 10, the polishing area 6 swept by the workpiece 100 is the smallest during the rotation of the carrier 1 around the sun gear 101. When the carrier 1 rotates around the sun gear 101 for the same number of revolutions, the smaller the area of ​​the polishing area 6, the more severe the wear of the polishing cloth on the upper polishing disc 103 and the lower polishing disc 104 will be, thus reducing the life of the polishing cloth.

[0057] Therefore, in this embodiment, in order to improve the service life of the polishing cloth, the first axis 110 and the second axis 120 do not coincide, so that the working hole 10 is eccentrically set on the carrier 1, such as... Figure 11 As shown, the workpiece 100 to be polished is installed at the axial position of the working hole 10 through the support part 2. At this time, the polishing area 6 formed by the contact between the workpiece 100 to be polished and the polishing cloth will increase, thereby extending the service life of the polishing cloth.

[0058] To further improve the service life of polishing cloths, such as Figure 12 As shown, it is necessary to make the eccentricity between the axis of the workpiece 100 to be polished and the axis of the sun gear 101 larger. Therefore, based on the eccentricity between the working hole 10 and the carrier 1, the workpiece 100 to be polished is eccentrically positioned within the working hole 10. Furthermore, the axis of the workpiece 100 to be polished is on the plane formed by the first axis 110 and the second axis 120, wherein the axis of the workpiece 100 to be polished and the second axis 120 are located on both sides of the first axis 110, thereby enabling the workpiece 100 to sweep a larger area.

[0059] At this time, the length of the support 2 at the working hole 10 position is adjusted as needed to address the issue of fixing the workpiece 100 to be polished.

[0060] Since the workpiece 100 to be polished is eccentrically positioned within the working hole 10, and the axis of the workpiece 100 is as far away as possible from the axis of the sun gear 101, in order to improve the positioning stability of the workpiece 100, in this embodiment, as follows... Figure 8 As shown, the insertion interfaces 4 on the periphery of the working hole 10 are non-uniformly distributed. Furthermore, the number of insertion interfaces 4 on the inner wall of the working hole 10 closer to the second axis 120 is less than the number of insertion interfaces 4 on the inner wall of the working hole 10 farther from the second axis 120. This arrangement can be referenced from [reference needed]. Figure 12As shown, when the workpiece 100 to be polished is placed on the side with more insertion interfaces 4, the workpiece 100 to be polished can come into contact with more support parts 2. Shorter support parts 2 can be used to support the workpiece 100 to be polished. On the side with fewer insertion interfaces 4, only a small number of support parts 2 are needed to push the workpiece 100 to be polished, which can improve the stability of the workpiece 100 to be polished.

[0061] It is worth noting that, since there are requirements for the placement of the workpiece 100 in the working hole 10, the distribution of the insertion interfaces 4 is non-uniform. The number of insertion interfaces 4 set on the inner wall of the working hole 10 away from the placement point of the workpiece 100 is minimized, thereby reducing the impact of the setting of the insertion interfaces 4 on the strength of the carrier 1.

[0062] Furthermore, the distribution of the insertion interface 4 is further explained here. The side with the shortest distance between the inner wall of the working hole 10 and the outer edge of the carrier 1 is defined as the narrow side, and the side with the longest distance between the inner wall of the working hole 10 and the outer edge of the carrier 1 is defined as the wide side, such as... Figure 8 As shown, there are more connectors 4 on the narrow side and fewer connectors 4 on the wide side.

[0063] Example 5: In this embodiment, the material is polished on both sides. During this process, the polishing liquid is poured downwards from the polishing cloth on the upper polishing disc 103. The polishing liquid easily contacts the top wall of the workpiece 100, wetting it. Then, under gravity, the polishing liquid drips onto the carrier 1 or the polishing cloth on the lower polishing disc 104. However, the polishing liquid has difficulty penetrating the carrier 1 and contacting the bottom wall of the workpiece 100, resulting in poor polishing of the bottom wall. Therefore, in this embodiment, if... Figure 11 and Figure 12 As shown, the carrier 1 is provided with a guide hole 5 that penetrates the upper and lower walls of the carrier 1. When the polishing liquid drips onto the carrier 1, the polishing liquid can flow along the guide hole 5 of the carrier 1 to the bottom wall of the workpiece 100 to be polished, thereby improving the polishing effect of the workpiece 100 to be polished.

[0064] In this embodiment, it is worth noting that the thickness of the workpiece 100 to be polished is greater than the thickness of the carrier 1, so that the top wall and bottom wall of the workpiece 100 to be polished can contact the polishing cloth on the upper polishing disk 103 and the polishing cloth on the lower polishing disk 104 respectively, thereby reducing the risk of the carrier 1 contacting the polishing cloth and reducing the wear of the polishing cloth.

[0065] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this application can be achieved, and this is not limited herein.

[0066] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0067] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A silicon material polishing carrier, wherein a carrier (1) is disposed between a sun gear (101) and a gear ring (102) and meshes with each other, and the carrier (1) is provided with a working hole (10) penetrating the carrier (1), characterized in that, Support (2), several support (2) are provided, the support (2) is installed on the inner wall of the working hole (10) and extends radially along the working hole (10), and the support (2) is detachably connected to the carrier (1); The buffer layer (3) is detachably installed on the support end (21) of the support part (2). The support end (21) is close to the axis of the working hole (10). The buffer layer (3) abuts against the peripheral wall of the workpiece (100) to be polished.

2. The silicon material polishing carrier according to claim 1, characterized in that, The inner wall of the working hole (10) is provided with a plug-in interface (4) extending radially along the working hole (10). The side of the support part (2) away from the support end (21) is provided with a plug-in end (22), which is plugged into the plug-in interface (4).

3. The silicon material polishing carrier according to claim 2, characterized in that, The inner wall of the plug-in interface (4) is provided with a damping block (41). The plug-in end (22) is plate-shaped and plugged into the plug-in interface (4). The side wall of the plug-in end (22) abuts against the inner wall of the plug-in interface (4). The plug-in end (22) contacts the damping block (41) to limit the radial sliding of the support part (2) along the working hole (10).

4. A silicon material polishing carrier according to claim 1, characterized in that, The support end (21) is one of the following: hemispherical, columnar, frustum-shaped, or wavy curved surface.

5. A silicon material polishing carrier according to claim 4, characterized in that, The side wall of the support end (21) is provided with an outward-facing insertion groove (211), and the buffer layer (3) is provided with an insertion rib (31). The insertion rib (31) is inserted into the insertion groove (211) and wraps the support end (21).

6. A silicon material polishing carrier according to claim 2, characterized in that, The first axis (110) of the working hole (10) is offset from the second axis (120) of the carrier (1).

7. A silicon material polishing carrier according to claim 6, characterized in that, The insertion interfaces (4) are not uniformly distributed on the periphery of the working hole (10). The number of insertion interfaces (4) on the periphery of the working hole (10) closer to the second axis (120) is less than the number of insertion interfaces (4) on the periphery of the working hole (10) farther away from the second axis (120).

8. A silicon material polishing carrier according to claim 3, 5 or 7, characterized in that, It also includes a flow guide hole (5), which is set on the carrier (1) and penetrates the upper and lower walls of the carrier (1). The thickness of the workpiece (100) to be polished is greater than the thickness of the carrier (1).

9. A silicon material polishing carrier according to claim 7, characterized in that, The axis of the workpiece to be polished (100) is on the plane formed by the first axis (110) and the second axis (120), and the axis of the workpiece to be polished (100) and the second axis (120) are located on both sides of the first axis (110).

10. A silicon material polishing carrier according to claim 1, characterized in that, A lower polishing disc (104) is rotatably connected below the carrier (1), and an upper polishing disc (103) is provided above the carrier (1) in the opposite direction of rotation to the lower polishing disc (104). The upper polishing disc (103) is provided with several polishing liquid injection holes (1031).

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