Crystal silicon plate film laminating machine

By combining the inclined side groove rod and slide cylinder with the double-sided arc blade design, along with the cross semi-circular rod and adjustable pressing roller, the problem of having to pause the conveyor belt during the cutting process of crystalline silicon substrate coating is solved, achieving a high-efficiency and high-quality coating effect.

CN120921683AActive Publication Date: 2025-11-11INNER MONGOLIA XINGGU TECH CO LTD
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Patent Information

Application Number
CN202511453198.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-10-13
Publication Date
2025-11-11
Estimated Expiration
2045-10-13

AI Technical Summary

Technical Problem

In the current process of coating crystalline silicon substrates, the cutting operation requires pausing the conveyor belt, resulting in frequent start-stop intermittent operation that affects coating efficiency.

Method used

The design employs inclined side groove rods and slide cylinders in conjunction with double-sided arc blades to achieve inclined cladding and cutting of the surface film of crystalline silicon substrates. It combines cross-distributed semi-circular rods for secondary inclined cladding and adapts to different substrate thicknesses and flatnesses through adjustable cladding rollers and rolling cladding structure.

Benefits of technology

It improves the efficiency and quality of coating crystalline silicon substrates, avoids downtime for cutting, ensures a tight fit between the film and the substrate, prevents air bubbles, and adapts to different substrate thicknesses and flatnesses.

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Abstract

The invention provides a crystal silicon plate film laminating machine, and relates to the technical field of mechanical equipment, the crystal silicon plate film laminating machine comprises a bottom frame, two supporting frames are symmetrically and uniformly distributed and fixedly connected to the middle of the upper surface of the bottom frame, a cutting assembly is arranged in the middle between the two supporting frames, and the cutting assembly comprises a semi-arc groove plate fixedly mounted in the middles of the two supporting frames; the device comprises two semi-arc groove plates, groove openings of the two semi-arc groove plates are opposite, sliding blocks are movably connected to the inner walls of the semi-arc groove plates, a side groove rod is fixedly connected between the two sliding blocks, a sliding barrel is movably connected to the outer wall of the side groove rod, and a double-edge arc cutter is movably installed below the sliding barrel. The sliding barrels on the outer walls of the side groove rods are guided into the gaps between the two adjacent crystal silicon plates, the bilateral arc cutters below the sliding barrels are attached to the edges of the crystal silicon plates at the rear ends, the crystal silicon plates continue to move to push the cutter bodies to move on the outer walls of the inclined rod bodies, a coated film is cut, cutting is completed without shutdown, and the cutting efficiency is improved. Therefore, the laminating efficiency of the crystal silicon plate is improved.
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Description

Technical Field

[0001] This invention relates to the field of mechanical equipment technology, and more specifically, to a crystalline silicon substrate coating machine. Background Technology

[0002] Crystalline silicon substrates are flat, sheet-like core materials made of high-purity monocrystalline or polycrystalline silicon, widely used in photovoltaics, semiconductors, and electronics. In the photovoltaic industry, it specifically refers to crystalline silicon solar cells. To save costs, some solar cells are made of polycrystalline silicon. Due to their inherent fragility and the need for long-term outdoor use, a coating process is necessary to improve their strength, thereby achieving impact resistance, moisture resistance, electrical insulation, and improved light absorption efficiency, ultimately ensuring the durability and power generation stability of the solar panel.

[0003] In the process of coating crystalline silicon substrates, a coating machine is typically used to press the required film onto the surface of the substrate using its pressing structure. Then, a cutting blade is used to cut the film to separate the film layers between adjacent substrates. However, in this coating process, the conveyor belt needs to continuously move the substrate to complete the coating, and then pause the conveyor belt during the cutting operation to coordinate with the cutting action. This intermittent operation affects the overall efficiency of the crystalline silicon substrate coating process.

[0004] For example, the Chinese invention patent (publication number: CN108312561A) discloses an "automatic film coating device for sheet materials". The specification states that the invention relates to the field of mechanical equipment, and in particular to an automatic film coating device for sheet materials. This invention can be adjusted according to the specifications of the sheet materials, can process various types of sheet materials, and can cut the film through a first cutting component, a second cutting component, and a third cutting component, thereby reducing manual labor. However, although this invention can cut the film pressed onto the crystalline silicon sheet material multiple times, the crystalline silicon sheet material film coating and conveying process needs to be stopped during the cutting process, which affects the efficiency of crystalline silicon sheet material film coating.

[0005] Therefore, we have made improvements to this and proposed a crystalline silicon substrate coating machine. Summary of the Invention

[0006] The purpose of this invention is to address the problem in the current lamination process where the cutting operation requires pausing the conveyor belt, and this frequent start-stop intermittent operation affects lamination efficiency.

[0007] To achieve the above-mentioned objectives, the present invention provides a silicon substrate coating machine to improve the aforementioned problems.

[0008] The application is as follows: A crystalline silicon substrate coating machine includes a base frame. Four side frames are uniformly and rectangularly fixedly connected to the top of the base frame. A rotating shaft is movably connected above two adjacent side frames. Side rollers are fixedly connected to the outer wall of each rotating shaft. A conveyor belt is movably connected between two side rollers. Two support frames are symmetrically and uniformly distributed and fixedly connected to the center of the upper surface of the base frame. An auxiliary frame is fixedly connected to the top of each support frame. A film roller is movably connected between two auxiliary frames. A cutting assembly is provided between the two support frames. The cutting assembly includes a semi-circular groove plate fixedly installed in the middle of the two support frames, with the groove openings of the two semi-circular groove plates facing each other. A conveyor belt is movably connected to the inner wall of the semi-circular groove plate. The slider has a side groove rod fixedly connected between two sliders. A sliding cylinder is movably connected to the outer wall of the side groove rod. A double-sided arc blade is movably installed below the sliding cylinder. An arc plate is fixedly connected to one end of the slider away from the side groove rod, and the arc plate is movably connected to the semi-arc groove plate. An arc tooth plate is fixedly connected to the side of the arc plate away from the side groove rod. Four fixed frames are fixedly connected in a straight line evenly distributed on both sides of the upper surface of the base frame. An auxiliary plate is fixedly connected above two adjacent fixed frames. The four auxiliary plates are rectangularly distributed on one side of the support frame. A inclined pressure component is provided above one group of auxiliary plates, and an auxiliary component is provided on one side of the upper surface of the other group of auxiliary plates.

[0009] As a preferred technical solution of this application, two auxiliary springs are sleeved on both sides of the outer wall of the side groove rod, and the other end of the auxiliary spring is fixedly installed on the side of the slider.

[0010] As a preferred technical solution of this application, one of the semi-arc groove plates has a side window in the middle of its side surface, and a bidirectional motor is fixedly connected to the side of the support frame away from the side groove rod. An auxiliary gear is fixedly connected to the output shaft end of the bidirectional motor, and one side of the auxiliary gear passes through the side window and meshes with the arc tooth plate.

[0011] As a preferred technical solution of this application, the inclined pressure assembly includes a limiting frame plate fixedly installed on the upper surface of two auxiliary plates on one side. The inner wall of the limiting frame plate has two semi-circular rods symmetrically and evenly distributed and movably connected, and the two semi-circular rods are symmetrically distributed relative to each other. One of the semi-circular rods has an extension bolt fixedly connected to the end away from the limiting frame plate, and the other semi-circular rod has a bushing fixedly connected to the end away from the limiting frame plate. The extension bolt and the bushing are movably connected.

[0012] As a preferred technical solution of this application, the auxiliary plate has grooves evenly distributed in a straight line on its surface. A sliding rod is movably connected to the inner wall of the groove. A positioning wheel is movably installed below the sliding rod. A spring telescopic rod is fixedly connected to the other end of the sliding rod. The other end of the spring telescopic rod is fixedly installed on the lower surface of the auxiliary plate.

[0013] As a preferred technical solution of this application, the other end of the semi-circular rod is movably connected to a positioning shaft disk, and the positioning shaft disk is movably mounted on the upper surface of the auxiliary plate, and a rolling assembly is provided on one side of the upper surface of the auxiliary plate.

[0014] As a preferred technical solution of this application, the auxiliary component includes an inclined frame plate fixedly installed above the auxiliary plate. Each of the two inclined frame plates has a limiting slide window on its opposite surface. A limiting shaft is movably connected between the two limiting slide windows. A pressing roller is fixedly connected to the outer wall of the limiting shaft. Arc-shaped sleeves are movably connected in a symmetrical and uniform manner above the limiting shaft. An elastic telescopic rod is fixedly connected above the arc-shaped sleeves.

[0015] As a preferred technical solution of this application, the rolling assembly includes a straight groove formed on the plane of the semi-circular rod, the inner wall of the straight groove is movably connected to the outer wall of the extension bolt shaft, two adjacent semi-circular rods can be spliced ​​together to form a round rod, and an adjusting gear is fixedly connected to the outer wall of one of the positioning shaft discs, and a straight toothed plate is meshed with the outer wall of the adjusting gear.

[0016] As a preferred technical solution of this application, a push plate is fixedly connected to the side of the spur gear away from the adjusting gear, an electric telescopic rod is fixedly connected to one side of the push plate, and a positioning plate is fixedly connected to the other end of the electric telescopic rod.

[0017] As a preferred technical solution of this application, a support plate is fixedly connected between the two auxiliary plates on the same side, and ribs are fixedly connected to the upper surface of the support plate in a symmetrical and uniform manner.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: In the scheme of this application: 1. To address the issue that the cutting operation in the existing coating process requires pausing the conveyor belt, and this frequent start-stop intermittent operation affects coating efficiency, an inclined side groove rod is installed during the coating conveyor process of the crystalline silicon substrate. This rod performs an initial inclined pressing operation on the crystalline silicon substrate to guide the air bubbles between the film and the substrate. In the gap between two adjacent crystalline silicon substrates, a sliding cylinder on the outer wall of the side groove rod is pushed between them by an auxiliary spring. The double-sided arc blade below the sliding cylinder then adheres to the edge of the rear crystalline silicon substrate to cut the film on the surface of the substrate. This allows for inclined pressing of the crystalline silicon substrate surface to guide air bubbles, ensuring a tight film adhesion. The blade adheres to the front edge of the crystalline silicon substrate. As the crystalline silicon substrate continues to move, it pushes the blade along the outer wall of the inclined rod, completing the blade rotation. The blade remains in contact with the rear crystalline silicon substrate, eliminating the need to stop the machine to complete the cutting. This improves the efficiency and quality of coating crystalline silicon substrates. 2. Four intersecting semicircular rods are used, with two facing downwards and the other two placed on the downward-facing semicircular rods with their flat surfaces facing downwards. The crystalline silicon substrate passes through these rods and the film on its surface is then subjected to a second tilting and pressing process. This process allows for a second tilting and pressing process on the crystalline silicon substrate to prevent air bubbles from forming between the film and the substrate. 3. By installing an arc-shaped sleeve above the limiting shaft of the pressing roller, the adjusting bolt rotates on the inclined frame plate, thereby adjusting the height of the arc-shaped sleeve and changing the height of the pressing roller. An elastic telescopic rod is installed above the arc-shaped sleeve, allowing the pressing roller to be elastically adjusted according to the height of the board surface, preventing the pressing roller from being damaged when passing over uneven board surfaces. Thus, the height of the pressing roller can be adjusted according to the thickness of the board, and the elastic adjustment can cope with uneven crystalline silicon boards, preventing the surface of the roller from being damaged due to the unevenness of the board surface. 4. By rotating one of the semicircular rods around the positioning shaft disk, the angle between the two symmetrically distributed semicircular rods gradually increases, causing the extension bolt shaft to slide into the straight groove of the other semicircular rod. With continuous rotation, the two semicircular rods are spliced ​​together to form a round rod, thereby enabling the coated crystalline silicon substrate to be rolled and pressed to meet the coating requirements of the crystalline silicon substrate at this time. 5. When positioning and pressing are required, the extension pin of one semicircular rod slides out of the straight groove of the other semicircular rod and enters the bushing rod. The two semicircular rods rotate around the extension pin and the bushing rod, reducing the angle between them, so that the two semicircular rods are symmetrically distributed. The arc surface of one semicircular rod is used to tilt and press the silicon substrate during the coating process. When rolling pressing is required, one semicircular rod is driven by a rotating adjusting gear to rotate around the positioning shaft disk. During the rotation, the extension pin of one semicircular rod disengages from the bushing rod and enters the straight groove of the other semicircular rod. With continuous sliding, the two semicircular rods are spliced ​​together to form a round rod, which rotates around the connection with the positioning shaft disk to roll and press the silicon substrate during the coating process. This allows for relative adjustment of the pressing state according to the type of coating on the silicon substrate, enabling flexible switching between tilting and rolling pressing states to ensure the coating effect of the silicon substrate. Attached Figure Description

[0019] Figure 1 A schematic diagram of the overall structure of the crystalline silicon substrate coating machine provided in this application. Figure 1 ; Figure 2 A schematic diagram of the overall structure of the crystalline silicon substrate coating machine provided in this application. Figure 2 ; Figure 3 A partial structural diagram of the crystalline silicon substrate coating machine provided in this application. Figure 1 ; Figure 4 A partial structural diagram of the crystalline silicon substrate coating machine provided in this application. Figure 2 ; Figure 5 A partial structural diagram of the crystalline silicon substrate coating machine provided in this application. Figure 3 ; Figure 6 A partial structural diagram of the crystalline silicon substrate coating machine provided in this application. Figure 4 ; Figure 7 This is a partial structural schematic diagram of the inclined pressure component in the crystalline silicon substrate coating machine provided in this application; Figure 8 This is a partial structural schematic diagram of the auxiliary components in the crystalline silicon substrate coating machine provided in this application; Figure 9 for Figure 6 Enlarged structural diagram at point A; Figure 10 for Figure 8 A magnified structural diagram at point B in the middle.

[0020] The image shows: 1. Base frame; 2. Side frame; 3. Rotating shaft; 4. Side roller; 5. Shaft frame; 6. Cutting assembly; 601. Semi-arc groove plate; 602. Slider; 603. Side groove rod; 604. Auxiliary spring; 605. Arc plate; 606. Arc tooth plate; 607. Side window; 608. Auxiliary gear; 609. Slide cylinder; 610. Double-sided arc blade; 611. Bidirectional motor; 7. Inclined pressure assembly; 701. Limiting frame plate; 702. Positioning shaft plate; 703. Semi-circular rod; 704. Extension bolt shaft; 705. Slide groove; 706. Slide rod; 707. Positioning wheel; 708. Bushing rod; 709. Spring telescopic rod; 8. Auxiliary assembly; 801. 802. Inclined frame plate; 803. Pressing roller; 804. Adjusting bolt; 805. Elastic telescopic rod; 806. Limiting sliding window; 807. Limiting shaft; 808. Arc sleeve; 9. Rolling assembly; 901. Adjusting gear; 902. Straight tooth plate; 903. Push plate; 904. Positioning plate; 905. Electric telescopic rod; 906. Straight groove; 10. Fixed frame; 11. Auxiliary plate; 12. Transmission wheel; 13. Belt; 14. Auxiliary wheel; 15. Support frame; 16. Auxiliary frame; 17. Film roller; 18. Auxiliary roller; 19. Conveyor belt; 20. Drive motor; 21. Support plate; 22. Rib plate; 23. Upper pressure roller; 24. Guide roller. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0022] As described in the background art, in this coating process, the conveyor belt needs to drive the crystalline silicon substrate continuously to complete the coating, while the conveyor needs to be paused when the cutting operation is performed in order to coordinate with the cutting action. This intermittent operation mode will affect the overall efficiency of the crystalline silicon substrate coating.

[0023] To solve this technical problem, the present invention provides a crystalline silicon substrate coating machine, which is applied in the field of mechanical equipment technology.

[0024] Example 1, please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10A silicon substrate coating machine includes a base frame 1. Four side frames 2 are uniformly and rectangularly fixedly connected to the top of the base frame 1. A shaft frame 5 is fixedly connected to the top of the side frames 2. A rotating shaft 3 is movably connected between two adjacent shaft frames 5. Side rollers 4 are fixedly connected to the outer wall of the rotating shaft 3. A conveyor belt 19 is movably connected between two side rollers 4. Two support frames 15 are symmetrically and uniformly distributed and fixedly connected to the middle of the upper surface of the base frame 1. An auxiliary frame 16 is fixedly connected to the top of the support frame 15. A film roller 17 is movably connected between two auxiliary frames 16. A cutting assembly 6 is provided in the middle between the two support frames 15. The cutting assembly 6 includes a semi-arc groove plate 601 fixedly installed in the middle of the two support frames 15, with the groove openings of the two semi-arc groove plates 601 facing each other. A slider 6 is movably connected to the inner wall of the semi-arc groove plate 601. 02. A side groove rod 603 is fixedly connected between two sliders 602. A slide cylinder 609 is movably connected to the outer wall of the side groove rod 603. A double-sided arc blade 610 is movably installed below the slide cylinder 609. An arc plate 605 is fixedly connected to one end of one slider 602 away from the side groove rod 603, and the arc plate 605 is movably connected to the semi-arc groove plate 601. An arc tooth plate 606 is fixedly connected to the side of the arc plate 605 away from the side groove rod 603. Four fixed frames 10 are fixedly connected in a straight line evenly distributed on both sides of the upper surface of the base frame 1. An auxiliary plate 11 is fixedly connected above two adjacent fixed frames 10. The four auxiliary plates 11 are rectangularly distributed on one side of the support frame 15. An inclined pressure component 7 is provided above one set of auxiliary plates 11, and a... An auxiliary component 8 is included, whose drive motor 20 drives the auxiliary wheel 14 to rotate. Under the transmission of the belt 13, the auxiliary wheel 14 rotates accordingly, driving one of the side rollers 4 to cooperate with the other side roller 4 to transport and coat the crystalline silicon substrate. The substrate is guided by two guide rollers 24 and an upper pressure roller 23, passing through two support frames 15. The film wound on the film roller 17 passes through two auxiliary rollers 18 and then through the pressing roller 802, pressing the film onto the surface of the crystalline silicon substrate. As the crystalline silicon substrate passes through the pressing roller 802 in sequence, the coating operation is performed. The crystalline silicon substrate with film passes under the side groove rod 603, which is in an inclined state. The slide cylinder 609 on the outer wall of the side groove rod 603 is supported by an auxiliary spring 6. 04. Pressing: The double-sided arc blade 610 is brought into contact with the side edge of the crystalline silicon substrate. The side groove rod 603 then performs the first pressing operation on the crystalline silicon substrate. As the previous crystalline silicon substrate passes through the two support frames 15, the next crystalline silicon substrate follows. At this time, there is a certain space between the previous and next crystalline silicon substrates. The auxiliary spring 604 pushes the slide cylinder 609 into this space, contacting the front edge of a crystalline silicon substrate. The blade of the double-sided arc blade 610 then comes into contact with the edge of the crystalline silicon substrate. As the conveyor belt 19 continues to move the crystalline silicon substrate, the substrate also pushes the double-sided arc blade 610 to slide against the inclined side groove rod 603, cutting the film pressed onto the surface of the crystalline silicon substrate. With continued pushing, the double-sided arc blade 610 is pushed out of the gap between adjacent crystalline silicon substrates.The material enters the side of the crystalline silicon substrate, compressing the auxiliary spring 604 at one end of the side groove rod 603. After this, the bidirectional motor 611 is activated, driving the auxiliary gear 608 to rotate. This, in turn, causes the meshing arc-tooth plate 606 to move, rotating around the center of the side groove rod 603. This causes the slider 602 in the arc plate 605 to slide within the semi-arc groove plate 601, changing the tilt direction of the side groove rod 603. This allows the double-sided arc blade 610 to continue contacting the edge of the crystalline silicon substrate that has not passed through the support frame 15. The movement of the crystalline silicon substrate then pushes the slide cylinder 609 connected to the double-sided arc blade 610 from one end of the side groove rod 603 to the other, facilitating a second cutting operation.

[0025] By using an inclined side groove rod 603 during the coating and conveying process of the crystalline silicon substrate, the first inclined pressing operation is performed on the coated crystalline silicon substrate to guide the air bubbles between the film and the crystalline silicon substrate to be discharged. In the gap between two adjacent crystalline silicon substrates, the slide cylinder 609 on the outer wall of the side groove rod 603 is pushed into the gap by the auxiliary spring 604. The double-sided arc blade 610 below the slide cylinder 609 then fits against the edge of the rear crystalline silicon substrate to cut the film on the surface of the crystalline silicon substrate. This allows for inclined pressing of the crystalline silicon substrate surface to guide the air bubbles, ensuring that the film can be tightly adhered. The blade body fits against the front edge of the crystalline silicon substrate. As the crystalline silicon substrate continues to move, it pushes the blade body to move on the outer wall of the inclined rod, completing the blade body rotation. This ensures that the blade body is always in contact with the rear crystalline silicon substrate, and the cutting can be completed without stopping the machine, thereby improving the efficiency and quality of coating crystalline silicon substrates.

[0026] Furthermore, such as Figure 3 , Figure 4 and Figure 5 As shown, two auxiliary springs 604 are sleeved on both sides of the outer wall of the side groove rod 603. The other end of the auxiliary spring 604 is fixedly installed on the side of the slider 602. The auxiliary spring 604 pushes the slider 609 to fit against the crystalline silicon substrate, so as to guide the double-sided arc blade 610 into the space between two adjacent crystalline silicon substrates for cutting operation.

[0027] Furthermore, such as Figure 2 , Figure 3 and Figure 5 As shown, a side window 607 is provided in the middle of the side of one of the semi-arc groove plates 601. A bidirectional motor 611 is fixedly connected to the side of the support frame 15 away from the side groove rod 603. An auxiliary gear 608 is fixedly connected to the output shaft end of the bidirectional motor 611. One side of the auxiliary gear 608 passes through the side window 607 and meshes with the arc tooth plate 606. The bidirectional motor 611 drives the auxiliary gear 608 to rotate, and it meshes with the arc tooth plate 606 through the side window 607 of the semi-arc groove plate 601, thereby causing the arc plate 605 to slide in the semi-arc groove plate 601 and change the tilt direction of the side groove rod 603.

[0028] Example 2 further optimizes the crystalline silicon substrate coating machine provided in Example 1, specifically, as follows: Figure 2 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the inclined pressing assembly 7 includes a limiting frame plate 701 fixedly installed on the upper surface of two auxiliary plates 11 on one side. Two semi-circular rods 703 are symmetrically and evenly distributed on the inner wall of the limiting frame plate 701, and are symmetrically distributed between the two semi-circular rods 703. One semi-circular rod 703 has an extension bolt 704 fixedly connected to its end away from the limiting frame plate 701, and the other semi-circular rod 703 has a bushing rod 708 fixedly connected to its end away from the limiting frame plate 701. The extension bolt 704 is movably connected to the bushing rod 708. The conveyor belt 19 transports the coated and cut crystalline silicon substrate through the two support frames. 15. Entering below the semi-circular rod 703, since the four semi-circular rods 703 are distributed crosswise on the conveyor belt 19, with the arc surfaces of two of the semi-circular rods 703 facing downwards, and the other two semi-circular rods 703 are both mounted on the adjacent semi-circular rods 703 with their flat surfaces facing downwards, they are connected to the bushing rod 708 by the extension bolt shaft 704, thus being mounted on the conveyor belt 19. The crystalline silicon substrate with film passes through from below and contacts the arc surface of the semi-circular rod 703. The two relatively distributed semi-circular rods 703 press the film on the surface of the crystalline silicon substrate with their arc surfaces, and in an inclined state, thereby realizing the secondary inclined pressing of the film on the crystalline silicon substrate.

[0029] Four intersecting semicircular rods 703 are used, with two facing downwards and the other two mounted on the downward-facing semicircular rods 703 with their flat surfaces facing downwards. The crystalline silicon substrate passes through these rods and undergoes a secondary tilting and pressing process to coat the film on its surface. This process prevents air bubbles from forming between the film and the substrate.

[0030] Furthermore, such as Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the auxiliary plate 11 has linearly and evenly distributed grooves 705 on its surface. A slide rod 706 is movably connected to the inner wall of the groove 705. A positioning wheel 707 is movably installed below the slide rod 706. A spring telescopic rod 709 is fixedly connected to the other end of the slide rod 706. The other end of the spring telescopic rod 709 is fixedly installed on the lower surface of the auxiliary plate 11. The positioning wheels 707, which are linearly distributed below the auxiliary plate 11, provide concentrated guidance for the crystalline silicon substrate. The spring telescopic rod 709 provides elastic guidance, pushing the positioning wheels 707 to move. The slide rod 706 connected to the positioning wheel 707 moves in the groove 705, which is the direction in which the positioning wheel 707 moves.

[0031] Furthermore, such as Figure 2 and Figure 7 As shown, the other end of the semi-circular rod 703 is movably connected to the positioning shaft disk 702, and the positioning shaft disk 702 is movably installed on the upper surface of the auxiliary plate 11. The positioning shaft disk 702 limits one end of the semi-circular rod 703 to one side of the auxiliary plate 11 to prevent the semi-circular rod 703 from shifting during the pressing process. A rolling assembly 9 is provided on one side of the upper surface of the auxiliary plate 11.

[0032] Example 3 further optimizes the crystalline silicon substrate coating machine provided in Examples 1 and 2, specifically, as follows: Figure 1 , Figure 6 , Figure 8 and Figure 10 As shown, the auxiliary component 8 includes inclined frame plates 801 fixedly installed above the auxiliary plate 11. Limiting windows 805 are provided on the opposite surfaces of the two inclined frame plates 801. A limiting shaft 806 is movably connected between the two limiting windows 805. A pressing roller 802 is fixedly connected to the outer wall of the limiting shaft 806. Arc-shaped sleeves 807 are symmetrically and evenly distributed above the limiting shaft 806, and the outer wall of the arc-shaped sleeves 807 is movably installed on the inner wall of the limiting windows 805. An elastic telescopic rod 804 is fixedly connected above the arc-shaped sleeves 807. After the film passes over the pressing roller 802, it contacts the surface of the crystalline silicon substrate. Then, the conveyor belt 19 is activated, moving the crystalline silicon substrate to pull the film, causing the film roller 17 to release the film. The pressing roller 802 presses the silicon substrate onto the crystalline silicon substrate. Depending on the thickness of the crystalline silicon substrate, the adjusting bolt 803 is rotated. Since there is a threaded connection between the adjusting bolt 803 and the upper part of the inclined frame plate 801, the arc sleeve 807 connected to the elastic telescopic rod 804 is driven to move up and down. The elastic telescopic rod 804 is adapted to the surface of the crystalline silicon substrate. If the surface of the substrate is uneven, the pressing roller 802 will be driven and its height will change. At this time, the limiting shaft 806 of the pressing roller 802 is in a positioning connection, which can easily damage the surface of the pressing roller 802. The elastic telescopic rod 804 mounted above the arc sleeve 807 can provide elastic buffer for the pressing roller 802.

[0033] An arc-shaped sleeve 807 is installed above the limiting shaft 806 of the pressing roller 802. The adjusting bolt 803 rotates on the inclined frame plate 801, thereby adjusting the height of the arc-shaped sleeve 807 and changing the height of the pressing roller 802. An elastic telescopic rod 804 is installed above the arc-shaped sleeve 807, so that the pressing roller 802 can be elastically adjusted according to the height of the plate surface, preventing the pressing roller 802 from being damaged when passing over uneven plate surfaces. Thus, the height of the pressing roller 802 can be adjusted according to the thickness of the plate, and the elastic adjustment can cope with uneven crystalline silicon plates, preventing the surface of the roller from being damaged due to the unevenness of the plate surface.

[0034] Furthermore, such as Figure 8 and Figure 10As shown, an adjusting bolt 803 is movably installed above the elastic telescopic rod 804, and the adjusting bolt 803 is threadedly installed above the inclined frame plate 801. The height of the arc sleeve 807 connected to the elastic telescopic rod 804 is adjusted by the threaded connection of the adjusting bolt 803 on the inclined frame plate 801, so as to adjust the height of the pressing roller 802 according to the thickness of the plate.

[0035] Furthermore, such as Figure 3 , Figure 4 and Figure 5 As shown, two auxiliary rollers 18 are symmetrically and evenly distributed and movably installed between the two support frames 15 in the upper middle part, and the two auxiliary rollers 18 are located above the side groove rod 603. The auxiliary rollers 18 guide the film exported by the film roller 17 to prevent the film from wrinkling before lamination.

[0036] Example 4 further optimizes the crystalline silicon substrate coating machine provided in Examples 1, 2, and 3. Specifically, as follows: Figure 1 , Figure 7 , Figure 8 and Figure 9 As shown, the rolling assembly 9 includes a straight groove 906 formed in the plane of the semi-circular rod 703. The inner wall of the straight groove 906 is movably connected to the outer wall of the extension pin shaft 704. Two adjacent semi-circular rods 703 can be spliced ​​together to form a round rod. The two sets of semi-circular rods 703 are distributed crosswise between the two auxiliary plates 11. An adjusting gear 901 is fixedly connected to the outer wall of one of the positioning shaft discs 702. A straight toothed plate 902 is meshed with the outer wall of the adjusting gear 901. When the electric telescopic rod 905 is activated, it extends to push and drive the straight toothed plate 902 to move. The adjusting gear 901 meshes with the straight toothed plate 902. Driven to rotate, the semicircular rod 703 rotates around the positioning shaft disk 702. Since the two semicircular rods 703 are symmetrically distributed, the rotation of one semicircular rod 703 drives the extension bolt shaft 704 to move the bushing rod 708 of the other semicircular rod 703. The angle gradually increases, causing the extension bolt shaft 704 to slide into the straight groove 906 of the other semicircular rod 703. With continuous rotation, the two semicircular rods 703 are spliced ​​together to form a round rod. When the crystalline silicon substrate is transported here, the spliced ​​round rod rotates to roll and press the film covering the crystalline silicon substrate.

[0037] By rotating one of the semicircular rods 703 around the positioning shaft disk 702, the angle between the two symmetrically distributed semicircular rods 703 gradually increases, causing the extension bolt shaft 704 to slide into the straight groove 906 of the other semicircular rod 703. With continuous rotation, the two semicircular rods 703 are spliced ​​together to form a round rod, thereby enabling the rolled pressing of the coated crystalline silicon substrate to meet the coating requirements of the crystalline silicon substrate at this time.

[0038] Furthermore, such as Figure 9 As shown, a push plate 903 is fixedly connected to the side of the spur gear 902 away from the adjusting gear 901. An electric telescopic rod 905 is fixedly connected to one side of the push plate 903. A positioning plate 904 is fixedly connected to the other end of the electric telescopic rod 905. The positioning plate 904 is fixedly installed on the surface of the auxiliary plate 11. The electric telescopic rod 905 extends, and the push plate 903 drives the spur gear 902 to move, providing rotational power for the meshing adjusting gear 901.

[0039] Furthermore, such as Figure 7 As shown, a support plate 21 is fixedly connected between two auxiliary plates 11 on the same side. Ribs 22 are fixedly connected to the upper surface of the support plate 21 in a symmetrical and uniform manner. The ribs 22 are installed on the support plate 21 below the conveyor belt 19 to provide support for the conveyor belt 19 in the process of conveying the crystalline silicon substrate.

[0040] Furthermore, such as Figure 1 , Figure 2 and Figure 6 As shown, a transmission wheel 12 is fixedly connected to one side of one of the side rollers 4. A belt 13 is movably installed on the outer wall of the transmission wheel 12. An auxiliary wheel 14 is movably connected to the other end of the belt 13. A drive motor 20 is fixedly connected to one side of the auxiliary wheel 14, and the drive motor 20 is fixedly installed on the upper surface of the base frame 1. The drive motor 20 drives the auxiliary wheel 14 to rotate. Under the transmission of the belt 13, the auxiliary wheel 14 rotates accordingly. The auxiliary wheel 14 then drives one of the side rollers 4 to cooperate with the other side roller 4 to transport and coat the crystalline silicon substrate.

[0041] Furthermore, such as Figure 4 and Figure 5 As shown, an upper pressure roller 23 is movably installed in the lower middle of the two support frames 15, and the upper pressure roller 23 is located in the middle of the outer wall of the conveyor belt 19. Two guide rollers 24 are movably installed symmetrically and evenly in the lower middle of the two support frames 15, and the two guide rollers 24 are located in the inner wall of the conveyor belt 19. The conveyor belt 19 is adjusted by the two guide rollers 24 and the upper pressure roller 23, thereby adjusting the transmission process of the conveyor belt 19.

[0042] The process of using the crystalline silicon substrate coating machine provided by this invention is as follows: Working principle: The operator places the overall structure in a suitable position and installs the film roller 17 above the support frame 15. The film roller passes through two auxiliary rollers 18 and then through the pressing roller 802 to press the film onto the upper surface of the crystalline silicon substrate. As the crystalline silicon substrate passes through the pressing roller 802 in sequence, the film coating operation is carried out. Adjustment: Rotate the adjusting bolt 803 according to the thickness of the crystalline silicon substrate. Since there is a threaded connection between the adjusting bolt 803 and the upper part of the inclined frame plate 801, it drives the arc sleeve 807 connected to the elastic telescopic rod 804 to move up and down. The elastic telescopic rod 804 is matched with the surface of the crystalline silicon substrate. If the surface of the substrate is uneven, the pressing roller 802 will be driven and its height will change. At this time, the limiting shaft 806 of the pressing roller 802 is a positioning connection, which can easily damage the surface of the pressing roller 802. The elastic telescopic rod 804 mounted above the arc sleeve 807 can provide elastic buffer for the pressing roller 802. Conveying: The drive motor 20 drives the auxiliary wheel 14 to rotate. Under the transmission of the belt 13, the auxiliary wheel 14 rotates accordingly, driving one of the side rollers 4, which cooperates with the other side roller 4 to convey and coat the crystalline silicon substrate. It is guided by two guide rollers 24 and the upper pressure roller 23 to pass through two support frames 15. The conveyor belt 19 is supported by the ribs 22 above the support plate 21, providing a stable base for the coating process of the crystalline silicon substrate. When the crystalline silicon substrate passes through the two sets of auxiliary plates 11, the sides of the crystalline silicon substrate are... The positioning wheel 707 below the auxiliary plate 11 makes contact to centrally adjust the crystalline silicon substrate, and the spring telescopic rod 709 connected to the positioning wheel 707 elastically guides the crystalline silicon substrate. The sliding rod 706 connected to the positioning wheel 707 moves in the sliding groove 705 to limit the direction of movement of the positioning wheel 707. The film wound by the film roller 17 passes through the two auxiliary rollers 18 and then through the pressing roller 802 to press the film onto the upper surface of the crystalline silicon substrate. As the crystalline silicon substrate passes through the pressing roller 802 in sequence, the film coating operation is performed. The crystalline silicon substrate with film passes under the side groove rod 603. Film-coated cutting: The silicon wafer with film passes under the side groove bar 603, which is tilted at this time. The slide cylinder 609 on the outer wall of the side groove bar 603 is pressed by the auxiliary spring 604, which drives the double-sided arc blade 610 to fit against the side of the silicon wafer. The side groove bar 603 then performs the first pressing operation on the silicon wafer. After the previous silicon wafer passes through the two support frames 15, the next silicon wafer follows. At this time, there is a certain space between the previous and the next silicon wafer. The auxiliary spring 604 pushes the slide cylinder 609 into it and contacts the front edge of the silicon wafer. The blade of the double-sided arc blade 610 fits against the edge of the silicon wafer. As the conveyor belt 19 continues to move the silicon wafer, the silicon wafer also pushes the double-sided arc blade 610 to slide on the outer wall of the tilted side groove bar 603, thus cutting. As the film pressed onto the surface of the crystalline silicon substrate continues to be pushed, the double-sided arc blade 610 is pushed out of the gap between adjacent crystalline silicon substrates and enters the side of the crystalline silicon substrate. It compresses the auxiliary spring 604 at one end of the side groove rod 603. After completion, the bidirectional motor 611 is started to drive the auxiliary gear 608 to rotate, which in turn drives the meshing arc tooth plate 606 to move. The plate rotates around the center of the side groove rod 603, and the slider 602 in the arc plate 605 slides in the semi-arc groove plate 601, changing the tilt direction of the side groove rod 603. This causes the double-sided arc blade 610 to continue to contact the edge of the crystalline silicon substrate that has not passed through the support frame 15, so that the movement of the crystalline silicon substrate can push the slide cylinder 609 connected to the double-sided arc blade 610 from one end of the side groove rod 603 to the other end for recutting. Inclined pressing: The conveyor belt 19 conveys the film-coated and cut crystalline silicon substrate through two support frames 15 and into the area below the semi-circular rods 703. Since the four semi-circular rods 703 are distributed crosswise on the conveyor belt 19, with the arc surfaces of two of the semi-circular rods 703 facing downwards and the other two semi-circular rods 703 being mounted on adjacent semi-circular rods 703 with their flat surfaces facing downwards, they are connected to the bushing rods 708 by the extension bolt shaft 704. Since the two connected semi-circular rods 703 are symmetrically distributed, when the film-coated crystalline silicon substrate passes through from below, the semi-circular rods 703 cannot rotate with the positioning shaft disk 702, thus being mounted on the conveyor belt 19. The film-coated crystalline silicon substrate passes through from below and contacts the arc surfaces of the semi-circular rods 703. The two relatively distributed semi-circular rods 703 press the film on the surface of the crystalline silicon substrate with their arc surfaces in an inclined state, thereby achieving a secondary inclined pressing of the film coating on the crystalline silicon substrate. Rolling lamination: Depending on the film applied to the crystalline silicon substrate, rolling lamination can be adjusted. The electric telescopic rod 905 is then extended to move the straight toothed plate 902. The adjusting gear 901, meshing with the straight toothed plate 902, is rotated, causing the semi-circular rod 703 to rotate around the positioning shaft disc 702. Since the two semi-circular rods 703 are symmetrically distributed, the rotation of one semi-circular rod 703 drives the extension bolt 704 to actuate the bushing rod 708 of the other semi-circular rod 703, gradually increasing the angle. This allows the extension bolt 704 to slide into the straight groove 906 of the other semi-circular rod 703. With continuous rotation, the two semi-circular rods 703 are spliced ​​together to form a round rod. When the crystalline silicon substrate is transported here, the spliced ​​round rod rotates to roll lamination the film applied to the crystalline silicon substrate. After the second lamination is completed, the substrate is discharged from the conveyor belt 19.

[0043] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0044] Obviously, the embodiments described above are merely some embodiments of the present invention, not all embodiments. The accompanying drawings show preferred embodiments of the present invention, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms; rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this invention.

Claims

1. A silicon substrate coating machine, comprising a base frame (1), wherein two support frames (15) are symmetrically and evenly distributed and fixedly connected to the middle of the upper surface of the base frame (1), characterized in that, A cutting assembly (6) is provided in the middle between the two support frames (15). The cutting assembly (6) includes a semi-arc groove plate (601) fixedly installed in the middle of the two support frames (15), and the grooves of the two semi-arc groove plates (601) are opposite to each other. A slider (602) is movably connected to the inner wall of the semi-arc groove plate (601). A side groove rod (603) is fixedly connected between the two sliders (602). A slide cylinder (609) is movably connected to the outer wall of the side groove rod (603). A double-sided arc blade (610) is movably installed below the slide cylinder (609). An arc plate (605) is fixedly connected to one end of the slider (602) away from the side groove rod (603). An arc tooth plate (606) is fixedly connected to the side of the arc plate (605) away from the side groove rod (603). Four fixed frames (10) are fixedly connected in a straight line evenly distributed on both sides of the upper surface of the base frame (1). An auxiliary plate (11) is fixedly connected above two adjacent fixed frames (10). An inclined pressure component (7) is provided above one set of auxiliary plates (11), and an auxiliary component (8) is provided on one side of the upper surface of the other set of auxiliary plates (11).

2. The silicon substrate coating machine according to claim 1, characterized in that, Two auxiliary springs (604) are sleeved on both sides of the outer wall of the side groove rod (603), and the other end of the auxiliary spring (604) is fixedly installed on the side of the slider (602).

3. The crystalline silicon substrate coating machine according to claim 2, characterized in that, One of the semi-arc groove plates (601) has a side window (607) in the middle of its side. A bidirectional motor (611) is fixedly connected to the side of the support frame (15) away from the side groove rod (603). An auxiliary gear (608) is fixedly connected to the output shaft end of the bidirectional motor (611). One side of the auxiliary gear (608) passes through the side window (607) and meshes with the arc tooth plate (606).

4. A crystalline silicon substrate coating machine according to claim 3, characterized in that, The inclined pressure assembly (7) includes a limiting frame plate (701) fixedly installed on the upper surface of two auxiliary plates (11) on one side. The inner wall of the limiting frame plate (701) is symmetrically and evenly connected to two semi-circular rods (703), and the two semi-circular rods (703) are symmetrically distributed. One of the semi-circular rods (703) is fixedly connected to an extension bolt (704) at the end away from the limiting frame plate (701), and the other semi-circular rod (703) is fixedly connected to a bushing rod (708) at the end away from the limiting frame plate (701). The extension bolt (704) and the bushing rod (708) are movably connected.

5. A crystalline silicon substrate coating machine according to claim 4, characterized in that, The auxiliary plate (11) has grooves (705) evenly distributed in a straight line on its surface. A slide rod (706) is movably connected to the inner wall of the groove (705). A positioning wheel (707) is movably installed below the slide rod (706). A spring telescopic rod (709) is fixedly connected to the other end of the slide rod (706).

6. A crystalline silicon substrate coating machine according to claim 4, characterized in that, The other end of the semi-circular rod (703) is movably connected to a positioning shaft disk (702), and the positioning shaft disk (702) is movably installed on the upper surface of the auxiliary plate (11). A rolling assembly (9) is provided on one side of the upper surface of the auxiliary plate (11).

7. A crystalline silicon substrate coating machine according to claim 4, characterized in that, The auxiliary component (8) includes a slanted frame plate (801) fixedly installed above the auxiliary plate (11). Each of the two slanted frame plates (801) has a limiting slide window (805) on its opposite side. A limiting shaft (806) is movably connected between the two limiting slide windows (805). A pressing roller (802) is fixedly connected to the outer wall of the limiting shaft (806). Arc sleeves (807) are movably connected symmetrically and evenly distributed above the limiting shaft (806). The outer wall of the arc sleeves (807) is movably installed on the inner wall of the limiting slide window (805). An elastic telescopic rod (804) is fixedly connected above the arc sleeves (807).

8. A crystalline silicon substrate coating machine according to claim 6, characterized in that, The rolling assembly (9) includes a straight groove (906) formed on the plane of the semi-circular rod (703). The inner wall of the straight groove (906) is movably connected to the outer wall of the extension pin shaft (704). Two adjacent semi-circular rods (703) can be spliced ​​together to form a round rod. An adjusting gear (901) is fixedly connected to the outer wall of one of the positioning shaft discs (702). A straight toothed plate (902) is meshed with the outer wall of the adjusting gear (901).

9. A crystalline silicon substrate coating machine according to claim 8, characterized in that, A push plate (903) is fixedly connected to the side of the straight tooth plate (902) away from the adjusting gear (901). An electric telescopic rod (905) is fixedly connected to one side of the push plate (903). A positioning plate (904) is fixedly connected to the other end of the electric telescopic rod (905). The positioning plate (904) is fixedly installed on the surface of the auxiliary plate (11).

10. A crystalline silicon substrate coating machine according to claim 9, characterized in that, A support plate (21) is fixedly connected between the two auxiliary plates (11) on the same side, and ribs (22) are fixedly connected to the upper surface of the support plate (21) in a symmetrical and uniform manner.

Citation Information

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