Signal detection method based on co-encapsulation system

Abstract

The application relates to a signal detection method based on a co-encapsulation system. The method comprises the following steps: acquiring an optical test signal based on an optical interface of the co-encapsulation system, modeling the interconnection of devices between the optical interface and an electrical interface in the co-encapsulation system, determining an equivalent model between the optical interface and the electrical interface, determining interconnection parameters for characterizing signal transmission characteristics between the optical interface and the electrical interface based on the equivalent model, determining an electrical test signal of the electrical interface according to the optical test signal and the interconnection parameters, and determining whether the signal integrity of an interface signal of the electrical interface in the co-encapsulation system meets the application index requirement according to the electrical test signal. The above scheme can perform signal integrity testing on the electrical interface inside the co-encapsulation system under the co-encapsulation architecture.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of signal processing, in particular to a signal detection method based on a co-packaged system. BACKGROUND

[0002] With the continuous development of advanced packaging technology, CPO (Co-Packaged Optics) has become the next generation of optical interconnection solution widely concerned in the industry due to its significant advantages in high interconnection density, low latency and low power consumption. Compared with traditional pluggable optical modules, the CPO architecture adopts advanced semiconductor packaging technology to integrate optical transceiver chips and electrical driving amplification chips into a high-speed optical engine (OE), and further co-packages with CPUs (Central Processing Unit), GPUs (Graphics Processing Unit) or switch chips to form the high-speed optical I / O interface of ASIC (Application Specific Integrated Circuit). With the continuous improvement of data rate between ASICs such as switches, computers and storage devices, CPO technology is gradually becoming the core support for efficient interconnection of future super-large data centers. However, unlike the characteristics of optical and electrical decoupling in pluggable architecture, CPO architecture integrates optical interconnection and electrical interconnection in a single chip system through advanced packaging technology. At this time, the electrical interface is completely in the chip system package, and the test engineer cannot directly contact the electrical interface and carry out signal integrity analysis by means of traditional test probes or equipment. The compliance test method based on CEI (OIF electrical interface standard) commonly used in the development and production stages of existing network equipment cannot be directly accessed to the electrical interface inside the co-packaged system, which makes it difficult to execute. This not only limits the actual verification and measurement of the electrical interface, but also brings difficulties to link loss budget analysis, link performance debugging and optimization. Therefore, how to realize effective signal testing of the electrical interface inside the system under the CPO architecture has become a key technical problem to be solved. SUMMARY

[0003] Therefore, it is necessary to provide a signal detection method based on a co-packaged system, which can test the interface signal of the electrical interface inside the co-packaged system under the co-packaged architecture.

[0004] In a first aspect, the present application provides a signal detection method based on a co-packaged system, which comprises:

[0005] obtaining an optical test signal based on an optical interface of the co-packaged system;

[0006] modeling interconnectivity of devices between the optical interface and the electrical interface in the co-packaged system, determining an equivalent model between the optical interface and the electrical interface;

[0007] determining, based on the equivalent model, interconnect parameters between the optical interface and the electrical interface that characterize signal transmission characteristics;

[0008] determining, based on the optical test signal and the interconnect parameters, an electrical test signal for the electrical interface;

[0009] determining, based on the electrical test signal, whether an interface signal of the electrical interface in the co-packaged system meets an application metric requirement in terms of signal integrity.

[0010] In one of the embodiments, modeling interconnectivity of devices between the optical interface and the electrical interface in the co-packaged system, determining an equivalent model between the optical interface and the electrical interface, comprises:

[0011] modeling interconnectivity of devices between the optical interface and the electrical interface in the co-packaged system that are purely electrical interconnects, determining a first transmission model;

[0012] modeling interconnectivity of devices between the optical interface and the electrical interface in the co-packaged system that are purely optical interconnects, determining a second transmission model;

[0013] modeling interconnectivity of devices between the optical interface and the electrical interface in the co-packaged system that are cross-modal converters, determining a third transmission model;

[0014] determining, based on the first transmission model, the second transmission model and the third transmission model, the equivalent model between the optical interface and the electrical interface.

[0015] In one of the embodiments, the first transmission model has a representation function as follows:

[0016] ;

[0017] wherein, is an output signal of a device that is a purely electrical interconnect between the optical interface and the electrical interface, is an input signal of a device that is a purely electrical interconnect between the optical interface and the electrical interface.

[0018] In one of the embodiments, the second transmission model has a representation function as follows: ;

[0019] wherein, is a transmission attenuation of a device that is a purely optical interconnect between the optical interface and the electrical interface in the co-packaged system; the unit of the signal transmission attenuation is decibel.

[0020] In one of the embodiments, the representation function of the third transmission model is:

[0021] wherein, is the output signal of the cross-modal conversion device between the optical interface and the electrical interface in the co-packaging system, is the input signal of the cross-modal conversion device between the optical interface and the electrical interface in the co-packaging system.

[0022] In one of the embodiments, the representation function of the equivalent model is:

[0023]

[0024] wherein, is the first transmission model, is the second transmission model, is the third transmission model, n is the number of the pure electrical interconnection devices between the optical interface and the electrical interface, p is the number of the pure optical interconnection devices between the optical interface and the electrical interface, and m is the number of the cross-modal conversion devices between the optical interface and the electrical interface.

[0025] In one of the embodiments, the electrical test signal of the electrical interface is determined according to the optical test signal and the interconnection parameter, comprising:

[0026] performing Laplace transform on the optical test signal to determine an optical signal parameter;

[0027] taking the parameter ratio of the optical signal parameter and the interconnection parameter as an electrical signal parameter;

[0028] performing inverse Laplace transform on the electrical signal parameter to determine the electrical test signal of the electrical interface.

[0029] In one of the embodiments, whether the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement is determined according to the electrical test signal, comprising:

[0030] if the electrical interface is a transmitting end interface, whether the baud rate, the output voltage amplitude, the wireless link signal, the steady-state voltage, the linear fitting pulse peak value, the signal-to-noise distortion ratio, the time interval error jitter, the root mean square value jitter and the signal level duty cycle of the electrical interface meet the protocol standard is determined based on the electrical test signal;

[0031] if yes, it is determined that the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement.

[0032] ​​In one embodiment, the determining, according to the electrical test signal, whether the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement further comprises:

[0033] If the electrical interface is a receiving end interface, determining, based on the electrical test signal, whether the interference tolerance, jitter tolerance and bit error rate of the electrical interface meet the protocol standard;

[0034] If yes, determining that the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement.

[0035] In one embodiment, before the obtaining, based on the optical interface of the co-packaging system, the optical test signal, further comprising:

[0036] Adjusting, based on the target working mode, the data rate, modulation mode, test vector and digital signal processing configuration of the application specific integrated circuit in the co-packaging system, and adjusting, based on the target working mode, the digital signal processing configuration of the co-packaging optical engine in the co-packaging system.

[0037] The above signal detection method based on the co-packaging system obtains an optical test signal based on an optical interface of the co-packaging system, models the interconnection of devices between the optical interface and the electrical interface in the co-packaging system, determines an equivalent model between the optical interface and the electrical interface, determines interconnection parameters between the optical interface and the electrical interface based on the equivalent model, determines an electrical test signal of the electrical interface according to the optical test signal and the interconnection parameters, and determines whether the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement according to the electrical test signal. The problem that a test engineer cannot directly establish electrical contact with the electrical interface of the co-packaging system and perform signal integrity testing by using traditional test equipment because the electrical interface of the co-packaging system is wrapped in the package of the entire chip system is solved. In the above scheme, the interconnection of devices between the optical interface and the electrical interface in the co-packaging system is modeled, and the electrical test signal of the electrical interface inside the co-packaging system can be obtained based on the optical test signal detected by the optical interface of the co-packaging system through the established equivalent model, so as to determine whether the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement according to the electrical test signal. The problem that the traditional electrical interface cannot be contacted and tested under the co-packaging architecture is solved, and the signal integrity of the electrical interface inside the co-packaging system can be tested under the co-packaging architecture. BRIEF DESCRIPTION OF DRAWINGS

[0038] Figure 1 A flowchart of the signal detection method based on the co-packaging system in one embodiment;

[0039] Figure 2 A system structure diagram of the co-packaging system in one embodiment;

[0040] Figure 3 A flowchart of a method for determining an electrical test signal in an embodiment is shown in FIG. 1.

[0041] Figure 4 An example diagram of high-speed signal transmission based on a co-packaged system in an embodiment is shown in FIG. 2.

[0042] Figure 5 An example diagram of high-speed signal transmission based on a co-packaged system in another embodiment is shown in FIG. 3.

[0043] Figure 6 An internal structure diagram of a computer device in an embodiment is shown in FIG. 4. DETAILED DESCRIPTION

[0044] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not used to limit the present application.

[0045] In an embodiment, as shown in FIG. 1, a signal detection method based on a co-packaged system is provided. The embodiment takes the method applied to a terminal as an example for illustration. It can be understood that the method can also be applied to a server. In the embodiment, the method includes the following steps. Figure 1

[0046] S110, obtaining an optical test signal based on an optical interface of a co-packaged system.

[0047] In the embodiment, a system structure diagram of the co-packaged system is shown in FIG. 2. The co-packaged system includes an ASIC chip, a co-packaged optical engine, an optical fiber, a substrate (a packaging substrate), a PCB (a printed circuit board), an electrical interface and an optical interface. The ASIC chip is a special-purpose chip designed for a specific purpose. The co-packaged optical engine is an optical engine module used to be integrated on the same substrate with the ASIC chip through an optoelectronic fusion scheme based on advanced packaging technology. The substrate is a packaging substrate for loading chips, mainly bearing electrical connection, mechanical support and signal distribution functions. The PCB is a carrier for electrical interconnection of electronic components. The core measurements for evaluating the optical test signal include but are not limited to optical power, input port allowed frequency offset, output signal rate, input jitter tolerance, extinction ratio and side mode suppression ratio. Figure 2

[0048] ​​Specifically, since the optical interface is exposed outside the co-packaged system, the optical test signal can be obtained by measuring the optical interface of the co-packaged system through a related professional test measurement device. The related professional test measurement device can include a high-speed oscilloscope, a high-speed optical probe, and corresponding data acquisition and processing software operated by a matching device.

[0049] For example, before obtaining the optical test signal based on the optical interface of the co-packaged system, the data rate, modulation mode, test vector, and digital signal processing configuration of the application-specific integrated circuit in the co-packaged system can be adjusted based on the target working mode, and the digital signal processing configuration of the co-packaged optical engine in the co-packaged system can be adjusted based on the target working mode.

[0050] In this embodiment, the data rate of the ASIC, i.e., the application-specific integrated circuit, generally refers to the maximum bandwidth of processing data, i.e., the amount of data processed per second. In this embodiment, the modulation mode can include NRZ (Not Return to Zero) and PAM-4 (Pulse Amplitude Modulation) modulation modes. The test vector is a combination of input and output data used to verify the correctness of the function of a circuit or system, and its core function is to judge whether the design meets the specification requirements by comparing the actual running result with the expected output. The test vector includes a set of input signals and corresponding expected output signals, for example, the test vector can include input or output excitation data, timing control parameters, and verification data of an inter-chip interconnection protocol. The DSP in the ASIC refers to a hardware module or chip designed specifically for digital signal processing, which is usually integrated in the ASIC to achieve specific signal processing functions such as filtering and transformation. The DSP of the co-packaged optical engine compensates and adjusts the signal based on the loss, distortion, and timing deviation in the optical signal transmission process to ensure the stability and accuracy of data transmission. The target working mode is the working mode of the co-packaged system after adjusting the data rate, modulation mode, test vector, and digital signal processing of the application-specific integrated circuit in the co-packaged system to the desired data. The desired data can be set according to actual needs.

[0051] The above scheme adjusts the ASIC and the co-packaged optical engine in the co-packaged system based on the target working mode, which enables the ASIC and the co-packaged optical engine in the co-packaged system to operate in the target working mode, facilitating subsequent detection of the interface signal of the electrical interface in the co-packaged system.

[0052] S120, interconnectivity modeling is performed on the devices between the optical interface and the electrical interface in the co-packaged system to determine the equivalent model between the optical interface and the electrical interface.

[0053] It should be noted that the interconnection relationship between the optical interface and the electrical interface in the co-packaging system includes electrical interconnection, optical interconnection and cross-modal conversion. The devices of electrical interconnection include drivers, transimpedance amplifiers, traces and vias on PCBs. The devices of optical interconnection include optical fibers, wavelength division multiplexing devices and polarization related devices. The devices of cross-modal conversion include modulators for electrical-optical conversion and detectors for optical-electrical conversion.

[0054] Exemplarily, the interconnection modeling of the devices between the optical interface and the electrical interface in the co-packaging system, and the determination of the equivalent model between the optical interface and the electrical interface, include:

[0055] The interconnection modeling of the devices of pure electrical interconnection between the optical interface and the electrical interface in the co-packaging system, and the determination of the first transmission model; the interconnection modeling of the devices of pure optical interconnection between the optical interface and the electrical interface in the co-packaging system, and the determination of the second transmission model; the interconnection modeling of the devices of cross-modal conversion between the optical interface and the electrical interface in the co-packaging system, and the determination of the third transmission model; and the determination of the equivalent model between the optical interface and the electrical interface based on the first transmission model, the second transmission model and the third transmission model.

[0056] Specifically, the input signal and the output signal of the device of pure electrical interconnection are both electrical signals, the device of pure electrical interconnection is generally a linear device, or operates in a linear operating interval, so that the transmission function can be used as the transmission model of the device of pure electrical interconnection.

[0057] Exemplarily, the representation function of the first transmission model is: ; wherein, is the output signal of the device of pure electrical interconnection between the optical interface and the electrical interface, is the input signal of the device of pure electrical interconnection between the optical interface and the electrical interface. is the representation function of the first transmission model, 1≤i≤n, and i is an integer, and n represents that there are n devices of pure electrical interconnection between the optical interface and the electrical interface.

[0058] Further, the input signal and the output signal of the device of pure optical interconnection are both optical signals, the device of pure optical interconnection generally has a fixed transmission attenuation, and the loss condition of the device is irrelevant to the data rate of the signal transmission, but depends on the design and processing technology of the device of pure optical interconnection. Therefore, the transmission gain of the device of pure optical interconnection can be used as the transmission model of the device of pure optical interconnection.

[0059] Exemplarily, the representation function of the second transmission model is: .

[0060] wherein, is the transmission attenuation of the device of pure optical interconnection between the optical interface and the electrical interface in the co-packaging system; the unit of the signal transmission attenuation is decibel. is the representation function of the second transmission model, 1≤k≤p, and k is an integer, and p represents that there are p pure optical interconnection devices between the optical interface and the electrical interface.

[0061] Further, the input signal and the output signal of the cross-modal conversion device are different types of signals, for example, if the input signal of the cross-modal conversion device is an electrical signal, the output signal thereof is an optical signal. In the target application scenario, the cross-modal conversion device needs to operate in the linear operating range, that is, there is a proportional relationship between the input signal and the output signal of the cross-modal conversion device, so that a single conversion gain can be used as the transmission model of the cross-modal conversion device.

[0062] For example, the representation function of the third transmission model is: .

[0063] wherein, is the output signal of the cross-modal conversion device between the optical interface and the electrical interface in the co-packaging system, is the input signal of the cross-modal conversion device between the optical interface and the electrical interface in the co-packaging system. is the representation function of the third transmission model, 1≤j≤m, and j is an integer, and m represents that there are m cross-modal conversion devices between the optical interface and the electrical interface. For example, may be the output power of the jth cross-modal conversion device, may be the input power of the jth cross-modal conversion device.

[0064] Further, the representation function of the equivalent model is: .

[0065] wherein, is the first transmission model, is the second transmission model, is the third transmission model, n is the number of pure electrical interconnection devices between the optical interface and the electrical interface, p is the number of pure optical interconnection devices between the optical interface and the electrical interface, and m is the number of cross-modal conversion devices between the optical interface and the electrical interface.

[0066] The above scheme constructs an equivalent model between the electrical interface and the optical interface in a co-packaging system, and the equivalent model can represent the signal transmission parameters of the pure electrical interconnection device, the pure optical interconnection device and the cross-modal conversion device between the electrical interface and the optical interface.

[0067] S130, based on the equivalent model, determining an interconnection parameter between the optical interface and the electrical interface for representing signal transmission characteristics.

[0068] It should be noted that the interconnection parameters between the optical interface and the electrical interface representing the signal transmission characteristics include but are not limited to transfer functions, scattering parameters, impulse responses, FIR (Finite Impulse Response) filter processed signals and IIR (Infinite Impulse Response) filter processed signals.

[0069] S140, determining the electrical test signal of the electrical interface according to the optical test signal and the interconnection parameters.

[0070] Exemplarily, as shown in the figure, determining the electrical test signal of the electrical interface according to the optical test signal and the interconnection parameters comprises: Figure 3

[0071] S1401, performing Laplace transform on the optical test signal to determine the optical signal parameter.

[0072] Exemplarily, the calculation formula of the optical signal parameter is: .

[0073] Wherein, y(t) is the optical test signal, and Y(S) is the optical signal parameter (Laplace transform of y(t)).

[0074] S1402, taking the parameter ratio of the optical signal parameter and the interconnection parameter as the electrical signal parameter.

[0075] Exemplarily, the calculation formula of the electrical signal parameter is: .

[0076] Wherein, X(S) is the electrical signal parameter, which is the Laplace transform of the electrical test signal to be solved.

[0077] S1403, performing inverse Laplace transform on the electrical signal parameter to determine the electrical test signal of the electrical interface.

[0078] Exemplarily, the calculation formula of the electrical test signal is: .

[0079] Wherein, x(t) is the electrical test signal.

[0080] Exemplarily, taking the optical test signal as an example, performing Laplace transform on the optical test signal to determine the optical signal parameter corresponding to the optical test signal, determining the interconnection parameter corresponding to the device testing the optical test signal in the co-packaging system based on the equivalent model, and determining the electrical signal parameter corresponding to the optical test signal based on the parameter ratio of the optical signal parameter corresponding to the optical test signal and the interconnection parameter corresponding to the device testing the optical test signal.

[0081] ​S150, determining whether the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement according to the electrical test signal.

[0082] For example, if the electrical interface is a transmitting end interface, it is determined whether the baud rate, output voltage amplitude, linear fitting pulse response, steady-state voltage, linear fitting pulse peak and signal-to-noise distortion ratio of the electrical interface meet the protocol standard based on the electrical test signal; if so, it is determined that the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement. That is, if the electrical test signal meets the signal specification of the complete interface signal specified in the signal test specification, it is determined that the electrical test signal meets the protocol standard, that is, the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement.

[0083] The linear fitting pulse peak, i.e. Linear Fit Pulse Peak, is a technical parameter in the communication interface standard, which refers to the proportional relationship between the linear adjustment pulse peak voltage of the transmitter output signal and the steady-state voltage. The signal-to-noise distortion ratio, i.e. SNDR, is a key indicator for measuring signal quality, which refers to the ratio of signal power to the sum of noise and distortion power.

[0084] It should be noted that the electrical interface in the co-packaging system can be located at the transmitting end of the entire link, or at the receiving end. For example, Figure 4 As shown in FIG. 2, if the electrical interface is located at the transmitting end, when the high-speed signal leaves the ASIC transmitting end, i.e. the Tx end of the ASIC, passes through the corresponding packaging loss, enters the input end of the co-packaging optical engine through the electrical interface, and is amplified and equalized by the driver, electro-optical conversion modulator and wavelength division multiplexer inside the co-packaging optical engine, and finally completes the electro-optical conversion, the optical signal is output from the co-packaging optical engine through the optical fiber. A high-speed sampling oscilloscope, a high-speed optical probe and corresponding acquisition software are used to obtain an optical test signal at the optical interface. After the electrical test signal is determined, the integrity of the electrical test signal is analyzed based on the signal test specification to determine whether the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement. The signal test specification can be the network interconnection protocol OIF-CEI-112G-XSR-PAM4.

[0085] For example, if the electrical interface is a receiving end interface, it is determined whether the interference tolerance, jitter tolerance and bit error rate of the electrical interface meet the protocol standard based on the electrical test signal; if so, it is determined that the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement.

[0086] For example, the linear fitting pulse response, steady-state voltage, linear fitting pulse peak and SNDR can be determined according to the OIF-CEI-05.2 standard document.

[0087] The linear fitting impulse response is determined as follows: the test signal is defined as y(k), and the corresponding code pattern of the test signal is x(n). N is the test vector length, and M is the number of samples in each code pattern. The linear fitting impulse length is... , The linearly fitted pulse delay is... , .

[0088] Calculate matrix or vector Y based on the test signal, test vector length, and number of samples:

[0089]

[0090] Furthermore, the matrix is ​​determined based on the linearly fitted pulse delay and the test vector length. :

[0091]

[0092] Furthermore, according to the matrix And the matrix X for determining the length of the test vector:

[0093]

[0094] Furthermore, matrix P is determined based on matrices X and Y:

[0095]

[0096] Furthermore, based on the first part of matrix X... Row data determination matrix :

[0097]

[0098] Based on matrix P, matrix The error matrix E is calculated from the matrix Y, the number of samples, and the test vector length.

[0099]

[0100] in, Error waveform matrix From the first part of matrix P Columns constitute a matrix for:

[0101]

[0102] Read in column order Matrix to obtain linear fitting impulse response .

[0103] steady-state voltage The method for determining it is as follows:

[0104]

[0105] Linear fitting of pulse peak The method for determining it is as follows:

[0106]

[0107] The method for determining SNDR is as follows:

[0108]

[0109] in, It is the mean square error of the error waveform e(k).

[0110] The determination method is as follows: for each code level of the PAM4 code pattern (code patterns 0, 1, 2, 3, a total of four types), locate the position in the test waveform where the code pattern appears continuously at least 6 times, and calculate the root mean square of the waveform data at that end. Let i = 0, 1, 2, 3. Calculate... .

[0111] like Figure 5 As shown, if the electrical interface is the receiving end interface, after the high-speed signal completes long-distance fiber optic transmission, it is connected to the input end of the co-packaged optical engine through the optical interface of the co-packaged system. The input optical signal undergoes optical-to-electric conversion through the wavelength division multiplexer, optical-to-electrical conversion detector, and transimpedance amplifier inside the co-packaged optical engine, followed by amplification and equalization. Finally, after appropriate packaging loss, the converted electrical signal is connected to the ASIC receiver, i.e., the Rx terminal of the ASIC, through the electrical interface. Based on this, a high-speed sampling oscilloscope, a high-speed optical probe, and corresponding acquisition software are used to acquire optical test signals at the optical interface. After determining the electrical test signals, integrity analysis is performed on the electrical test signals based on signal test specifications to determine whether the signal integrity of the interface signal of the electrical interface in the co-packaged system meets the application requirements. If the electrical test signals conform to the complete interface signal specifications stipulated in the signal test specifications, then the electrical test signals are deemed to conform to the protocol standard, i.e., the signal integrity of the interface signal of the electrical interface in the co-packaged system meets the application requirements.

[0112] The above scheme can perform signal integrity detection on the output signal of the electrical interface at the output end and the input signal of the electrical interface at the input end.

[0113] In the signal detection method based on the co-packaging system, the optical interface of the co-packaging system obtains an optical test signal, models the interconnection of devices between the optical interface and the electrical interface in the co-packaging system, determines an equivalent model between the optical interface and the electrical interface, and determines interconnection parameters between the optical interface and the electrical interface based on the equivalent model; the electrical test signal of the electrical interface is determined according to the optical test signal and the interconnection parameters; and whether the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement is determined according to the electrical test signal. The problem that the test engineer cannot directly establish electrical contact with the electrical interface of the co-packaging system by using the traditional test equipment and perform signal integrity testing because the electrical interface of the co-packaging system is wrapped in the package of the entire chip system is solved. In the above scheme, the interconnection of devices between the optical interface and the electrical interface in the co-packaging system is modeled, the electrical test signal of the electrical interface inside the co-packaging system is derived based on the optical test signal detected by the optical interface of the co-packaging system through the established equivalent model, whether the signal integrity of the interface signal of the electrical interface in the co-packaging system meets the application index requirement is determined according to the electrical test signal, and the problem of the difficulty in contacting and testing the traditional electrical interface under the co-packaging architecture is solved, so that the signal integrity testing of the electrical interface inside the co-packaging system under the co-packaging architecture can be performed.

[0114] In one embodiment, a computer device, which can be a terminal, has an internal structure diagram as shown in Figure 6 The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit, and an input device. The processor, the memory, and the input / output interface are connected through a system bus, and the communication interface, the display unit, and the input device are connected to the system bus through the input / output interface. The processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for running the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is configured to exchange information between the processor and external devices. The communication interface of the computer device is configured to perform wired or wireless communication with external terminals. The wireless communication can be achieved through WIFI, mobile cellular network, NFC (Near Field Communication), or other technologies. The computer program is executed by the processor to implement a signal detection method based on a co-packaging system. The display unit of the computer device is configured to form a visually visible picture, which can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer overlaid on the display screen, or can be a key, a trackball, or a touchpad arranged on the shell of the computer device. The input device can also be an external keyboard, a touchpad, a mouse, or the like.

[0115] Those skilled in the art can understand that, Figure 6 The structure shown in the figure is only a block diagram of part of the structure related to the scheme of the present application, and does not constitute a limitation on the computer device to which the scheme of the present application is applied. The specific computer device can include more or fewer components than those shown in the figure, or combine certain components, or have a different component arrangement.

[0116] In one embodiment, a computer device is provided, comprising a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the following steps:

[0117] Step one, obtaining an optical test signal based on an optical interface of a co-packaged system;

[0118] Step two, modeling the interconnection of devices between the optical interface and the electrical interface in the co-packaged system to determine an equivalent model between the optical interface and the electrical interface;

[0119] Step three, determining an interconnection parameter representing signal transmission characteristics between the optical interface and the electrical interface based on the equivalent model;

[0120] Step four, determining an electrical test signal of the electrical interface according to the optical test signal and the interconnection parameter;

[0121] Step five, determining whether the signal integrity of the interface signal of the electrical interface in the co-packaged system meets the application index requirement according to the electrical test signal.

[0122] In one embodiment, a computer readable storage medium is provided, having a computer program stored thereon, and the computer program is executed by a processor to implement the following steps:

[0123] Step one, obtaining an optical test signal based on an optical interface of a co-packaged system;

[0124] Step two, modeling the interconnection of devices between the optical interface and the electrical interface in the co-packaged system to determine an equivalent model between the optical interface and the electrical interface;

[0125] Step three, determining an interconnection parameter representing signal transmission characteristics between the optical interface and the electrical interface based on the equivalent model;

[0126] Step four, determining an electrical test signal of the electrical interface according to the optical test signal and the interconnection parameter;

[0127] Step five, determining whether the signal integrity of the interface signal of the electrical interface in the co-packaged system meets the application index requirement according to the electrical test signal.

[0128] In one embodiment, a computer program product is provided, comprising a computer program which, when executed by a processor, implements the following steps:

[0129] Step one, obtaining an optical test signal based on an optical interface of a co-packaged system;

[0130] Step two, modeling the interconnectivity of devices between the optical interface and the electrical interface in the co-packaged system, determining an equivalent model between the optical interface and the electrical interface;

[0131] Step three, determining interconnection parameters between the optical interface and the electrical interface based on the equivalent model, the interconnection parameters characterizing signal transmission characteristics;

[0132] Step four, determining an electrical test signal of the electrical interface according to the optical test signal and the interconnection parameters;

[0133] Step five, determining whether the signal integrity of the interface signal of the electrical interface in the co-packaged system meets the application index requirements according to the electrical test signal.

[0134] It should be noted that the user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the present application are all information and data authorized by the user or authorized by all parties, and the collection, use and processing of related data need to comply with relevant national and regional laws, regulations and standards.

[0135] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments of the methods can be included. Any reference to memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration but not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The database involved in the embodiments provided in the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., without being limited thereto. The processor involved in the embodiments provided in the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processing, a programmable logic device, a data processing logic device based on quantum computing, etc., without being limited thereto.

[0136] Any combination of the technical features of the above embodiments can be made. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combination of the technical features does not exist, it should be considered as the scope of the present application.

[0137] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A signal detection method based on a co-encapsulation system, characterized in that, The signal detection method based on the co-encapsulation system is executed by a computer device, and the method comprises: An optical test signal is obtained based on an optical interface of the co-encapsulation system; Interconnectivity modeling is performed on devices between the optical interface and an electrical interface in the co-encapsulation system to determine an equivalent model between the optical interface and the electrical interface; Based on the equivalent model, interconnectivity parameters of the optical interface and the electrical interface are determined to characterize signal transmission characteristics; Based on the optical test signal and the interconnectivity parameters, an electrical test signal of the electrical interface is determined; Based on the electrical test signal, it is determined whether signal integrity of an interface signal of the electrical interface in the co-encapsulation system meets application index requirements.

2. The method of claim 1, wherein, Interconnectivity modeling is performed on devices between the optical interface and an electrical interface in the co-encapsulation system to determine an equivalent model between the optical interface and the electrical interface, comprising: Interconnectivity modeling is performed on devices between the optical interface and an electrical interface in the co-encapsulation system to determine an equivalent model between the optical interface and the electrical interface, comprising: Interconnectivity modeling is performed on devices between the optical interface and an electrical interface in the co-encapsulation system to determine an equivalent model between the optical interface and the electrical interface, comprising: Based on the first transmission model, the second transmission model and the third transmission model, an equivalent model between the optical interface and the electrical interface is determined. The representation function of the first transmission model is:

3. The method of claim 2, wherein, The representation function of the equivalent model is: ； wherein an output signal for a device with a pure electrical interconnection between an optical interface and an electrical interface, an input signal for a device with a pure electrical interconnection between an optical interface and an electrical interface.

4. The method of claim 2, wherein, The representation function of the second transmission model is: ; wherein, is the transmission attenuation of the device for pure optical interconnection between the optical interface and the electrical interface in the co-packaged system; the unit of the signal transmission attenuation is decibel.

5. The method of claim 2, wherein, The representation function of the third transmission model is: ;‌ wherein, an output signal for a device that cross-modally converts between an optical interface and an electrical interface in the co-packaged system, an input signal for a device that cross-modally converts between an optical interface and an electrical interface in the co-packaged system.

6. The method of claim 2, wherein, Based on the optical test signal and the interconnectivity parameters, an electrical test signal of the electrical interface is determined, comprising: ； wherein, is a first transmission model, is a second transmission model, is a third transmission model, n is the number of devices with pure electrical interconnect between the optical and electrical interfaces, p is the number of devices with pure optical interconnect between the optical and electrical interfaces, and m is the number of devices with cross-modal conversion between the optical and electrical interfaces.

7. The method of claim 1, wherein, Laplace transformation is performed on the optical test signal to determine an optical signal parameter; The parameter ratio of the optical signal parameter and the interconnectivity parameter is taken as an electrical signal parameter; Inverse Laplace transformation is performed on the electrical signal parameter to determine the electrical test signal of the electrical interface. Based on the electrical test signal, it is determined whether signal integrity of an interface signal of the electrical interface in the co-encapsulation system meets application index requirements, comprising:

8. The method of claim 1, wherein, If the electrical interface is a transmitting end interface, it is determined based on the electrical test signal whether baud rate, output voltage amplitude, wireless link signal, steady-state voltage, linearly fitted pulse peak value, signal-to-noise distortion ratio, time interval error jitter, root mean square value jitter and signal level duty cycle of the electrical interface meet protocol standards; If yes, it is determined that signal integrity of the interface signal of the electrical interface in the co-encapsulation system meets application index requirements. Based on the electrical test signal, it is determined whether signal integrity of an interface signal of the electrical interface in the co-encapsulation system meets application index requirements, further comprising:

9. The method of claim 1, wherein, If the electrical interface is a receiving end interface, it is determined based on the electrical test signal whether interference tolerance, jitter tolerance and bit error rate of the electrical interface meet protocol standards; If yes, it is determined that signal integrity of the interface signal of the electrical interface in the co-encapsulation system meets application index requirements. Before the optical test signal is obtained based on the optical interface of the co-encapsulation system, further comprising:

10. The method of claim 1, wherein, ​ Based on a target operating mode, adjusting a data rate, a modulation scheme, a test vector, and a digital signal processing configuration of an application specific integrated circuit in a co-packaged system, and adjusting a digital signal processing configuration of a co-packaged optical engine in the co-packaged system based on the target operating mode.

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