Electrochromic device and preparation method thereof, color changing device and terminal product

Abstract

The invention provides an electrochromic device and a preparation method thereof, a color changing device and a terminal product, relates to the technical field of electrochromism, and aims to solve the technical problem that the width of a non-visual area of an electrochromic device is large. The preparation method comprises the following steps: forming a first conductive part extending along the edge of a first conductive substrate layer on the first conductive substrate layer; forming a second conductive part extending along the edge of the second conductive substrate layer on the second conductive substrate layer; forming a sealing layer on the first conductive substrate layer, wherein the sealing layer at least partially covers the first conductive part; and / or, a sealing layer is formed on the second conductive substrate layer, and the sealing layer at least partially covers the second conductive part; and enabling the first conductive substrate layer to be opposite to the second conductive substrate layer, and enabling the first conductive part, the sealing layer and the second conductive part to be aligned and pressed. The preparation method provided by the invention is used for reducing the width of the non-visual area of the electrochromic device.

Description

Technical Field

[0001] This application relates to the field of electrochromic technology, and in particular to an electrochromic device, its preparation method, color-changing device, and end product. Background Technology

[0002] Electrochromism refers to the phenomenon that the optical properties (reflectivity, transmittance, absorptivity, etc.) of a material undergo stable and reversible color changes under the influence of an external electric field, which manifests as reversible changes in color and transparency in appearance.

[0003] Existing electrochromic devices typically include a visible area and a non-visible area surrounding the visible area. However, the non-visible area of ​​current electrochromic devices is relatively wide, reducing their applicability. Summary of the Invention

[0004] In view of the above problems, this application provides an electrochromic device and its preparation method, color-changing device and end product, so as to reduce the width of the non-visible area of ​​the electrochromic device and improve the applicability of the electrochromic device.

[0005] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0006] The first aspect of this application provides a method for fabricating an electrochromic device, comprising the following steps:

[0007] A first conductive substrate layer is provided, and a first conductive portion extending along the edge of the first conductive substrate layer is formed on the conductive surface of the first conductive substrate layer;

[0008] A second conductive substrate layer is provided, and a second conductive portion extending along the edge of the second conductive substrate layer is formed on the conductive surface of the second conductive substrate layer;

[0009] A sealing layer is formed on the first conductive substrate layer, the sealing layer at least partially covering the first conductive portion; and / or, a sealing layer is formed on the second conductive substrate layer, the sealing layer at least partially covering the second conductive portion;

[0010] The first conductive substrate layer and the second conductive substrate layer are placed opposite each other, and the first conductive portion, the sealing layer and the second conductive portion are aligned and pressed together, so that the first conductive substrate layer, the second conductive substrate layer and the sealing layer form a receiving space for accommodating the electrochromic layer.

[0011] This application provides a method for fabricating an electrochromic device. First, a first conductive portion is formed on a first conductive substrate layer, and a second conductive portion is formed on a second conductive substrate layer. Then, a sealing layer is formed on at least one of the first and second conductive substrate layers. Next, the first conductive substrate layer, the second conductive substrate layer, and the sealing layer are aligned and pressed together to form a space for accommodating the electrochromic layer, thereby connecting the first and second conductive substrate layers through the sealing layer. Furthermore, the sealing layer does not need to be located outside the conductive portion, reducing the width of the non-visible area formed by the sealing layer and the conductive portion in the electrochromic device. This increases the proportion of the visible area while maintaining the same area of ​​the electrochromic device, thus improving the applicability of the electrochromic device.

[0012] In one possible implementation, the method further includes:

[0013] A first insulating portion extending along the edge of the first conductive substrate layer is formed on the conductive surface of the first conductive substrate layer. After the first conductive portion and the first insulating portion are formed, the first conductive portion and the first insulating portion enclose a first accommodating space; and / or,

[0014] A second insulating portion extending along the edge of the second conductive substrate is formed on the conductive surface of the second conductive substrate layer. After the second conductive portion and the second insulating portion are formed, the second conductive portion and the second insulating portion enclose and form a second accommodating space.

[0015] In one possible implementation, the method further includes:

[0016] A first insulating portion is formed on the conductive surface of the first conductive substrate layer;

[0017] A second insulating portion is formed on the conductive surface of the second conductive substrate layer;

[0018] The step of aligning the first conductive substrate layer and the second conductive substrate layer with each other and aligning and pressing the first conductive portion, the sealing layer, and the second conductive portion together further includes:

[0019] The first conductive portion is positioned opposite the second insulating portion, and the second conductive portion is positioned opposite the first insulating portion.

[0020] In one possible implementation, the method further includes: after forming the first accommodating space, forming a color-changing material layer attached to the conductive surface of the first conductive substrate layer, the color-changing material layer being located within the first accommodating space; and / or,

[0021] After forming the second accommodating space, an ion storage layer is formed attached to the conductive surface of the second conductive substrate layer, the ion storage layer being located within the second accommodating space. In one possible implementation, the method further includes:

[0022] Before aligning and pressing the first conductive part, the sealing layer, and the second conductive part together, the ion-conducting layer is formed on the side of the color-changing material layer away from the first conductive substrate layer; or...

[0023] Before the first conductive part, the sealing layer and the second conductive part are pressed together, the ion conducting layer is formed on the side of the ion storage layer away from the second conductive substrate layer.

[0024] In one possible implementation, the step of forming a sealing layer on the first conductive substrate layer includes:

[0025] The sealing layer is formed on the first conductive portion and the first insulating portion, and the sealing layer at least partially covers the first conductive portion and the first insulating portion; and / or,

[0026] The step of forming a sealing layer on the second conductive substrate layer includes:

[0027] The sealing layer is formed on the second conductive portion and the second insulating portion, and the sealing layer at least partially covers the second conductive portion and the second insulating portion.

[0028] In one possible implementation, the method further includes:

[0029] Before aligning and pressing the first conductive part, the sealing layer and the second conductive part together, the electrochromic layer is pre-cured.

[0030] After aligning and pressing the first conductive part, the sealing layer and the second conductive part together, the sealing layer is cured to form the electrochromic device.

[0031] In one possible implementation, the step of pre-curing the electrochromic layer includes:

[0032] The color-changing material layer is formed in the first accommodating space on the first conductive substrate layer, and the color-changing material layer is pre-cured; the ion storage layer is formed in the second accommodating space on the second conductive substrate layer, and the ion storage layer is pre-cured.

[0033] The ion-conducting layer is formed on the side of the color-changing material layer away from the first conductive substrate layer, and the ion-conducting layer is pre-cured; or, the ion-conducting layer is formed on the side of the ion storage layer away from the second conductive substrate layer, and the ion-conducting layer is pre-cured.

[0034] In one possible implementation, before aligning and pressing the first conductive portion, the sealing layer, and the second conductive portion, the process includes:

[0035] The ion-conducting layer is formed on the side of the color-changing material layer away from the first conductive substrate layer; the sealing layer is formed on the second conductive portion and the second insulating portion; and the ion-conducting layer on the first conductive substrate layer is pre-cured; or...

[0036] The ion-conducting layer is formed on the side of the color-changing material layer away from the second conductive substrate layer, the sealing layer is formed on the first conductive portion and the first insulating portion, and the ion-conducting layer on the second conductive substrate layer is pre-cured.

[0037] In one possible implementation, before aligning and pressing the first conductive portion, the sealing layer, and the second conductive portion together, the method further includes:

[0038] The ion-conducting layer is formed on the side of the color-changing material layer away from the first conductive substrate layer; the sealing layer is formed on the first conductive portion and the first insulating portion; the sealing layer is covered with a mask; and the ion-conducting layer on the first conductive substrate layer is pre-cured; or...

[0039] An ion-conducting layer is formed on the side of the ion storage layer away from the second conductive substrate layer, a sealing layer is formed on the second conductive portion and the second insulating portion, the sealing layer is covered with a mask, and the ion-conducting layer on the second conductive substrate layer is pre-cured.

[0040] In one possible implementation, the method further includes:

[0041] After the first conductive portion is formed, a first protective portion is provided on the first conductive portion, the first protective portion being at least partially in contact with the first conductive substrate layer; and / or,

[0042] After the second conductive portion is formed, a second protective portion is provided on the second conductive portion, and the second protective portion is at least partially in contact with the second conductive substrate layer.

[0043] In one possible implementation, the method further includes:

[0044] An initial first conductive substrate layer is provided, the initial first conductive substrate layer comprising at least one first conductive substrate layer;

[0045] An initial second conductive substrate layer is provided, the initial second conductive substrate layer comprising at least one second conductive substrate layer;

[0046] After aligning and pressing the first conductive part, the sealing layer and the second conductive part together, the parts are cut along the stacking direction of the initial first conductive substrate layer, the sealing layer and the initial second conductive substrate layer to divide and form the individual electrochromic devices.

[0047] In one possible implementation, the method further includes:

[0048] The filling layer is disposed between the initial first conductive substrate layer and the initial second conductive substrate layer, and the filling layer is formed between at least two of the electrochromic devices.

[0049] A second aspect of this application provides an electrochromic device, including an electrochromic layer and a first conductive substrate layer and a second conductive substrate layer respectively disposed on both sides of the electrochromic layer; a first conductive portion is disposed on the first conductive substrate layer, a second conductive portion is disposed on the second conductive substrate layer, and a sealing layer is disposed between the first conductive substrate layer and the second conductive substrate layer; wherein the sealing layer at least partially covers the first conductive portion; and / or, the sealing layer at least partially covers the second conductive portion.

[0050] This application provides an electrochromic device, in which a first conductive part is disposed on a first conductive substrate layer and a second conductive part is disposed on a second conductive substrate layer. The first conductive part, the sealing layer and the second conductive part are aligned and pressed together, which reduces the width of the non-visible area of ​​the electrochromic device, reduces the area of ​​the electrochromic device and improves the applicability of the electrochromic device.

[0051] In one possible implementation, the electrochromic layer and the first conductive portion are spaced apart; and / or, the electrochromic layer and the second conductive portion are spaced apart. In one possible implementation, a first insulating portion is provided on the first conductive substrate layer, a second insulating portion is provided on the second conductive substrate layer, and,

[0052] The sealing layer at least partially covers the first insulating portion; and / or, the sealing layer at least partially covers the second insulating portion.

[0053] In one possible implementation, the first conductive portion is disposed within the sealing layer, the sealing layer at least partially covering the first conductive substrate layer; and / or, the second conductive portion is disposed within the sealing layer, the sealing layer at least partially covering the second conductive substrate layer.

[0054] In one possible implementation, the first conductive substrate layer is provided with a first protective portion, the first protective portion covering the surface of the first conductive portion away from the first conductive substrate layer, and the first protective portion at least partially covering the first conductive substrate layer.

[0055] And / or, the second conductive substrate layer is provided with a second protective portion, the second protective portion covering the surface of the second conductive portion away from the second conductive substrate layer, and the second protective portion at least partially covering the second conductive substrate layer.

[0056] A third aspect of this application provides a color-changing device, including a transparent substrate layer, a shielding layer, and an electrochromic device. The substrate layer is disposed on the side of the first conductive substrate layer of the electrochromic device that is away from the electrochromic layer, or on the side of the second conductive substrate layer of the electrochromic device that is away from the electrochromic layer.

[0057] The shielding layer is disposed on the substrate layer, and the shielding layer at least covers the sealing layer.

[0058] A fourth aspect of this application provides a terminal product including an electrochromic device or color-changing apparatus, wherein the terminal product includes any one of a rearview mirror, a curtain wall, a sunroof, a side window, a windshield, a housing of an electronic product, eyeglasses, a vehicle, and a display panel.

[0059] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the electrochromic devices and their preparation methods, color-changing devices and terminal products provided by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific embodiments. Attached Figure Description

[0060] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0061] Figure 1 A schematic flowchart illustrating the fabrication method of the electrochromic device provided in the embodiments of this application;

[0062] Figure 2 This is a schematic diagram of the structure of the first conductive substrate layer provided in an embodiment of this application;

[0063] Figure 3 A schematic diagram showing the formation of a first conductive portion and a first insulating portion on a first conductive substrate layer, provided for an embodiment of this application;

[0064] Figure 4 A schematic diagram showing the formation of a first conductive portion, a first insulating portion, and a first protective portion on a first conductive substrate layer, provided in an embodiment of this application;

[0065] Figure 5 A schematic diagram of the structure of the first conductive part, the first insulating part, and the first protective part provided in the embodiments of this application;

[0066] Figure 6 A schematic diagram showing the formation of a second conductive portion and a second insulating portion on a second conductive substrate layer, provided for an embodiment of this application;

[0067] Figure 7 A schematic diagram showing the formation of a second conductive portion, a second insulating portion, and a second protective portion on a second conductive substrate layer, provided for an embodiment of this application;

[0068] Figure 8 A schematic diagram of the structure of the second conductive part, the second insulating part, and the second protective part provided in the embodiments of this application;

[0069] Figure 9 This is a schematic diagram of the formation of a color-changing material layer provided in an embodiment of this application;

[0070] Figure 10 This is a schematic diagram of the formation of an ion storage layer provided in an embodiment of this application;

[0071] Figure 11 This is a schematic diagram of forming a sealing layer on a first conductive substrate layer, provided as an embodiment of this application.

[0072] Figure 12 This is a schematic diagram of forming a sealing layer on a second conductive substrate layer, provided in an embodiment of this application.

[0073] Figure 13 This is a schematic diagram of the formation of an ion-conducting layer on a first conductive substrate layer provided in an embodiment of this application;

[0074] Figure 14 This is a schematic diagram of the formation of an ion-conducting layer on a second conductive substrate layer provided in an embodiment of this application;

[0075] Figure 15 A schematic diagram of the pre-cured ion-conducting layer located on the first conductive substrate layer provided in the embodiments of this application;

[0076] Figure 16 A schematic diagram showing the first conductive substrate layer provided in this application embodiment having a sealing layer and an ion-conducting layer;

[0077] Figure 17 Pre-curing provided for embodiments of this application Figure 16 Schematic diagram of the ion-conducting layer;

[0078] Figure 18 This is a schematic diagram illustrating the alignment and pressing of the first conductive substrate layer and the second conductive substrate layer according to an embodiment of this application.

[0079] Figure 19 This is a schematic diagram of the structure of the electrochromic device provided in the embodiments of this application;

[0080] Figure 20 A schematic diagram showing the relative positions of the initial first conductive substrate layer and the first conductive substrate layer provided in the embodiments of this application;

[0081] Figure 21 A schematic diagram showing the relative positions of the initial second conductive substrate layer and the second conductive substrate layer provided in the embodiments of this application;

[0082] Figure 22 A schematic diagram of a color-changing device including an electrochromic device provided for an embodiment of this application;

[0083] Figure 23 Provided for the embodiments of this application Figure 22 Exploded view of the color-changing device.

[0084] Explanation of reference numerals in the attached figures:

[0085] 10. Visible area; 20. Non-visible area;

[0086] 100. First conductive substrate layer;

[0087] 100a, Initial first conductive substrate layer; 110, First substrate layer; 120, First conductive layer; 130, First conductive portion; 140, First insulating portion; 150, First protective portion;

[0088] 200. Second conductive substrate layer;

[0089] 200a, Initial second conductive substrate layer; 210, Second substrate layer; 220, Second conductive layer; 230, Second conductive part; 240, Second insulating part; 250, Second protective part;

[0090] 300. Sealing layer;

[0091] 400, Electrochromic layer;

[0092] 410. Color-changing material layer; 420. Ion conduction layer; 430. Ion storage layer;

[0093] 500. Photomask;

[0094] 600, Substrate layer;

[0095] 700, shielding layer. Detailed Implementation

[0096] To address the aforementioned technical problems, embodiments of this application provide an electrochromic device, its fabrication method, color-changing apparatus, and end product. In the fabrication method, a first conductive portion is first formed on a first conductive substrate layer, and a second conductive portion is formed on a second conductive substrate layer. Then, a sealing layer is formed on at least one of the first and second conductive substrate layers. Finally, the first conductive substrate layer, the second conductive substrate layer, and the sealing layer are aligned and pressed together to form a space for accommodating the electrochromic layer, thereby connecting the first and second conductive substrate layers through the sealing layer.

[0097] Wherein, at least a portion of the orthographic projection of the sealing layer onto the plane where the electrochromic layer is located coincides with the orthographic projection of the first conductive portion onto the plane where the electrochromic layer is located; and / or, at least a portion of the orthographic projection of the sealing layer onto the plane where the electrochromic layer is located coincides with the orthographic projection of the second conductive portion onto the plane where the electrochromic layer is located, and the sealing layer is disposed between the first conductive substrate layer and the second conductive substrate layer.

[0098] The first conductive substrate layer, the sealing layer, and the second conductive substrate layer can be sequentially arranged along the thickness direction of the electrochromic device. Unlike the prior art, where the sealing layer and the conductive part are arranged from the edge of the electrochromic device inward, the sealing layer does not need to be set on the outside of the conductive part. This reduces the width of the non-visible area formed by the sealing layer and the conductive part in the electrochromic device. With the area of ​​the electrochromic device remaining unchanged, the proportion of the visible area is increased, thus improving the applicability of the electrochromic device.

[0099] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0100] Figure 1 This is a flowchart illustrating the fabrication method of the electrochromic device provided in the embodiments of this application. Figures 2-19 This is a schematic diagram illustrating the various stages of the fabrication process for an electrochromic device. The following section combines... Figures 2-19 The fabrication method of electrochromic devices is described in detail.

[0101] The method for fabricating the electrochromic device provided in this application includes the following steps:

[0102] Step S100: Provide a first conductive substrate layer, and form a first conductive portion extending along the edge of the first conductive substrate layer on the conductive surface of the first conductive substrate layer;

[0103] Reference Figure 2 First, the structure of the first conductive substrate layer 100 will be described. For example, the first conductive substrate layer 100 can be used to support the first conductive part 130. The first conductive substrate layer 100 can be set to be transparent so that the electrochromic device can transmit light through the first conductive substrate layer 100.

[0104] The first conductive substrate 100 may include a first substrate 110 and a first conductive layer 120 disposed on the surface of the first substrate 110. The first substrate 110 may be configured as a rigid first substrate 110. For example, the material of the first substrate 110 may be glass or the like, in order to improve the hardness and rigidity of the first substrate 110 and improve the support effect of the first substrate 110.

[0105] Alternatively, the first substrate layer 110 may be configured as a flexible first substrate layer 110. For example, the material of the first substrate layer 110 may be configured as one or more of polyester resin (i.e., the condensation polymer of terephthalic acid and ethylene glycol, abbreviated as PET or PEIT), polymethyl methacrylate (i.e., acrylic, abbreviated as PMMA), polycarbonate (i.e., a polymer containing carbonate groups in its molecular chain, abbreviated as PC), and polyimide (abbreviated as PI).

[0106] When the first substrate layer 110 is configured as a flexible first substrate layer 110, the thickness of the first substrate layer 110 can be set to be greater than or equal to 20 micrometers and less than or equal to 500 micrometers. For example, the thickness of the first substrate layer 110 can be set within any thickness range of 20 micrometers-50 micrometers, 50 micrometers-100 micrometers, 100 micrometers-150 micrometers, 150 micrometers-200 micrometers, 200 micrometers-250 micrometers, 250 micrometers-300 micrometers, 300 micrometers-350 micrometers, 350 micrometers-400 micrometers, 400 micrometers-450 micrometers, and 450 micrometers-500 micrometers.

[0107] For example, the thickness of the first substrate layer 110 can be set to one of 20 micrometers, 50 micrometers, 100 micrometers, 150 micrometers, 200 micrometers, 250 micrometers, 300 micrometers, 350 micrometers, 400 micrometers, 450 micrometers and 500 micrometers.

[0108] Each of the above thickness ranges may include at least one of the two endpoint values. For example, when the thickness of the first substrate layer 110 is set in the thickness range of 20 micrometers to 50 micrometers, the thickness of the first substrate layer 110 may be greater than or equal to 20 micrometers and less than or equal to 50 micrometers; or, the thickness of the first substrate layer 110 may be greater than 20 micrometers and less than or equal to 50 micrometers; or, the thickness of the first substrate layer 110 may be greater than or equal to 20 micrometers and less than 50 micrometers.

[0109] Alternatively, any of the above thickness ranges may not include the two endpoint values. For example, when the thickness of the first substrate 110 is set in the range of 20 micrometers to 50 micrometers, the thickness of the first substrate 110 may also be set to be greater than 20 micrometers and less than 50 micrometers.

[0110] It should be noted that the numerical ranges appearing in the embodiments of this application, such as other thickness ranges or length ranges that appear later, can all refer to the thickness range of the first base layer 110. That is, the numerical range can include at least one of the two endpoint values, or the numerical range may not include the two endpoint values. This will not be repeated in the embodiments of this application.

[0111] For example, the light transmittance of the first substrate layer 110 can be set to be greater than or equal to 70%. For example, the light transmittance of the first substrate layer 110 can be set within any of the following light transmittance ranges: 70%-75%, 75%-80%, 80%-85%, 85%-90%, and 90%-95%. For example, the light transmittance of the first substrate layer 110 can be set to one of the following: 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, and 95%.

[0112] It should be noted that the material of the first base layer 110 can be set as an insulating material, and the conductive surface of the first conductive base layer 100 is the surface of the first conductive layer 120, which is used to support the first conductive part 130.

[0113] For example, the material of the first conductive layer 120 may be one or more of indium tin oxide (ITO), zinc aluminum oxide (AZO), fluorine-doped tin oxide (FTO), silver nanowires, graphene, carbon nanotubes, metal mesh transparent conductive structures, and nano silver paste.

[0114] The thickness of the first conductive layer 120 can be set to be greater than or equal to 0.1 nanometers and less than or equal to 10 micrometers. The thickness of the first conductive layer 120 can be set within any thickness range of 0.1 nanometers-0.5 nanometers, 0.5 nanometers-1 nanometers, 1 nanometers-5 nanometers, 5 nanometers-10 nanometers, 10 nanometers-100 nanometers, 100 nanometers-500 nanometers, 500 nanometers-1 micrometer, 1 micrometer-3 micrometers, 3 micrometers-5 micrometers, 5 micrometers-7 micrometers, and 7 micrometers-10 micrometers; for example, the thickness of the first conductive layer 120 can be set within the thickness range of 1 nanometer to 1 micrometer.

[0115] Specifically, the thickness of the first conductive layer 120 can be set to one of the following: 0.1 nanometer, 0.5 nanometer, 1 nanometer, 5 nanometer, 10 nanometer, 100 nanometer, 500 nanometer, 1 micrometer, 3 micrometer, 5 micrometer, 7 micrometer and 10 micrometer.

[0116] The formation process of the first conductive layer 120 can be achieved by one or more of the following methods: spraying, spin coating, slot extrusion coating, slit coating, roll-to-roll coating, gravure coating, screen printing, transfer coating, bar coating, or physical vapor deposition (PVD).

[0117] For example, the first conductive portion 130 may be electrically connected to the first conductive layer 120. The first conductive portion 130 is located at the edge of the first conductive substrate layer 100. The step of forming the first conductive portion 130 includes: using any one or a combination of at least two of screen printing, pad printing, inkjet printing, metal mesh printing, offset printing, gravure printing, spraying, dispensing, vapor deposition or adhesive to form the first conductive portion 130 on the surface of the first substrate layer 110.

[0118] The material of the first conductive part 130 may include any one or a combination of at least two of conductive silver paste, conductive copper paste, conductive carbon paste, nano silver conductive ink, copper foil, copper wire or conductive film; for example, the material of the first conductive part 130 may be conductive silver paste.

[0119] Alternatively, the material combination of the first conductive part 130 may include a combination of conductive silver paste and conductive copper paste, a combination of conductive copper paste and conductive carbon paste, a combination of conductive carbon paste and nano-silver conductive ink, a combination of nano-silver conductive ink and conductive film, a combination of copper foil and copper wire, conductive silver paste, conductive copper paste and conductive carbon paste, a combination of conductive silver paste, conductive carbon paste and nano-silver conductive ink, a combination of conductive copper paste, conductive carbon paste and conductive film, or a combination of conductive silver paste, conductive copper paste, conductive carbon paste, nano-silver conductive ink, copper wire, copper foil and conductive film.

[0120] In a plane parallel to the first conductive substrate layer 100, the width of the first conductive portion 130 can be uniformly set, or the width of the first conductive portion 130 can be non-uniformly set. The width of the first conductive portion 130 can be set to be greater than or equal to 0.02 mm and less than or equal to 20 mm. The width of the first conductive portion 130 can be set within any of the following width ranges: 0.02 mm-0.1 mm, 0.1 mm-0.2 mm, 0.2 mm-1 mm, 1 mm-2 mm, 2 mm-3 mm, 3 mm-4 mm, 4 mm-5 mm, 5 mm-6 mm, 6 mm-8 mm, 8 mm-10 mm, 10 mm-12 mm, 12 mm-14 mm, 14 mm-16 mm, 16 mm-18 mm, and 18 mm-20 mm.

[0121] For example, the width of the first conductive portion 130 can be set to one of 0.02 mm, 0.1 mm, 0.2 mm, 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 8 mm, 10 mm, 12 mm, 14 mm, 16 mm, 18 mm, and 20 mm. The embodiments of this application are not limited to the listed values; other unlisted values ​​within this range are also applicable. Those skilled in the art can make reasonable selections based on the size of the first substrate layer 110 to facilitate the connection of the first conductive layer 120 and the first conductive portion 130 to an external conductive material.

[0122] The thickness of the first conductive portion 130 can be set to be greater than or equal to 1 micrometer and less than or equal to 200 micrometers. The thickness of the first conductive portion 130 can be set within any thickness range of 1 micrometer-20 micrometers, 20 micrometers-30 micrometers, 30 micrometers-40 micrometers, 40 micrometers-50 micrometers, 50 micrometers-60 micrometers, 60 micrometers-70 micrometers, 70 micrometers-80 micrometers, 80 micrometers-90 micrometers, 90 micrometers-100 micrometers, 100 micrometers-110 micrometers, 110 micrometers-120 micrometers, 120 micrometers-130 micrometers, 130 micrometers-140 micrometers, 140 micrometers-150 micrometers, 150 micrometers-160 micrometers, 160 micrometers-170 micrometers, 170 micrometers-180 micrometers, 180 micrometers-190 micrometers, and 190 micrometers-200 micrometers; for example, the thickness of the first conductive portion 130 can be set within the thickness range of 10 micrometers-60 micrometers.

[0123] It should be noted that in the above embodiments, the resistivity of the first conductive part 130 is lower than that of the first conductive layer 120, and those skilled in the art can make reasonable selections of the material of the first conductive part 130 based on the different resistivity of the first conductive part 130.

[0124] For example, the resistivity of the first conductive portion 130 can be set to be greater than or equal to 1 × 10⁻⁶.-6 Ω·cm, less than or equal to 1×10 -3 The resistivity of the first conductive part 130 can be set to 1×10 Ω·cm. -6 Ω·cm⁻⁵×10 -6 Ω·cm, 5×10 -6 Ω·cm⁻¹×10 -5 Ω·cm, 1×10 -5 Ω·cm⁻⁵×10 -5 Ω·cm, 5×10 -5 Ω·cm⁻¹×10 -4 Ω·cm, 1×10 -4 Ω·cm⁻⁵×10 -4 Ω·cm, and 5×10 -4 Ω·cm⁻¹×10 -3 Within any resistivity range of Ω·cm.

[0125] For example, the resistivity of the first conductive part 130 can be set to 1×10⁻⁶. -6 Ω·cm, 5×10 -6 Ω·cm, 1×10 -5 Ω·cm, 5×10 -5 Ω·cm, 1×10- 4 Ω·cm, 5×10 -4 Ω·cm and 1×10 -3 One of Ω·cm.

[0126] The first conductive portion 130 may be continuously arranged, or the first conductive portion 130 may be discontinuously arranged. The shape of the first conductive portion 130 may be a regular shape, for example, the shape of the first conductive portion 130 may be a strip or an arc, or the shape of the first conductive portion 130 may be an irregular shape. The embodiments of this application do not impose further limitations on this.

[0127] Step S200: Provide a second conductive substrate layer 200, and form a second conductive portion 230 extending along the edge of the second conductive substrate layer 200 on the conductive surface of the second conductive substrate layer 200.

[0128] Reference Figure 6 First, the second conductive substrate layer 200 will be described. The second conductive substrate layer 200 can be used to support the second conductive part 230. The second conductive substrate layer 200 can be used to cooperate with the first conductive substrate layer 100 to support and protect the structure located between the first conductive substrate layer 100 and the second conductive substrate layer 200. The second conductive substrate layer 200 can be made transparent so that the electrochromic device can transmit light through the second conductive substrate layer 200.

[0129] The second conductive substrate layer 200 may include a second substrate layer 210 and a second conductive layer 220 disposed on the surface of the second substrate layer 210. The material, thickness and light transmittance of the second substrate layer 210 can be referenced to the first substrate layer 110. For details, please refer to the above description. The embodiments of this application will not be repeated here.

[0130] It should be noted that the second substrate layer 210 can be disposed in the same manner as the first substrate layer 110. For example, when the first substrate layer 110 is configured as a flexible first substrate layer 110, the second substrate layer 210 can be configured as a flexible second substrate layer 210 accordingly; when the first substrate layer 110 is configured as a rigid first substrate layer 110, the second substrate layer 210 can be configured as a rigid second substrate layer 210 accordingly.

[0131] It should be noted that the material of the second base layer 210 can be set as an insulating material, and the conductive surface of the second conductive base layer 200 is the surface of the second conductive layer 220, which is used to support the second conductive part 230.

[0132] The material, thickness, and formation method of the second conductive layer 220 can be referenced from the first conductive layer 120, as described above. The embodiments of this application will not be repeated here.

[0133] For example, the second conductive portion 230 may be electrically connected to the second conductive layer 220, and the step of forming the second conductive portion 230 may include: using any one or a combination of at least two of the following: screen printing, pad printing, inkjet printing, metal mesh printing, offset printing, gravure printing, spraying, dispensing, vapor deposition or adhesive application.

[0134] The material, width, and thickness of the second conductive part 230 can be referenced from the first conductive part 130, as described above. The embodiments of this application will not be repeated here.

[0135] It should be noted that in the above embodiments, the resistivity of the second conductive part 230 is lower than that of the second conductive layer 220, and those skilled in the art can make reasonable selections of the material of the second conductive part 230 based on the different resistivity of the second conductive part 230.

[0136] The second conductive part 230 can be continuously arranged, or it can be discontinuously arranged. The shape of the second conductive part 230 can be a regular shape, for example, the shape of the second conductive part 230 can be a strip or an arc, or it can be an irregular shape. The embodiments of this application do not impose further limitations on this.

[0137] It is readily understood that the first conductive portion 130 can be formed first on the conductive surface of the first conductive substrate layer 100, and then the second conductive portion 230 can be formed on the conductive surface of the second conductive substrate layer 200. Alternatively, the second conductive portion 230 can be formed first on the conductive surface of the second conductive substrate layer 200, and then the first conductive portion 130 can be formed on the conductive surface of the first conductive substrate layer 100. Alternatively, the first conductive portion 130 can be formed on the conductive surface of the first conductive substrate layer 100, and the second conductive portion 230 can be formed on the conductive surface of the second conductive substrate layer 200 simultaneously. This embodiment does not further limit the formation order of the first conductive portion 130 and the second conductive portion 230.

[0138] In the above embodiments, the first conductive part 130 and the second conductive part 230 can be disposed on the edge of the conductive substrate layer according to actual needs, so that electricity can be conducted to the first conductive substrate layer 100 through the first conductive part 130 and to the second conductive substrate layer 200 through the second conductive part 230. Since the direction of electricity conduction is from the first conductive part and the second conductive part to the middle area of ​​the electrochromic device, the electrochromic device can gradually change color from the periphery to the center, thus improving the user experience.

[0139] Step S300: A sealing layer is formed on a first conductive substrate layer, the sealing layer at least partially covering the first conductive portion; and / or, a sealing layer is formed on a second conductive substrate layer, the sealing layer at least partially covering the second conductive portion;

[0140] In embodiments of this application, after the first conductive portion 130 is formed on the conductive surface of the first conductive substrate layer 100, a sealing layer 300 may be formed on the first conductive substrate layer 100. And / or, after the second conductive portion 230 is formed on the conductive surface of the second conductive substrate layer 200, a sealing layer 300 may be formed on the second conductive substrate layer 200.

[0141] The sealing layer 300 may be formed on the first conductive substrate 100 or the second conductive substrate 200, or the sealing layer 300 may be partially formed on the first conductive substrate 100 and partially formed on the second conductive substrate 200.

[0142] For example, the sealing layer 300 is formed on the first conductive substrate layer 100, the sealing layer 300 is disposed on the outer periphery of the color-changing material layer 410, or on the outer periphery of the color-changing material layer 410 and the ion-conducting layer 420, and the sealing layer 300 at least partially fills the space between the color-changing material layer 410 and the first conductive portion 130.

[0143] In one possible implementation, a sealing layer 300 is disposed on the conductive surface of the first conductive substrate layer 100, such that the sealing layer 300 partially covers the first conductive portion 130 (not shown in the figure). By providing that the sealing layer 300 and the first conductive portion 130 partially overlap along the thickness direction of the electrochromic device, the width of the non-visible area of ​​the electrochromic device is reduced while the widths of the sealing layer 300 and the first conductive portion 130 remain unchanged, thereby improving the applicability of the electrochromic device.

[0144] In one possible implementation, refer to Figure 11 A sealing layer 300 is disposed on the conductive surface of the first conductive substrate layer 100, so that the sealing layer 300 completely covers the first conductive part 130. By distributing the sealing layer 300 and the first conductive part 130 overlapping along the thickness direction of the electrochromic device, not only is the width of the non-visible area of ​​the electrochromic device reduced, but the sealing layer 300 also provides a protective covering for the first conductive part 130, thereby isolating it from moisture and preventing the first conductive part 130 from being corroded by moisture, thus ensuring the conductivity of the first conductive part 130.

[0145] For example, the sealing layer 300 is formed on the second conductive substrate layer 200, the sealing layer 300 is disposed on the outer periphery of the ion storage layer 430, or on the outer periphery of the ion storage layer 430 and the ion conduction layer 420, and the sealing layer 300 at least partially fills the space between the ion storage layer 430 and the second conductive portion 230.

[0146] In one possible implementation, a sealing layer 300 is disposed on the conductive surface of the second conductive substrate layer 200, such that the sealing layer 300 partially covers the second conductive portion 130 (not shown in the figure). By providing that the sealing layer 300 and the second conductive portion 230 partially overlap along the thickness direction of the electrochromic device, the width of the non-visible area of ​​the electrochromic device is reduced while the width of the sealing layer 300 and the width of the second conductive portion 230 remain unchanged, thereby improving the applicability of the electrochromic device.

[0147] In one possible implementation, refer to Figure 12 A sealing layer 300 is disposed on the conductive surface of the second conductive substrate layer 200, so that the sealing layer 300 completely covers the second conductive part 230. By distributing the sealing layer 300 and the second conductive part 230 overlapping along the thickness direction of the electrochromic device, not only is the width of the non-visible area of ​​the electrochromic device reduced, but the sealing layer 300 also provides a protective covering for the second conductive part 230. This isolates the second conductive part 230 from moisture, preventing it from being corroded by moisture and ensuring the conductivity of the first conductive part 130.

[0148] For example, the sealing layer 300 is partially formed on the first conductive substrate layer 200 and partially formed on the second conductive substrate layer 200. Specifically, a first portion of the sealing layer 300 covers the first conductive portion 130 and the first insulating portion 140, and a second portion of the sealing layer 300 covers the second conductive portion 230 and the second insulating portion 240, so as to achieve the connection between the first conductive substrate layer 100 and the second conductive substrate layer 200 through the sealing layer 300.

[0149] For example, after the color-changing material layer 410 is formed, a sealing layer 300 may be formed on the conductive surface of the first conductive substrate layer 100. After the ion storage layer 430 and the ion conduction layer 420 are formed, a sealing layer 300 may be formed on the conductive surface of the second conductive substrate layer 200.

[0150] Alternatively, after forming the color-changing material layer 410 and the ion-conducting layer 420, a sealing layer 300 may be formed on the conductive surface of the first conductive substrate layer 100. After forming the ion storage layer 430, a sealing layer 300 may be formed on the conductive surface of the second conductive substrate layer 200.

[0151] The material of the first part of the sealing layer 300 can be the same as the sealing material of the second part of the sealing layer 300, so that by setting the same sealing material, the sealing layer 300 has a good bonding force between the first conductive substrate layer 100 and the second conductive substrate layer 200.

[0152] In the embodiments of this application, the material of the sealing layer 300 can be a thermosetting adhesive, which can be one of polyolefins, polyamides, polyesters, and ethylene and their copolymers. Optionally, the volume shrinkage rate of the thermosetting adhesive is greater than or equal to 0.5% and less than or equal to 2%, and the volume shrinkage rate of the thermosetting adhesive can be set within any of the following shrinkage rate ranges: 0.5%-0.8%, 0.8%-1%, 1%-1.2%, 1.2%-1.5%, 1.5%-1.8%, and 1.8%-2%.

[0153] Alternatively, the sealing layer 300 may also be a photocurable adhesive, including one of epoxy resin, vinyl ether resin, acrylate resin, unsaturated resin, polyester, polyolefin and polythiol and a photoinitiator.

[0154] Step S400: The first conductive substrate layer and the second conductive substrate layer are placed opposite each other, and the first conductive part, the sealing layer and the second conductive part are aligned and pressed together, so that the first conductive substrate layer, the second conductive substrate layer and the sealing layer form a receiving space for accommodating the electrochromic layer.

[0155] Reference Figure 18 and Figure 19The first conductive substrate layer 100 and the second conductive substrate layer 200 are placed opposite each other, and the first conductive part 130, the sealing layer 300 and the second conductive part 230 are aligned and pressed together. The first conductive substrate layer 100 and the second conductive substrate layer 200 are laminated together by vacuum pressing to reduce the possibility of air bubbles being generated in the electrochromic device during the lamination process.

[0156] Furthermore, during the pressing process, the sealant constituting the sealing layer 300 has a certain degree of fluidity, allowing it to flow between the first conductive substrate layer 100 and the second conductive substrate layer 200 under pressure. By setting the viscosity of the sealant in the sealing layer 300, the surface of the sealing layer 300 facing the first conductive substrate layer 100 is tightly adhered to the first conductive substrate layer 100, and the surface of the sealing layer 300 facing the second conductive substrate layer 200 is tightly adhered to the second conductive substrate layer 200.

[0157] For example, the viscosity of the sealant in the sealing layer 300 can be set to be greater than or equal to 20,000 Pa·s and less than or equal to 200,000 Pa·s, thereby improving the adhesion between the sealing layer 300 and the first conductive substrate 100 or the second conductive substrate 200 after curing, improving the interfacial bonding force between the sealing layer 300 and the first conductive substrate 100 or the second conductive substrate 200, and enhancing the overall sealing stability of the electrochromic device.

[0158] Optionally, the electrochromic layer 400 includes a color-changing material layer 410, an ion-conducting layer 420, and an ion-storage layer 430. It should be noted that the color-changing material layer 410, the ion-conducting layer 420, and the ion-storage layer 430 are a fluid liquid mixture before curing.

[0159] Reference Figure 3 After providing the first conductive substrate layer 100, the preparation method may further include: forming a first insulating portion 140 extending along the edge of the first conductive substrate layer 100 on the conductive surface of the first conductive substrate layer 100; after the first conductive portion 130 and the first insulating portion 140 are formed, the first conductive portion 130 and the first insulating portion 140 enclose a first accommodating space, and the surface of the first conductive layer 120 facing away from the first substrate layer 110 faces the first accommodating space.

[0160] For example, the first conductive portion 130 and the first insulating portion 140 are both located in the edge region of the first conductive substrate layer 100. The first insulating portion 140 can be together with the first conductive portion 130 to form a first accommodating space. The step of forming the first insulating portion 140 includes: using any one or a combination of at least two of the following methods: screen printing, pad printing, inkjet printing, metal mesh printing, offset printing, gravure printing, spraying, dispensing, vapor deposition or adhesive application to form the first insulating portion 140 on the first conductive substrate layer 100.

[0161] The material of the first insulating part 140 can be an insulating adhesive. For example, the first insulating part 140 may include one of epoxy resin, vinyl ether resin, acrylate resin, unsaturated resin, polyester, polyolefin and polythiol and a photoinitiator.

[0162] It should be noted that the first conductive portion 130 can be formed first on the conductive surface of the first conductive substrate layer 100, and then the first insulating portion 140 can be formed on the conductive surface of the first conductive substrate layer 100, so that the first conductive portion 130 and the first insulating portion 140 together enclose the first accommodating space; or, the first insulating portion 140 can be formed first on the conductive surface of the first conductive substrate layer 100, and then the first conductive portion 130 can be formed on the conductive surface of the first conductive substrate layer 100, so that the first conductive portion 130 and the first insulating portion 140 together enclose the first accommodating space.

[0163] Alternatively, while forming the first conductive portion 130 on the conductive surface of the first conductive substrate layer 100, a first insulating portion 140 may also be formed on the conductive surface of the first conductive substrate layer 100, such that the first conductive portion 130 and the first insulating portion 140 together enclose and form the first accommodating space.

[0164] Reference Figure 4 and Figure 5 In some possible implementations, a first conductive portion 130 may be formed on the conductive surface of the first conductive substrate layer 100 first, and then a first protective portion 150 may be formed. The first protective portion 150 covers the surface of the first conductive portion 130 that does not contact the first conductive substrate layer 100. The first protective portion 150 can provide a certain degree of isolation and protection for the first conductive portion 130 and improve the stability of the first conductive portion 130.

[0165] For example, the first protective part 150 may be made of the same material as the first insulating part 140, and the first protective part 150 may be integrally formed with the first insulating part 140.

[0166] For example, on the surface of the first conductive substrate layer 100, a first conductive portion 130 can be provided first, and then a first insulating portion 140 and a first protective portion 150 can be provided simultaneously, such that the first insulating portion 140 and the first protective portion 150 are provided continuously, and at least a portion of the first protective portion 150 covers the surface of the first conductive portion 130 away from the first conductive substrate layer 100.

[0167] The first protective part 150 can provide a certain degree of isolation and protection for the first conductive part 130, thereby reducing the possibility of chemical reaction in the first conductive part 130 and improving the stability of the first conductive part 130.

[0168] For example, the width of the first protective portion 150 may be greater than the width of the first conductive portion 130, so that the first insulating portion 140 covers the inner surface of the first conductive portion 130, thereby reducing the possibility that the first conductive portion 130 directly contacts the electrochromic layer 400.

[0169] A color-changing material layer 410 is disposed in the first accommodating space on the conductive surface of the first conductive substrate layer 100. Before hardening, the color-changing material layer 410 is a fluid liquid mixture. When sprayed into the first accommodating space, it will adhere to the conductive surface of the first conductive substrate layer 100 and flow and diffuse to the edge portion inside the first accommodating space. By providing the first conductive part 130 and the first insulating part 140 that are enclosed together, the flow range of the material is restricted, so that the color-changing material layer 410 has a regular boundary after curing, making the color-changing range of the electrochromic device controllable and improving the applicability of the electrochromic device.

[0170] Reference Figure 6 After providing the second conductive substrate layer 200 and before forming the sealing layer, the preparation method may further include: forming a second insulating portion 240 extending along the edge of the second conductive substrate layer 200 on the conductive surface of the second conductive substrate layer 200; after the second conductive portion 230 and the second insulating portion 240 are formed, the second conductive portion 230 and the second insulating portion 240 enclose a second accommodating space, and the surface of the second conductive layer 220 facing away from the second substrate layer 210 faces the second accommodating space.

[0171] For example, the second conductive portion 230 and the second insulating portion 240 are both located in the edge region of the second conductive substrate layer 200. The second insulating portion 240 can be together with the second conductive portion 230 to form a second accommodating space. The step of forming the second insulating portion 240 includes: using any one or a combination of at least two of the following methods: screen printing, pad printing, inkjet printing, metal mesh printing, offset printing, gravure printing, spraying, dispensing, vapor deposition or adhesive application to form the second insulating portion 240 on the second conductive substrate layer 200.

[0172] The material of the second insulating part 240 can be the same as that of the first insulating part 140, as described above. The embodiments of this application will not be repeated here.

[0173] It should be noted that the second conductive portion 230 can be formed on the conductive surface of the second conductive substrate layer 200 first, and then the second insulating portion 240 can be formed on the conductive surface of the second conductive substrate layer 200, so that the second conductive portion 230 and the second insulating portion 240 together enclose and form the second accommodating space.

[0174] Alternatively, a second insulating portion 240 may be formed first on the conductive surface of the second conductive substrate layer 200, and then a second conductive portion 230 may be formed on the conductive surface of the second conductive substrate layer 200, such that the second conductive portion 230 and the second insulating portion 240 together enclose and form a second accommodating space.

[0175] Alternatively, while forming the second conductive portion 230 on the conductive surface of the second conductive substrate layer 200, a second insulating portion 240 may also be formed on the conductive surface of the second conductive substrate layer 200, such that the second conductive portion 230 and the second insulating portion 240 together enclose and form the second accommodating space.

[0176] Reference Figure 7 and Figure 8 In some possible implementations, a second conductive portion 230 may be formed first on the conductive surface of the second conductive substrate layer 200, and then a second protective portion 250 may be formed. The second protective portion 250 covers the surface of the second conductive portion 230 that does not contact the second conductive substrate layer 200. The second protective portion 250 can provide a certain degree of isolation and protection for the second conductive portion 230, thereby improving the stability of the second conductive portion 230.

[0177] For example, the second protective part 250 may be made of the same material as the second insulating part 240, and the second protective part 250 may be integrally formed with the second insulating part 240.

[0178] For example, on the surface of the second conductive substrate layer 200, a second conductive portion 230 is first provided, and then a second insulating portion 240 and a second protective portion 250 are provided simultaneously. The second insulating portion 240 and the second protective portion 250 are provided continuously, and at least a portion of the second protective portion 250 covers the surface of the second conductive portion 230 away from the second conductive substrate layer 200.

[0179] The second protective part 250 can provide a certain degree of isolation and protection for the second conductive part 230, thereby reducing the possibility of chemical reaction in the second conductive part 230 and improving the stability of the second conductive part 230.

[0180] For example, the width of the second protective portion 250 may be greater than the width of the second conductive portion 230, so that the second protective portion 250 covers the inner surface of the second conductive portion 230, thereby reducing the possibility that the second conductive portion 230 directly contacts the electrochromic layer 400.

[0181] For example, an ion storage layer 430 is provided in the second accommodating space on the conductive surface of the second conductive substrate layer 100. The ion storage layer 430 is a fluid liquid mixture before curing. When sprayed into the second accommodating space, it will adhere to the conductive surface of the second conductive substrate layer 200 and flow and diffuse to the edge portion inside the second accommodating space. By providing the second conductive part 230 and the second insulating part 240 that are enclosed together, the flow range of the material is restricted, so that the ion storage layer 430 has a regular boundary after curing, making the color change range of the electrochromic device controllable and improving the applicability of the electrochromic device.

[0182] In the embodiments provided in this application, a first conductive portion 130 and a first insulating portion 140 extending along the edge of the first conductive substrate layer 100 are formed on the conductive surface of the first conductive substrate layer 100. In a direction parallel to the first conductive substrate layer 100, a first accommodating space formed by the first conductive portion 130 and the first insulating portion 140 has an opening toward the second conductive substrate layer 200. The inner region of the first accommodating space can be used to accommodate at least a portion of the electrochromic layer 400.

[0183] A second conductive portion 230 and a second insulating portion 240 extending along the edge of the second conductive substrate layer 200 are formed on the conductive surface of the second conductive substrate layer 200. In a direction parallel to the second conductive substrate layer 200, the second accommodating space formed by the second conductive portion 230 and the second insulating portion 240 has an opening toward the second conductive substrate layer 200. The inner region of the second accommodating space can be used to accommodate at least a portion of the electrochromic layer 400.

[0184] A first insulating portion is formed on the conductive surface of a first conductive substrate layer, and a second insulating portion is formed on the conductive surface of a second conductive substrate layer; the first conductive substrate layer and the second conductive substrate layer are positioned opposite each other, such that the first conductive portion is opposite to the second insulating portion, and the second conductive portion is opposite to the first insulating portion.

[0185] For example, the first insulating portion 140 is disposed opposite to the second conductive portion 230, and the second insulating portion 240 is disposed opposite to the first conductive portion 130. By aligning and pressing the first conductive portion 130, the sealing layer 300, and the second conductive portion 230 together, the first insulating portion 140 can form an insulating protection for the second conductive portion 240 in the stacking direction, or the second insulating portion 240 can form an insulating protection for the first conductive portion 130 in the stacking direction, further avoiding contact between the first conductive portion 130 and the second conductive portion 230, and reducing the possibility of short circuit in the electrochromic device.

[0186] It should be noted that the first conductive substrate layer 100, the second conductive substrate layer 200, and the sealing layer 300 together form a receiving space for accommodating the electrochromic layer 400. Specifically, the first conductive portion 130 and the first insulating portion 140, together with the first conductive substrate layer 100, form a first receiving space with an opening; the second conductive portion 230 and the second insulating portion 240, together with the second conductive substrate layer 200, form a second receiving space with an opening. When the first conductive substrate layer 100 and the second conductive substrate layer 200 are pressed together, the openings of the first and second receiving spaces are positioned opposite each other, allowing the first and second receiving spaces to communicate. This communication between the first and second receiving spaces forms the receiving space for the electrochromic device, used to accommodate the electrochromic layer 400.

[0187] Reference Figure 9 After the first accommodating space is formed, a color-changing material layer is formed on the conductive surface of the first conductive substrate layer, and the color-changing material layer is located within the first accommodating space.

[0188] For example, after forming the first accommodating space, the method for fabricating the electrochromic device further includes: forming a color-changing material layer 410 in the first accommodating space of the first conductive substrate layer 100. For example, the electrochromic material can be filled into the first accommodating space by inkjet printing to form the color-changing material layer 410, and the color-changing material layer 410 at least partially covers the first conductive layer 120.

[0189] It should be noted that the color-changing material layer 410 is a fluid liquid mixture before curing. When sprayed into the first accommodating space, the color-changing material will adhere to the conductive surface of the first conductive substrate layer 100 and will flow and diffuse to the edge of the first accommodating space. By setting the first conductive part 130 and the first insulating part 140 that are enclosed together, the flow range of the color-changing material is limited, so that the color-changing material layer 410 has a regular boundary after curing, making the color-changing range of the electrochromic device controllable and improving the applicability of the electrochromic device.

[0190] The thickness of the color-changing material layer 410 can be set to be greater than or equal to 10 micrometers and less than or equal to 50 micrometers. The thickness of the color-changing material layer 410 can be set within any of the following ranges: 10-20 micrometers, 20-30 micrometers, 30-40 micrometers, and 40-50 micrometers. It should be noted that the thickness of the color-changing material layer 410 refers to the thickness of the color-changing material after it has hardened.

[0191] refer to Figure 10 After the second accommodating space is formed, an ion storage layer is formed on the conductive surface of the second conductive substrate layer, and the ion storage layer is located within the second accommodating space.

[0192] For example, after forming the second accommodating space, the method for fabricating the electrochromic device further includes: forming an ion storage layer 430 attached to the conductive surface of the second conductive substrate within the second accommodating space of the second conductive substrate layer 200, wherein the ion storage layer is located within the second accommodating space. For example, the ion storage layer 430 can be formed by filling the second accommodating space with ion storage material using an inkjet printing method, and the ion storage layer 430 at least covers the second conductive layer 220 within the accommodating space.

[0193] It should be noted that the ion storage layer 430 is a fluid liquid mixture before curing. When sprayed into the second accommodating space, the color-changing material will adhere to the conductive surface of the second conductive substrate layer 200 and will flow and diffuse to the edge portion inside the second accommodating space. By setting the second conductive part 230 and the second insulating part 240 that are enclosed together, the flow range of the material is restricted, so that the ion storage layer 430 has a regular boundary after curing, making the color-changing range of the electrochromic device controllable and improving the applicability of the electrochromic device.

[0194] The thickness of the ion storage layer 430 can be set to be greater than or equal to 10 micrometers, less than or equal to 50 micrometers, and the thickness of the ion storage layer 430 can be set within any thickness range of 10-20 micrometers, 20-30 micrometers, 30-40 micrometers, and 40-50 micrometers.

[0195] Reference Figure 13 Before the first conductive part, the sealing layer and the second conductive part are pressed together, the method for preparing the electrochromic device may include: forming an ion-conducting layer 420 on the side of the color-changing material layer 410 away from the first conductive substrate layer 100; for example, the ion-conducting layer 420 may be formed on the surface of the color-changing material layer 410 away from the first conductive substrate layer 100 by means of inkjet printing, etc., and the ion-conducting layer 420 is located in the first accommodating space.

[0196] Or, refer to Figure 14 Before the first conductive part, the sealing layer, and the second conductive part are pressed together, the method for fabricating the electrochromic device may further include: forming an ion-conducting layer 420 on the side of the ion storage layer 430 away from the second conductive substrate layer 200. For example, the ion-conducting layer 420 can be formed on the surface of the ion storage layer 430 away from the second conductive substrate layer 200 by inkjet printing or the like, and the ion-conducting layer 420 is located within the second accommodating space.

[0197] In an electrochromic device, an ion storage layer 430, an ion conduction layer 420, and a color-changing material layer 410 can be stacked sequentially along the thickness direction of the electrochromic device. By setting the ion conduction layer 420, ions can be conducted through the ion conduction layer 420.

[0198] The step of forming a sealing layer on the first conductive substrate layer further includes: forming a sealing layer on the first conductive portion and the first insulating portion, wherein the sealing layer at least partially covers the first conductive portion and the first insulating portion.

[0199] For example, the sealing layer 300 may be formed on the first conductive substrate layer 100, and the sealing layer 300 is located on the conductive surface of the first conductive substrate layer 100. The sealing layer 300 at least partially covers the first conductive portion 130, and the sealing layer 300 may also cover the first insulating portion 140, so as to form a protective covering for the first conductive portion 130 and the first insulating portion 140. After the first conductive portion, the sealing layer and the second conductive portion are correspondingly pressed together, in the thickness direction of the first conductive substrate layer 100, the side of the sealing layer 300 facing away from the first conductive substrate layer 100 contacts the second conductive substrate layer 200.

[0200] The step of forming a sealing layer on the second conductive substrate layer further includes: forming a sealing layer on the second conductive portion and the second insulating portion, wherein the sealing layer at least partially covers the second conductive portion and the second insulating portion.

[0201] For example, the sealing layer 300 may also be formed on the second conductive substrate layer 200. The sealing layer 300 is located on the conductive surface of the second conductive substrate layer 200. The sealing layer 300 at least partially covers the second conductive portion 230, and the sealing layer 300 may also cover the second insulating portion 240, so as to form a protective covering for the second conductive portion 230 and the second insulating portion 240. After the first conductive portion, the sealing layer, and the second conductive portion are correspondingly pressed together, the side of the sealing layer 300 facing away from the second conductive substrate layer 200 contacts the first conductive substrate layer 100 in the thickness direction of the second conductive substrate layer 200.

[0202] In some embodiments of this application, the method for preparing an electrochromic device may include: pre-curing an electrochromic material before aligning and pressing the first conductive part, the sealing layer, and the second conductive part together, wherein the electrochromic material includes at least one of a color-changing material layer 410, an ion storage layer 430, and an ion conducting layer 420.

[0203] After aligning and pressing the first conductive part 130, the sealing layer 300, and the second conductive part 230 together, the preparation method further includes curing the sealing layer 300 to form an electrochromic device.

[0204] For example, before aligning and pressing the first conductive part 130, the sealing layer 300, and the second conductive part 230, uncured sealant is applied to the first conductive substrate layer 100 and / or the second conductive substrate layer 200, allowing the sealant to fully contact the first conductive substrate layer 100 and / or the second conductive substrate layer 200. After aligning and pressing the first conductive part 130, the sealing layer 300, and the second conductive part 230, the sealant is cured using radiation curing or thermal curing techniques to obtain a cured sealing layer 300. This sealant layer 300 connects the first conductive substrate layer 100 and the second conductive substrate layer 200, forming a stable contact surface between the sealant layer 300 and the first conductive substrate layer 100 and the second conductive substrate layer 200. This ensures the sealing effect of the sealant layer 300 and isolates moisture, reducing the possibility of the electrochromic layer 400 contacting moisture and increasing the service life of the electrochromic device.

[0205] It is easy to understand that the specific curing method can be determined based on the material of the sealing layer 300, and this application embodiment does not impose further restrictions on this.

[0206] The sealing layer 300 extends into the electrochromic device with a width less than or equal to 1 mm. For example, the width of the sealing layer 300 extending into the electrochromic device can be set within any of the following width ranges: 0 mm-0.1 mm, 0.1 mm-0.2 mm, 0.2 mm-0.3 mm, 0.3 mm-0.4 mm, 0.4 mm-0.5 mm, 0.5 mm-0.6 mm, 0.6 mm-0.7 mm, 0.7 mm-0.8 mm, 0.8 mm-0.9 mm, and 0.9 mm-1 mm, in order to reduce the width of the non-visible area 20 of the electrochromic device.

[0207] It should be noted that the direction of moisture permeation through the sealing layer 300 is that it penetrates from the outer surface of the sealing layer 300 in the direction of its thickness, passing through the sealing layer 300 and reaching the surface adjacent to the electrochromic layer. The sealing layer 300 surrounds the periphery of the electrochromic device, effectively preventing moisture from seeping in from the periphery, ensuring the integrity of the sealing structure of the electrochromic device, improving its sealing performance and waterproof capability, and thus extending its service life.

[0208] For example, the electrochromic material includes a color-changing material layer 410, an ion-conducting layer 420, and an ion-storing layer 430. In some optional embodiments, the pre-curing step of the electrochromic material may include: forming the color-changing material layer 410 in a first accommodating space of the first conductive substrate layer 100 and pre-curing the color-changing material layer 410; forming the ion-storing layer 430 in a second accommodating space of the second conductive substrate layer 200 and pre-curing the ion-storing layer 430.

[0209] Furthermore, an ion-conducting layer 420 is formed on the surface of the color-changing material layer 410 away from the first conductive substrate layer 100, and the ion-conducting layer 420 is pre-cured; or an ion-conducting layer 420 is formed on the surface of the ion storage layer 430 away from the second conductive substrate layer 200, and the ion-conducting layer 420 is pre-cured. During the pre-curing process of the electrochromic material, radiation curing technology or thermal curing technology can be used.

[0210] It should be noted that in this embodiment, the color-changing material layer 410 is pre-cured first, and then the ion-conducting layer 420 is formed on the surface of the color-changing material layer 410 and pre-cured. Alternatively, the ion storage layer 430 is pre-cured first, and then the ion-conducting layer 420 is formed on the surface of the ion storage layer 430 and pre-cured.

[0211] It is understandable that, since both the color-changing material layer 410 and the ion-conducting layer 420 have a certain degree of fluidity, the color-changing material layer 410 is pre-cured before the ion-conducting layer 420 is set on the surface of the color-changing material layer 410 and the ion-conducting layer 420 is pre-cured. This makes the thickness and shape of the color-changing material layer 410 relatively fixed. When the ion-conducting layer 420 is set, the materials of the ion-conducting layer 420 and the color-changing material layer 410 will not mix with each other, thereby making the thickness of the ion-conducting layer 420 and the color-changing material layer 410 more uniform and improving the uniformity of the thickness of the ion-conducting layer 420 and the color-changing material layer 410.

[0212] Since both the ion storage layer 430 and the ion conduction layer 420 have a certain degree of fluidity, the ion storage layer 430 is pre-cured before the ion conduction layer 420 is deposited on the surface of the ion storage layer 430 and the ion conduction layer 420 is pre-cured. This makes the thickness and shape of the ion storage layer 430 relatively fixed. When the ion conduction layer 420 is deposited, the materials of the ion conduction layer 420 and the ion storage layer 430 will not mix with each other, thereby making the thickness of the ion conduction layer 420 and the ion storage layer 430 more uniform and improving the uniformity of the thickness of the ion conduction layer 420 and the ion storage layer 430.

[0213] In addition, before curing the sealing layer 300, the color-changing material layer 410, the ion-conducting layer 420 and the ion-storage layer 430 are cured first. This can prevent excessive pressure from compressing the thickness of the color-changing material layer 410, the ion-conducting layer 420 and the ion-storage layer 430 to a thinner state. In other words, the thickness of the color-changing material layer 410, the ion-conducting layer 420 and the ion-storage layer 430 is controlled so that the thickness of the pre-cured color-changing material layer 410, the ion-conducting layer 420 and the ion-storage layer 430 is almost the same as the thickness after compression.

[0214] After aligning and pressing the first conductive substrate layer 100 and the second conductive substrate layer 200, the sealant is then cured to ensure that the sealant has good flowability during alignment and pressing, and can form a good adhesion with the surfaces of the first conductive substrate layer 100 and the second conductive substrate layer 200 during vacuum pressing, so that the sealing layer 300 of the electrochromic device has good sealing performance after curing.

[0215] The step before aligning and pressing the first conductive part, the sealing layer and the second conductive part may further include: forming an ion-conducting layer 420 on the side of the color-changing material layer 410 away from the first conductive substrate layer 100, forming a sealing layer 300 on the second conductive part 230 and the second insulating part 240, and pre-curing the ion-conducting layer 420.

[0216] Reference Figure 15 For example, an ion-conducting layer 420 is first formed on one side of the first conductive substrate layer 100, and a sealing layer 300 is formed on the conductive surface of the second conductive substrate layer 200. The ion-conducting layer 420 located on the first conductive substrate layer 100 is pre-cured using radiation curing technology or thermal curing technology.

[0217] The step before aligning and pressing the first conductive part, the sealing layer and the second conductive part may further include: forming an ion conducting layer 420 on the side of the ion storage layer 430 away from the second conductive substrate layer 200, forming a sealing layer 300 on the first conductive part 130 and the first insulating part 140, and pre-curing the ion conducting layer 420.

[0218] For example, an ion-conducting layer 420 is first formed on one side of the second conductive substrate layer 200, and a sealing layer 300 is formed on the conductive surface of the first conductive substrate layer 100. The ion-conducting layer 420 located on the second conductive substrate layer 200 is pre-cured using radiation curing technology or thermal curing technology.

[0219] It is easy to understand that when the sealing layer 300 is formed on the conductive surface of the first conductive substrate layer 100 and the ion conduction layer 420 is formed on the surface of the ion storage layer 430 of the second conductive substrate layer 200, the sealing layer 300 on the first conductive substrate layer 100 will not be pre-cured when the ion conduction layer 420 located on the second conductive substrate layer 200 is pre-cured.

[0220] When the sealing layer 300 is formed on the conductive surface of the second conductive substrate layer 200 and the ion-conducting layer 420 is formed on the surface of the color-changing material layer 410 of the first conductive substrate layer 100, the sealing layer 300 located on the second conductive substrate layer 200 will not be pre-cured when the ion-conducting layer 420 located on the first conductive substrate layer 100 is pre-cured.

[0221] For example, the ion-conducting layer 420 is first formed on the surface of the color-changing material layer 410 of the first conductive substrate layer 100 or on the surface of the ion storage layer 430 of the second conductive substrate layer 200. The ion-conducting layer 420 is pre-cured before the sealing layer 300 is formed. Then, the sealing layer 300 is formed on the conductive surface of the first conductive substrate layer 100 or the conductive surface of the second conductive substrate layer 200 to ensure that the sealant has good flowability during alignment and pressing, and good adhesion to the surfaces of the first conductive substrate layer 100 and the second conductive substrate layer 200 during vacuum pressing. (Refer to...) Figure 16 and Figure 17 When the sealing layer 300 is formed on the conductive surface of the first conductive substrate layer 100 and the ion-conducting layer 420 is formed on the surface of the color-changing material layer 410 of the first conductive substrate layer 100, before aligning and pressing the first conductive portion 130, the sealing layer 300 and the second conductive portion 230, the process may include: forming the ion-conducting layer 420 on the side of the color-changing material layer 410 away from the first conductive substrate layer 100, forming the sealing layer 300 on the first conductive portion 130 and the first insulating portion 140, covering the sealing layer 300 with a mask plate 500, and curing the ion-conducting layer 420 on the first conductive substrate layer 100.

[0222] For example, when the sealing layer 300 is formed on the conductive surface of the first conductive substrate layer 100 and the ion-conducting layer 420 is formed on the surface of the color-changing material layer 410 of the first conductive substrate layer 100, the sealing layer 300 is covered by a mask plate 500, which covers the surface of the sealing layer 300 away from the first conductive substrate layer 100. Then, the ion-conducting layer 420 is irradiated by radiation curing technology to achieve pre-curing of the ion-conducting layer 420. The mask plate 500 can also block the sealing layer 300 and prevent radiation (e.g., UV light) from irradiating the sealing layer 300, thereby reducing the possibility that the sealing layer 300 will be cured.

[0223] Alternatively, when the sealing layer 300 is formed on the conductive surface of the second conductive substrate layer 200 and the ion-conducting layer 420 is formed on the surface of the ion storage layer 430 of the second conductive substrate layer 200, before aligning and pressing the first conductive portion 130, the sealing layer 300 and the second conductive portion 230, the following steps may be included: forming the ion-conducting layer 420 on the side of the ion storage layer 430 away from the second conductive substrate layer 200, forming the sealing layer 300 on the second conductive portion 230 and the second insulating portion 240, covering the sealing layer 300 with a mask plate 500, and curing the ion-conducting layer 420 on the second conductive substrate layer 200.

[0224] For example, when the sealing layer 300 is formed on the conductive surface of the second conductive substrate layer 200 and the ion-conducting layer 420 is formed on the surface of the ion storage layer 430 of the second conductive substrate layer 200, the sealing layer 300 can be covered by a mask 500. The mask 500 covers the surface of the sealing layer 300 away from the second conductive substrate layer 200, and then the ion-conducting layer 420 is irradiated by radiation curing technology to achieve pre-curing of the ion-conducting layer 420. The mask 500 can also block the sealing layer 300 and prevent radiation (e.g., UV light) from irradiating the sealing layer 300, thereby reducing the possibility that the sealing layer 300 will be cured.

[0225] It should be noted that when the sealing layer 300 and the ion-conducting layer 420 are irradiated by radiation curing technology, the mask covering the sealing layer 300 can isolate and block UV light, preventing the sealant from being irradiated by UV light, thereby reducing the possibility of the sealing layer 300 being cured and allowing the ion-conducting layer 420 to be pre-cured. In some embodiments of this application, the method for fabricating an electrochromic device may include: providing an initial first conductive substrate layer, the initial first conductive substrate layer including at least one first conductive substrate layer; providing an initial second conductive substrate layer, the initial second conductive substrate layer including at least one second conductive substrate layer; after aligning and pressing the first conductive portion, the sealing layer and the second conductive portion together, cutting along the stacking direction of the initial first conductive substrate layer, the sealing layer and the initial second conductive substrate layer to divide and form independent electrochromic devices.

[0226] For example, refer to Figure 20 and Figure 21 The above-described fabrication process can be performed on the initial first conductive substrate layer 100a and the initial second conductive substrate layer 200a, such that the initial first conductive substrate layer 100a and the initial second conductive substrate layer 200a are disposed opposite to each other, and a plurality of independent electrochromic devices are formed between the initial first conductive substrate layer 100a and the initial second conductive substrate layer 200a. Each electrochromic device includes an electrochromic layer 400 and a filling layer surrounding the electrochromic layer 400, and the plurality of independent electrochromic devices are spaced apart.

[0227] The initial first conductive substrate 100a and the initial second conductive substrate 200a can be cut along the stacking direction of the initial first conductive substrate 100a, the sealing layer 300, and the initial second conductive substrate 200a, so that the initial first conductive substrate 100a forms multiple first conductive substrates 100, and the initial second conductive substrate 200a forms multiple second conductive substrates 200. The multiple first conductive substrates 100, multiple second conductive substrates 200, and multiple electrochromic layers 400 are arranged in a one-to-one correspondence. Each first conductive substrate 100, together with one second conductive substrate 200, one electrochromic layer 400, and the sealing layer 300, forms an electrochromic device. This allows for the simultaneous formation of multiple electrochromic devices, improving production efficiency and enabling large-scale production of electrochromic devices. Furthermore, a filler layer is provided between the initial first conductive substrate 100a and the initial second conductive substrate 200a, and the filler layer is formed between at least two electrochromic devices.

[0228] It should be noted that the filling layer can be disposed between the initial first conductive substrate layer 100a and the initial second conductive substrate layer 200a, and the filling layer can fill between the independent electrochromic layers 400. When the initial first conductive substrate layer 100a and the initial second conductive substrate layer 200a are cut, the filling layer can surround the corresponding electrochromic layer 400.

[0229] For example, the filling layer can also be disposed in the entire area between the initial first conductive substrate 100a and the initial second conductive substrate 200a, thereby reducing the possibility of cavities between the initial first conductive substrate 100a and the initial second conductive substrate 200a. When the initial first conductive substrate 100a and the initial second conductive substrate 200a are vacuum-pressed, the filling layer between the electrochromic devices can make the pressure on different areas more uniform, reducing the possibility of uneven stress on different parts of the initial first conductive substrate 100a and the initial second conductive substrate 200a during pressing.

[0230] In this embodiment, multiple independent electrochromic devices are formed between the initial first conductive substrate layer 100a and the initial second conductive substrate layer 200a. A filler layer may be partially disposed between the initial first conductive substrate layer 100a and the initial second conductive substrate layer 200a. Alternatively, a filler layer may be disposed between the initial first conductive substrate layer 100a and the initial second conductive substrate layer 200a. The material of the filler layer may be the same as the material of the sealing layer 300. The filler layer and the sealing layer 300 may be formed simultaneously between the initial first conductive substrate layer 100a and the initial second conductive substrate layer 200a to facilitate the formation process of the filler layer and the sealing layer 300.

[0231] In summary, the method for fabricating the electrochromic device provided in this application first forms a first conductive portion 130 on a first conductive substrate layer 100 and a second conductive portion 230 on a second conductive substrate layer 200; then, a sealing layer 300 is formed on at least one of the first conductive substrate layer 100 and the second conductive substrate layer 200; and then, the first conductive substrate layer 100, the second conductive substrate layer 200 and the sealing layer 300 are aligned and pressed together to form a space for accommodating the electrochromic material, so that the first conductive substrate layer 100 and the second conductive substrate layer 200 are connected through the sealing layer 300.

[0232] Furthermore, the first conductive portion 130, the sealing layer 300, and the second conductive portion 230 are aligned and pressed together. The sealing layer 300 can be disposed between the first conductive substrate layer 100 and the second conductive substrate layer 200. The first conductive substrate layer 100, the sealing layer 300, and the second conductive substrate layer 200 can be sequentially disposed along the thickness direction of the electrochromic device, thereby eliminating the need for the sealing layer 300 to be disposed outside the first conductive portion 130 or the second conductive portion 230. The sealing layer and the conductive portion are at least partially overlapped along the thickness direction of the electrochromic device. While keeping the width of the sealing layer 300 and the width of the conductive portion constant, the width of the non-visible area of ​​the electrochromic device is reduced, ensuring the sealing effect of the sealing layer and improving the applicability of the electrochromic device.

[0233] Reference Figure 22 and Figure 23 A second aspect of this application provides an electrochromic device, which includes an electrochromic layer 400 and a first conductive substrate layer 100 and a second conductive substrate layer 200 respectively disposed on both sides of the electrochromic layer 400. The first conductive substrate layer 100 is provided with a first conductive portion 130, and the second conductive substrate layer 200 is provided with a second conductive portion 230. A sealing layer 300 is disposed between the first conductive substrate layer 100 and the second conductive substrate layer 200. The electrochromic layer 400 is located in the visible area 10 of the electrochromic device, and the first conductive portion 130, the second conductive portion 230 and the sealing layer 300 are located in the non-visible area 20 of the electrochromic device. The sealing layer at least partially covers the first conductive portion; and / or, the sealing layer at least partially covers the second conductive portion.

[0234] The electrochromic layer 400 includes a color-changing material layer 410, an ion-conducting layer 420, and an ion storage layer 430, which are sequentially stacked along the thickness direction of the electrochromic device. By setting the electrochromic layer 400 and introducing current or voltage between the first conductive substrate layer 100 and the second conductive substrate layer 200, an electric field is formed on both sides of the electrochromic layer 400, thereby driving the electrochromic device to undergo coloring or fading, so that the electrochromic device exhibits a change in light transmittance in appearance, thereby achieving the function of adjusting the light transmittance of the scene in which the electrochromic device is applied.

[0235] In the above embodiment, the central portion of the electrochromic layer 400 is located in the visible area of ​​the electrochromic device, while the sealing layer 300, the first conductive portion 130, and the second conductive portion 230 are located in the non-visible area of ​​the electrochromic device. By at least partially covering the first and second conductive portions with the sealing layer, the width of the non-visible area 20 in the electrochromic device is reduced while ensuring effective sealing, thereby improving the applicability of the electrochromic device.

[0236] The first conductive substrate layer 100 and the second conductive substrate layer 200 can be specifically referred to above, and will not be repeated here in the embodiments of this application. The arrangement and formation process of the ion storage layer 430, the ion conduction layer 420 and the color-changing material layer 410 can be referred to above, and will not be repeated here in the embodiments of this application.

[0237] In some embodiments, the electrochromic layer and the first conductive portion are spaced apart. In some possible embodiments, when the color-changing material layer 410 in the electrochromic layer 400 is formed on the conductive surface of the first conductive substrate layer 100, the color-changing material layer 410 is spaced apart from the first conductive portion 130, and the edge of the color-changing material layer 410 does not cover the first conductive portion 130. The color-changing material layer 410 can be uniformly disposed on the surface of the first conductive substrate layer 100, making the overall thickness of the color-changing material layer 410 more uniform and ensuring the color-changing effect of the electrochromic device.

[0238] In other embodiments, the electrochromic layer and the second conductive portion are spaced apart.

[0239] In some possible implementations, when the ion storage layer 430 in the electrochromic layer 400 is formed on the conductive surface of the second conductive substrate layer 200, the ion storage layer 430 is spaced apart from the second conductive portion 230, and the edge of the ion storage layer 430 does not cover the second conductive portion 230. The ion storage layer 430 can be uniformly disposed on the surface of the second conductive substrate layer 200, making the overall thickness of the ion storage layer 430 more uniform and ensuring the color-changing effect of the electrochromic device. Optionally, in the direction parallel to the first conductive substrate layer 100, the distance between the inner edge of the first conductive portion and the color-changing material layer 410 is greater than or equal to 20 micrometers and less than or equal to 40 micrometers; and / or, in the direction parallel to the second conductive substrate layer 200, the distance between the inner edge of the second conductive portion and the ion storage layer 430 is greater than or equal to 20 micrometers and less than or equal to 40 micrometers.

[0240] In the above embodiments, the electrochromic layer 400 is spaced apart from the first conductive portion 130 and the second conductive portion 230, which reduces the possibility of the electrochromic layer 400 coming into contact with the first conductive portion 130 and the second conductive portion 230. For example, when the first conductive portion 130 and the second conductive portion 230 are made of a metallic material such as silver, the highly reactive silver ions can affect the color-changing function of the electrochromic layer 400. By spaced the electrochromic layer 400 from the first conductive portion 130 and the second conductive portion 230, the possibility of ions in the first conductive portion 130 and the second conductive portion 230 reacting chemically with the electrochromic layer 400 is reduced, thus ensuring the color-changing effect of the electrochromic device.

[0241] In some other embodiments, the sealing layer 300 at least partially covers the first conductive portion 130 and at least partially covers the first conductive substrate layer 100; and / or, the sealing layer 300 at least partially covers the second conductive portion 230 and at least partially covers the second conductive substrate layer 200.

[0242] For example, a first conductive portion 130 is disposed within a sealing layer 300, and the sealing layer 300 covers the first conductive portion 130 while at least partially covering the first conductive substrate layer 100; a second conductive portion 230 is disposed within a sealing layer 300, and the sealing layer 300 covers the second conductive portion 230 while at least partially covering the second conductive substrate layer 200. This arrangement can enhance the adhesion strength between the sealing layer 300 and the first conductive substrate layer 100, and between the sealing layer 300 and the second conductive substrate layer 200, preventing the sealing layer 300 from separating from the first conductive substrate layer 100 or the second conductive substrate layer 200, and further improving the sealing effect of the sealing layer 300.

[0243] Furthermore, the first conductive part 130 is disposed within the sealing layer 300, and the second conductive part 230 is disposed within the sealing layer 300. The sealing layer 300 can reduce the possibility that the first conductive part 130 and the second conductive part 230 are exposed to the outside, reduce the possibility that the first conductive part 130 and the second conductive part 230 directly contact the electrochromic layer 400, and reduce the possibility that the first conductive part 130 and the second conductive part 230 directly contact the external water and oxygen.

[0244] It should be noted that "covering" can mean that the sealing layer 300 is in contact with the first conductive part 130, and the sealing layer 300 is also in contact with the first conductive substrate layer 100. "Covering" can also mean that the sealing layer 300 is in contact with the second conductive part 230, and the sealing layer 300 is also in contact with the second conductive substrate layer 200.

[0245] In some embodiments, a first insulating portion is provided on a first conductive substrate layer, a second insulating portion is provided on a second conductive substrate layer, and a sealing layer at least partially covers the first insulating portion; and / or, the sealing layer at least partially covers the second insulating portion.

[0246] In some possible implementations, the first insulating portion 140 is disposed on the conductive surface of the first conductive substrate layer 100, and the sealing layer 300 completely covers the first insulating portion 140. Within the non-visible area of ​​the electrochromic device, the width of the first insulating portion 140 is smaller than the width of the sealing layer 300 along the direction from the inside to the outside of the electrochromic device. When the material of the first insulating portion 140 reacts with the material of the color-changing material layer 410, the sealing layer 300 protects the first insulating portion 140 by placing it within the sealing layer 300, thus preventing direct contact between the first insulating portion 140 and the electrochromic layer 400.

[0247] In some possible implementations, the first insulating portion 140 is disposed on the conductive surface of the first conductive substrate layer 100, and the sealing layer 300 partially covers the first insulating portion 140. Within the non-visible area of ​​the electrochromic device, the width of the first insulating portion 140 may be greater than the width of the sealing layer 300 (not shown) along the direction from the inside to the outside of the electrochromic device. When the material of the first insulating portion 140 and the material of the electrochromic layer 400 repel each other, by partially positioning the first insulating portion 140 outside the sealing layer 300, the repulsive force of the first insulating portion 140 on the color-changing material layer 410 can confine the color-changing material layer 410 to a specific area.

[0248] In some possible embodiments, the second insulating portion 240 is disposed on the conductive surface of the second conductive substrate layer 200, and the sealing layer 300 completely covers the second insulating portion 240. Within the non-visible area of ​​the electrochromic device, the width of the second insulating portion 240 is smaller than the width of the sealing layer 300 along the direction from the inside to the outside of the electrochromic device. When the material of the second insulating portion 240 reacts with the material of the ion storage layer 430, the sealing layer 300 protects the second insulating portion 240 by placing it within the sealing layer 300, thus preventing direct contact between the second insulating portion 240 and the electrochromic layer 400.

[0249] In some possible embodiments, the second insulating portion 240 is disposed on the conductive surface of the second conductive substrate layer 200, and the sealing layer 300 partially covers the second insulating portion 240. Within the non-visible area of ​​the electrochromic device, the width of the second insulating portion 240 may be greater than the width of the sealing layer 300 (not shown in the figure) along the direction from the inside to the outside of the electrochromic device. When the materials of the second insulating portion 240 and the electrochromic layer 400 repel each other, by partially positioning the second insulating portion 240 outside the sealing layer 300, the repulsive force of the second insulating portion 240 on the ion storage layer 430 can confine the ion storage layer 430 to a specific area.

[0250] In some embodiments of this application, along the thickness direction of the electrochromic device, the orthographic projection of the first insulating portion 140 onto the plane where the electrochromic layer 400 is located at least partially covers the orthographic projection of the second conductive portion 230 onto the plane where the electrochromic layer 400 is located; and / or, the orthographic projection of the second insulating portion 240 onto the plane where the electrochromic layer 400 is located at least partially covers the orthographic projection of the first conductive portion 130 onto the plane where the electrochromic layer 400 is located.

[0251] In this embodiment, the first insulating part 140 is disposed opposite to the second conductive part 230, and the second insulating part 240 is disposed opposite to the first conductive part 130. The first insulating part 140 forms an insulating protection for the second conductive part 230 in the stacking direction, or the second insulating part 240 forms an insulating protection for the first conductive part 130 in the stacking direction, thereby further avoiding contact between the first conductive part 130 and the second conductive part 230 and reducing the possibility of short circuit in the electrochromic device.

[0252] The first conductive substrate layer 100 may be provided with a first protective portion 150, which may cover the surface of the first conductive portion 130 opposite to the first conductive substrate layer 100. The first protective portion 150 covers the first conductive portion 130 while at least partially covering the first conductive substrate layer 100. The first protective portion 150 can provide a certain degree of isolation and protection for the first conductive portion 130, thereby reducing the possibility of chemical reactions occurring in the first conductive portion 130 and improving its stability.

[0253] For example, the width of the first protective portion 150 may be greater than the width of the first conductive portion 130, so that the first protective portion 150 covers the inner surface of the first conductive portion 130, thereby reducing the possibility that the first conductive portion 130 directly contacts the electrochromic layer 400.

[0254] The second conductive substrate 200 may be provided with a second protective portion 250. The second protective portion 250 may cover the surface of the second conductive portion 230 that faces away from the second conductive substrate 200. The second protective portion 250 covers the second conductive portion 230 and at least partially covers the second conductive substrate 200. The second protective portion 250 can provide a certain degree of isolation and protection for the second conductive portion 230, thereby reducing the possibility of chemical reactions occurring in the second conductive portion 230 and improving the stability of the second conductive portion 230.

[0255] For example, the width of the second protective portion 250 may be greater than the width of the second conductive portion 230, so that the second protective portion 250 covers the inner surface of the second conductive portion 230, thereby reducing the possibility that the second conductive portion 230 directly contacts the electrochromic layer 400.

[0256] The electrochromic device may further include a first lead electrode and a second lead electrode. The first lead electrode may be electrically connected to a first conductive part, and the second lead electrode may be electrically connected to a second conductive part, so that the first conductive part is electrically connected to an external conductive material through the first lead electrode, and the second conductive part is electrically connected to an external conductive material through the second lead electrode.

[0257] The first lead electrode can be disposed at the end of the first conductive portion, or the first lead electrode can also be disposed in the middle of the first conductive portion; the second lead electrode can be disposed at the end of the second conductive portion, or the second lead electrode can also be disposed in the middle of the second conductive portion. The first lead electrode can be electrically connected to the first conductive portion, and the first lead electrode can extend to the outside of the first conductive substrate layer. The second lead electrode can be electrically connected to the second conductive portion, and the second lead electrode can extend to the outside of the second conductive substrate layer. In the above embodiments, both the first lead electrode and the second lead electrode can be flexible printed circuit boards (FPCs), which are highly reliable and extremely flexible printed circuit boards made of polyimide or polyester film as a substrate.

[0258] The first external terminal and the second external terminal can be positive and negative power lines of an external power source. The positive and negative power lines can be electrically connected to the first lead electrode and the second lead electrode respectively by soldering or snapping to achieve a stable electrical connection.

[0259] Reference Figure 22 and Figure 23A third aspect of the present application provides an electrochromic device, including a transparent substrate layer 600, a shielding layer 700 and the aforementioned electrochromic device. The substrate layer 600 is disposed on the side of the first conductive substrate layer 100 of the electrochromic device that is away from the electrochromic layer 400, or disposed on the side of the second conductive substrate layer 200 of the electrochromic device that is away from the electrochromic layer 400.

[0260] A shielding layer 700 is disposed on the substrate layer 600 and at least covers the sealing layer 300. The shielding layer 700 is disposed in the non-visible area 20 of the electrochromic device to shield the sealing layer 300, the conductive part, and the electrochromic layer 400. It should be noted that, compared with related technologies, the electrochromic device provided in this application embodiment reduces the width of the non-visible area 20, thereby reducing the width of the shielding layer 700 and improving the applicability of the electrochromic device.

[0261] A fourth aspect of this application provides a terminal product including the aforementioned electrochromic device or color-changing apparatus. The terminal product includes any one of a rearview mirror, curtain wall, sunroof, side window, windshield, electronic product casing, eyeglasses, vehicle, and display panel. In this embodiment, by employing the aforementioned electrochromic device or color-changing apparatus, all the advantages of the aforementioned color-changing electrochromic device and color-changing apparatus are achieved.

[0262] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0263] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0264] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A method for preparing an electrochromic device, characterized in that, Includes the following steps: A first conductive substrate layer is provided, and a first conductive portion extending along the edge of the first conductive substrate layer is formed on the conductive surface of the first conductive substrate layer; A second conductive substrate layer is provided, and a second conductive portion extending along the edge of the second conductive substrate layer is formed on the conductive surface of the second conductive substrate layer; A sealing layer is formed on the first conductive substrate layer, the sealing layer at least partially covering the first conductive portion; and / or, a sealing layer is formed on the second conductive substrate layer, the sealing layer at least partially covering the second conductive portion; The first conductive substrate layer and the second conductive substrate layer are placed opposite each other, and the first conductive portion, the sealing layer and the second conductive portion are aligned and pressed together, so that the first conductive substrate layer, the second conductive substrate layer and the sealing layer form a receiving space for accommodating the electrochromic layer.

2. The method for preparing the electrochromic device according to claim 1, characterized in that, The method further includes: A first insulating portion extending along the edge of the first conductive substrate layer is formed on the conductive surface of the first conductive substrate layer. After the first conductive portion and the first insulating portion are formed, the first conductive portion and the first insulating portion enclose a first accommodating space; and / or, A second insulating portion extending along the edge of the second conductive substrate is formed on the conductive surface of the second conductive substrate layer. After the second conductive portion and the second insulating portion are formed, the second conductive portion and the second insulating portion enclose and form a second accommodating space.

3. The method for preparing the electrochromic device according to claim 1, characterized in that, The method further includes: A first insulating portion is formed on the conductive surface of the first conductive substrate layer; A second insulating portion is formed on the conductive surface of the second conductive substrate layer; The step of aligning the first conductive substrate layer and the second conductive substrate layer with each other and aligning and pressing the first conductive portion, the sealing layer, and the second conductive portion together further includes: The first conductive portion is positioned opposite the second insulating portion, and the second conductive portion is positioned opposite the first insulating portion.

4. The method for preparing the electrochromic device according to claim 2, characterized in that, The method further includes: after forming the first accommodating space, forming a color-changing material layer attached to the conductive surface of the first conductive substrate layer, the color-changing material layer being located within the first accommodating space; and / or, After the second accommodating space is formed, an ion storage layer is formed attached to the conductive surface of the second conductive substrate layer, and the ion storage layer is located within the second accommodating space.

5. The method for preparing the electrochromic device according to claim 4, characterized in that, The method further includes: Before aligning and pressing the first conductive part, the sealing layer, and the second conductive part together, the ion-conducting layer is formed on the side of the color-changing material layer away from the first conductive substrate layer; or... Before the first conductive part, the sealing layer and the second conductive part are pressed together, the ion conducting layer is formed on the side of the ion storage layer away from the second conductive substrate layer.

6. The method for preparing the electrochromic device according to claim 2, characterized in that, The step of forming a sealing layer on the first conductive substrate layer includes: The sealing layer is formed on the first conductive portion and the first insulating portion, and the sealing layer at least partially covers the first conductive portion and the first insulating portion; and / or, The step of forming a sealing layer on the second conductive substrate layer includes: The sealing layer is formed on the second conductive portion and the second insulating portion, and the sealing layer at least partially covers the second conductive portion and the second insulating portion.

7. The method for preparing the electrochromic device according to claim 1, characterized in that, The method further includes: Before aligning and pressing the first conductive part, the sealing layer and the second conductive part together, the electrochromic layer is pre-cured. After aligning and pressing the first conductive part, the sealing layer and the second conductive part together, the sealing layer is cured to form the electrochromic device.

8. The method for preparing the electrochromic device according to claim 7, characterized in that, The step of pre-curing the electrochromic layer includes: The color-changing material layer is formed in a first accommodating space on the first conductive substrate layer, and the color-changing material layer is pre-cured; an ion storage layer is formed in a second accommodating space on the second conductive substrate layer, and the ion storage layer is pre-cured. The ion-conducting layer is formed on the side of the color-changing material layer away from the first conductive substrate layer, and the ion-conducting layer is pre-cured; or, the ion-conducting layer is formed on the side of the ion storage layer away from the second conductive substrate layer, and the ion-conducting layer is pre-cured.

9. The method for preparing the electrochromic device according to claim 7, characterized in that, Before aligning and pressing the first conductive part, the sealing layer, and the second conductive part, the process includes: An ion-conducting layer is formed on the side of the color-changing material layer away from the first conductive substrate layer; the sealing layer is formed on the second conductive portion and the second insulating portion; and the ion-conducting layer on the first conductive substrate layer is pre-cured; or... The ion-conducting layer is formed on the side of the color-changing material layer away from the second conductive substrate layer, the sealing layer is formed on the first conductive portion and the first insulating portion, and the ion-conducting layer on the second conductive substrate layer is pre-cured.

10. The method for preparing the electrochromic device according to claim 7, characterized in that, Before aligning and pressing the first conductive part, the sealing layer, and the second conductive part together, the method further includes: An ion-conducting layer is formed on the side of the color-changing material layer away from the first conductive substrate layer; the sealing layer is formed on the first conductive portion and the first insulating portion; the sealing layer is covered with a mask; and the ion-conducting layer on the first conductive substrate layer is pre-cured; or... An ion-conducting layer is formed on the side of the ion storage layer away from the second conductive substrate layer, a sealing layer is formed on the second conductive portion and the second insulating portion, the sealing layer is covered with a mask, and the ion-conducting layer on the second conductive substrate layer is pre-cured.

11. The method for preparing the electrochromic device according to claim 1, characterized in that, The method further includes: After the first conductive portion is formed, a first protective portion is provided on the first conductive portion, the first protective portion being at least partially in contact with the first conductive substrate layer; and / or, After the second conductive portion is formed, a second protective portion is provided on the second conductive portion, and the second protective portion is at least partially in contact with the second conductive substrate layer.

12. The method for preparing the electrochromic device according to claim 1, characterized in that, The method further includes: An initial first conductive substrate layer is provided, the initial first conductive substrate layer comprising at least one first conductive substrate layer; An initial second conductive substrate layer is provided, the initial second conductive substrate layer comprising at least one second conductive substrate layer; After aligning and pressing the first conductive part, the sealing layer and the second conductive part together, the parts are cut along the stacking direction of the initial first conductive substrate layer, the sealing layer and the initial second conductive substrate layer to divide and form the individual electrochromic devices.

13. The method for preparing the electrochromic device according to claim 12, characterized in that, The method further includes: A filling layer is disposed between the initial first conductive substrate layer and the initial second conductive substrate layer, the filling layer being formed between at least two of the electrochromic devices.

14. An electrochromic device, characterized in that, The device includes an electrochromic layer and a first conductive substrate layer and a second conductive substrate layer respectively disposed on both sides of the electrochromic layer; a first conductive portion is provided on the first conductive substrate layer, a second conductive portion is provided on the second conductive substrate layer, and a sealing layer is provided between the first conductive substrate layer and the second conductive substrate layer; wherein... The sealing layer at least partially covers the first conductive portion; and / or, the sealing layer at least partially covers the second conductive portion.

15. The electrochromic device according to claim 14, characterized in that, The electrochromic layer and the first conductive portion are spaced apart; and / or, the electrochromic layer and the second conductive portion are spaced apart.

16. The electrochromic device according to claim 14, characterized in that, A first insulating portion is disposed on the first conductive substrate layer, and a second insulating portion is disposed on the second conductive substrate layer, and... The sealing layer at least partially covers the first insulating portion; and / or, the sealing layer at least partially covers the second insulating portion.

17. The electrochromic device according to claim 14, characterized in that, The first conductive substrate layer is provided with a first protective portion, the first protective portion covers the surface of the first conductive portion away from the first conductive substrate layer, and the first protective portion at least partially covers the first conductive substrate layer. And / or, the second conductive substrate layer is provided with a second protective portion, the second protective portion covering the surface of the second conductive portion away from the second conductive substrate layer, and the second protective portion at least partially covering the second conductive substrate layer.

18. A color-changing device, characterized in that, The device includes a transparent substrate layer and the electrochromic device according to any one of claims 14-17, wherein the substrate layer is disposed on the side of the first conductive substrate layer opposite to the electrochromic layer, or disposed on the side of the second conductive substrate layer opposite to the electrochromic layer.

19. A terminal product, characterized in that, Includes the electrochromic device according to any one of claims 14-17 or the color-changing device according to claim 18, wherein the end product includes any one of rearview mirrors, curtain walls, car sunroofs, car side windows, car windshields, housings of electronic products, eyeglasses, vehicles, and display panels.

Images