Battery pack high-voltage distribution box heat dissipation analysis method and device based on CAE (Computer Aided Engineering)

Abstract

The invention discloses a CAE-based battery pack high-voltage distribution box heat dissipation analysis method and device, and belongs to the technical field of computer aided design, and the method comprises the steps: obtaining material parameters and a three-dimensional simplified model of each part of a battery pack high-voltage distribution box; based on the material parameters of all the parts and the three-dimensional simplified model, a configured three-dimensional simplified model is obtained; and on the basis of the configured three-dimensional simplified model, a fast charging working condition analysis result and a continuous urgent adding and urgent decreasing working condition analysis result are obtained by adopting a fast charging working condition and a continuous urgent adding and urgent decreasing working condition respectively. Analysis and simulation verification are carried out in the design stage, repeated sample verification is not needed, and the design efficiency is improved.

Description

Technical Field

[0001] This invention discloses a method and device for heat dissipation analysis of high-voltage distribution boxes in battery packs based on CAE, belonging to the field of computer-aided design technology. Background Technology

[0002] As a core component connecting the battery system and the vehicle's electrical system, the high-voltage distribution box of a new energy vehicle battery pack is not only responsible for the distribution and transmission of high-voltage electricity, but also ensures the stable operation of the high-voltage system under complex conditions through multiple safety mechanisms, intelligent monitoring, and thermal management design, providing crucial support for the vehicle's energy efficiency, safety, and reliability. Internally, it contains main positive, main negative, fast-charging positive, fast-charging negative, boost relays, shunts, smart fuses, copper busbars, BMU mainboard, and other components, with a cooling device located at the bottom of the casing.

[0003] In the operation and application of new energy vehicles, the high-voltage distribution box of the battery pack is subjected to varying current for a certain period of time. According to the principle of current heating, the heat generated by current passing through a conductor is proportional to the square of the current, the conductor's resistance, and the duration of current flow. Under test conditions, if the generated heat causes localized temperatures to become excessively high, exceeding the tolerance limits of components, it will lead to high-temperature damage. Therefore, it is essential to evaluate the current loading conditions to ensure that the components through which current flows in the circuit can withstand the current load specified by standards.

[0004] Currently, the verification of high-voltage distribution boxes in battery packs mainly adopts specialized environmental testing methods: the boxes are fixed on a dedicated environmental test bench, and current excitation is applied. The standard for passing the test is that the components do not suffer high-temperature damage under different current excitation conditions. If the test fails, the components need to be replaced and the test repeated, which makes the entire verification process lengthy. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention proposes a CAE-based method and apparatus for analyzing the heat dissipation of high-voltage distribution boxes in battery packs. This method allows for analysis and simulation verification during the design phase, eliminating the need for repeated sample verification and improving design efficiency.

[0006] The technical solution of the present invention is as follows:

[0007] According to a first aspect of the present invention, a CAE-based method for analyzing the heat dissipation of a high-voltage distribution box in a battery pack is provided, comprising:

[0008] Obtain the material parameters and simplified 3D model of each component of the high-voltage distribution box of the battery pack;

[0009] Based on the material parameters of each component and the simplified 3D model, the configured simplified 3D model is obtained;

[0010] Based on the configured simplified 3D model, fast charging and continuous rapid acceleration / deceleration conditions were used to obtain analysis results for fast charging and continuous rapid acceleration / deceleration conditions, respectively.

[0011] Furthermore, obtain the material parameters of each component, including at least: the temperature variation curves of the density, specific heat capacity, and thermal conductivity of key component materials; the temperature variation curves of the density, specific heat capacity, thermal conductivity, and dynamic viscosity of coolant materials; the contact heat power of coolant flow rate and inlet temperature, and the contact resistance between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts.

[0012] Furthermore, based on the material parameters of each component and the simplified 3D model, the configured simplified 3D model is obtained, including:

[0013] Based on the simplified three-dimensional model, a wizard for creating an external natural convection transient heat dissipation model is used to obtain the first simplified three-dimensional model.

[0014] Based on the material parameters of each component and the first three-dimensional simplified model, material properties are created and assigned to each component to obtain the second three-dimensional simplified model.

[0015] Based on the second simplified three-dimensional model, a fluid subdomain of the cooling device is created and boundary conditions are set to obtain the third simplified three-dimensional model.

[0016] Based on the third simplified three-dimensional model, the thermal radiation coefficient is set to obtain the fourth simplified three-dimensional model;

[0017] Based on the fourth simplified 3D model, local mesh refinement is created to obtain the configured simplified 3D model.

[0018] Furthermore, based on the configured simplified 3D model, fast charging and continuous rapid acceleration / deceleration conditions were applied respectively to obtain analysis results for fast charging and continuous rapid acceleration / deceleration conditions, including:

[0019] Based on the configured simplified 3D model, set the input current and output voltage ports;

[0020] The corresponding contact heat power was applied to the contact surfaces between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts, respectively, to obtain the temperature distribution cloud map of the first key component during the charging process.

[0021] Based on the temperature distribution cloud map of the first key component during the charging process, the fast charging condition analysis results are obtained;

[0022] Based on the configured simplified 3D model, continuous rapid acceleration and deceleration conditions were loaded to obtain the temperature distribution cloud map of the second key component during the charging process.

[0023] Based on the temperature distribution cloud map of the second key component during the charging process, the analysis results of continuous rapid acceleration and deceleration were obtained.

[0024] Furthermore, based on the temperature distribution cloud map of the first key component during the charging process, the fast charging condition analysis results are obtained, including:

[0025] Based on the temperature distribution cloud map of the first key component during the charging process, the maximum temperature of the first component is obtained;

[0026] Based on the maximum temperature of the first component and the upper limit temperature at which the component can operate, a first judgment result is obtained.

[0027] In response to the first judgment result that the maximum temperature of the component is greater than or equal to the upper limit of the component's allowable operating temperature, the fast charging condition analysis result is unqualified.

[0028] In response to the first judgment result that the maximum temperature of the component is less than the upper limit of the component's allowable operating temperature, the fast charging condition analysis result is qualified.

[0029] Furthermore, based on the temperature distribution cloud map of the second key component during the charging process, the analysis results of continuous rapid acceleration and deceleration conditions were obtained, including:

[0030] Based on the temperature distribution cloud map of the second key component during the charging process, the maximum temperature of the second component during the loading process is obtained.

[0031] Based on the maximum temperature of the first component and the upper limit temperature at which the component can operate, a second judgment result is obtained.

[0032] In response to the second judgment result that the maximum temperature of the component is greater than or equal to the upper limit of the component's allowable operating temperature, the analysis result of the continuous rapid acceleration and deceleration condition is unqualified.

[0033] In response to the second judgment result that the maximum temperature of the component is less than the upper limit of the component's allowable operating temperature, the analysis result of the continuous rapid acceleration and deceleration condition is qualified.

[0034] According to a second aspect of the present invention, a CAE-based heat dissipation analysis device for a high-voltage distribution box of a battery pack is provided, comprising:

[0035] The acquisition module is used to acquire the material parameters and simplified 3D model of each component of the high-voltage distribution box of the battery pack;

[0036] The configuration module is used to obtain the configured simplified 3D model based on the material parameters of each component and the simplified 3D model.

[0037] The analysis module is used to obtain analysis results for fast charging and continuous rapid acceleration / deceleration based on the configured simplified 3D model.

[0038] Furthermore, the analysis module includes:

[0039] Based on the configured simplified 3D model, set the input current and output voltage ports;

[0040] The corresponding contact heat power was applied to the contact surfaces between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts, respectively, to obtain the temperature distribution cloud map of the first key component during the charging process.

[0041] Based on the temperature distribution cloud map of the first key component during the charging process, the fast charging condition analysis results are obtained;

[0042] Based on the configured simplified 3D model, continuous rapid acceleration and deceleration conditions were loaded to obtain the temperature distribution cloud map of the second key component during the charging process.

[0043] Based on the temperature distribution cloud map of the second key component during the charging process, the analysis results of continuous rapid acceleration and deceleration were obtained.

[0044] According to a third aspect of the present invention, a terminal is provided, comprising:

[0045] One or more processors;

[0046] Memory for storing the one or more processor-executable instructions;

[0047] Wherein, the one or more processors are configured as follows:

[0048] Perform the method described in the first aspect of the embodiments of the present invention.

[0049] According to a fourth aspect of the present invention, a non-transitory computer-readable storage medium is provided, wherein when instructions in the storage medium are executed by a processor of a terminal, the terminal is enabled to perform the method described in the first aspect of the present invention.

[0050] According to a fifth aspect of the present invention, an application product is provided that, when the application product is running on a terminal, causes the terminal to execute the method described in the first aspect of the present invention.

[0051] The beneficial effects of this invention are as follows:

[0052] (1) By acquiring the material parameters and three-dimensional simplified models of each component, a solid physical foundation is laid for subsequent analysis, ensuring that the analysis process closely matches the characteristics of the actual components, improving the accuracy and reliability of the analysis. After configuration based on these parameters and models, the constructed analysis framework can more realistically reflect the structure and material properties of the power distribution box, providing an accurate digital carrier for working condition simulation.

[0053] (2) The analysis was conducted using fast charging and continuous rapid acceleration and deceleration conditions. These two conditions are typical scenarios in which the high-voltage distribution box of new energy vehicles experiences changes in current excitation during actual use. They can comprehensively and selectively capture the stress and heat generation of the internal components of the distribution box under different driving conditions, avoiding the limitations that may exist in single-condition analysis and making the analysis results more practically instructive.

[0054] (3) Compared with traditional special environmental tests, it is more inclined to digital simulation analysis, which can assess the durability of components in the early design stage. This helps to discover potential problems in advance, reduce the time and cost of repeated replacements and tests due to unqualified components, and thus improve the efficiency of the entire R&D process.

[0055] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Attached Figure Description

[0056] Figure 1 This is a flowchart illustrating a CAE-based method for analyzing the heat dissipation of a high-voltage distribution box in a battery pack, according to an exemplary embodiment.

[0057] Figure 2 This is a three-dimensional model diagram of the high-voltage distribution box structure of a battery pack, as illustrated in an exemplary embodiment of a CAE-based method for analyzing the heat dissipation of a high-voltage distribution box in a battery pack.

[0058] Figure 3 This is a three-dimensional model diagram of the high-voltage distribution box structure of a battery pack, as illustrated in an exemplary embodiment of a CAE-based method for analyzing the heat dissipation of a high-voltage distribution box in a battery pack.

[0059] Figure 4 This is a graph showing the change of current over time during fast charging in a CAE-based high-voltage distribution box heat dissipation analysis method for battery packs, according to an exemplary embodiment.

[0060] Figure 5 This is a cloud map of copper busbar temperature distribution at 210s during fast charging in a CAE-based high-voltage distribution box heat dissipation analysis method for battery packs, according to an exemplary embodiment.

[0061] Figure 6 This is a relay temperature distribution cloud map at 210s during fast charging operation, illustrating a CAE-based method for analyzing the heat dissipation of a high-voltage distribution box in a battery pack, according to an exemplary embodiment.

[0062] Figure 7 This is a graph showing the change of current over time under continuous rapid acceleration and deceleration conditions in a CAE-based high-voltage distribution box heat dissipation analysis method for battery packs, according to an exemplary embodiment.

[0063] Figure 8 This is a cloud map of copper busbar temperature distribution at 96 seconds during a continuous rapid acceleration and deceleration operation in a CAE-based high-voltage distribution box heat dissipation analysis method for battery packs, according to an exemplary embodiment.

[0064] Figure 9 This is a relay temperature distribution cloud map at 96 seconds during a continuous rapid acceleration and deceleration operation in a CAE-based high-voltage distribution box heat dissipation analysis method for battery packs, according to an exemplary embodiment.

[0065] Figure 10 This is a schematic block diagram illustrating the structure of a CAE-based high-voltage power distribution box heat dissipation analysis device for a battery pack, according to an exemplary embodiment.

[0066] Figure 11 This is a schematic block diagram of a terminal structure according to an exemplary embodiment. Detailed Implementation

[0067] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0068] In the description of this invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0069] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0070] This invention provides a CAE-based method for analyzing the heat dissipation of a high-voltage power distribution box in a battery pack. This method is implemented by a terminal, which can be a desktop computer or a laptop computer, etc., and the terminal includes at least a CPU.

[0071] Example 1

[0072] Figure 1 This is a flowchart illustrating a CAE-based heat dissipation analysis method for a high-voltage distribution box of a battery pack, according to an exemplary embodiment. The method is used in a terminal and includes the following steps:

[0073] Step S10: Obtain the material parameters and simplified 3D model of each component of the high-voltage distribution box of the battery pack;

[0074] Step S20: Based on the material parameters of each component and the three-dimensional simplified model, the configured three-dimensional simplified model is obtained;

[0075] Step S30: Based on the configured three-dimensional simplified model, fast charging condition and continuous rapid acceleration and deceleration condition are respectively used to obtain the analysis results of fast charging condition and continuous rapid acceleration and deceleration condition.

[0076] Furthermore, obtain the material parameters of each component, including at least: the temperature variation curves of the density, specific heat capacity, and thermal conductivity of key component materials; the temperature variation curves of the density, specific heat capacity, thermal conductivity, and dynamic viscosity of coolant materials; the contact heat power of coolant flow rate and inlet temperature, and the contact resistance between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts.

[0077] Furthermore, based on the material parameters of each component and the simplified 3D model, the configured simplified 3D model is obtained, including:

[0078] Based on the simplified three-dimensional model, a wizard for creating an external natural convection transient heat dissipation model is used to obtain the first simplified three-dimensional model.

[0079] Based on the material parameters of each component and the first three-dimensional simplified model, material properties are created and assigned to each component to obtain the second three-dimensional simplified model.

[0080] Based on the second simplified three-dimensional model, a fluid subdomain of the cooling device is created and boundary conditions are set to obtain the third simplified three-dimensional model.

[0081] Based on the third simplified three-dimensional model, the thermal radiation coefficient is set to obtain the fourth simplified three-dimensional model;

[0082] Based on the fourth simplified 3D model, local mesh refinement is created to obtain the configured simplified 3D model.

[0083] Furthermore, based on the configured simplified 3D model, fast charging and continuous rapid acceleration / deceleration conditions were applied respectively to obtain analysis results for fast charging and continuous rapid acceleration / deceleration conditions, including:

[0084] Based on the configured simplified 3D model, set the input current and output voltage ports;

[0085] The corresponding contact heat power was applied to the contact surfaces between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts, respectively, to obtain the temperature distribution cloud map of the first key component during the charging process.

[0086] Based on the temperature distribution cloud map of the first key component during the charging process, the fast charging condition analysis results are obtained;

[0087] Based on the configured simplified 3D model, continuous rapid acceleration and deceleration conditions were loaded to obtain the temperature distribution cloud map of the second key component during the charging process.

[0088] Based on the temperature distribution cloud map of the second key component during the charging process, the analysis results of continuous rapid acceleration and deceleration were obtained.

[0089] Furthermore, based on the temperature distribution cloud map of the first key component during the charging process, the fast charging condition analysis results are obtained, including:

[0090] Based on the temperature distribution cloud map of the first key component during the charging process, the maximum temperature of the first component is obtained;

[0091] Based on the maximum temperature of the first component and the upper limit temperature at which the component can operate, a first judgment result is obtained.

[0092] In response to the first judgment result that the maximum temperature of the component is greater than or equal to the upper limit of the component's allowable operating temperature, the fast charging condition analysis result is unqualified.

[0093] In response to the first judgment result that the maximum temperature of the component is less than the upper limit of the component's allowable operating temperature, the fast charging condition analysis result is qualified.

[0094] Furthermore, based on the temperature distribution cloud map of the second key component during the charging process, the analysis results of continuous rapid acceleration and deceleration conditions were obtained, including:

[0095] Based on the temperature distribution cloud map of the second key component during the charging process, the maximum temperature of the second component during the loading process is obtained.

[0096] Based on the maximum temperature of the first component and the upper limit temperature at which the component can operate, a second judgment result is obtained.

[0097] In response to the second judgment result that the maximum temperature of the component is greater than or equal to the upper limit of the component's allowable operating temperature, the analysis result of the continuous rapid acceleration and deceleration condition is unqualified.

[0098] In response to the second judgment result that the maximum temperature of the component is less than the upper limit of the component's allowable operating temperature, the analysis result of the continuous rapid acceleration and deceleration condition is qualified.

[0099] By applying this embodiment, the material parameters and simplified 3D models of each component are obtained, laying a solid physical foundation for subsequent analysis. This ensures that the analysis process closely matches the characteristics of the actual components, improving the accuracy and reliability of the analysis. After configuration based on these parameters and models, the constructed analysis framework can more realistically reflect the structure and material properties of the power distribution box, providing an accurate digital carrier for operating condition simulation.

[0100] This embodiment analyzes fast charging and continuous rapid acceleration / deceleration conditions. These two conditions are typical scenarios in which the high-voltage distribution box of a new energy vehicle experiences changes in current excitation during actual use. This allows for a comprehensive and focused capture of the stress and heat generation of the internal components of the distribution box under different driving conditions, avoiding the limitations that may exist in single-condition analysis and making the analysis results more practically instructive.

[0101] Compared to traditional specialized environmental testing, this embodiment leans more towards digital simulation analysis, which can assess the durability of components in the early design stage. This helps to identify potential problems in advance, reduce the time and cost of repeated replacements and tests due to component non-compliance, and thus improve the efficiency of the entire R&D process.

[0102] Example 2

[0103] This is an exemplary embodiment illustrating a CAE-based heat dissipation analysis method for a high-voltage power distribution box in a battery pack. The method is used in a terminal and includes the following steps:

[0104] Step S10: Obtain the material parameters and simplified 3D model of each component of the battery pack high-voltage distribution box. The specific details are as follows:

[0105] Obtain the temperature-dependent curves of material density, specific heat capacity, and thermal conductivity of key components such as the shell, copper busbar, insulating pad, and thermally conductive pad.

[0106] Obtain the curves of coolant material density, specific heat capacity, thermal conductivity, and dynamic viscosity as a function of temperature, and obtain the coolant flow rate and inlet temperature.

[0107] Obtain the contact resistance between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts. Then, apply the formula P = I... 2 R converts contact resistance into contact heat power, where I is the current and R is the contact resistance.

[0108] The 3D model of the battery pack high-voltage distribution box includes: housing, cooling device, copper busbars, relays, smart fuses, shunts, insulating pads, thermally conductive pads, etc. Figure 2 and Figure 3As shown. Retain other non-heat source components that are large enough to significantly impact natural convection and play a crucial role in heat conduction, while removing components with minimal impact on heat distribution. For the coolant inlet and outlet locations of the cooling system, the create cap function can be used to create inlet and outlet caps. Save the results using Catia software as a .CATProduct file.

[0109] It is worth noting that for structurally complex components, a comprehensive evaluation can be conducted based on their location and contribution to heat distribution, leading to model simplification. This retains key heat dissipation-related features while reducing the number of meshes and improving computational speed. For relay components, their external structural outline and detailed conductive copper pillar structure are preserved, and the structure is divided into separate parts. This reflects both their impact on system heat convection and radiation, as well as their heat transfer characteristics. The same approach is used for smart fuses and shunts, dividing them into main body and connecting parts, respectively. For the motherboard, since it is located at the edge of the casing and there are no high-power heat-generating devices around it, it is ignored in the model. For the outer surface of the copper busbar in contact with the relay copper pillars, an indentation of the same size as the contact area with the copper pillars should be created to apply the current load. Other retained non-heat-generating components should be appropriately processed to reduce local microstructures. In addition, there should be no gaps between current-conducting structures, otherwise, a short circuit will occur.

[0110] Step S20: Based on the material parameters of each component and the simplified 3D model, the configured simplified 3D model is obtained, as detailed below:

[0111] Open the .CATProduct file using FloEFD software and create an external natural convection transient heat dissipation model using the wizard. Select the discrete heat transfer and radiation model, exclude fluid cavities that do not meet the requirements, use the default blackbody wall, and set the ambient temperature and component temperature to the initial ambient temperature of 45℃ required by the experiment. Select laminar or turbulent flow type, and determine the gravity direction based on the actual experimental setup. It is worth noting that to ensure the simulation model can correctly identify the fluid region, solid region, and fluid-solid boundary, a model check should be performed during the 3D model preparation stage. When the analysis model is complex and has many fluid-solid boundary regions, multiple local regions can be checked first before performing an overall model check. Using feature options, this can effectively identify the entire model.

[0112] Materials should be prioritized to avoid simulation errors caused by material overlap, ensure accurate simulation of heat transfer paths, and improve simulation accuracy. Copper busbars and relay copper pillars have the highest priority, followed by insulating pads, thermal pads, and plastic parts such as housings.

[0113] Select inlet and outlet caps to create a fluid subdomain, and set the inlet velocity and outlet ambient pressure of the fluid subdomain to standard atmospheric pressure. For volumetric flow rate velocity inlet conditions, conversion can be made based on the relationship between flow rate and inlet area:

[0114] v = Qv / S (1)

[0115] in:

[0116] Qv is the coolant volumetric flow rate (unit: L / min);

[0117] S is the coolant inlet area (unit: m²) 2 )

[0118] It is now known that Qv = 2 L / min = 3.334 × 10 -5 m 3 / s, S=78.5mm 2 =7.85×10 -5 m 2 Then the coolant inlet velocity is:

[0119] v = Qv / S = 3.334 × 10 -5 m 3 / s÷7.85×10 -5 m 2 =0.43m / s

[0120] When the coolant flow path of the initial cooling system is not clearly designed, the equivalent power cooling capacity can be calculated based on the coolant type, density and specific heat capacity parameters, volumetric flow rate, and coolant inlet and outlet temperature difference provided by the OEM or partner.

[0121] Q=m·c·ΔT (2)

[0122] in:

[0123] m is the coolant mass flow rate (unit: kg / s);

[0124] c is the specific heat capacity of the coolant (unit: J / (kg·K));

[0125] ΔT is the temperature difference between the coolant inlet and outlet (unit: K).

[0126] Given that the coolant volumetric flow rate is Qv = 2 L / min = 3.334 × 10⁻⁶ -5 m 3 Given that the coolant density ρ = 1073 kg / m³ and c = 3350 J / kg·K, the coolant mass flow rate is:

[0127] m = Qv·ρ = 3.334 × 10 -5 m3 / s×1073kg / m3=0.036kg / s

[0128] Cooling power:

[0129] Q=m·c·ΔT=0.036kg / s×3350J / kg·K×8K=965W

[0130] The thermal radiation coefficient of the components is primarily set based on the color of the component's outer casing material, as shown in the table below:

[0131]

[0132] The global initial mesh is set to the highest level, 7. Local mesh refinement is then created, primarily refining the solid mesh along the current conduction path at a refinement level of 4. This ensures accurate transfer of Joule heat generated by the current; otherwise, issues such as distorted heat distribution and local temperature calculation deviations due to excessively large mesh sizes may occur. Additionally, to enhance the effects of heat convection and radiation, the mesh refinement level at the solid-fluid interface is set to 2.

[0133] Step S30: Based on the configured three-dimensional simplified model, fast charging condition and continuous rapid acceleration and deceleration condition are respectively used to obtain the analysis results of fast charging condition and continuous rapid acceleration and deceleration condition.

[0134] Establish a fast charging operating condition analysis project with a total analysis time of 902 seconds. Set the input current and output voltage ports according to the actual current load conditions. The current input should reflect its change over time, such as… Figure 4 As shown. Simultaneously, corresponding contact heat power should be applied to the contact surfaces between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts. The maximum volumetric temperature output target should be established separately for each relay conductive copper column, smart fuse connection, and shunt connection to obtain temperature distribution cloud maps of key components during the charging process, as shown. Figure 5 and Figure 6 As shown in the diagram. The maximum temperature of the key components should be compared with the upper limit of the component's allowable operating temperature. If the maximum temperature of a component at any moment during loading is greater than or equal to the upper limit of its allowable operating temperature, then the component is unqualified under fast charging conditions; otherwise, the component is qualified. The upper limits of the allowable operating temperatures for relays, smart fuses, and shunts are 150℃, 130℃, and 125℃, respectively. According to the cloud map results, the relays, smart fuses, and shunts did not experience high-temperature damage under fast charging conditions and are therefore qualified.

[0135] Establish a continuous rapid acceleration and deceleration operation analysis project with a total analysis time of 100 seconds. The current changes over time as follows: Figure 7 Other boundary conditions are the same as those used in establishing a fast-charging operating condition analysis project to obtain temperature distribution cloud maps of key components during the charging process, such as... Figure 8 and Figure 9 As shown. Similarly, if the maximum temperature of a component at any moment during loading is greater than or equal to the upper limit of its allowable operating temperature, then the component is unqualified under continuous rapid acceleration and deceleration conditions; otherwise, the component is qualified.

[0136] Example 3

[0137] Figure 10 This is an exemplary embodiment illustrating a CAE-based thermal analysis device for a high-voltage power distribution box of a battery pack, the device comprising:

[0138] The acquisition module 210 is used to acquire the material parameters and three-dimensional simplified model of each component of the high-voltage distribution box of the battery pack;

[0139] Configuration module 220 is used to obtain the configured simplified three-dimensional model based on the material parameters of each component and the simplified three-dimensional model.

[0140] Analysis module 230 is used to obtain analysis results for fast charging and continuous rapid acceleration / deceleration based on the configured three-dimensional simplified model, respectively.

[0141] Furthermore, the analysis module 230 includes:

[0142] Based on the configured simplified 3D model, set the input current and output voltage ports;

[0143] The corresponding contact heat power was applied to the contact surfaces between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts, respectively, to obtain the temperature distribution cloud map of the first key component during the charging process.

[0144] Based on the temperature distribution cloud map of the first key component during the charging process, the fast charging condition analysis results are obtained;

[0145] Based on the configured simplified 3D model, continuous rapid acceleration and deceleration conditions were loaded to obtain the temperature distribution cloud map of the second key component during the charging process.

[0146] Based on the temperature distribution cloud map of the second key component during the charging process, the analysis results of continuous rapid acceleration and deceleration were obtained.

[0147] By applying this embodiment, the material parameters and simplified 3D models of each component are obtained, laying a solid physical foundation for subsequent analysis. This ensures that the analysis process closely matches the characteristics of the actual components, improving the accuracy and reliability of the analysis. After configuration based on these parameters and models, the constructed analysis framework can more realistically reflect the structure and material properties of the power distribution box, providing an accurate digital carrier for operating condition simulation.

[0148] This embodiment analyzes fast charging and continuous rapid acceleration / deceleration conditions. These two conditions are typical scenarios in which the high-voltage distribution box of a new energy vehicle experiences changes in current excitation during actual use. This allows for a comprehensive and focused capture of the stress and heat generation of the internal components of the distribution box under different driving conditions, avoiding the limitations that may exist in single-condition analysis and making the analysis results more practically instructive.

[0149] Compared to traditional specialized environmental testing, this embodiment leans more towards digital simulation analysis, which can assess the durability of components in the early design stage. This helps to identify potential problems in advance, reduce the time and cost of repeated replacements and tests due to component non-compliance, and thus improve the efficiency of the entire R&D process.

[0150] Example 4

[0151] Figure 11 This is a structural block diagram of a terminal provided in an embodiment of this application. The terminal can be the terminal in the above embodiments. The terminal 300 can be a portable mobile terminal, such as a smartphone or tablet computer. The terminal 300 may also be referred to as user equipment, portable terminal, or other names.

[0152] Typically, terminal 300 includes a processor 301 and a memory 302.

[0153] Processor 301 may include one or more processing cores, such as a quad-core processor or an octa-core processor. Processor 301 may be implemented using at least one hardware form selected from DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array). Processor 301 may also include a main processor and a coprocessor. The main processor, also known as a CPU (Central Processing Unit), is used to process data in the wake-up state; the coprocessor is a low-power processor used to process data in the standby state. In some embodiments, processor 301 may integrate a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content to be displayed on the screen. In some embodiments, processor 301 may also include an AI (Artificial Intelligence) processor, which is used to handle computational operations related to machine learning.

[0154] The memory 302 may include one or more computer-readable storage media, which may be tangible and non-transitory. The memory 302 may also include high-speed random access memory and non-volatile memory, such as one or more disk storage devices or flash memory devices. In some embodiments, the non-transitory computer-readable storage media in the memory 302 is used to store at least one instruction, which is executed by the processor 301 to implement a CAE-based thermal analysis method for a high-voltage distribution box of a battery pack provided in this application.

[0155] In some embodiments, the terminal 300 may also optionally include: a peripheral device interface 303 and at least one peripheral device. Specifically, the peripheral device includes at least one of: a radio frequency circuit 304, a touch display screen 305, a camera 306, an audio circuit 307, a positioning component 308, and a power supply 309.

[0156] The peripheral device interface 303 can be used to connect at least one I / O (Input / Output) related peripheral device to the processor 301 and the memory 302. In some embodiments, the processor 301, memory 302, and peripheral device interface 303 are integrated on the same chip or circuit board; in some other embodiments, any one or two of the processor 301, memory 302, and peripheral device interface 303 can be implemented on separate chips or circuit boards, which is not limited in this embodiment.

[0157] The radio frequency (RF) circuit 304 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The RF circuit 304 communicates with communication networks and other communication devices via electromagnetic signals. The RF circuit 304 converts electrical signals into electromagnetic signals for transmission, or converts received electromagnetic signals back into electrical signals. Optionally, the RF circuit 304 includes: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a user identity module card, etc. The RF circuit 304 can communicate with other terminals through at least one wireless communication protocol. This wireless communication protocol includes, but is not limited to: the World Wide Web, metropolitan area networks, intranets, various generations of mobile communication networks (2G, 3G, 4G, and 5G), wireless local area networks, and / or WiFi (Wireless Fidelity) networks. In some embodiments, the RF circuit 304 may also include circuitry related to NFC (Near Field Communication), which is not limited in this application.

[0158] The touch display screen 305 is used to display a UI (User Interface). This UI may include graphics, text, icons, videos, and any combination thereof. The touch display screen 305 also has the ability to collect touch signals on or above its surface. These touch signals can be input as control signals to the processor 301 for processing. The touch display screen 305 is used to provide virtual buttons and / or a virtual keyboard, also known as soft buttons and / or a soft keyboard. In some embodiments, there may be one touch display screen 305, which is located on the front panel of the terminal 300; in other embodiments, there may be at least two touch display screens, respectively located on different surfaces of the terminal 300 or in a folded design; in still other embodiments, the touch display screen 305 may be a flexible display screen, located on a curved or folded surface of the terminal 300. Furthermore, the touch display screen 305 may be configured as a non-rectangular, irregular shape, i.e., a non-rectangular screen. The touch display screen 305 may be made of materials such as LCD (Liquid Crystal Display) or OLED (Organic Light-Emitting Diode).

[0159] Camera assembly 306 is used to acquire images or videos. Optionally, camera assembly 306 includes a front-facing camera and a rear-facing camera. Typically, the front-facing camera is used for video calls or selfies, and the rear-facing camera is used for taking photos or videos. In some embodiments, there are at least two rear-facing cameras, which are any one of a main camera, a depth-sensing camera, and a wide-angle camera, to achieve background blurring by fusion of the main camera and the depth-sensing camera, and panoramic shooting and VR (Virtual Reality) shooting by fusion of the main camera and the wide-angle camera. In some embodiments, camera assembly 306 may also include a flash. The flash can be a single-color temperature flash or a dual-color temperature flash. A dual-color temperature flash is a combination of a warm light flash and a cool light flash, which can be used for light compensation at different color temperatures.

[0160] Audio circuit 307 provides an audio interface between the user and terminal 300. Audio circuit 307 may include a microphone and a speaker. The microphone is used to collect sound waves from the user and the environment, converting the sound waves into electrical signals that are input to processor 301 for processing, or input to radio frequency circuit 304 for voice communication. For stereo sound acquisition or noise reduction purposes, multiple microphones may be used, each located at a different part of terminal 300. The microphone may also be an array microphone or an omnidirectional microphone. The speaker is used to convert electrical signals from processor 301 or radio frequency circuit 304 into sound waves. The speaker may be a conventional diaphragm speaker or a piezoelectric ceramic speaker. When the speaker is a piezoelectric ceramic speaker, it can convert electrical signals not only into audible sound waves but also into inaudible sound waves for purposes such as distance measurement. In some embodiments, audio circuit 307 may also include a headphone jack.

[0161] The positioning component 308 is used to determine the current geographic location of the terminal 300 in order to enable navigation or LBS (Location Based Service). The positioning component 308 can be a positioning component based on the US GPS (Global Positioning System), China's BeiDou system, or Russia's Galileo system.

[0162] The power supply 309 is used to power the various components in the terminal 300. The power supply 309 can be AC ​​power, DC power, a disposable battery, or a rechargeable battery. When the power supply 309 includes a rechargeable battery, the rechargeable battery can be a wired rechargeable battery or a wireless rechargeable battery. A wired rechargeable battery is a battery that is charged via a wired connection, while a wireless rechargeable battery is a battery that is charged via a wireless coil. The rechargeable battery can also be used to support fast charging technology.

[0163] In some embodiments, the terminal 300 further includes one or more sensors 310. The one or more sensors 310 include, but are not limited to: an accelerometer 311, a gyroscope 312, a pressure sensor 313, a fingerprint sensor 314, an optical sensor 315, and a proximity sensor 316.

[0164] Accelerometer 311 can detect the magnitude of acceleration along the three coordinate axes of a coordinate system established with terminal 300. For example, accelerometer 311 can be used to detect the components of gravitational acceleration along the three coordinate axes. Processor 301 can control touchscreen 305 to display the user interface in landscape or portrait view based on the gravitational acceleration signal acquired by accelerometer 311. Accelerometer 311 can also be used for games or for acquiring user motion data.

[0165] The gyroscope sensor 312 can detect the orientation and rotation angle of the terminal 300. The gyroscope sensor 312, in conjunction with the accelerometer sensor 311, can collect the user's 3D (3D) movements on the terminal 300. Based on the data collected by the gyroscope sensor 312, the processor 301 can perform the following functions: motion sensing (e.g., changing the UI based on the user's tilt), image stabilization during shooting, game control, and inertial navigation.

[0166] The pressure sensor 313 can be disposed on the side bezel of the terminal 300 and / or on the lower layer of the touch display screen 305. When the pressure sensor 313 is disposed on the side bezel of the terminal 300, it can detect the user's grip signal on the terminal 300 and perform left / right hand recognition or quick operation based on the grip signal. When the pressure sensor 313 is disposed on the lower layer of the touch display screen 305, it can control the operable controls on the UI interface based on the user's pressure operation on the touch display screen 305. The operable controls include at least one of button controls, scroll bar controls, icon controls, and menu controls.

[0167] The fingerprint sensor 314 is used to collect a user's fingerprint to identify the user's identity. When the user's identity is identified as trusted, the processor 301 authorizes the user to perform relevant sensitive operations, including unlocking the screen, viewing encrypted information, downloading software, making payments, and changing settings. The fingerprint sensor 314 can be located on the front, back, or side of the terminal 300. When the terminal 300 has physical buttons or a manufacturer's logo, the fingerprint sensor 314 can be integrated with the physical buttons or manufacturer's logo.

[0168] An optical sensor 315 is used to collect ambient light intensity. In one embodiment, the processor 301 can control the display brightness of the touch screen 305 based on the ambient light intensity collected by the optical sensor 315. Specifically, when the ambient light intensity is high, the display brightness of the touch screen 305 is increased; when the ambient light intensity is low, the display brightness of the touch screen 305 is decreased. In another embodiment, the processor 301 can also dynamically adjust the shooting parameters of the camera assembly 306 based on the ambient light intensity collected by the optical sensor 315.

[0169] The proximity sensor 316, also known as a distance sensor, is typically located on the front of the terminal 300. The proximity sensor 316 is used to detect the distance between the user and the front of the terminal 300. In one embodiment, when the proximity sensor 316 detects that the distance between the user and the front of the terminal 300 is gradually decreasing, the processor 301 controls the touchscreen display 305 to switch from a screen-on state to a screen-off state; when the proximity sensor 316 detects that the distance between the user and the front of the terminal 300 is gradually increasing, the processor 301 controls the touchscreen display 305 to switch from a screen-off state to a screen-on state.

[0170] Those skilled in the art will understand that Figure 11 The structure shown does not constitute a limitation on terminal 300, and may include more or fewer components than shown, or combine certain components, or use different component arrangements.

[0171] Example 5

[0172] In an exemplary embodiment, a computer-readable storage medium is also provided, on which a computer program is stored, which, when executed by a processor, implements a CAE-based method for heat dissipation analysis of a high-voltage distribution box for a battery pack as provided in all embodiments of the present application.

[0173] Any combination of one or more computer-readable media may be used. A computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium can be, for example—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in connection with an instruction execution system, apparatus, or device.

[0174] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including—but not limited to—electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, capable of transmitting, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device.

[0175] The program code contained on a computer-readable medium may be transmitted using any suitable medium, including—but not limited to—wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.

[0176] Computer program code for performing the operations of this invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0177] Example 6

[0178] In an exemplary embodiment, an application product is also provided, including one or more instructions that can be executed by the processor 301 of the aforementioned device to complete the aforementioned CAE-based method for analyzing the heat dissipation of a high-voltage power distribution box in a battery pack.

[0179] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. It can be applied to various fields suitable for the present invention. Other modifications can be readily made by those skilled in the art. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and examples shown and described herein.

Claims

1. A CAE-based method for analyzing the heat dissipation of a high-voltage distribution box in a battery pack, characterized in that, include: Obtain the material parameters and simplified 3D model of each component of the high-voltage distribution box of the battery pack; Based on the material parameters of each component and the simplified three-dimensional model, the configured simplified three-dimensional model is obtained; Based on the configured simplified three-dimensional model, fast charging and continuous rapid acceleration / deceleration conditions were used to obtain analysis results for fast charging and continuous rapid acceleration / deceleration conditions, respectively.

2. The CAE-based heat dissipation analysis method for high-voltage distribution boxes of battery packs according to claim 1, characterized in that, Obtain the material parameters of each component, including at least: the temperature variation curves of the density, specific heat capacity, and thermal conductivity of the key component materials; the temperature variation curves of the density, specific heat capacity, thermal conductivity, and dynamic viscosity of the coolant materials; the contact heat power of the coolant flow rate and inlet temperature, and the contact resistance between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts.

3. The CAE-based heat dissipation analysis method for high-voltage distribution boxes of battery packs according to claim 1, characterized in that, Based on the material parameters of each component and the simplified 3D model, the configured simplified 3D model is obtained, including: Based on the aforementioned simplified three-dimensional model, an external natural convection transient heat dissipation model wizard is created to obtain the first simplified three-dimensional model. Based on the material parameters of each component and the first three-dimensional simplified model, material properties are created and assigned to each component to obtain the second three-dimensional simplified model. Based on the second three-dimensional simplified model, a fluid subdomain of the cooling device is created and boundary conditions are set to obtain a third three-dimensional simplified model; Based on the third simplified three-dimensional model, the thermal radiation coefficient is set to obtain the fourth simplified three-dimensional model. Based on the fourth simplified 3D model, local mesh refinement is created to obtain the configured simplified 3D model.

4. The CAE-based heat dissipation analysis method for high-voltage distribution boxes of battery packs according to claim 1, characterized in that, Based on the configured simplified 3D model, fast charging and continuous rapid acceleration / deceleration conditions were applied to obtain analysis results for both conditions, including: Based on the configured simplified three-dimensional model, the input current and output voltage ports are set; The corresponding contact heat power was applied to the contact surfaces between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts, respectively, to obtain the temperature distribution cloud map of the first key component during the charging process. Based on the temperature distribution cloud map of the first key component during the charging process, the analysis results of the fast charging condition are obtained; Based on the configured simplified three-dimensional model, a continuous rapid acceleration and deceleration condition is applied to obtain a temperature distribution cloud map of the second key component during the charging process. Based on the temperature distribution cloud map of the second key component during the charging process, the analysis results of the continuous rapid acceleration and deceleration working condition are obtained.

5. The CAE-based heat dissipation analysis method for high-voltage distribution boxes of battery packs according to claim 4, characterized in that, Based on the temperature distribution cloud map of the first key component during the charging process, the fast charging condition analysis results are obtained, including: Based on the temperature distribution cloud map of the first key component during the charging process, the maximum temperature of the first component is obtained; Based on the maximum temperature of the first component and the upper limit temperature at which the component can operate, a first judgment result is obtained; In response to the first judgment result that the maximum temperature of the component is greater than or equal to the upper limit temperature of the component's allowable operation, the fast charging condition analysis result is unqualified. In response to the first judgment result that the maximum temperature of the component is less than the upper limit temperature at which the component can operate, the fast charging condition analysis result is qualified.

6. The CAE-based heat dissipation analysis method for high-voltage distribution boxes of battery packs according to claim 4, characterized in that, Based on the temperature distribution cloud map of the second key component during the charging process, the analysis results of the continuous rapid acceleration and deceleration condition are obtained, including: Based on the temperature distribution cloud map of the second key component during the charging process, the maximum temperature of the second component during the loading process is obtained. Based on the maximum temperature of the first component and the upper limit temperature at which the component can operate, a second judgment result is obtained. In response to the second judgment result that the maximum temperature of the component is greater than or equal to the upper limit of the allowable operating temperature of the component, the analysis result of the continuous rapid acceleration and deceleration condition is unqualified; In response to the second judgment result that the maximum temperature of the component is less than the upper limit temperature of the component's allowable operation, the analysis result of the continuous rapid acceleration and deceleration condition is qualified.

7. A CAE-based heat dissipation analysis device for high-voltage distribution boxes of battery packs, characterized in that, include: The acquisition module is used to acquire the material parameters and simplified 3D model of each component of the high-voltage distribution box of the battery pack; The configuration module is used to obtain the configured simplified three-dimensional model based on the material parameters of each component and the simplified three-dimensional model. The analysis module is used to obtain analysis results for fast charging and continuous rapid acceleration / deceleration based on the configured simplified three-dimensional model, respectively.

8. The CAE-based heat dissipation analysis device for high-voltage distribution boxes of battery packs according to claim 7, characterized in that, The analysis module includes: Based on the configured simplified three-dimensional model, the input current and output voltage ports are set; The corresponding contact heat power was applied to the contact surfaces between copper busbars, between copper busbars and relays, between copper busbars and smart fuses, and between copper busbars and shunts, respectively, to obtain the temperature distribution cloud map of the first key component during the charging process. Based on the temperature distribution cloud map of the first key component during the charging process, the analysis results of the fast charging condition are obtained; Based on the configured simplified three-dimensional model, a continuous rapid acceleration and deceleration condition is applied to obtain a temperature distribution cloud map of the second key component during the charging process. Based on the temperature distribution cloud map of the second key component during the charging process, the analysis results of the continuous rapid acceleration and deceleration working condition are obtained.

9. A terminal, characterized in that, include: One or more processors; Memory for storing the one or more processor-executable instructions; Wherein, the one or more processors are configured as follows: Perform the CAE-based heat dissipation analysis method for high-voltage distribution boxes of battery packs as described in any one of claims 1 to 6.

10. A non-transitory computer-readable storage medium, characterized in that, When the instructions in the storage medium are executed by the terminal's processor, the terminal is able to execute a CAE-based method for analyzing the heat dissipation of a high-voltage power distribution box for a battery pack, as described in any one of claims 1 to 6.

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