RFID anti-metal electronic tag and preparation method thereof

Abstract

The application provides an RFID anti-metal electronic tag and a preparation method thereof, which comprises a plastic base plate, a plastic cover plate, an RFID electronic tag and a thermal transfer paper, wherein: a first end surface of the plastic base plate is sequentially and spacedly provided with a first groove and a second groove from inside to outside, the RFID electronic tag is embedded in the first groove, the second groove is filled with glue, and the plastic cover plate is covered with the first end surface of the plastic base plate through the glue; and the second end surface of the plastic base plate is provided with the thermal transfer paper. The application can keep the surface of the thermal transfer paper flat when the RFID electronic tag is naturally bent, can avoid the problem of the pressing crease caused by the sudden change and the gap due to the insufficient glue, and can realize the anti-displacement of the electronic tag and the thermal expansion and cold shrinkage buffer, thereby improving the surface flatness and stability of the RFID anti-metal electronic tag.

Description

Technical Field

[0001] This application relates to the field of radio frequency tags or data identification and recording carrier technology, and in particular to an RFID anti-metal electronic tag and its preparation method. Background Technology

[0002] RFID (Radio Frequency Identification) electronic signage is a new type of intelligent identification solution that combines RFID technology with traditional signage. It is widely used in retail, logistics, asset management, smart cities, and other fields. Common electronic signage uses rigid, inflexible materials, such as RFID parking space signs and street light signs; or flexible materials such as coated paper, such as packaging box labels and express delivery bag labels. In recent years, with the widespread application of RFID in the power industry, new requirements have been placed on RFID electronic signage. For example, utility pole signs not only need to be metal-resistant but also have a certain degree of flexibility to fit the pole, and the surface needs to be printable. Composites of thin aluminum base plates with flexible, metal-resistant tags (electronic tags with foam substrates) and fully foam-embedded tags with grooves in the middle have also emerged.

[0003] While existing thin aluminum base plate composite flexible anti-metal labels can bend naturally and fit with utility poles, they have a certain thickness, resulting in a bulge on the surface printing paper, which affects aesthetics. Furthermore, the printing paper needs to be pre-printed and cannot be printed directly. On the other hand, while existing all-foam hollowed-out flexible anti-metal labels can have their surface printing paper flattened and look good, and can be printed directly, the tension between the front printing paper and the back sealing adhesive paper prevents the labels from bending naturally, resulting in noticeable creases when tied to cylindrical objects such as utility poles.

[0004] In summary, existing RFID electronic tags cannot maintain a flat, crease-free surface on the thermally printed paper when naturally bent. Furthermore, issues include the tag's simple groove structure leading to easy displacement, lack of thermal expansion and contraction buffer, insufficient adhesion due to excessive or insufficient glue application, and downward creases caused by sudden height differences. Summary of the Invention

[0005] This application provides an RFID anti-metal electronic tag and its manufacturing method. By using a thin plastic material as a substrate and hollowing out the middle to embed the tag, the RFID electronic tag can bend naturally and the surface is completely flat, making it suitable for printer printing. Furthermore, by setting the sidewalls of the first groove for placing the tag and the second groove for filling the glue as inclined sidewalls, it achieves anti-displacement and thermal expansion and contraction buffering for the electronic tag, solves the problem of uneven glue filling, and avoids the problem of downward pressure creases caused by sudden drop when there is too little glue.

[0006] In a first aspect, this application provides an RFID anti-metal electronic tag, comprising a plastic substrate, a plastic cover, an RFID electronic tag, and thermal transfer paper, wherein:

[0007] The first end face of the plastic substrate is provided with a first groove and a second groove spaced apart from the inside to the outside. The RFID electronic tag is embedded in the first groove, and the second groove is filled with glue. The plastic cover plate covers the first end face of the plastic substrate through the glue.

[0008] The heat transfer paper is disposed on the second end face of the plastic substrate.

[0009] In some embodiments, the second groove is an annular groove that surrounds the outer peripheral wall of the first groove in a circumferential manner. The second groove includes an annular inner sidewall close to the first groove and an annular outer sidewall away from the first groove. The height of the annular inner sidewall is lower than the height of the annular outer sidewall. A boss forms a gap between the annular inner sidewall of the second groove and the outer peripheral wall of the first groove. The boss and the plastic substrate are integrally formed. The outer peripheral wall of the first groove is the first sidewall of the boss, and the annular inner sidewall of the second groove is the second sidewall of the boss. The top plane of the boss is lower than the first end face of the plastic substrate.

[0010] In some embodiments, the second sidewall of the boss is inclined toward the first groove, such that the width of the opening end of the second groove is greater than the width of the bottom end of the second groove; the outer peripheral sidewall of the plastic cover plate fits against the annular outer sidewall of the second groove for positioning; after the plastic cover plate is closed, the first cover surface fits against the top plane of the boss for positioning, and a wedge-shaped gap is formed between the cover plate and the second sidewall of the boss; the wedge-shaped gap gradually narrows from the top plane of the boss toward the bottom end of the second groove; the wedge-shaped gap and the second groove together constitute the filling area of ​​the adhesive.

[0011] In some embodiments, the first sidewall of the boss is inclined toward the central axis of the first groove, such that the inner diameter of the opening end of the first groove is smaller than the inner diameter of the bottom end of the first groove, forming a conical groove with a constricted outer peripheral wall, and the outer peripheral wall of the RFID electronic tag and the outer peripheral wall of the first groove form a conical surface fit.

[0012] In some embodiments, the substrates of the plastic substrate and the plastic cover plate include at least one of the following: PVC material, PC material, ABS material; the adhesive includes a curing adhesive, the initial state of the curing adhesive is liquid, and the adhesive includes at least one of the following: epoxy resin adhesive, UV adhesive, anaerobic adhesive; the heat transfer paper includes PVC paper with single-sided adhesive backing.

[0013] In some embodiments, the RFID electronic tag includes an RFID anti-metal chip, which is encapsulated between two flexible substrates.

[0014] In some embodiments, the plastic substrate is provided with a plurality of fixing holes for mounting and fixing the RFID anti-metal electronic tag.

[0015] Secondly, embodiments of this application provide a method for preparing an RFID anti-metal electronic tag, applicable to the RFID anti-metal electronic tag as described in the first aspect of embodiments of this application, the method comprising:

[0016] An RFID anti-metal chip is encapsulated between two layers of flexible substrate to obtain an RFID electronic tag.

[0017] Prepare a plastic substrate having the first groove and the second groove;

[0018] The RFID electronic tag is embedded and fixed in the first groove; and glue is injected into the second groove;

[0019] The plastic cover plate is placed on the first end face of the plastic substrate, and the plastic substrate after being covered is baked at a low temperature to cure the adhesive.

[0020] A heat transfer paper is applied to the second end face of the plastic substrate after it has been baked at the low temperature.

[0021] In some embodiments, the preparation of the plastic substrate having the first groove and the second groove includes: forming the first groove at the center position on the first end face of the plastic substrate; forming the second groove at intervals around the outer peripheral wall of the first groove; for the boss formed between the outer peripheral wall of the first groove and the annular inner side wall of the second groove, setting the first side wall of the boss to be inclined toward the central axis of the first groove, and setting the second side wall of the boss to be inclined toward the first groove; and setting the top plane of the boss such that the top plane of the boss is smaller than the first end face of the plastic substrate.

[0022] In some embodiments, the step of covering the plastic cover plate with the first end face of the plastic substrate includes: moving the first cover surface of the plastic cover plate toward the first end face of the plastic substrate and moving the plastic cover plate toward the first end face of the plastic substrate; when the outer peripheral sidewall of the plastic cover plate is in contact with the annular outer sidewall of the second groove, continuously pressing down the plastic cover plate until the first cover surface of the plastic cover plate is in contact with and limited by the top plane of the boss, and simultaneously bonded with the glue injected into the second groove, thereby completing the covering of the plastic cover plate with the plastic substrate.

[0023] As can be seen from the embodiments of this application, the first end face of the plastic substrate is provided with a first groove and a second groove spaced apart from the inside to the outside. The RFID electronic tag is embedded in the first groove, and the second groove is filled with glue. The plastic cover plate is covered with the first end face of the plastic substrate by the glue. The second end face of the plastic substrate is provided with thermal transfer paper. Thus, compared with the existing thin aluminum base plate composite flexible anti-metal tags and the flexible anti-metal tags embedded in the middle of the foam, this application uses a thin plastic material as the substrate and a middle groove to embed the tag, which allows the RFID electronic tag to bend naturally and the surface to be completely flat, suitable for printer printing. In addition, by setting the sidewalls of the first groove for placing the tag and the second groove for filling the glue as inclined sidewalls, it achieves anti-displacement and thermal expansion and contraction buffering for the electronic tag, and solves the problem of uneven glue filling. It can also avoid the problem of downward pressure creases caused by sudden drop when there is too little glue. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall structure of an RFID anti-metal electronic tag provided in an embodiment of this application;

[0026] Figure 2 This is one of the embodiments provided in this application. Figure 1 A magnified structural diagram of part A in the diagram;

[0027] Figure 3 This is a cross-sectional structural schematic diagram of an RFID anti-metal electronic tag provided in an embodiment of this application;

[0028] Figure 4 This is one of the embodiments provided in this application. Figure 3 A magnified structural diagram of part B in the diagram;

[0029] Figure 5 This is a schematic diagram of the second end face of a plastic substrate for an RFID anti-metal electronic tag provided in an embodiment of this application;

[0030] Figure 6 This is a schematic diagram of the structure of an RFID electronic tag provided in an embodiment of this application;

[0031] Figure 7 This application provides a schematic diagram of the shape of an electronic signboard when it is bent in the prior art;

[0032] Figure 8 This application provides a schematic diagram of the shape of an RFID anti-metal electronic tag when it is bent.

[0033] Figure 9 This application provides an overall flowchart of a method for preparing an RFID anti-metal electronic tag;

[0034] Figure 10 This application provides a flowchart of the fabrication process for a plastic substrate for an RFID anti-metal electronic tag.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1-RFID anti-metal electronic tag, 10-plastic substrate, 20-plastic cover plate, 30-RFID electronic tag, 40-thermal transfer paper, 110-first end face, 111-first groove, 112-second groove, 1121-annular outer side wall, 113-protrusion, 1131-first side wall of protrusion, 1132-second side wall of protrusion, 1133-top plane of protrusion, 114-fixing hole, 120-second end face, 210-first cover surface, 211-wedge gap, 310-RFID anti-metal chip, 320-flexible substrate. Detailed Implementation

[0037] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0038] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0039] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0040] In the embodiments of this application, "and / or" describes the relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone; A and B exist simultaneously; B exists alone. Among them, A and B can be singular or plural.

[0041] In this embodiment, the symbol " / " can indicate that the preceding and following objects are in an "or" relationship. Alternatively, the symbol " / " can also represent a division sign, i.e., performing a division operation. For example, A / B can mean A divided by B.

[0042] In the embodiments of this application, "at least one item" or its similar expression refers to any combination of these items, including any combination of a single item or a plurality of items. "One or more" means one or more, while "multiple" means two or more. For example, "at least one item" of a, b, or c can represent the following seven cases: a, b, c; a and b; a and c; b and c; a, b, and c. Each of a, b, and c can be an element or a set containing one or more elements.

[0043] In the embodiments of this application, "equal to" can be used with "greater than" and is applicable to technical solutions used when "greater than" is used; it can also be used with "less than" and is applicable to technical solutions used when "less than" is used. When "equal to" is used with "greater than", it is not used with "less than"; when "equal to" is used with "less than", it is not used with "greater than".

[0044] While existing thin aluminum base plate composite flexible anti-metal labels can bend naturally and fit with utility poles, they have a certain thickness, resulting in a bulge on the surface printing paper, which affects aesthetics. Furthermore, the printing paper needs to be pre-printed and cannot be printed directly. On the other hand, while existing all-foam hollowed-out flexible anti-metal labels can have their surface printing paper flattened and look good, and can be printed directly, the tension between the front printing paper and the back sealing adhesive paper prevents the labels from bending naturally, resulting in noticeable creases when tied to cylindrical objects such as utility poles.

[0045] In summary, existing RFID electronic tags cannot maintain a flat, crease-free surface on the thermally printed paper when naturally bent. Furthermore, issues include the tag's simple groove structure leading to easy displacement, lack of thermal expansion and contraction buffer, insufficient adhesion due to excessive or insufficient glue application, and downward creases caused by sudden height differences.

[0046] To address the aforementioned issues, this application provides an RFID anti-metal electronic tag and its preparation method. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0047] Please see Figure 1 , Figure 1 This is a schematic diagram of the overall structure of an RFID anti-metal electronic tag provided in an embodiment of this application, as shown below. Figure 1 As shown, the RFID anti-metal electronic tag 1 includes a plastic substrate 10, a plastic cover plate 20, an RFID electronic tag 30, and a thermal transfer paper 40. The first end face 110 of the plastic substrate 10 is provided with a first groove 111 and a second groove 112 spaced apart from the inside to the outside. The RFID electronic tag 30 is embedded in the first groove 111, and the second groove 112 is filled with glue. The plastic cover plate 20 is covered with the first end face 110 of the plastic substrate 10 by the glue. The second end face 120 of the plastic substrate 10 is provided with the thermal transfer paper 40.

[0048] In this case, because the RFID electronic tag 30 is embedded in the first groove 111, it obscures the first groove 111, therefore... Figure 1 The structural diagram does not directly show the first groove 111. Furthermore, the first end face 110 and the second end face 120 of the plastic substrate 10 are opposite end faces, therefore... Figure 1 The structural diagram shown only shows the structure on the first end face 110 of the plastic substrate 10, and does not directly show the second end face 120 of the plastic substrate 10, nor the heat transfer paper 40 disposed on the second end face 120 of the plastic substrate 10.

[0049] For details, please refer to Figure 2 , Figure 2 This is one of the embodiments provided in this application. Figure 1 An enlarged structural diagram of part A in the diagram is shown below. Figure 2 As shown, the overall structure of the first end face 110 of the plastic substrate 10 is presented, as well as the structural relationship between the first groove 111, the second groove 112, and the boss 113 disposed on the first end face 110 of the plastic substrate 10.

[0050] In some embodiments, the second groove 112 is an annular groove that surrounds the outer peripheral wall of the first groove 111 in a circumferential manner. The second groove 112 includes an annular inner sidewall (the first sidewall 1131 of the boss) close to the first groove 111 and an annular outer sidewall 1121 away from the first groove 111. The height of the annular inner sidewall is lower than the height of the annular outer sidewall 1121. The annular inner sidewall of the second groove 112 and the outer peripheral wall of the first groove 111 are separated by a boss 113. The boss 113 and the plastic substrate 10 are integrally formed. The outer peripheral wall of the first groove 111 is the first sidewall 1131 of the boss, and the annular inner sidewall of the second groove 112 is the second sidewall 1132 of the boss. The top plane 1133 of the boss is lower than the first end face 110 of the plastic substrate 10.

[0051] Among them, see Figure 2 The second groove 112 is a square annular groove, adapted to the square outer contour of the plastic substrate 10. In specific applications, the shapes of the second groove 112 and the plastic substrate 10 can be reasonably deformed, such as the second groove 112 being a circular annular groove, a polygonal groove, a curved annular groove, etc., and the plastic substrate 10 having a cylindrical outer contour, a polygonal outer contour, etc. Correspondingly, if the annular groove of the second groove 112 has multiple annular structures, the shape of the second sidewall 1132 of the boss also needs to be adapted and adjusted. For example, when the second groove 112 is a square annular groove, the second sidewall 1132 of the boss is a flat rectangle; when the second groove 112 is a circular annular groove, the second sidewall 1132 of the boss is a continuous curved surface. This application does not limit the shape of the second groove 112 and the plastic substrate 10.

[0052] As can be seen, in this embodiment, the second groove 112 surrounds the first groove 111 in a full circumference. Combined with the stepped groove body in which the "annular outer sidewall 1121 is higher than the second sidewall 1132 of the boss", it can provide radial restraint for the plastic cover plate 20 through the outer sidewall, and can also separate the label embedding area and the glue filling area by relying on the boss 113, so as to avoid glue contamination of the label. Moreover, the boss 113 is integrally formed with the substrate to ensure the stability of the sidewall. It simultaneously achieves stable label restraint, efficient glue sealing and universality of application, solving the problems of loose structure, poor sealing and limited application of traditional signs.

[0053] Further, please refer to Figure 3 , Figure 4 , Figure 3This is a cross-sectional structural diagram of an RFID anti-metal electronic tag provided in an embodiment of this application. Figure 4 This is one of the embodiments provided in this application. Figure 3 A magnified structural diagram of part B in the diagram. (See diagram below.) Figure 3 , Figure 4 As shown, a portion of the plastic substrate 10 is divided into two parts by cutting it vertically downward from the first end face 110 of the plastic substrate 10, and an enlarged view of the first groove 111, the second groove 112 and the boss 113 on the cross-sectional view is shown.

[0054] The first groove 111 is located on the inner side of the plastic substrate 10, and the second groove 112 is located outside the first groove 111, that is, on the inner side away from the plastic substrate 10. The annular inner wall of the second groove 112 and the outer peripheral wall of the first groove 111 are separated by a boss 113. The top plane 1133 of the boss is lower than the first end face 110 of the plastic substrate 10.

[0055] Specifically, the first cover surface 210 of the plastic cover plate 20 is fitted onto the plastic substrate 10, and the first cover surface 210 of the plastic cover plate 20 is in contact with the top plane 1133 of the boss to achieve positioning; and the outer peripheral sidewall of the plastic cover plate 20 is fitted with the annular outer sidewall 1121 of the second groove 112 for positioning. The first cover surface 210 of the plastic cover plate 20 covers and seals the top opening of the first groove 111, which is used to seal the RFID electronic tag 30 in the first groove 111.

[0056] In some embodiments, the second sidewall 1132 of the boss is inclined toward the direction of the first groove 111, such that the width of the opening end of the second groove 112 is greater than the width of the bottom end of the second groove 112; the outer peripheral sidewall of the plastic cover plate 20 is fitted with the annular outer sidewall 1121 of the second groove 112 for limiting; after the plastic cover plate 20 is closed, the first cover surface 210 is fitted with the top plane of the boss 113 for limiting, and a wedge-shaped gap 211 is formed between it and the second sidewall 1132 of the boss. The wedge-shaped gap 211 gradually narrows from the top plane 1133 of the boss toward the bottom end of the second groove 112. The wedge-shaped gap 211 and the second groove 112 together constitute the glue filling area.

[0057] Among them, the wedge-shaped gap 211 is as follows Figure 4 The area shown by the "dashed line" is shown in the image.

[0058] The inclination of the second sidewall 1132 of the boss towards the first groove 111 means that the entire second sidewall 1132 (the entire circumferential range) of the boss is inclined in the same direction, for example, gradually converging towards the central axis of the first groove 111 to form a continuous and uniform inclined surface, rather than localized or asymmetrical inclination. This full-circumferential inclination design ensures that after the plastic cover plate 20 is closed, a circumferential wedge-shaped gap 211 is formed between it and the second sidewall 1132 of the boss, ensuring a consistent gap shape throughout the circumference and providing uniform flow and filling space for the adhesive.

[0059] The tilt angle of the second sidewall 1132 of the boss toward the first groove 111 is related to various factors, including but not limited to the need to consider the flowability of the adhesive, the width gradient of the wedge gap 211, the deformation adaptability of the plastic cover plate 20, and the processing and assembly precision. For example, when the viscosity of epoxy resin is high, the tilt angle can be designed to be 5°-8° to accelerate the flow; when the viscosity of UV adhesive is low, the tilt angle can be reduced to 3°-5° to avoid excessive loss; rigid PC cover plates have small deformation, so the tilt angle can be slightly larger; ABS cover plates are slightly elastic, so the tilt angle can be appropriately reduced to ensure that when there is less adhesive, the cover plate can fit the adhesive area through slight deformation.

[0060] As can be seen, in this embodiment, the second groove 112 is inclined with the second side wall 1132 of the boss (i.e. the annular inner side wall of the second groove 112) to form a "wide opening and narrow bottom" shape, so that after the plastic cover plate 20 is closed, a wedge-shaped gap 211 is formed between the first cover surface 210 of the cover plate and the second side wall 1132 of the inclined boss. This design ensures that the space occupied by the plastic cover plate 20 and the second side wall 1132 of the boss is not an abrupt 90° transition, but rather a combination of wedge-shaped gaps 211 formed by the inclined surface. This achieves the following technical effects: when the cured adhesive is poured, if there is slightly more adhesive, the wedge-shaped gap 211, which is wider at the top and narrower at the bottom, can accommodate the excess adhesive and prevent overflow; if there is slightly less adhesive, the plastic cover plate 20 can be pressed downwards by its own gentle deformation (relying on the fit and limitation with the top plane 1133 of the boss), so that the adhesive is evenly covered along the inclined side wall. This avoids obvious creases and large gap areas caused by the abrupt drop due to the 90° vertical transition, which does not affect the aesthetics and can ensure the stability and accuracy of the subsequent printing process. This allows for precise adaptation to the error conditions of adhesive usage and ensures that the thermal printing paper on the surface of the electronic sign remains flat when it is naturally bent.

[0061] In some embodiments, the first sidewall 1131 of the boss is inclined toward the central axis of the first groove 111, such that the inner diameter of the opening end of the first groove 111 is smaller than the inner diameter of the bottom end of the first groove 111, forming a conical groove with a contracted outer peripheral wall, and the outer peripheral wall of the RFID electronic tag 30 and the outer peripheral wall of the first groove 111 form a conical surface fit.

[0062] The inclination of the first sidewall 1131 of the boss towards the central axis of the first groove 111 means that the entire first sidewall 1131 of the boss (i.e., the outer peripheral wall of the first groove 111) is in a continuous and uniform inclination in the same direction. In other words, the outline of the first sidewall 1131 of the boss gradually converges towards the central axis of the groove, forming a complete conical surface without breaks or local protrusions / recesses, rather than only partially or asymmetrically inclination. This full-circumference inclination design is the core of ensuring that the RFID electronic tag 30 can form a "full-circumference fit" conical surface with the first groove 111. If there are local non-inclination areas, gaps will appear between the outer peripheral wall of the tag and the groove wall, resulting in a loss of radial constraint and preventing stable embedding.

[0063] The tilt angle of the first sidewall 1131 of the boss towards the central axis of the first groove 111 is related to many factors, including but not limited to the outer periphery and flexibility of the RFID electronic tag 30, the buffering requirements for thermal expansion and contraction of the tag, the injection molding process and dimensional accuracy, the depth of the first groove 111 and the thickness of the tag. For example, the tilt angle is usually designed to be 3°-8°. If the angle is too small (<3°), the conical surface constraint will be weak, and the tag will be easily displaced by external forces. If the angle is too large (>8°), the inner diameter of the groove opening will be too narrow, and the tag will need to deform excessively to fit in, which may damage the internal RFID anti-metal chip 310. For another example, when the expansion amount of the RFID electronic tag 30 is 0.2mm, the difference in inner diameter between the bottom end of the groove and the opening end needs to be ≥0.2mm to avoid the tag squeezing the first sidewall 1131 of the boss after expansion, which would damage the chip.

[0064] As can be seen, in this embodiment, the first groove 111 is inclined with the first side wall 1131 of the boss (i.e., the outer peripheral wall of the first groove 111) to form a conical groove with a narrow opening and a wide bottom, so that the RFID electronic tag 30 can cooperate with the conical surface, thereby achieving the following technical effects: the RFID electronic tag 30 can be self-locked and fixed by the conical surface cooperation, preventing displacement and falling off caused by external force, and can also rely on the ample space at the bottom of the groove to provide a buffer for the thermal expansion and contraction of the tag, avoiding damage from temperature stress; at the same time, the inclined surface can guide the tag to be assembled smoothly, protecting the internal chip from mechanical damage, and solving the problems of poor fixation, weak environmental adaptability, and easy assembly damage of traditional flat grooves.

[0065] The above Figures 1-4 The structure on the first end face 110 of the plastic substrate 10 is described in detail below. Figure 5 , Figure 5 This is a schematic diagram of the second end face of a plastic substrate for an RFID anti-metal electronic tag provided in an embodiment of this application, as shown below. Figure 5As shown, the second end face 120 of the plastic substrate 10 is a flat and smooth plane, and the blank heat transfer paper 40 is directly pasted on the second end face 120 of the plastic substrate 10.

[0066] The heat transfer paper 40 can transfer preset patterns, text, numbers, and other information to the paper surface through a heat transfer process, clearly presenting the "physical identification information" corresponding to the sign, such as equipment number, asset name, affiliated unit, warning slogan, etc. The information content on the heat transfer paper can be quickly adjusted for different application scenarios. The heat transfer paper 40 is pasted on the second end face 120, which can directly isolate stains (such as oil stains, dust), minor scratches or moisture in the external environment, and prevent the surface of the plastic substrate 10 from wear, discoloration or slight corrosion due to long-term exposure.

[0067] It is understandable that in the RFID anti-metal electronic tag 1 provided in this application, the thermal transfer paper 40 can remain flat when the electronic tag is naturally bent. The main reason is that a thin plastic material is used as a substrate support, and the thermal transfer paper 40 is a flexible material that is pulled by the thin plastic. In addition, in this application, blank thermal transfer paper is first pasted on the second end face 120 of the plastic substrate 10, and then printed when actually used. Compared with the prior art scheme of printing the thermal transfer paper 40 first and then pasting it, it can be printed when actually used, shortening the time cycle and reducing errors.

[0068] Furthermore, by setting the sidewalls of the first groove 111 for placing the label and the second groove 112 for filling the adhesive as inclined sidewalls, this application can also help to achieve "the heat transfer paper 40 remaining flat when the electronic signboard is naturally bent". The first sidewall 1131 and the second sidewall 1132 of the boss are both inclined sidewalls. Combined with the integral molding process of the boss 113, it can enhance the overall rigidity of the plastic substrate 10, disperse the stress during natural bending, and prevent the substrate from warping or local bulging due to stress concentration. In addition, the uniform adhesive filling of the second groove 112 and the wedge-shaped gap 211 makes the plastic cover plate 20 firmly attached to the plastic substrate 10, further restraining the bending deformation of the substrate. In addition, the second end face 120 itself is a smooth flat design, and the heat transfer paper 40 can be tightly attached. Even if the substrate is naturally bent, the heat transfer paper 40 will not wrinkle, bubble or peel due to substrate deformation, thus maintaining a flat state.

[0069] In some embodiments, the plastic substrate 10 is provided with a plurality of fixing holes 114 for mounting and fixing the RFID anti-metal electronic tag 1.

[0070] See Figure 5 The fixing holes 114 can be set at the four corners of the plastic substrate 10, including but not limited to square holes, round holes, etc., to facilitate the installation of cable ties to bind the plastic substrate 10 to objects such as utility poles.

[0071] In some embodiments, the substrates of the plastic substrate 10 and the plastic cover plate 20 include at least one of the following: PVC material, PC material, ABS material; the adhesive includes curing adhesive, the initial state of the curing adhesive is liquid, and the adhesive includes at least one of the following: epoxy resin adhesive, UV adhesive, anaerobic adhesive; the heat transfer paper includes PVC paper with single-sided adhesive backing.

[0072] As can be seen, in this embodiment, the initial liquid state of the curing adhesive is adapted to the wedge-shaped gap 211 of the second groove 112, and can flow and fill along the inclined sidewall. After curing, it forms a rigid adhesive layer, which, when bonded to the rigid substrate, strengthens the overall structural strength of the plastic cover plate 20 and the plastic substrate 10. The curing adhesive has a low initial viscosity (typically between 100-10000 mPa·s), good fluidity, and is easy to deliver through pipelines and apply with a needle. Taking epoxy resin as an example, its A / B components remain liquid during the operating time after mixing, allowing it to fully penetrate into the gaps of the encapsulated device. For example, an automatic dispensing machine, through 3D trajectory planning and multi-axis linkage control, can achieve precise coverage of the second groove 112 without dead angles, uniformity, or overflow.

[0073] Please see Figure 6 , Figure 6 This is a schematic diagram of the structure of an RFID electronic tag provided in an embodiment of this application, as shown below. Figure 6 As shown, the RFID electronic tag 30 includes an RFID anti-metal chip 310, which is encapsulated between two flexible substrates 320.

[0074] As can be seen, in this embodiment, the RFID anti-metal chip 310 is encapsulated between two flexible substrates 320. It adapts to the conical surface of the first groove 111 through its flexible characteristics, allowing it to deform slightly during assembly to fit the inclined sidewall. It also buffers the stress generated by thermal expansion and contraction, preventing the chip from being directly damaged by force. At the same time, the flexible encapsulation layer can isolate the chip from direct contact with the metal environment. Together with the anti-metal design of the substrate, it ensures the stable transmission of RFID signals.

[0075] The following is combined with Figures 7-8 Compared with the surface morphology of existing electronic signs when bent, this application demonstrates that the RFID anti-metal electronic sign provided by this application can achieve a flat surface without creases when the thermal printing paper is naturally bent, compared with the prior art.

[0076] Please see Figure 7 , Figure 8 , Figure 7 This is a schematic diagram illustrating the shape of an electronic signboard when bent, as provided in an embodiment of this application. Figure 8 This is a schematic diagram of the shape of an RFID anti-metal electronic tag when bent, as provided in an embodiment of this application. Figure 7 , Figure 8 As shown, Figure 7 This demonstrates the shape of an electronic signboard made of existing flexible foam substrate when bent. Figure 8 The RFID anti-metal electronic tag of this application is shown in the shape when bent.

[0077] Among these, foam refers to flexible materials such as EVA, PE foam, and sponge. This is the primary method used in the current market for flexible anti-metal RFID tags. It is evident that when adhesive paper (thermal printing paper) is pasted on both sides of the flexible material, obvious wrinkles and creases appear. This is because the existing sign structure is prone to uneven deformation of the substrate when bent, causing the surface marking layer to be stretched and compressed, making it impossible to maintain flatness. This not only affects visual information readability but may also lead to long-term damage and detachment of the marking layer due to stress concentration at the creases, reducing lifespan and information reliability. Current technology struggles to meet the requirements for tags that can bend naturally while maintaining a flat surface printing paper.

[0078] Furthermore, see Figure 8 The anti-metal electronic signage provided in this application maintains a smooth and flat surface with no obvious creases when bent. This is primarily because the electronic signage uses a thin plastic material as a substrate for support, and the thermal transfer paper is a flexible material. The thin plastic material pulls the paper to maintain its flatness and prevent creases. Simultaneously, the first and second sidewalls of the protrusions are designed as inclined sidewalls, allowing the substrate to evenly distribute stress and maintain a relatively flat state when the signage bends naturally. This enables the thermal transfer paper to adhere tightly, consistently maintaining good flatness. This ensures clear readability of information and improves the durability and reliability of the signage in bending scenarios.

[0079] Please see Figure 9 , Figure 9 This is an overall flowchart of a method for preparing an RFID anti-metal electronic tag according to an embodiment of this application, as shown below. Figure 9 As shown, the method includes: S901, encapsulating an RFID anti-metal chip between two flexible substrates to obtain an RFID electronic tag; S902, preparing a plastic substrate with a first groove and a second groove; S903, embedding and fixing the RFID electronic tag in the first groove; and injecting adhesive into the second groove; S904, covering the first end face of the plastic substrate with a plastic cover plate, and baking the covered plastic substrate at a low temperature to cure the adhesive; S905, setting a heat transfer paper on the second end face of the plastic substrate after low-temperature baking.

[0080] This application does not limit the encapsulation method of encapsulating an RFID anti-metal chip between two flexible substrates; nor does it limit the preparation method of the plastic substrate with grooves, such as compression molding, machine grooving, etc.; nor does it limit the specific method of injecting adhesive into the second groove of the plastic substrate, such as manual injection, automatic machine injection, etc.

[0081] Specifically, please refer to Figure 10 , Figure 10 This is a flowchart illustrating the fabrication process of a plastic substrate for an RFID anti-metal electronic tag, as provided in an embodiment of this application. Figure 10 As shown, the preparation of the plastic substrate having a first groove and a second groove includes: S1001, forming a first groove at the center position of a first end face of the plastic substrate; forming a second groove at intervals around the outer peripheral wall of the first groove; S1002, for the boss formed between the outer peripheral wall of the first groove and the annular inner side wall of the second groove, setting the first side wall of the boss to be inclined toward the central axis of the first groove, and setting the second side wall of the boss to be inclined toward the first groove; S1003, setting the top plane of the boss such that the top plane of the boss is smaller than the first end face of the plastic substrate.

[0082] In some embodiments, the step of covering the plastic cover plate with the first end face of the plastic substrate includes: moving the first cover face of the plastic cover plate toward the first end face of the plastic substrate and moving the plastic cover plate toward the first end face of the plastic substrate; when the outer peripheral sidewall of the plastic cover plate is in contact with the annular outer sidewall of the second groove, continuously pressing down the plastic cover plate until the first cover face of the plastic cover plate is in contact with the top plane of the boss and simultaneously bonded with the glue injected in the second groove, thereby completing the covering of the plastic cover plate with the plastic substrate.

[0083] It is understood that the annular outer wall of the second groove is used to limit the plastic cover plate in the direction of the first end face of the plastic substrate, and the top plane of the boss is used to limit the plastic cover plate in the direction perpendicular to the first end face. However, the thickness of the plastic cover plate is not limited. The thickness of the plastic cover plate can be exactly equal to the height difference between the top plane of the boss and the first end face, or have a small deviation from the height difference. In addition, this application does not limit the RFID electronic tag to be exactly equal to the depth of the first groove, and can be slightly less than the depth of the first groove to be fully embedded in the first groove. In specific applications, it can be adjusted according to actual needs.

[0084] For example, the plastic substrate is 2mm thick, the plastic cover is 0.5mm thick, the depth of the first groove (the height of the boss) is 1.5mm, and the thickness of the RFID tag is 1.5mm. Then, the height of the outer annular wall of the second groove is 2mm, and the height of the inner annular wall of the second groove is 1.5mm. Thus, the RFID tag is just embedded in the first groove and is flush with the opening of the first groove. The plastic cover is moved downward to the second groove so that the plastic cover fits against the outer annular wall of the second groove. When the first cover surface of the plastic cover fits against the top plane of the boss, it is continuously pressed down to perform a smooth deformation of the cover and the boss. The preset distance of continuous pressing can be 0.1mm, so that the adhesive flows fully in the gap area between the plastic cover and the inner annular wall of the second groove and fully contacts the plastic cover and the inner annular wall of the second groove to complete the bonding and sealing.

[0085] As can be seen, in this embodiment, by using a thin plastic material as a substrate and hollowing out the middle to embed the label, the RFID electronic tag can bend naturally and the surface is completely flat, making it suitable for printer printing. Furthermore, by setting the sidewalls of the first groove for placing the label and the second groove for filling the glue as inclined sidewalls, the system can prevent the electronic tag from shifting and buffer against thermal expansion and contraction, solve the problem of uneven glue filling, and avoid the problem of downward pressure creases caused by sudden drop when there is too little glue.

[0086] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. An RFID anti-metal electronic tag, characterized in that, This includes plastic substrates, plastic covers, RFID electronic tags, and thermal transfer paper, among which: The first end face of the plastic substrate is provided with a first groove and a second groove in sequence from the inside to the outside. The second groove is an annular groove. The second groove includes an annular inner wall close to the first groove and an annular outer wall away from the first groove. The annular inner wall of the second groove and the outer peripheral wall of the first groove are separated by a boss. The outer peripheral wall of the first groove is the first side wall of the boss, and the annular inner wall of the second groove is the second side wall of the boss. The RFID electronic tag is embedded in the first groove, and the second groove is filled with glue. The plastic cover plate covers the first end face of the plastic substrate through the glue. After the plastic cover plate is closed, the first cover surface fits against the top plane of the boss for positioning and forms a wedge-shaped gap with the second side wall of the boss. The plastic cover plate and the second side wall of the boss form a non-perpendicular transition space occupancy state. The wedge-shaped gap and the second groove together constitute the glue filling area. The outer peripheral wall of the RFID electronic tag and the outer peripheral wall of the first groove form a conical surface fit to achieve self-locking fixation of the RFID electronic tag. The heat transfer paper is disposed on the second end face of the plastic substrate.

2. The RFID anti-metal electronic tag according to claim 1, characterized in that, The annular groove surrounds the outer peripheral wall of the first groove in a circumferential manner, and the height of the inner annular wall is lower than the height of the outer annular wall; the boss and the plastic substrate are integrally formed, and the top plane of the boss is lower than the first end face of the plastic substrate.

3. The RFID anti-metal electronic tag according to claim 2, characterized in that, The second sidewall of the boss is inclined toward the first groove, such that the width of the opening end of the second groove is greater than the width of the bottom end of the second groove. The outer peripheral sidewall of the plastic cover plate fits against the annular outer sidewall of the second groove for positioning, and the wedge-shaped gap gradually narrows from the top plane of the boss towards the bottom end of the second groove.

4. The RFID anti-metal electronic tag according to claim 2, characterized in that, The first sidewall of the boss is inclined toward the central axis of the first groove, such that the inner diameter of the opening end of the first groove is smaller than the inner diameter of the bottom end of the first groove, forming a conical groove with a constricted outer peripheral wall.

5. An RFID anti-metal electronic tag according to any one of claims 1-4, characterized in that, The substrates of the plastic substrate and the plastic cover include at least one of the following: PVC material, PC material, and ABS material; The adhesive includes a curing adhesive, the initial state of which is liquid, and the adhesive includes at least one of the following: epoxy resin adhesive, UV adhesive, and anaerobic adhesive. The heat transfer paper includes single-sided adhesive PVC paper.

6. The RFID anti-metal electronic tag according to claim 1, characterized in that, The RFID electronic tag includes an RFID anti-metal chip, which is encapsulated between two flexible substrates.

7. The RFID anti-metal electronic tag according to claim 1, characterized in that, The plastic substrate has multiple mounting holes for installing and fixing the RFID anti-metal electronic tag.

8. A method for preparing an RFID anti-metal electronic tag as described in any one of claims 1-7, characterized in that, Includes the following steps: An RFID anti-metal chip is encapsulated between two layers of flexible substrate to obtain an RFID electronic tag. Prepare a plastic substrate having the first groove and the second groove; The RFID electronic tag is embedded and fixed in the first groove; and glue is injected into the second groove; The plastic cover plate is placed on the first end face of the plastic substrate, and the plastic substrate after being covered is baked at a low temperature to cure the adhesive. A heat transfer paper is applied to the second end face of the plastic substrate after it has been baked at the low temperature.

9. The method according to claim 8, characterized in that, The preparation of the plastic substrate having the first groove and the second groove includes: The first groove is formed at the center position of the first end face of the plastic substrate; The second groove is formed at intervals around the outer peripheral wall of the first groove; For the boss formed between the outer peripheral wall of the first groove and the annular inner sidewall of the second groove, the first sidewall of the boss is configured to be inclined toward the central axis of the first groove, and the second sidewall of the boss is configured to be inclined toward the first groove; and, The top plane of the boss is configured such that it is smaller than the first end face of the plastic substrate.

10. The method according to claim 9, characterized in that, The step of covering the first end face of the plastic cover plate with the plastic substrate includes: The first cover surface of the plastic cover plate is directed toward the first end face of the plastic substrate, and the plastic cover plate is moved toward the first end face of the plastic substrate. When the outer peripheral sidewall of the plastic cover plate is in contact with the annular outer sidewall of the second groove, the plastic cover plate is continuously pressed down until the first cover surface of the plastic cover plate is in contact with the top plane of the boss and simultaneously bonded to the glue injected in the second groove, thus completing the covering of the plastic cover plate and the plastic substrate.

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