Inductor structure and forming method thereof

Abstract

The invention provides an inductor structure and a forming method. The inductor structure comprises a substrate; the at least two metal layers are sequentially stacked on the substrate, each of the two metal layers comprises a first inductance metal layer located on the substrate, and each first inductance metal layer comprises a plurality of first conductive coils which are concentrically wound at intervals; the second inductive metal layer is located on the first inductive metal layer and comprises a plurality of second conductive coils which are concentrically wound at intervals, the second conductive coils and the first conductive coils have a common coil center, the projection of the first conductive coils on the substrate is a first pattern, and the projection of the second conductive coils on the substrate is a second pattern; the projection of the second conductive coil on the substrate is a second pattern, the second pattern is overlapped with the first pattern, and at least one second pattern is partially overlapped with the adjacent first pattern at the same time; the at least one second pattern is partially overlapped with the adjacent first pattern at the same time, so that the partial area of the second conductive coil corresponds to the gap between the adjacent first conductive coils, the opposite area between the first conductive coils and the second conductive coils is reduced, the coupling capacitance is reduced, and the coupling efficiency is improved. Therefore, the quality factor of the inductor structure is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to inductor structures and methods for forming them. Background Technology

[0002] Inductors, as key components of radio frequency integrated circuits, are widely used in voltage-controlled oscillators, low-noise amplifiers, and power amplifiers.

[0003] An inductor typically consists of three parts: a coil, a substrate shielding structure, and a guard ring. The inductor's quality factor Q is the ratio of the difference between the peak magnetic energy and the peak electrical energy stored in the inductor to its losses over one cycle. The inductor's quality factor Q plays a crucial role in the performance of radio frequency circuits. Because the top layer of metal has low coupling to the substrate and low resistance, inductor coils are usually made with a thick top layer of metal to achieve a high quality factor Q.

[0004] However, the quality factor performance of existing inductor structures still needs further improvement. Summary of the Invention

[0005] The technical problem solved by this invention is to provide an inductor structure and a method for forming the same, so as to improve the performance of the inductor structure.

[0006] To solve the above-mentioned technical problems, the present invention provides an inductor structure, comprising: a substrate; at least two metal layers stacked sequentially on the substrate, each of the two metal layers including a first inductor metal layer located on the substrate, the first inductor metal layer including a plurality of first conductive coils concentrically spaced around it; a second inductor metal layer located on the first inductor metal layer, the second inductor metal layer including a plurality of second conductive coils concentrically spaced around it, the second conductive coils and the first conductive coils having a common coil center, the projection of the first conductive coil on the substrate being a first pattern, the projection of the second conductive coil on the substrate being a second pattern, the second pattern overlapping the first pattern, and at least one of the second patterns simultaneously partially overlapping an adjacent first pattern.

[0007] Optionally, the number of the second conductive coils is different from the number of the first conductive coils, and the width of the second conductive coil is different from the width of the first conductive coil.

[0008] Optionally, the width of the second conductive coil is smaller than the width of the first conductive coil, and the number of the second conductive coils is greater than the number of the first conductive coils.

[0009] Optionally, the first conductive coil includes a first inner conductive coil closest to the center of the coil, the first inner conductive coil having a first inner edge close to the center of the coil, and the second conductive coil includes a second inner conductive coil closest to the center of the coil, the second inner conductive coil having a second inner edge close to the center of the coil, and the distance from the center of the coil to the first inner edge is equal to the distance from the center of the coil to the second inner edge.

[0010] Optionally, the first conductive coil includes a first outer conductive coil furthest from the center of the coil, the first outer conductive coil having a first outer edge furthest from the center of the coil, and the second conductive coil includes a second outer conductive coil furthest from the center of the coil, the second outer conductive coil having a second outer edge furthest from the center of the coil, and the distance from the center of the coil to the first outer edge is equal to the distance from the center of the coil to the second outer edge.

[0011] Optionally, there is a first gap between adjacent first conductive coils, the width of which ranges from 0.1µm to 100µm.

[0012] Optionally, a second gap is provided between adjacent second conductive coils, the width of which ranges from 0.1µm to 100µm.

[0013] Optionally, it further includes: a conductive plug located between any two adjacent metal layers, wherein the first conductive coil and the second conductive coil are electrically connected through the conductive plug.

[0014] Optionally, it may also include a grounding shield layer located between the substrate and the lowest layer of the first inductive metal layer.

[0015] Accordingly, the present invention also provides a method for forming an inductor structure, comprising: providing a substrate; sequentially stacking at least two metal layers on the substrate, the two metal layers including a first inductor metal layer formed on the substrate, the first inductor metal layer including a plurality of first conductive coils arranged concentrically spaced around it; forming a second inductor metal layer on the first inductor metal layer, the second inductor metal layer including a plurality of second conductive coils arranged concentrically spaced around it, the second conductive coils and the first conductive coils having a common coil center, the projection of the first conductive coil on the substrate being a first pattern, the projection of the second conductive coil on the substrate being a second pattern, the second pattern overlapping the first pattern, and at least one of the second patterns simultaneously partially overlapping an adjacent first pattern.

[0016] Optionally, the number of the second conductive coils is different from the number of the first conductive coils, and the width of the second conductive coil is different from the width of the first conductive coil.

[0017] Optionally, the width of the second conductive coil is smaller than the width of the first conductive coil, and the number of the second conductive coils is greater than the number of the first conductive coils.

[0018] Optionally, the first conductive coil includes a first inner conductive coil closest to the center of the coil, the first inner conductive coil having a first inner edge close to the center of the coil, and the second conductive coil includes a second inner conductive coil closest to the center of the coil, the second inner conductive coil having a second inner edge close to the center of the coil, and the distance from the center of the coil to the first inner edge is equal to the distance from the center of the coil to the second inner edge.

[0019] Optionally, the first conductive coil includes a first outer conductive coil furthest from the center of the coil, the first outer conductive coil having a first outer edge furthest from the center of the coil, and the second conductive coil includes a second outer conductive coil furthest from the center of the coil, the second outer conductive coil having a second outer edge furthest from the center of the coil, and the distance from the center of the coil to the first outer edge is equal to the distance from the center of the coil to the second outer edge.

[0020] Optionally, there is a first gap between adjacent first conductive coils, the width of which ranges from 0.1µm to 100µm.

[0021] Optionally, a second gap is provided between adjacent second conductive coils, the width of which ranges from 0.1µm to 100µm.

[0022] Optionally, before forming the second inductive metal layer on the first inductive metal layer, an insulating layer is formed on the surface of the first inductive metal layer; a conductive plug is placed within the insulating layer, and the first conductive coil and the second conductive coil are electrically connected through the conductive plug.

[0023] Optionally, it may also include forming a grounding shield layer between the substrate and the lowest layer of the first inductive metal layer.

[0024] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0025] In the inductor structure provided by this invention, at least two metal layers are stacked sequentially on a substrate. Each metal layer includes a first inductor metal layer on the substrate, comprising multiple concentrically arranged first conductive coils. A second inductor metal layer is also located on the first inductor metal layer, comprising multiple concentrically arranged second conductive coils. The first and second conductive coils share a common coil center. The projection patterns of the first and second inductor metal layers on the substrate coincide. The projections of the first and second conductive coils on the substrate form a first pattern, and the projections of the second conductive coils on the substrate form a second pattern. At least one second pattern partially overlaps with an adjacent first pattern. Since the multiple first conductive coils are spaced apart, the partial overlap between at least one second pattern and an adjacent first pattern ensures that a portion of the area of ​​the second conductive coil corresponds to the gap between adjacent first conductive coils. This reduces the facing area between the first and second conductive coils, thereby lowering the coupling capacitance and improving the quality factor of the inductor structure, thus having a wide range of applications. Attached Figure Description

[0026] Figures 1 to 3 A schematic diagram of an inductor structure;

[0027] Figures 4 to 6 This is a schematic diagram of the steps in the method for forming an inductor structure according to an embodiment of the present invention;

[0028] Figure 7 The diagram shows a comparison of the overall Q performance of the inductor structure of the present invention with that of a conventional inductor structure.

[0029] Figure 8 The diagram shows a comparison of the Q-maximum values ​​of the inductor structure of this invention with those of a conventional inductor structure. Detailed Implementation

[0030] It should be noted that the terms "surface" and "on" in this specification are used to describe the relative spatial position and are not limited to whether there is direct contact.

[0031] As described in the background section, the performance of inductor structures formed in the prior art needs improvement. An inductor structure will now be described and analyzed in conjunction with this study.

[0032] Please refer to Figures 1 to 3An inductor structure 102 includes a substrate (not shown); a first inductor metal layer 104 located on the substrate, the first inductor metal layer 104 including three first conductive coils 100; and a second inductor metal layer 103 located on the first inductor metal layer 104, the second inductor metal layer including three second conductive coils 101, wherein the projections of the first conductive coils 100 on the substrate coincide with the projections of the second conductive coils 101 on the substrate.

[0033] Figure 2 for Figure 1 A schematic diagram of the structure of the second inductor metal layer 103; Figure 3 for Figure 1 A schematic diagram of the structure of the first inductor metal layer 104.

[0034] The inventors discovered that when the first conductive coil 100 and the second conductive coil 101 are connected by a conductive plug, the first conductive coil 100 and the second conductive coil 101 have a symmetrical structure. The first conductive coil 100 and the second conductive coil 101 face each other, that is, the projection of the first conductive coil 100 on the substrate is completely consistent with the projection pattern of the second conductive coil 101 on the substrate. Moreover, the first conductive coil 100 and the second conductive coil 101 have a one-to-one correspondence. With this structure, the facing area of ​​the first conductive coil 100 and the second conductive coil 101 is very large, which will result in a large coupling capacitance and reduce the Q value of the inductance.

[0035] Through research, the inventors discovered that by sequentially stacking a first inductor metal layer and a second inductor metal layer on a substrate, the first inductor metal layer includes multiple concentrically spaced first conductive coils, and the second inductor metal layer includes multiple concentrically spaced second conductive coils. The first and second conductive coils share a common coil center. The projection patterns of the first and second inductor metal layers on the substrate coincide. The projection of the first conductive coils on the substrate is the first pattern, and the projection of the second conductive coils on the substrate is the second pattern. At least one second pattern partially overlaps with an adjacent first pattern. Since the multiple first conductive coils are spaced apart, and by utilizing the partial overlap of at least one second pattern with an adjacent first pattern, the facing area of ​​the first and second conductive coils is reduced, thereby lowering the coupling capacitance and improving the quality factor of the inductor structure. This design has a wider range of applications.

[0036] To make the above-mentioned objectives, features and beneficial effects of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0037] First, please refer to Figures 4 to 6A substrate (not shown) is provided, and at least two metal layers are sequentially stacked on the substrate, the two metal layers including a first inductive metal layer 200 and a second inductive metal layer 200' formed on the substrate.

[0038] Figure 4 This is a top view of the inductor structure; Figure 5 This is a schematic diagram of the structure of the first inductor metal layer 200; Figure 6 This is a schematic diagram of the structure of the second inductor metal layer 200'.

[0039] In this embodiment, the substrate includes a base and a device layer (not shown) formed on the base, and a metal interconnect layer (not shown) is also formed on the device layer.

[0040] In this embodiment, two metal layers are stacked on the substrate.

[0041] In other embodiments, multiple metal layers may be stacked on the substrate, including forming the first inductor metal layer 200 and the second inductor metal layer 200' on the substrate, and then stacking the metal layers to the required number of layers, using the first inductor metal layer 200 and the second inductor metal layer 200' as a cycle unit.

[0042] In this embodiment, the first inductive metal layer 200 includes a plurality of first conductive coils 201 arranged concentrically at intervals.

[0043] In this embodiment, the second inductor metal layer 200' is located on the first inductor metal layer 200. The second inductor metal layer 200' includes a plurality of second conductive coils 202 arranged concentrically and spaced around each other. The second conductive coils 202 and the first conductive coils 201 have a common coil center (O). The projection of the first conductive coil 201 on the substrate is a first pattern, and the projection of the second conductive coil 202 on the substrate is a second pattern. The second pattern overlaps with the first pattern, and at least one of the second patterns simultaneously has partial overlap with the adjacent first pattern.

[0044] In this embodiment, at least one of the second patterns partially overlaps with the adjacent first pattern. Since the multiple first conductive coils 201 are spaced apart, the gap between at least one second conductive coil 202 and the adjacent first conductive coil 201 is used to reduce the facing area of ​​the first conductive coil 201 and the second conductive coil 202, thereby reducing the coupling capacitance and improving the quality factor of the inductor structure, which has a wide range of applications.

[0045] Figure 7The above inductor structure and the traditional inductor structure ( Figure 1 The overall Q performance comparison shows that the Q value of this inductor structure in the 2GHz to 17.2GHz frequency band is significantly improved compared to the traditional inductor structure, exceeding 8.5%.

[0046] Figure 7 The center line ① represents the Q-value curve of the conventional inductor structure; line ② represents the Q-value curve of the inductor structure in this embodiment.

[0047] Figure 8 The above inductor structure and the traditional inductor structure ( Figure 1 The Q-maximum of the inductor is significantly higher than that of the traditional inductor structure, with an increase of more than 10.9%.

[0048] Figure 8 The center line ① represents the Q-value curve of the conventional inductor structure; line ② represents the Q-value curve of the inductor structure in this embodiment.

[0049] In this embodiment, the first shape is an octagon.

[0050] In other embodiments, the first shape may also be a circle, a triangle, a quadrilateral, a pentagon, a hexagon, or a heptagon.

[0051] In this embodiment, the second shape is an octagon.

[0052] In other embodiments, the second shape may also be a circle, a triangle, a quadrilateral, a pentagon, a hexagon, or a heptagon.

[0053] In this embodiment, the cross-sectional shapes of the first conductive coil 201 and the second conductive coil 202 include circular, square, rectangular or flat shapes.

[0054] In this embodiment, the first conductive coil 201 and the second conductive coil 202 have the same thickness.

[0055] In other embodiments, the thicknesses of the first conductive coil 201 and the second conductive coil 202 may be different.

[0056] In this embodiment, the number of the second conductive coils 202 is different from the number of the first conductive coils 201, and the width of the second conductive coils 202 is different from the width of the first conductive coils 201.

[0057] In this embodiment, the width of the second conductive coil 202 is smaller than the width of the first conductive coil 201, and the number of the second conductive coils 202 is greater than the number of the first conductive coils 201.

[0058] Specifically, there are two first conductive coils 201 and three second conductive coils 202.

[0059] In this embodiment, the width (d2) of the second conductive coil 202 is smaller than the width (d1) of the first conductive coil 201.

[0060] In this embodiment, the first conductive coil 201 includes a first inner conductive coil 201a that is closest to the coil center (O), and the first inner conductive coil 201a has a first inner edge close to the coil center (O). The second conductive coil 202 includes a second inner conductive coil 202a that is closest to the coil center (O), and the second inner conductive coil 202a has a second inner edge close to the coil center (O). The distance (R1) from the coil center (O) to the first inner edge is equal to the distance (R1') from the coil center (O) to the second inner edge.

[0061] In this embodiment, the first conductive coil 201 includes a first outer conductive coil 201b that is farthest from the coil center (O), and the first outer conductive coil 201b has a first outer edge that is far from the coil center (O). The second conductive coil 202 includes a second outer conductive coil 202b that is farthest from the coil center (O), and the second outer conductive coil 202b has a second outer edge that is far from the coil center (O). The distance (R2) from the coil center (O) to the first outer edge is equal to the distance (R2') from the coil center (O) to the second outer edge.

[0062] In this embodiment, R1 = R1' and R2 = R2' are used to make the plurality of first conductive coils 201 and the plurality of second conductive coils 202 spatially aligned.

[0063] In this embodiment, there is a first gap (s1) between adjacent first conductive coils 201, and the width of the first gap (s1) ranges from 0.1um to 100um.

[0064] In this embodiment, there is a second gap (s2) between adjacent second conductive coils 202, and the width of the second gap (s2) ranges from 0.1um to 100um.

[0065] In this embodiment, before forming the second inductor metal layer 200' on the first inductor metal layer 200, the method further includes: forming an insulating layer (not shown in the figure) on the surface of the first inductor metal layer 200; and a conductive plug (not shown in the figure) inside the insulating layer, through which the first conductive coil 201 and the second conductive coil 202 are electrically connected.

[0066] In this embodiment, the conductive plug connects the first conductive coil 201 and the second conductive coil 202 in series.

[0067] In other embodiments, the first conductive coil 201 and the second conductive coil 202 may be connected in series, partially in series, or partially in parallel, etc.

[0068] In this embodiment, the first inductive metal layer 200 further includes a first connection terminal 203 connected to a plurality of first conductive coils 201.

[0069] In this embodiment, the second inductive metal layer 200' further includes a second connection terminal 204 connected to a plurality of second conductive coils 202.

[0070] In this embodiment, a grounding shield 205 is formed between the substrate and the lowest layer of the first inductor metal layer 200. The grounding shield 205 is used to interrupt the magnetic field of the inductor to the substrate, reduce electromagnetic losses caused by the substrate, and thereby improve the Q value.

[0071] Accordingly, using the above-described forming method, the present invention also provides an inductor structure, including a substrate; at least two metal layers stacked sequentially on the substrate, each of the two metal layers including a first inductor metal layer 200 located on the substrate, the first inductor metal layer 200 including a plurality of first conductive coils 201 concentrically spaced around it; a second inductor metal layer 200' located on the first inductor metal layer 200, the second inductor metal layer 200' including a plurality of second conductive coils 202 concentrically spaced around it, the second conductive coils 202 and the first conductive coils 201 having a common coil center (O), the projection of the first conductive coil 201 on the substrate being a first pattern, the projection of the second conductive coil 202 on the substrate being a second pattern, the second pattern overlapping the first pattern, and at least one of the second patterns simultaneously partially overlapping with an adjacent first pattern.

[0072] In this embodiment, since the multiple first conductive coils 201 are spaced apart, and at least one second pattern partially overlaps with the adjacent first pattern, a portion of the area of ​​the second conductive coil 202 corresponds to the gap between the adjacent first conductive coils 201. This reduces the facing area between the first conductive coils 201 and the second conductive coils 202, thereby reducing the coupling capacitance and improving the quality factor of the inductor structure, which has a wider range of applications.

[0073] In this embodiment, the number of the second conductive coils 202 is different from the number of the first conductive coils 201, and the width of the second conductive coils 202 is different from the width of the first conductive coils 201.

[0074] In this embodiment, the width of the second conductive coil 202 is smaller than the width of the first conductive coil 201, and the number of the second conductive coils 202 is greater than the number of the first conductive coils 201.

[0075] Specifically, there are two first conductive coils 201 and three second conductive coils 202.

[0076] In this embodiment, the first conductive coil 201 includes a first inner conductive coil 201a that is closest to the coil center (O), and the first inner conductive coil 201a has a first inner edge close to the coil center (O). The second conductive coil 202 includes a second inner conductive coil 202a that is closest to the coil center (O), and the second inner conductive coil 202a has a second inner edge close to the coil center (O). The distance (R1) from the coil center (O) to the first inner edge is equal to the distance (R1') from the coil center (O) to the second inner edge.

[0077] In this embodiment, the first conductive coil 201 includes a first outer conductive coil 201b that is farthest from the coil center (O), and the first outer conductive coil 201b has a first outer edge that is far from the coil center (O). The second conductive coil 202 includes a second outer conductive coil 202b that is farthest from the coil center (O), and the second outer conductive coil 202b has a second outer edge that is far from the coil center (O). The distance (R2) from the coil center (O) to the first outer edge is equal to the distance (R2') from the coil center (O) to the second outer edge.

[0078] In this embodiment, the second conductive coil 202 further includes a second intermediate conductive coil 202c located between the second outer conductive coil 202b and the second inner conductive coil 202a.

[0079] In this embodiment, there is a first gap (s1) between adjacent first conductive coils 201, and the width of the first gap (s1) ranges from 0.1um to 100um.

[0080] In this embodiment, there is a second gap (s2) between adjacent second conductive coils 202, and the width of the second gap (s2) ranges from 0.1um to 100um.

[0081] In this embodiment, it further includes a conductive plug located between any two adjacent metal layers, wherein the first conductive coil 201 and the second conductive coil 202 are electrically connected through the conductive plug.

[0082] In this embodiment, the first inductive metal layer 200 further includes a first connection terminal 203 connected to a plurality of first conductive coils 201.

[0083] In this embodiment, the second inductive metal layer 200' further includes a second connection terminal 204 connected to a plurality of second conductive coils 202.

[0084] In this embodiment, a ground shielding layer 205 is also included, located between the substrate and the lowest layer, the first inductive metal layer 200.

[0085] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. An inductor structure, characterized in that, include: Substrate; At least two metal layers are stacked sequentially on the substrate, each of the two metal layers including a first inductive metal layer located on the substrate, the first inductive metal layer including a plurality of first conductive coils that are concentrically spaced around it; A second inductive metal layer is located on the first inductive metal layer. The second inductive metal layer includes a plurality of second conductive coils that are concentrically spaced around each other. The second conductive coils and the first conductive coils have a common coil center. The projection of the first conductive coil on the substrate is a first pattern, and the projection of the second conductive coil on the substrate is a second pattern. The second pattern overlaps with the first pattern, and at least one of the second patterns simultaneously has partial overlap with the adjacent first pattern.

2. The inductor structure as described in claim 1, characterized in that, The number of the second conductive coils is different from the number of the first conductive coils, and the width of the second conductive coil is different from the width of the first conductive coil.

3. The inductor structure as described in claim 1, characterized in that, The width of the second conductive coil is smaller than the width of the first conductive coil, and the number of the second conductive coils is greater than the number of the first conductive coils.

4. The inductor structure as described in claim 1, characterized in that, The first conductive coil includes a first inner conductive coil closest to the center of the coil, the first inner conductive coil having a first inner edge close to the center of the coil; the second conductive coil includes a second inner conductive coil closest to the center of the coil, the second inner conductive coil having a second inner edge close to the center of the coil; the distance from the center of the coil to the first inner edge is equal to the distance from the center of the coil to the second inner edge.

5. The inductor structure as described in claim 1, characterized in that, The first conductive coil includes a first outer conductive coil that is furthest from the center of the coil, and the first outer conductive coil has a first outer edge that is far from the center of the coil. The second conductive coil includes a second outer conductive coil that is furthest from the center of the coil, and the second outer conductive coil has a second outer edge that is far from the center of the coil. The distance from the center of the coil to the first outer edge is equal to the distance from the center of the coil to the second outer edge.

6. The inductor structure as described in claim 1, characterized in that, There is a first gap between adjacent first conductive coils, and the width of the first gap ranges from 0.1um to 100um.

7. The inductor structure as described in claim 1, characterized in that, There is a second gap between adjacent second conductive coils, and the width of the second gap ranges from 0.1um to 100um.

8. The inductor structure as described in claim 1, characterized in that, Also includes: A conductive plug is located between any two adjacent metal layers, and the first conductive coil and the second conductive coil are electrically connected through the conductive plug.

9. The inductor structure as described in claim 1, characterized in that, Also includes: A grounding shield layer located between the substrate and the lowest layer, the first inductive metal layer.

10. A method for forming an inductor structure, characterized in that, include: Provide substrate; At least two metal layers are stacked sequentially on the substrate, the two metal layers including a first inductive metal layer formed on the substrate, the first inductive metal layer including a plurality of first conductive coils arranged concentrically spaced around it; A second inductor metal layer is formed on the first inductor metal layer. The second inductor metal layer includes a plurality of second conductive coils arranged concentrically and spaced around each other. The second conductive coils and the first conductive coils have a common coil center. The projection of the first conductive coil on the substrate is a first pattern, and the projection of the second conductive coil on the substrate is a second pattern. The second pattern overlaps with the first pattern, and at least one of the second patterns simultaneously has partial overlap with the adjacent first pattern.

11. The method for forming an inductor structure as described in claim 10, characterized in that, The number of the second conductive coils is different from the number of the first conductive coils, and the width of the second conductive coil is different from the width of the first conductive coil.

12. The method for forming an inductor structure as described in claim 10, characterized in that, The width of the second conductive coil is smaller than the width of the first conductive coil, and the number of the second conductive coils is greater than the number of the first conductive coils.

13. The method for forming an inductor structure as described in claim 10, characterized in that, The first conductive coil includes a first inner conductive coil closest to the center of the coil, the first inner conductive coil having a first inner edge close to the center of the coil; the second conductive coil includes a second inner conductive coil closest to the center of the coil, the second inner conductive coil having a second inner edge close to the center of the coil; the distance from the center of the coil to the first inner edge is equal to the distance from the center of the coil to the second inner edge.

14. The method for forming an inductor structure as described in claim 10, characterized in that, The first conductive coil includes a first outer conductive coil that is furthest from the center of the coil, and the first outer conductive coil has a first outer edge that is far from the center of the coil. The second conductive coil includes a second outer conductive coil that is furthest from the center of the coil, and the second outer conductive coil has a second outer edge that is far from the center of the coil. The distance from the center of the coil to the first outer edge is equal to the distance from the center of the coil to the second outer edge.

15. The method for forming an inductor structure as described in claim 10, characterized in that, There is a first gap between adjacent first conductive coils, and the width of the first gap ranges from 0.1um to 100um.

16. The method for forming an inductor structure as described in claim 10, characterized in that, There is a second gap between adjacent second conductive coils, and the width of the second gap ranges from 0.1um to 100um.

17. The method for forming an inductor structure as described in claim 10, characterized in that, Before forming the second inductive metal layer on the first inductive metal layer, an insulating layer is formed on the surface of the first inductive metal layer; a conductive plug is placed inside the insulating layer, and the first conductive coil and the second conductive coil are electrically connected through the conductive plug.

18. The method for forming an inductor structure as described in claim 10, characterized in that, Also includes: A grounding shielding layer is formed between the substrate and the lowest layer, the first inductive metal layer.

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