Laser processing method and device of package substrate, electronic equipment and storage medium

Abstract

The invention provides a laser processing method and device of a packaging substrate, electronic equipment and a storage medium. The method comprises the following steps: acquiring a to-be-processed packaging substrate, and determining the layer number of the to-be-processed packaging substrate; directly performing laser processing on the to-be-processed packaging substrate at the initial position in response to the fact that the layer number is determined to be an odd number; and in response to the fact that the number of the layers is determined to be an even number, rotating the to-be-processed packaging substrate by a first preset angle, controlling the to-be-processed packaging substrate to move from the initial position to an updating position, and performing laser processing on the to-be-processed packaging substrate in the updating position.

Description

Technical Field

[0001] This disclosure relates to the field of substrate processing technology, and in particular to a laser processing method, apparatus, electronic device and storage medium for packaging substrates. Background Technology

[0002] In the process of high-precision substrate processing and chip packaging, the expansion and contraction values ​​of different areas of the packaging substrate will vary. As the number of laser processing layers increases, the expansion and contraction value deviation becomes larger and larger. When the expansion and contraction value deviation of the same batch of packaging substrates is large, it will have a serious impact on subsequent assembly, packaging and other processes, resulting in a decrease in product yield.

[0003] Therefore, how to avoid excessive deviations in expansion and contraction values ​​between different areas of the packaging substrate has become an urgent technical problem to be solved. Summary of the Invention

[0004] In view of this, the purpose of this disclosure is to provide a laser processing method, apparatus, electronic device and storage medium for packaging substrates to solve or partially solve the above-mentioned technical problems.

[0005] To achieve the above objectives, the first aspect of this disclosure provides a laser processing method for a packaging substrate, the method comprising: Obtain the packaging substrate to be processed and determine the layer number of the packaging substrate to be processed; In response to determining that the layer number is an odd number, laser processing is directly performed on the packaging substrate to be processed in the initial position; In response to determining that the layer number is an even number, the packaging substrate to be processed is rotated by a first preset angle, the packaging substrate to be processed is controlled to move from the initial position to the updated position, and laser processing is performed on the packaging substrate to be processed at the updated position.

[0006] Based on the same inventive concept, a second aspect of this disclosure provides a laser processing apparatus for a packaging substrate, comprising: The layer number determination module is configured to acquire the packaging substrate to be processed and determine the layer number of the packaging substrate to be processed; The first laser processing module is configured to directly perform laser processing on the packaging substrate to be processed in the initial position in response to determining that the layer number is an odd number of layers; The second laser processing module is configured to, in response to determining that the layer number is an even number, rotate the packaging substrate to be processed by a first preset angle, control the packaging substrate to be processed to move from the initial position to the updated position, and perform laser processing on the packaging substrate to be processed at the updated position.

[0007] Based on the same inventive concept, a third aspect of this disclosure proposes an electronic device including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor implements the method described above when executing the computer program.

[0008] Based on the same inventive concept, a fourth aspect of this disclosure provides a non-transitory computer-readable storage medium that stores computer instructions for causing a computer to perform the methods described above.

[0009] As described above, this disclosure provides a laser processing method, apparatus, electronic device, and storage medium for packaging substrates. The process involves acquiring a packaging substrate to be processed and determining its layer number. If the layer number is odd, laser processing is directly performed on the packaging substrate at its initial position. If the layer number is even, the packaging substrate is rotated by a first preset angle, controlling its movement from the initial position to a newer position, and laser processing is performed on the updated position. By rotating the packaging substrate at even-numbered layers, the laser processing areas differ between odd-numbered and even-numbered layers, thereby reducing the expansion / contraction deviation between different areas of the packaging substrate and preventing excessive expansion / contraction deviation from affecting product yield. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in this disclosure or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1A This is a schematic diagram showing the expansion and contraction values ​​of different areas of the packaging substrate after laser processing in related technologies. Figure 1B This is a schematic diagram showing the expansion and contraction values ​​of each layer of the packaging substrate in the related technology; Figure 1C A flowchart of laser processing of packaging substrates in related technologies; Figure 2A This is a flowchart of a laser processing method for a packaging substrate according to an embodiment of the present disclosure; Figure 2B This is a flowchart of the laser processing of the packaging substrate after rotation, according to an embodiment of the present disclosure; Figure 2C This is a schematic diagram illustrating the change of the anti-fool hole coordinates according to an embodiment of this disclosure; Figure 2DA schematic diagram of the program configuration interface for an embodiment of this disclosure; Figure 2E This is a schematic diagram of a new configuration interface according to an embodiment of this disclosure; Figure 2F This is a schematic diagram of the interface for creating a new subroutine according to an embodiment of this disclosure; Figure 2G This is a schematic diagram of the interface for creating a new master program according to an embodiment of this disclosure; Figure 2H This is a schematic diagram of the request approval interface according to an embodiment of this disclosure; Figure 2I This is a schematic diagram of the QP coordinates of the packaging substrate according to an embodiment of this disclosure; Figure 2J This is a schematic diagram showing the expansion and contraction values ​​of different areas of the packaging substrate after laser processing, before and after the improvement of the embodiments of this disclosure. Figure 3 This is a schematic diagram of the structure of the laser processing apparatus for the packaging substrate according to an embodiment of the present disclosure; Figure 4 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0012] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0013] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0014] Based on the background description, Ajinomoto Build-up Film (ABF) is an organic resin material used for high-density packaging, primarily for high-end chip packaging substrates. In the process of manufacturing semiconductor packaging substrates for Flip Chip Ball Grid Array (FCBGA) using ABF, the expansion and contraction values ​​of different areas (e.g., quarter panel, QP) of the same packaging substrate (panel) vary significantly after laser processing. All packaging substrates exhibit a fixed expansion and contraction deviation trend after laser processing. Figure 1A This is a schematic diagram illustrating the expansion and contraction values ​​of different areas of a packaging substrate after laser processing in related technologies. For example... Figure 1A As shown, the expansion and contraction values ​​of the two QPs (QP2 and QP3) laser-processed at the back end of the same package substrate are always higher than those of the two QPs (QP1 and QP4) laser-processed at the front end.

[0015] Figure 1B This is a schematic diagram illustrating the expansion and contraction values ​​of each layer of the packaging substrate in related technologies. For example... Figure 1B As shown, the expansion and contraction values ​​of QPs (QP2 and QP3) and QPs (QP1 and QP4) from the BU01 layer to the EP layer after laser processing show an increasing deviation as the number of ABF insulating layers increases. However, the expansion and contraction deviation values ​​from the EP layer to the SR layer (which does not require laser processing) remain relatively stable. Therefore, the increasing deviation in expansion and contraction values ​​between QPs is due to the direct influence of the laser processing technology on these differences.

[0016] According to the current laser processing method, the difference in expansion and contraction values ​​between QPs increases with the increase of the number of ABP stacking layers. After laser processing, the expansion and contraction value deviation becomes larger and larger, and the expansion and contraction value deviation between QPs becomes larger and larger after laser processing. Figure 1C This is a flowchart of laser processing of packaging substrates in related technologies. For example... Figure 1C As shown, laser drilling is first performed on the BU01 layer, then on the BU02 layer, and finally on the EP layer. This will lead to an increasingly larger deviation in the expansion and contraction values.

[0017] When the expansion and contraction values ​​of the same batch of packaging substrates vary greatly, the U-balling process needs to split the different expansion and contraction values ​​in the same batch of packaging substrates into two or more batches for manufacturing based on the QP expansion and contraction performance. Otherwise, the product yield will be lost due to expansion and contraction issues.

[0018] As mentioned above, how to avoid excessive deviations in expansion and contraction values ​​between different regions of the packaging substrate has become an important research problem.

[0019] Based on the above description, such as Figure 2A As shown, the laser processing method for the packaging substrate proposed in this embodiment includes: Step 101: Obtain the packaging substrate to be processed and determine the layer number of the packaging substrate to be processed.

[0020] Step 102: In response to determining that the layer number is an odd number, laser processing is directly performed on the packaging substrate to be processed in the initial position.

[0021] Step 103: In response to determining that the layer number is an even number, the packaging substrate to be processed is rotated by a first preset angle, the packaging substrate to be processed is controlled to move from the initial position to the updated position, and the packaging substrate to be processed at the updated position is laser-processed.

[0022] In practice, based on current laser processing methods, a fixed trend of expansion and contraction has been observed: the expansion and contraction values ​​of two QPs (QP2 & QP3) after laser processing at the back end of the same panel are always higher than those of two QPs (QP1 & QP4) after laser processing at the front end. Therefore, to reduce the difference in expansion and contraction values ​​between QPs, a key laser processing technology is employed: rotating the packaging substrate panel by 180°. The first preset angle can be 180°.

[0023] Figure 2B This is a flowchart illustrating the laser processing of the packaging substrate after rotation, according to an embodiment of this disclosure. Figure 2BAs shown, when processing BU01 layer, the laser processing uses the normal process procedure to process the packaging substrate panel, without the need for rotation. After the packaging substrate completes the entire process flow to produce BU01 layer and is cycled to ABF stacking to add layers to BU02 layer, a new key process is applied at the laser station to rotate the packaging substrate panel 180° based on the original BU01 layer before laser processing of BU02 layer; and so on. Odd-numbered layers are laser processed without rotation like BU01 layer, and even-numbered layers are laser processed like BU02 layer. The layer is processed by laser rotation of 180°. The laser process uses a new key technology to reduce the difference in expansion and contraction values ​​between QPs. By processing the odd and even layers by laser rotation of 180°, the expansion and contraction values ​​of QPs (QP2 & QP3) and QPs (QP1 & QP4) within the same packaging substrate panel are complementary. This reduces the difference in expansion and contraction values ​​between QPs after laser processing of the packaging substrate, improves expansion and contraction uniformity, and increases the yield of the packaging substrate products.

[0024] Through the above embodiments, a packaging substrate to be processed is obtained, and its layer number is determined. When the layer number is odd, laser processing is directly performed on the packaging substrate in the initial position. When the layer number is even, the packaging substrate to be processed is rotated by a first preset angle, controlling it to move from the initial position to a new position, and laser processing is performed on the packaging substrate in the new position. In this way, by rotating the packaging substrate of even-numbered layers, the areas of laser processing for odd-numbered and even-numbered layers are different, thereby reducing the expansion and contraction deviation between different areas of the packaging substrate and thus avoiding the impact on product yield due to excessive expansion and contraction deviation.

[0025] In some embodiments, step 101 includes: Step 1011: Obtain the packaging substrate to be processed and the substrate processing data.

[0026] Step 1012: Convert the substrate processing data into laser machine processing format data, and determine the layer number of the packaging substrate to be processed based on the laser machine processing format data.

[0027] In practice, the substrate processing data can be Computer Aided Manufacturing (CAM). Specifically, the substrate processing data of the packaging substrate to be processed is acquired, and application software (e.g., CAD CONVERT) is used to convert the substrate processing data into laser machine processing format data. Based on the laser machine processing format data, the layer number of the packaging substrate to be processed is determined. The layer number of the packaging substrate includes at least one of the following: BU01 layer, BU02 layer, BU03 layer, BU04 layer, BU05 layer, BU06 layer...EP layer and SR layer.

[0028] The above method obtains the substrate processing data of the packaging substrate to be processed. The application software can convert the substrate processing data into laser machine processing format data. In this way, the layer number of the packaging substrate to be processed can be quickly and accurately determined based on the laser machine processing format data.

[0029] In some embodiments, after step 1012, the method further includes: Step 1012A: Modify the coordinates of the anti-foolproof holes in the even-numbered layers of the laser machine processing format data to obtain updated processing data.

[0030] Step 1012B: Set the processing program name for the updated processing data and store the updated processing data according to the preset storage path.

[0031] In practice, Figure 2C This is a schematic diagram illustrating the change of the anti-fool hole coordinates according to an embodiment of this disclosure. Figure 2C As shown, after converting the substrate processing data into laser machine processing format data, for even-numbered layers that need to be rotated, the coordinates of the Hirita ID holes are changed in the laser machine processing format data, while keeping other contents unchanged, to obtain updated processing data.

[0032] The system sets the processing program name for the updated processing data and stores the updated processing data according to a pre-defined storage path. Specifically, when the user clicks "Save to specified path," the path control in the system interface receives the path setting instruction and sets the storage path for the updated processing data. At the same time, the save control in the system interface receives the save instruction and stores the updated processing data according to the pre-defined storage path.

[0033] The above method modifies the coordinates of the anti-foolproof holes in even-numbered layers of the laser machining tool's processing format data to obtain updated processing data, facilitating the rotation of even-numbered layer encapsulation substrates. The updated processing data is then given a processing program name and stored according to a pre-defined storage path, allowing for the configuration of subroutines based on the processing program name and storage path.

[0034] In some embodiments, step 103 includes: Step 1031: Scan the packaging substrate to be processed to obtain a pre-configured subroutine and a master program. The pre-configured subroutine is bound to the laser machine, and the pre-configured master program is bound to the upper board machine and the lower board machine.

[0035] Step 1032: Based on the pre-configured parent program and subprogram, the packaging substrate to be processed is identified as having an even number of layers, and a rotation command is generated.

[0036] Step 1033: The board mounting machine rotates the packaging substrate to be processed by a first preset angle based on the rotation command, and controls the packaging substrate to be processed to move from the initial position to the updated position.

[0037] Step 1034: The laser machine performs laser processing on the packaging substrate to be processed at the updated position.

[0038] Step 1035: The unloading machine rotates the packaging substrate to be processed by a second preset angle, controlling the packaging substrate to be processed to move from the updated position to the initial position.

[0039] In specific implementation, the embodiments of this disclosure need to realize the function of automatically rotating the packaging substrate by 180°. This cannot be achieved by hardware alone. New functions need to be developed and combined with software to realize the action of rotating the packaging substrate by 180°.

[0040] By developing new hardware and software within the MES system and integrating it with the laser engraving machine, the loading machine, and the unloading machine, when a packaged substrate arrives at the laser station, the production team scans the process card barcode or QR code on the current batch of packaged substrates using a barcode scanner. The Recipe program then sends instructions to the loading machine. The loading machine identifies whether rotation is required. If rotation is needed, the loading machine picks up the packaged substrate, rotates it 180° in a first direction, and places it on the laser engraving machine's processing table. The laser engraving machine completes the laser engraving of the packaged substrate according to the corresponding production sequence. After the laser engraving is complete, the unloading machine rotates the packaged substrate 180° in a second direction. The first and second directions are opposite. This allows the unloading machine to rotate the packaged substrate back to its initial position, ensuring that the keying holes of even-numbered and odd-numbered layers are on the same side, preventing obstruction of the keying holes.

[0041] The above scheme identifies the packaging substrate to be processed as having an even number of layers based on the pre-configured master and subroutines, enabling rapid and accurate generation of rotation commands. The upper board machine rotates the packaging substrate to be processed by a first preset angle based on the rotation command, controlling the substrate to move from its initial position to a newer position. The laser machine then performs laser processing on the substrate at the newer position, thus achieving laser processing on even-numbered layer packaging substrates after rotation, thereby reducing the expansion / contraction deviation between different areas of the packaging substrate. The lower board machine rotates the packaging substrate to be processed by a second preset angle, controlling the substrate to move from the newer position to the initial position, ensuring that the keying holes of the even-numbered and odd-numbered layer packaging substrates are on the same side, avoiding obstruction of the keying holes.

[0042] In some embodiments, the pre-configuration process of the subroutine includes: Step 1031A: Create a new subroutine using the Manufacturing Execution System and select a preset change item in the change set.

[0043] Step 1031B: In response to determining that the current layer number is an odd number, the name of the first subroutine is set.

[0044] Step 1031C: In response to determining that the current layer number is an even number, the name of the second subroutine is set.

[0045] Step 1031D: Configure the newly created subroutine based on the first subroutine name, the second subroutine name, the product type, the storage path, and the processing program name.

[0046] In practice, the laser processing subroutine (sub-recipe) is created in the Manufacturing Execution System (MES), which is a newly developed software interface specifically designed for creating laser processing programs.

[0047] Figure 2D This is a schematic diagram of the program configuration interface according to an embodiment of this disclosure. Figure 2D As shown, the newly created MES interface displays a Recipe. Clicking on a Subroutine sends a command to the Subroutine control, which then enters the Subroutine configuration interface. The Subroutine configuration interface displays multiple control buttons. Clicking the "New" control button sends a command to the newly created control, which then enters the new control configuration interface.

[0048] Figure 2E This is a schematic diagram of a new configuration interface according to an embodiment of this disclosure. Figure 2E As shown, the new configuration interface displays a set of change items. Clicking the drop-down option of the change set will display multiple arbitrary strings. Select a relatively complex string. The main purpose of the change set is to prevent the existence of the same characters as other baseboards, which may lead to defects (bugs). It is mainly to prevent software conflicts that may cause bugs. After completing this step, click Next. The Next control receives the instruction and enters the new subroutine interface.

[0049] Figure 2F This is a schematic diagram of the interface for creating a new subroutine according to an embodiment of this disclosure. Figure 2F As shown, in the "New Recipe" interface, the subroutine is created. The specific creation process is as follows: ⑤ Subroutine Name: Subroutine name confirmation. Specifically, when the packaging substrate to be processed is an odd-numbered layer that does not require rotation, a first subroutine name without a suffix is ​​set (e.g., DOE_LAC_MTGTF4_BU01F); when the packaging substrate to be processed is an even-numbered layer that requires rotation, a second subroutine name with a suffix is ​​set (e.g., DOE_LAC_MTGTF4_BU01_ROT, where ROT is a suffix).

[0050] ⑥ Product Type: This refers to the product category. The drop-down options are Production and Engineering. You can set the appropriate option based on the product type.

[0051] ⑦ Storage path (Supplier information): refers to the storage path preset in step 1012B. The storage path of the subroutine needs to match the storage path of the updated processing data in step 1012B.

[0052] ⑧ Resource Recipe Name: This refers to the name of the processing program in step 1012B. The name of the processing program in the subroutine must be consistent with the name of the processing program that updates the processing data in step 1012B.

[0053] 9. Create: After completing the above steps, click Create Control. The Create Control will receive the instructions and complete the creation of the subroutine.

[0054] The above scheme enables the configuration of subroutines based on the first subroutine name, the second subroutine name, the product type, the storage path, and the processing program name. This allows the configured subroutines to control the laser processing station to perform laser processing on the packaging substrate.

[0055] In some embodiments, the pre-configuration process of the parent program includes: Step 1031a: Create a new master program using the Manufacturing Execution System.

[0056] Step 1031b: In response to determining that the layer is an odd-numbered layer, the first parent program name is set.

[0057] Step 1031c: In response to determining that the layer is an even-numbered layer, the second parent program name is set.

[0058] Step 1031d: Configure the newly created parent program based on the first parent program name, the second parent program name, the product type, and the resource configuration name.

[0059] In practice, after the subroutine for laser processing is created, a master program (Recipe) also needs to be created. The subroutine is mainly used for laser machine processing creation. The subroutine name makes it easy for production to confirm whether the laser program is rotating. The master program covers all program actions, such as issuing the recipe, automatic Track in on the upper plate machine, automatic Track Out on the lower plate machine, and all other related programs.

[0060] The parent program is also created by clicking the newly developed Recipe option in the MES system, such as... Figure 2D As shown, the newly created MES interface displays a program (Recipe). Clicking on the parent program sends a command to the parent program control, which then enters the parent program configuration interface. The subroutine configuration interface displays multiple control buttons. Clicking the "New" control button sends a command to the newly created parent program interface.

[0061] Figure 2G This is a schematic diagram of the interface for creating a new master program according to an embodiment of this disclosure. Figure 2G As shown, in the "New Recipe" interface, the creation of the parent program is completed. The specific creation process is as follows: ① Parent Program Name (Name): Parent program name confirmation. Specifically, when the packaging substrate to be processed is an odd-numbered layer that does not require rotation, a first parent program name containing the first suffix POR is set (e.g., DOE_LAC_MTGTF4_BU01F_POR); when the packaging substrate to be processed is an even-numbered layer that requires rotation, a second parent program name containing the second suffix ROTATION is set (e.g., DOE_LAC_MTGTF4_BU01F_ROTATION).

[0062] ② Product Type: This refers to the product category. The drop-down options are Production and Engineering. You can set the product type accordingly.

[0063] ③ Resource Recipe Name: The resource recipe name is configured as LACMIT when configuring the parent program.

[0064] ④ Next: After completing the above steps, click Next. A verification interface will pop up. In the verification interface, search for the created program directly by its name. If the corresponding subroutine and parent program are displayed, it means that the entire subroutine and parent program have been created successfully.

[0065] The above scheme enables the configuration of the master program based on the first master program name, the second master program name, the product type, and the resource configuration name. This allows the configured master program to control the upper board machine to rotate the even-numbered layer packaging substrate to the updated position, and simultaneously, to control the lower board machine to rotate the even-numbered layer laser-processed packaging substrate back to the initial position.

[0066] In some embodiments, after steps 1031D and 1031d, the method further includes: Step 1031X: In the manufacturing execution system, determine the processing request generated based on the subroutine and the parent program, determine a new configuration interface based on the processing request, and confirm the processing request based on the new configuration interface.

[0067] Step 1031Y: In the manufacturing execution system, the pre-configured subroutine is bound to the laser machine, and the pre-configured master program is bound to the upper and lower plate machines.

[0068] In practice, Figure 2H This is a schematic diagram of the request approval interface according to an embodiment of this disclosure. Figure 2H As shown, after configuring the subroutine and the parent program, the program needs to be activated to take effect. Specifically, clicking the newly developed Request Approval control button in the MES will bring up the Request Change Set Approval interface. After confirming that everything is correct, click the Request Approval control button. The Request Approval control will receive the instruction, and the configured production Recipe will take effect.

[0069] The above scheme involves defining processing requests generated by subroutines and master programs within the Manufacturing Execution System (MES). A new configuration interface is then created based on these requests, and the processing requests are confirmed through this interface. Pre-configured subroutines are bound to the laser engraving machine within the MES, and the pre-configured master program is bound to the upper and lower board mounting machines. This allows the pre-configured subroutines to control the laser engraving machine to perform laser processing on the packaged substrate. Simultaneously, the pre-configured master program controls the upper board mounting machine to rotate even-layer packaged substrates to a new position, and the pre-configured master program controls the lower board mounting machine to rotate even-layer laser-processed packaged substrates back to their initial position.

[0070] In some embodiments, step 1032 includes: Step 1032A: Obtain the target parent program name from the pre-configured parent program, and obtain the target subroutine name from the pre-configured subroutine.

[0071] Step 1032B: In response to determining that the target parent program name is the second parent program name and the target subroutine name is the second subroutine name, the packaging substrate to be processed is determined to be an even-numbered layer, and a rotation command is generated.

[0072] In practice, when the packaging substrate to be processed is an odd-numbered layer that does not require rotation, a first subroutine name without a suffix is ​​set (e.g., DOE_LAC_MTGTF4_BU01F); when the packaging substrate to be processed is an even-numbered layer that requires rotation, a second subroutine name with a suffix is ​​set (e.g., DOE_LAC_MTGTF4_BU01_ROT, where ROT is a suffix).

[0073] Additionally, when the packaging substrate to be processed is located on an odd-numbered layer that does not require rotation, a first master program name containing the first suffix POR is set (e.g., DOE_LAC_MTGTF4_BU01F_POR); when the packaging substrate to be processed is located on an even-numbered layer that requires rotation, a second master program name containing the second suffix ROTATION is set (e.g., DOE_LAC_MTGTF4_BU01F_ROTATION).

[0074] When the target parent program name is DOE_LAC_MTGTF4_BU01F_ROTATION and the target subroutine name is DOE_LAC_MTGTF4_BU01_ROT, it is determined that the package substrate to be processed has an even number of layers, and a rotation command is generated. The even number of layers in the package substrate can be determined based on the second suffix "ROTATION" in the target parent program name and the suffix "ROT" in the target subroutine name.

[0075] With the above scheme, when the target parent program name is the second parent program name and the target subroutine name is the second subroutine name, it is possible to quickly and accurately determine that the packaging substrate to be processed is an even-numbered layer and generate a rotation command, thereby controlling the even-numbered layer packaging substrate to rotate based on the rotation command.

[0076] Figure 2I This is a schematic diagram of the QP coordinates of the packaging substrate according to an embodiment of this disclosure. Figure 2I As shown, the packaging substrate is divided into four regions: QP1, QP2, QP3, and QP4. The coordinates of the four corner points on each QP are as follows: Figure 2I As shown. In QP1, the coordinates of point P1 are... The coordinates of point P2 are The coordinates of point P3 are The coordinates of point P4 are In QP2, the coordinates of point P5 are: The coordinates of point P6 are The coordinates of point P7 are The coordinates of point P8 are In QP3, the coordinates of point P9 are: The coordinates of point P10 are The coordinates of point P11 are The coordinates of point P12 are In QP4, the coordinates of point P13 are: The coordinates of point P14 are The coordinates of point P15 are: The coordinates of point P16 are .

[0077] On the packaging substrate, taking QP1 as an example, the expansion / contraction value between QP and QP is calculated as follows:

[0078] in, This indicates the expansion / contraction value of the QP1 region of the packaging substrate in the X direction. This represents the rate of expansion / contraction between point P3 and point P2 in the X direction. This represents the rate of expansion / contraction between point P4 and point P1 in the X direction.

[0079]

[0080] in, This represents the expansion / contraction value of the QP1 region of the packaging substrate in the Y direction. This represents the rate of expansion / contraction in the Y direction between points P2 and P1. This represents the rate of expansion / contraction in the Y direction between points P3 and P4.

[0081]

[0082] in, This represents the rate of expansion / contraction between point P3 and point P2 in the X direction. It can also be expressed as , This represents the actual coordinates of point P3 in the X direction. It can also be expressed as , This represents the actual coordinates of point P2 in the X direction. It can also be expressed as , This represents the normal coordinates of point P3 in the X direction. It can also be expressed as , This represents the normal coordinates of point P2 in the X direction.

[0083]

[0084] in, This represents the rate of expansion / contraction between point P4 and point P1 in the X direction. It can also be expressed as , This represents the actual coordinates of point P4 in the X direction. It can also be expressed as , This represents the actual coordinates of point P1 in the X direction. It can also be expressed as , This represents the normal coordinates of point P4 in the X direction. It can also be expressed as , This represents the normal coordinates of point P1 in the X direction.

[0085]

[0086] in, This represents the rate of expansion / contraction in the Y direction between points P2 and P1. It can also be expressed as , This represents the actual coordinates of point P2 in the Y direction. It can also be expressed as , This represents the actual coordinates of point P1 in the Y direction. It can also be expressed as , This represents the normal coordinates of point P2 in the Y direction. It can also be expressed as , This represents the normal coordinates of point P1 in the Y direction.

[0087]

[0088] in, This represents the rate of expansion / contraction in the Y direction between points P3 and P4. It can also be expressed as , This represents the actual coordinates of point P3 in the Y direction. It can also be expressed as , This represents the actual coordinates of point P4 in the Y direction. It can also be expressed as , This represents the normal coordinates of point P3 in the Y direction. It can also be expressed as , This represents the normal coordinates of point P4 in the Y direction.

[0089]

[0090] in, This represents the expansion / contraction deviation in the X direction between QP and QP. This indicates that the maximum expansion / contraction value in the X direction is taken from the four QPs of the packaging substrate. This indicates the minimum expansion / contraction value in the X direction taken from the four QPs of the packaging substrate.

[0091]

[0092] in, This represents the expansion / contraction deviation in the Y direction between QP and QP. This indicates that the maximum expansion / contraction value in the Y direction is taken from the four QPs of the packaging substrate. This indicates the minimum expansion / contraction value in the Y direction taken from the four QPs of the packaging substrate.

[0093] Similarly, on the packaging substrate, the expansion and contraction values ​​between QP and QP can be calculated based on QP2, QP3 and QP4, and can be obtained in the above calculation method.

[0094] The embodiments disclosed herein have the following technical effects: By rotating the packaging panel 180° during the laser processing of even-numbered layers such as BU02 layer, BU04 layer, BU06 layer...2n layer, the expansion and contraction deviation between QPs can be effectively solved, thereby improving the problem of product yield caused by expansion and contraction deviation after laser processing.

[0095] Figure 2J This is a schematic diagram showing the expansion and contraction values ​​of different areas of the packaging substrate after laser processing, before and after improvements according to embodiments of this disclosure. Figure 2J As shown, the design of an experiment (DOE) for the key technical solution of rotating the laser processing method by 180° according to the embodiments of this disclosure shows a significant improvement compared to the process before improvement. Two batches of the same packaging substrate were split for verification. In one batch, all layers were produced at the laser station according to the original processing method. The results after laser processing showed that due to the large difference in expansion and contraction between QPs, some QPs could not be completely covered by the subsequent stencil. In the other batch, even-numbered layers were laser-processed according to the technical solution of this disclosure by rotating the packaging substrate by 180°. The data after processing showed that by rotating the packaging substrate by 180° before laser processing, all QPs could be effectively and completely covered by the stencil. The technical solution of this disclosure can reduce the expansion and contraction value between QPs.

[0096] According to the technical solution of this disclosure, after the ABF film is applied to the packaging substrate for layering, the laser processing method of rotating the packaging substrate with even-numbered layers by 180° can effectively reduce the expansion and contraction deviation between QPs and improve the problem of low product yield caused by expansion and contraction deviation.

[0097] Through the above embodiments, a packaging substrate to be processed is obtained, and its layer number is determined. When the layer number is odd, laser processing is directly performed on the packaging substrate in the initial position. When the layer number is even, the packaging substrate to be processed is rotated by a first preset angle, controlling it to move from the initial position to a new position, and laser processing is performed on the packaging substrate in the new position. In this way, by rotating the packaging substrate of even-numbered layers, the areas of laser processing for odd-numbered and even-numbered layers are different, thereby reducing the expansion and contraction deviation between different areas of the packaging substrate and thus avoiding the impact on product yield due to excessive expansion and contraction deviation.

[0098] It should be noted that the method of this disclosure embodiment can be executed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method of this disclosure embodiment, and the multiple devices will interact with each other to complete the method described.

[0099] It should be noted that the above description describes some embodiments of this disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0100] Based on the same inventive concept, corresponding to any of the above embodiments, this disclosure also provides a laser processing apparatus for packaging substrates.

[0101] refer to Figure 3 The laser processing apparatus for the packaging substrate includes: The layer number determination module 301 is configured to acquire the packaging substrate to be processed and determine the layer number of the packaging substrate to be processed; The first laser processing module 302 is configured to directly perform laser processing on the packaging substrate to be processed in the initial position in response to determining that the number of layers is an odd number. The second laser processing module 303 is configured to, in response to determining that the layer number is an even number, rotate the packaging substrate to be processed by a first preset angle, control the packaging substrate to be processed to move from the initial position to the updated position, and perform laser processing on the packaging substrate to be processed at the updated position.

[0102] In some embodiments, the layer number determination module 301 includes: The acquisition unit is configured to acquire the packaging substrate to be processed and the substrate processing data; The layer number determination unit is configured to convert the substrate processing data into laser machine processing format data, and determine the layer number of the packaging substrate to be processed based on the laser machine processing format data.

[0103] In some embodiments, after determining the layer number of the packaging substrate to be processed based on the laser machine processing format data, the layer number determination module 301 further includes: The modification processing unit is configured to modify the coordinates of the anti-fool holes in the even-numbered layers of the laser machine processing format data to obtain updated processing data. The storage unit is configured to set a processing program name for the updated processing data and store the updated processing data according to a preset storage path.

[0104] In some embodiments, the second laser processing module 303 includes: The scanning processing unit is configured to scan the packaging substrate to be processed to obtain a pre-configured subroutine and a master program, wherein the pre-configured subroutine is bound to the laser machine, and the pre-configured master program is bound to the upper board machine and the lower board machine. The rotation instruction generation unit is configured to generate rotation instructions based on a pre-configured parent program and subroutine that identify the packaging substrate to be processed as having an even number of layers. The first rotation unit is configured to rotate the packaging substrate to be processed by the board mounting machine by a first preset angle based on the rotation command, and control the packaging substrate to be processed to move from the initial position to the updated position. A laser processing unit is configured to perform laser processing on the package substrate to be processed at the updated position using the laser machine. The second rotating unit is configured to rotate the packaging substrate to be processed by the unloading machine by a second preset angle, thereby controlling the packaging substrate to be processed to move from the updated position to the initial position.

[0105] In some embodiments, the apparatus further includes a subroutine configuration module, the subroutine configuration module comprising: The subroutine creation unit is configured to create a new subroutine using the manufacturing execution system and selects preset change items in the change set; The first subroutine name setting unit is configured to set the first subroutine name in response to determining that the number of the layer is an odd number. The second subroutine name setting unit is configured to set the second subroutine name in response to determining that the number of the current layer is an even number of layers; The subroutine configuration unit is configured to configure a newly created subroutine based on the first subroutine name, the second subroutine name, the product type, the storage path, and the processing program name.

[0106] In some embodiments, the apparatus further includes a master program configuration module, the master program configuration module comprising: The parent program creation unit is configured to create a new parent program using the manufacturing execution system; The first parent program name setting unit is configured to set the first parent program name in response to determining that the layer is an odd layer; The second parent program name setting unit is configured to set the second parent program name in response to determining that the layer is an even-numbered layer; The parent program configuration unit is configured to configure the newly created parent program based on the first parent program name, the second parent program name, the product type, and the resource configuration name.

[0107] In some embodiments, the rotation command generation unit includes: The sub-unit is configured to retrieve the target parent program name from a pre-configured parent program and the target subroutine name from a pre-configured subroutine. The rotation instruction generation subunit is configured to determine that the package substrate to be processed is an even-numbered layer in response to determining that the target parent program name is a second parent program name and the target subroutine name is a second subroutine name, and to generate a rotation instruction.

[0108] For ease of description, the above apparatus is described in terms of its functions, divided into various modules. Of course, in implementing this disclosure, the functions of each module can be implemented in one or more software and / or hardware.

[0109] The apparatus described above is used to implement the laser processing method for the corresponding packaging substrate in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0110] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this disclosure also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the laser processing method for the packaging substrate described in any of the above embodiments.

[0111] Figure 4 This embodiment illustrates a more specific hardware structure of an electronic device. The device may include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.

[0112] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0113] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.

[0114] The input / output interface 1030 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components within the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touchscreens, microphones, various sensors, etc., while output devices may include displays, speakers, vibrators, indicator lights, etc.

[0115] The communication interface 1040 is used to connect the communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB (Universal Serial Bus), network cable, etc.) or wireless means (such as mobile network, WIFI (Wireless Fidelity), Bluetooth, etc.).

[0116] Bus 1050 includes a pathway for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.

[0117] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0118] The electronic devices described above are used to implement the laser processing method for the corresponding packaging substrate in any of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0119] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this disclosure also provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to execute the laser processing method of the packaging substrate as described in any of the above embodiments.

[0120] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0121] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the laser processing method of the packaging substrate as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0122] Based on the same inventive concept, corresponding to any of the above embodiments, this application also provides a computer program product, including computer program instructions. When the computer program instructions are run on a computer, the computer causes the computer to execute the laser processing method for the packaging substrate as described in any of the above embodiments, which has the beneficial effects of the corresponding method embodiments, and will not be repeated here.

[0123] It is understood that before using the technical solutions of the various embodiments in this disclosure, users will be informed of the type, scope of use, and usage scenarios of the personal information involved in an appropriate manner, and user authorization will be obtained.

[0124] For example, upon receiving a user's active request, a prompt message is sent to the user to explicitly inform them that the requested operation will require the acquisition and use of the user's personal information. This allows the user to independently choose, based on the prompt message, whether to provide personal information to the software or hardware such as electronic devices, applications, servers, or storage media performing the operations of this disclosed technical solution.

[0125] As an optional but not limited implementation, in response to a user's active request, sending a prompt message to the user can be done via a pop-up window, where the prompt message can be presented in text format. Furthermore, the pop-up window can also include a selection control allowing the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0126] It is understood that the above notification and user authorization process are merely illustrative and do not constitute a limitation on the implementation of this disclosure. Other methods that comply with relevant laws and regulations may also be applied to the implementation of this disclosure.

[0127] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this disclosure is limited to these examples; within the framework of this disclosure, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this disclosure as described above, which are not provided in detail for the sake of brevity.

[0128] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this disclosure, the provided drawings may or may not show well-known power / ground connections to integrated circuit (IC) chips and other components. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this disclosure, and this also takes into account the fact that the details of implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this disclosure will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this disclosure, it will be apparent to those skilled in the art that the embodiments of this disclosure can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0129] Although this disclosure has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0130] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this disclosure. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A laser processing method for a packaging substrate, characterized in that, The method includes: Obtain the packaging substrate to be processed and determine the layer number of the packaging substrate to be processed; In response to determining that the layer number is an odd number, laser processing is directly performed on the packaging substrate to be processed in the initial position; In response to determining that the layer number is an even number, the packaging substrate to be processed is rotated by a first preset angle, the packaging substrate to be processed is controlled to move from the initial position to the updated position, and laser processing is performed on the packaging substrate to be processed at the updated position.

2. The method according to claim 1, characterized in that, The step of obtaining the packaging substrate to be processed and determining the layer number of the packaging substrate to be processed includes: Acquire the packaging substrate to be processed and the substrate processing data; The substrate processing data is converted into laser machine processing format data, and the layer number of the packaging substrate to be processed is determined based on the laser machine processing format data.

3. The method according to claim 2, characterized in that, After determining the layer number of the packaging substrate to be processed based on the laser machine processing format data, the method further includes: The coordinates of the anti-foolproof holes in the even-numbered layers of the laser machine processing format data are modified to obtain updated processing data; Set a processing program name for the updated processing data, and store the updated processing data according to a pre-defined storage path.

4. The method according to claim 3, characterized in that, In response to determining that the current layer number is an even number, the packaging substrate to be processed is rotated by a first preset angle, the packaging substrate to be processed is controlled to move from the initial position to the updated position, and laser processing is performed on the packaging substrate to be processed at the updated position, including: The packaging substrate to be processed is scanned to obtain a pre-configured subroutine and a master program. The pre-configured subroutine is bound to the laser machine, and the pre-configured master program is bound to the upper board machine and the lower board machine. Based on the pre-configured parent and child programs, the packaging substrate to be processed is identified as having an even number of layers, and a rotation command is generated. The loading machine rotates the packaging substrate to be processed by a first preset angle based on the rotation command, and controls the packaging substrate to be processed to move from the initial position to the updated position. The laser machine performs laser processing on the packaging substrate to be processed at the updated position; The unloading machine rotates the packaging substrate to be processed by a second preset angle, controlling the packaging substrate to be processed to move from the updated position to the initial position.

5. The method according to claim 4, characterized in that, The pre-configuration process of the subroutine includes: Create a new subroutine using the Manufacturing Execution System and select preset change items in the change set; In response to determining that the current layer number is an odd number, the name of the first subroutine is set; In response to determining that the current layer number is an even number, the name of the second subroutine is set; Configure the newly created subroutine based on the first subroutine name, the second subroutine name, the product type, the storage path, and the processing program name.

6. The method according to claim 4, characterized in that, The pre-configuration process of the parent program includes: Create a new master program using the Manufacturing Execution System; In response to determining that the layer in question is an odd-numbered layer, the first parent program name is set; In response to determining that the layer in question is an even-numbered layer, the second parent program name is set; Configure the newly created parent program based on the first parent program name, the second parent program name, the product type, and the resource configuration name.

7. The method according to claim 4, characterized in that, The pre-configured parent and child programs identify that the packaging substrate to be processed has an even number of layers, and generate rotation instructions, including: Obtain the target parent program name from the pre-configured parent program, and obtain the target subroutine name from the pre-configured subroutine; In response to determining that the target parent program name is the second parent program name and the target subroutine name is the second subroutine name, the packaging substrate to be processed is determined to be an even-numbered layer, and a rotation command is generated.

8. A laser processing apparatus for a packaging substrate, characterized in that, include: The layer number determination module is configured to acquire the packaging substrate to be processed and determine the layer number of the packaging substrate to be processed; The first laser processing module is configured to directly perform laser processing on the packaging substrate to be processed in the initial position in response to determining that the layer number is an odd number of layers; The second laser processing module is configured to, in response to determining that the layer number is an even number, rotate the packaging substrate to be processed by a first preset angle, control the packaging substrate to be processed to move from the initial position to the updated position, and perform laser processing on the packaging substrate to be processed at the updated position.

9. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the processor, when executing the program, implements the method as claimed in any one of claims 1 to 7.

10. A non-transitory computer-readable storage medium, characterized in that, The non-transitory computer-readable storage medium stores computer instructions for causing a computer to perform the method according to any one of claims 1 to 7.

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