VCSEL chip wafer batch transfer cleaning equipment and process

Abstract

The application discloses a VCSEL chip wafer batch transfer cleaning equipment and process, relates to the technical field of wafer cleaning, and comprises an outer machine body, a back plate, a table plate, a circulating cleaning box, a driving assembly and a plurality of clamping assemblies. The back plate and the table plate are arranged in the outer machine body, a square groove is formed in the table plate, the circulating cleaning box is located below the table plate, the driving assembly is slidably arranged on the back plate, and the plurality of clamping assemblies are arranged on the driving assembly. The clamping assembly clamps the wafer, the clamping arm clamps the edge of the wafer before the wafer is cleaned, the wedge-shaped protrusions at the bottom of the wedge-shaped push ring are used to start pushing the supporting arm downward, so that the soft pad on the supporting arm is separated from the surface of the wafer, and the clamping part does not affect the cleaning effect.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, specifically a batch transfer and cleaning equipment and process for VCSEL chip wafers. Background Technology

[0002] Vertical cavity surface-emitting laser (VCSEL) chips are widely used as core optoelectronic devices in fields such as 3D sensing, fiber optic communication, and lidar. The performance and reliability of wafers are highly dependent on the cleanliness of the manufacturing process. Therefore, wafer cleaning is a crucial back-end process. Traditional batch cleaning equipment usually uses a chuck at the end of a robotic arm to perform center adsorption or edge contact clamping on the wafers. However, this clamping method has some drawbacks.

[0003] Firstly, the adsorption components leave marks on the front or back of the wafer, affecting subsequent processes in that area. Traditional edge clamping may scratch the functional layers at the wafer edge due to concentrated contact area, and the obstructed areas can lead to incomplete cleaning of the clamping points. Secondly, during the cleaning process, particulate contaminants washed off the wafer surface gradually settle or suspend in the cleaning solution. Traditional static or low-speed overflow methods for updating the cleaning solution are inefficient and cannot effectively maintain the high cleanliness of the ultrapure water or chemical solution in the tank. As the number of cleaning batches increases, the concentration of impurities in the fluid in the tank increases, exacerbating the risk of cross-contamination on the wafer surface and resulting in unstable cleaning effects that cannot meet the stringent manufacturing requirements of high-end chips. Therefore, the industry needs a new type of batch transfer cleaning equipment that can continuously maintain a high-cleanliness cleaning environment. Summary of the Invention

[0004] The purpose of this invention is to provide a batch transfer and cleaning equipment and process for VCSEL chip wafers to solve the problems mentioned in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a VCSEL chip wafer batch transfer and cleaning device, comprising an external body, a backplate, a platform, a circulating cleaning tank, a drive assembly, and several clamping assemblies. The backplate and the platform are disposed in the external body. A square groove is formed on the platform. The circulating cleaning tank is located below the platform. The drive assembly is slidably mounted on the backplate. Several clamping assemblies are mounted on the drive assembly. The clamping assemblies clamp the wafers.

[0006] Furthermore, the circulating cleaning tank includes a water tank, an outlet pipe, a spiral tube, several filter tubes, a main return water pipe, a secondary return water pipe, and a water pump. The water tank has an outlet hole and a return water hole on opposite sides. The outlet hole is near the bottom of the water tank, and the return water hole is near the bottom of the water tank. The outlet pipe is connected to the outlet hole, and the main return water pipe is connected to the return water hole. The spiral tube is connected between the outlet pipe and the main return water pipe. During the wafer cleaning process, the water pump is started to circulate the water in the water tank. Impurities cleaned off the wafer sink to the bottom of the water tank, and impurities in the water tank are drawn out from the outlet pipe and flow into the spiral tube.

[0007] Furthermore, the water pump is connected to the end of the outlet pipe near the outlet hole. Each filter element tube is tangentially connected to each bend at the bottom of the spiral tube. Each filter element tube contains a replaceable filter element. The end of each filter element tube away from the spiral tube is connected to a secondary return water pipe. The end of the secondary return water pipe away from the filter element tube is connected to the outlet pipe. During the flow of water in the spiral tube, impurities are affected by centrifugal force and flow along the outer layer of the spiral tube. When passing through the bend at the bottom of the spiral tube, the impurities enter the filter element tube and are filtered by the filter element. The clean water flows to the outlet pipe through the secondary return water pipe to achieve circulation. The water in the spiral tube enters the water tank through the main return water pipe. By circulating the water in the tank, impurities are reduced. Then, the centrifugal characteristics of the spiral tube separate the impurities in the water, causing the impurities to flow out tangentially. After being filtered by the filter element, the impurities continue to flow back, realizing rapid circulation and filtration of the cleaning water. This achieves the technical effect of maintaining the cleanliness of the cleaning water, thereby improving the cleaning effect of the wafers.

[0008] Furthermore, the drive assembly includes a lifting module, a motor, a motor shaft, an eccentric fork frame, and an inner adapter frame. The lifting module is slidably connected to the back plate and is connected to a control system via a circuit. The motor is inverted and mounted on the lifting module. The motor shaft passes through the lifting module and is connected to the eccentric fork frame. The centerline of the motor shaft does not coincide with the center symmetry line of the eccentric fork frame. The inner adapter frame is rotatably mounted below the eccentric fork frame. The wafer feeding device uses a suction cup to move the wafer to be cleaned onto the support arm of each clamping assembly. After the clamping arm firmly clamps the wafer, the lifting module drives the motor to lower... As the motor descends, the eccentric fork-shaped frame and the inner adapter frame descend, immersing the clamping components and wafers in the water tank. At this time, the motor is powered on, causing the motor shaft to rotate, and the eccentric fork-shaped frame begins to rotate. Since the transfer center between the inner adapter frame and the eccentric fork-shaped frame is located on the central symmetry line of the eccentric fork-shaped frame, while the axis of the motor shaft does not coincide with the central symmetry line of the eccentric fork-shaped frame, the centrifugal forces on both sides of the inner adapter frame become unbalanced during the rotation of the eccentric fork-shaped frame. This causes the inner adapter frame to tilt, and the linear velocity of the rear end of the tilted inner adapter frame increases, which in turn increases the speed of the water flow, enhancing the cleaning force of the wafers and improving cleaning efficiency.

[0009] Furthermore, several clamping assemblies are vertically and evenly distributed in the inner adapter frame. Several partitions are provided between every two adjacent clamping assemblies. Each clamping assembly includes a platform housing, two sets of displacement mechanisms, and a double-headed arc-shaped electric actuator. The platform housing is horseshoe-shaped. Each platform housing has four bottom transfer grooves symmetrically opened at the bottom and four side transfer grooves symmetrically opened on the inner ring of each platform housing. The two sets of displacement mechanisms are symmetrically arranged in the platform housing. The double-headed arc-shaped electric actuator is located inside the platform housing and pushes the two sets of displacement mechanisms to move.

[0010] Furthermore, each set of the displacement mechanism includes a pair of support arms and a pair of clamping arms. The pair of support arms are rotatably mounted in the bottom transition groove, and the pair of clamping arms are rotatably mounted in the side transition groove. Both support arms and the two clamping arms are provided with soft pads. Each clamping arm is provided with a small gear at the transition point between the side transition groove and the clamping arm. Each support arm is provided with a reset coil spring at the transition point between the bottom transition groove and the clamping arm. When the wafer is moved onto the support arm, the double-headed arc-shaped electric push rod pushes the wedge-shaped push rings on both sides to move. The wedge-shaped push rings abut against the stop block through the thrust spring. Therefore, when the wedge-shaped push rings start to move, the gear rings also move at the same time. The gear rings drive the clamping arms to rotate through the small gears. The four clamping arms on both sides of the tray housing rotate simultaneously to clamp the edge of the wafer.

[0011] Furthermore, each displacement mechanism also includes a gear ring and a wedge-shaped push ring. Both the gear ring and the wedge-shaped push ring are slidably disposed in the tray housing. The gear ring meshes with two small gears. The bottom of the wedge-shaped push ring is provided with two wedge-shaped protrusions. The bottom of the wedge-shaped push ring slides in contact with the two support arms. The push rod of the double-headed arc-shaped electric push rod is connected to the wedge-shaped push ring. After the four clamping arms have firmly clamped the wafer, the clamping arms can no longer rotate, and the wedge-shaped push ring can continue to slide. At this time, the thrust spring is compressed, and the wedge-shaped protrusions at the bottom of the wedge-shaped push ring begin to push the support arms downward, so that the soft pads on the support arms leave the surface of the wafer, avoiding the clamping part from affecting the cleaning effect.

[0012] Furthermore, a stop is provided at the bottom of the toothed ring, and a groove is provided on the wedge-shaped push ring. The stop is located in the groove of the wedge-shaped push ring, and a thrust spring is provided between the stop and the groove. After cleaning is completed, the motor stops, the lifting module lifts the wafer from the water tank, the double-headed arc-shaped electric push rod pulls the wedge-shaped push rings on both sides to move back, the support arm first resets, the soft pad supports the wafer from the bottom, the thrust spring is released from the compressed state and pulls the toothed ring to move, the toothed ring drives the clamping arm to rotate through the pinion gear, and the four clamping arms on both sides of the support shell rotate at the same time and retract into the side transfer groove, and the wafer cleaning is completed.

[0013] A batch transfer and cleaning process for VCSEL chip wafers includes the following steps:

[0014] S1: The wafer feeding device transfers the wafers to be cleaned onto several clamping assemblies;

[0015] S2: The double-headed arc-shaped electric actuator pushes two sets of displacement mechanisms to move, the clamping arm clamps the wafer, and the support arm leaves the wafer;

[0016] S3: The lifting module drives the clamping assembly to descend, immersing the wafer in the water tank;

[0017] S4: The motor drives the inner adapter to rotate through the eccentric fork frame, and the wafer rotates and is cleaned in the water tank;

[0018] S5: Start the water pump to circulate the water in the water tank, and the filter tube filters the water in the tank.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] 1. By circulating the water in the tank to reduce impurities, and then using the centrifugal properties of the spiral tube to separate the impurities in the water, the impurities flow out tangentially. After being filtered by the filter element, the water continues to flow back, achieving rapid circulation and filtration of the cleaning water. This achieves the technical effect of maintaining the cleanliness of the cleaning water, thereby improving the cleaning effect of the wafers.

[0021] 2. By utilizing the imbalance of centrifugal forces on both sides of the inner adapter during the rotation of the eccentric fork frame, the inner adapter is tilted. The linear velocity of the rear end of the tilted inner adapter increases, and the speed of the water flow also increases, thereby enhancing the cleaning force of the wafer and improving the cleaning efficiency.

[0022] 3. Before cleaning the wafer, the clamping arm clamps its edge, and then the wedge-shaped protrusion at the bottom of the wedge-shaped push ring pushes the support arm downward, so that the soft pad on the support arm leaves the surface of the wafer, avoiding the clamping part from affecting the cleaning effect. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall appearance and structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the internal structure of the present invention. Figure 1 ;

[0025] Figure 3 This is a schematic diagram of the internal structure of the present invention. Figure 2 ;

[0026] Figure 4 This is a schematic diagram of the internal structure of the present invention. Figure 3 ;

[0027] Figure 5 This is a schematic diagram of the clamping component structure of the present invention. Figure 1 ;

[0028] Figure 6 This is a schematic diagram of the clamping component structure of the present invention. Figure 2 ;

[0029] Figure 7 This is a schematic diagram of the clamping component structure of the present invention. Figure 3 .

[0030] In the diagram: 1. External unit; 2. Back panel; 3. Platform; 4. Water tank; 5. Outlet pipe; 6. Spiral pipe; 7. Filter tube; 8. Main return pipe; 9. Auxiliary return pipe; 10. Water pump; 11. Lifting module; 12. Motor; 13. Motor shaft; 14. Eccentric fork frame; 15. Inner adapter frame; 16. Platform housing; 17. Spacer; 18. Support arm; 19. Soft pad; 20. Clamping arm; 21. Pinion; 22. Gear ring; 23. Wedge-shaped push ring; 24. Stop block; 25. Thrust spring; 26. Double-headed arc-shaped electric actuator. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Example: Figures 1-7 As shown, the present invention provides a technical solution: a VCSEL chip wafer batch transfer and cleaning device, including an outer body 1, a back plate 2, a platform 3, a circulating cleaning box, a drive assembly, and several clamping assemblies. The back plate 2 and the platform 3 are disposed in the outer body 1. A square groove is formed on the platform 3. The circulating cleaning box is located below the platform 3. The drive assembly is slidably mounted on the back plate 2. Several clamping assemblies are mounted on the drive assembly. The clamping assemblies clamp the wafers.

[0033] The circulating cleaning tank includes a water tank 4, an outlet pipe 5, a spiral pipe 6, several filter cartridges 7, a main return pipe 8, a secondary return pipe 9, and a water pump 10. The water tank 4 has an outlet and a return hole on opposite sides, with the outlet near the bottom and the return hole near the bottom of the tank. The outlet pipe 5 connects to the outlet, and the main return pipe 8 connects to the return hole. The spiral pipe 6 connects between the outlet pipe 5 and the main return pipe 8. The water pump 10 is connected to the end of the outlet pipe 5 near the outlet. Each filter cartridge 7 is tangentially connected to each bend at the bottom of the spiral pipe 6. Each filter cartridge 7 contains a replaceable filter cartridge. The end of each filter cartridge 7 furthest from the spiral pipe 6 is connected to the secondary return pipe 9, and the end of the secondary return pipe 9 furthest from the filter cartridge 7 is connected to the outlet pipe 5. During wafer cleaning, the water pump 10 is activated to circulate the water in the water tank 4. Impurities removed from the wafer during cleaning settle to the bottom of water tank 4. These impurities are then drawn from water outlet pipe 5 and flow into spiral tube 6. As the water flows through spiral tube 6, the impurities are affected by centrifugal force, adhering to the outer layer of spiral tube 6. Upon reaching the bend at the bottom of spiral tube 6, the impurities enter filter tube 7 and are filtered. The purified water flows back to water outlet pipe 5 via secondary return pipe 9, achieving circulation. Water in spiral tube 6 enters water tank 4 via main return pipe 8. This circulation reduces impurities, and the centrifugal properties of spiral tube 6 separate impurities from the water flow, causing them to flow out tangentially. After being filtered again by the filter element, the water continues to flow back, achieving rapid circulation and filtration of the cleaning water. This maintains the cleanliness of the cleaning water, thereby improving the cleaning effect on the wafers.

[0034] The drive assembly includes a lifting module 11, a motor 12, a motor shaft 13, an eccentric fork frame 14, and an inner adapter frame 15. The lifting module 11 is slidably connected to the back plate 2. The lifting module 11 is connected to a control system via a circuit. The motor 12 is mounted upside down on the lifting module 11. The motor shaft 13 passes through the lifting module 11 and is connected to the eccentric fork frame 14. The axis of the motor shaft 13 does not coincide with the center symmetry line of the eccentric fork frame 14. The inner adapter frame 15 is rotatably mounted below the eccentric fork frame 14. The wafer feeding device uses a suction cup to move the wafers to be cleaned onto the support arms 18 of each clamping assembly. After the clamping arms 20 firmly clamp the wafers, the lifting module 11 drives the motor 12 to descend. As the motor 12 descends, the fork-shaped frame 14 and the inner adapter frame 15 are submerged in the water tank 4, and the clamping components and wafers are immersed in the water tank. At this time, the motor 12 is powered on, driving the motor shaft 13 to rotate, and the eccentric fork-shaped frame 14 begins to rotate. Since the transfer center of the inner adapter frame 15 and the eccentric fork-shaped frame 14 is located on the central symmetry line of the eccentric fork-shaped frame 14, while the axis of the motor shaft 13 does not coincide with the central symmetry line of the eccentric fork-shaped frame 14, the centrifugal forces on both sides of the inner adapter frame 15 are unbalanced during the rotation of the eccentric fork-shaped frame 14, which in turn causes the inner adapter frame 15 to tilt. The linear velocity of the rear end of the tilted inner adapter frame 15 increases, and the speed of the water flow also increases, which enhances the cleaning force of the wafers and improves the cleaning efficiency.

[0035] Several clamping assemblies are vertically and evenly distributed in the inner adapter frame 15. Several partitions 17 are provided between every two adjacent clamping assemblies. Each clamping assembly includes a platform housing 16, two sets of displacement mechanisms, and a double-headed arc-shaped electric actuator 26. The platform housing 16 is horseshoe-shaped, with four bottom transfer grooves symmetrically opened at the bottom of each platform housing 16 and four side transfer grooves symmetrically opened on the inner ring of each platform housing 16. The two sets of displacement mechanisms are symmetrically arranged in the platform housing 16, and the double-headed arc-shaped electric actuator 26 is located inside the platform housing 16. The double-headed arc-shaped electric actuator 26 pushes the two sets of displacement mechanisms to move. Each set of displacement mechanisms includes a pair of support arms 18 and a pair of clamping arms 20. The pair of support arms 18 are rotatably mounted in the bottom transfer groove. A pair of clamping arms 20 are rotatably mounted in the side transition groove. Soft pads 19 are provided on both the two support arms 18 and the two clamping arms 20. A small gear 21 is provided at the transition point between each clamping arm 20 and the side transition groove. A reset coil spring (not shown in the figure) is provided at the transition point between each support arm 18 and the bottom transition groove. When the wafer is moved onto the support arm 18, the double-headed arc-shaped electric push rod 26 pushes the wedge-shaped push rings 23 on both sides to move. The wedge-shaped push rings 23 abut against the stop block 24 through the thrust spring 25. Therefore, when the wedge-shaped push rings 23 start to move, the toothed ring 22 also moves at the same time. The toothed ring 22 drives the clamping arms 20 to rotate through the small gear 21. The four clamping arms 20 on both sides of the tray housing 16 rotate at the same time to clamp the edge of the wafer.

[0036] Each displacement mechanism also includes a gear ring 22 and a wedge-shaped push ring 23. Both the gear ring 22 and the wedge-shaped push ring 23 are slidably disposed in the support housing 16. The gear ring 22 meshes with two pinions 21. The bottom of the wedge-shaped push ring 23 is provided with two wedge-shaped protrusions. The bottom of the wedge-shaped push ring 23 is in sliding contact with the two support arms 18. The push rod of the double-headed arc-shaped electric push rod 26 is connected to the wedge-shaped push ring 23. The bottom of the gear ring 22 is provided with a stop block 24. The wedge-shaped push ring 23 has a sliding groove. The stop block 24 is located in the sliding groove of the wedge-shaped push ring 23. A thrust spring 25 is provided between the stop block 24 and the sliding groove. After the four clamping arms 20 have firmly clamped the wafer, the clamping arms 20 can no longer rotate, and the wedge-shaped push ring 23 can continue to slide. At this time, the thrust spring 25 is compressed, and the wedge-shaped protrusion at the bottom of the wedge-shaped push ring 23 begins to push the support arm 18 downward, so that the soft pad 19 on the support arm 18 leaves the surface of the wafer, avoiding the clamping part from affecting the cleaning effect. When the cleaning is completed, the motor 12 stops, the lifting module 11 lifts the wafer out of the water tank 4, the double-headed arc-shaped electric push rod 26 pulls the wedge-shaped push rings 23 on both sides to move back, the support arm 18 first resets, the soft pad 19 supports the wafer from the bottom, the thrust spring 25 is released from the compressed state and pulls the toothed ring 22 to move, the toothed ring 22 drives the clamping arm 20 to rotate through the pinion 21, and the four clamping arms 20 on both sides of the tray housing 16 rotate at the same time and retract into the side transfer groove, and the wafer cleaning is completed.

[0037] The working principle of this invention is as follows: When the wafer is transferred to the support arm 18, the double-headed arc-shaped electric push rod 26 pushes the wedge-shaped push rings 23 on both sides to move. The wedge-shaped push rings 23 abut against the stop block 24 through the thrust spring 25. Therefore, when the wedge-shaped push rings 23 start to move, the toothed ring 22 also moves at the same time. The toothed ring 22 drives the clamping arm 20 to rotate through the pinion 21. The four clamping arms 20 on both sides of the tray housing 16 rotate at the same time to clamp the edge of the wafer. After the four clamping arms 20 have clamped the wafer firmly, the clamping arms 20 can no longer rotate, and the wedge-shaped push rings 23 can continue to slide. At this time, the thrust spring 25 is compressed, and the wedge-shaped protrusion at the bottom of the wedge-shaped push ring 23 begins to push the support arm 18 downward, so that the soft pad 19 on the support arm 18 leaves the surface of the wafer, avoiding the clamping part from affecting the cleaning effect.

[0038] The lifting module 11 drives the motor 12 to descend. The eccentric fork frame 14 and the inner adapter frame 15 descend with the motor 12, and the clamping components and wafers are immersed in the water tank 4. At this time, the motor 12 is powered on and drives the motor shaft 13 to rotate. The eccentric fork frame 14 begins to rotate. Since the transfer center of the inner adapter frame 15 and the eccentric fork frame 14 is located on the central symmetry line of the eccentric fork frame 14, while the axis of the motor shaft 13 does not coincide with the central symmetry line of the eccentric fork frame 14, the centrifugal forces on both sides of the inner adapter frame 15 are unbalanced during the rotation of the eccentric fork frame 14. This causes the inner adapter frame 15 to tilt. The linear velocity of the rear end of the tilted inner adapter frame 15 increases, and the speed of the water flow also increases, which enhances the cleaning force of the wafers and improves the cleaning efficiency.

[0039] During wafer cleaning, water pump 10 is activated to circulate the water in water tank 4. Impurities removed from the wafer settle to the bottom of water tank 4. The impurities in water tank 4 are drawn out from water outlet pipe 5 and flow into spiral tube 6. As the water flows in spiral tube 6, the impurities are affected by centrifugal force and flow along the outer layer of spiral tube 6. When passing the bend at the bottom of spiral tube 6, the impurities enter filter tube 7 and are filtered by the filter element. The clean water flows back to water outlet pipe 5 through auxiliary return water pipe 9 to achieve circulation. The water in spiral tube 6 enters water tank 4 through main return water pipe 8. By circulating the water in water tank 4, impurities are reduced. Then, the centrifugal characteristics of spiral tube 6 are used to separate the impurities in the water, causing the impurities to flow out tangentially. After being filtered by the filter element, the water continues to flow back, achieving rapid circulation and filtration of cleaning water. This achieves the technical effect of maintaining the cleanliness of the cleaning water, thereby improving the cleaning effect of the wafers.

[0040] After cleaning is completed, the motor 12 stops, the lifting module 11 lifts the wafer from the water tank 4, the double-headed arc-shaped electric push rod 26 pulls the wedge-shaped push rings 23 on both sides to move back, the support arm 18 first resets, the soft pad 19 supports the wafer from the bottom, the thrust spring 25 is released from the compressed state and pulls the toothed ring 22 to move, the toothed ring 22 drives the clamping arm 20 to rotate through the pinion 21, the four clamping arms 20 on both sides of the tray housing 16 rotate at the same time and retract into the side transfer groove, and the wafer cleaning is completed.

[0041] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A batch transfer and cleaning device for VCSEL chip wafers, characterized in that: The device includes an outer casing (1), a back plate (2), a platform (3), a circulating cleaning box, a drive assembly, and several clamping assemblies. The back plate (2) and the platform (3) are disposed in the outer casing (1). A square groove is provided on the platform (3). The circulating cleaning box is located below the platform (3). The drive assembly is slidably mounted on the back plate (2). Several clamping assemblies are mounted on the drive assembly. The clamping assemblies clamp the wafer. The circulating cleaning tank includes a water tank (4), a water outlet pipe (5), a spiral pipe (6), several filter tubes (7), a main return water pipe (8), a secondary return water pipe (9), and a water pump (10). The water tank (4) has a water outlet and a return water hole on opposite sides. The water outlet is close to the bottom of the water tank (4), and the return water hole is close to the bottom of the water tank (4). The water outlet pipe (5) is connected to the water outlet, the main return water pipe (8) is connected to the return water hole, and the spiral pipe (6) is connected between the water outlet pipe (5) and the main return water pipe (8). The water pump (10) is connected to the end of the outlet pipe (5) near the outlet hole. Each filter element tube (7) is tangentially connected to each bend at the bottom of the spiral tube (6). Each filter element tube (7) is provided with a replaceable filter element. The end of each filter element tube (7) away from the spiral tube (6) is connected to a secondary return water pipe (9). The end of the secondary return water pipe (9) away from the filter element tube (7) is connected to the outlet pipe (5).

2. The VCSEL chip wafer batch transfer and cleaning equipment according to claim 1, characterized in that: The drive assembly includes a lifting module (11), a motor (12), a motor shaft (13), an eccentric fork frame (14), and an inner adapter frame (15). The lifting module (11) is slidably connected to the back plate (2). The lifting module (11) is connected to a control system via a circuit. The motor (12) is installed upside down on the lifting module (11). The motor shaft (13) passes through the lifting module (11) and is connected to the eccentric fork frame (14). The axis of the motor shaft (13) does not coincide with the center symmetry line of the eccentric fork frame (14). The inner adapter frame (15) is rotatably installed below the eccentric fork frame (14).

3. The VCSEL chip wafer batch transfer and cleaning equipment according to claim 2, characterized in that: Several clamping components are vertically and evenly distributed in the inner adapter frame (15). Several partitions (17) are provided between each two adjacent clamping components. Each clamping component includes a platform housing (16), two sets of displacement mechanisms, and a double-headed arc-shaped electric actuator (26). The platform housing (16) is horseshoe-shaped. Each platform housing (16) has four bottom transfer grooves symmetrically opened at the bottom and four side transfer grooves symmetrically opened in the inner circle of each platform housing (16). The two sets of displacement mechanisms are symmetrically arranged in the platform housing (16). The double-headed arc-shaped electric actuator (26) is located inside the platform housing (16). The double-headed arc-shaped electric actuator (26) pushes the two sets of displacement mechanisms to move.

4. The VCSEL chip wafer batch transfer and cleaning equipment according to claim 3, characterized in that: Each set of the displacement mechanism includes a pair of support arms (18) and a pair of clamping arms (20). The pair of support arms (18) are rotatably mounted in the bottom transition groove, and the pair of clamping arms (20) are rotatably mounted in the side transition groove. A soft pad (19) is provided on both the two support arms (18) and the two clamping arms (20). A small gear (21) is provided at the transition point between each clamping arm (20) and the side transition groove. A reset coil spring is provided at the transition point between each support arm (18) and the bottom transition groove.

5. The VCSEL chip wafer batch transfer and cleaning equipment according to claim 4, characterized in that: Each displacement mechanism also includes a toothed ring (22) and a wedge-shaped push ring (23). The toothed ring (22) and the wedge-shaped push ring (23) are slidably disposed in the support housing (16). The toothed ring (22) meshes with two small gears (21). The bottom of the wedge-shaped push ring (23) is provided with two wedge-shaped protrusions. The bottom of the wedge-shaped push ring (23) slides in contact with two support arms (18). The push rod of the double-headed arc-shaped electric push rod (26) is connected to the wedge-shaped push ring (23).

6. The VCSEL chip wafer batch transfer and cleaning equipment according to claim 5, characterized in that: The bottom of the toothed ring (22) is provided with a stop (24), the wedge-shaped push ring (23) is provided with a sliding groove, the stop (24) is located in the sliding groove of the wedge-shaped push ring (23), and a thrust spring (25) is provided between the stop (24) and the sliding groove.

7. A cleaning process applicable to the VCSEL chip wafer batch transfer and cleaning equipment as described in claim 6, characterized in that: Includes the following steps: S1: The wafer feeding device transfers the wafers to be cleaned onto several clamping assemblies; S2: The double-headed arc-shaped electric push rod (26) pushes the two sets of displacement mechanisms to move, the clamping arm (20) clamps the wafer, and the support arm (18) leaves the wafer; S3: The lifting module (11) drives the clamping assembly to descend, immersing the wafer in the water tank (4); S4: The motor (12) drives the inner adapter (15) to rotate through the eccentric fork frame (14), and the wafer rotates and is cleaned in the water tank (4); S5: Start the water pump (10) to circulate the water in the water tank (4), and the filter tube (7) filters the water in the water tank (4).

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