A pick-and-place assembly and die bonder

Abstract

The present application relates to the technical field of die bonding, and particularly relates to a mounting assembly and a die bonding device. The mounting assembly comprises a first fixing seat, first and second fixing plates are arranged on the first fixing seat at intervals, a first driving member is mounted on the first fixing plate, a second driving member is mounted on the second fixing plate, a load mechanism is mounted on the first driving member, and a mounting mechanism is mounted on the second driving member. The load mechanism and the mounting mechanism move towards each other or move away from each other under the driving of the first and second driving members. The vibration generated in the movement of the mounting mechanism is offset by the reverse movement of the load mechanism, so that the mounting precision is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonding, in particular to a mounting assembly and a die bonding device. BACKGROUND

[0002] Die bonding refers to a process of bonding new products to a specified area of a substrate by a colloid to form a via or a point via, thereby providing conditions for subsequent wire bonding. In implementing this process, a mounting mechanism is usually moved to a chip placement position to adsorb the chip, and then moved to the substrate for mounting. During the mounting movement of the mounting mechanism, frequent acceleration and deceleration movements are involved. The change in acceleration will cause vibration of the mounting mechanism, thereby reducing the precision of chip mounting. SUMMARY

[0003] To solve the technical problem of low chip mounting precision, the present application provides a mounting assembly and a die bonding device.

[0004] The technical problem of the present application is solved by providing a mounting assembly, which comprises a first fixed seat, a first fixed plate and a second fixed plate are arranged at intervals on the first fixed seat, a first driving member is installed on the first fixed plate, a second driving member is installed on the second fixed plate, a load mechanism is installed on the first driving member, a mounting mechanism is installed on the second driving member, and the load mechanism and the mounting mechanism move towards or away from each other under the drive of the first driving member and the second driving member; the mounting mechanism comprises a binding head device, the binding head device comprises a force control detection module, the force control detection module comprises a reference block, a photoelectric sensor and a signal amplifier, the signal amplifier is signal connected with the photoelectric sensor, the photoelectric sensor can emit a light source to the top surface of the reference block, and the signal amplifier determines the height change of the reference block by detecting the change in the amount of light reflected and received when the chip contacts the substrate.

[0005] Preferably, the first fixed plate and the second fixed plate are arranged in line along the length direction thereof, and the first fixed plate and the second fixed plate are both perpendicular to the first fixed seat; the first fixed plate is provided with a first sliding rail along the length direction thereof, the second fixed plate is provided with a second sliding rail along the length direction thereof, and the load mechanism and the mounting mechanism are respectively connected with the first sliding rail and the second sliding rail in sliding connection.

[0006] Preferably, the second fixed plate is provided with a third sliding rail, the third sliding rail is provided with a third driving member, the third driving member is installed with a third fixed plate, and the third fixed plate is fixedly connected with the second sliding rail; the third sliding rail is perpendicular to the second sliding rail, and the second sliding rail and the third sliding rail are connected in sliding connection through the third fixed plate.

[0007] Preferably, the second fixed plate is provided with a avoiding slot on the side facing the third fixed plate, the third fixed plate comprises a first connecting part and a second connecting part, the first connecting part is fixedly connected with the third driving part, and the second connecting part is fixedly connected with the second sliding rail; a reinforcing rib is arranged between the first connecting part and the second connecting part, and the reinforcing rib is in clearance fit with the avoiding slot.

[0008] Preferably, the attaching mechanism comprises a binding head device, the binding head device comprises a force control detection module, a force control driving module and an attaching module; the force control detection module comprises a reference block, a photoelectric sensor and a signal amplifier, the signal amplifier is signal connected with the photoelectric sensor; the attaching module comprises a main shaft and a main shaft seat, two ends of the main shaft are a transmission end and a working end respectively, the main shaft is arranged in the main shaft seat, and the main shaft can move up and down relative to the main shaft seat, and the working end of the main shaft is exposed to the main shaft seat; the top end of the reference block is connected with the force control driving module, and the bottom end of the reference block is connected with the transmission end of the main shaft; the photoelectric sensor is arranged in the main shaft seat, one end of a light source emitted by the photoelectric sensor extends into the inside of the main shaft seat, the other end of the photoelectric sensor is connected to the signal amplifier, the photoelectric sensor can emit a light source to the top surface of the reference block, and when a chip contacts a substrate, the signal amplifier determines the height variation of the reference block by detecting the change of the amount of light reflected and received by the light source.

[0009] Preferably, the photoelectric sensor is arranged at an inclination angle θ with the top surface of the reference block, and the light source emitted by the photoelectric sensor is aligned with the middle region of the top surface of the reference block, the inclination angle θ ranges from 0° to 90°, and the photoelectric sensor is one of a fiber sensor, a laser ranging sensor, a grating sensor and an infrared sensor.

[0010] To solve the above technical problems, the present application provides another technical solution as follows: a die bonding device, comprising a control assembly, a track assembly and a first fixing seat, the track assembly and the first fixing seat are arranged side by side, the first fixing seat is sequentially provided with a dispensing assembly, a lower vision assembly and the attaching assembly as claimed in any one of the above along the length direction, the track assembly is provided with an upper feeding assembly and a lower discharging assembly at both ends, the track assembly is provided with a wafer assembly on the side away from the first fixing seat, and the wafer assembly and the attaching assembly are in position correspondence; the control assembly is signal connected with the track assembly, the upper feeding assembly, the dispensing assembly, the lower vision assembly, the wafer assembly, the attaching assembly and the lower discharging assembly respectively.

[0011] Preferably, the point gluing assembly comprises a second visual detector, a first base, a horizontal driving element arranged at the bottom of the first base, a vertical driving element arranged at the side of the first base, and a dust removal mechanism and / or a point gluing mechanism arranged at the side of the first base away from the vertical driving element, the second visual detector is used to identify the micro dust on the substrate; the point gluing mechanism comprises a first visual detector and a point gluing head, the first visual detector and the point gluing head are signal connected, the dust removal mechanism comprises a storage tank, an air pipe and a dust removal head, the dust removal head is provided with an adsorption air path and a blowing air path, one end of the air pipe is connected with the storage tank, and the other end is connected with the adsorption air path; the vertical driving element is fixed with a mounting bracket, the mounting bracket comprises first and second mounting plates arranged at intervals, the first mounting plate is fixedly connected with the vertical driving element away from the second mounting plate, the first visual detector is fixed between the first and second mounting plates, the storage tank is fixed at the side of the first mounting plate, and the second mounting plate is provided with the point gluing head and / or the dust removal head away from the first mounting plate.

[0012] Preferably, the track assembly comprises a second fixing base, a first guide rail fixedly installed on the second fixing base, and a second guide rail movably installed on the second fixing base and arranged at intervals with the first guide rail, the opposite sides of the first guide rail and the second guide rail are provided with first bosses, the first bosses are arranged along the length direction of the track assembly, and the first bosses are used to carry the substrate transported from the feeding assembly; the side of the second fixing base away from the first guide rail is provided with a limit sensor, the limit sensor is signal connected with the control assembly, and when the second guide rail moves to a distance less than a preset threshold value from the limit sensor, the control assembly controls the second guide rail to stop moving.

[0013] Preferably, the second fixing base is further provided with a heating table, the heating table is located between the first guide rail and the second guide rail, the heating table is sequentially provided with first, second and third heating zones along the length direction of the track assembly; the first guide rail and / or the second guide rail is provided with a pressing block at a position corresponding to the heating table, the pressing block can move axially relative to the heating table to fix the substrate on the heating table; and the heating table is provided with a vacuum adsorption channel for adsorbing the substrate.

[0014] Compared with the prior art, the provided point gluing assembly and die bonding equipment have the following advantages:

[0015] 1、The embodiment of the present application provides a mounting assembly, by movably mounting a load mechanism on a first fixed plate and movably mounting a mounting mechanism on a second fixed plate, the load mechanism and the mounting mechanism on the first fixed plate and the second fixed plate can move towards or away from each other, so that the center of gravity of the mounting assembly 4 is not offset, to offset the vibration generated by the mounting mechanism during acceleration or deceleration, and the motion stability and precision of the mounting mechanism are improved.

[0016] 2、The mounting assembly provided by the embodiment of the present application, by the design of the first fixed plate and the second fixed plate being collinear and perpendicular to the first fixed seat, cooperating with the slide rails arranged along the respective length directions, provides stable linear motion guidance for the load mechanism and the mounting mechanism, effectively reduces the lateral deviation during motion, and improves the mounting precision; at the same time, the slide rail connection mode can also reduce the motion resistance, so that the mechanism responds more quickly and can adapt to the mounting rhythm more quickly.

[0017] 3、The mounting assembly provided by the embodiment of the present application, the third slide rail on the second fixed plate is perpendicular to the second slide rail, the second slide rail is moved by the third driving piece, so that the mounting mechanism increases a motion dimension and can cover more mounting positions on the substrate; the second slide rail and the third slide rail are connected by the third fixed plate, realizing flexible conversion of the motion direction of the mounting machine, so that it can realize two-dimensional plane motion, and the structure is compact and does not occupy too much space.

[0018] 4、The mounting assembly provided by the embodiment of the present application, the avoiding groove of the second fixed plate provides space for the motion of the third fixed plate, avoids structural interference, and ensures that the third fixed plate can move smoothly; the setting of the reinforcing rib enhances the overall rigidity of the third fixed piece, so that when bearing the mounting mechanism, it can reduce the deformation caused by motion inertia and ensure the mounting precision; the gap cooperation of the reinforcing rib and the avoiding groove further improves the smoothness of the motion.

[0019] 5. The mounting assembly provided in this embodiment of the invention includes a force control detection module, a force control drive module, and a mounting module. In the force control detection module, a photoelectric sensor emits a light source to the top surface of the reference block. When the chip contacts the substrate, the signal amplifier detects the change in the amount of light reflected and received by the light source to determine the change in the height of the reference block, and provides real-time feedback on the force on the spindle drive end. The non-contact measurement method has the characteristics of high sensitivity and anti-electromagnetic interference. By detecting the change in the amount of light reflected and received by the light source in two cases, before the chip contacts the substrate and when the chip contacts the substrate, the positioning detection when the chip contacts the substrate can be realized. In addition, the pressure change before and after the chip contacts the substrate during the mounting process is fed back to ensure that the mounting force at the spindle working end is uniform and meets the process requirements, avoiding overpressure damage to the chip or underpressure leading to poor bonding. The top of the reference block is connected to the force control drive module, and the bottom of the reference block is connected to the drive end of the spindle to ensure the transmission efficiency and detection accuracy of the mounting pressure.

[0020] It should be noted that existing technologies for detecting chip-substrate contact typically involve placing sensors such as distance sensors or photoelectric sensors on the side of the nozzle. These sensors directly detect changes in nozzle height to determine chip-substrate contact. However, this approach has several drawbacks: First, side-mounting the nozzle occupies actual mounting space, impacting chip mounting efficiency. Second, when mounting multiple chip types, different sizes and lengths of nozzles are required. Each nozzle change necessitates readjusting the sensor's detection reference, affecting the accuracy of nozzle height change detection. This can lead to chip damage due to overvoltage or poor bonding due to undervoltage during chip picking or mounting. Third, the nozzle typically rotates with the spindle. If the nozzle rotates relative to the sensor, the shape of the nozzle's outer surface can affect the detected height change value. Compared with the prior art, the binding device provided in this embodiment of the invention sets a reference block connected to the transmission end of the spindle. A photoelectric sensor emits a light source to the top surface of the reference block, and a signal amplifier detects the change in the amount of light reflected and received by the light source to determine the change in the height of the reference block. This does not occupy the actual mounting space near the working end of the spindle. The detection object is changed from the nozzle to the reference block between the force control drive module and the spindle. It is also not affected by different nozzle types and different outer peripheral surface shapes, thereby ensuring mounting efficiency, improving the detection accuracy when the chip contacts the substrate, and avoiding chip damage due to overvoltage or poor bonding due to undervoltage.

[0021] 6. In the head-binding device provided in this embodiment of the invention, the bottom end of the reference block is connected to the transmission end of the main shaft, so that the reference block has both lifting and rotating movements. The main function of the photoelectric sensor is to determine the lifting position of the reference block. The rotational movement of the reference block following the main shaft will not affect the photoelectric detection. The photoelectric sensor is set at an inclined angle θ with the top surface of the reference block. The inclined angle θ can be an acute angle or a right angle, so that when the reference block is lifted to different positions, the light source of the photoelectric sensor can be illuminated on the top surface of the reference block. The light source emitted by the photoelectric sensor is aligned with the middle area of ​​the top surface of the reference block, which can avoid the irregular deformation of the edge of the reference block from interfering with the signal amplifier when detecting the change in the amount of light reflected and received by the light source. This further ensures the accuracy of detecting the change in the height of the reference block when the chip contacts the substrate. The photoelectric sensor can be a fiber optic sensor, a laser rangefinder sensor, a grating sensor or an infrared sensor, which is smaller in size and has a faster response speed than other sensors.

[0022] 7. This invention also provides a die bonding device that coordinates multiple modules, including the track assembly, feeding assembly, and dispensing assembly, through a control component to form a fully automated production line of "feeding-dust removal and dispensing-inspection-mounting-unloading," significantly reducing manual intervention and improving production continuity and efficiency. The track assembly and the first fixed base are arranged side by side, and the functional components are arranged sequentially along the length of the track. The process is clear and the space utilization is high. The linear layout allows the substrate to flow in a straight line without rotation or secondary clamping, improving the overall mounting efficiency. The wafer assembly and the mounting assembly are positioned correspondingly, shortening the chip transfer path and reducing mounting waiting time.

[0023] 8. The die bonding equipment provided in this embodiment of the invention integrates a second vision detector, a horizontal drive, and a vertical drive to achieve integrated operation of substrate micro-dust identification, dust removal, and dispensing, reducing process changeover time and improving production efficiency. The cooperation of the horizontal and vertical drive components enables multi-dimensional movement of the dust removal and dispensing mechanisms, precisely adapting to the dust removal and dispensing needs at different locations on the substrate. The detachable dust removal and dispensing mechanisms facilitate quick replacement of dispensing heads of different diameters or different types of dust removal heads according to process requirements, reducing maintenance costs and making it suitable for multi-variety, small-batch production. The double-layer plate design of the mounting bracket arranges the first vision detector, storage tank, dispensing head, and dust removal head in an orderly manner, resulting in a compact structure that avoids interference and vibration between components, further improving overall mounting accuracy.

[0024] 9、The track assembly of the die bonding equipment provided by the embodiment of the present application is designed with the first guide rail fixed and the second guide rail movable, the distance between the two guide rails can be adjusted to adapt to substrates of different width specifications, and the universality of the equipment is improved; the first boss is arranged along the length direction of the track, can stably bear the substrate, and avoids the substrate from sliding off the edge of the guide rail during transportation; the position sensor can monitor the moving position of the second guide rail in real time, and triggers a stop instruction when the distance is less than a preset threshold, preventing the second guide rail from moving excessively and colliding with other components, improving the safety of the equipment operation, and prolonging the service life of the equipment.

[0025] 10、The first, second and third heating zones of the heating table of the die bonding equipment provided by the embodiment of the present application can be independently temperature-controlled, and can meet the temperature requirements of the substrate at different stages of mounting; the cooperation of the pressing block and the vacuum suction channel can double-fix the substrate from two aspects of mechanical pressing and negative pressure adsorption, which can effectively prevent the substrate from warping or deviating due to thermal expansion and contraction during heating. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0027] Figure 1 is a layout structure schematic diagram of a die bonding equipment provided by the embodiment of the present application.

[0028] Figure 2 is a side view of a track assembly in a die bonding equipment provided by the embodiment of the present application.

[0029] Figure 3 is a structure schematic diagram of a clamping assembly in a die bonding equipment provided by the embodiment of the present application.

[0030] Figure 4 is a structure schematic diagram of a heating table in a die bonding equipment provided by the embodiment of the present application.

[0031] Figure 5 is a local structure schematic diagram of a track assembly in a die bonding equipment provided by the embodiment of the present application.

[0032] Figure 6 is a structure schematic diagram of a lower visual assembly in a die bonding equipment provided by the embodiment of the present application.

[0033] Figure 7 is a partial layout structure schematic diagram of a die bonding equipment provided by the embodiment of the present application.

[0034] Figure 8 is a structural schematic view of a dispensing assembly in a die bonding apparatus provided by an embodiment of the present application.

[0035] Figure 9 is a sectional view of a dust removal head in a die bonding apparatus provided by an embodiment of the present application.

[0036] Figure 10 is a lower view of a dust removal head in a die bonding apparatus provided by an embodiment of the present application.

[0037] Figure 11 is a structural schematic view of a first fixing base in a die bonding apparatus provided by an embodiment of the present application.

[0038] Figure 12 is a structural schematic view of a die bonding assembly in a die bonding apparatus provided by an embodiment of the present application.

[0039] Figure 13 is a structural schematic view of a third fixing plate in a die bonding apparatus provided by an embodiment of the present application.

[0040] Figure 14 is a structural schematic view of a second fixing plate in a die bonding apparatus provided by an embodiment of the present application.

[0041] Figure 15 is a structural schematic view of a whole structure of a binding head device provided by an embodiment of the present application.

[0042] Figure 16 is a sectional view of a binding head device provided by an embodiment of the present application, which includes an internal structure. Figure 1 .

[0043] Figure 17 is a structural schematic view of a whole frame of a force control driving module in a binding head device provided by an embodiment of the present application.

[0044] Figure 18 is a sectional view of an internal structure of a die bonding module in a binding head device provided by an embodiment of the present application, which is provided with an air floating bearing and an air floating bearing seat.

[0045] Figure 19 is a sectional view of an internal structure of a die bonding module in a binding head device provided by an embodiment of the present application, which is provided with a spline sleeve and a spline seat.

[0046] Figure 20 is a sectional view of a binding head device provided by an embodiment of the present application, which includes an internal structure. Figure 2 .

[0047] Figure 21 is a flowchart of a die bonding method provided by an embodiment of the present application.

[0048] Explanation of the drawing:

[0049] 100, die bonding apparatus; 10, substrate;

[0050] 1. Dispensing assembly; 11. First base; 111. Horizontal driving member; 112. Vertical driving member; 113. Mounting bracket; 1131. First mounting plate; 1132. Second mounting plate; 12. Dust removal mechanism; 121. Storage tank; 122. Air pipe; 123. Dust removal head; 1231. Suction air path; 1232. Vacuum hole; 1233. Blow air path; 1234. Blow hole; 13. Dispensing mechanism; 131. First visual detector; 132. Dispensing head;

[0051] 2. Track assembly; 21. First fixed seat; 22. Second fixed seat; 221. First guide rail; 222. Second guide rail; 2221. Driving module; 223. First boss; 224. Limit sensor; 225. Heating table; 2251. First heating area; 2252. Second heating area; 2253. Third heating area; 2254. Vacuum suction channel; 226. Fixed seat; 2261. Cross beam; 2262. Press block; 227. Third guide rail; 23. Dust removal and dispensing area; 24. Mounting area; 25. Transfer table; 26. Clamping assembly; 261. Clamping base; 262. Fourth driving member; 263. First clamping jaw; 264. Second clamping jaw; 265. First cam; 266. Second cam;

[0052] 3. Lower visual assembly; 31. Second base; 311. Second visual detector; 312. Third visual detector; 313. Fourth visual detector; 314. Fifth visual detector; 315. Straight line driving module;

[0053] 4. Mounting assembly; 41. First fixed plate; 411. First driving member; 412. First sliding rail; 413. Fixed support; 42. Second fixed plate; 421. Second driving member; 422. Second sliding rail; 423. Third driving member; 424. Third sliding rail; 425. Avoidance groove; 43. Load mechanism; 44. Mounting mechanism; 45. Third fixed plate; 451. First connecting part; 452. Second connecting part; 453. Reinforcing rib;

[0054] 5. Wafer assembly; 51. Wafer tray; 52. Needle assembly; 6. Feeding assembly; 7. Discharging assembly;

[0055] 8, control assembly; 9, binding head device; 91, force control detection module; 911, reference block; 912, photoelectric sensor; 913, signal amplifier; 92, force control driving module; 921, cylinder body; 922, proportional valve; 923, transmission member; 93, mounting module; 931, main shaft; 932, main shaft seat; 9321, vacuum air opening; 9322, air path inlet; 933, vertical guide assembly; 9331, guide seat; 93311, hollow channel; 9332, movable shaft; 9333, guide bearing; 9334, guide block; 934, first guide assembly; 9341, air float bearing; 9342, air float bearing seat; 935, second guide assembly; 9351, spline sleeve; 9352, spline seat; 936, bearing assembly; 9361, bearing spacer; 937, suction nozzle assembly; 938, magnetic spring assembly; 9381, iron block; 9382, magnetic rod; 939, magnetic rod seat; 94, rotary driving module; 941, servo motor; 942, synchronous wheel assembly; 9421, first synchronous wheel; 9422, second synchronous wheel; 9423, synchronous belt. DETAILED DESCRIPTION

[0056] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely intended to explain the present application and should not be used to limit the present application.

[0057] In the embodiments provided by the present application, it should be understood that "B corresponding to A" means that B is associated with A and B can be determined according to A. However, it should also be understood that the determination of B according to A means that B can be determined according to A and / or other information, not only according to A.

[0058] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present application.

[0059] In various embodiments of the present application, it should be understood that the size of the serial number of the above processes does not mean the inevitable sequence of execution, and the execution sequence of the processes should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0060] The flow diagrams and the block diagrams in the drawings are illustrations of architectures, functions, and operations of possible implementations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flow diagrams or block diagrams can represent a module, a segment, or a portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and / or flow diagrams, and combinations thereof, can be implemented by special purpose hardware-based systems that perform the specified functions or operations, or combinations of special purpose hardware and computer instructions.

[0061] Referring to Figure 1 The embodiment of the present application provides a die bonding equipment 100, which comprises a control assembly 8, a track assembly 2 and a first fixing seat 21, the track assembly 2 and the first fixing seat 21 are arranged side by side, the first fixing seat 21 sequentially arranges a dispensing assembly 1, a lower vision assembly 3 and a mounting assembly 4 along the length direction, the track assembly 2 is provided with a feeding assembly 6 and a discharging assembly 7 at both ends, the track assembly 2 is provided with a wafer assembly 5 away from the first fixing seat 21, and the wafer assembly 5 and the mounting assembly 4 are in position correspondence; the control assembly 8 is signal connected with the track assembly 2, the feeding assembly 6, the dispensing assembly 1, the lower vision assembly 3, the wafer assembly 5, the mounting assembly 4 and the discharging assembly 7 respectively.

[0062] The die bonding equipment 100 provided by the embodiment of the present application can form a full-automatic assembly line of "feeding-dusting-dispensing-detecting-mounting-discharging" by overall planning and coordinating the track assembly 2, the feeding assembly 6, the dispensing assembly 1 and other modules through the control assembly 8, so that manual intervention is greatly reduced, and production continuity and efficiency are improved. The track assembly 2 and the first fixing seat 21 are arranged side by side, and each functional assembly is sequentially arranged along the length direction of the track, so that the process is clear and the space utilization rate is high, and the linear layout enables the substrate 10 to be linearly flowed, without rotation or secondary clamping, so that the overall mounting efficiency is improved; the wafer assembly 5 and the mounting assembly 4 are in position correspondence, so that the chip transfer path is shortened, and the mounting waiting time is reduced.

[0063] Further, please refer to Figure 2The track assembly 2 comprises a second fixing base 22, a first guide rail 221 fixedly installed on the second fixing base 22, a second guide rail 222 movably installed on the second fixing base 22 and spaced apart from the first guide rail 221, and first bosses 223 arranged on opposite sides of the first guide rail 221 and the second guide rail 222 and extending along the length direction of the track assembly 2, and the first bosses 223 are used for carrying the substrate 10 transported from the feeding assembly 6.

[0064] Specifically, the second fixing base 22 is provided with a third guide rail 227 extending along the width direction of the second fixing base 22, and the second guide rail 222 is fixed on the third guide rail 227 and can move along the width direction of the second fixing base 22 under the action of the third guide rail 227, so as to adjust the spacing between the first guide rail 221 and the second guide rail 222.

[0065] It can be understood that, by the design that the first guide rail 221 is fixed and the second guide rail 222 is movable in the track assembly 2, different width specifications of the substrate 10 can be adapted by adjusting the spacing between the first guide rail 221 and the second guide rail 222, and the versatility of the equipment is improved; the first bosses 223 are arranged along the length direction of the track, which can stably carry the substrate 10 and avoid the substrate 10 from sliding off the edge of the guide rail during transportation.

[0066] Specifically, the second fixing base 22 is provided with a third guide rail 227 extending along the width direction of the second fixing base 22, and the second guide rail 222 is fixed on the third guide rail 227 and can move along the width direction of the second fixing base 22 under the action of the third guide rail 227, so as to adjust the spacing between the first guide rail 221 and the second guide rail 222.

[0067] It should be noted that the limit sensor 224 can monitor the moving position of the second guide rail 222 in real time, and a stop instruction is triggered when the distance is less than the preset threshold, so as to prevent the second guide rail 222 from moving excessively and colliding with other components, improve the safety of the equipment operation, and prolong the service life of the equipment.

[0068] In some embodiments, the first fixing base 21 is higher than the second fixing base 22, the first fixing base 21 and the second fixing base 22 are provided with an avoidance space at the corresponding positions, the second guide rail 222 is provided with a driving module 2221 away from the first guide rail 221, which is used for driving the movement of the second guide rail 222, and when the second guide rail 222 moves away from the first guide rail 221, the driving module 2221 can be embedded in the avoidance space, so that the first fixing base 21 and the second fixing base 22 can be compactly arranged to shorten the moving distance of each execution module and improve the overall mounting efficiency.

[0069] Please further combine Figure 3The first guide rail 221 and / or the second guide rail 222 is provided with a plurality of clamping assemblies 26. The clamping assembly 26 comprises a clamping base 261 which is slidably connected to the first guide rail 221 or the second guide rail 222 along the length direction of the track assembly 2. The clamping base 261 is provided with a fourth driving member 262. The clamping base 261 is further slidably connected with a first clamping jaw 263 and a second clamping jaw 264 in a direction perpendicular to the track assembly 2. A first cam 265 and a second cam 266 are arranged on the rotating end of the fourth driving member 262 in a staggered manner. The first clamping jaw 263 abuts against the first cam 265, and the second clamping jaw 264 abuts against the second cam 266.

[0070] It should be noted that when the fourth driving member 262 drives the first cam 265 to rotate, the first clamping jaw 263 can be lifted by the first cam 265 to hold the substrate 10 due to the different radii of the first cam 265 at different positions. The first cam 265 and the second cam 266 are arranged in a staggered manner on the rotating end of the fourth driving member 262, i.e., the two cams are stacked on the rotating end of the fourth driving member 262 and the outer contours do not coincide. Since the radii of the second cam 266 at different positions are also different, when the fourth driving member 262 drives the second cam 266 to rotate, the second clamping jaw 264 can be floated up and down to press against the substrate 10. It can be understood that when it is necessary to clamp the substrate 10, the first cam 265 and the second cam 266 are driven to rotate by the fourth driving member 262 synchronously. The first clamping jaw 263 rises under the action of the first cam 265, and the second clamping jaw 264 descends under the action of the second cam 266. The first clamping jaw 263 and the second clamping jaw 264 cooperate to clamp the substrate 10. Thereafter, the substrate 10 can be transported to a designated position by sliding the clamping base 261 relative to the first guide rail 221 or the second guide rail 222.

[0071] In a feasible implementation, the track assembly 2 is provided with four groups of clamping assemblies 26. Two groups of clamping assemblies 26 are arranged at the two ends of the track assembly 2 in the length direction, which are used to complete the transportation of the substrate 10 for feeding and discharging. The other two groups of clamping assemblies 26 are arranged below the dispensing assembly 1 and the mounting assembly 4 respectively, which are used to transport the substrate 10 to a designated position for dust removal, dispensing, mounting and other operations.

[0072] Further, please refer to Figure 2 and Figure 4 The second fixing seat 22 is further provided with a heating table 225 which is located between the first guide rail 221 and the second guide rail 222. The heating table 225 is sequentially provided with a first heating area 2251, a second heating area 2252 and a third heating area 2253 along the length direction of the track assembly 2. The three heating areas of the heating table 225 can be independently temperature-controlled, which can meet the temperature requirements of the substrate 10 at different stages of mounting.

[0073] In some embodiments, the first heating zone 2251 is used to preheat the substrate 10, the second heating zone 2252 is used to heat the preheated substrate 10 to a process temperature, and the third heating zone 2253 is used to keep the substrate 10 after chip mounting warm to avoid affecting the mounting quality due to rapid cooling.

[0074] In other embodiments, the length of the first heating zone 2251 is greater than the second heating zone 2252. When performing die bonding of a long substrate 10, the first heating zone 2251 first heats a larger area of the substrate 10 to a certain temperature, and then the preheated part of the substrate 10 is transported to the second heating zone 2252 in sequence to be quickly heated to a process temperature.

[0075] Please refer to the combination of Figure 5 The first guide rail 221 and / or the second guide rail 222 are provided with a pressing block 2262 at a position corresponding to the heating table 225. The pressing block 2262 can move axially relative to the heating table 225 to fix the substrate 10 on the heating table 225. The heating table 225 is provided with a vacuum suction channel 2254 for suction of the substrate 10. The pressing block 2262 cooperates with the vacuum suction channel 2254 to fix the substrate 10 from two aspects of mechanical pressing and negative pressure suction, which can effectively prevent the substrate 10 from warping or shifting due to thermal expansion and contraction during heating.

[0076] Specifically, the heating table 225 is provided at the bottom with a lifting assembly. The heating table 225 can be lifted or lowered in a direction perpendicular to the track assembly 2 under the action of the lifting assembly.

[0077] It should be noted that when the clamping assembly 26 clamps the substrate 10 to transport it to the heating table 225, the heating table 225 is lowered in height under the action of the lifting assembly. Specifically, the heating table 225 is lowered to a position where the upper surface of the heating table 225 is lower than the first boss 223, so that the substrate 10 can be smoothly transported above the heating table 225. When the substrate 10 is transported above the heating table 225, the lifting assembly drives the heating table 225 to rise and lift the substrate 10, and the vacuum suction channel 2254 is started to suction the substrate 10. It should be understood that the upper surface of the heating table 225 is a flat surface, and the lifting of the substrate 10 by the heating table 225 can ensure the flatness of the substrate 10 and improve the mounting quality.

[0078] As a feasible implementation, the first guide rail 221 is provided with a fixing seat 226, the fixing seat 226 is movable up and down relative to the track assembly 2, the fixing seat 226 is provided with a crossbeam 2261 extending to the second guide rail 222, the crossbeam 2261 is located above the track assembly 2 and is higher than the clamping assembly 26, both ends of the crossbeam 2261 are provided with pressing blocks 2262, when the substrate 10 is located on the heating table 225, the fixing seat 226 can drive the pressing blocks 2262 to descend, so as to press the substrate 10 and further fix the substrate 10; specifically, the pressing blocks 2262 are arranged in a staggered manner with the clamping assembly 26, so that the clamping assembly 26 does not interfere with the pressing blocks 2262 when moving.

[0079] Further, please refer to Figure 1 、 Figure 6 and Figure 7 , the track assembly 2 is provided with a dust removal dispensing area 23 and a mounting area 24 along the length direction, the track assembly 2 is provided with a transfer table 25 close to the wafer assembly 5, the wafer assembly 5 includes a wafer tray 51, the mounting area 24, the transfer table 25 and the wafer tray 51 are collinear; the lower visual assembly 3 includes a second base 31, a second visual detector 311, a third visual detector 312, a fourth visual detector 313 and a fifth visual detector 314 arranged on the second base 31; the second visual detector 311 is located above the dust removal dispensing area 23, the third visual detector 312 is located above the mounting area 24, the fourth visual detector 313 is located above the transfer table 25, and the fifth visual detector 314 is located above the wafer tray 51.

[0080] Specifically, the second visual detector 311, the third visual detector 312, the fourth visual detector 313 and the fifth visual detector 314 are all fixedly arranged on the second base 31 to identify a predetermined area, the visual detector finely detects the area to be identified at a fixed angle, so as to guarantee the stability of visual detection.

[0081] In some embodiments, the third visual detector 312 is further provided with a linear drive module 315, the third visual detector 312 is movable along the width direction of the track assembly 2 under the action of the linear drive module 315, when the substrate 10 to be mounted is large in size, a column thereof along the width direction needs to be mounted with multiple chips, the linear drive module 315 controls the third visual detector 312 to move, so as to accurately identify the position of each chip to be mounted.

[0082] The fixed crystal device 100 provided by the embodiment of the present application divides the track assembly 2 into the dust removal dispensing area 23 and the mounting area 24 according to functions, so that the production process is clearer and the independent control of each process is facilitated; the mounting area 24, the transfer table 25 and the wafer tray 51 are arranged in a line, so that the transfer path of the chip from the wafer tray 51 to the mounting area 24 through the transfer table 25 is shortened, and the material transfer time is reduced; the plurality of visual detectors of the lower visual assembly 3 correspond to the dust removal dispensing area 23, the mounting area 24, the transfer table 25 and the wafer tray 51 respectively, so that the key parameters such as the dispensing quality of the substrate 10 and the chip position can be detected in a targeted manner, accurate positioning data for the dust removal, mounting and other processes is provided, and the fixed crystal yield is greatly improved.

[0083] In some embodiments, the wafer assembly 5 includes a material transfer head assembly and a pin assembly 52, and the wafer tray 51 is defined with a material taking position, i.e. the position of the chip to be taken out, and the fifth visual detector 314 is used to position the chip on the material taking position, and the material transfer head assembly is used to transfer the chip on the material taking position to the transfer table 25. Specifically, the transfer table 25 is arranged in line with the material taking position, so that the transfer path of the chip from the wafer tray 51 to the transfer table 25 is a straight line, the complexity of the motion trajectory of the material transfer head assembly is reduced, and the transfer time is shortened. At the same time, the straight line path can reduce the risk of position deviation during chip transfer and improve the transfer accuracy.

[0084] In other embodiments, the third visual detector 312, the fourth visual detector 313, the fifth visual detector 314, the mounting mechanism 44 and the material transfer head assembly can work synchronously; that is, when the material transfer head assembly grabs the chip on the wafer tray 51, the fourth visual detector 313 synchronously identifies and detects the chip on the transfer table 25, the fifth visual detector 314 also synchronously identifies the mounting area 24 to obtain the mounting position information, and at the same time, the mounting mechanism 44 can also perform the chip mounting operation at this stage.

[0085] Specifically, a translation driving assembly is further arranged below the wafer tray 51, which is used to control the wafer tray 51 to move along the length direction and the width direction of the track assembly 2; under the driving of the translation driving assembly, the wafer tray 51 can make the material taking position correspond to the fifth visual detector 314 at all times, so as to ensure that the fifth visual detector 314 can accurately identify the chip.

[0086] As a feasible implementation manner, the bottom of the pin assembly 52 is provided with a driving member, and the pin assembly 52 can move along the direction connected with the transfer table 25 under the action of the driving member. By moving the pin assembly 52, a column of chips on the wafer tray 51 can be lifted in turn.

[0087] In some embodiments, the transfer station 25 is detachably arranged on the track assembly 2. For the chips with low requirements for mounting accuracy, the mounting mechanism 44 can directly pick up the chips on the wafer tray 51 and then transfer them to the substrate 10 for mounting. For mounting of such chips, the transfer station 25 can be removed so that the wafer tray 51 can be moved close to the track assembly 2 to shorten the distance of the chips from the wafer tray 51 to the track assembly 2, further shorten the transfer time of the chips, and improve the mounting efficiency.

[0088] Further, please refer to Figure 6 、 Figure 8-10 , the dispensing assembly 1 is used for removing dust from the substrate 10, which comprises a second visual detector 311, a first base 11, a horizontal driving member 111 arranged at the bottom of the first base 11, a vertical driving member 112 arranged at the side of the first base 11, and a dust removal mechanism 12 and / or a dispensing mechanism 13 detachably arranged at the side of the first base 11 away from the vertical driving member 112, the second visual detector 311 is used for identifying dust on the substrate 10; the dispensing mechanism 13 comprises a first visual detector 131 and a dispensing head 132, the first visual detector 131 and the dispensing head 132 are signal connected, the dust removal mechanism 12 comprises a storage tank 121, an air pipe 122 and a dust removal head 123, the dust removal head 123 is provided with a suction air path 1231 and a blowing air path 1233, one end of the air pipe 122 is connected with the storage tank 121, and the other end is connected with the suction air path 1231; the vertical driving member 112 is fixed with a mounting bracket 113, the mounting bracket 113 comprises first and second mounting plates 1131 and 1132 arranged at intervals, the first mounting plate 1131 is fixedly connected with the vertical driving member 112 away from the second mounting plate 1132, the first visual detector 131 is fixed between the first and second mounting plates 1131 and 1132, the storage tank 121 is fixed at the side of the first mounting plate 1131, and the second mounting plate 1132 is detachably provided with the dispensing head 132 and / or the dust removal head 123 away from the first mounting plate 1131.

[0089] Understandably, the dispensing assembly 1 realizes the integrated operation of substrate 10 dust identification, dust removal and dispensing by integrating the second visual detector 311, the horizontal driving member 111 and the vertical driving member 112, reduces the process switching time, and improves the production efficiency; wherein the cooperation of the horizontal driving member 111 and the vertical driving member 112 can drive the dust removal and dispensing mechanism 13 to realize multi-dimensional movement, which can accurately adapt to the dust removal and dispensing requirements of different positions on the substrate 10; the detachable dust removal mechanism 12 and the dispensing mechanism 13 facilitate quick replacement of dispensing heads 132 of different diameters or dust removal heads 123 of different types according to process requirements, reducing maintenance costs and suitable for multi-variety small-batch production; the double-layer plate design of the mounting bracket 113 orderly arranges the first visual detector 131, the storage tank 121, the dispensing head 132 and the dust removal head 123, the structure is compact and interference and vibration interference between components are avoided, further improving the overall mounting precision.

[0090] In some embodiments, only the dispensing head 132 is installed on the first mounting plate 1131 for dispensing or drawing glue on the substrate 10; or only the dust removal head 123 is installed on the first mounting plate 1131 for dust removal on the substrate 10; according to the actual process required for die bonding, the corresponding dispensing head 132 or dust removal head 123 can be selected for installation, and the unnecessary components are detached, so that the dispensing assembly 1 can meet the process requirements of die bonding, effectively reducing the load of the mounting bracket 113 and improving the movement precision.

[0091] In some embodiments, the dispensing head 132 and the dust removal head 123 are installed on the first mounting plate 1131 at the same time, the dust removal head 123 can be used to clean the dust on the substrate 10 that affects dispensing and mounting, and then the dispensing head 132 can be used to dispense the substrate 10.

[0092] Please refer to Figure 9 and Figure 10 , the adsorption gas path 1231 and the blowing gas path 1233 are isolated, the dust removal head 123 is provided with a plurality of vacuum holes 1232 and a plurality of blowing holes 1234, the vacuum holes 1232 are communicated with the adsorption gas path 1231, the blowing holes 1234 are communicated with the blowing gas path 1233, and the adsorption gas path 1231 and the blowing gas path 1233 can work at the same time.

[0093] Specifically, the plurality of vacuum holes 1232 and the plurality of blowing holes 1234 are arranged in two rows along the length direction of the bottom of the dust removal head 123, that is, the vacuum holes 1232 are arranged in one row, the blowing holes 1234 are arranged in one row, and the vacuum holes 1232 and the blowing holes 1234 correspond one by one.

[0094] Alternatively, the arrangement of the vacuum holes 1232 and the blowing holes 1234 can also be a meandering shape, a ring shape or any other arrangement, which can be set according to actual conditions.

[0095] It can be understood that the adsorption gas path 1231 is arranged separately from the blowing gas path 1233, so as to avoid the adsorbed dust from flowing back into the blowing gas path 1233 and polluting the substrate 10; when the two work at the same time, the blowing gas path 1233 can blow away the stubborn dust on the surface of the substrate 10 through the blowing hole 1234, and the adsorption gas path 1231 can timely adsorb the blown dust through the vacuum hole 1232, so as to form a "blowing-adsorbing" circulating airflow, and cooperatively remove the dust, thereby greatly improving the dust removal efficiency; the distribution design of the plurality of vacuum holes 1232 and blowing holes 1234 can cover a larger area of the substrate 10, and adapt to the dust removal needs of substrates 10 of different sizes.

[0096] Further, the second visual detector 311 performs dust recognition detection on the substrate 10 before and after the work of the dust removal head 123.

[0097] Specifically, when the second visual detector 311 detects that there is still dust on the substrate 10 after dust removal, the information is fed back to the control assembly 8, and the control assembly 8 controls the dust removal head 123 to perform dust removal processing on the substrate 10 again until the second visual detector 311 detects that the cleanliness of the substrate 10 meets the standard.

[0098] It can be understood that the second visual detector 311 performs dust detection on the substrate 10 before and after dust removal, respectively, to form a closed-loop dust removal detection of "detection-dust removal-re-detection", so as to quantitatively evaluate the dust removal effect, avoid the non-standard substrate 10 from flowing into the subsequent dispensing or mounting process, guarantee the product yield, realize automatic detection, reduce the randomness and errors of manual sampling inspection, and improve the production stability.

[0099] Further, the second visual detector 311 includes a second base 31, the first visual detector 131 is fixed on the first base 11, the second visual detector 311 is located above the first base 11, and the detection range of the first visual detector 131 is smaller than the detection range of the second visual detector 311.

[0100] It should be noted that the second base 31 is fixed on the first fixing seat 21, and the second visual detector 311 is fixed on the second base 31 and corresponds to the dust removal dispensing area 23. By fixing the second visual detector 311, the relative position of the second visual detector 311 and the dust removal dispensing area 23 remains unchanged, so that the same reference can be maintained every time the detection is performed, and the stability of the detection is ensured.

[0101] It can be understood that the second visual detector 311 can quickly locate a plurality of dusts in a large area by scanning the entire substrate 10, improve the detection accuracy, and the second visual detector 311 is located above the first base 11, which not only ensures that the second visual detector 311 can have a larger detection angle, but also avoids structural interference of the dust removal mechanism 12 or the dispensing mechanism 13 moving below; the first visual detector 131 arranged on the mounting bracket 113 can move synchronously with the dispensing mechanism 13 and accurately identify and detect the dispensing area in real time.

[0102] Specifically, the process of dust removal treatment by the dispensing assembly 1 is as follows: when the substrate 10 is transported to the dust removal and dispensing area 23, the second visual detector 311 identifies the dust on the substrate 10 and feeds back the identification result to the control assembly 8, the control assembly 8 controls the dust removal head 123 to remove the dust on the substrate 10, after the dust removal treatment is completed, the control assembly 8 controls the second visual detector 311 to identify the dust on the substrate 10 again, if the identification result is that there is no dust on the current substrate 10, the dust removal process is ended, otherwise, the dust removal head 123 is controlled again to remove the dust on the substrate 10.

[0103] The process of dispensing treatment by the dispensing assembly 1 is as follows: when the substrate 10 is transported to the dust removal and dispensing area 23, the first base 11 is moved to correspond to the first visual detector 131 and the substrate 10, the first visual detector 131 identifies the position of the dispensing position on the substrate 10, and then the dispensing head 132 is controlled to dispense or draw glue on the position.

[0104] As a feasible implementation, the dispensing assembly 1 can first use the second visual detector 311 to scan and identify the dust area and the dispensing area of the substrate 10 during dust removal treatment or dispensing treatment, and then use the first visual detector 131 to detect the key area such as the dispensing position with high precision, which takes into account the detection efficiency and accuracy.

[0105] Further, please refer to Figure 11 and Figure 12 , the first fixed seat 21 is provided with a first fixed plate 41 and a second fixed plate 42 at intervals, the first fixed plate 41 is movably mounted with a load mechanism 43, and the second fixed plate 42 is movably mounted with a mounting mechanism 44; the load mechanism 43 and the mounting mechanism 44 can move towards each other or away from each other.

[0106] Specifically, the first fixed plate 41 is provided with a first driving part 411, the second fixed plate 42 is provided with a second driving part 421, the first driving part 411 is provided with a loading mechanism 43, the second driving part 421 is provided with a mounting mechanism 44, and the loading mechanism 43 and the mounting mechanism 44 move towards or away from each other under the driving of the first driving part 411 and the second driving part 421.

[0107] It should be noted that when the chip is mounted, the second driving part 421 is used to drive the mounting mechanism 44 to move to the transfer table 25 or the wafer tray 51 to suck the chip, and then the chip is moved to the designated position on the substrate 10 for mounting. In this process, the movement of the mounting mechanism 44 has acceleration or deceleration, which causes the center of gravity of the mounting assembly 4 to deviate and slight vibration occurs.

[0108] The die bonding apparatus 100 provided by the embodiment of the present application movably installs the loading mechanism 43 on the first fixed plate 41 and movably installs the mounting mechanism 44 on the second fixed plate 42, so that the loading mechanism 43 and the mounting mechanism 44 on the first fixed plate 41 and the second fixed plate 42 can move towards or away from each other, thereby ensuring that the center of gravity of the mounting assembly 4 does not deviate and offsetting the vibration generated by the mounting mechanism 44 during acceleration or deceleration, which improves the movement stability and precision of the mounting mechanism 44.

[0109] As a feasible implementation manner, the first fixed plate 41 and the second fixed plate 42 are arranged in line along the length direction thereof, and the first fixed plate 41 and the second fixed plate 42 are both perpendicular to the first fixed seat 21; the first fixed plate 41 is provided with a first sliding rail 412 along the length direction thereof, the second fixed plate 42 is provided with a second sliding rail 422 along the length direction thereof, and the loading mechanism 43 and the mounting mechanism 44 are respectively connected with the first sliding rail 412 and the second sliding rail 422 in a sliding manner.

[0110] Specifically, the weight of the loading mechanism 43 matches the weight of the mounting mechanism 44, and when the mounting mechanism 44 moves, the loading mechanism 43 simultaneously moves in the opposite direction at the same speed and distance as the movement of the mounting mechanism 44.

[0111] It can be understood that through the design of the first fixed plate 41 and the second fixed plate 42 being in line and perpendicular to the first fixed seat 21, and the sliding rails being arranged along the length direction of each, stable linear motion guidance is provided for the loading mechanism 43 and the mounting mechanism 44, which effectively reduces the lateral deviation during movement and improves the mounting precision; at the same time, the sliding rail connection mode can also reduce the movement resistance, so that the mechanism responds more quickly and can adapt to the mounting rhythm more quickly.

[0112] In some embodiments, the sliding rail surface is smeared with wear-resistant lubricating grease to reduce the friction coefficient and further improve the smoothness of movement and the service life of the sliding rail.

[0113] Further, please refer to Figure 13 and Figure 14 , the second fixed plate 42 is provided with a third sliding rail 424, the third sliding rail 424 is provided with a third driving part 423, the third driving part 423 is installed with a third fixed plate 45, the third fixed plate 45 is fixedly connected with the second sliding rail 422; the third sliding rail 424 is perpendicular to the second sliding rail 422, and the second sliding rail 422 and the third sliding rail 424 are slidably connected through the third fixed plate 45.

[0114] Optionally, the specific structure of the first driving part 411, the second driving part 421, the third driving part 423 and the fourth driving part 262 includes but is not limited to one or more of a linear motor, a servo motor, a voice coil motor, a driving cylinder, a ball screw provided with a motor, a gear and rack structure provided with a motor, etc.

[0115] It should be noted that the third sliding rail 424 on the second fixed plate 42 is perpendicular to the second sliding rail 422, and the second sliding rail 422 is moved by the third driving part 423, so that the mounting mechanism 44 increases a movement dimension, and more mounting positions on the substrate 10 can be covered; the second sliding rail 422 and the third sliding rail 424 are connected through the third fixed plate 45, so that the movement direction of the mounting mechanism 44 is flexibly converted, so that it can realize two-dimensional plane movement, and the structure is compact and does not occupy too much space.

[0116] Further, the second fixed plate 42 is provided with a avoiding groove 425 on the side facing the third fixed plate 45, the third fixed plate 45 includes a first connecting part 451 and a second connecting part 452, the first connecting part 451 is fixedly connected with the third driving part 423, and the second connecting part 452 is fixedly connected with the second sliding rail 422; the first connecting part 451 and the second connecting part 452 are provided with a reinforcing rib 453, and the reinforcing rib 453 is gap matched with the avoiding groove 425.

[0117] As a feasible implementation manner, the first fixed plate 41 is provided with a fixed support 413, and the first sliding rail 412 is arranged on the same side of the fixed support 413 and the second connecting part 452.

[0118] Specifically, the third sliding rail 424 is provided with a buffer device at both ends, so as to avoid rigid collision when the second sliding rail 422 is moved to the limit position by the third driving part 423.

[0119] Understandably, the clearance groove 425 of the second fixing plate 42 provides space for the movement of the third fixing plate 45, avoiding structural interference and ensuring smooth movement of the third fixing plate 45. The reinforcing rib 453 enhances the overall rigidity of the third fixing plate 45, reducing deformation caused by motion inertia when supporting the mounting mechanism 44, thus ensuring mounting accuracy. The clearance fit between the reinforcing rib 453 and the clearance groove 425 further improves the smoothness of movement.

[0120] Please see Figure 12 , Figure 15 and Figure 16 The mounting mechanism 44 includes a binding head device 9 for picking up chips and mounting them onto a substrate. The binding head device 9 includes a force control detection module 91, a force control drive module 92, and a mounting module 93. The force control detection module 91 includes a reference block 911, a photoelectric sensor 912, and a signal amplifier 913. The signal amplifier 913 is connected to the photoelectric sensor 912. The mounting module 93 includes a spindle 931 and a spindle seat 932. The two ends of the spindle 931 are a drive end and a working end, respectively. The spindle 931 passes through the spindle seat 932 and can move up and down relative to the spindle seat 932. The working end of the chip is exposed on the spindle seat 932; the top of the reference block 911 is connected to the force control drive module 92, and the bottom of the reference block 911 is connected to the transmission end of the spindle 931; the photoelectric sensor 912 is located on the spindle seat 932, and one end of the photoelectric sensor 912 that emits a light source extends into the interior of the spindle seat 932, and the other end of the photoelectric sensor 912 is connected to the signal amplifier 913. The photoelectric sensor 912 can emit a light source to the top surface of the reference block 911. When the chip contacts the substrate, the signal amplifier 913 determines the height change of the reference block 911 by detecting the change in the amount of light received by the light source reflection.

[0121] The binding head device 9 provided in this embodiment of the invention can be used for chip picking and placement in the automated placement process of the semiconductor industry. The binding head device 9 is applied in applications requiring high-precision chip placement. When picking up and adsorbing chips, it exposes the features that need to be identified, enabling real-time alignment of the chip's surface and placement position identification points during chip placement. Specifically, the placement module 93 includes a spindle 931 and a spindle seat 932. The spindle 931 passes through the spindle seat 932 and can move up and down relative to the spindle seat 932. The working end of the spindle seat 932 is exposed. The working end of the spindle 931 can be connected to nozzles of different specifications to adsorb different types of chips. Through the vertical movement of the spindle 931 and the spindle seat 932, the nozzle at the working end of the spindle 931 can reach the chip picking and placement positions, whereby the nozzle is responsible for picking up, adsorbing, and placing the chip.

[0122] It can be understood that the force control detection module 91 comprises a reference block 911, a photoelectric sensor 912 and a signal amplifier 913, the photoelectric sensor 912 can emit a light source to the top surface of the reference block 911, when the chip contacts the substrate, the signal amplifier 913 detects the change of the light amount received by the light source reflection to determine the height change amount of the reference block 911, and the force condition of the driving end of the main shaft 931 is fed back in real time, the non-contact measurement method has the characteristics of high sensitivity and anti-electromagnetic interference, by detecting the change of the light amount received by the light source reflection by the signal amplifier 913 under the two conditions of before the chip contacts the substrate and when the chip contacts the substrate, the in-place detection when the chip contacts the substrate can be realized, and the pressure change before and after the chip contacts the substrate is fed back during the mounting process, so that the mounting force of the working end of the main shaft 931 is uniform and meets the process requirements, and the chip is prevented from being damaged by overpressure or poor bonding caused by underpressure; the top end of the reference block 911 is connected with the force control driving module 92, and the bottom end of the reference block 911 is connected with the driving end of the main shaft 931, so as to ensure the transmission efficiency and detection accuracy of the mounting pressure.

[0123] In the embodiment of the application, the photoelectric sensor 912 is used to realize the in-place detection when the chip contacts the substrate, and the specific steps are as follows: the mounting threshold of the signal amplifier 913 is set in advance, the mounting threshold is used to judge whether the external force borne by the working end of the main shaft 931 is overshoot; the photoelectric sensor 912 emits a light source to the top surface of the reference block 911, the working end of the main shaft 931 picks up the chip, before the chip contacts the substrate, the signal amplifier 913 obtains the first position of the reference block 911 in the static state by detecting the light amount received by the light source reflection, and obtains the second position of the reference block 911 when the chip contacts the substrate; the signal amplifier 913 calculates the height change amount of the reference block 911 according to the first position and the second position, and compares the height change amount with the mounting threshold; whether the height change amount exceeds the mounting threshold is judged: if the height change amount does not exceed the mounting threshold, the signal amplifier 913 sends a mounting signal to the force control driving module 92, the force control driving module 92 drives the main shaft 931 to move downward in the vertical direction through the reference block 911, and the chip is mounted to the substrate; if the height change amount exceeds the mounting threshold, the signal amplifier 913 alarms.

[0124] It should be noted that in the prior art, when the chip contacts the substrate, the detection of the in-place detection is usually performed by setting a ranging sensor or a photoelectric sensor on the side of the suction nozzle to directly detect the height variation of the suction nozzle to determine whether the chip contacts the substrate. However, this method has many defects. On the one hand, the detection on the side of the suction nozzle will occupy the actual mounting space, and the efficiency of mounting the chip to the substrate will be affected. On the other hand, when facing the mounting of multiple chips, different sizes and lengths of suction nozzles need to be replaced, and the detection reference of the sensor needs to be adjusted again after each replacement of the suction nozzle, so that the detection accuracy of the height variation of the suction nozzle is affected, and the chip may be damaged due to overpressure or underpressure during the picking or mounting of the chip, which may lead to poor adhesion. On the other hand, the suction nozzle generally rotates with the rotation of the main shaft, and if the suction nozzle rotates relative to the sensor, the detection value of the height variation may be affected due to the different shapes of the outer periphery of the suction nozzle. Compared with the prior art, the head binding device 9 provided in the embodiment of the present application sets a reference block 911 connected to the transmission end of the main shaft 931, emits a light source to the top surface of the reference block 911 through a photoelectric sensor 912, and detects the change in the amount of light reflected and received by the light source through a signal amplifier 913 to determine the height variation of the reference block 911. The actual mounting space near the working end of the main shaft 931 is not occupied, the detection object is changed from the suction nozzle to the reference block 911 between the force control driving module 92 and the main shaft 931, and the suction nozzle type and the different shapes of the outer periphery of the suction nozzle will not affect the detection, thereby ensuring the mounting efficiency, improving the detection accuracy when the chip contacts the substrate, and avoiding the situation that the chip is damaged due to overpressure or underpressure or poor adhesion.

[0125] In some embodiments, the signal amplifier 913 can be installed on the side of the head binding device 9 away from the main shaft seat 932. The signal amplifier 913 of the embodiment of the present application can be fixed by a detachable connection such as a bolt, a thread or a buckle, and the signal amplifier 913 can be placed according to actual needs, as long as the detection accuracy of the change in the amount of light reflected and received by the light source and the determination of the height variation of the reference block 911 are ensured. The specific embodiments of the present embodiment cannot be used to limit the present application, and any modification, equivalent replacement and improvement within the principles of the present application shall be included in the protection scope of the present application.

[0126] In some embodiments, the photoelectric sensor 912 is arranged at an inclined angle θ with the top end surface of the reference block 911, and the light source emitted by the photoelectric sensor 912 is aligned with the middle region of the top end surface of the reference block 911.

[0127] The reference block 911 is connected to the transmission end of the main shaft 931, and the reference block 911 moves synchronously with the main shaft 931, so that the reference block 911 has both lifting action and rotating action, and the photoelectric sensor 912 mainly judges the lifting position of the reference block 911, and the rotating action of the reference block 911 following the main shaft 931 does not affect the photoelectric detection.

[0128] It can be understood that the photoelectric sensor 912 is arranged obliquely relative to the top end surface of the reference block 911, and the two have an oblique angle θ, the light source emitted by the photoelectric sensor 912 is aligned with the middle region of the top end surface of the reference block 911, and the edge irregular deformation of the reference block 911 can be avoided to interfere with the detection of the signal amplifier 913 when the light source reflection receiving light quantity changes, and the detection accuracy of the height change amount of the reference block 911 when the chip contacts the substrate is further ensured.

[0129] In some embodiments, the oblique angle θ is in the range of 0°<θ≤90°. It can be understood that by setting the oblique angle θ as an acute angle or a right angle, the light source of the photoelectric sensor 912 can be ensured to irradiate the top end surface of the reference block 911 when the reference block 911 is lifted to different positions. In the embodiment of the present application, the upper limit position of the lifting of the reference block 911 is the bottom of the force control driving module 92, and the lower limit position is the transmission end of the main shaft 931; no matter whether the lifting action of the reference block 911 is to the upper limit position or the lower limit position, the position irradiated by the light source of the photoelectric sensor 912 can be ensured, and the detection precision of the force control of the binding head device 9 is improved. In the embodiment of the present application, the oblique angle θ is 30°, 45° or 60°.

[0130] It should be noted that the reference block 911 has two functions: one is to detect whether the chip contacts the substrate before the binding head device 9 completes the mounting, and the other is to realize the mounting pressure conduction between the force control driving module 92, the reference block 911 and the main shaft 931 when the chip is mounted to the substrate by the working end of the main shaft 931. Therefore, if the oblique angle θ between the photoelectric sensor 912 and the top end surface of the reference block 911 is 0°, that is, the light source emitted by the photoelectric sensor 912 horizontally irradiates the top end surface of the reference block 911, it is difficult to ensure that the light source of the photoelectric sensor 912 continuously irradiates the top end surface of the reference block 911 during the mounting pressure conduction between the force control driving module 92, the reference block 911 and the main shaft 931.

[0131] In some embodiments, the photoelectric sensor 912 is one of a fiber sensor, a laser ranging sensor, a grating sensor and an infrared sensor.

[0132] It can be understood that the cooperation between the photoelectric sensor 912 and the signal amplifier 913 can obtain a signal reflecting the position change, which is specifically applied to the binding head device 9 of the embodiment of the present application to calculate the distance of the reference block 911 moving up when the actual suction nozzle is pressed down; the cooperation between the two can also obtain a feedback signal in the interval, which indicates that the chip has contacted the substrate and waits for the next mounting signal; in addition, the cooperation between the two can also obtain an overshoot signal when the pressure of the chip in contact with the substrate exceeds the threshold, which indicates that the chip may have been damaged, so as to remind the operator to reset the detection reference of the photoelectric sensor 912 and the signal amplifier 913. In the embodiment of the present application, the photoelectric sensor 912 is an optical fiber sensor, which is used to emit a light source to the top end surface of the reference block 911, receive the amount of light reflected by the optical fiber, and transmit it to the signal amplifier 913. The value of the amount of light displayed on the signal amplifier 913 reflects the position of the reference block 911.

[0133] As an alternative embodiment, the sensor of the embodiment of the present application can also be a Hall sensor, a capacitive sensor or an inductive sensor. When using a Hall sensor, the distance of the reference block 911 moving up and down can be measured by fixing a magnet on the top end surface of the reference block 911, but compared with the optical fiber sensor, the detection accuracy is relatively low due to the need to install a magnet; when using a capacitive sensor or an inductive sensor, only the feedback signal of the contact between the chip and the substrate can be detected, which has limitations.

[0134] Please refer to Figure 16 and Figure 17 , the force control driving module 92 includes a cylinder body 921, a proportional valve 922 and a transmission member 923, the cylinder body 921 is pneumatically connected with the proportional valve 922, and the proportional valve 922 is used to control the cylinder body 921 to work with a certain constant force; the cylinder body 921 is abutted with the top end of the reference block 911 in the vertical direction through the transmission member 923, so as to be in transmission connection between the cylinder body 921 and the reference block 911.

[0135] In the binding head device 9 provided by the embodiment of the present application, the proportional valve 922 of the force control driving module 92 can control the cylinder body 921 to work with a certain constant force, so that the binding head can realize high-speed mounting in the PTP (Place To Place, position to position) mode, the proportional valve 922 does not need to be repeatedly output during the mounting process, which can reduce the mechanical loss of the proportional valve 922 and prolong the service life; the constant force output can ensure the driving stability of the cylinder body 921, so that the mounting pressure is consistent when mounting a batch of chips, and the uniformity of batch mounting is improved.

[0136] Understandably, the cylinder body 921 abuts against the top end of the reference block 911 in the vertical direction through the transmission member 923, which can make the transmission path of the driving force output by the cylinder body 921 more direct and the transmission direction more explicit, avoid unnecessary loss caused by the force direction deviation of the reference block 911 in the transmission process, ensure that the driving force can fully act on the reference block 911, and thus reduce the deviation of the mounting position caused by unstable driving force transmission.

[0137] It should be noted that the cylinder body 921, the proportional valve 922 and the force control detection module 91 cooperate to realize precise control of the chip mounting down pressure, which can not only expand the adjustable range of the chip mounting down pressure, but also ensure the high precision requirement of the chip mounting down pressure. The proportional valve 922 can precisely control the constant force output by the cylinder body 921, so that the mounting down pressure between the chip and the substrate can be adjusted according to the process requirements of different chips, which can adapt to the process requirements of different types of chips. Using the cylinder body 921 to realize pneumatic driving can make the response more rapid, and cooperating with the proportional valve 922 to precisely control the constant force can quickly and stably output the pre-set driving force in the high-speed mounting process of the chip, which helps to improve the overall mounting efficiency.

[0138] Please refer to Figure 15 and Figure 18 , the mounting module 93 further comprises a vertical guide assembly 933, which is located between the force control driving module 92 and the spindle seat 932, and is sleeved on the main shaft 931; the vertical guide assembly 933 comprises a guide seat 9331, a movable shaft 9332, a guide bearing 9333 and a guide block 9334, the guide seat 9331 is provided with a hollow channel 93311 penetrating in the horizontal direction, the movable shaft 9332 and the guide bearing 9333 are arranged in the hollow channel 93311, the guide bearing 9333 is installed on the movable shaft 9332, and the movable shaft 9332 is connected with the main shaft 931, and the guide bearing 9333 and the movable shaft 9332 are perpendicular to the main shaft 931; the guide block 9334 is fixedly arranged in the hollow channel 93311 and parallel to the main shaft 931, and abuts against the outer ring of the guide bearing 9333, so that the guide bearing 9333 can slide relative to the guide block 9334.

[0139] In the binding head device 9 provided by the embodiment of the application, the vertical guide assembly 933 between the force control driving module 92 and the spindle seat 932 is sleeved on the main shaft 931, and the vertical guide assembly 933 is used to provide guidance for the main shaft 931 in the vertical direction, which helps to ensure the stability and precision of the movement of the working end of the main shaft 931 in the vertical direction, and thus improves the precision of the chip mounting and ensures the detection precision of the force control detection module 91 when the chip contacts the substrate.

[0140] It can be understood that the guide seat 9331 is provided with a hollow channel 93311 penetrating in the horizontal direction, the movable shaft 9332, the guide bearing 9333 and the guide block 9334 are arranged in the hollow channel 93311, the guide bearing 9333 is installed on the movable shaft 9332, the movable shaft 9332 is connected with the main shaft 931, the guide block 9334 is parallel to the main shaft 931, and through cooperation of the guide bearing 9333 and the guide block 9334, the vertical movement of the main shaft 931 can be further precisely guided. Wherein, the movable shaft 9332, the guide bearing 9333 and the guide block 9334 are integrated in the hollow channel 93311, the structure of the vertical guide assembly 933 can be more compact, the space occupation is reduced, the miniaturization design of the head binding device 9 is facilitated, the centralized layout of various components is also convenient for later maintenance and replacement, and the maintenance cost of the head binding device 9 is further reduced.

[0141] Further, the guide block 9334 abuts against the outer ring of the guide bearing 9333, so that the guide bearing 9333 is limited by the guide block 9334 and can only move in the vertical direction and cannot rotate relatively. Through this design, the main shaft 931 can be prevented from deviating in the horizontal direction, and the guide bearing 9333 can slide relative to the guide block 9334, the guide bearing 9333 is arranged to reduce friction during movement, and the vertical movement of the main shaft 931 is smoother.

[0142] It should be noted that the movable shaft 9332 is connected with the main shaft 931 perpendicularly, the outer ring of the guide bearing 9333 abuts against the guide block 9334 in a matching mode, a multi-directional constraint stable structure is formed, the lateral force that may be generated during the mounting process of the working end of the main shaft 931 is offset, the slight amplitude shaking of the main shaft 931 is further inhibited, and the position accuracy of the head binding device 9 during the mounting moment is ensured.

[0143] In some embodiments, the top and bottom of the hollow channel 93311 are provided with a limit for the guide bearing 9333, the guide bearing 9333 can slide up and down in the vertical direction by a distance of 3mm, which is suitable for the force stroke range required by most types of chip mounting. By setting the upper and lower limits, the force stroke can be prevented from exceeding, on the one hand, the damage of the chip and / or the substrate caused by overpressure can be avoided, and on the other hand, the safety and durability of the vertical guide assembly 933 can be enhanced, and the service life of the head binding device 9 is prolonged.

[0144] Please refer to Figure 16 and Figure 18The mounting module 93 further comprises a first guide assembly 934, a bearing assembly 936 and a suction nozzle assembly 937, the first guide assembly 934 and the bearing assembly 936 are arranged along the length direction of the main shaft 931, the suction nozzle assembly 937 is connected with the working end of the main shaft 931, the main shaft seat 932 is provided with a vacuum air port 9321 for extracting vacuum for the suction nozzle assembly 937; the first guide assembly 934 comprises an air floating bearing 9341 and an air floating bearing seat 9342, the air floating bearing 9341 is sleeved on the main shaft 931, and the air floating bearing seat 9342 is sleeved on the air floating bearing 9341; the main shaft seat 932 is sleeved on the bearing assembly 936, and the bearing assembly 936 is sleeved on the air floating bearing seat 9342, so as to form the first guide matching structure which is sequentially sleeved between the main shaft seat 932, the bearing assembly 936, the air floating bearing seat 9342 and the air floating bearing 9341.

[0145] In the binding head device 9 provided by the embodiment of the application, the air floating bearing 9341 of the first guide assembly 934 cooperates with the air floating bearing seat 9342, and the friction of the air floating bearing 9341 is low, so that the sequentially sleeved structure between the air floating bearing seat 9342, the air floating bearing 9341 and the main shaft 931 can reduce the influence of the vertical movement resistance on the mounting downward pressure in the working process of the binding head device 9, improve the detection accuracy of the binding head device 9 when the chip contacts the substrate, and improve the accuracy of the mounting downward pressure when the chip is mounted on the substrate.

[0146] It can be understood that the outer ring of the bearing assembly 936 is connected with the main shaft seat 932, the inner ring of the bearing assembly 936 is connected with the air floating bearing seat 9342, and the sequentially sleeved structure between the main shaft seat 932, the bearing assembly 936 and the air floating bearing seat 9342 forms the first guide matching mechanism, which can provide high-precision guide constraint for the main shaft 931, reduce the radial deviation of the main shaft 931 when moving in the vertical direction, and improve the stability of the main shaft 931 when completing the lifting and rotating actions.

[0147] It should be noted that the vacuum air port 9321 on the main shaft seat 932 can extract vacuum for the suction nozzle assembly 937, reduce the influence of the suction nozzle vacuum air path on the mounting force control process, avoid the deviation of the suction nozzle assembly 937 when picking up and mounting the chip, and ensure that the picking up and mounting operation of the chip by the suction nozzle assembly 937 is more reliable.

[0148] The bearing assembly 936 can ensure the accuracy of the rotating action of the main shaft 931 as a guide, and can also ensure the sealing performance of the suction nozzle vacuum air path, so that the picking up and mounting operation of the chip does not deviate.

[0149] Further, please continue to refer to Figure 16 、 Figure 18 and Figure 20The gas inlet 9322 is arranged adjacent to the vacuum gas inlet 9321 and is not communicated with each other, and the gas of the binding head device 9 passes through the inside of the suction nozzle assembly 937, and after flowing through the inside of the main shaft 931, the reference block 911, the guide seat 9331 and the gas floating bearing seat 9342, is communicated with the vacuum gas inlet 9321.

[0150] In the binding head device 9 provided by the embodiment of the application, the gas inlet 9322 can stably supply gas to the gas floating bearing 9341, and ensure that the gas floating bearing 9341 normally works to improve the motion accuracy of the main shaft 931; the gas inlet 9322 and the vacuum gas inlet 9321 are arranged adjacent to each other and are not communicated with each other, so that the gas inlet of the gas floating bearing 9341 and the vacuum gas path of the suction nozzle assembly 937 can avoid mutual interference, and the independence and stability of the respective gas paths are ensured.

[0151] It should be noted that the gas of the binding head device 9 passes through the inside of the suction nozzle assembly 937, and after flowing through the inside of the main shaft 931, the reference block 911, the guide seat 9331 and the gas floating bearing seat 9342, is communicated with the vacuum gas inlet 9321 on the main shaft seat 932, and through this design: on the one hand, the sealing property of the suction nozzle assembly 937 for extracting vacuum can be ensured, so that the stability of chip adsorption of the suction nozzle assembly 937 during picking and placing of chips is ensured, and the stability and reliability of the working of the binding head device 9 are improved as a whole; on the other hand, the suction nozzle assembly 937 and the main shaft 931 can be kept relatively stationary, so that the in-place detection of the force control detection module 91 when the chip contacts the substrate is not affected by the suction nozzle vacuum gas path, and errors are avoided.

[0152] In the embodiment of the application, the bearing assembly 936 includes two bearings sleeved on the gas floating bearing seat 9342 and a bearing spacer 9361 located between the two bearings. The bearing is a contact rubber sealing ring type bearing, which is used to improve the sealing property of the suction nozzle vacuum gas path and ensure that the process of picking and placing chips does not deviate; a sealing ring is sleeved on the groove of the bearing spacer 9361 to block the gas inlet 9322 and the vacuum gas inlet 9321, so that the suction nozzle vacuum gas path and the gas floating bearing positive pressure do not interfere with each other.

[0153] In some embodiments, the head binding device 9 further comprises a rotary drive module 94, the rotary drive module 94 comprising a servo motor 941 and a synchronous wheel assembly 942, the working end of the servo motor 941 being in transmission connection with the main shaft 931 through the synchronous wheel assembly 942; the synchronous wheel assembly 942 comprising a first synchronous wheel 9421, a second synchronous wheel 9422 and a synchronous belt 9423, the synchronous belt 9423 being sleeved on the first synchronous wheel 9421 and the second synchronous wheel 9422 at the same time, the first synchronous wheel 9421 being sleeved on the air floating bearing seat 9342 near one side of the working end of the main shaft 931, and the second synchronous wheel 9422 being sleeved on the working end of the servo motor 941.

[0154] It can be understood that the working end of the servo motor 941 is in transmission connection with the main shaft 931 through the synchronous wheel assembly 942 to drive the main shaft 931 to rotate, and the structure is small and exquisite, and the transmission mode of the synchronous belt can reduce the size of the head binding device 9 in the vertical direction, so that space can be reserved for installing the downward-looking camera, and the overall layout of the head binding device 9 is more compact; in the embodiment of the application, the outer diameter of the first synchronous wheel 9421 is greater than the outer diameter of the second synchronous wheel 9422, and the rotation angle is further subdivided to improve the angle accuracy of the head binding device 9 during mounting.

[0155] Please refer to Figure 16 and Figure 19 , the mounting module 93 further comprises a second guide assembly 935, a bearing assembly 936 and a suction nozzle assembly 937, the second guide assembly 935 and the bearing assembly 936 being arranged along the length direction of the main shaft 931, the suction nozzle assembly 937 being connected with the working end of the main shaft 931, the main shaft seat 932 being provided with a vacuum air port 9321 for extracting vacuum for the suction nozzle assembly 937; the second guide assembly 935 comprises a spline sleeve 9351 and a spline seat 9352, the spline sleeve 9351 being sleeved on the main shaft 931, and the spline seat 9352 being sleeved on the spline sleeve 9351; the main shaft seat 932 is sleeved on the bearing assembly 936, and the bearing assembly 936 is sleeved on the spline seat 9352 to form a second guide matching structure which is sequentially sleeved between the main shaft seat 932, the bearing assembly 936, the spline seat 9352 and the spline sleeve 9351; the gas of the head binding device 9 passes through the inside of the suction nozzle assembly 937, and after flowing through the inside of the main shaft 931, the reference block 911, the guide seat 9331 and the spline seat 9352, it is communicated with the vacuum air port 9321.

[0156] In the head binding device 9 provided by the embodiment of the application, the spline sleeve 9351 of the second guide assembly 935 cooperates with the spline seat 9352, the friction of the spline sleeve 9351 is low, and the sequential sleeving between the spline seat 9352, the spline sleeve 9351 and the main shaft 931 can reduce the influence of the vertical movement resistance on the mounting downward pressure during the working process of the head binding device 9, and improve the accuracy of the mounting downward pressure of the head binding device 9 for mounting the chip to the substrate.

[0157] It can be understood that the spline structure formed by the spline sleeve 9351 and the spline seat 9352 helps the main shaft 931 to transmit torque and reduce deviation during movement, and improves the guiding reliability; the outer ring of the bearing assembly 936 is connected with the main shaft seat 932, and the inner ring of the bearing assembly 936 is connected with the spline seat 9352, and after the main shaft seat 932, the bearing assembly 936 and the spline seat 9352 are sequentially sleeved, a second guiding matching mechanism is formed, which can provide high-precision guiding constraint for the main shaft 931, reduce the radial deviation of the main shaft 931 when moving in the vertical direction, and improve the stability of the main shaft 931 when completing the lifting and rotating action.

[0158] It should be noted that the vacuum air port 9321 on the main shaft seat 932 can extract vacuum for the suction nozzle assembly 937, reduce the influence of the suction nozzle vacuum air path on the mounting force control process, avoid deviation of the suction nozzle assembly 937 when picking up and mounting the chip, ensure that the picking up and mounting operation of the chip by the suction nozzle assembly 937 is more reliable, ensure that the suction nozzle assembly 937 and the main shaft 931 remain relatively stationary, so that the in-place detection of the force control detection module 91 when the chip contacts the substrate is not affected by the suction nozzle vacuum air path, thereby avoiding errors.

[0159] In the embodiment of the application, the bearing assembly 936 includes two bearings sleeved on the spline seat 9352 and a bearing spacer 9361 located between the two bearings. The bearing is a contact rubber sealing ring type bearing, which can ensure the accuracy of the main shaft 931 when completing the rotating action, and also can ensure the sealing performance of the suction nozzle vacuum air path, so as to ensure that the chip picking and mounting operation does not deviate.

[0160] In some embodiments, the binding head device 9 further includes a rotary driving module 94, which includes a servo motor 941 and a synchronous wheel assembly 942, and the working end of the servo motor 941 is drivingly connected with the main shaft 931 through the synchronous wheel assembly 942; the synchronous wheel assembly 942 includes a first synchronous wheel 9421, a second synchronous wheel 9422 and a synchronous belt 9423, the synchronous belt 9423 is sleeved on the first synchronous wheel 9421 and the second synchronous wheel 9422 at the same time, the first synchronous wheel 9421 is sleeved on one side of the spline seat 9352 close to the working end of the main shaft 931, and the second synchronous wheel 9422 is sleeved on the working end of the servo motor 941.

[0161] Understandably, the working end of the servo motor 941 is in transmission connection with the main shaft 931 through the synchronous wheel assembly 942 to drive the main shaft 931 to rotate, and the structure is small and compact, and the synchronous belt transmission mode can reduce the size of the head binding device 9 in the vertical direction, so that the space can be reserved for installing the downward-looking camera, and the overall layout of the head binding device 9 is more compact; in the embodiment of the application, the outer diameter of the first synchronous wheel 9421 is larger than that of the second synchronous wheel 9422, and the rotation angle is further subdivided to improve the angle accuracy of the head binding device 9 during mounting.

[0162] Please refer to Figure 18 , Figure 19 , wherein, Figure 18 is the internal structure sectional view of the mounting module 93 provided with the air floating bearing 9341 and the air floating bearing seat 9342, Figure 19 is the internal structure sectional view of the mounting module 93 provided with the spline sleeve 9351 and the spline seat 9352, the scheme of the air floating bearing 9341 and the air floating bearing seat 9342 is consistent with the scheme of the spline sleeve 9351 and the spline seat 9352, but the mounting effect is slightly different.

[0163] Understandably, the friction coefficient of the air floating bearing is usually between 0.0001 and 0.0002, and the friction coefficient of the spline is usually between 0.0006 and 0.003, so from the friction coefficient, the mounting and pressing force accuracy of the air floating bearing scheme is higher. The embodiment of the application adopts the low-friction spline sleeve 9351 as the Z-axis guide of the main shaft 931, which can reduce the influence of the Z-axis movement resistance on the mounting and pressing force of the main shaft 931, and improve the mounting and pressing force accuracy of the head binding device 9; if the air floating bearing 9341 is used to replace the spline sleeve 9351, the resistance of the Z-axis movement will be further reduced, and the mounting and pressing force accuracy of the head binding device 9 will be further improved.

[0164] Please refer to Figure 15 , Figure 18 and Figure 20 , the internal structure of the mounting module 93 is also provided with a magnetic spring assembly 938 and a magnetic rod seat 939, the magnetic spring assembly 938 includes an iron block 9381 and a magnetic rod 9382, and the magnetic rod seat 939 is fixedly arranged in the hollow channel 93311; the magnetic rod 9382 is connected with the magnetic rod seat 939, the iron block 9381 is located in the hollow channel 93311, and there is a gap between the iron block 9381 and the magnetic rod 9382; the iron block 9381 is provided with a holding structure, and the iron block 9381 is connected with the main shaft 931 through the holding structure, and the iron block 9381 is threadedly connected with the movable shaft 9332; the iron block 9381 can move relative to the magnetic rod 9382 in the vertical direction through the magnetic force to drive the main shaft 931 to move synchronously to realize the elastic reset of the main shaft 931 in the vertical direction.

[0165] In the head binding device 9 provided by the embodiment of the present application, the magnetic spring assembly 938 and the magnetic rod seat 939 are arranged inside the mounting module 93, the magnetic spring assembly 938 comprises an iron block 9381 and a magnetic rod 9382, the magnetic rod seat 939 is fixedly arranged in the hollow channel 93311, that is, the magnetic rod seat 939 is fixed together with the guide seat 9331, and the main function of the magnetic rod seat 939 is to fix the magnetic rod 9382; the magnetic spring assembly 938 is integrated inside the mounting module 93, the structure layout is more compact, the external space of the head binding device 9 is not additionally occupied, and the miniaturization and integration of the head binding device 9 are facilitated.

[0166] Understandably, the iron block 9381 is connected with the main shaft 931 through the holding structure and is also threadedly connected with the movable shaft 9332, so that the magnetic spring is formed between the iron block 9381 and the magnetic rod 9382, the relative movement of the iron block 9381 and the magnetic rod 9382 is realized through the magnetic force, the iron block 9381 can drive the main shaft 931 to be elastically reset in the vertical direction, the self-weight of the main shaft 931 and the self-weight of the load located above the main shaft 931 are balanced, the false alarm of the signal amplifier 913 is reduced or even eliminated when the main shaft 931 is not elastically reset in the vertical direction, and the false alarm rate of the signal amplifier 913 is reduced or even eliminated.

[0167] It should be noted that there is a gap between the iron block 9381 and the magnetic rod 9382, and the iron block 9381 and the magnetic rod 9382 do not contact each other, the non-contact reset mode driven by the magnetic force can reduce mechanical wear, improve the service life of the head binding device 9, avoid the influence of the tension of the traditional spring on the fitting force between the chip and the substrate when the traditional spring is reset, gradually shorten the maintenance period of the traditional spring and related components, and gradually increase the maintenance cost.

[0168] In some embodiments, the movable shaft 9332 is connected with the main shaft 931 perpendicularly, the iron block 9381 is connected with the main shaft 931 through the holding structure, and the iron block 9381 is also threadedly connected with the movable shaft 9332, so that the double fixation of “the main shaft 931 is connected with the iron block 9381 and the movable shaft 9332 respectively” and “the iron block 9381 is connected with the movable shaft 9332” is formed, the relative looseness among the iron block 9381, the main shaft 931 and the movable shaft 9332 is avoided, the elastic reset force of the magnetic spring in the vertical direction can be efficiently transmitted to the main shaft 931, and reset lag or position deviation caused by the gap in the connection is avoided.

[0169] Please refer to Figure 21 For the convenience of understanding, the embodiment of the present application further provides a mounting method applied to the above head binding device to mount the chip to the substrate, and the mounting method comprises the following steps:

[0170] S1: preset a mounting threshold of the signal amplifier, the mounting threshold is used to judge whether the working end of the spindle is subjected to an overshoot force;

[0171] S2: the photoelectric sensor emits a light source to the top surface of the reference block, the working end of the spindle picks up the chip, before the chip contacts the substrate, the signal amplifier obtains a first position of the reference block when the reference block is static by detecting the light amount of the light source reflected and received, and obtains a second position of the reference block when the chip contacts the substrate;

[0172] S3: the signal amplifier calculates a height variation of the reference block according to the first position and the second position, and compares the height variation with the mounting threshold;

[0173] S4: when the height variation does not exceed the mounting threshold, the signal amplifier sends a mounting signal to the force control driving module, the force control driving module drives the spindle to move downward in the vertical direction through the reference block to mount the chip to the substrate; when the height variation exceeds the mounting threshold, the signal amplifier generates an alarm.

[0174] The mounting method of the embodiment of the present application is applied to the above-described binding head device to mount the chip to the substrate, and has the same beneficial effects as the above-described binding head device.

[0175] It can be understood that the signal amplifier is connected with the photoelectric sensor, the photoelectric sensor detects the position of the reference block by emitting a light source and detecting the light amount of the light source reflected and received by the signal amplifier before the chip contacts the substrate and when the chip contacts the substrate, and the signal amplifier can calculate the height variation of the reference block according to the position change of the reference block.

[0176] In the mounting method provided by the embodiment of the present application, the height variation is compared with the mounting threshold, whether the working end of the spindle is subjected to an overshoot force when the chip is picked up and contacted to the substrate can be judged, when the height variation is lower than the mounting threshold, the force control driving module can normally drive the working end of the spindle to complete the mounting, when the height variation is higher than the mounting threshold, the signal amplifier will generate an alarm, the chip is prevented from being damaged due to an overshoot force, the mounting quality of the binding head device is ensured, and the scrap rate of the chip is further reduced.

[0177] Specifically, in step S1, the signal amplifier is connected with the photoelectric sensor to ensure that the detected reference block position signal can be stably transmitted and analyzed, to provide a reliable signal basis for subsequent mounting threshold judgment, and to ensure the accuracy and real-time performance of signal transmission; by pre-setting the mounting threshold, a clear quantitative standard can be provided for force control judgment in the mounting process, to avoid the signal amplifier from sending a mounting signal to the force control driving module when the chip and the substrate have not yet contacted, which affects the mounting effect of the chip; at the same time, it is also convenient to flexibly adjust the mounting threshold according to the process requirements of different chips and substrates, to adapt to different mounting process requirements. The photoelectric sensor in the embodiment of the application is specifically a fiber optic sensor, and the cooperation of the fiber optic sensor and the signal amplifier can send a feedback signal when the chip and the substrate are in contact, and can also send an alarm when the chip is subjected to an overshoot.

[0178] In step S2, the position of the reference block is detected in stages, the static position of the reference block before the chip and the substrate are in contact is detected first, and then the position change of the reference block when the chip and the substrate are in contact is detected, so as to facilitate the signal amplifier to calculate the height change amount of the reference block when the chip and the substrate are in contact; in step S3, the height change amount of the reference block is calculated by the signal amplifier, and the height change amount is compared with the mounting threshold, to determine whether the external force acting on the working end of the main shaft when the chip is picked up and mounted to contact the substrate is an overshoot.

[0179] In step S4, according to the comparison result of the height change amount and the mounting threshold, a mounting or alarm action is performed, to form an instant response mechanism of "detection, judgment and execution", to ensure the continuity of normal mounting, and also to provide an alarm for the technician when the external force acting on the working end of the main shaft is an overshoot, to further realize the operation of quickly interrupting the mounting process, to avoid damage to the chip and / or the substrate, and to reduce the probability of overall die bonding equipment downtime for maintenance.

[0180] The above has introduced in detail a mounting assembly and a die bonding equipment disclosed in the embodiment of the application, specific examples have been applied in this paper to describe the principles and implementation modes of the application, and the above embodiment description is only used to help understand the method of the application and its core idea. Meanwhile, for those skilled in the art, according to the idea of the application, the specific implementation mode and application range will be changed, and the above description should not be understood as a limitation on the application. Any modification, equivalent replacement and improvement within the principles of the application should be included in the protection scope of the application.

Claims

1. A mounting assembly, characterized by: The first fixed seat is provided with a first fixed plate and a second fixed plate at intervals, the first fixed plate is provided with a first driving part, the second fixed plate is provided with a second driving part, the first driving part is provided with a load mechanism, the second driving part is provided with a mounting mechanism, and the load mechanism and the mounting mechanism move towards or away from each other under the driving of the first driving part and the second driving part. The mounting mechanism comprises a binding head device, the binding head device comprises a force control detection module, the force control detection module comprises a reference block, a photoelectric sensor and a signal amplifier, the signal amplifier is signal connected with the photoelectric sensor, the photoelectric sensor can emit light source to the top surface of the reference block, and when the chip contacts the substrate, the signal amplifier determines the height variation of the reference block by detecting the change of the received light amount of the light source.

2. The pick-and-place assembly of claim 1, wherein: The first fixed plate and the second fixed plate are arranged in line along the length direction, and the first fixed plate and the second fixed plate are perpendicular to the first fixed seat. The first fixed plate is provided with a first sliding rail along the length direction, the second fixed plate is provided with a second sliding rail along the length direction, and the load mechanism and the mounting mechanism are respectively connected with the first sliding rail and the second sliding rail.

3. The assembly of claim 2, wherein: The second fixed plate is provided with a third sliding rail, the third sliding rail is provided with a third driving part, the third driving part is provided with a third fixed plate, and the third fixed plate is fixedly connected with the second sliding rail. The third sliding rail is perpendicular to the second sliding rail, and the second sliding rail and the third sliding rail are connected through the third fixed plate.

4. The pick-and-place assembly of claim 3, wherein: The second fixed plate is provided with a relief groove on the side facing the third fixed plate, the third fixed plate comprises a first connecting part and a second connecting part, the first connecting part is fixedly connected with the third driving part, and the second connecting part is fixedly connected with the second sliding rail. The first connecting part and the second connecting part are provided with a reinforcing rib, and the reinforcing rib is gap fitted with the relief groove.

5. The pick-and-place assembly of claim 1, wherein: The binding head device comprises a force control driving module and a mounting module. The mounting module comprises a main shaft and a main shaft seat, the main shaft is provided with a transmission end and a working end at two ends respectively, the main shaft is arranged in the main shaft seat, and the main shaft can move up and down relative to the main shaft seat, and the working end of the main shaft is exposed outside the main shaft seat. The top end of the reference block is connected with the force control driving module, the bottom end of the reference block is connected with the transmission end of the main shaft, the photoelectric sensor is arranged in the main shaft seat, one end of the light source emitted by the photoelectric sensor extends into the inside of the main shaft seat, and the other end of the photoelectric sensor is connected to the signal amplifier.

6. The pick-and-place assembly of claim 5, wherein The photoelectric sensor and the top surface of the reference block are arranged at an inclination angle θ, the light source emitted by the photoelectric sensor is aligned with the middle region of the top surface of the reference block, and the inclination angle θ ranges from 0° to 90°. The photoelectric sensor is one of a fiber sensor, a laser ranging sensor, a grating sensor and an infrared sensor.

7. A die bonding apparatus, characterized in that: The control assembly, the track assembly and the first fixing seat are arranged side by side, the first fixing seat is sequentially provided with a point gluing assembly, a lower visual assembly and the mounting assembly as claimed in any one of claims 1-6 along the length direction, the track assembly is provided with a feeding assembly and a discharging assembly at both ends, the track assembly is provided with a wafer assembly on the side away from the first fixing seat, and the wafer assembly and the mounting assembly are positionally corresponding; The control assembly is signal connected with the track assembly, the feeding assembly, the point gluing assembly, the lower visual assembly, the wafer assembly, the mounting assembly and the discharging assembly respectively.

8. The die bonding apparatus of claim 7, wherein: The point gluing assembly comprises a second visual detector, a first base, a horizontal driving member arranged at the bottom of the first base, and a vertical driving member arranged at the side of the first base, and the vertical driving member is detachably provided with a dust removal mechanism and / or a point gluing mechanism on the side away from the first base, and the second visual detector is used for identifying micro dust on the substrate; The point gluing mechanism comprises a first visual detector and a point gluing head, and the first visual detector and the point gluing head are signal connected, the dust removal mechanism comprises a storage tank, a gas pipe and a dust removal head, the dust removal head is provided with a suction gas path and a blowing gas path, one end of the gas pipe is connected with the storage tank, and the other end is connected with the suction gas path; The vertical driving member is fixedly provided with a mounting bracket, the mounting bracket comprises first and second installation plates arranged at intervals, the first installation plate is fixedly connected with the vertical driving member on the side away from the second installation plate, the first visual detector is fixed between the first and second installation plates, the storage tank is fixed on the side of the first installation plate, and the second installation plate is detachably provided with the point gluing head and / or the dust removal head on the side away from the first installation plate.

9. The die bonding apparatus of claim 7, wherein: The track assembly comprises a second fixing seat, a first guide rail fixedly installed on the second fixing seat, and a second guide rail movably installed on the second fixing seat and arranged at intervals with the first guide rail, the opposite sides of the first and second guide rails are provided with first bosses, the first bosses are arranged along the length direction of the track assembly, and the first bosses are used for carrying the substrate transported from the feeding assembly; The second fixing seat is provided with a limit sensor on the side away from the first guide rail, the limit sensor is signal connected with the control assembly, and when the second guide rail moves to a distance less than a preset threshold from the limit sensor, the control assembly controls the second guide rail to stop moving.

10. The die bonding apparatus of claim 9, wherein: The second fixing seat is further provided with a heating table, the heating table is located between the first and second guide rails, and the heating table is sequentially provided with first, second and third heating zones along the length direction of the track assembly; The first and / or second guide rail is provided with a pressing block at a position corresponding to the heating table, the pressing block can move axially relative to the heating table to fix the substrate on the heating table, and the heating table is provided with a vacuum suction channel for suction of the substrate.

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