Silicon optical chip laser bonding equipment

Abstract

The invention relates to the technical field of semiconductor manufacturing equipment, in particular to silicon optical chip laser bonding equipment, which comprises a table body, a processing frame is fixedly mounted on the upper surface of the table body, a lifting cylinder is mounted on the processing frame, and a laser bonder is fixedly mounted at the bottom end of a driving shaft of the lifting cylinder; a refrigeration cabinet is fixedly mounted on the upper surface of the mounting plate, a driving shaft of the lifting air cylinder is fixedly sleeved with a fixing block, vertical rods are symmetrically and fixedly mounted on the upper surface of the fixing block, air grooves are vertically formed in the top ends of the vertical rods, and piston rods are slidably and hermetically inserted into the air grooves; the top end of the piston rod is fixedly connected with the inner top wall of the machining frame, and an air outlet pipe is fixedly installed at the bottom end of the vertical rod. By means of the action of vertical reciprocating movement in the bonding process of the laser bonder and cooperation between the piston rod and the vertical rod, after bonding is completed, cold air in the refrigeration cabinet can be sprayed to the surface of the laser head, and therefore the effect of cooling the laser head in time is achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and in particular to a silicon photonic chip laser bonding device. Background Technology

[0002] In the manufacturing process of silicon photonics chips, high-precision connections between silicon photonics chips and other optical components or substrates are required using laser bonding equipment. The laser bonding equipment uses a high-energy-density laser beam, which is focused on the connection area between the silicon photonics chip and the object to be bonded. The laser energy is absorbed by the material and converted into heat energy, which rapidly heats the material in the bonding area to its melting point or softening point. Under the combined action of pressure and temperature, the materials are fused or tightly bonded, thus forming a reliable optical and mechanical connection.

[0003] The laser head of existing laser bonding equipment generates heat when bonding silicon photonic chips. Although the bonding time is short, long-term continuous bonding will cause heat to accumulate. Excessive temperature will affect the performance and lifespan of the components inside the laser head, thus adversely affecting the quality and efficiency of silicon photonic chip laser bonding. Summary of the Invention

[0004] The purpose of this invention is to address the following shortcomings in the prior art: the laser head of existing laser bonding equipment generates heat when bonding silicon photonic chips. Although the bonding time is short, long-term continuous bonding will cause heat accumulation. Excessive temperature will affect the performance and lifespan of the components inside the laser head, thereby adversely affecting the quality and efficiency of silicon photonic chip laser bonding. Therefore, this invention proposes a silicon photonic chip laser bonding device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A silicon photonics chip laser bonding device includes a platform, a processing frame is fixedly installed on the upper surface of the platform, a lifting cylinder is fixedly installed at the top inside the processing frame, a laser bonder is fixedly installed at the bottom end of the drive shaft of the lifting cylinder, and a placement component for carrying the silicon photonics chip and the object to be bonded is provided on the upper surface of the platform. A mounting plate is fixedly installed on the back of the processing frame, and a refrigeration cabinet is fixedly installed on the upper surface of the mounting plate. A fixing block is fixedly sleeved on the drive shaft of the lifting cylinder. Vertical rods are symmetrically fixedly installed on the upper surface of the fixing block. An air groove is vertically opened at the top of the vertical rod, and a piston rod is slidably and sealed inside the air groove. The top of the piston rod is fixedly connected to the top wall inside the processing frame. An air outlet pipe is fixedly installed at the bottom of the vertical rod. The bottom of the air outlet pipe passes through the fixing block and faces the laser head of the laser bonder. The vertical rod is connected to the refrigeration cabinet through an air inlet pipe. Both the air inlet pipe and the air outlet pipe are equipped with one-way valves.

[0006] Preferably, the one-way valve in the air inlet pipe is directed from inside the refrigeration cabinet to inside the air tank, and the one-way valve in the air outlet pipe is directed from inside the air tank to the outside.

[0007] Preferably, the placement assembly includes a placement box that slides in contact with the upper surface of the stage. The upper surface of the placement box has a limiting groove adapted to the shape of the object to be bonded. A limiting frame is fixedly installed on the inner wall of the limiting groove via a connecting rod. The hollow cross-sectional shape of the limiting frame is adapted to the shape of the silicon photonic chip. The limiting groove and the limiting frame are used to limit the displacement of the object to be bonded and the silicon photonic chip during the bonding process, respectively. The upper surface of the placement box has a push opening communicating with the limiting groove, and the surface of the placement box has openings that communicate with the limiting groove. The unloading trough is connected to the slot. The left and right side walls of the placement box have openings. Sliding rods are slidably inserted into the openings. Baffles are fixedly installed at the ends of the two sliding rods that are close to each other, and mounting blocks are fixedly installed at the ends of the two sliding rods that are far apart. The mounting blocks are connected to the placement box through telescopic components. The two baffles are used to support the objects to be bonded located in the limiting slots. The bottom of the push opening is higher than the top of the baffles. The placement box is controlled to move laterally by a pressing component. The two sliding rods are controlled to move away from each other by a drive component.

[0008] Preferably, the telescopic component includes a telescopic spring sleeved on the slide rod, with both ends of the telescopic spring fixedly connected to the mounting block and the placement box, respectively.

[0009] Preferably, the pressing component includes two bent rods and two abutment rods respectively fixedly installed on both sides of the fixed block. The surface of the bent rods is provided with slide rails, which are composed of an integrally formed bevel and a straight opening. The bottom ends of the two bent rods are fixedly connected to the upper surface of the placement box by bolts. The ends of the two abutment rods that are far apart from each other are slidably arranged in the two slide rails. Straight rods are symmetrically fixedly installed on the inner wall of the processing frame, and the two bent rods are slidably sleeved on the two straight rods respectively.

[0010] Preferably, the bottom of the placement box is provided with multiple spherical grooves, and rolling balls are embedded in the spherical grooves, and the rolling balls are in rolling contact with the platform.

[0011] Preferably, the drive assembly includes two symmetrically vertically fixed push rods and two inclined plates fixedly installed on the upper surface of the platform. A connecting rod is fixedly installed on the lower surface of the mounting block. The two inclined plates are respectively fixedly installed at the bottom ends of the two connecting rods, and the two inclined plates are symmetrically arranged. An opening is opened on the surface of the inclined plate, and a rotating opening is opened on the top wall of the opening. A rotating shaft is rotatably installed in the rotating opening. A mounting block is fixedly installed at the top end of the rotating shaft. The mounting block is connected to the inclined plate through an elastic component. A rotating plate is fixedly installed at the bottom end of the rotating shaft. The rotating plate restricts the rotation direction through a rotation limiting component. The two openings correspond to the positions of the two push rods respectively.

[0012] Preferably, the elastic component includes a torsion spring sleeved on the rotating shaft, with both ends of the torsion spring fixedly connected to the mounting block and the inclined plate, respectively.

[0013] Preferably, the rotation limiting component includes a rotation limiting rod that is vertically fixedly installed on the top of the rotating plate, and the top wall of the opening has an arc-shaped rotation limiting opening with the rotating shaft as the center, and the rotation limiting rod is slidably disposed in the rotation limiting opening.

[0014] Preferably, the surface of the processing frame is symmetrically rotatably connected to a frame door, the surface of the frame door is provided with an observation port, and a transparent glass is embedded in the observation port.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. By utilizing the vertical reciprocating motion of the laser bonder during the bonding process, and the cooperation between the piston rod and the vertical rod, cold air from the cooling cabinet can be sprayed onto the surface of the laser head after bonding is completed, thereby achieving the effect of timely cooling of the laser head; 2. Through the cooperation between the limiting frame and the limiting groove, the silicon photonics chip and the object to be bonded can be fixed quickly, avoiding positional displacement between the silicon photonics chip and the object to be bonded, which would affect the bonding quality; 3. When bonding is complete, the placement box will move during the upward movement of the laser bonder and will no longer be located below the laser bonder. This avoids the safety hazard that would occur if the operator's hand was located below the laser bonder when placing subsequent silicon photonic chips and objects to be bonded. 4. When the laser bonder moves upward and the placement box moves laterally, the bonded silicon photonic chip will be automatically unloaded without manual handling, thus improving the bonding efficiency. Attached Figure Description

[0016] Figure 1 This is a front three-dimensional structural diagram of a silicon photonic chip laser bonding device proposed in this invention; Figure 2 This is a three-dimensional back view of a silicon photonics chip laser bonding device proposed in this invention. Figure 3 This is a partial frontal three-dimensional structural diagram of the platform and processing frame of a silicon photonic chip laser bonding device proposed in this invention. Figure 4 This is a top-view three-dimensional structural diagram of the platform and processing frame of a silicon photonic chip laser bonding device proposed in this invention. Figure 5 This is a top-view three-dimensional structural diagram of the component placement area in a silicon photonic chip laser bonding device proposed in this invention; Figure 6This is a partial bottom-view three-dimensional structural diagram of the component placement area in a silicon photonic chip laser bonding device proposed in this invention; Figure 7 This is a partial three-dimensional structural diagram of the baffle and inclined plate in a silicon photonic chip laser bonding device proposed in this invention. Figure 8 This is a partial three-dimensional structural diagram of the baffle and inclined plate in a silicon photonic chip laser bonding device proposed in this invention; Figure 9 for Figure 3 Enlarged structural diagram at point A in the middle; Figure 10 for Figure 4 Enlarged structural diagram at point B.

[0017] In the diagram: 1. Body, 2. Processing frame, 3. Lifting cylinder, 4. Laser bonder, 5. Refrigeration cabinet, 6. Fixing block, 7. Vertical rod, 8. Transparent glass, 9. Piston rod, 10. Air outlet pipe, 11. Air inlet pipe, 12. Placement box, 13. Limiting groove, 14. Limiting frame, 15. Push port, 16. Unloading groove, 17. Slide rod, 18. Baffle, 19. Mounting block, 20. Telescopic spring, 21. Bending rod, 22. Abutment rod, 23. Angled opening, 24. Straight opening, 25. Straight rod, 26. Rolling ball, 27. Push rod, 28. Angled plate, 29. Through port, 30. Rotating shaft, 31. Rotating plate, 32. Torsion spring, 33. Rotation limiting rod, 34. Rotation limiting port, 35. Frame door. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0019] Reference Figures 1-10 A silicon photonics chip laser bonding device includes a platform 1, a processing frame 2 fixedly mounted on the upper surface of the platform 1, a lifting cylinder 3 fixedly mounted on the top of the processing frame 2, a laser bonder 4 fixedly mounted on the bottom end of the drive shaft of the lifting cylinder 3, a placement component for carrying the silicon photonics chip and the object to be bonded on the upper surface of the platform 1, a frame door 35 symmetrically rotatably connected to the surface of the processing frame 2, an observation port opened on the surface of the frame door 35, and a transparent glass 8 embedded in the observation port.

[0020] A mounting plate is fixedly installed on the back of the processing frame 2. A refrigeration cabinet 5 is fixedly installed on the upper surface of the mounting plate (the refrigeration cabinet 5 is existing technology and is mainly used to manufacture and store cold air; its working principle will not be described in detail here). A fixing block 6 is fixedly sleeved on the drive shaft of the lifting cylinder 3. Vertical rods 7 are symmetrically fixedly installed on the upper surface of the fixing block 6. A vertical air groove is vertically opened at the top of the vertical rod 7. A piston rod 9 is slidably and sealed inside the air groove. The top of the piston rod 9 is fixedly connected to the inner top wall of the processing frame 2. An air outlet pipe 10 is fixedly installed at the bottom of the vertical rod 7. The bottom of the air outlet pipe 10 passes through the fixing block 6 and faces the laser head of the laser bonder 4. The vertical rod 7 is connected to the refrigeration cabinet 5 through the air inlet pipe 11. Both the air inlet pipe 11 and the air outlet pipe 10 are equipped with one-way valves. The one-way valve in the air inlet pipe 11 is directed from inside the refrigeration cabinet 5 to inside the air groove, and the one-way valve in the air outlet pipe 10 is directed from inside the air groove to the outside.

[0021] First, the object to be bonded and the silicon photonic chip are placed on the placement assembly, and the placement assembly is moved to a suitable position. Then, the lifting cylinder 3 is activated to control the laser bonder 4 to move downward, so that the laser head of the laser bonder 4 performs laser bonding processing on the object to be bonded and the silicon photonic chip located on the placement assembly. During the downward movement of the laser bonder 4, the fixing block 6 moves downward along with the two vertical rods 7. The volume of the space between the bottom of the gas groove and the bottom of the piston rod 9 increases, and the pressure decreases. The cold air in the cooling cabinet 5 enters the gas groove from the air inlet pipe 11. When the bonding process is completed, the lifting cylinder 3 moves the laser bonder 4 upward, and the fixing block 6 also moves upward along with the two vertical rods 7. The volume of the space between the bottom of the gas groove and the bottom of the piston rod 9 decreases, and the pressure increases. The cold air in the gas groove is then ejected from the air outlet pipe 10 and acts on the surface of the laser head of the laser bonder 4, thereby achieving the effect of timely cooling of the laser head.

[0022] The placement assembly includes a placement box 12 that slides in contact with the upper surface of the platform 1. The upper surface of the placement box 12 has a limiting groove 13 adapted to the shape of the object to be bonded. A limiting frame 14 is fixedly installed on the inner wall of the limiting groove 13 via a connecting rod. The hollow cross-sectional shape of the limiting frame 14 is adapted to the shape of the silicon photonic chip. The limiting groove 13 and the limiting frame 14 are used to limit the displacement of the object to be bonded and the silicon photonic chip during the bonding process, respectively. The upper surface of the placement box 12 has a push opening 15 communicating with the limiting groove 13. The surface of the placement box 12 has a discharge groove 16 communicating with the limiting groove 13. Both the left and right side walls of the placement box 12 have through openings, and sliding rods 17 are slidably inserted into the through openings. The ends of the two sliding rods 17 that are close to each other are fixed. A baffle 18 is fixedly installed. Mounting blocks 19 are fixedly installed at the ends of two sliding rods 17 that are far apart from each other. The mounting blocks 19 are connected to the placement box 12 via telescopic components. The telescopic components include telescopic springs 20 sleeved on the sliding rods 17. The two ends of the telescopic springs 20 are fixedly connected to the mounting blocks 19 and the placement box 12, respectively. The two baffles 18 are used to support the objects to be bonded located in the limiting grooves 13. The bottom of the push opening 15 is higher than the top of the baffles 18. The placement box 12 is controlled to move laterally by a pressing component. The pressing component includes two bent rods 21 and two abutment rods 22 fixedly installed on both sides of the fixed block 6. A slide rail is formed on the surface of the bent rods 21, consisting of an integrally formed bevel 23 and a straight opening 24. The two bent rods... The bottom ends of 21 are fixedly connected to the upper surface of the placement box 12 by bolts. The bolt fasteners facilitate quick replacement of placement boxes 12 with different shaped limiting grooves 13 and limiting frames 14. The ends of the two abutment rods 22 that are far apart from each other are slidably arranged in two slide rails. Straight rods 25 are symmetrically fixedly installed on the inner wall of the processing frame 2. Two bent rods 21 are slidably sleeved on the two straight rods 25. The two slide rods 17 are controlled to move away from each other by a drive assembly. The drive assembly includes two push rods 27 that are symmetrically and vertically fixedly installed on the upper surface of the platform 1 and two inclined plates 28. A connecting rod is fixedly installed on the lower surface of the mounting block 19. The two inclined plates 28 are fixedly installed at the bottom ends of the two connecting rods, and the two inclined plates 28 are symmetrically arranged. The surface has an opening 29, and the top wall of the opening 29 has a rotating opening. A rotating shaft 30 is rotatably installed inside the rotating opening. A mounting block is fixedly installed at the top of the rotating shaft 30. The mounting block is connected to the inclined plate 28 through an elastic component. The elastic component includes a torsion spring 32 sleeved on the rotating shaft 30. The two ends of the torsion spring 32 are fixedly connected to the mounting block and the inclined plate 28, respectively. A rotating plate 31 is fixedly installed at the bottom of the rotating shaft 30. The rotating plate 31 restricts the rotation direction through a rotation limiting component. The rotation limiting component includes a rotation limiting rod 33 vertically fixedly installed at the top of the rotating plate 31. An arc-shaped rotation limiting opening 34 is opened on the top wall of the opening 29 with the rotating shaft 30 as the center. The rotation limiting rod 33 is slidably arranged in the rotation limiting opening 34. The two openings 29 correspond to the positions of the two push rods 27, respectively.

[0023] When the laser bonder 4 is at its highest point, the two abutment rods 22 will be located at the highest points of the two inclined openings 23 respectively, and the placement box 12 will also be located near the opening of the processing frame 2, not below the laser bonder 4. At this time, the two baffles 18 will abut against each other, thereby sealing the bottom of the limiting groove 13. The object to be bonded can then be pushed into the limiting groove 13 from the push opening 15. After the object to be bonded enters the limiting groove 13, its bottom will abut against the upper surface of the baffle 18, and the object to be bonded will not move due to the obstruction of the groove wall of the limiting groove 13. Then, the silicon photonic chip is placed in the limiting frame 14, so that the bottom of the silicon photonic chip abuts against the upper surface of the object to be bonded. The part where the silicon photonic chip contacts the object to be bonded is the bonding part.

[0024] Then, the lifting cylinder 3 controls the laser bonder 4 to move downwards. During this process, the two abutment rods 22 slide in the two inclined openings 23 respectively. Under the pressure of the inclined surface, the placement box 12 moves towards the processing frame 2. During this process, the two push rods 27 enter the two through openings 29 respectively and push the rotating plate 31 located in the through opening 29 to rotate. The rotation limit rod 33 rotates out from the rotation limit opening 34 until the push rod 27 no longer contacts the rotating plate 31. At this time, the rotating plate 31 will quickly rotate and reset under the elastic potential energy of the torsion spring 32, and the rotation limit rod 33 will re-enter the rotation limit opening 34 until the bonding part moves to the position directly below the laser head of the laser bonder 4. At this time, as the laser head of the laser bonder 4 moves downwards, the two abutment rods 22 will slide from the two inclined openings 23 into the two straight openings 24 respectively. Thus, when the laser head moves downwards, the abutment rods 22 will not press against the placement box 12 to move.

[0025] When bonding is complete, as the laser bonder 4 moves upward, the two abutment rods 22 will enter the two inclined holes 23 from the two straight holes 24 respectively. Under the pressure of the inclined surface, the placement box 12 will move towards the opening of the processing frame 2.

[0026] During this process, the two rotating plates 31 will abut against the two push rods 27 respectively. Due to the restriction of the rotating rods 33 and the rotation limit opening 34, the rotating plates 31 cannot rotate inward towards the processing frame 2. As a result, the push rods 27 will slide in contact with the surface of the rotating plates 31. Under the action of the inclined surface, the two inclined plates 28 will move away from each other, carrying the two sliding rods 17 and the two baffles 18 respectively, until the two baffles 18 move to the bottom of the sealing limit groove 13 and are no longer covered. The silicon photonic chip will fall from the bottom of the limiting groove 13 into the unloading groove 16. When the laser bonder 4 moves to the top, the two inclined plates 28 will no longer contact the two push rods 27. The two inclined plates 28, the two slide rods 17 and the two baffles 18 will move and reset quickly under the elastic potential energy of the extension spring 20. The two baffles 18 will abut against each other again, thereby sealing and covering the bottom of the limiting groove 13, which is convenient for placing subsequent bonding objects and silicon photonic chips.

[0027] That is, through the cooperation between the limiting frame 14 and the limiting groove 13, the silicon photonics chip and the object to be bonded can be fixed quickly, avoiding positional displacement between the silicon photonics chip and the object to be bonded, which would affect the bonding quality.

[0028] When bonding is complete, as the laser bonder 4 moves upward, the placement box 12 will move and will no longer be located below the laser bonder 4. This avoids the safety hazard that would occur if the operator's hand was located below the laser bonder 4 when placing subsequent silicon photonic chips and objects to be bonded.

[0029] When the laser bonder 4 moves upward and the placement box 12 moves laterally, the bonded silicon photonic chip will automatically be unloaded without manual handling, thus improving the efficiency of the bonding process.

[0030] The bottom of the placement box 12 is provided with multiple spherical grooves, and rolling balls 26 are rolled and embedded in the spherical grooves. The rolling balls 26 roll and contact with the platform 1, and the rolling balls 26 can reduce the friction between the contact surfaces of the placement box 12 and the platform 1.

[0031] In this invention, the object to be bonded and the silicon photonic chip are first placed on the placement assembly, and the placement assembly is moved to a suitable position. At this time, the lifting cylinder 3 is activated to control the laser bonder 4 to move downward, so that the laser head of the laser bonder 4 performs laser bonding processing on the object to be bonded and the silicon photonic chip located on the placement assembly. During the downward movement of the laser bonder 4, the fixing block 6 moves downward along with the two vertical rods 7. The volume of the space between the bottom of the gas groove and the bottom of the piston rod 9 increases, and the pressure decreases. The cold air in the cooling cabinet 5 enters the gas groove from the air inlet pipe 11. When the bonding processing is completed, the lifting cylinder 3 moves the laser bonder 4 upward along with the lifting cylinder 3. The fixing block 6 also moves upward along with the two vertical rods 7. The volume of the space between the bottom of the gas groove and the bottom of the piston rod 9 decreases, and the pressure increases. The cold air in the gas groove is ejected from the air outlet pipe 10 and acts on the surface of the laser head of the laser bonder 4, thereby achieving the effect of timely cooling of the laser head.

[0032] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A silicon photonics chip laser bonding device, comprising a platform (1), characterized in that, A processing frame (2) is fixedly installed on the upper surface of the platform (1). A lifting cylinder (3) is fixedly installed at the top inside the processing frame (2). A laser bonder (4) is fixedly installed at the bottom of the drive shaft of the lifting cylinder (3). A placement component for carrying silicon photonic chips and objects to be bonded is provided on the upper surface of the platform (1). A mounting plate is fixedly installed on the back of the processing frame (2), and a refrigeration cabinet (5) is fixedly installed on the upper surface of the mounting plate. A fixing block (6) is fixedly sleeved on the drive shaft of the lifting cylinder (3). Vertical rods (7) are symmetrically fixedly installed on the upper surface of the fixing block (6). A vertical groove is opened at the top of the vertical rod (7). A piston rod (9) is slidably and sealed in the groove. The top of the piston rod (9) is fixedly connected to the top wall inside the processing frame (2). An air outlet pipe (10) is fixedly installed at the bottom of the vertical rod (7). The bottom of the air outlet pipe (10) passes through the fixing block (6) and faces the laser head of the laser bonder (4). The vertical rod (7) is connected to the refrigeration cabinet (5) through the air inlet pipe (11). A one-way valve is provided in both the air inlet pipe (11) and the air outlet pipe (10).

2. The silicon photonic chip laser bonding device according to claim 1, characterized in that, The one-way valve in the air inlet pipe (11) is open from inside the refrigeration cabinet (5) to inside the air tank, and the one-way valve in the air outlet pipe (10) is open from inside the air tank to the outside.

3. The silicon photonic chip laser bonding device according to claim 1, characterized in that, The placement assembly includes a placement box (12) that slides in contact with the upper surface of the platform (1). The upper surface of the placement box (12) has a limiting groove (13) adapted to the shape of the object to be bonded. A limiting frame (14) is fixedly installed on the inner wall of the limiting groove (13) via a connecting rod. The hollow cross-sectional shape of the limiting frame (14) is adapted to the shape of the silicon photonic chip. The limiting groove (13) and the limiting frame (14) are used to restrict the displacement of the object to be bonded and the silicon photonic chip during the bonding process, respectively. The upper surface of the placement box (12) has a push opening (15) communicating with the limiting groove (13). The surface of the placement box (12) has a push opening (15) communicating with the limiting groove (13). The unloading trough (16) and the placement box (12) are provided with openings on the left and right side walls. Sliding rods (17) are slidably inserted into the openings. Baffles (18) are fixedly installed at the ends of the two sliding rods (17) that are close to each other, and mounting blocks (19) are fixedly installed at the ends of the two sliding rods (17) that are far apart from each other. The mounting blocks (19) are connected to the placement box (12) through telescopic components. The two baffles (18) are used to support the objects to be bonded located in the limiting groove (13). The bottom of the push opening (15) is higher than the top of the baffles (18). The placement box (12) is controlled to move laterally by a pressing component. The two sliding rods (17) are controlled to move away from each other by a drive component.

4. The silicon photonic chip laser bonding device according to claim 3, characterized in that, The telescopic component includes a telescopic spring (20) sleeved on the slide bar (17), and the two ends of the telescopic spring (20) are fixedly connected to the mounting block (19) and the placement box (12) respectively.

5. A silicon photonic chip laser bonding device according to claim 3, characterized in that, The pressing component includes two bent rods (21) and two abutment rods (22) respectively fixedly installed on both sides of the fixed block (6). The surface of the bent rods (21) is provided with slide rails, which are composed of an integrally formed oblique opening (23) and a straight opening (24). The bottom ends of the two bent rods (21) are fixedly connected to the upper surface of the placement box (12) by bolts. The ends of the two abutment rods (22) that are far apart from each other are slidably arranged in the two slide rails. Straight rods (25) are symmetrically fixedly installed on the inner wall of the processing frame (2). The two bent rods (21) are slidably sleeved on the two straight rods (25).

6. The silicon photonics chip laser bonding device according to claim 3, characterized in that, The bottom of the placement box (12) is provided with multiple spherical grooves, and a rolling ball (26) is rolled and embedded in the spherical groove. The rolling ball (26) rolls and contacts the platform (1).

7. A silicon photonic chip laser bonding device according to claim 3, characterized in that, The drive assembly includes two symmetrical vertical push rods (27) fixedly installed on the upper surface of the platform (1) and two inclined plates (28). A connecting rod is fixedly installed on the lower surface of the mounting block (19). The two inclined plates (28) are respectively fixedly installed at the bottom ends of the two connecting rods and are symmetrically arranged. The surface of the inclined plate (28) is provided with an opening (29). The top wall of the opening (29) is provided with a rotating opening. A rotating shaft (30) is rotatably installed in the rotating opening. A mounting block is fixedly installed at the top of the rotating shaft (30). The mounting block is connected to the inclined plate (28) through an elastic component. A rotating plate (31) is fixedly installed at the bottom end of the rotating shaft (30). The rotating plate (31) restricts the rotation direction through a rotation limiting component. The two openings (29) correspond to the positions of the two push rods (27).

8. A silicon photonic chip laser bonding device according to claim 7, characterized in that, The elastic component includes a torsion spring (32) sleeved on the rotating shaft (30), with both ends of the torsion spring (32) fixedly connected to the mounting block and the inclined plate (28), respectively.

9. A silicon photonic chip laser bonding device according to claim 7, characterized in that, The rotation limiting component includes a rotation limiting rod (33) that is vertically fixedly installed at the top of the rotating plate (31). The top wall of the opening (29) has an arc-shaped rotation limiting opening (34) with the rotating shaft (30) as the center. The rotation limiting rod (33) is slidably arranged in the rotation limiting opening (34).

10. A silicon photonic chip laser bonding device according to claim 1, characterized in that, The surface of the processing frame (2) is symmetrically rotatably connected to a frame door (35), and an observation port is provided on the surface of the frame door (35), with a transparent glass (8) embedded in the observation port.

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