Graphene heating wire processing method

By using vacuum suction cup positioning and mold fixation, combined with a gradual shearing and chip removal device, the problem of automated processing of graphene heating wires was solved, improving the yield rate and reducing production costs.

CN120935877APending Publication Date: 2025-11-11SHAOXING HENGYAN ELECTROMECHANICAL TECH CO LTD
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Patent Information

Application Number
CN202410560129.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-05-08
Publication Date
2025-11-11

AI Technical Summary

Technical Problem

Existing technologies make it difficult to automate the processing of graphene heating wires, and traditional methods are prone to causing graphene sheets to break, reducing the yield rate.

Method used

The graphene sheet is positioned using a vacuum suction cup and fixed with a mold. It is then processed by gradually shearing with a cutting tool to ensure that the cutting tool only contacts the shearing point of the graphene sheet, avoiding line or surface contact. Excess fragments are removed by combining the tool with a chip removal device.

Benefits of technology

The automated production of graphene heating wires has been achieved, improving the yield rate and reducing production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the field of heating tubes, in particular to a graphene heating wire processing method which comprises the following steps: placing a graphene sheet on a lower mold through a first adsorption device, positioning the graphene sheet on the lower mold through a second adsorption device, and fixing the graphene sheet through an upper mold; a lifting cutter is arranged above the lower die, the cutting edge part of the cutter is matched with the shape of the die, after the graphene sheet is fixed, the graphene sheet is gradually sheared from one side of the graphene sheet to the other side through the lifting cutter, then the upper die and the lifting cutter exit, and the graphene heating wire formed through cutting is taken away through a first adsorption device; and finally, chips are discharged through lifting of the chip removing device. Wherein the shape of the cross section of the upper die and the shape of the cross section of the lower die are consistent with the shape of the graphene heating wire needing to be machined. By the adoption of the scheme, automatic machining of the graphene heating wire can be achieved, and the yield of the graphene heating wire is guaranteed.
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Description

Technical Field

[0001] This invention relates to the field of heating elements, and specifically to a method for processing graphene heating wires. Background Technology

[0002] Graphene is a two-dimensional material composed of a single layer of carbon atoms, possessing extremely high thermal conductivity and excellent electrical conductivity. When an electric current is applied, the free electrons in graphene undergo irregular motion under the influence of the current; this phenomenon is called Brownian motion. During this process, collisions between electrons and interactions between electrons and carbon atoms generate heat, which is produced through the collisions and friction between carbon atoms in the resistive layer.

[0003] The electrothermal conversion efficiency of graphene heating tubes is higher than that of commonly used carbon fiber heating tubes. Therefore, more and more companies are starting to research graphene heating tube related technologies. For example, CN117915502A discloses a graphene film heating tube and its preparation method, and CN208001380U discloses a graphene heating film and a heating device including the graphene heating film. Both of these involve a continuous arc-shaped distribution of heating wires.

[0004] The aforementioned bow-shaped heating wire is generally obtained by processing graphene sheets. Due to the fragility of graphene sheets, the automatic processing of graphene heating wires using traditional punching methods is prone to breakage of the graphene sheets, while manual processing would reduce processing efficiency. Therefore, the inventors conducted further research and developed a graphene heating wire processing method, which led to this invention. Summary of the Invention

[0005] The purpose of this invention is to provide a method for processing graphene heating wires, which can realize the automatic processing of graphene heating wires and ensure their yield rate.

[0006] To achieve the above objectives, the technical solution of the present invention is as follows:

[0007] A method for processing graphene heating wire includes the following steps:

[0008] The graphene sheet is placed on the lower mold using the first adsorption device, positioned on the lower mold using the second adsorption device, and then fixed using the upper mold.

[0009] A lifting cutter is installed above the lower mold. The cutting edge of the cutter matches the shape of the mold. After the graphene sheet is fixed, the lifting cutter gradually cuts from one side of the graphene sheet to the other side. Then the upper mold and the lifting cutter are removed. The graphene heating wire is then removed by the first adsorption device. Finally, the chip removal device removes the chips.

[0010] The cross-sectional shapes of the upper and lower molds are consistent with the shape of the graphene heating wire to be processed.

[0011] The applicant conducted tearing, pressing, and shearing tests on graphene sheets and found that when the graphene sheets were cut using a scissor-like structure, they did not shatter and the edges remained smooth. Based on this idea, the applicant designed the above-mentioned technical solution, which uses a lower mold to adsorb and position the graphene sheet, then uses an upper mold to fix the graphene sheet, and then uses a tool with the same shape as the heating wire to be processed to gradually cut it. Here, gradual cutting means that the tool always makes contact with the graphene sheet only at the "cutting point" (while direct pressing with the mold will form line or surface contact, which is easy to break), which can minimize the force on the graphene sheet and thus prevent it from deforming and breaking. After cutting, the excess graphene sheet is removed by a chip removal device.

[0012] Furthermore, the first adsorption device is a vacuum suction cup.

[0013] Due to the properties of graphene sheets, they can easily be damaged by grippers such as robotic arms. Therefore, a suction cup is used to pick up and place the graphene sheets.

[0014] Furthermore, a second adsorption device is installed at both ends of the lower mold, which adsorbs the graphene sheets through adsorption holes.

[0015] Furthermore, when positioning the graphene sheet, the lower mold remains stationary while the second adsorption device adsorbs the graphene sheet, the upper mold descends, and finally the graphene sheet is clamped and positioned by the upper and lower molds.

[0016] Furthermore, the length direction of the graphene sheet placed on the lower mold is defined as the X direction, and the width direction is defined as the Y direction. The cutting edge of the cutting device is gradually tilted in both the X and Y directions.

[0017] Furthermore, the chip removal device can be raised and lowered relative to the mold, and the shape of the chip removal device also matches the shape of the mold.

[0018] Furthermore, the cutting device is positioned above the lower mold. The lowest point of the cutting edge on the bottom surface of the cutting device first contacts the graphene sheet. As the cutting device descends, the cutting is completed at the highest point of the bottom cutting edge.

[0019] If the outermost ring of the bottom surface of the cutting device is considered as a rectangle, its tilt direction is from the lowest point of the angle that first contacts the graphene sheet, and gradually rises along the diagonal.

[0020] Furthermore, the cross-sectional dimensions of the upper mold should be smaller than those of the lower mold.

[0021] The upper and lower molds have the same shape, but the upper mold is slightly smaller than the lower mold, so that when the upper mold is removed, the graphene heating wire can be left on the lower mold in conjunction with the cutting device.

[0022] Furthermore, the chip removal device is located on the outside of the lower mold, and bevels are provided on both sides of it.

[0023] During the ascent of the lint removal device, the remaining graphene sheets fall off from the inclined side.

[0024] Furthermore, the cutting device includes a first cutter and a second cutter. The cutting edge of the first cutter is continuously toothed and spaced apart from each other.

[0025] By adopting the above solution, the present invention has the following advantages compared with the prior art:

[0026] While achieving industrial-scale automated production of graphene heating wires, the yield rate of heating wires was guaranteed, greatly improving production efficiency and reducing the cost of heating tubes. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the graphene heating wire that needs to be processed in this embodiment;

[0028] Figure 2 This is a schematic diagram of the device corresponding to this embodiment;

[0029] Figure 3 This is a schematic diagram of the upper mold;

[0030] Figure 4 This is a schematic diagram of the lower mold;

[0031] Figure 5 This is a bottom view of the cutting device;

[0032] Figure 6 This is a side view of the cutting device;

[0033] Figure 7 This is a schematic diagram of a dandruff removal device;

[0034] Label Explanation

[0035] Upper mold 1, lower mold 2, suction hole 21,

[0036] Cutting device 3, first cutter 31, blade 311, second cutter 32, blade 321.

[0037] 4. Dust removal device, 41. Beveled edge, 5. Graphene sheet. Detailed Implementation

[0038] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0039] The structure and function of a heating element determine that its heating wire needs to be made as follows: Figure 1 When the structure shown is used, the processing difficulty described in the background art will be further increased. Therefore, the processing of this continuous arc-shaped graphene heating wire, which is wider in the middle and narrower at both ends, will be used as an example for illustration.

[0040] like Figure 2 As shown, the processing method of the present invention employs the following... Figure 2 The processing device shown is a specific embodiment. The processing device includes an upper mold 1, a lower mold 2, a cutting device 3, and a chip removal device 4. The graphene sheet 5 to be processed can be placed between the upper mold 1 and the lower mold 2. The graphene sheet itself can be transported by a vacuum suction cup.

[0041] Structural references for upper mold 1 and lower mold 2 Figure 3 , Figure 4 The cross-section of the mold is consistent with Figure 1 The graphene heating wires in the molds have a consistent structure, with a relatively wide central section and a relatively flat surface in contact with the graphene sheet. The lower mold 2 also has adsorption holes 21 on both sides for initial positioning of the graphene sheet. Since this embodiment uses a fixed lower mold 2 and a raised upper mold 1, the upper mold 1 is made slightly smaller than the lower mold 2 to facilitate the use of the cutting device 3, ensuring that the cutting device 3 primarily aligns with the shape of the lower mold 2.

[0042] Layout reference of cutting device 3 Figure 2 It is positioned around the upper mold 1 and can be raised and lowered relative to the upper mold 1. (Structure reference...) Figure 5 , Figure 6 It is formed by the cooperation of the first cutting tool 31 and the second cutting tool 32, so as to Figure 5 From the perspective of the first cutter 31 and the second cutter 32, the structures are the same. Each cutter includes an outer cutter holder and a cutting edge (311, 321) located in the middle. The cutting edges (311, 321) of the two cutters are continuously toothed and spaced apart from each other. The overall cross-section formed by the cutting edges (311, 321) is consistent with the shape of the graphene heating wire. The position of the cutting edges (311, 321) is the part of the graphene sheet that needs to be removed, and the gap between the cutting edges (311, 321) is the shape of the graphene heating wire that needs to be processed.

[0043] Based on the aforementioned cutting edge, further adjustments to the cutting tool are needed to prevent the graphene sheet from shattering during processing.

[0044] Similarly Figure 5 For example, and refer to Figure 6The cutting device 3 is set above the lower mold 2 with the blades facing downwards. The endpoints of the first blade 31 311 are points a and b, and the endpoints of the second blade 32 321 are points c and d. When point b is the lowest point, the blades gradually tilt and rise from point b to point a. The position of point c is relatively higher than point b, and point d is relatively at the highest position. During cutting, the graphene sheet is cut sequentially from right to left along the blades of the first blade 31 and the second blade 32. That is, the contact between the graphene sheet and the blades is always only the "point at which it is cut". If there is no tilt, a "line or surface at which it is cut" will be formed. If there is no blade tilt, the graphene sheet can only be guaranteed not to break when all conditions are perfect. Therefore, it is extremely difficult to achieve in industry.

[0045] The cutting tool does not necessarily have to be tilted with b as the lowest point; any method that conforms to the above principles is acceptable.

[0046] A method for processing graphene heating wire involves first placing a graphene sheet onto a lower mold 2 using a vacuum suction cup (not shown in the figure, existing technology can be used). The graphene sheet is initially positioned using the suction holes at both ends of the lower mold. The vacuum suction cup is then removed, and the upper mold 1 descends to clamp and position the graphene sheet. Subsequently, a cutting device located around the upper mold descends to cut the graphene sheet. After the upper mold and cutting device are reset, the graphene heating wire is removed from the graphene sheet again using the vacuum suction cup. The remaining graphene fragments are removed by a chip removal device located around the lower mold. The cut graphene fragments can then be separated from the mold by rising, and can be removed from the inclined sides of the chip removal device by means of air blowing pipes, etc.

[0047] In the above structure, the lifting structure of the upper mold, cutting device, and chip removal device are not the key technologies of this invention. It is sufficient to find the corresponding driving structure in commonly used technical means.

[0048] The above are merely specific embodiments of the present invention. Furthermore, terms such as "upper," "lower," "left," "right," and "middle" used in the present invention are for reference only and are not absolute limitations. Any non-substantial modifications made using the present invention shall be considered as infringing upon the protection scope of the present invention.

Claims

1. A method for processing graphene heating wire, characterized in that, Includes the following steps: The graphene sheet is placed on the lower mold using the first adsorption device, positioned on the lower mold using the second adsorption device, and then fixed using the upper mold. A lifting cutter is installed above the lower mold. The cutting edge of the cutter matches the shape of the mold. After the graphene sheet is fixed, the lifting cutter gradually cuts from one side of the graphene sheet to the other side. Then the upper mold and the lifting cutter are removed. The graphene heating wire is then removed by the first adsorption device. Finally, the chip removal device removes the chips. The cross-sectional shapes of the upper and lower molds are consistent with the shape of the graphene heating wire to be processed.

2. The method for processing graphene heating wire according to claim 1, characterized in that: The first adsorption device is a vacuum suction cup.

3. The method for processing graphene heating wire according to claim 1, characterized in that: The second adsorption device is located at both ends of the lower mold, and it adsorbs the graphene sheets through adsorption holes.

4. The method for processing graphene heating wire according to claim 1, characterized in that: When positioning the graphene sheet, the lower mold remains stationary while the second adsorption device adsorbs the graphene sheet. The upper mold descends, and finally the graphene sheet is clamped and positioned by the upper and lower molds.

5. The method for processing graphene heating wire according to claim 1, characterized in that: The length direction of the graphene sheet placed on the lower mold is defined as the X direction, and the width direction is defined as the Y direction. The cutting edge of the cutting device is gradually tilted in both the X and Y directions.

6. The method for processing graphene heating wire according to claim 1, characterized in that: The chip removal device can be raised and lowered relative to the mold, and the shape of the chip removal device is also matched with the shape of the mold.

7. The method for processing graphene heating wire according to claim 1, characterized in that: The cutting device is positioned above the lower mold. The lowest point of the cutting edge on the bottom surface of the cutting device first contacts the graphene sheet. As the cutting device descends, the cutting is completed at the highest point of the bottom cutting edge.

8. The method for processing graphene heating wire according to claim 1, characterized in that: The cross-sectional dimensions of the upper mold must be smaller than those of the lower mold.

9. A method for processing graphene heating wire according to claim 1, characterized in that: The chip removal device is located on the outside of the lower mold, and has beveled edges on both sides.

10. A method for processing graphene heating wire according to claim 1, characterized in that: The cutting device includes a first cutter and a second cutter. The cutting edge of the first cutter is continuously toothed and spaced apart from each other.

Citation Information

Patent Citations

  • Graphene film heating pipe and preparation method thereof

    CN117915502A

  • Heating device for graphite alkene adds hotting mask and adds hotting mask including this graphite alkene

    CN208001380U