Radar

Abstract

The invention provides a radar, and relates to the technical field of radars. The radar comprises a housing which is internally provided with a cavity; the two data processing board cards are positioned in the cavity and are oppositely arranged; the heat dissipation module is located between the two data processing board cards, makes contact with the two data processing board cards and the shell and is used for conducting heat emitted by the two data processing board cards to the shell.

Description

Technical Field

[0001] This application relates to the field of radar technology, and in particular to a radar. Background Technology

[0002] As radar operates at increasingly higher frequencies, users are placing greater demands on its internal heat dissipation capabilities. Currently, conventional radars typically employ heat sinks to reduce the temperature of the various internal modules.

[0003] However, the above-mentioned processing methods increase the size of the radar and make its internal structure more complex, which is not conducive to the miniaturization and integration of radar. Summary of the Invention

[0004] This application provides a radar.

[0005] In a first aspect, embodiments of this application provide a radar, comprising: a housing having a cavity inside; two data processing boards disposed opposite to each other within the cavity; and a heat dissipation module located between the two data processing boards, the heat dissipation module being in contact with both data processing boards and the housing, for conducting heat emitted by the two data processing boards to the housing.

[0006] The radar in this embodiment of the application, by setting a heat dissipation module between two data processing boards arranged opposite each other in the cavity, can simultaneously dissipate heat from both data processing boards, thereby improving the internal heat dissipation efficiency of the radar and enabling each data processing board to operate at normal temperature. Compared with the structure of each board corresponding to a heat dissipation module in the prior art, the radar in this application reduces the number of components in the cavity, thereby reducing the size of the radar, making the radar more miniaturized, and easier to install and use. Attached Figure Description

[0007] In the accompanying drawings of the embodiments of this application:

[0008] Figure 1 A schematic diagram of the disassembled structure of a radar provided in an embodiment of this application;

[0009] Figure 2 This is a schematic diagram of the overall structure of a radar provided in an embodiment of this application;

[0010] Figure 3 A schematic diagram of the disassembled structure of a radar provided in an embodiment of this application;

[0011] Figure 4 This is a schematic diagram of the structure inside the first subshell of a radar provided in an embodiment of this application;

[0012] Figure 5This is a schematic diagram of the structure of the outer side of the first subshell of a radar provided in an embodiment of this application;

[0013] Figure 6 A schematic diagram of the outer side of the second sub-shell of a radar provided in an embodiment of this application;

[0014] Figure 7 This is a schematic diagram of the inner structure of the second subshell of a radar provided in an embodiment of this application. Detailed Implementation

[0015] To enable those skilled in the art to better understand the technical solutions of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0016] The present application will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms, and the present application should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that this application will be thorough and complete, and will enable those skilled in the art to fully understand the scope of the application.

[0017] The accompanying drawings of the embodiments of this application are used to provide a further understanding of the embodiments of this application and constitute a part of the specification. They are used together with the detailed embodiments to explain this application and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the description of the detailed embodiments with reference to the accompanying drawings.

[0018] This application can be described with reference to plan views and / or cross-sectional views, using the ideal schematic diagrams of this application. Therefore, the example illustrations can be modified according to manufacturing techniques and / or tolerances. Without conflict, various embodiments and features in the embodiments of this application can be combined with each other.

[0019] The terminology used in this application is for describing specific embodiments only and is not intended to limit the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated enumerated entries. The singular forms "a" and "the" as used herein are also intended to include the plural forms unless the context clearly indicates otherwise. The terms "comprising," "made of," etc., as used herein, specify the presence of the stated feature, integral, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0020] Unless otherwise specified, all terms used in this application (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this application, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in this application.

[0021] In the description of this application, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0023] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] This application is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown in the drawings illustrate the specific shapes of the areas of the element, but are not intended to be limiting.

[0025] With the rapid development of intelligent driving technology, the requirements for radar installed in vehicles are also increasing. Radar provides vehicles with data such as positioning and tracking to ensure safe driving.

[0026] In some related technologies, millimeter-wave radar installed on a vehicle includes a heat dissipation device and a corresponding data processing board. The heat dissipation device is used to cool the corresponding data processing board.

[0027] However, as radar functionality increases, various types of data processing boards will be installed inside the radar. The conventional structure of using a single heat dissipation device to cool each data processing board would increase the size of the radar, making its internal structure more complex and hindering the miniaturization and integration of radar.

[0028] To address the aforementioned problems, this application provides a radar system.

[0029] Figure 1 This is a schematic diagram of the disassembled structure of a radar provided in an embodiment of this application. Figure 1 As shown, the radar in this embodiment includes: a housing ( Figure 1 (Not shown in the image), the housing has a cavity; two data processing boards (e.g., first data processing board 121 and second data processing board 122) are located in the cavity and are arranged opposite each other; a heat dissipation module 110 is located between the two data processing boards.

[0030] The heat dissipation module 110 is in contact with both data processing boards and the housing, and is used to conduct the heat emitted by the two data processing boards to the housing.

[0031] The heat dissipation method of the heat dissipation module 110 includes at least conductive heat dissipation, and may further include radiative heat dissipation.

[0032] Conductive heat dissipation refers to the heat generated by the data processing board being directly conducted to the heat dissipation module 110, and then conducted to the cooler casing through the heat dissipation module 110.

[0033] Thermal radiation refers to the heat dissipation module 110 receiving thermal radiation generated by the data processing boards, thereby reducing the temperature of the two data processing boards.

[0034] By employing different heat dissipation methods, the heat dissipation efficiency of the heat dissipation module 110 can be improved, ensuring that the temperature of the two data processing boards can be kept within a preset range.

[0035] In some embodiments, Figure 2 This is a schematic diagram of the overall structure of a radar provided in an embodiment of this application.

[0036] refer to Figure 2The housing 130 refers to the external structure of the radar. The housing 130 can be a one-piece molded structure with a cavity, or it can be a structure with a cavity constructed by upper and lower curved surfaces. This application does not limit this.

[0037] The housing 130 can be a housing connected by multiple screws 141 and multiple screw holes 142 so that a sealed cavity can be formed inside the radar.

[0038] The plug 150 may be a plug with 12 pins.

[0039] Since data processing boards are installed inside the cavity, they generate heat when processing data. Due to the airtightness of the housing 130, the heat emitted by the data processing boards is not easily conducted. In this application, a heat dissipation module is installed between the two data processing boards to conduct the heat dissipated by the two data processing boards to the housing 130 in a timely manner, thereby controlling the temperature of the data processing boards within a preset range and ensuring that each data processing board can work normally.

[0040] The radar in this embodiment of the application, by setting a heat dissipation module between two data processing boards arranged opposite each other in the cavity, can simultaneously dissipate heat from both data processing boards, thereby improving the internal heat dissipation efficiency of the radar and enabling each data processing board to operate at normal temperature. Compared with the structure of each board corresponding to a heat dissipation module in the prior art, the radar in this application reduces the number of components in the cavity, thereby reducing the size of the radar, making the radar more miniaturized, and easier to install and use.

[0041] In some exemplary embodiments, the heat dissipation module can shield electromagnetic waves emitted by the two data processing boards.

[0042] Each data processing board generates electromagnetic waves during data processing. These electromagnetic waves propagate through the air, affecting surrounding modules and reducing their operational accuracy.

[0043] Furthermore, the electromagnetic waves emitted by the data processing boards also carry a certain amount of energy. That is, electromagnetic waves are a form of heat radiation. Therefore, when the heat dissipation module receives the electromagnetic waves emitted by the two data processing boards, the heat dissipation module 110 will conduct the heat to the casing in the form of heat radiation to reduce the temperature of the two data processing boards.

[0044] Because a heat dissipation module 110 with electromagnetic wave shielding capability is placed between the two data processing boards, the two data processing boards will not interfere with each other. For example, the electromagnetic waves emitted by the first data processing board 121 are shielded or absorbed by the heat dissipation module 110, thereby preventing the second data processing board 122 from being interfered with by the electromagnetic waves emitted by the first data processing board 121, allowing the second data processing board 122 to work normally. At the same time, it can also reduce the temperature of the first data processing board 121.

[0045] In some exemplary embodiments, the heat dissipation module is connected to either of the two data processing boards; the two data processing boards are respectively connected to the housing.

[0046] Two data processing boards can be fixed to the housing, and the heat dissipation module is connected to one of the data processing boards, thereby realizing the positioning of all components.

[0047] The above connection method not only enhances the stability of the heat dissipation module but also allows for flexible and easy-to-implement connection between the heat dissipation module and the data processing boards. Furthermore, since both data processing boards are connected to the housing, heat conduction is further accelerated, allowing for the fastest possible dissipation of heat from both boards.

[0048] The heat dissipation module can be connected to either the first data processing board 121 or the second data processing board 122. For example, the heat dissipation module can be connected to the first data processing board 121 (or the second data processing board 122) using any of the following connection methods: snap-fit, soldering, plug-in, and screw-fit.

[0049] In some exemplary embodiments, the housing includes a first sub-shell and a second sub-shell that are mated together.

[0050] The first data processing board is located on the side where the first sub-shell is located, and the second data processing board is located on the side where the second sub-shell is located. For example, the first data processing board is adjacent to the inside of the first sub-shell, and the second data processing board is adjacent to the inside of the second sub-shell.

[0051] By using a mating connection to connect the first and second sub-shells, a tight connection can be formed between them, creating a cavity. This not only facilitates installation but also allows for flexible configuration of the data processing boards located on different sub-shell sides.

[0052] In some embodiments, the first sub-shell and the second sub-shell are sealed by any of the following methods: adhesive sealing, compression sealing, or sealing ring sealing.

[0053] By adopting the above-mentioned different types of sealing methods, the first and second sub-shells can be tightly connected, reducing dust and other debris falling into the cavity and enabling the various modules inside the radar to work better.

[0054] In some embodiments, a positioning device is further provided on the inner side of the first sub-shell for positioning the first data processing board on the first sub-shell.

[0055] The positioning device includes a positioning post or a positioning edge.

[0056] In some exemplary embodiments, the first data processing board is a digital board, and the second data processing board is an antenna board; the second subshell has an antenna transmission area made of electromagnetic wave transmission material at least at the position corresponding to the antenna board.

[0057] Digital boards are used to process and calculate signals from various modules within the radar. For example, digital boards are used to process control signals sent by the control chip.

[0058] The antenna board is used to transmit and receive electromagnetic wave signals. By setting the position on the second sub-shell corresponding to the antenna board as the antenna transmission area, the antenna board can receive electromagnetic wave signals transmitted into the radar through this area. This allows the antenna board to process the received electromagnetic wave signals quickly and accurately, improving the radar's processing efficiency.

[0059] In some exemplary embodiments, the first sub-shell is made of a thermally conductive material; the inner side of the first sub-shell is provided with heat dissipation protrusions that contact the digital board.

[0060] The thermally conductive materials include metals, graphite, thermal grease, etc., and this application does not limit the types of materials used. The heat dissipation protrusions can be configured as multiple protrusions that are higher than the inner surface of the first sub-shell, so that there is a certain space between the digital board and the inner surface of the first sub-shell to facilitate heat conduction.

[0061] Since the heat dissipation protrusion is in contact with the digital circuit board, it can quickly conduct away the heat generated by the digital circuit board. Furthermore, based on the first sub-shell made of thermally conductive material, the heat obtained by the heat dissipation protrusion can be dissipated from the first sub-shell to the outside of the radar, thereby achieving a cooling effect on the inside of the radar.

[0062] In some exemplary embodiments, heat dissipation teeth are provided on the outer side of the first sub-shell.

[0063] The heat dissipation teeth are set on the outer surface of the first sub-shell, which can increase the surface area of ​​the outer surface of the first sub-shell, thereby enabling the first sub-shell to quickly dissipate its heat to the outside of the radar, thus improving the internal heat dissipation efficiency of the radar.

[0064] In some exemplary embodiments, the second subshell includes a hollow protrusion in which the antenna board is disposed.

[0065] Since electromagnetic wave signals can be transmitted through all sides of the hollow protrusion, placing the antenna board inside the protrusion enables the antenna board to receive electromagnetic wave signals from all directions outside the radar more quickly and accurately, thereby allowing the antenna board to better process the electromagnetic wave signals.

[0066] In some embodiments, the second subshell is made of an electromagnetic wave transmitting material, that is, the antenna transmission area on the second subshell is the entire second subshell, which can expand the area of ​​the antenna transmission area so that external electromagnetic wave signals can be received by the antenna board more quickly, thereby improving the processing efficiency of electromagnetic wave signals.

[0067] In some exemplary embodiments, the surface of the second subshell is provided with reinforcing ribs.

[0068] The reinforcing rib can be a raised strip-shaped component set on the surface of the second sub-shell. Since the second sub-shell can be made of electromagnetic wave transmitting material, which has low strength, the strength of the second sub-shell can be improved by setting reinforcing ribs on the surface of the second sub-shell, thereby achieving the supporting function of the second sub-shell.

[0069] In some exemplary embodiments, the first sub-shell and the second sub-shell are sealed together.

[0070] The first and second sub-shells can be sealed together by any of the following methods: adhesive sealing, compression sealing, or sealing ring sealing.

[0071] The above-mentioned sealing connection method can tightly connect the first and second sub-shells, reduce dust and other debris falling into the cavity, achieve waterproof sealing of the internal cavity of the radar, and enable the various modules inside the radar to work better.

[0072] In some embodiments, the radar further includes a connection module for powering the two data processing boards, or for interacting with at least one of the two data processing boards.

[0073] The connecting module is either independently fixed to the housing, or the connecting module is part of the housing.

[0074] In some embodiments, Figure 3 This is a schematic diagram of the disassembled structure of a radar provided in an embodiment of this application. Figure 3 As shown, the radar includes a first sub-shell 31, a second sub-shell 32, a first data processing board 33, a heat dissipation module 34, a second data processing board 35, and a connection module 36.

[0075] The first sub-shell 31 and the second sub-shell 32 can be sealed together by a sealing component (not shown in the figure) to achieve the airtightness of the entire radar.

[0076] For example, the first sub-shell 31 and the second sub-shell 32 are sealed by any of the following methods: adhesive sealing, compression sealing, or sealing ring sealing. These sealing connection methods ensure a tight connection between the first sub-shell 31 and the second sub-shell 32, reducing dust and other debris from entering the cavity, achieving a waterproof seal for the radar's internal cavity, and allowing the various modules inside the radar to function better.

[0077] The heat dissipation module 34 is located between the first data processing board 33 and the second data processing board 35. The heat dissipation module 34 can be soldered onto either the first data processing board 33 or the second data processing board 35. The heat dissipation module 34 is used to dissipate heat from the first data processing board 33 and the second data processing board 35, and to shield the electromagnetic waves emitted by the two data processing boards.

[0078] The second data processing board 35 has a larger area than the first data processing board 33, which enables a stepped spatial architecture, thereby reducing the internal space of the radar and making the radar more miniaturized.

[0079] The connection module 36 is used to supply power to the first data processing board 33 and the second data processing board 35, or to interact with the first data processing board 33 (or the second data processing board 35) by signal exchange. For example, the connection module 36 is used to transmit electrical signals input from other modules to the first data processing board 33.

[0080] The connection module 36 can be an independent module and fixed on the first sub-shell 31; the connection module 36 can also be part of the first sub-shell 31, and this application does not limit this.

[0081] refer to Figure 3 The first sub-shell 31, the first data processing board 33, the heat dissipation module 34, the second data processing board 35, and the second sub-shell 32 are stacked sequentially. The heat dissipation module 34 is used to dissipate heat for both the first data processing board 33 and the second data processing board 35. This not only dissipates heat for each data processing board more efficiently, but also significantly reduces the length and width of the radar, making it more suitable for use inside vehicles and other equipment, thus reducing the space occupied in the vehicle's interior.

[0082] In some instances, the heat dissipation module 34 also serves to shield the electromagnetic waves emitted by the two data processing boards, thereby minimizing the interference between the first data processing board 33 and the second data processing board 35 and improving the data processing efficiency of each data processing board.

[0083] In some instances, the first data processing board 33 and the second data processing board 35 can also be designed as a single unit integrated with the heat dissipation module 34, thereby further reducing the internal space of the radar and making the radar more miniaturized.

[0084] In this embodiment, by Figure 3 The minimalist architecture shown not only efficiently dissipates the heat generated by each data processing board to the outside of the radar through the heat dissipation module, but also simplifies the internal structure of the radar, saving considerable space and making the radar simple and reliable while meeting radar performance requirements.

[0085] Figure 4 This is a schematic diagram of the structure inside the first subshell of a radar provided in an embodiment of this application. Figure 4 As shown, the inner side of the first sub-shell 31 is provided with: the body 311 of the first sub-shell 31, the sealing module 312, the positioning post 313, the positioning edge 314 and the heat dissipation boss 315.

[0086] The sealing module 312 is used to seal the body 311 of the first sub-shell 31 with the second sub-shell 32 by pressing, thereby achieving the water-tight seal of the radar.

[0087] The crimping methods include riveting crimping and direct insertion crimping. Riveting crimping is based on the tenon and mortise structure between the body 311 of the first sub-shell 31 and the second sub-shell 32. Direct insertion crimping involves directly connecting the body 311 of the first sub-shell 31 to the second sub-shell 32. Using these crimping methods reduces the range of movement between the body 311 of the first sub-shell 31 and the second sub-shell 32, allowing for a faster connection between the first sub-shell 31 and the second sub-shell 32 via the sealing module 312.

[0088] For example, the sealing module 312 can be a sealing ring or a module based on adhesive material. This application does not limit this and will not elaborate further here.

[0089] Combination Figure 2 , Figure 3 As shown, when the radar in this application is installed and used, the connection module 36 needs to be fixed on the first sub-shell 31 firstly, and then the first data processing board 33 is precisely positioned by the positioning post 313 on the first sub-shell 31 to connect the first data processing board 33 to the first sub-shell 31, thereby realizing the transmission of electrical signals inside the radar through the connection module 36; furthermore, by using screws, the first data processing board 33 is locked and fixed on the first sub-shell 31, that is, the first data processing board 33 is fixedly installed on the first sub-shell 31.

[0090] The heat dissipation module 34 is connected to the first data processing board 33 by welding, and the first data processing board 33 is fixed to the first sub-shell 31. Furthermore, the second data processing board 35 is stacked on the heat dissipation module 34. Finally, the first sub-shell 31 and the second shell 32 are joined together to realize the installation of the radar.

[0091] The heat dissipation module 34 also functions as an isolation plate, that is, it is used to isolate electromagnetic waves between the first data processing board 33 and the second data processing board 35.

[0092] In some embodiments, the first sub-shell 31 and the second shell 32 can be sealed by any of the following methods: adhesive sealing, compression sealing, or sealing ring sealing, to achieve a water-repellent sealing effect for the radar.

[0093] In some embodiments, Figure 4 The inner side of the body 311 of the first sub-shell 31 shown is provided with a positioning edge 314 for positioning the first data processing board 33 during installation. The first data processing board 33 is guided by the positioning edge 314 for installation, and is precisely positioned by a fisheye pin (not shown) on the connecting module 36 and the positioning edge 314. Finally, the connecting module 36 and the first data processing board 33 are fixed to the body 311 of the first sub-shell 31 by bolts.

[0094] In some embodiments, the inner side of the first sub-shell 31 is designed in a stepped shape, wherein there is a certain height difference between the plane where the heat dissipation boss 315 is located and the plane used to fix the first data processing board 33; and, since the area of ​​the first data processing board 33 is different from the area of ​​the second data processing board 35, the stepped design can be reasonably utilized to save the internal space of the radar to a large extent.

[0095] The heat dissipation protrusions 315 are disposed on the body 311 of the first sub-shell 31. The heat dissipation protrusions 315 are used to contact the second data processing board 35, thereby increasing the contact area between the second data processing board 35 and external modules. This allows each heat dissipation protrusion 315 to assist the heat dissipation module 36 in quickly dissipating the heat generated by the second data processing board 35, improving the heat dissipation efficiency inside the radar, and thus rapidly reducing the temperature of the second data processing board 35.

[0096] In some embodiments, the positioning post 313 is used for positioning and installing the second housing 32 to ensure that the first sub-housing 31 and the second housing 32 can be tightly connected.

[0097] Figure 5 This is a schematic diagram of the outer structure of the first sub-shell of a radar provided in an embodiment of this application. (Combined with...) Figures 3-5As shown, the outer side of the first sub-shell 31 is provided with: heat dissipation teeth 316, vent holes 317 and mounting components 318.

[0098] The heat dissipation teeth 316 are used to dissipate heat from the first sub-shell 31. The mounting component 318 is used to fix the connecting module 36 onto the first sub-shell 31.

[0099] Vent 317 is used to allow the first sub-shell 31 to vent, so as to balance the air pressure inside the radar and outside.

[0100] In some embodiments, the vent 317 may also be provided on the second sub-shell 32, and this application does not limit this.

[0101] In some embodiments, the first subshell 31 is made of metal or other heat dissipation material, thereby improving the heat dissipation efficiency of the radar.

[0102] Figure 6 This is a schematic diagram of the outer side of the second subshell of a radar provided in an embodiment of this application. Figure 7 This is a schematic diagram of the inner structure of the second subshell of a radar provided in an embodiment of this application.

[0103] Combination Figure 3 , Figure 6 and Figure 7 Therefore, the outer side of the second sub-shell 32 includes: the body 321 of the second sub-shell 32 and the groove 322. The inner side of the second sub-shell 32 corresponds to the outer side of the second sub-shell. (Reference) Figure 6 Viewed from the outside of the second subshell 32, the main body 321 has a convex shape. (Reference) Figure 7 Viewed from the inside of the second subshell 32, the body 321 of the second subshell 32 has a concave shape.

[0104] Among them, groove 322 is with Figure 4 The groove in the positioning post 313 matches the groove in the positioning post 322. Because the groove 322 is... Figure 4 The positioning posts 313 in the middle are in one-to-one correspondence. Therefore, when connecting the first sub-shell 31 and the second sub-shell 32, they can be connected through the groove 322 and... Figure 4 The positioning post 313 in the middle is used to limit the position, so as to ensure that the first sub-shell 31 and the second sub-shell 32 can be tightly and accurately connected together.

[0105] In some embodiments, the body 321 of the second sub-shell 32 is made of an electromagnetic wave transmitting material, and the front of the second sub-shell 32 is provided with a hollow protrusion so that the second data processing board 35 can be disposed in the protrusion, so that the second data processing board 35 can receive external electromagnetic wave signals through the body 321 of the second sub-shell 32.

[0106] In some embodiments, the body 321 of the second sub-shell 32 is provided with reinforcing ribs (not shown in the figure). Since the electromagnetic wave transmission material has low hardness, the second sub-shell 32 can be reinforced and supported by the reinforcing ribs.

[0107] By the above Figures 3-7 The radar shown can efficiently dissipate heat through its internal heat dissipation module 34 located between the two data processing boards, heat dissipation fins 316 located on the outside of the first sub-shell 31, and heat dissipation protrusions 315 located on the body 311 of the first sub-shell 31. Furthermore, the two data processing boards are cooled by only one heat dissipation module in a stacked design, which greatly reduces the internal space of the radar, achieving miniaturization. Compared to traditional millimeter-wave radars, the radar in this application is small in size, compact in structure, and simple in internal assembly, enabling it to achieve more efficient heat dissipation with a smaller size and weight. This makes it more suitable for applications in space-constrained devices such as vehicles, further promoting radar miniaturization.

[0108] This application has disclosed exemplary embodiments, and although specific terminology has been used, it is used and should be interpreted only in a general illustrative sense and is not intended to be limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of this application as set forth by the appended claims.

Claims

1. A radar comprising: A housing having a cavity inside; Two data processing boards positioned opposite each other, located within the cavity; A heat dissipation module is located between the two data processing boards. The heat dissipation module is in contact with both data processing boards and the housing, and is used to conduct the heat emitted by the two data processing boards to the housing.

2. The radar according to claim 1, wherein, The heat dissipation module can shield the electromagnetic waves emitted by the two data processing boards.

3. The radar according to claim 1, wherein, The heat dissipation module is connected to either of the two data processing boards; The two data processing boards are respectively connected to the housing.

4. The radar according to claim 1, wherein, The housing includes a first sub-housing and a second sub-housing that are connected together; the two data processing boards include a first data processing board and a second data processing board. The first data processing board is located on the side where the first sub-shell is located, and the second data processing board is located on the side where the second sub-shell is located.

5. The radar according to claim 4, wherein, The first data processing board is a digital board, and the second data processing board is an antenna board; The second subshell has an antenna transmission area made of electromagnetic wave transmitting material at least at the position corresponding to the antenna board.

6. The radar according to claim 5, wherein, The first subshell is made of thermally conductive material; The inner side of the first sub-shell is provided with a heat dissipation protrusion that contacts the digital board.

7. The radar according to claim 6, wherein, The outer side of the first sub-shell is provided with heat dissipation teeth.

8. The radar according to claim 5, wherein, The second sub-shell includes a hollow protrusion, and the antenna board is disposed within the protrusion.

9. The radar according to claim 5, wherein, The surface of the second subshell is provided with reinforcing ribs.

10. The radar according to claim 4, wherein, The first sub-shell and the second sub-shell are sealed together.

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