Signal transmission method, device and equipment of PCB (Printed Circuit Board) and medium

Abstract

The invention provides a signal transmission method and device of a PCB, equipment and a medium. Comprising the following steps: acquiring an optical signal, and determining an electric signal corresponding to the optical signal according to a preset ROSA module; transmitting the electric signal to a welding layer of the PCB according to the ROSA module, and determining a preset hole of the welding layer; transmitting an electric signal of the welding layer to the element layer according to a preset welding layer wire of the welding layer and a hole wire corresponding to the preset hole; determining a hollow area corresponding to a preset coupling capacitor, and transmitting an electric signal of the element layer to a control unit according to the coupling capacitor and the hollow area; in this way, the transmission speed of PCB signal transmission is increased, and the transmission quality is improved.

Description

Technical Field

[0001] This application relates to the technical field of PCB board transmission, and in particular to a signal transmission method, apparatus, device and medium for PCB boards. Background Technology

[0002] PCB, or Printed Circuit Board, has seen its signal transmission rate and performance rise with the development of electronic technology and the increase in signal speed. Access network technology has gradually upgraded from the widely used low-speed signals such as GPON / EPON to the currently widely used XGPON / 10G EPON technologies.

[0003] In existing signal transmission methods, the received optical signal current is generally converted into a differential voltage signal by a transimpedance amplifier during 10GPON optical transmission. This differential signal is then transmitted to a limiting amplifier chip via a coupling capacitor. The limiting amplifier chip outputs a differential signal, which is then sent to the system's MAC chip for parsing via a coupling capacitor.

[0004] However, existing signal transmission methods suffer from poor transmission performance. Summary of the Invention

[0005] This application provides a signal transmission method, apparatus, device, and medium for PCB boards to solve the problem of poor transmission performance in existing signal transmission methods.

[0006] In a first aspect, this application provides a signal transmission method for a PCB board, the method comprising: Acquire the optical signal and determine the corresponding electrical signal based on the preset ROSA module; According to the ROSA module, electrical signals are transmitted to the soldering layer of the PCB board, and the preset holes of the soldering layer are determined. Based on the pre-set solder layer conductors and the corresponding hole conductors for the pre-set holes, the electrical signals of the solder layer are transmitted to the component layer; The cutout area corresponding to the preset coupling capacitor is determined, and the electrical signal of the component layer is transmitted to the control unit according to the coupling capacitor and the cutout area.

[0007] In some embodiments of this application, according to the ROSA module, electrical signals are transmitted to the soldering layer of the PCB board, and preset holes in the soldering layer are determined, including: Determine the pins of the ROSA module; the connection method between the pins and the solder layer of the PCB board is through-hole. Based on the pins of the ROSA module, electrical signals are transmitted to the soldering layer of the PCB board; Determine the pre-set holes for the welding layer.

[0008] In some embodiments of this application, determining the preset holes in the weld layer includes: Identify the same target hole corresponding to each layer of the PCB board, and determine the solder hole ring of the target hole in the solder layer; Determine the preset hole based on the target hole and the welding ring.

[0009] In some embodiments of this application, the electrical signal of the solder layer is transmitted to the component layer according to the solder layer conductors preset in the solder layer and the hole conductors corresponding to the preset holes, including: The high-speed differential conductor is determined to have a width of 0.18 mm; Determine the welding layer conductors based on the high-speed differential conductors; Determine the wire guide for the hole; The electrical signals of the solder layer are transmitted to the component layer based on the solder layer conductors and the hole conductors.

[0010] In some embodiments of this application, determining the hole conductor includes: Determine the welding pad with a radius of 0.4 mm; Determine the hole wire based on the welding pad.

[0011] In some embodiments of this application, determining the cutout area corresponding to a preset coupling capacitor, and transmitting the electrical signal of the component layer to the control unit based on the coupling capacitor and the cutout area, includes: Determine the component layer region corresponding to the coupling capacitor; Based on the component layer region, determine the target region, which is 1 mm long and 1.15 mm wide; Determine the excavation area based on the target area; Based on the coupling capacitance and the cutout area, the electrical signals of the component layer are transmitted to the control unit.

[0012] In some embodiments of this application, the electrical signals of the component layer are transmitted to the control unit based on the coupling capacitance and the cut-out area, including: Determine the component layer region corresponding to the signal differential wires of the control unit; Based on the component layer region, determine the target region, which is 0.85 mm long and 1 mm wide; Based on the coupling capacitance, cutout area, and target region, the electrical signals of the component layer are transmitted to the control unit.

[0013] Secondly, this application provides a signal transmission device for a PCB board, the device comprising: The signal acquisition module is used to acquire optical signals and determine the corresponding electrical signals based on the preset ROSA module. The hole determination module is used to transmit electrical signals to the soldering layer of the PCB board according to the ROSA module, and to determine the preset holes of the soldering layer; The signal transmission module is used to transmit the electrical signal of the solder layer to the component layer according to the solder layer wires preset in the solder layer and the hole wires corresponding to the preset holes. The area determination module is used to determine the cutout area corresponding to the preset coupling capacitor, and transmit the electrical signal of the component layer to the control unit according to the coupling capacitor and the cutout area.

[0014] Thirdly, this application provides a computer device, including: a processor, and a memory communicatively connected to the processor; The memory stores the instructions that the computer executes; The processor executes computer execution instructions stored in memory to implement the method of this application.

[0015] Fourthly, this application provides a computer-readable storage medium storing program code, which, when executed by a processor, is used to implement the method of this application.

[0016] The signal transmission method, apparatus, device, and medium for PCB boards provided in this application acquire optical signals and determine the corresponding electrical signals based on a preset ROSA module; transmit the electrical signals to the soldering layer of the PCB board according to the ROSA module and determine the preset holes of the soldering layer; transmit the electrical signals of the soldering layer to the component layer according to the preset soldering layer conductors and the hole conductors corresponding to the preset holes; determine the cutout area corresponding to the preset coupling capacitor, and transmit the electrical signals of the component layer to the control unit according to the coupling capacitor and the cutout area.

[0017] In this way, by improving the pins of the ROSA module, adopting a through-hole connection method to connect to the solder layer of the PCB board, and transmitting signals through high-speed differential conductors, and by removing the area corresponding to the coupling capacitor, the signal reflection problem caused by the discontinuity of the trace via and coupling capacitor impedance is solved, and the adverse effects of PCB board trace design on high-speed signal transmission are reduced. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] Figure 1 A schematic flowchart illustrating a signal transmission method for a PCB board provided in an embodiment of this application; Figure 2 This is a schematic diagram illustrating the application of a signal transmission method for a PCB board provided in an embodiment of this application. Figure 3 This is a dimensional schematic diagram of a signal transmission method for a PCB board provided in an embodiment of this application; Figure 4 A schematic flowchart illustrating another signal transmission method for a PCB board provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a signal transmission device for a PCB board provided in an embodiment of this application; Figure 6 This is a structural block diagram of an apparatus for performing a signal transmission method on a PCB board according to an embodiment of this application. Detailed Implementation

[0020] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0021] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0022] Figure 1 This is a schematic flowchart illustrating a signal transmission method for a PCB board provided in an embodiment of this application. Figure 1 As shown, the signal transmission method of this PCB board may include the following steps: S110. Acquire the optical signal and determine the corresponding electrical signal based on the preset ROSA module.

[0023] Optical signals are a form of signal that uses light as a carrier to transmit information. They utilize the characteristics of light (such as light intensity, frequency, and phase) to represent and transmit information. In an FTTR system, the optical module is a key component for realizing photoelectric conversion. The optical module typically contains a PCB, which carries components such as driver chips and signal processing chips. It is responsible for controlling the process of light emission and reception, as well as modulating and demodulating the optical signal. The PCB can realize the mutual conversion between electrical signals and optical signals based on the photoelectric effect and using photoelectric conversion devices. The photoelectric conversion device can be a ROSA module, thereby realizing signal transmission on the PCB.

[0024] The ROSA (Receiver Optical Subassembly) is a key component in an optical communication system used to receive optical signals and convert them into electrical signals. It typically consists of a photodetector (such as a PIN photodiode or avalanche photodiode APD), a transimpedance amplifier (TIA), and other related optical and circuit components. When an optical signal strikes the photodetector, according to the photoelectric effect, photon energy is absorbed, generating electron-hole pairs and thus forming a photocurrent. This photocurrent is converted into a voltage signal by the transimpedance amplifier, amplified, and finally output as an electrical signal proportional to the intensity of the input optical signal, completing the optical-to-electrical signal conversion process.

[0025] Based on this, by acquiring optical signals and performing photoelectric conversion using the ROSA module, corresponding electrical signals are obtained, so that signal transmission on the PCB board can be realized subsequently based on the electrical signals.

[0026] S120. Based on the ROSA module, transmit electrical signals to the soldering layer of the PCB board and determine the preset holes of the soldering layer.

[0027] The soldering layer of the PCB board is used to place surface mount components, through-hole pins, or connectors. It is the bottom layer of the PCB board, opposite to the top layer. The top layer is the main component mounting surface, and larger components that need to be easily observed and debugged, such as integrated circuit chips, large electrolytic capacitors, and sockets, are usually placed on the top layer. The bottom layer is used to solder through-hole components (such as ROSA pins), power modules, and heat dissipation designs. It also carries the copper foil traces and signal traces that connect to the components in the top and inner layers, forming a complete circuit path to ensure smooth transmission of electronic signals throughout the entire circuit board.

[0028] Preset vias are pre-defined holes used for connecting conductors from the bottom to the top of a PCB. This allows signals to be transmitted from the bottom to the top of the PCB through these preset vias. Via-to-layer switching is a crucial method in PCB design for signal transmission and electrical connections between different layers. Vias are small holes that penetrate different layers of a PCB, plated with copper. The copper on the hole walls connects the copper traces of circuits on the upper and lower layers, enabling signal transmission between different layers. This transforms the PCB from a planar structure to a three-dimensional structure, allowing wiring that cannot be completed with a single layer to be achieved through the combination of multiple layers and vias.

[0029] Based on this, the electrical signal is directly transmitted to the bottom of the PCB board through the ROSA module, and the holes at the bottom for layer replacement are determined so that subsequent layer replacement can be performed through the holes, reducing the impedance that is easily caused by the excessive length of the ROSA module pins.

[0030] S130. Based on the pre-set solder layer conductors and the corresponding hole conductors of the pre-set holes, the electrical signal of the solder layer is transmitted to the component layer.

[0031] Among them, the solder layer conductors are conductors that transmit signals at the bottom of the PCB board. They can be high-speed differential lines, which are an important wiring method for transmitting high-speed signals and have the characteristics of strong anti-interference ability and good signal integrity. The via conductors are used to connect different layers of the PCB board, thereby enabling signal transmission between different layers. They can be circuit copper lines. Vias are holes drilled in the PCB board with copper plated on their walls. These copper layers are used to connect the circuit copper lines between different layers, thereby transforming the PCB board from a planar structure into a three-dimensional structure, allowing signals to be transmitted between the lines on different layers.

[0032] The component layer is the top layer of a PCB board. PCB boards are usually multi-layered, and the top layer is the very top layer of the PCB board, also known as the component layer. Various electronic components, such as chips, resistors, capacitors, and inductors, are usually placed on this layer. The pins of the components are connected to the circuit pattern on the top layer through processes such as soldering to realize the function of the circuit.

[0033] Based on this, the pins of the ROSA module are connected to the vias at the bottom of the PCB board via high-speed differential lines. This allows for the transmission of electrical signals to the top layer via the copper traces inside the vias. However, in PCB design, direct insertion of the ROSA (optical receiver submodule) pins can cause stubs (stubs can be understood as the unused portion of the conductor, in this case, the part of the pin that is not fully utilized by the signal), leading to discontinuous signal transmission. When the ROSA pins are directly inserted, if the pin length exceeds the actual length required for connection on the PCB board, a stub is formed. For example, if a pin is inserted from the top layer and connected to an inner layer circuit, but there is still an extra section on the bottom layer that is not used by the signal, this becomes a stub. Therefore, by directly inserting the ROSA pins to the bottom layer of the PCB board and using high-speed differential lines and vias to achieve layer switching of electrical signals, the continuity of signal transmission is ensured.

[0034] S140. Determine the cutout area corresponding to the preset coupling capacitor, and transmit the electrical signal of the component layer to the control unit according to the coupling capacitor and the cutout area.

[0035] Among them, the coupling capacitor, also known as the AC coupling capacitor, is a capacitor element used to connect two parts in a circuit, allowing AC signals to pass through while blocking DC signals. During high-speed signal transmission, the presence of the coupling capacitor will change the impedance characteristics of the signal transmission line, resulting in signal reflection and distortion. By hollowing out the reference layer below the coupling capacitor, the electric field distribution near the capacitor can be adjusted, reducing the influence of the capacitor's parasitic parameters, making the impedance of the signal transmission line more uniform, thereby improving signal integrity.

[0036] The control unit can be an IC chip. An IC chip (Integrated Circuit Chip) is an electronic device that integrates a large number of microelectronic components (such as transistors, resistors, capacitors, etc.) onto a tiny semiconductor chip to achieve a specific function.

[0037] Based on this, by determining the coupling capacitor and the corresponding cutout area, the electrical signal is transmitted to the IC chip through the coupling capacitor.

[0038] Based on the feasible implementation of S120 described above, this application further provides a method for transmitting electrical signals to the soldering layer of a PCB board according to the ROSA module and determining preset holes in the soldering layer, including the following steps: Determine the pins of the ROSA module; the connection method between the pins and the solder layer of the PCB board is through-hole. Based on the pins of the ROSA module, electrical signals are transmitted to the soldering layer of the PCB board; Determine the pre-set holes for the welding layer.

[0039] The radius of the isolation unit corresponding to the pin of the ROSA module can be adjusted to 0.8 mm. The isolation unit refers to the isolation area set around the pad of the ROSA pin in the printed circuit board (PCB) design, that is, the anti-pad corresponding to the ROSA pin. The anti-pad is a copper-free area around the via or pin in the PCB, which is used to isolate the via from the adjacent reference plane (such as GND or PWR layer), prevent electrical short circuits and control parasitic capacitance.

[0040] Based on this, by determining the radius of the anti-pad corresponding to the ROSA pin to be 0.8 mm and inserting the pin directly into the bottom layer of the PCB board, the impedance discontinuity problem caused by the size of the pin pad was solved.

[0041] Based on the feasible implementation of S120 described above, this application further provides the steps for determining the preset holes in the weld layer, including: Identify the same target hole corresponding to each layer of the PCB board, and determine the solder hole ring of the target hole in the solder layer; Determine the preset hole based on the target hole and the welding ring.

[0042] In this context, the same target hole corresponding to each layer of the PCB board is the hole ring of the via layer change between each layer of the PCB board. A via is a small hole that penetrates different layers of the PCB board. It is plated with copper inside and connects the copper wires of the upper and lower layers through the copper on the hole wall, thereby realizing the transmission of signals between different layers. The target hole can be understood as the small hole of each layer.

[0043] The solder hole ring is a hole ring located on the bottom layer of the PCB board for through-hole layer replacement.

[0044] Based on this, by determining the via rings between each layer of the PCB board for via layer switching, the circuit can be transmitted across layers according to the internal circuit copper lines.

[0045] Based on the feasible implementation of S130 described above, this application further provides a method for transmitting electrical signals from the solder layer to the component layer according to solder layer conductors preset in the solder layer and hole conductors corresponding to preset holes, including the following steps: The high-speed differential conductor is determined to have a width of 0.18 mm; Determine the welding layer conductors based on the high-speed differential conductors; Determine the wire guide for the hole; The electrical signals of the solder layer are transmitted to the component layer based on the solder layer conductors and the hole conductors.

[0046] The width of high-speed differential lines has a significant impact on signal transmission, PCB design, and circuit performance. The width of differential lines is one of the key factors affecting differential impedance. In order to achieve low-reflection transmission of high-speed signals, the impedance of differential lines needs to be controlled at a specific value, such as the common 100 ohms. If the line width is too wide, the differential impedance will be lower than the target value, resulting in increased signal reflection and affecting signal integrity. If the line width is too narrow, the impedance will be higher than the target value, which will also cause reflection and may also lead to increased signal attenuation.

[0047] Based on this, by determining a high-speed differential line with a width of 0.18 mm as the conductor for signal transmission on the bottom layer of the PCB board, electrical signals are transmitted to the top layer according to the high-speed differential line and the circuit copper wires inside the holes.

[0048] Based on the feasible implementation of S130 described above, this application further provides the steps for determining the hole conductor: Determine the welding pad with a radius of 0.4 mm; Determine the hole wire based on the welding pad.

[0049] Among them, the solder pad is the solder pad corresponding to the hole of the via layer change, which provides an electrical connection point between the electronic component pin and the circuit on the PCB, so that current can flow between the component and the circuit, ensuring the normal operation of the entire circuit system. When changing layers from the bottom layer to the top layer, the copper skin between the vias is completely removed, and the radius of the corresponding solder pad Anti-pad is modified to 0.4 mm.

[0050] Based on this, the anti-pad radius corresponding to the via was modified to 0.4 mm, thereby reducing the impedance caused by the via.

[0051] Please see Figure 2 , Figure 2 This is a schematic diagram illustrating the application of a signal transmission method for a PCB board provided in an embodiment of this application; as shown below. Figure 2 As shown, the ROSA pin is directly inserted into the bottom layer of the PCB board. The high-speed differential line of the bottom layer is routed through a hole in the bottom layer to change to the top layer. The vias only have via loops in the bottom layer, and the via loops are removed in other layers. The bottom layer needs to be supplemented with a portion of copper as a reference for the high-speed line. When the differential signal changes from the bottom layer to the top layer, all the copper between the vias is removed. The area below the coupling capacitor is removed close to the IC. The second layer below the QFN pad of the IC signal differential line is removed.

[0052] Please see Figure 3 , Figure 3 This is a dimensional schematic diagram of a signal transmission method for a PCB board provided in an embodiment of this application; as shown below. Figure 3 As shown, the anti-pad radius of the ROSA pin is modified to 0.8mm, and a portion of copper is added to the bottom layer as a reference for high-speed lines with a width of 0.18mm. All copper between vias is removed, the anti-pad radius is modified to 0.4mm, the size of the cut-out below the coupling capacitor is 1*1.15mm, and the size of the cut-out in the second layer below the QFN pad of the IC signal differential line is 0.85*1mm.

[0053] In some embodiments of this application, the ROSA pin is directly inserted into the bottom layer of the PCB board. The high-speed differential line in the bottom layer is transferred to the top layer through a hole in the bottom layer to achieve signal transmission. In existing PCB board signal transmission methods, the differential signal is transmitted to the IC chip limiting amplifier through a coupling capacitor on the surface layer. The coupling capacitor is placed close to the ROSA end, and the proportion of the second layer cut out is only the size of the coupling capacitor package. The high-speed differential QFN pin of the IC is not specially treated. It is easy to cause impedance discontinuity due to the stub caused by the direct insertion of the ROSA pin, the inappropriate size of the cutout of the coupling capacitor, or the improper treatment of the high-speed differential QFN pin of the IC. This seriously affects the efficiency and quality of signal transmission. This can be solved by directly inserting the ROSA pin into the bottom layer of the PCB board, adjusting the anti-pad radius corresponding to the pin, cutting out all the copper between the vias when changing layers, and determining the cutout size corresponding to the coupling capacitor.

[0054] Thus, in optical communication systems, the ROSA module, as a core component for optical signal reception, directly affects the overall system performance due to its signal transmission quality. To effectively improve the signal transmission performance of the ROSA module, a through-hole pin connection is used to connect it to the PCB board solder layer, reducing contact resistance and signal transmission loss through large-area contact. For signal transmission, high-speed differential conductors are selected, providing strong anti-interference capabilities and effectively suppressing common-mode interference. Addressing the impedance discontinuity issues caused by vias and coupling capacitors in PCB trace design, precise cutouts are made in the areas corresponding to the coupling capacitors. By adjusting the electric field distribution near the capacitors, the influence of parasitic parameters is reduced, achieving uniform impedance of the transmission line and significantly reducing signal reflection.

[0055] Figure 4 This is a schematic flowchart illustrating another signal transmission method for a PCB board provided in an embodiment of this application. Figure 4 As shown, the signal transmission method of this PCB board may include the following steps: S410: Acquire the optical signal and determine the corresponding electrical signal based on the preset ROSA module.

[0056] S420: Based on the ROSA module, transmit electrical signals to the soldering layer of the PCB board and determine the preset holes of the soldering layer.

[0057] S430. Based on the pre-set solder layer conductors and the corresponding hole conductors of the pre-set holes, the electrical signal of the solder layer is transmitted to the component layer.

[0058] In some embodiments of this application, the specific implementation of steps S410 to S430 can be found in the foregoing embodiments, and will not be repeated here.

[0059] S440. Determine the component layer region corresponding to the coupling capacitor.

[0060] Based on this, by determining the area corresponding to the coupling capacitor on the component layer, i.e. the top layer of the PCB board, the size of the cut-out area can be determined according to the area corresponding to the coupling capacitor.

[0061] S450. Based on the component layer area, determine the target area, which is 1 mm long and 1.15 mm wide.

[0062] The target area is the hollowed-out area corresponding to the coupling capacitor. During high-speed signal transmission, the presence of the coupling capacitor will change the impedance characteristics of the signal transmission line, resulting in signal reflection and distortion. By hollowing out the reference layer below the coupling capacitor, the electric field distribution near the capacitor can be adjusted, the influence of the capacitor's parasitic parameters can be reduced, and the impedance of the signal transmission line can be made more uniform, thereby improving signal integrity.

[0063] Based on this, the size of the hollowed-out area is determined in order to improve the transmission quality of the signal.

[0064] S460. Determine the excavation area based on the target area.

[0065] Based on this, the target area is determined as the area to be excavated in order to facilitate signal transmission.

[0066] S470: Based on the coupling capacitance and cutout area, the electrical signals of the component layer are transmitted to the control unit.

[0067] Based on this, signal transmission on the PCB board is achieved by hollowing out the coupling capacitor in the reference layer below the coupling capacitor.

[0068] Based on the feasible implementation of S470 described above, this application further provides a method for transmitting electrical signals from a component layer to a control unit according to the coupling capacitance and the cut-out area, including the following steps: Determine the component layer region corresponding to the signal differential wires of the control unit; Based on the component layer region, determine the target region, which is 0.85 mm long and 1 mm wide; Based on the coupling capacitance, cutout area, and target region, the electrical signals of the component layer are transmitted to the control unit.

[0069] The target area is the area on the second layer below the QFN pad of the IC signal differential line; the presence of the pad will change the characteristic impedance of the differential line, resulting in impedance discontinuity during signal transmission.

[0070] Based on this, by determining the cut-out area corresponding to the second layer below the QFN pad of the IC signal differential line, signal transmission is performed according to the cut-out coupling capacitor and the IC signal differential line.

[0071] In some embodiments of this application, the loss caused by excessively long PCB traces and the impedance discontinuity caused by trace vias and coupling capacitors are reduced, thereby solving the signal reflection problem. In addition, the impedance discontinuity caused by the size of the input and output pin pads of the signal transceiver chip is solved. The corresponding area of ​​the coupling capacitor is precisely hollowed out. By adjusting the electric field distribution near the capacitor, the influence of parasitic parameters is reduced, the transmission line impedance is homogenized, and signal reflection is significantly reduced.

[0072] Figure 5 This is a schematic diagram of the structure of a signal transmission device 500 for a PCB board provided in an embodiment of this application. Figure 5 As shown, the signal transmission device 500 of the PCB board includes: a signal acquisition module 510, a hole determination module 520, a signal transmission module 530, and an area determination module 540; wherein: The signal acquisition module 510 is used to acquire optical signals and determine the electrical signals corresponding to the optical signals according to the preset ROSA module. The hole determination module 520 is used to transmit electrical signals to the soldering layer of the PCB board according to the ROSA module and determine the preset holes of the soldering layer. The signal transmission module 530 is used to transmit the electrical signal of the solder layer to the component layer according to the solder layer wires preset in the solder layer and the hole wires corresponding to the preset holes. The area determination module 540 is used to determine the cutout area corresponding to the preset coupling capacitor, and transmit the electrical signal of the component layer to the control unit according to the coupling capacitor and the cutout area.

[0073] In this embodiment of the application, the hole determination module 520 can also be specifically used for: According to the ROSA module, electrical signals are transmitted to the soldering layer of the PCB board, and the preset holes of the soldering layer are determined, including: Determine the pins of the ROSA module; the connection method between the pins and the solder layer of the PCB board is through-hole. Based on the pins of the ROSA module, electrical signals are transmitted to the soldering layer of the PCB board; Determine the pre-set holes for the welding layer.

[0074] In this embodiment of the application, the hole determination module 520 can also be specifically used for: Identify the same target hole corresponding to each layer of the PCB board, and determine the solder hole ring of the target hole in the solder layer; Determine the preset hole based on the target hole and the welding ring.

[0075] In this embodiment of the application, the signal transmission module 530 can also be specifically used for: The high-speed differential conductor is determined to have a width of 0.18 mm; Determine the welding layer conductors based on the high-speed differential conductors; Determine the wire guide for the hole; The electrical signals of the solder layer are transmitted to the component layer based on the solder layer conductors and the hole conductors.

[0076] In this embodiment of the application, the signal transmission module 530 can also be specifically used for: Determine the welding pad with a radius of 0.4 mm; Determine the hole wire based on the welding pad.

[0077] In this embodiment of the application, the area determination module 540 can also be specifically used for: Determine the component layer region corresponding to the coupling capacitor; Based on the component layer region, determine the target region, which is 1 mm long and 1.15 mm wide; Determine the excavation area based on the target area; Based on the coupling capacitance and the cutout area, the electrical signals of the component layer are transmitted to the control unit.

[0078] In this embodiment of the application, the area determination module 540 can also be specifically used for: Determine the component layer region corresponding to the signal differential wires of the control unit; Based on the component layer region, determine the target region, which is 0.85 mm long and 1 mm wide; Based on the coupling capacitance, cutout area, and target region, the electrical signals of the component layer are transmitted to the control unit.

[0079] Figure 6 This is a schematic diagram of the device provided in an embodiment of this application. Figure 6 As shown, the device 600 includes: The device 600 may include a processor 601 with one or more processing cores, a memory 602 with one or more computer-readable storage media, a communication component 603, and other components. The processor 601, memory 602, and communication component 603 are connected via a bus 606.

[0080] In the specific implementation process, at least one processor 601 executes computer execution instructions stored in memory 602, causing at least one processor 601 to execute the signal transmission method of the PCB board as described above.

[0081] The specific implementation process of processor 601 can be found in the above method embodiments, and its implementation principle and technical effect are similar. It will not be repeated here.

[0082] Furthermore, the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. A general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this application can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0083] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0084] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0085] In some embodiments, a computer program product is also provided, including a computer program or instructions that, when executed by a processor, implement the steps in any of the signal transmission methods for the PCB board described above.

[0086] For details on the implementation of each of the above operations, please refer to the previous examples, which will not be repeated here.

[0087] Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be performed by instructions, or by instructions controlling related hardware. These instructions can be stored in a computer-readable storage medium and loaded and executed by a processor.

[0088] Therefore, embodiments of this application provide a computer-readable storage medium storing a plurality of program codes, which can be loaded by a processor to execute the steps in any of the signal transmission methods for a PCB board provided in embodiments of this application.

[0089] The storage medium may include: read-only memory (ROM), random access memory (RAM), disk or optical disk, etc.

[0090] According to one aspect of this application, a computer program product or computer program is provided, the computer program product or computer program including computer instructions stored in a computer-readable storage medium.

[0091] Since the instructions stored in the storage medium can execute the steps in any of the signal transmission methods of the PCB board provided in the embodiments of this application, the beneficial effects that any of the signal transmission methods of the PCB board provided in the embodiments of this application can achieve can be realized. For details, please refer to the previous embodiments, which will not be repeated here.

[0092] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the foregoing claims.

[0093] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A signal transmission method for a PCB board, characterized in that, The method includes: Acquire optical signals and determine the corresponding electrical signals based on the preset ROSA module; According to the ROSA module, the electrical signal is transmitted to the soldering layer of the PCB board, and the preset holes of the soldering layer are determined; Based on the pre-set welding layer conductors and the corresponding hole conductors of the pre-set holes, the electrical signals of the welding layer are transmitted to the component layer; The cutout area corresponding to the preset coupling capacitor is determined, and the electrical signal of the component layer is transmitted to the control unit according to the coupling capacitor and the cutout area.

2. The method according to claim 1, characterized in that, According to the ROSA module, the electrical signal is transmitted to the soldering layer of the PCB board, and the preset holes of the soldering layer are determined, including: The pins of the ROSA module are determined, and the connection method between the pins and the solder layer of the PCB board is through-hole. The electrical signal is transmitted to the solder layer of the PCB board according to the pins of the ROSA module; Determine the preset holes in the weld layer.

3. The method according to claim 2, characterized in that, The step of determining the preset holes in the weld layer includes: Identify the same target hole corresponding to each layer of the PCB board, and determine the welding hole ring of the target hole in the welding layer; The preset hole is determined based on the target hole and the welding ring.

4. The method according to claim 1, characterized in that, The step of transmitting the electrical signal of the solder layer to the component layer according to the solder layer wires preset in the solder layer and the hole wires corresponding to the preset holes includes: A high-speed differential conductor is defined, wherein the width of the high-speed differential conductor is 0.18 mm; The welding layer conductor is determined based on the high-speed differential conductor; Determine the wire in the hole; The electrical signal of the solder layer is transmitted to the component layer based on the solder layer conductor and the hole conductor.

5. The method according to claim 4, characterized in that, The process of determining the hole conductor includes: Determine the welding pad with a radius of 0.4 mm; The hole wire is determined based on the welding pad.

6. The method according to claim 1, characterized in that, The step of determining the cutout area corresponding to the preset coupling capacitor, and transmitting the electrical signal of the component layer to the control unit according to the coupling capacitor and the cutout area, includes: Determine the component layer region corresponding to the coupling capacitor; Based on the component layer region, a target region is determined, wherein the target region is 1 mm long and 1.15 mm wide; The excavation area is determined based on the target area; Based on the coupling capacitance and the cutout area, the electrical signals of the component layer are transmitted to the control unit.

7. The method according to claim 6, characterized in that, The step of transmitting the electrical signal of the component layer to the control unit based on the coupling capacitance and the cutout area includes: Determine the component layer region corresponding to the signal differential wires of the control unit; Based on the component layer region, a target region is determined, wherein the target region is 0.85 mm long and 1 mm wide; The electrical signals of the component layer are transmitted to the control unit based on the coupling capacitor, the cut-out area, and the target region.

8. A signal transmission device for a PCB board, characterized in that, The device includes: The signal acquisition module is used to acquire optical signals and determine the electrical signals corresponding to the optical signals according to the preset ROSA module. A hole determination module is used to transmit the electrical signal to the solder layer of the PCB board according to the ROSA module, and determine the preset holes of the solder layer; The signal transmission module is used to transmit the electrical signal of the welding layer to the component layer according to the welding layer wires preset in the welding layer and the hole wires corresponding to the preset holes; The area determination module is used to determine the cutout area corresponding to the preset coupling capacitor, and transmit the electrical signal of the component layer to the control unit according to the coupling capacitor and the cutout area.

9. A device, characterized in that, include: One or more processors; Memory; One or more programs, wherein the one or more programs are stored in memory and configured to be executed by one or more processors, the one or more programs being configured to perform the method as claimed in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores program code that can be called by a processor to perform the method as claimed in any one of claims 1 to 7.

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