Electronic assembly, casing assembly and electronic equipment
By setting bevels on the heat dissipation unit and the electronic unit and using thermal interface materials, the problem of thermal paste being scraped off during insertion was solved, and good thermal conductivity between the electronic unit and the heat dissipation unit was achieved.
Patent Information
- Application Number
- CN202410687787.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-05-08
- Filing Date
- 2024-05-30
- Publication Date
- 2025-11-11
AI Technical Summary
During the process of inserting the electronic unit into the housing, the thermal paste applied to the electronic unit is easily scraped off or damaged by the heat dissipation unit that is already fixed in the housing, resulting in the thermal conduction efficiency between the electronic unit and the heat dissipation unit being less than expected.
The heat dissipation unit and the electronic unit are designed with inclined surfaces, and a thermal interface material is provided on the electronic unit. When the electronic unit is inserted into the housing, the thermal interface material is pushed by the inclined surface of the heat dissipation unit to form a continuous thermal interface layer to ensure thermal coupling.
It achieves good thermal conductivity between the electronic unit and the heat dissipation unit, avoids the problem of thermal paste being scraped off during insertion, and ensures the expected effect of thermal conductivity.
Smart Images
Figure CN120935981A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an electronic component, a housing assembly, and an electronic device. Background Technology
[0002] With the development of technology, an electronic device has been developed that houses an electronic unit and a heat dissipation unit. The heat dissipation unit is fixed inside the casing, while the electronic unit is slidably inserted into the casing. Before inserting the electronic unit into the casing, thermal paste must be applied to the electronic unit to ensure good thermal coupling between the electronic unit and the heat dissipation unit after insertion.
[0003] However, during the insertion of the electronic unit into the housing, the thermal paste applied to the electronic unit is easily scraped off or damaged by the heat dissipation unit already fixed inside the housing, resulting in lower-than-expected heat transfer efficiency between the electronic unit and the heat dissipation unit. In view of this, researchers in the field are working to solve the aforementioned problems. Summary of the Invention
[0004] The present invention provides an electronic component, a housing component, and an electronic device that can ensure the heat conduction efficiency between the electronic unit and the heat dissipation unit.
[0005] An embodiment of the present invention discloses an electronic device comprising a housing assembly and an electronic component. The housing assembly includes a housing and a heat dissipation unit. The heat dissipation unit is disposed within the housing and includes a heat dissipation unit body. The heat dissipation unit body has a first inclined surface, which is inclined relative to the heat dissipation unit body. The electronic component is slidably mounted within the housing and includes an electronic unit and a thermal interface material. The electronic unit includes an electronic unit body, which has a second inclined surface, which is inclined relative to the electronic unit body. The thermal interface material is disposed on the second inclined surface of the electronic unit and contacts the first inclined surface of the heat dissipation unit, thereby thermally coupling the electronic component to the heat dissipation unit.
[0006] Another embodiment of the present invention discloses a housing assembly, comprising a housing and a heat dissipation unit. The housing includes multiple side plates surrounding an accommodating space, and one side of each side plate surrounding an assembly opening communicating with the accommodating space. The heat dissipation unit is disposed within the accommodating space and includes a heat dissipation unit body. The heat dissipation unit body has an inclined surface that slopes away from the assembly opening.
[0007] Another embodiment of the present invention discloses an electronic component for slidably mounting within a housing, suitable for thermal coupling with a heat dissipation unit within the housing. The electronic component includes an electronic unit and a thermal interface material. The electronic unit includes an electronic unit body with an inclined surface. The thermal interface material is disposed on the inclined surface and is suitable for filling a gap between the electronic component and the heat dissipation unit.
[0008] According to the electronic components, housing components, and electronic devices disclosed in the above embodiments, by providing a first inclined surface on the heat dissipation unit body, a second inclined surface on the electronic unit body, and disposing of thermal interface material on the second inclined surface of the electronic unit, the thermal interface material can be pushed by the first inclined surface of the heat dissipation unit when the electronic unit is installed in the housing, thereby allowing the electronic unit to be thermally coupled to the heat dissipation unit through the thermal interface material. In this way, the expected heat conduction efficiency between the electronic unit and the heat dissipation unit can be ensured.
[0009] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description
[0010] Figure 1 The figure shown is a perspective view of an electronic device disclosed according to a first embodiment of the present invention;
[0011] Figure 2 As shown Figure 1 A three-dimensional schematic diagram of electronic components of an electronic device being extracted from its casing;
[0012] Figure 3 As shown Figure 2 A cross-sectional view of the electronic components being pushed into the housing;
[0013] Figure 4 As shown Figure 2 A cross-sectional schematic diagram of the thermal interface material of an electronic component in contact with a heat dissipation unit.
[0014] Figure 5 As shown Figure 4 Enlarged cross-sectional view of part of the diagram;
[0015] Figure 6 As shown Figure 2 A cross-sectional view showing the electronic components fully inserted into the housing;
[0016] Figure 7 As shown Figure 6 A partially enlarged cross-sectional view.
[0017] [Explanation of Figure Markers]:
[0018] 1. Electronic equipment;
[0019] 10. Housing assembly;
[0020] 11. Housing;
[0021] 110. Side panels;
[0022] 111. Assembly port;
[0023] 112. Storage space;
[0024] 113. Assembly slot;
[0025] 12. Heat dissipation unit;
[0026] 120. Heat dissipation unit body;
[0027] 121. Liquid inlet connector;
[0028] 122. Liquid outlet connector;
[0029] 123. First inclined plane;
[0030] 13. Guide rail;
[0031] 20. Electronic components;
[0032] 21. Electronic unit;
[0033] 211. Electronic unit body;
[0034] 212. Boss structure;
[0035] 213. Second inclined plane;
[0036] 22. Thermal interface materials;
[0037] 23. Continuous thermal interface layer;
[0038] θ1, θ2, slope;
[0039] H1, H2, Height;
[0040] D. Sliding direction;
[0041] E. Direction of extension;
[0042] P, major axis;
[0043] L, length;
[0044] W, width;
[0045] T, thickness;
[0046] G. Distance. Detailed Implementation
[0047] Please see Figure 1 , Figure 1 This is a perspective view of an electronic device disclosed according to a first embodiment of the present invention. In this embodiment, the electronic device 1 is, for example, a high-performance computing device. The electronic device 1 includes a housing assembly 10 and a plurality of electronic components 20.
[0048] Next, please refer to Figures 1 to 3 . Figure 2 for Figure 1 A three-dimensional schematic diagram of electronic components being extracted from the casing of an electronic device. Figure 3 for Figure 2 A cross-sectional view of the electronic components being pushed into the housing.
[0049] The housing assembly 10 includes a housing 11 and multiple heat dissipation units 12. The housing 11 includes multiple side plates 110, an assembly port 111, and a receiving space 112. The multiple side plates 110 surround the receiving space 112, and the assembly port 111 is formed by the sides of the multiple side plates 110 and communicates with the receiving space 112. The heat dissipation unit 12 is, for example, a liquid cooling plate, including a heat dissipation unit body 120 and having an inlet connector 121 and an outlet connector 122, allowing coolant to flow through the heat dissipation unit 12. Furthermore, each heat dissipation unit body 120 has two first inclined surfaces 123. The two first inclined surfaces 123 are located on opposite sides of the heat dissipation unit body 120 of the heat dissipation unit 12. The first inclined surface 123 is inclined at an angle θ1 from the assembly port away from the assembly port 111 relative to the heat dissipation unit body 120. The angle θ1 of the first inclined surface 123 relative to the heat dissipation unit body 120 is, for example, less than 5 degrees, such as 3 degrees. These heat dissipation units 12 are fixed at intervals within the accommodating space 112 of the housing 11, forming a plurality of assembly slots 113 within the accommodating space 112. These assembly slots 113 are located on one side of the first inclined surface 123 of these heat dissipation units 12. In each assembly slot 113, the height H1 of the side of the assembly slot 113 adjacent to the assembly port 111 is greater than the height H2 of the side of the assembly slot 113 away from the assembly port 111.
[0050] These electronic components 20 are slidably mounted in the assembly slots 113 within the housing 11. Since these electronic components 20 have similar structures, only one will be described in detail below. Each electronic component 20 includes an electronic unit 21 and multiple thermal interface materials 22. The electronic unit 21 is slidably mounted in the assembly slot 113 within the housing 11. For example, the housing assembly 10 may further include multiple guide rails 13, and the opposite sides of the electronic unit 21 can be connected to the housing 11 via two guide rails 13, allowing the electronic unit 21 to be slidably mounted into the assembly slot 113 within the housing 11. The sliding direction D of the electronic unit 21 relative to the housing 11 is either the extending direction E of the guide rail 13 or parallel to the major axis P of the guide rail 13.
[0051] It should be noted that the electronic unit 21 is not limited to the assembly slot 113 that can be slidably inserted into the housing 11 via two guide rails 13. In other embodiments, the housing assembly may instead include a plurality of L-shaped brackets disposed on opposite sides within the housing, and the electronic unit can be slidably inserted into the assembly slot within the housing 11 via the guidance of two opposing L-shaped brackets. In one embodiment, the electronic unit can be directly slidably inserted into the assembly slot within the housing without the guidance of any components.
[0052] The electronic unit 21 includes an electronic unit body 211, a boss structure 212, and a second inclined surface 213. The boss structure 212 protrudes outward from the electronic unit body 211, and the second inclined surface 213 is located on the boss structure 212. The second inclined surface 213 is inclined to the electronic unit body 211; in other words, the second inclined surface 213 is not parallel to the sliding direction D of the electronic unit 21 relative to the housing 11. That is, the second inclined surface 213 forms an angle with the sliding direction D of the housing 11. For example, the second inclined surface 213 forms an acute angle with the sliding direction D of the housing 11. And the slope θ2 of the second inclined surface 213 is, for example, less than 5 degrees, such as 3 degrees.
[0053] These thermal interface materials 22 are, for example, but not limited to, thermal paste. These thermal interface materials 22 can be applied to the second inclined surface 213 of the electronic unit 21 by machine (e.g., an automatic dispensing machine) to save time and control the amount of paste. Before the electronic component 20 is placed into the assembly slot 113 within the housing 11, these thermal interface materials 22 are, for example, rectangular strips, spaced apart on the second inclined surface 213 of the electronic unit 21. The length L and width W of each thermal interface material 22 are, for example, 270 mm and 12 mm, respectively, and the thickness T of each thermal interface material 22 is greater than the distance G between the second inclined surface 213 of the electronic unit 21 and the first inclined surface 123 of the heat dissipation unit 12 after placement in the housing 11 (e.g., ...). Figure 7As shown in the diagram, this distance G can also be considered as the width of the gap between the second inclined surface 213 of the electronic unit 21 after it is placed in the housing 11 and the first inclined surface 123 of the heat dissipation unit 12. For example, the thickness T of these thermal interface materials 22 is 0.5 mm, and the distance G between the second inclined surface 213 of the electronic unit 21 after it is placed in the housing 11 and the first inclined surface 123 of the heat dissipation unit 12 is 0.3 mm.
[0054] Next, the process of installing the electronic component 20 into the assembly slot 113 of the housing 11 will be described below. Please refer to [link / reference needed]. Figures 3 to 5 . Figure 4 for Figure 2 A cross-sectional view of the thermal interface material of an electronic component in contact with a heat dissipation unit. Figure 5 for Figure 4 A partially enlarged cross-sectional view.
[0055] First, such as Figure 3 As shown, the electronic component 20 is pushed into the assembly slot 113 of the housing 11 along the sliding direction D. Then, as... Figure 4 and Figure 5 As shown, when the electronic components 20 are about to be fully pushed into the assembly slot 113 of the housing 11, the thermal interface material 22 on the second inclined surface 213 of the electronic unit 21 comes into contact with the first inclined surface 123 of the heat dissipation unit 12.
[0056] Next, please refer to Figure 6 and Figure 7 . Figure 6 for Figure 2 A cross-sectional view showing the electronic components fully inserted into the housing. Figure 7 for Figure 6 A partially enlarged cross-sectional view.
[0057] like Figure 6 and Figure 7 As shown, the electronic component 20 is further pushed into the assembly slot 113 of the housing 11 along the sliding direction D. This causes the thermal interface material 22 on the second inclined surface 213 of the electronic unit 21 to be pushed by the first inclined surface 123 of the heat dissipation unit 12, filling the gap or space between the second inclined surface 213 of the electronic unit 21 and the first inclined surface 123 of the heat dissipation unit 12. In this way, after the electronic component 20 is fully pushed into the assembly slot 113 of the housing 11, a continuous thermal interface layer 23 is formed between the heat dissipation unit 12 and the electronic unit 21. This ensures that the first inclined surface 123 of the heat dissipation unit 12 and the second inclined surface 213 of the electronic unit 21 are thermally coupled through the large-area continuous thermal interface layer 23, achieving the expected heat conduction efficiency.
[0058] In this embodiment, the area of the continuous thermal interface layer 23 formed by these thermal interface materials 22 is, for example, equal to the area of the second inclined surface 213 of the electronic unit 21 or the area of the first inclined surface 123 of the heat dissipation unit 12. In this way, it can be ensured that the first inclined surface 123 of the heat dissipation unit 12 and the second inclined surface 213 of the electronic unit 21 are completely coupled through the continuous thermal interface layer 23, thereby further improving the heat conduction efficiency.
[0059] It should be noted that the continuous thermal interface layer 23 is not limited to being formed of multiple thermal interface materials 22. In other embodiments, the continuous thermal interface layer may be formed of only one thermal interface material. In such a configuration, after the electronic components are placed into the assembly slot within the housing, the area of the thermal interface material pushed by the first slope of the heat dissipation unit may be equal to or less than the area of the second slope of the electronic unit or the area of the first slope of the heat dissipation unit.
[0060] On the other hand, these thermal interface materials 22 are not limited to forming a continuous thermal interface layer 23 after being pushed by the first inclined surface of the heat dissipation unit. In other embodiments, these thermal interface materials remain in a spaced-out state after being pushed by the first inclined surface of the heat dissipation unit.
[0061] In this embodiment, the slopes θ1 and θ2 of the first slope 123 of the heat dissipation unit 12 and the second slope 213 of the electronic unit 21 are set to be less than 5 degrees. This allows the first slope 123 of the heat dissipation unit 12 and the second slope 213 of the electronic unit 21 to be relatively flat, so as to avoid the height of the casing 11 from being excessively increased due to the design of the slopes of the heat dissipation unit 12 and the electronic unit 21, and thus maintain the aesthetics of the overall electronic device 1.
[0062] Furthermore, by using the slopes θ1 and θ2 of the first slope 123 of the heat dissipation unit 12 and the second slope 213 of the electronic unit 21 to be 3 degrees, the thickness of these thermal interface materials 22 is 0.5 mm before the electronic component 20 is placed into the assembly slot 113 in the housing 11, and the distance between the second slope 213 of the electronic unit 21 and the first slope 123 of the heat dissipation unit 12 after the electronic unit 21 is placed into the housing 11 is 0.3 mm, these thermal interface materials 22 will not be scraped off during the process of pushing the electronic component 20 into the housing 11, and it is ensured that after the electronic component 20 is fully pushed into the housing 11, these thermal interface materials 22 are evenly distributed in the gap between the second slope 213 of the electronic unit 21 and the first slope 123 of the heat dissipation unit 12, thereby achieving the structural integrity of the continuous thermal interface layer 23.
[0063] It should be noted that the slopes θ1 and θ2 of the first slope 123 of the heat dissipation unit 12 and the second slope 213 of the electronic unit 21, the thickness T of the thermal interface material 22 before the electronic component 20 is placed into the assembly slot 113 in the housing 11, and the distance G between the second slope 213 of the electronic unit 21 and the first slope 123 of the heat dissipation unit 12 after the electronic unit 21 is placed into the housing 11 are not limited to the values or ranges mentioned above. As long as it is ensured that the thermal interface material is not scraped off during the process of pushing the electronic component into the housing, and that the thermal interface material is evenly distributed in the gap between the second slope of the electronic unit and the first slope of the heat dissipation unit after the electronic component is fully pushed into the housing, the above parameters can be adjusted arbitrarily according to requirements.
[0064] It should be noted that the heat dissipation unit 12 is not limited to a liquid cooling plate. In other embodiments, the heat dissipation unit may be a heat sink fin. In such a configuration, the heat absorbed by the heat dissipation unit can be dissipated by natural convection, or a fan can be installed inside the casing to dissipate the heat absorbed by the heat dissipation unit 12 by forced convection.
[0065] On the other hand, the number of heat dissipation units 12 and the number of electronic components 20 are not limited to multiples. In other embodiments, the number of heat dissipation units and the number of electronic components may be single.
[0066] According to the electronic components, housing components, and electronic devices disclosed in the above embodiments, a first inclined surface is provided on the heat dissipation unit body, which is inclined away from the assembly port. The electronic unit body is provided with a second inclined surface, which is not parallel to the sliding direction of the electronic component relative to the housing. The arrangement of these thermal interface materials on the second inclined surface of the electronic unit allows these thermal interface materials to be pushed by the first inclined surface of the heat dissipation unit when the electronic unit is installed in the housing, thus forming a continuous thermal interface layer between the heat dissipation unit and the electronic unit. In this way, thermal coupling between the first inclined surface of the heat dissipation unit and the second inclined surface of the electronic unit is ensured through a large-area continuous thermal interface layer, achieving the expected heat conduction efficiency.
[0067] Furthermore, the area of the continuous thermal interface layer is equal to the area of the second inclined surface of the electronic unit or the area of the first inclined surface of the heat dissipation unit. In this way, it can be ensured that the first inclined surface of the heat dissipation unit and the second inclined surface of the electronic unit are completely coupled through the continuous thermal interface layer, thereby further improving the heat conduction efficiency.
[0068] Furthermore, by setting the slope of the first slope of the heat dissipation unit and the second slope of the electronic unit to be less than 5 degrees, the first slope of the heat dissipation unit and the second slope of the electronic unit can be made relatively flat, so as to avoid the height of the casing from increasing excessively due to the slope design of the heat dissipation unit and the electronic unit, and thus maintain the aesthetics of the overall electronic device.
[0069] Although the present invention has been disclosed above with reference to the preferred embodiments described above, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the claims defined in the appended patent application.
Claims
1. An electronic device, characterized in that, Include: A housing assembly, comprising: A casing; and A heat dissipation unit is disposed within the housing and includes a heat dissipation unit body. The heat dissipation unit body has a first inclined surface that is inclined to the heat dissipation unit body. An electronic component is slidably mounted within the housing, and the electronic component includes: An electronic unit includes an electronic unit body, the electronic unit body having a second inclined surface, the second inclined surface being inclined to the electronic unit body; and A thermal interface material is disposed on the second inclined surface of the electronic unit, and the thermal interface material contacts the first inclined surface of the heat dissipation unit, thereby thermally coupling the electronic component to the heat dissipation unit.
2. The electronic device according to claim 1, characterized in that, The housing includes multiple side panels that surround an accommodating space. One side of each side panel surrounds an assembly opening that connects to the accommodating space. The heat dissipation unit is disposed within the accommodating space. The first inclined surface slopes from the assembly opening toward the heat dissipation unit body in a direction away from the assembly opening.
3. The electronic device according to claim 1, characterized in that, The heat dissipation unit has two first inclined surfaces, which are respectively located on opposite sides of the heat dissipation unit body. The electronic components have two second inclined surfaces, which are respectively facing the two first inclined surfaces of the heat dissipation unit.
4. The electronic device according to claim 1, characterized in that, The electronic unit includes a boss structure that protrudes from the body of the electronic unit, and the second inclined surface is located on the boss structure.
5. The electronic device according to claim 1, characterized in that, The slope of the first and second inclined planes is less than 5 degrees.
6. The electronic device according to claim 5, characterized in that, The slope of the first and second inclined planes is 3 degrees.
7. The electronic device according to claim 1, characterized in that, The thickness of the thermal interface material is equal to the distance between the second inclined surface of the electronic unit and the first inclined surface of the heat dissipation unit.
8. The electronic device according to claim 7, characterized in that, The distance between the second inclined surface of the electronic unit and the first inclined surface of the heat dissipation unit is 0.3 mm.
9. The electronic device according to claim 1, characterized in that, The area of the thermal interface material is equal to the area of the second inclined surface of the electronic unit or the area of the first inclined surface of the heat dissipation unit.
10. The electronic device according to claim 1, characterized in that, The heat dissipation unit is fixed inside the casing.
11. The electronic device according to claim 1, characterized in that, The heat dissipation unit is a liquid cooling plate.
12. The electronic device according to claim 1, characterized in that, The thermal interface material is thermal paste.
13. An electronic component, characterized in that, Slidably mounted within a housing, suitable for thermal coupling with a heat dissipation unit within the housing, the electronic component includes: An electronic unit includes an electronic unit body, the electronic unit body having an inclined surface that is inclined to the electronic unit body; and A thermal interface material is disposed on the inclined surface, the thermal interface material being adapted to fill a gap between the electronic component and the heat dissipation unit.
14. The electronic component according to claim 13, characterized in that, The electronic component has a boss structure that protrudes from the electronic unit body, and the inclined surface is located on the boss structure.
15. The electronic component according to claim 13, characterized in that, The slope of the inclined plane is less than 5 degrees.
16. The electronic component according to claim 13, characterized in that, The slope of the inclined plane is 3 degrees.
17. The electronic component according to claim 13, characterized in that, The thermal interface material is multiple, and the multiple thermal interface materials are disposed alternately on the inclined surface of the electronic unit.
18. The electronic component according to claim 17, characterized in that, Multiple thermal interface materials are in the form of square strips.
19. The electronic component according to claim 13, characterized in that, The thickness of the thermal interface material is greater than the distance between the heat dissipation units of the electronic component.
20. A housing assembly, characterized in that, Include: A housing comprising multiple side panels that surround an accommodating space, and an assembly opening formed by one side of each side panel communicating with the accommodating space; and A heat dissipation unit is disposed within the accommodating space and includes a heat dissipation unit body. The heat dissipation unit body has an inclined surface that slopes from the assembly port toward a direction away from the assembly port onto the heat dissipation unit body.