Chip mounter and chip mounting method

Abstract

The application discloses a patching machine and a patching method, and relates to the technical field of servers. The patching machine comprises a first transfer device, a bearing device, a second transfer device and a visual processing system. The first transfer device is used for transferring a board card to a first preset position. The bearing device comprises a plurality of bearing assemblies. At least one bearing assembly comprises a first driving device and a bearing structure. The bearing structure is used for bearing the board card. The first driving device is drivingly connected with the bearing structure to drive the bearing structure to overturn the board card. The second transfer device is used for transferring a clamp connector to a second preset position to cooperate with the board card. The visual processing system is used for collecting real-time positions of the board card and the clamp connector. A control module is electrically connected with the visual processing system, the first driving device and the second transfer device. The control module controls the running state of the first driving device and / or the second transfer device according to the image collection result of the visual processing system. The application at least solves the problem of low assembly efficiency of the clamp connector and the board card of the patching machine in the related art.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, and in particular to a chip mounter and a chip mounting method. BACKGROUND

[0002] Currently, in the field of server mainboard assembly process, the clamp connector (straddle connector) becomes the key component for solving the space conflict and signal integrity problem in high-density and modular system due to its unique connection mode. Specifically, the connection mode of the clamp connector allows a PCB (daughter card) to be directly "straddled" above the edge of the main PCB, and the ultra-short distance vertical interconnection is achieved through welding or pressure connection.

[0003] However, in the related art, the mounting suction nozzles of most chip mounters move in the X-Y plane and do not have the ability to directly grab and place the clamp connector along the Z-axis direction. Therefore, the installation process of the clamp connector mainly relies on manual insertion or specially designed offline installation fixtures, which not only has low efficiency but also leads to poor consistency of products due to human factors. SUMMARY

[0004] The present application provides a chip mounter and a chip mounting method to at least solve the problem of low assembly efficiency of the clamp connector and the board card of the chip mounter in the related art.

[0005] The present application provides a chip mounter, comprising: a first transfer device for transferring a board card to a first preset position; a carrying device comprising a plurality of sequentially arranged carrying assemblies, at least one carrying assembly comprising a first driving device and a carrying structure, the carrying structure being used for carrying the board card, and the first driving device being drivingly connected with the carrying structure to drive the carrying structure to drive the board card to flip; a second transfer device for transferring a clamp connector to a second preset position to cooperate with the board card; a vision processing system for acquiring real-time positions of the board card and the clamp connector; a control module electrically connected with the vision processing system, the first driving device, and the second transfer device, and the control module controlling the running state of the first driving device and / or the second transfer device according to the image acquisition result of the vision processing system.

[0006] Further, the carrying device further comprises: a second driving device drivingly connected with the first driving device and electrically connected with the control module; wherein when the vision processing system acquires that the board card is flipped by a preset angle or is flipped to the second preset position, the second driving device is started by the control module to drive the first driving device to drive the board card to perform lifting movement.

[0007] Further, the bearing structure comprises two guide rails arranged oppositely, each guide rail has a receiving recess, and the two receiving recesses are arranged oppositely to accommodate the board card; wherein the bearing device further comprises a suction device arranged on the guide rail and below the guide rail, and the suction device is used for suctioning the board card installed in the receiving recess.

[0008] Further, the second transfer device comprises a mechanical arm and a suction nozzle arranged on the mechanical arm, the suction nozzle is used for suctioning the clamp connector, and the suction force of the suction nozzle is adjustably arranged; a first detection device is used for detecting the pressure between the suction nozzle and the clamp connector; a second detection device is used for detecting the weight of the clamp connector; an alarm module is electrically connected with the control module; wherein the first detection device and the second detection device are electrically connected with the control module, when the detection value of the first detection device is greater than or equal to a preset pressure value, the suction force of the suction nozzle is adjusted through the control module; when the detection value of the second detection device exceeds a preset weight range value, the alarm module is controlled to send an alarm signal through the control module.

[0009] Further, the clamp connector comprises a connector body and a clamping part arranged on the connector body, the clamping part has a matching cavity for the board card to extend into; wherein the cavity wall of the matching cavity is limited and stopped after the board card extends into the matching cavity; the clamping part is one; or the clamping part is multiple, and the multiple clamping parts are arranged in the length direction and / or the width direction of the connector body.

[0010] Further, the clamping part comprises a first plate body, a second plate body and a third plate body connected in sequence, the first plate body and the third plate body are arranged oppositely to form a matching cavity with the second plate body and the third plate body; wherein the first plate body has a first guide inclined surface at one end away from the second plate body, the first guide inclined surface is used for guiding the board card extending into the matching cavity; and / or the third plate body has a second guide inclined surface at one end away from the second plate body, the second guide inclined surface is used for guiding the board card extending into the matching cavity.

[0011] Further, the chip mounter further comprises an optoelectronic module, the optoelectronic module is used for acquiring the position of the board card; the visual processing system comprises an image acquisition module, the image acquisition module is used for acquiring the image of the first mark point on the board card and acquiring the image of the second mark point on the clamp connector; a flight visual module, when the suction nozzle suctions the clamp connector and moves above the board card to prepare for mounting, the flight visual module tracks the motion trail of the clamp connector in real time, combines the image of the first mark point acquired by the image acquisition module and the position of the board card acquired by the optoelectronic module to calculate the real-time three-dimensional position relationship between the clamp connector and the board card; a real-time image background difference module, in the process of image acquisition of the image acquisition module, the real-time image background difference module is used for filtering the light changes in the environment.

[0012] The application also provides a patching method suitable for the patching machine; the patching method comprises the following steps: S1: transferring the board card to a first preset position; S2: acquiring the position of a first mark point on the board card; when it is judged that the first mark point is located at a third preset position, starting the adsorption device to adsorb the board card through the adsorption device; the first mark point is at least two; S3: starting the first driving device to drive the bearing structure to overturn the board card; when the visual processing system acquires that the board card is overturned by a preset angle or is turned to a second preset position, controlling the first driving device to stop running; starting the second transfer device to transfer the clamp connector to the board card.

[0013] Further, the method for transferring the clamp connector to the board card through the second transfer device comprises the following steps: S31: starting the suction nozzle to adsorb the clamp connector through the suction nozzle; S32: controlling the mechanical arm to transfer the suction nozzle and the clamp connector to a fourth preset position along a preset path, so that the board card is inserted into the matching cavity of the clamp connector; S33: controlling the suction nozzle to stop running to release the clamp connector.

[0014] Further, the method for transferring the clamp connector to the board card through the second transfer device further comprises a step S30 between the step S31 and the step S32: acquiring a first real-time position of the first mark point, and comparing the first real-time position with the second preset position to obtain a position offset; wherein in the step S32, the preset path is obtained from the set path and the position offset.

[0015] By applying the technical scheme of the application, the first driving device of the patching machine drives the bearing structure to overturn the board card, combined with the real-time position feedback of the visual processing system, the control module can accurately control the overturning angle and position of the bearing structure according to the collected image results, ensure the relative position between the clamp connector and the board card is accurate and error-free, and thus significantly improve the patching precision, compared with the traditional manual or semi-automatic patching method, the yield loss caused by position deviation can be greatly reduced, the signal integrity and electrical performance of the product are improved, and thus the problem of low assembly efficiency of the clamp connector and the board card of the patching machine in the related art is solved. At the same time, the first transfer device and the second transfer device can quickly and efficiently position the board card and the clamp connector to the preset position, and the overturning function of the bearing device avoids additional manual intervention, reduces the production cycle time, so that the production line can be more flexible to adapt to different types of board cards and connectors, without the need for large-scale modification of the whole machine, only the program parameters of the control module need to be adjusted, and accurate patching of various types of components can be realized, thereby enhancing the universality and adaptability of the production line. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings described in the following embodiments are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from these drawings without creative labor.

[0017] Figure 1 The schematic diagram of the three-dimensional structure of the board card of the chip mounter in the embodiment of the present application when the board card is not flipped;

[0018] Figure 2 The schematic diagram of the three-dimensional structure of the board card of the chip mounter in the embodiment of the present application when the board card is not flipped; Figure 1

[0019] Figure 3 The schematic diagram of the three-dimensional structure of the board card of the chip mounter in the embodiment of the present application when the board card is not flipped; Figure 1

[0020] Figure 4 The schematic diagram of the three-dimensional structure of the clamping plate connector of the chip mounter in the embodiment of the present application; Figure 3

[0021] The flow chart of the chip mounting method of the embodiment of the present application. Figure 5 The above drawings include the following reference signs:

[0022] 10, board card;

[0023] 20, bearing device; 21, bearing assembly; 211, bearing structure;

[0024] 30, clamping plate connector; 31, connector body; 32, clamping part; 321, first plate body; 322, second plate body; 323, third plate body; 324, matching cavity; 325, first guide inclined surface; 326, second guide inclined surface.

[0025] DETAILED DESCRIPTION The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0026]

[0027] ​​​It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, it can be the communication inside two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the ordinary skilled in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For the ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0028] In order for those skilled in the art to better understand the scheme of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0029] In order to solve the problem of low assembly efficiency of the clamp connector of the patch machine and the board card in the related technology, the present application provides a patch machine and a patching method.

[0030] As Figures 1 to 4As shown, the chip mounter comprises a first transfer device, a bearing device 20, a second transfer device, a visual processing system and a control module. The first transfer device is used to transfer the board card 10 to a first preset position. The bearing device 20 comprises a plurality of bearing assemblies 21 arranged in sequence, at least one bearing assembly 21 comprises a first driving device and a bearing structure 211, the bearing structure 211 is used to bear the board card 10, and the first driving device is drivingly connected with the bearing structure 211 to drive the bearing structure 211 to drive the board card 10 to flip. The second transfer device is used to transfer the clamp connector 30 to a second preset position to cooperate with the board card 10. The visual processing system is used to collect the real-time position of the board card 10 and the clamp connector 30. The control module is electrically connected with the visual processing system, the first driving device and the second transfer device, and the control module controls the running state of the first driving device and / or the second transfer device according to the image collection result of the visual processing system.

[0031] By applying the technical scheme of the embodiment, the bearing structure is driven by the first driving device of the chip mounter to drive the board card to flip, combined with the real-time position feedback of the visual processing system, the control module can accurately control the flipping angle and position of the bearing structure according to the collected image result, ensure the relative position between the clamp connector and the board card is accurate and error-free, and thus significantly improve the mounting precision. Compared with the traditional manual or semi-automatic mounting method, the yield caused by position deviation can be greatly reduced, the signal integrity and electrical performance of the product are improved, and thus the problem of low assembly efficiency of the clamp connector and the board card of the chip mounter in the related art is solved. At the same time, the first transfer device and the second transfer device can quickly and efficiently position the board card 10 and the clamp connector 30 to the preset position, and the flipping function of the bearing device 20 avoids additional manual intervention, reduces the production cycle time, so that the production line can more flexibly adapt to different types of board cards and connectors, without the need for large-scale modification of the whole machine, only the program parameters of the control module need to be adjusted, and accurate mounting of various types of components can be realized, thereby enhancing the universality and adaptability of the production line.

[0032] Optionally, the bearing device 20 further comprises a second driving device, which is drivingly connected with the first driving device and electrically connected with the control module. Wherein, when the visual processing system obtains that the board card 10 is flipped to a preset angle or reaches a second preset position, the second driving device is started by the control module to drive the first driving device to drive the board card 10 to perform the lifting movement. In this way, the second driving device in the bearing device 20 cooperates with the first driving device to realize the double dynamic control of flipping and lifting of the board card 10. When the visual processing system captures the flipping angle or position of the board card 10 in real time, once it is confirmed that the board card 10 has been flipped to a preset angle or reaches a second preset position, the control module activates the second driving device immediately. The second driving device then drives the first driving device to accurately control the lifting movement of the bearing structure 211, ensuring that the board card 10 can be smoothly and accurately lifted to the appropriate mounting height after accurate flipping. The above fine control mechanism effectively eliminates the backlash and deformation accumulation error in mechanical transmission, greatly improves the mounting precision and reliability of the placement machine, and has a significant positive impact on signal integrity and product yield.

[0033] In the present embodiment, by integrating flipping and lifting control, the automatic process in the placement machine is optimized. In the bearing device 20, the board card 10 is accurately flipped by the first driving device, and the second driving device is started in time according to the instruction of the control module to automatically adjust the lifting of the bearing structure 211, realizing the continuous automatic operation from flipping to lifting to mounting. The above design avoids the multiple manual transfer of the board card between different stations in the traditional process, significantly shortens the processing cycle, and improves the throughput of the production line. At the same time, the efficient connection of the automatic process also reduces the interference of human factors and reduces the potential production error rate, further improving the overall production efficiency and economic benefit.

[0034] As shown in Figure 1 and Figure 3 , the bearing structure 211 comprises two guide rails arranged oppositely, each guide rail has a receiving recess, and the two receiving recesses are arranged oppositely to accommodate the board card 10. Wherein, the bearing device 20 further comprises a suction device, which is arranged on the guide rail below the guide rail and is used for suctioning the board card 10 installed in the receiving recess. In this way, the bearing structure 211 can accurately and firmly position the board card 10 through the two oppositely arranged guide rails and their receiving recesses, ensuring the stability of the board card 10 during mounting. At the same time, the suction device arranged below the guide rail further enhances the stability of the board card. This design effectively solves the positional deviation caused by slight movement or vibration of the board card, improves the positional accuracy and stability during flipping, mounting and other actions of the placement machine on the board card 10, thereby ensuring the accurate mounting of the clamp connector, reducing the processing error caused by mechanical vibration or board card displacement, and significantly improving the consistency and reliability of the product.

[0035] In the embodiment, the integration of the suction device in the design of the bearing structure brings significant safety and adaptability improvement. For different sizes, shapes and even weights of the board card, the suction device can provide uniform downward suction force, effectively avoiding the problem of board card warping or deformation.

[0036] In the embodiment, the second transfer device includes a mechanical arm, a suction nozzle, and a first detection device. The suction nozzle is arranged on the mechanical arm and is used to suck the clamp connector 30. The suction force of the suction nozzle is adjustably set. The first detection device is used to detect the pressure between the suction nozzle and the clamp connector 30. The first detection device is electrically connected to the control module. When the detection value of the first detection device is greater than or equal to the preset pressure value, the suction force of the suction nozzle is adjusted by the control module. In this way, the second transfer device realizes dynamic adjustment of the suction force of the clamp connector 30 by being equipped with a mechanical arm, a suction nozzle, and a first detection device. The adjustable suction force of the suction nozzle, combined with the real-time monitoring of the pressure between the suction nozzle and the clamp connector by the first detection device, ensures stable suction of the connector during transportation and avoids damage or deformation of the connector caused by excessive suction force. When the pressure value detected by the first detection device exceeds the preset range, the control module adjusts the suction force of the suction nozzle in real time. This mechanism effectively solves the problem of unstable suction caused by differences in connector material or aging of the suction nozzle, significantly improving the reliability and success rate of the mounting.

[0037] Specifically, the electrical connection of the first detection device and the control module not only optimizes the suction force control during mounting, but also introduces an intelligent mechanism for actively preventing mounting defects. During the process of transporting the clamp connector to the designated position, the first detection device continuously monitors and feeds back the pressure change between the suction nozzle and the connector. Once the detected pressure value is lower than the preset threshold, it indicates the risk of insufficient suction. The control module will automatically increase the suction force of the suction nozzle to prevent the connector from falling off or deviating from the preset position before mounting, thereby avoiding common defects such as empty mounting, position deviation, or damage during subsequent mounting.

[0038] Optionally, the second transfer device further comprises a second detection device and an alarm module. The second detection device is configured to detect the weight of the clamp connector 30. The alarm module is electrically connected to the control module. The second detection device is electrically connected to the control module, and when the detection value of the second detection device exceeds the preset weight range value, the control module controls the alarm module to send an alarm signal. In this way, the second detection device is integrated into the second transfer device to detect the weight of the clamped clamp connector in real time. When the detected weight exceeds the preset normal weight range value, the control module quickly responds to activate the alarm module to send a warning signal, thereby discovering potential errors in the mounting process, such as missing clamp connectors, multiple clamp connectors sticking together, or unexpected foreign matter attached, and immediately taking measures to avoid mounting incorrect or incomplete connectors to the board card, thereby significantly improving the product quality control capability and reducing the rework rate and scrap rate.

[0039] As shown in Figure 3 The clamp connector 30 includes a connector body 31 and a clamping portion 32. The clamping portion 32 is arranged on the connector body 31, and the clamping portion 32 has a matching cavity 324 for the board card 10 to extend into. When the board card 10 extends into the matching cavity 324, it is limited and stopped by the cavity wall of the matching cavity 324. In this way, by introducing the matching cavity 324 with the limiting and stopping function in the design of the clamp connector 30, precise positioning and mechanical self-locking between the connector and the board card 10 are achieved. When the board card 10 extends into the matching cavity 324, its edge contacts the cavity wall and triggers the limiting and stopping mechanism, thereby ensuring accurate alignment between the connector and the board card.

[0040] Specifically, the matching cavity 324 and the board card 10 are in interference fit (interference amount 0.05mm±0.01mm), and when the board card 10 is completely in place, the clamping portion 32 is tightly engaged with the board card 10 to form an interference fit mechanical self-locking, preventing the clamp connector 30 from dislocation in subsequent thermal cycling or mechanical vibration, thereby ensuring long-term stable electrical contact between the clamp connector 30 and the board card 10, and significantly enhancing signal integrity and connection reliability.

[0041] Optionally, the clamping portion 32 is one; or the clamping portion 32 is multiple, and the multiple clamping portions 32 are arranged at intervals along the length direction and / or width direction of the connector body 31. In this way, the above arrangement makes the number of clamping portions 32 more flexible to meet different use requirements and working conditions, and also improves the processing flexibility of the workers.

[0042] As shown in Figure 4As shown, the clamping portion 32 comprises a first plate body 321, a second plate body 322 and a third plate body 323 connected in sequence, the first plate body 321 is arranged opposite to the third plate body 323 to form a fitting cavity 324 with the second plate body 322 and the third plate body 323; wherein the first plate body 321 has a first guide inclined surface 325 at one end away from the second plate body 322, the first guide inclined surface 325 is used for guiding the board card 10 inserted into the fitting cavity 324; and / or the third plate body 323 has a second guide inclined surface 326 at one end away from the second plate body 322, the second guide inclined surface 326 is used for guiding the board card 10 inserted into the fitting cavity 324. In this way, the above arrangement makes the structure of the clamping portion 32 more simple, easy to process and realize, and reduces the processing cost and difficulty of the clamping portion 32. At the same time, when the board card 10 is inserted into the fitting cavity 324, the first guide inclined surface 325 and / or the second guide inclined surface 326 can guide the board card 10 to be inserted smoothly along the correct trajectory, even if there is a slight deviation in the initial position, the guide inclined surface can automatically correct these deviations, ensuring the accurate butt joint of the board card and the connector.

[0043] In the embodiment, the clamping portion 32 comprises a first plate body 321, a second plate body 322 and a third plate body 323 connected in sequence, the first plate body 321 is arranged opposite to the third plate body 323 to form a fitting cavity 324 with the second plate body 322 and the third plate body 323; wherein the first plate body 321 has a first guide inclined surface 325 at one end away from the second plate body 322, the first guide inclined surface 325 is used for guiding the board card 10 inserted into the fitting cavity 324, the third plate body 323 has a second guide inclined surface 326 at one end away from the second plate body 322, the second guide inclined surface 326 is used for guiding the board card 10 inserted into the fitting cavity 324.

[0044] In the embodiment, the patch machine further comprises an optoelectronic module for acquiring the position of the board card 10; the patch machine further comprises a visual processing system comprising an image acquisition module, a flight vision module and a real-time image background difference module. The image acquisition module is used to acquire the image of the first mark point on the board card 10 and the image of the second mark point on the clamp connector 30. When the suction nozzle moves to the position above the board card 10 to prepare for the installation of the clamp connector 30, the flight vision module tracks the movement trajectory of the clamp connector 30 in real time, and combines the image of the first mark point acquired by the image acquisition module and the position of the board card 10 acquired by the optoelectronic module to calculate the real-time three-dimensional positional relationship between the clamp connector 30 and the board card 10. During the image acquisition process of the image acquisition module, the real-time image background difference module is used to filter the light changes in the environment. In this way, the above-mentioned settings enable the patch machine to realize full-range, high-precision and dynamic monitoring and control during the process of grabbing and installing the clamp connector 30, greatly improving the installation speed and quality, and providing key technical support for realizing high-precision automatic installation of the clamp connector 30. Through the integration of image acquisition, flight vision and real-time image background difference, the positional error during the installation process of the clamp connector 30 can be effectively avoided, the installation yield can be improved, and the continuity and efficiency of the installation process can be ensured.

[0045] In the embodiment, when the suction nozzle carrying the clamp connector 30 moves to the position above the installation target board to prepare, the position of the first mark point on the board card 10 is first accurately positioned, and simultaneously or subsequently, the image acquisition module accurately identifies the position of the second mark point on the clamp connector 30. The visual processing system calculates the offset (ΔX, ΔY, Δθ) of the actual position / angle of the clamp connector 30 relative to the suction nozzle and the target position / angle (based on the first mark point of the board card 10 and the set installation coordinates) in real time. In this way, the above-mentioned calculation fuses the compensation amount after the coordinate transformation of the board card 10. In the case that the board card 10 is in a non-standard (rotated by 90°) state, the dynamic positions of the board card 10 and the second mark point on the clamp connector 30 are accurately positioned, and the spatial coordinate alignment is quickly completed through a special algorithm, which lays a foundation for accurate placement.

[0046] In the embodiment, the control module drives the suction nozzle accurately according to the vision-calculated ΔX, ΔY, Δθ offset, and makes fine position and angle adjustment before or during the Z-axis descent of the suction nozzle, to compensate for the aforementioned offset. The suction nozzle carrying the clamping plate connector descends accurately along the Z-axis to a predetermined height (the height value is programmed and set in combination with the height of the clamping plate connector, the thickness of the PCB, and the sinking depth). When the pins / clamping portions of the clamping plate connector contact the pads / positioning holes of the board card, the vacuum suction force is weakened or accurately released. Among them, the control strategy can pre-release part of the vacuum before the bottom of the clamping plate connector contacts the board surface to reduce the impact, or automatically release when the contact instantaneously senses the pressure change. The suction nozzle continuously applies a preset and programmable downward pressure. Through the optimized guide slope design, the clamping plate connector is guided to slide accurately to the predetermined position. When the downward pressure makes the clamping plate connector fully in place, the clamping portions are tightly buckled with the edge of the board card, achieving an interference fit (interference amount 0.05mm±0.01mm), and completing mechanical self-locking.

[0047] Specifically, the vision processing system searches for a pre-trained template pattern of the marker point at a high speed, accurately extracts the center of the marker point, calculates the coordinates (Uc, Vc) of each recognized marker point in the camera coordinate system, converts the positions (Uci, Vci) of the multiple (at least 2) marker points in the camera coordinate system in the previous frame into actual positions (Xi, Yi) in the rotation center coordinate system based on the pre-calibrated camera internal parameters and the camera and rotation center external parameters, and compares with the position at the previous moment (before rotation) or the ideal theoretical position to obtain the displacement deviation (ΔX, ΔY) and the rotation angle deviation Δθ of the board card at the current position.

[0048] Optionally, the optoelectronic module is a high-brightness infrared LED. The wavelength of the high-brightness infrared LED is 850nm or 940nm, has good penetration, is resistant to environmental visible light interference (SMT workshop environment light is complex), and is suitable for aligning the marker point.

[0049] Optionally, the field of view angle of the vision processing system is focused on the edge key area (including the first marker point area) of the board card.

[0050] In the embodiment, the real-time image background difference module performs real-time image background difference, noise reduction, contrast enhancement (such as adaptive histogram equalization), and edge sharpening.

[0051] As shown in Figure 5 The application also provides a patching method, which is suitable for the patching machine described above; the patching method comprises the following steps:

[0052] Step S1: transferring the board card 10 to a first preset position;

[0053] Step S2: Obtain the position of the first mark point on the board card 10, and start the adsorption device to adsorb the board card 10 through the adsorption device when it is judged that the first mark point is located at the third preset position; the first mark point is at least two;

[0054] Step S3: Start the first driving device to drive the bearing structure 211 to overturn the board card 10, and control the first driving device to stop running when the visual processing system obtains that the board card 10 overturns a preset angle or overturns to a second preset position; start the second transfer device to transfer the clamp connector 30 to the board card 10 through the second transfer device.

[0055] Specifically, the above steps S1 to S3 realize the highly automated and accurate alignment and mounting between the board card 10 and the clamp connector 30. In step S2, the accurate detection and judgment of the first mark point ensure that the board card 10 has reached the preset correct position (the third preset position) before starting to be adsorbed, which is the premise of ensuring the mounting accuracy. In this way, through the positioning of at least two mark points, a more stable coordinate reference can be constructed, so as to effectively correct any potential position deviation in the subsequent overturning process, and ensure the positioning accuracy of the board card 10 after overturning. At the same time, the whole mounting method designs a continuous automatic process from transfer, alignment to mounting, reduces the link of manual intervention, eliminates the dependence on special tooling or manual skills in the traditional process, that is, through automatic control, not only the mounting speed is improved, but also the consistency and reliability of each mounting are guaranteed, and the production efficiency is greatly improved. In addition, due to the automatic alignment and mounting mechanism in steps S2 and S3, the position accuracy of the board card 10 in the mounting process is significantly improved, further reducing the connector failure rate caused by position deviation, and optimizing the product quality.

[0056] In the embodiment, after the board card 10 is initially stopped and positioned, the visual recognition and coordinate recording are completed, and the stable state is entered, all initial position information is determined (calibration value). The control module sends instructions to the bearing device through a preset path, such as rotating to an angle A at an angular velocity W. During the whole process of rotation starting, accelerating, uniform speed, decelerating and braking, the visual processing system continuously takes high-speed photos and real-time attention is paid to the position of the preset key area. The difference between the actual mark point position detected by the visual processing system and the target position is the compensation amount in the stable state at this moment. Among them, the control module receives the measured deviation information (ΔX 实 ,ΔY 实 ,Δθ 实 ) of the photoelectric module and the position information of the self-encoder of the first driving device in real time. The control module generates a high dynamic response compensation control amount (such as an angle correction amount Δφ or a waiting, positioning and static stabilization time). The compensation instruction is superimposed into the original rotation instruction queue in real time, and the first driving device adjusts the rotation angle in a small way.

[0057] In the embodiment, the method of transferring the board connector 30 to the board card 10 by the second transferring device includes:

[0058] Step S31: start the suction nozzle to adsorb the board connector 30 by the suction nozzle;

[0059] Step S32: control the mechanical arm to transfer the suction nozzle and the board connector 30 to the fourth preset position according to the preset path, so that the board card 10 extends into the matching cavity 324 of the board connector 30;

[0060] Step S33: control the suction nozzle to stop running to release the board connector 30.

[0061] Specifically, the process of matching the board connector 30 with the board card 10 by the second transferring device, i.e. steps S31 to S33, demonstrates the high precision and control ability of the automated mounting technology. After starting the suction nozzle to adsorb the board connector 30 (step S31), the mechanical arm moves accurately according to the preset path (step S32), which takes into account the optimal angle and route of the board card 10 extending into the matching cavity 324, while avoiding interference with other components of the chip mounter, ensuring the safety and efficiency of the mounting process. The coordinated work of the visual processing system and the mechanical arm ensures that the position and orientation of the connector during the movement are aligned with the board card, realizing seamless connection between the two in the mounting process, greatly improving the precision and success rate of mounting, and reducing the rate of defective products.

[0062] In the embodiment, the automated operation process (steps S31 to S33) of the second transferring device simplifies the complex steps of manually handling the board connector, and changes the originally tedious manual alignment and placement into a fast and reliable machine control process. After adsorption and transfer are completed, the suction nozzle is controlled to stop running (step S33) to achieve precise release of the board connector 30. The automation of this step ensures that the connector can be stably positioned at the correct position of the board card 10 without the need for manual secondary calibration, improving the continuity and efficiency of mounting. Compared with traditional manual or special tooling solutions, this method greatly shortens the mounting cycle and reduces production costs, while reducing the possibility of human error by reducing manual operations, further improving the overall productivity and product quality of the production line.

[0063] In the embodiment, the method of transferring the board connector 30 to the board card 10 by the second transferring device further includes a step S30 between step S31 and step S32:

[0064] obtain the first real-time position of the first marker point, and compare the first real-time position with the second preset position to obtain a position offset; wherein in step S32, the preset path is obtained from the set path and the position offset.

[0065] Specifically, in the process of transferring the clamp connector 30 to the board card 10, the first real-time position of the first mark point is obtained, and compared with the second preset position, so as to calculate the position offset. The above real-time position monitoring and error analysis ensures that any potential position deviation can be quickly responded before mounting. In step S32, the preset path is no longer based on the initial setting, but is dynamically adjusted in combination with the current position offset, so as to realize accurate correction of the mechanical arm path, and ensure that the clamp connector 30 can be docked with the mating cavity 324 of the board card 10 in the best path and posture. In this way, the above path adjustment mechanism based on real-time error feedback greatly improves the accuracy of the mounting process, reduces the defective rate caused by position deviation, and optimizes the electrical performance and mechanical stability of the product.

[0066] From the above description, it can be seen that the above-mentioned embodiments of the present application achieve the following technical effects:

[0067] The first driving device of the chip mounter drives the bearing structure to flip the board card, and the real-time position feedback of the vision processing system. The control module can accurately control the flipping angle and position of the bearing structure according to the collected image results, ensure the relative position between the clamp connector and the board card is accurate and error-free, and significantly improve the mounting accuracy. Compared with the traditional manual or semi-automatic mounting method, the defective rate caused by position deviation can be greatly reduced, the signal integrity and electrical performance of the product can be improved, and the problem of low assembly efficiency of the clamp connector and the board card of the chip mounter in the related art is solved. At the same time, the first transfer device and the second transfer device can quickly and efficiently position the board card and the clamp connector to the preset position, and the flipping function of the bearing device avoids additional manual intervention, reduces the production cycle time, so that the production line can be more flexible to adapt to different types of board cards and connectors, without the need for large-scale modification of the whole machine. Only by adjusting the program parameters of the control module, the accurate mounting of various types of components can be realized, and the universality and adaptability of the production line are enhanced.

[0068] The principles and implementation modes of the present application are described by applying specific examples in this paper, and the above examples are only used to help understand the method and its core idea. It should be noted that for ordinary skilled persons in the technical field, without departing from the principles of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A chip mounter characterized by comprising: The application relates to a board card and clamp plate connector automatic matching device. The device comprises: a first transfer device for transferring a board card (10) to a first preset position; a bearing device (20) comprising a plurality of bearing assemblies (21) arranged in sequence, at least one of the bearing assemblies (21) comprising a first driving device and a bearing structure (211) for bearing the board card (10), the first driving device being drivingly connected with the bearing structure (211) to drive the bearing structure (211) to rotate the board card (10); a second transfer device for transferring a clamp plate connector (30) to a second preset position to cooperate with the board card (10); a visual processing system for collecting real-time positions of the board card (10) and the clamp plate connector (30); a control module electrically connected with the visual processing system, the first driving device and the second transfer device, the control module controlling an operating state of the first driving device and / or the second transfer device according to an image collection result of the visual processing system; the bearing device (20) further comprises: a second driving device drivingly connected with the first driving device and electrically connected with the control module; 2. The patcher of claim 1, wherein, wherein when the visual processing system obtains that the board card (10) is rotated by a preset angle or is rotated to a second preset position, the second driving device is started by the control module to drive the first driving device to perform lifting movement. the bearing structure (211) comprises: two oppositely arranged guide rails, each of the guide rails having a receiving recess, and the two receiving recesses being oppositely arranged to accommodate the board card (10); wherein the bearing device (20) further comprises:

3. The patcher of claim 1, wherein, a suction device arranged on and below the guide rail, the suction device being used for suctioning the board card (10) installed in the receiving recess. the second transfer device comprises: a mechanical arm; a suction nozzle arranged on the mechanical arm, the suction nozzle being used for suctioning the clamp plate connector (30), and the suction force of the suction nozzle being adjustably arranged; a first detection device for detecting a pressure between the suction nozzle and the clamp plate connector (30); a second detection device for detecting a weight of the clamp plate connector (30); an alarm module electrically connected with the control module; 4. The patcher of claim 1, wherein, wherein the first detection device and the second detection device are both electrically connected with the control module, the suction force of the suction nozzle is adjusted by the control module when a detection value of the first detection device is greater than or equal to a preset pressure value, and the alarm module is controlled by the control module to send an alarm signal when a detection value of the second detection device exceeds a preset weight range value. the clamp plate connector (30) comprises: a connector body (31); A clamping portion (32) is arranged on the connector body (31), and the clamping portion (32) has a matching cavity (324) for the board card (10) to extend into; wherein, after the board card (10) extends into the matching cavity (324), the cavity wall of the matching cavity (324) limits and stops; the clamping portion (32) is one; or, the clamping portion (32) is multiple, and multiple clamping portions (32) are arranged along the length direction and / or width direction of the connector body (31).

5. The patcher of claim 4, wherein, The clamping portion (32) comprises a first plate body (321), a second plate body (322) and a third plate body (323) connected in sequence, the first plate body (321) is arranged opposite to the third plate body (323) to form the matching cavity (324) with the second plate body (322) and the third plate body (323); wherein, one end of the first plate body (321) away from the second plate body (322) has a first guide inclined surface (325) for guiding the board card (10) extending into the matching cavity (324); and / or, one end of the third plate body (323) away from the second plate body (322) has a second guide inclined surface (326) for guiding the board card (10) extending into the matching cavity (324).

6. The patcher of claim 3, wherein, The patch machine further comprises an optoelectronic module for acquiring the position of the board card (10); The visual processing system comprises: An image acquisition module for acquiring images of first mark points on the board card (10) and acquiring images of second mark points on the clamp connector (30); A flight vision module, when the suction nozzle moves to above the board card (10) to prepare for patching after the suction nozzle adsorbs the clamp connector (30), the flight vision module tracks the motion trail of the clamp connector (30) in real time, combines the images of the first mark points acquired by the image acquisition module and the position of the board card (10) acquired by the optoelectronic module to calculate the real-time three-dimensional positional relationship between the clamp connector (30) and the board card (10); A real-time image background difference module, during the image acquisition process of the image acquisition module, the real-time image background difference module is used for filtering light changes in the environment.

7. A patching method characterized by, The patching method is suitable for the patch machine of any one of claims 1 to 6; the patching method comprises: Step S1: transferring the board card (10) to a first preset position; Step S2: acquiring the positions of first mark points on the board card (10), and starting the adsorption device to adsorb the board card (10) by the adsorption device when it is judged that the first mark points are located at a third preset position; the first mark points are at least two. Step S3: start the first driving device to drive the bearing structure (211) to flip the board card (10), and when the visual processing system obtains that the board card (10) is flipped by a preset angle or is flipped to a second preset position, stop the first driving device; start the second transfer device to transfer the clamp connector (30) to the board card (10) through the second transfer device.

8. The patch method of claim 7, wherein, The method for transferring the clamp connector (30) to the board card (10) through the second transfer device comprises: Step S31: start the suction nozzle to adsorb the clamp connector (30) through the suction nozzle; Step S32: control the mechanical arm to transfer the suction nozzle and the clamp connector (30) to a fourth preset position according to a preset path, so that the board card (10) extends into the matching cavity (324) of the clamp connector (30); Step S33: control the suction nozzle to stop running to release the clamp connector (30).

9. The patch method of claim 8, wherein, The method for transferring the clamp connector (30) to the board card (10) through the second transfer device further comprises a step S30 between the step S31 and the step S32: Obtain a first real-time position of the first mark point, and compare the first real-time position with the second preset position to obtain a position offset; In the step S32, the preset path is obtained from the set path and the position offset.

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