Sensor device and method for producing plurality of sensor devices
By using a combination of piezoresistive silicon MEMS elements and support elements, the problem of bending deformation of sensor devices in harsh environments was solved, achieving miniaturization and high-precision measurement, and extending service life.
Patent Information
- Application Number
- CN202480025627.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-04-20
- Filing Date
- 2024-03-22
- Publication Date
- 2025-11-11
AI Technical Summary
Existing sensor devices are prone to bending and deformation under high pressure, high temperature and extremely low temperature environments, which leads to inaccurate measurements and shortens service life. In addition, existing materials are not compact enough.
Piezoresistive silicon MEMS elements are used as pressure sensors. The design combines support elements and upper housing elements. The support elements are placed in the middle area of the circuit carrier to reduce bending moment. The connection design between the upper and lower housing elements is used to export force to avoid bending deformation.
This technology enables miniaturization of sensor devices, improves measurement accuracy, and extends service life, while reducing material usage and ensuring stable measurements in harsh environments.
Smart Images
Figure CN120936855A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a sensor device having a pressure sensor element, and a method for manufacturing a plurality of sensor devices. Background Technology
[0002] In numerous applications in industrial and automotive technologies, such as thermal engines, filters, cooling circuits, and air conditioning systems, the pressure and temperature of fluids need to be measured simultaneously and in a location-dependent manner. The sensor devices used for this purpose may withstand high pressure loads, such as up to 100 bar, high temperatures, such as up to 180°C, and extremely low temperatures, down to -40°C. Summary of the Invention
[0003] The object of this invention is to provide an advantageous sensor device.
[0004] The objective is achieved by the sensor device according to claim 1. The dependent claims relate to preferred embodiments of the sensor device.
[0005] A sensor device is proposed, comprising a core component and an upper housing component. The core component includes a pressure sensor element, a circuit carrier, and a support element. The upper housing component surrounds the core component and rests against the upper side of the support element. The circuit carrier has a central region and an edge region surrounding the central region. The support element is disposed in the central region of the circuit carrier and on the upper side of the circuit carrier.
[0006] The edge region of the circuit carrier may not have a support element. The support element may, in particular, have a stop surface that abuts against the stop surface of the upper housing element. Forces applied to the core component are transmitted to the upper housing element via the stop surface of the support element.
[0007] The outer circumference of the support element can extend along the boundary between the edge region and the middle region of the circuit carrier.
[0008] By placing the support element in the central region of the circuit carrier, the force transmission from the core component to the upper housing component can be designed to minimize the bending moment experienced by the core component. To this end, forces can be transmitted via a centrally located central region on the circuit carrier, which is designed to be sufficiently large to prevent dome-shaped deformation of the circuit carrier.
[0009] In this manner, bending loads in the core component can be minimized. Reducing bending loads enables improved miniaturization of the sensor device and increased measurement accuracy. It also allows for a compact sensor device design and low material usage.
[0010] The upper housing element can be part of the housing of the sensor device. In particular, the upper housing element and the lower housing element can form the housing of the sensor device, and the upper housing element can be connected to the lower housing element. Here, the pressure of the fluid measured by the pressure sensor element can be transmitted to the pressure sensor element via the lower housing element.
[0011] Each distance between the support element and the edge point of the circuit carrier can be at least 5%, preferably at least 10%, or at least 20% of the length of a straight line connecting the edge point to the opposite edge point of the circuit carrier and extending through the midpoint of the circuit carrier. By thus positioning the support element in the central region of the circuit carrier, it is ensured that the force applied to the core component by the fluid is transmitted from a region of the core component sufficiently far from its edge. This prevents bending moments in the plate or circuit carrier due to forces applied to the edges.
[0012] The outer circumference of the support element can extend along the boundary between the central and edge regions of the circuit carrier. The central region can occupy at least 10% of the area of the circuit carrier, preferably at least 25%. This ensures that the support element is large enough to transmit forces to the upper housing element in a planar manner rather than at approximately a point. This also avoids force peaks that could lead to inaccurate measurements and shorten the component's lifespan.
[0013] The central region may occupy no more than 80% of the area of the circuit carrier, preferably less than 60%. This ensures that the force is applied sufficiently far from the edge of the circuit carrier to prevent bending of the circuit carrier.
[0014] The support element may have a frame surrounding an inner region where the pressure sensor element is disposed. Because the support element is positioned above the circuit carrier, forces are not transmitted from the circuit carrier itself or the pressure sensor element to the upper housing element. Instead, the support element is used for this purpose. The support element has a purely mechanical function, protecting the measuring element, the circuit carrier, and the pressure sensor element from peak forces.
[0015] The design ensures that forces are transmitted to the upper housing components not in a point-to-point manner but in a surface-to-surface manner, thus preventing point-like deformation of the core components.
[0016] The support element may have a crossbeam extending through the interior region. Alternatively or additionally, the support element may have at least one protrusion extending into the interior region. The stop surface of the support element may be formed by the upper sides of the frame, the crossbeam, and at least one protrusion. Thus, the crossbeam and at least one protrusion also facilitate force transmission to the upper housing element and additionally distribute the force over a larger area, thereby avoiding the generation of mechanical stress peaks and overloading of the materials used.
[0017] The sensor device may have a lower housing element that forms a media connection channel designed to deliver fluid to the underside of the core component. In particular, the sensor device may be designed to conduct fluid to a pressure sensor element, enabling the pressure sensor element to determine the fluid pressure.
[0018] The axial direction can be defined as the direction along the media connection channel toward the core component. The lower housing element may extend beyond the core component in the axial direction. The lower housing element may have a rolled edge that surrounds the lower end of the upper housing element in the axial direction. Here, the lower and upper housing elements can be designed such that the force transmitted from the core component to the stop surface of the upper housing element is released from the upper housing element to the rolled edge of the lower housing element. In this way, the force can be discharged from the core component, and bending moments in the core component can be avoided. The core component may be designed to transmit force to the upper housing element via a support element, wherein the upper housing element is designed to discharge the force received by the core component to the rolled edge of the media delivery section. For this purpose, the upper housing element is designed to be sufficiently rigid.
[0019] The upper housing components can be directly attached to the rolled edge. The rolled edge can be sealed with potting compound.
[0020] Pressure sensor elements can be piezoresistive silicon MEMS elements. Compared to other pressure sensor elements, such as ceramic pressure sensor elements, piezoresistive silicon MEMS elements are characterized by a smaller configuration and a more favorable price. By using piezoresistive silicon MEMS elements, the effective area on which the fluid acts on the pressure sensor element can be designed to be very small, and the force acting on the core component can be kept small. This can further help reduce the required structural space and weight of the sensor device.
[0021] Piezoresistive silicon MEMS elements can be sensitive in a pressure range of 50 mbar to 50 bar. Piezoresistive silicon MEMS elements can provide output signals up to 120 mV. Therefore, compared to capacitive pressure sensors, piezoresistive silicon MEMS elements can cover a wider measurement range and produce a stronger output signal that is less sensitive to interference.
[0022] Piezoresistive silicon MEMS elements can be used for both absolute and relative pressure measurements. These piezoresistive silicon MEMS elements can be used in a temperature range between -40°C and +180°C.
[0023] The sensor device may also include a temperature sensor element. The temperature sensor element may be an NTC thermistor. The temperature sensor element may be mounted on the circuit carrier of the core component.
[0024] The core component may have a plate disposed on the underside of the circuit carrier, wherein a pressure sensor element is fastened to the upper side of the plate, and the plate has a channel in which the pressure sensor element is disposed at an end. Fluid can be guided through the plate to the pressure sensor element via the channel. The plate can seal the media connection channel formed by the lower housing element relative to the circuit carrier. The plate may be made of a media-resistant material, such as steel, ceramic, glass, or plastic, or be composed of one of these materials.
[0025] The temperature sensor element may have two connecting wires, each extending through a through-hole in a plate, wherein the through-hole in the plate is sealed by a potting material. The upper housing element may have at least one contact element electrically connected to a circuit carrier.
[0026] On the other hand, a method is provided for manufacturing multiple sensor devices as described above, wherein the core components are manufactured and calibrated in batch assembly (Nutzenverband). Attached Figure Description
[0027] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings.
[0028] Figure 1 An exploded view of a sensor device used to measure pressure and temperature is shown.
[0029] Figure 2 The upper side of the core component is shown.
[0030] Figure 3 The lower side of the core component is shown.
[0031] Figure 4 The circuit carrier is shown.
[0032] Figure 5 A cross-sectional view of the upper housing element is shown.
[0033] Figure 6 A cross-sectional view of the lower housing component is shown.
[0034] Figure 7 The force lines in the sensor device are shown. Detailed Implementation
[0035] Figure 1 An exploded view shows a sensor device used to measure pressure and temperature.
[0036] The sensor device has a core component 100, an upper housing component 200, and a lower housing component 300.
[0037] The core component 100 includes a pressure sensor element 104 designed to determine the absolute or relative pressure of a fluid, i.e., a liquid or gas. The pressure sensor element 104 is designed to convert the pressure applied thereto into an electrical signal from which the pressure level can be determined. Medium loading occurs on the back side of the pressure sensor element 104 facing the medium connection channel. The pressure sensor element 104 may have a curved plate, the area and thickness of which are selected based on the desired measurement range. The pressure sensor element 104 is a piezoresistive silicon MEMS element.
[0038] In the embodiment shown in the figure, the core component 100 additionally includes a temperature sensor element 105 designed to determine the temperature of the fluid. In an alternative embodiment, the core component does not have a temperature sensor element 105. Furthermore, the core component has a circuit carrier 102 that contacts the sensor elements 104, 105.
[0039] Temperature sensor element 105 is designed to generate an electrical signal whose magnitude is related to the temperature of the fluid. Temperature sensor element 105 may be an NTC thermistor. Temperature sensor element 105 may extend into the measuring medium to detect its temperature with the least possible distortion and to ensure the shortest possible response time.
[0040] The lower housing element 300 forms a medium connection channel through which the pressure and temperature of the fluid to be measured can be delivered to the sensor elements 104 and 105 of the core component 100.
[0041] The upper housing element 200 is connected to and surrounds the core component 100, and protects it from environmental influences in such a manner that the lower side of the core component is not covered by the upper housing element 200. The sensor device is designed such that the force applied to the core component 100 by the fluid can be transmitted to the lower housing element 300 via the upper housing element 200.
[0042] The axial direction A is defined as extending along the medium connection channel and pointing from the lower side 110 of the core component 100 to the upper side 111 of the core component 100. Element pointing in the opposite direction to the direction in which fluid is delivered to the core component 100 will be referred to as "below along axial direction A". Element pointing in the direction in which fluid is guided to the core component 100 will be referred to as "above along axial direction A".
[0043] The core component 100 is described below. Figure 2 The upper side 111 of the core component 100 is shown. Figure 3 The lower side 110 of the core component 100 is shown. Figure 4 The circuit carrier 102 of the core component 100 is shown.
[0044] The core component 100 includes a pressure sensor element 104, a temperature sensor element 105, a circuit carrier 102, a support element 103, and a plate 101.
[0045] The upper side 102a of the circuit carrier 102 faces away from the dielectric connection channel of the lower housing element 300. The lower side 102b of the circuit carrier 102 faces the dielectric connection channel of the lower housing element 300.
[0046] A support element 103 and at least one electronic device 106 are provided on the upper side 102a of the circuit carrier 102. The circuit carrier 102 has a recess 107 in which a pressure sensor element 104 is disposed. The recess 107 is an opening extending through the circuit carrier in the axial direction A, and the opening is large enough to accommodate the pressure sensor element 104. The pressure sensor element 104 is connected to the circuit carrier 102 via a bonding wire. The bonding wire crosses the recess 107 here.
[0047] The support element 103 has a frame 103a that surrounds the opening 107 of the pressure sensor element 104 and the circuit carrier 102. The support element 103 also has a crossbeam 103b that divides the internal region surrounded by the frame 103a into two chambers. The support element 103 has two protrusions 103c extending into the internal region.
[0048] A pressure sensor element 104 is disposed in the first of two chambers formed by the frame 103a and the crossbeam 103b. The chamber in which the pressure sensor element 104 is disposed may be filled by a passivation portion, which may cover the pressure sensor element 104.
[0049] The support element 103 protrudes upward from the circuit support member 102 in the axial direction and forms a stop surface. The upper housing element 200 abuts against the stop surface, and force is transmitted to the upper housing element 200 via the stop surface. Here, the upper side of the frame 103a, the upper side of the crossbeam 103b, and the upper side of the protrusion 103c extending into the internal region abut against the upper housing element 200.
[0050] An electrical contact portion 108 of a temperature sensor element 105 is provided in the second chamber of the two chambers formed by the frame 103a and the crossbeam 103b.
[0051] Electronic components 106 mounted on circuit carrier 102 form control and evaluation electronics, which are connected to pressure sensor element 104 and temperature sensor element 105. Circuit carrier 102 has a circuit board material, such as FR4.
[0052] A plate 101 is provided on the lower side 102b of the circuit carrier 102. The plate is made of a media-resistant material, such as ceramic, steel, glass, or plastic. The plate 101 is configured such that it seals the media connection channel formed by the lower housing element 300 relative to the circuit carrier 102. The plate 101 has a channel 109 through which fluid can travel from the media connection channel to the pressure sensor element 104. The pressure sensor element 104 is provided on the side of the channel 109 opposite to the media connection channel.
[0053] Board 101 has a pass-through portion 112 for the connection wire of temperature sensor element 105. If the connection wire is disposed in the pass-through portion 112, the pass-through portion 112 is sealed by potting material in the manner described above. Other electronic components 106, which are components of the control and evaluation electronic devices, may be disposed on the lower side 102b of circuit carrier 102.
[0054] The circuit carrier 102 enables mechanical and electrical connections between the electronic device 106 and the sensor elements 104 and 105. Furthermore, the circuit carrier 102 is electrically and mechanically connected to the contact element 202 disposed in the upper housing element 200.
[0055] The support element 103 and the plate 101 can be connected to the circuit carrier 102 via adhesive, respectively.
[0056] Figure 4 The circuit carrier 102 is shown, with a central region 113 and an edge region 114 marked. A support element 103 is disposed only in the central region 113. The support element is not disposed in the edge region 114. The edge region 114 surrounds the central region 113.
[0057] The intermediate region 113 includes the geometric midpoint of the circuit carrier. The intermediate region 113 includes at least 10% of the area of the circuit carrier 102, preferably at least 25% of the area of the circuit carrier 102. The outer contour of the intermediate region 113 is defined by a frame 103a formed by the support element 103, wherein the outer edge of the frame 103a forms the boundary between the intermediate region 113 and the edge region 114.
[0058] The distance AA between the support element 103 and each edge point P1 of the circuit carrier 102 is at least 5% of the length L of the following straight line, preferably 10% or 20%, which connects edge point P1 to the opposite edge point P2 of the circuit carrier 102 and extends through the midpoint MP of the circuit carrier 102. The length of this straight line gives the diameter of the circuit carrier 102. This described arrangement allows the support element 103 to be centrally positioned on the circuit carrier 102 with a sufficiently large distance from the edge of the circuit carrier 102.
[0059] The force applied to the core component 100 by the fluid is transmitted to the upper housing component 200 via the support element 103. By positioning the support element 103 in the intermediate region 113 of the circuit carrier 102, the bending moment applied to the core component 100 by the force is minimized. The force is transmitted through the support element 103, through the intermediate region 113, and thus also through the midpoint of the core component 100, to the upper housing component 200. Because force is transmitted using the intermediate region 113, bending of the core component 100 can be avoided, which could occur if the force were transmitted through the edge region 114.
[0060] Since the intermediate region 113 comprises at least 10%, preferably 25%, of the area of the circuit carrier 102 and is defined by the frame 103a, it is ensured that forces are transmitted via a sufficiently large area, rather than, for example, in a near-point manner, thus avoiding single force peaks in the core component 100 that would otherwise lead to inaccurate measurements and / or reduced long-term stability.
[0061] The upper housing element 200 is described below. Figure 5 A cross-sectional view of the upper housing element 200 is shown.
[0062] The upper housing element 200 has a plastic element 201 and a contact element 202. The plastic element 201 extends substantially along the axial direction A. In its lower region, the plastic element 201 has a flange 203, which is a region with a larger cross-section compared to other regions of the upper housing element 200.
[0063] The flange 203 of the upper housing element 200 has sufficient rigidity to redirect the force in the axial direction A to the crease 301 of the lower housing element 300 that abuts against the flange 203 in the axial direction.
[0064] Flange 203 is designed to surround core component 100 and extend downward beyond core component 100 in the axial direction A. A stop surface 204 is formed inside flange 203, at which support element 104 of core component 100 abuts. Force is transmitted from support element 104 to upper housing element 200 via stop surface 204. Upper housing element 200 is designed to discharge the force to the rolled edge 301 of lower housing element 300.
[0065] Furthermore, the upper housing element has a contact element 202 that is electrically connected to the circuit carrier 102. The contact element 202 enables electrical contact between the circuit carrier 102 and external electronic devices. The contact element 202 is implemented as a metallic, resilient contact pin. The contact element is designed to insert into the contact terminals of the circuit carrier 102 and to position the core component 100 during installation in the aforementioned manner.
[0066] Each contact element 202 has two bends, wherein the contact elements 202 extend parallel to each other at a small spacing in the upper region of the upper housing element 200 along the axial direction A, and are arranged at a larger distance from each other in the flange 203 of the upper housing element 200. These two bends provide elasticity to the contact elements 202. The plastic part 201 has a guide element that defines the orientation of the contact elements 202 and has a clearance, such that the elasticity of the contact elements 202 can be achieved in this manner. This allows for the compensation of manufacturing tolerances.
[0067] A potting compound 206 is applied to the outer 205 of the flange 203, where it abuts against the rolled edge 301 of the lower housing element 300, thereby connecting and sealing the upper housing element 200 and the lower housing element 300 together. The potting compound 206 seals the interiors of the upper housing element 200 and the lower housing element 300 relative to environmental influences. Furthermore, the potting compound 206 ensures the mechanical stability of the connection between the housing elements 200 and 300. The potting compound 206 may contain a sealant that compensates for the difference in the coefficients of thermal expansion between the upper and lower housing elements 200 and 300. In this manner, the generation of mechanical stress can be reduced or avoided, thereby ensuring a long-term stable seal at the connection between the rolled edge and the flange.
[0068] Figure 6 A cross-sectional view of the lower housing element 300 is shown.
[0069] The lower housing element 300 is designed to connect with the upper housing element 200. The lower housing element 300 has a first sealing ring 302 located inside, and may also have a second sealing ring 303 located outside the lower housing element. The lower housing element may also have a sleeve-shaped protective element 304.
[0070] The lower housing element 300 has an upper region with a large cross-section, which is designed to surround the core component 100 and also the flange 203 of the upper housing element 200. Here, the upper region has an inwardly pointing rolled edge 301 at its upper end. The rolled edge is attached either directly or via potting compound 206 to the outside 205 of the flange 203 of the upper housing element 200.
[0071] The inner first sealing ring 302 seals the medium connection channel relative to the plate 101. The inner sealing ring 302, together with the lower housing element 300 and the plate 101, forms an axial seal.
[0072] The lower region of the lower housing element 300 has a smaller diameter compared to the upper region. The lower region is designed as a tube and is hollow inside. A medium connection channel is formed inside the lower region, through which fluid is guided to the core component 100. The outer wall of the lower region may be threaded. A second sealing ring 303 may be provided on the outer side of the lower housing element 300 in the transition from the lower region to the upper region. The second sealing ring is designed to seal the lower housing element 300 when the sensor device is installed. Alternative designs for the sealing region of the lower housing element 300 are feasible.
[0073] The protective element 304 can be designed such that it surrounds the temperature sensor element 105 and provides mechanical protection to it in the aforementioned manner. Simultaneously, the protective element must ensure good contact between the measuring medium and the temperature sensor element 105.
[0074] Furthermore, the protective element 304 can electrically and thermally insulate the temperature sensor element 105 relative to the lower housing element 300, thereby improving measurement accuracy.
[0075] The protective element 304 may be a plastic part, which can be secured in the lower housing element 300 by means of a form fit. Since the protective element 304 is not fastened to the core component 100, no mechanical load is applied to the core component 100 by the protective element 304. A bilateral form fit between the protective element 304 and the lower region of the lower housing element 300 ensures that the protective element 304 is retained in the lower housing element 300. The form fit can be formed, for example, by deformation, such as thermoforming. In an alternative embodiment, the sensor device may not have a protective element 304.
[0076] Figure 7 The force lines in the sensor device are shown. Here, the force lines are outlined with arrows. This view should only show the general direction of the forces. The length and density of the arrows do not allow for inferences about the height of the individual forces acting.
[0077] In the medium connection channel formed in the lower housing element 300, the arrows indicate pressure p not only in the radial direction but also in the axial direction. In the core component 100 and in the upper housing element 200, the arrows indicate force f.
[0078] The fluid guiding through the medium port applies an upward force in the axial direction A to the core component 100 under its pressure. This force is first applied to the plate 101 that seals the medium connection channel. The force is then transmitted to the support element 103 via the plate 101 and the circuit carrier 102. The support element 103 forms a stop surface that abuts against the stop surface 204 of the upper housing element 200, allowing the force to be transmitted from the support element 103 to the upper housing element 200. The upper housing element 200 is now designed such that the force is transmitted to the rolled edge 301 of the lower housing element 300, where the flange 203 of the upper housing element 200 abuts in the axial direction.
[0079] In the circuit carrier 102, the force acts in the intermediate region 113. The force does not act on the edge region 114 of the circuit carrier 102. Since the support element 103 is located in the intermediate region 113 of the circuit carrier 102 and abuts against the stop surface 204 of the upper housing element 200, the support element 103 receives the force and continues to transmit it to the upper housing element 200. This prevents bending of the circuit carrier 102. The support in the edge region 114 of the circuit carrier 102 can be omitted. The edge region 114 of the circuit carrier 102 can be used in electronic devices.
[0080] Core components are manufactured and calibrated in batch assembly. This method improves the manufacturing process and, in particular, makes it more cost-effective.
[0081] List of reference numerals
[0082] 100-core component
[0083] 101 boards
[0084] 102 Circuit Bearer
[0085] The upper side of the 102a circuit carrier
[0086] The lower side of the 102b circuit carrier
[0087] 103 Support Components
[0088] 103a framework
[0089] 103b crossbeam
[0090] 103c convex part
[0091] 104 pressure sensor element
[0092] 105 temperature sensor element
[0093] 106 Electronic Components
[0094] 107 Empty Section
[0095] Electrical contacts of 108 temperature sensor element
[0096] Channel 109
[0097] The lower side of the 110-core component
[0098] The upper side of the 111 core component
[0099] 112 Piercing Section
[0100] 113 Middle Area
[0101] 114 Edge Area
[0102] 200 Upper Housing Components
[0103] 201 Plastic Components
[0104] 202 Contact Element
[0105] 203 flange
[0106] 204 stop surface
[0107] 205 outer flange
[0108] 206 Filling and Sealing Section
[0109] 300 Lower Housing Components
[0110] 301 rolled edge
[0111] 302 sealing ring
[0112] 303 sealing ring
[0113] 304 protection element
[0114] A-axis direction
[0115] Spacing of AA support element from the edge point
[0116] P1 edge point
[0117] P2 edge point
[0118] MP midpoint
[0119] L is the length of the straight line from P1 to P2.
Claims
1. A sensor device, the sensor device comprising: - Core component (100), the core component having a pressure sensor element (104), a circuit carrier (102), and a support element (103), and - Upper housing element (200) surrounding the core component (100). The upper housing element (200) rests against the upper side of the support element (103). The circuit carrier (102) has a central region (113) and an edge region (114) surrounding the central region (113). The support element (103) is disposed in the middle region (113) of the circuit carrier (102) and on the upper side of the circuit carrier (102).
2. The sensor device according to claim 1, The distance (AA) between the support element (103) and the edge point (P1) of the circuit carrier (102) is at least 5%, preferably at least 10% or at least 20% of the length (L) of the following straight line, which connects the edge point (P1) to the opposite edge point (P2) of the circuit carrier (102) and extends through the midpoint (MP) of the circuit carrier (102).
3. The sensor device according to any one of the preceding claims, The outer circumference of the support element (103) extends along the boundary between the middle region (113) and the edge region (114) of the circuit carrier (102). The intermediate region (113) occupies at least 10% of the area of the circuit carrier (102).
4. The sensor device according to any one of the preceding claims, The support element (103) has a frame (103a) surrounding an inner region in which the pressure sensor element (104) is disposed.
5. The sensor device according to claim 4, The support element (103) has a crossbeam (103b) that extends through the interior region. and / or The support element (103) has at least one protrusion (103c) extending into the inner region.
6. The sensor device according to any one of the preceding claims, The sensor device wherein the sensor has a lower housing element (300) that forms a medium connection channel designed to deliver fluid to the underside (110) of the core component (100).
7. The sensor device according to claim 6, The axial direction (A) points along the medium connection channel toward the core component (100). The lower housing element (300) extends beyond the core component (100) in the axial direction (A), and The lower housing element (300) has a rolled edge (301) that surrounds the lower end of the upper housing element (200) in the axial direction (A).
8. The sensor device according to claim 7, The core component (100) is designed to transmit force to the upper housing component (200) via the support element (103), and The upper housing element (200) is designed to direct the force received by the core component (100) to the rolled edge (301) of the lower housing element (300).
9. The sensor device according to any one of claims 6 to 8, The upper side of the circuit carrier (102) is directed away from the medium connection channel.
10. The sensor device according to any one of claims 6 to 9, The upper housing element (200) has a flange (203) at its lower end in the axial direction (A), the flange abutting against the inside of the rolled edge (301) of the lower housing element (300).
11. The sensor device according to any one of claims 6 to 10, The upper housing element (200) and the rolled edge (301) are connected to each other and sealed together by potting compound (206).
12. The sensor device according to any one of the preceding claims, The pressure sensor element (104) is a piezoresistive silicon MEMS element.
13. The sensor device according to any one of the preceding claims, The sensor device also includes a temperature sensor element (105).
14. The sensor device according to any one of the preceding claims, The core component (100) has a plate (101) disposed on the lower side (102b) of the circuit carrier (102). The pressure sensor element (104) is fastened to the upper side of the plate (101), and The plate (101) has a channel (109), and the pressure sensor element (104) is disposed at the end of the channel (109).
15. The sensor device according to claim 13, The plate (101) therein is made of steel, ceramic, glass or plastic.
16. The sensor device according to claim 13 and any one of claims 14 or 15, The temperature sensor element (105) has two connecting wires that extend through a through-hole (112) in the plate (101). The through portion (112) in the plate (101) is sealed with potting material.
17. A method for manufacturing a plurality of sensor devices according to any one of the preceding claims, The core component (100) is manufactured and calibrated in batch assembly.