Atomizing core and electronic atomizing device

Abstract

The embodiment of the invention provides an atomizing core and an electronic atomizing device, a liquid guiding base body is provided with a liquid absorbing surface and an atomizing surface, the atomizing surface is provided with a first punching area and a second punching area, the first punching area and the second punching area are arranged at an interval along a first direction, and a non-porous area is formed at the interval; a plurality of liquid outlets which are formed at intervals in the first direction are formed in the first punching area and the second punching area respectively, and the liquid suction face is provided with a plurality of liquid inlets which communicate with the liquid outlets in a one-to-one correspondence mode; in the first direction, the distance between every two adjacent liquid outlets in the first punching area is a first distance, the distance between every two adjacent liquid outlets in the second punching area is a second distance, the length of the non-porous area in the first direction is a first length, and the first length is larger than the first distance and the second distance. The heating assembly comprises a heating film with the uniform thickness, the heating film is attached to the first punching area, the second punching area and the non-hole area, and the area, located at the liquid outlet, of the heating film is open. According to the atomizing core, heat concentration can be relieved.

Description

Technical Field

[0001] This application relates to the field of atomization technology, and in particular to an atomizing core and an electronic atomization device. Background Technology

[0002] As users increasingly demand higher bursts and larger vapor production from electronic atomizers, the power requirements for atomizer coils are also gradually increasing. In related technologies, through-hole atomizer coils can match higher power output by increasing the heating area. However, with the continuous increase in heating film area, the heating film is prone to micro-cracks in the liquid-conducting substrate and heating film failure due to heat concentration. Summary of the Invention

[0003] In view of this, the main objective of the embodiments of this application is to provide an atomizing core and electronic atomizing device that can alleviate heat concentration.

[0004] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:

[0005] A first aspect of this application provides an atomizing core, comprising:

[0006] A liquid-conducting substrate has a liquid-absorbing surface and an atomizing surface. The atomizing surface has a first perforated area and a second perforated area. The first perforated area and the second perforated area are spaced apart along a first direction to form a non-porous area at the interval. Multiple liquid outlets are formed in both the first perforated area and the second perforated area, spaced apart along the first direction. The liquid-absorbing surface has multiple liquid inlets that correspond one-to-one with the liquid outlets. Along the first direction, the distance between adjacent liquid outlets in the first perforated area is a first distance, the distance between adjacent liquid outlets in the second perforated area is a second distance, and the length of the non-porous area along the first direction is a first length, which is greater than the first distance and the second distance.

[0007] The heating element includes a heating film of uniform thickness, which is attached to the first perforated area, the second perforated area and the non-perforated area, and the area of ​​the heating film at the liquid outlet is open.

[0008] In one embodiment, the first length is greater than or equal to 1.5 times of at least one of the first spacing and the second spacing, and less than or equal to 3 times of at least one of the first spacing and the second spacing.

[0009] In one embodiment, the first spacing is greater than or equal to 10 μm and less than or equal to 200 μm; and / or,

[0010] The second spacing is greater than or equal to 10 μm and less than or equal to 200 μm; and / or,

[0011] The aperture of the liquid outlet is greater than or equal to 5 μm and less than or equal to 100 μm.

[0012] In one embodiment, the first perforated area and the second perforated area are symmetrically arranged with respect to the non-perforated area; or,

[0013] The length of the first punched area along the first direction is the second length, and the length of the second punched area along the first direction is the third length. The second length is greater than or equal to 95% of the third length and less than or equal to 105% of the third length.

[0014] In one embodiment, the liquid-conducting substrate is made of ceramic, quartz, or glass; and / or,

[0015] The array of liquid outlets within the first perforated area is configured; and / or,

[0016] The liquid outlet array is set within the second perforated area.

[0017] In one embodiment, the heating component includes a first pin and a second pin disposed on the atomizing surface. The first pin is located on the side of the first perforated area away from the non-perforated area, and the second pin is located on the side of the second perforated area away from the non-perforated area. The heating film is electrically connected to the first pin and the second pin at opposite ends along the first direction to form a current path from the first pin to the second pin.

[0018] In one embodiment, the first direction is consistent with the extension direction of the current path, and the angle between the extension direction of the hole-free region and the second direction is greater than or equal to -5° and less than or equal to 5°; wherein, the second direction is perpendicular to the first direction.

[0019] In one embodiment, the projection of the heating film is located within the projection plane parallel to the atomizing surface, which is formed by the first pin, the second pin, the first perforated area, the second perforated area, and the non-perforated area.

[0020] In one embodiment, the atomizing surface further has at least one third perforated area, the third perforated area having the liquid outlet, the third perforated area being located at the interval between the first perforated area and the second perforated area, and the third perforated area being formed on at least one side of the non-perforated area along a second direction; wherein, the second direction is perpendicular to the first direction.

[0021] In one embodiment, the extension length of the third punching area along the second direction is a fourth length, and the extension length of the interval between the first punching area and the second punching area along the second direction is a fifth length, wherein the fourth length is less than or equal to 1 / 3 of the fifth length.

[0022] In one embodiment, the third perforated areas are respectively provided on opposite sides of the non-perforated area along the second direction, and the two third perforated areas are symmetrically arranged about the non-perforated area.

[0023] In one embodiment, the heating film is formed by a deposition process; and / or,

[0024] The heating film is one of the following: a resistance heating alloy material, a noble metal, and a noble metal alloy; or,

[0025] The heating film is one of the following: iron-based alloy, nickel-based alloy, titanium-based alloy, platinum, gold, or gold-silver alloy.

[0026] A second aspect of this application provides an electronic atomizing device, the electronic atomizing device including a power supply component and any of the atomizing cores described above, wherein the heating film is electrically connected to the power supply component.

[0027] This application provides an atomizing core and an electronic atomizing device. A first perforated area and a second perforated area on the atomizing surface are spaced apart along a first direction to form a non-perforated area at the intervals. The heating film has a uniform thickness and is attached to the first perforated area, the second perforated area, and the non-perforated area, with the area of ​​the heating film at the liquid outlet open. Therefore, by adding a non-perforated area between the first and second perforated areas, and with the length of the non-perforated area along the first direction being greater than the distance between adjacent liquid outlets within the first and second perforated areas, it is possible to eliminate the need for an open area at the point where the heating film is attached to the non-perforated area to facilitate liquid outlet connection. However, within the area attached to the first and second perforated areas, the area of ​​the heating film at the liquid outlet must be open to allow liquid to exit. Therefore, compared with the first and second perforated areas, the cross-sectional area of ​​the area where the heating film is attached to the non-perforated area is greatly increased, and the resistance is greatly reduced. This greatly reduces the heat generation in the area where the heating film is attached to the non-perforated area. The area where the heating film is attached to the non-perforated area can separate the heating film from the areas where the first and second perforated areas are attached, thus better buffering the problem of heat concentration and reducing the risk of microcracks in the liquid-conducting substrate and failure of the heating film. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of an atomizing core according to an embodiment of this application;

[0029] Figure 2 for Figure 1A diagram showing supplementary markings for the mid-core atomizer core;

[0030] Figure 3 for Figure 1 AA section view;

[0031] Figure 4 for Figure 1 Dry-burning temperature distribution diagram of the mid-atomizer core;

[0032] Figure 5 This is a schematic diagram of the structure of an atomizing core according to another embodiment of this application;

[0033] Figure 6 for Figure 5 Supplementary marking diagram of the mid-core coil

[0034] Figure 7 for Figure 5 Dry-burning temperature distribution diagram of the mid-atomizer core;

[0035] Figure 8 This is a schematic diagram of the atomizing core in related technologies.

[0036] Explanation of reference numerals in the attached figures

[0037] 10. Liquid-conducting substrate; 10a. Liquid-absorbing surface; 10b. Atomizing surface; 10c. First perforated area; 10d. Second perforated area; 10e. Non-perforated area; 10f. Liquid outlet; 10g. Third perforated area; 20. Heating element; 21. Heating film; 22. First pin; 23. Second pin; a. First spacing; b. Second spacing; c. First length; d. Second length; e. Third length; f. Fourth length; g. Fifth length. Detailed Implementation

[0038] In this application, the orientation or positional relationship of "first direction", "second direction" and "current direction" is based on the appendix. Figure 1 The orientation or positional relationship shown is for illustrative purposes only and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0039] One embodiment of this application provides an atomizing core; please refer to [link / reference]. Figure 1 , Figure 2 and Figure 3 The atomizing core includes a liquid-conducting substrate 10 and a heating element 20.

[0040] The liquid-conducting substrate 10 has a liquid-absorbing surface 10a and an atomizing surface 10b. The atomizing surface 10b has a first perforated area 10c and a second perforated area 10d. The first perforated area 10c and the second perforated area 10d are spaced apart along a first direction to form a non-porous area 10e at the interval. Multiple liquid outlets 10f are formed in both the first perforated area 10c and the second perforated area 10d, spaced apart along the first direction. The liquid-absorbing surface 10a has multiple liquid inlets that correspond one-to-one with the liquid outlets 10f. Along the first direction, the distance between adjacent liquid outlets 10f in the first perforated area 10c is a first distance a, the distance between adjacent liquid outlets 10f in the second perforated area 10d is a second distance b, and the length of the non-porous area 10e along the first direction is a first length c, which is greater than the first distance a and the second distance b.

[0041] The heating component 20 includes a heating film 21 of uniform thickness. The heating film 21 is attached to the first perforated area 10c, the second perforated area 10d and the non-perforated area 10e, and the area of ​​the heating film 21 at the liquid outlet 10f is open.

[0042] Another embodiment of this application provides an electronic atomizing device including a power supply component and an atomizing core as described in any embodiment of this application, wherein the heating film 21 is electrically connected to the power supply component.

[0043] Specifically, please refer to Figure 1 and Figure 3 The atomizing core is used to atomize the atomizing liquid to form an aerosol. The liquid-absorbing surface 10a is the side of the liquid-conducting substrate 10 with a liquid inlet for the atomizing liquid to enter. The atomizing surface 10b is the side of the liquid-conducting substrate 10 with a liquid outlet 10f for the atomizing liquid entering from the liquid inlet to flow out to the heating film 21, so that the heating film 21 atomizes the atomizing liquid to form an aerosol.

[0044] The specific material of the liquid-conducting substrate 10 is not limited, such as ceramic, quartz, glass or other insulating materials.

[0045] Please see Figure 1 and Figure 2 The first perforated area 10c, the second perforated area 10d, and the non-perforated area 10e are all regions on the atomizing surface 10b. Multiple liquid outlets 10f are formed in the first and second perforated areas 10c and 10d respectively, while the non-perforated area 10e does not have any liquid outlets 10f. Furthermore, the liquid outlets 10f in the first and second perforated areas 10c and 10d are spaced apart along a first direction. However, this does not mean that the liquid outlets 10f in the first and second perforated areas 10c and 10d can only be arranged in a single row along the first direction; in fact, they can also be arranged in multiple rows along other directions.

[0046] For example, please see Figure 1 and Figure 2 The liquid outlets 10f within the first perforated area 10c are arranged in an array. For example, the liquid outlets 10f within the first perforated area 10c are arranged in a rectangular array.

[0047] For example, the outlets 10f within the second perforation zone 10d are arranged in an array. For instance, the outlets 10f within the second perforation zone 10d are arranged in a rectangular array.

[0048] The inlet and outlet 10f on the liquid absorption surface 10a are connected in a one-to-one correspondence. In fact, the inlet and outlet 10f are connected to form a through hole that runs from the liquid absorption surface 10a to the atomizing surface 10b, penetrating the liquid-conducting substrate 10. By forming the through hole, the atomized liquid can flow through the inlet to the outlet 10f, where it is atomized by the heating film 21 to form an aerosol.

[0049] Furthermore, along the first direction, the length of the non-porous region 10e should not only be greater than the distance between all adjacent liquid outlets 10f along the first direction within the first perforated region 10c, but also greater than the distance between all adjacent liquid outlets 10f along the first direction within the second perforated region 10d. This ensures that the spacing between the close-proximity liquid outlets 10f in the first and second perforated regions 10c is sufficiently large, thereby enabling the non-porous region 10e to effectively buffer the problem of heat concentration.

[0050] It should be noted that the length of the non-porous region 10e along the first direction can be the distance between the liquid outlets 10f of the first perforated region 10c and the second perforated region 10d that are close to each other. Depending on the actual situation, this distance can also be slightly larger than the length of the non-porous region 10e along the first direction.

[0051] Please see Figure 2 and Figure 3 The heating film 21 is at least partially attached to the first perforated area 10c, the second perforated area 10d, and the non-perforated area 10e. At the points where the heating film 21 is attached to the first perforated area 10c and the second perforated area 10d, since both the first perforated area 10c and the second perforated area 10d have liquid outlets 10f, the area of ​​the heating film 21 at the liquid outlet 10f is open to facilitate the atomization of the atomized liquid flowing out from the liquid outlet 10f. That is, the heating film 21 has multiple through holes corresponding one-to-one with the liquid outlets 10f.

[0052] It should be noted that this application reduces the heat in the non-porous region 10e by adjusting the resistance distribution of the heating film 21, thereby avoiding the problem of heat concentration. The resistance of the heating film 21 is related to parameters such as its material, cross-sectional area, and thickness. Since the material of each region of the heating film 21 is consistent and the thickness of each region of the heating film 21 is uniform, the resistance of the heating film 21 can be adjusted by adjusting the cross-sectional area of ​​the heating film 21, thereby adjusting the amount of heat generated by the heating film 21.

[0053] Therefore, since there is no liquid outlet 10f in the non-porous region 10e, the area where the heating film 21 is attached to the non-porous region 10e also does not have through holes. As a result, the cross-sectional area of ​​this area is larger than the cross-sectional area of ​​the area where the heating film 21 is attached to the first perforated region 10c and the second perforated region 10d, which greatly reduces the resistance of the area where the heating film 21 is attached to the non-porous region 10e, thereby greatly reducing the heat generation in this area and thus achieving the effect of buffering heat concentration.

[0054] It should be noted that in actual production, the thickness of each region of the heating film 21 is difficult to guarantee as absolutely uniform due to errors. Therefore, the uniform thickness mentioned in this embodiment refers to the relatively uniform thickness of each region of the heating film 21. In practice, it means that the thickness difference between each region of the heating film 21 must be within a set thickness difference. For example, the thickness difference between each region of the heating film 21 is less than or equal to 1%.

[0055] Simultaneously, the uniformity of thickness in each region of the heating film 21 can be promoted through the formation process of the heating film 21. For example, the heating film 21 is formed by a deposition process. By employing a deposition process to form the heating film 21, it is possible to ensure that the heating film 21 has good thickness uniformity. For instance, the heating film 21 can be formed by physical vapor deposition or chemical vapor deposition.

[0056] Furthermore, the material of each region of the heating film 21 is consistent. When current passes through the heating film 21, the heating film 21 can generate heat due to its own resistance. The heating film 21 can be made of common resistance heating alloy materials, precious metals, or precious metal alloys.

[0057] For example, the heating film 21 is an iron-based alloy, a nickel-based alloy, or a titanium-based alloy.

[0058] For example, the heating film 21 is made of platinum, gold, or a gold-silver alloy.

[0059] It is understandable that the spacing between adjacent liquid outlets 10f along the first direction within the first perforation zone 10c and the second perforation zone 10d can be the same or there can be some differences.

[0060] However, the spacing should not be too small. On the one hand, a small spacing makes processing and manufacturing difficult, and on the other hand, it can easily cause heat concentration. Of course, the spacing should not be too large either. If the spacing is too large, the overall volume of the atomizing core will increase, and the liquid supply effect of the liquid guiding substrate 10 will be poor, resulting in poor atomization effect.

[0061] The specific spacing can be set according to the actual situation.

[0062] For example, the first spacing 'a' is greater than or equal to 10 μm and less than or equal to 200 μm. For example, 10 μm, 100 μm, or 200 μm.

[0063] For example, the second spacing b is greater than or equal to 10 μm and less than or equal to 200 μm. For example, 10 μm, 100 μm, or 200 μm.

[0064] Of course, the specific dimensions of the orifice diameter of each 10f outlet can be set according to the actual situation. It should not be too small, as this will lead to poor liquid supply and poor atomization. Of course, it should not be too large either, as this will easily cause heat concentration problems.

[0065] Its specific aperture can be set according to the actual situation.

[0066] For example, the pore size of the outlet 10f is greater than or equal to 5 μm and less than or equal to 100 μm. Such as 5 μm, 50 μm, or 100 μm.

[0067] In related technologies, the power of a through-hole atomizing core is between 5.5W and 8.5W, and the maximum power that a single atomizing core can withstand is 12W. If it is used with more than 12W, ceramic microcracks are likely to occur under certain liquid supply conditions (such as when a newly installed atomizing core is not fully wetted during the first puff), which will lead to the failure of the heating film.

[0068] In this embodiment, the first perforated area 10c and the second perforated area 10d of the atomizing core are spaced apart along a first direction to form a non-perforated area 10e at the interval. The heating film 21 is attached to the first perforated area 10c, the second perforated area 10d, and the non-perforated area 10e, and the area of ​​the heating film 21 at the liquid outlet 10f is open. Thus, by adding a non-perforated area 10e between the first perforated area 10c and the second perforated area 10d, and along the first direction, the length of the non-perforated area 10e is greater than the distance between adjacent liquid outlets 10f within the first perforated area 10c and the second perforated area 10d, it is not necessary to open a portion of the area where the heating film 21 is attached to the non-perforated area 10e to connect to the liquid outlet 10f. In the area attached to the first perforated area 10c and the second perforated area 10d, the area of ​​the heating film 21 at the liquid outlet 10f must be open to allow liquid to flow from the liquid outlet 10f. Therefore, compared with the first perforated area 10c and the second perforated area 10d, the cross-sectional area of ​​the area where the heating film 21 is attached to the non-perforated area 10e is greatly increased, and the resistance is greatly reduced. This greatly reduces the heat generation in the area where the heating film 21 is attached to the non-perforated area 10e. The area where the heating film 21 is attached to the non-perforated area 10e can separate the heating film 21 from the areas where the first perforated area 10c and the second perforated area 10d are attached, thereby better buffering the problem of heat concentration and reducing the risk of microcracks in the liquid-conducting substrate 10 and failure of the heating film 21.

[0069] In one embodiment, please refer to Figure 2 The first length c is greater than or equal to at least 1.5 times the first spacing a and the second spacing b, and less than or equal to at least 3 times the first spacing a and the second spacing b.

[0070] Specifically, the first length c is the length of the non-porous region 10e along the first direction. The longer the length, the better the effect of buffering heat concentration.

[0071] The first length c can be only greater than 1.5 times the first spacing a, or only greater than 1.5 times the second spacing b, or greater than both the first spacing a and the second spacing b by 1.5 times.

[0072] Meanwhile, when the first length c can meet the effect of buffering heat concentration, if the first length c is too large, the area of ​​the heating film 21 that is attached to the non-porous area 10e will be too large, and since there is no liquid outlet 10f to supply liquid, too much heat will be wasted, thereby affecting the mist consumption ratio of the heating film 21.

[0073] The first length c can be less than 3 times the first spacing a, or less than 3 times the second spacing b, or less than 3 times both the first spacing a and the second spacing b.

[0074] For example, the first length c can be 1.5 times, 2 times, or 3 times the first spacing a.

[0075] For example, the first length c can be 1.5 times, 2 times, or 3 times the second spacing b.

[0076] For example, the first length c is greater than or equal to at least 1.5 times the first spacing a and the second spacing b, and less than or equal to at least 2 times the first spacing a and the second spacing b. Thus, while satisfying the heat concentration effect of buffering, the size of the non-porous region 10e can be further reduced, further preventing heat waste.

[0077] In one embodiment, please refer to Figure 2 The length of the first punched area 10c along the first direction is the second length d, and the length of the second punched area 10d along the first direction is the third length e. The second length d is greater than or equal to 95% of the third length e and less than or equal to 105% of the third length e. For example, the second length d is 95% or 105% of the third length e, or the second length d is equal to the third length e.

[0078] Specifically, by controlling the length ratio of the first perforated area 10c and the second perforated area 10d within the aforementioned range along the first direction, the non-perforated area 10e can be located in the middle region of the perforated range within the atomizing surface 10b, which can further improve the effect of concentrating buffered heat.

[0079] Understandably, within the atomizing surface 10b, the heat is more concentrated in the central region of the overall perforated area formed by the first perforated area 10c and the second perforated area 10d, resulting in a higher temperature in the central region. Therefore, by placing the non-perforated area 10e between the first perforated area 10c and the second perforated area 10d, and controlling the length ratio of the first perforated area 10c and the second perforated area 10d along the first direction within the aforementioned range, the non-perforated area 10e can be located in the central region, effectively alleviating the heat concentration problem in the central region of the overall perforated area of ​​the atomizing surface 10b.

[0080] It should be noted that the entire area of ​​the first perforation area 10c and the entire area of ​​the second perforation area 10d are used to form multiple spaced liquid outlets 10f. That is, there is no area in the first perforation area 10c that is larger than the first spacing a and does not have a liquid outlet 10f. Similarly, there is no area in the second perforation area 10d that is larger than the second spacing b and does not have a liquid outlet 10f.

[0081] Furthermore, the specific shapes of the first punching area 10c and the second punching area 10d are not limited.

[0082] For example, the first perforated area 10c and the second perforated area 10d are symmetrically arranged about the non-perforated area 10e. This allows for uniform utilization of the heating film 21, resulting in more uniform mist output from the electronic atomizing device.

[0083] In one embodiment, please refer to Figure 1 and Figure 3 The heating component 20 includes a first pin 22 and a second pin 23 disposed on the atomizing surface 10b. The first pin 22 is located on the side of the first perforated area 10c away from the non-perforated area 10e, and the second pin 23 is located on the side of the second perforated area 10d away from the non-perforated area 10e. The heating film 21 is electrically connected to the first pin 22 and the second pin 23 at opposite ends along a first direction to form a current path from the first pin 22 to the second pin 23. Thus, the current flowing along the current path passes through the area where the heating film 21 is in contact with the non-perforated area 10e, thereby ensuring that there is a low-temperature area with less heat generation (its temperature is relative to the heating film 21 and the first perforated area 10c and the second perforated area 10d) along the current path, which can buffer the problem of heat concentration.

[0084] Specifically, the first perforated area 10c, the non-perforated area 10e, and the second perforated area 10d are located between the positions of the first pin 22 and the second pin 23 on the atomizing surface 10b. The area of ​​the heating film 21 located between the first pin 22 and the second pin 23 is respectively bonded to the first perforated area 10c, the non-perforated area 10e, and the second perforated area 10d.

[0085] It should be noted that the electronic atomizing device also includes a power supply component, wherein the first pin 22 and the second pin 23 can be electrically connected to the power supply component, thereby forming a closed loop through the first pin 22 and the second pin 23 to supply power to the heating film 21 located between the first pin 22 and the second pin 23. Thus, when current flows along the current path from the first pin 22 to the second pin 23, the heating film 21 generates heat to heat and atomize the atomizing liquid.

[0086] It should be noted that the direction of the current path extension is the direction of current flow, which can be roughly the same as the first direction, but with a certain angle. Of course, it can also be consistent with the first direction.

[0087] For example, please see Figure 1 and Figure 2 The current path extends in the same direction as the first direction, and the angle between the extension direction of the hole-free region 10e and the second direction is greater than or equal to -5° and less than or equal to 5°; wherein the second direction is perpendicular to the first direction.

[0088] Specifically, the first perforated area 10c and the second perforated area 10d are located on opposite sides of the non-perforated area 10e along a first direction. The first perforated area 10c and the second perforated area 10d are separated by extending the non-perforated area 10e.

[0089] It should be noted that the extension direction of the non-porous region 10e will affect the arrangement of the liquid outlets 10f in the first perforated region 10c and the second perforated region 10d. In fact, the extension direction of the non-porous region 10e should be controlled as close as possible to the second direction. This can ensure the effect of alleviating heat concentration and facilitate the arrangement of more liquid outlets 10f to improve atomization efficiency.

[0090] Therefore, the extension direction of the holeless region 10e can be consistent with the second direction, i.e., the angle between the two is 0°. Of course, depending on the actual situation and the errors that may occur during the actual setup, the extension direction of the holeless region 10e can also be within the range of ±5° deflection from the second direction, such as -5°, -3°, 3°, or 5°.

[0091] It should be noted that the extension direction of the non-perforated region 10e is the same as the second direction, i.e., 0°. The positive or negative value of the angle between the two is used to distinguish the direction of deflection of the extension direction of the non-perforated region 10e relative to the second direction. Specifically, a positive value is when the extension direction of the non-perforated region 10e deflects towards the second perforated region 10d relative to the second direction, and a negative value is when the extension direction of the non-perforated region 10e deflects towards the first perforated region 10c relative to the second direction.

[0092] In one embodiment, please refer to Figure 1 In the projection plane parallel to the atomizing surface 10b, the projection of the heating film 21 is located in the projection plane formed by the first pin 22, the second pin 23, the first perforated area 10c, the second perforated area 10d, and the non-perforated area 10e.

[0093] Specifically, the heating film 21 is located in the area between the first pin 22 and the second pin 23, within the overall area formed by the first perforated area 10c, the second perforated area 10d, and the non-perforated area 10e, and is in contact with this overall area. Therefore, the heating film 21 can be utilized as much as possible, avoiding the problem of reduced utilization of the heating film 21 due to some areas of the heating film 21 extending beyond the aforementioned projection surface.

[0094] It is understandable that the projection of the heating film 21 can be exactly the same as the projection area formed by the above structures. Of course, depending on the actual situation, the projection area of ​​the above structures can also be slightly larger than the projection area of ​​the heating film 21.

[0095] For example, along the second direction, at least a portion of one of the first perforated area 10c and the second perforated area 10d extends into the coverage area of ​​the heating film 21. This ensures that at least a portion of the liquid outlet 10f is located within the coverage area of ​​the heating film 21, thereby guaranteeing the effective liquid supply to the first perforated area 10c and the second perforated area 10d.

[0096] In one embodiment, please refer to Figure 5 The atomizing surface 10b also has at least one third perforated area 10g, which has a liquid outlet 10f. The third perforated area 10g is located at the interval between the first perforated area 10c and the second perforated area 10d, and the third perforated area 10g is formed on at least one side of the non-perforated area 10e along a second direction; wherein the second direction is perpendicular to the first direction. Therefore, while ensuring that the non-perforated area 10e has a heat-concentrating buffering effect, the number of liquid outlets 10f on the atomizing surface 10b can be increased as much as possible to improve the liquid supply effect, thereby improving the atomization effect of the heating film 21.

[0097] Specifically, the first perforated area 10c and the second perforated area 10d are set alternately. In the interval between the two, not only is a non-perforated area 10e formed, but also a third perforated area 10g is formed. The third perforated area 10g is also provided with a liquid outlet 10f. It can be understood that the liquid absorption surface 10a is also provided with a liquid inlet that corresponds to and communicates with the liquid outlet 10f.

[0098] The number of holes to be punched in the third 10g area can be determined based on the actual situation.

[0099] For example, the atomizing surface 10b includes only one third perforated area 10g, which is located on any side of the non-perforated area 10e along the second direction.

[0100] For example, the atomizing surface 10b includes two third perforated areas 10g, which are located on opposite sides of the non-perforated area 10e along the second direction. This allows the non-perforated area 10e to be centrally located, thereby improving its ability to buffer heat concentration in the central region.

[0101] It should be noted that the two third perforated areas 10g may differ in shape or length, or they may be symmetrically arranged with respect to the non-perforated area 10e. Please refer to [link / reference]. Figure 5 The symmetrical arrangement can further improve the buffering effect of the non-porous zone 10e on the heat concentration in the central region.

[0102] The distance between the third punching area 10g and the first punching area 10c and the second punching area 10d is not limited. It can be the same as the first distance a, the same as the second distance b, or different from both.

[0103] It is understandable that in the interval between the first perforated area 10c and the second perforated area 10d, if the third perforated area 10g has a longer length along the second direction, the extension length of the non-perforated area 10e along the second direction will be shortened, thereby reducing the effect of the non-perforated area 10e in alleviating heat concentration. Therefore, the length of the third perforated area 10g along the second direction should not be too long.

[0104] For example, please see Figure 6 The third punching area 10g extends along the second direction for a fourth length f, and the interval between the first punching area 10c and the second punching area 10d extends along the second direction for a fifth length g. The fourth length f is less than or equal to 1 / 3 of the fifth length g.

[0105] Specifically, the extension length of the third perforated area 10g along the second direction should not be too long. By controlling it within 1 / 3 of the length of the interval between the first perforated area 10c and the second perforated area 10d, it can be ensured that the extension length of the non-porous area 10e along the second direction is greater than or equal to 1 / 3. Thus, while ensuring the heat concentration relief effect of the non-porous area 10e, the liquid supply efficiency of the liquid-conducting substrate 10 can be improved.

[0106] It should be noted that the specific extension length of the third punching area 10g can be set according to actual needs, such as the fourth length f being 1 / 3, 1 / 4, or 1 / 5 of the fifth length g.

[0107] It is understandable that when the non-perforated area 10e is provided with a third perforated area 10g on each of the opposite sides along the second direction, and the extension length of the third perforated area 10g is 1 / 3 of the fifth length g, then the extension length of the non-perforated area 10e along the second direction is also 1 / 3 of the fifth length g.

[0108] In one embodiment, by providing a non-porous region 10e, the liquid-conducting substrate 10 can withstand 12-15W dry-burning thermal shock and wet-burning thermal shock.

[0109] Under dry-burning conditions, the heating film 21 can withstand a power of 12W. Specifically, this applies to areas with an area of ​​5.5-6.8mm². 2 The heating film 21 has a porosity of 20% in the liquid-conducting substrate 10. By using a constant power of 12W to dry-burn in the air for 10 cycles with a power-on period of 3 seconds and a stop period of 8 seconds, the resistance change of the heating film 21 is less than 20%.

[0110] Under wet firing conditions, the heating film 21 can meet the testing requirements of more than 1000 suction pumps. Specifically, it is suitable for areas with an area of ​​5.5-6.8 mm². 2The heating film 21 has a liquid-conducting substrate 10 with a porosity of 20%. Atomizing liquid is supplied to the heating film 21, and it is powered by a constant 12W. The atomization process is initiated by pumping for 3 seconds followed by a 27-second pause. After 1000 pumps by the user, the resistance change of the heating film 21 is less than 20%.

[0111] For related technologies, please refer to Figure 8 The liquid-conducting substrate is a ceramic matrix with an array of outlets. However, the perforated area on the atomizing surface is continuous, with no non-perforated areas. The specific thickness of the liquid-conducting substrate is 0.7 mm, the pore diameter of the outlets is 50 μm, and the spacing between adjacent outlets is 100 μm. The perforated area is 2.8 x 2.4 mm. 2 The holes are evenly distributed in the perforated area.

[0112] The heating film material consists of 16-18% Cr, 10-12% Ni, 2-3% Mo, and the remainder is 67-72% Fe. The protective layer is a pure Ta layer. The effective heating area of ​​the heating film is 2.8 * 2.1 = 5.88 mm. 2 (This value does not take porosity into account).

[0113] In the relevant technology, the dry-burning capability of the liquid-conducting substrate is demonstrated by the user drawing air five times while the heating film is powered at 12W, resulting in a resistance change of more than 20%. The power-on method involves a constant 12W power supply for 3 seconds followed by an 8-second pause. The temperature is concentrated in the central high-temperature zone of the heating film, with the highest temperature at the infrared imaging center reaching 1083℃.

[0114] In one specific embodiment, the liquid-conducting substrate 10 is a ceramic substrate with an array of liquid outlets 10f. Specifically, the thickness is 0.7 mm, the pore size of the liquid outlets 10f is 50 μm, and the spacing between adjacent liquid outlets 10f is 100 μm. The overall area formed by the first perforated area 10c and the second perforated area 10d is 2.8 * 2.4 mm. 2 The length of the non-porous region 10e along the first direction is 200 μm.

[0115] The heating film 21 is composed of 16-18% Cr, 10-12% Ni, 2-3% Mo, and the remainder is 67-72% Fe. The protective layer is a pure Ta layer. The effective heating area of ​​the heating film 21 is 2.8 * 2.1 = 5.88 mm. 2 (This value does not take porosity into account).

[0116] The dry-burning capability of the liquid-conducting substrate 10 meets the following requirement: when energized at 12W to the heating film 21, the resistance change of the heating film 21 is less than 20% after 10 suctions by the user. The energizing method involves a constant power of 12W for 3 seconds followed by an 8-second pause. The dry-burning temperature distribution is as follows: Figure 4 As shown, when the liquid-conducting substrate 10 is dry-burned at a constant power of 12W, the center temperature observed by infrared imaging is 896℃. The area where the heating film 21 adheres to the non-porous region 10e generates less or no heat, thus dividing the highest temperature into two regions. This highest temperature is significantly lower than the highest temperature in related technologies.

[0117] The wet burning capability of the liquid-conducting substrate 10 can meet the following requirements: when the atomizing liquid is supplied to the heating film 21, a constant power of 12W is applied, and the pumping method is used to pump for 3 seconds and stop for 27 seconds, after pumping for 1000 times, the resistance change of the heating film 21 is less than 10%.

[0118] In one specific embodiment, the liquid-conducting substrate 10 is a ceramic substrate with a thickness of 0.7 mm. The pore diameter of the liquid outlet 10f is 40 μm, and the pore spacing between adjacent liquid outlets 10f is 80 μm. The overall area formed by the first perforated area 10c and the second perforated area 10d is 2.8 * 2.4 mm. 2 The non-porous region 10e extends along the second direction and has a length of 160 μm.

[0119] The heating film 21 is composed of 16-18% Cr, 10-12% Ni, 2-3% Mo, and the remainder is 67-72% Fe. The protective layer is a pure Ta layer. The effective heating area of ​​the heating film 21 is 2.8 * 2.1 = 5.88 mm. 2 (This value does not take porosity into account).

[0120] The dry-burning capability of the liquid-conducting substrate 10 meets the following requirement: when energized at 12W to the heating film 21, the resistance change of the heating film 21 is less than 20% after 10 suctions by the user. The energizing method involves a constant power of 12W for 3 seconds followed by an 8-second pause. The dry-burning temperature distribution is as follows: Figure 7 As shown, its highest temperature is also lower than the highest temperature in related technologies.

[0121] The wet burning capability of the liquid-conducting substrate 10 can meet the following requirements: when the atomizing liquid is supplied to the heating film 21, a constant power of 12W is applied, and the pumping method is used to pump for 3 seconds and stop for 27 seconds, after pumping for 1000 times, the resistance change of the heating film 21 is less than 10%.

[0122] In the description of this application, the references to terms such as "in one embodiment," "in some embodiments," "in a specific embodiment," or "exemplary," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine the different embodiments or examples described in this application, as well as the features of the different embodiments or examples.

[0123] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. An atomizing core, characterized in that, include: A liquid-conducting substrate has a liquid-absorbing surface and an atomizing surface. The atomizing surface has a first perforated area and a second perforated area. The first perforated area and the second perforated area are spaced apart along a first direction to form a non-porous area at the interval. Multiple liquid outlets are formed in both the first perforated area and the second perforated area, spaced apart along the first direction. The liquid-absorbing surface has multiple liquid inlets that correspond one-to-one with the liquid outlets. Along the first direction, the distance between adjacent liquid outlets in the first perforated area is a first distance, the distance between adjacent liquid outlets in the second perforated area is a second distance, and the length of the non-porous area along the first direction is a first length, which is greater than the first distance and the second distance. The heating element includes a heating film of uniform thickness, which is attached to the first perforated area, the second perforated area and the non-perforated area, and the area of ​​the heating film at the liquid outlet is open.

2. The atomizing core according to claim 1, characterized in that, The first length is greater than or equal to 1.5 times of at least one of the first spacing and the second spacing, and less than or equal to 3 times of at least one of the first spacing and the second spacing.

3. The atomizing core according to claim 2, characterized in that, The first spacing is greater than or equal to 10 μm and less than or equal to 200 μm; and / or, The second spacing is greater than or equal to 10 μm and less than or equal to 200 μm; And / or, The aperture of the liquid outlet is greater than or equal to 5 μm and less than or equal to 100 μm.

4. The atomizing core according to claim 1, characterized in that, The first perforated area and the second perforated area are symmetrically arranged with respect to the non-perforated area; or, The length of the first punched area along the first direction is the second length, and the length of the second punched area along the first direction is the third length. The second length is greater than or equal to 95% of the third length and less than or equal to 105% of the third length.

5. The atomizing core according to claim 1, characterized in that, The liquid-conducting substrate is made of ceramic, quartz, or glass; and / or, The array of liquid outlets within the first perforated area is configured; and / or, The liquid outlet array is set within the second perforated area.

6. The atomizing core according to any one of claims 1-5, characterized in that, The heating element includes a first pin and a second pin disposed on the atomizing surface. The first pin is located on the side of the first perforated area away from the non-perforated area, and the second pin is located on the side of the second perforated area away from the non-perforated area. The heating film is electrically connected to the first pin and the second pin at opposite ends along the first direction to form a current path from the first pin to the second pin.

7. The atomizing core according to claim 6, characterized in that, The current path extends in the same direction as the first direction, and the angle between the extension direction of the hole-free region and the second direction is greater than or equal to -5° and less than or equal to 5°; wherein the second direction is perpendicular to the first direction.

8. The atomizing core according to claim 6, characterized in that, Within a projection plane parallel to the atomizing surface, the projection of the heating film lies within the projection plane formed by the first pin, the second pin, the first perforated area, the second perforated area, and the non-perforated area.

9. The atomizing core according to any one of claims 1-5, characterized in that, The atomizing surface also has at least one third perforated area, the third perforated area having the liquid outlet, the third perforated area being located at the interval between the first perforated area and the second perforated area, and the third perforated area being formed on at least one side of the non-perforated area along a second direction; wherein, the second direction is perpendicular to the first direction.

10. The atomizing core according to claim 9, characterized in that, The third punching area extends along the second direction for a fourth length, and the interval between the first punching area and the second punching area extends along the second direction for a fifth length, wherein the fourth length is less than or equal to 1 / 3 of the fifth length.

11. The atomizing core according to claim 9, characterized in that, The three perforated areas are respectively provided on opposite sides of the non-perforated area along the second direction, and the two third perforated areas are symmetrically arranged about the non-perforated area.

12. The atomizing core according to any one of claims 1-5, characterized in that, The heating film is formed by a deposition process; and / or, The heating film is one of the following: a resistance heating alloy material, a noble metal, and a noble metal alloy; or, The heating film is one of the following: iron-based alloy, nickel-based alloy, titanium-based alloy, platinum, gold, or gold-silver alloy.

13. An electronic atomizing device, characterized in that, The electronic atomizing device includes a power supply component and an atomizing core as described in any one of claims 1-12, wherein the heating film is electrically connected to the power supply component.

Images