Environment-friendly wafer gold stripping device and process for VCSEL chip

Abstract

The application discloses an environment-friendly wafer gold stripping device for a VCSEL chip and a process, relates to the technical field of wafer gold stripping, and comprises a machine body, a gold stripping assembly is arranged in the machine body, the gold stripping assembly is composed of a fixing groove, an outer ring and a gold stripping body, the fixing groove is located on the bottom surface of the machine body, the outer ring is located above the fixing groove, and the gold stripping body is arranged on the side, away from the fixing groove, of the outer ring; the gold stripping body is composed of a fixing body and a fixing ring; a rotating groove is arranged in the fixing body, and a plurality of gold stripping rings are arranged in the fixing ring; a rotating shaft is arranged in the rotating groove, and a plurality of lever wheels are arranged on the shaft wall of the rotating shaft; the plurality of gold stripping rings are subjected to wave-shaped reciprocating motion, so that the flushing liquid continuously flows from the center of the wafer to the edge of the wafer, and in the process that the distance between the gold stripping ring and the wafer surface continuously decreases, the flow rate is gradually increased, and the effect that the metal film is separated from the wafer surface is further improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer gold stripping, and particularly relates to an environmentally-friendly wafer gold stripping device for a VCSEL chip and a process. BACKGROUND

[0002] The wafer gold stripping device is a device for processing a wafer surface in semiconductor manufacturing and related processes, and is mainly used for stripping or cleaning a metal film on the wafer surface. The existing wafer gold stripping device usually adopts a processing mode of flushing from one side edge of the wafer to the other side edge, so that the flow rate of the flushing water flow is in a constant state, the flushing force when the water flow contacts the wafer is greater than the flushing force away from the water flow contacting the wafer for a certain distance, and the flushing effect is in a step-down state, and thus the wafer surface metal film stripping effect is poor, and the time consumed is long. SUMMARY

[0003] The application aims to provide an environmentally-friendly wafer gold stripping device for a VCSEL chip and a process to solve the problems in the prior art.

[0004] To achieve the above-mentioned purpose, the application provides the following technical scheme.

[0005] An environmentally-friendly wafer gold stripping device for a VCSEL chip and a process, comprising a machine body, a gold stripping assembly is arranged in the machine body, the gold stripping assembly is composed of a fixed groove, an outer ring and a gold stripping body, the fixed groove is located on the bottom surface of the machine body, the outer ring is located above the fixed groove, and the gold stripping body is arranged on the side, away from the fixed groove, of the outer ring.

[0006] Preferably, the machine body is provided with a moving arm on each side, the moving arm is connected with the outer wall of the outer ring, a moving motor is arranged in the moving arm, a driving shaft of the moving motor is provided with a transmission wheel, the transmission wheel is in frictional contact with the outer wall of the machine body, and the outer ring is in sliding connection with the fixed groove.

[0007] The wafer is placed in front of the fixed groove, the moving arm is located at the end, away from the fixed groove, of the machine body, at this time, the outer ring and the gold stripping body are located above the fixed groove, and the outer ring is separated from the fixed groove;

[0008] When the wafer is placed in the fixed groove, the controller controls the moving motor to start, the driving shaft of the moving motor drives the transmission wheel to rotate, the transmission wheel is in frictional contact with the machine body, the transmission wheel drives the moving arm to move, the moving arm moves towards the side close to the fixed groove, and the moving arm drives the outer ring to move at the same time, so that the bottom of the outer ring is in contact with the top of the fixed groove.

[0009] Preferably, the top of the body is provided with a rotating motor, the drive shaft of the rotating motor is provided with an extension rod, the extension rod is connected with the gold stripping body near one side of the fixed groove, and the gold stripping body is in contact with the outer ring surface.

[0010] When the outer ring is moved to the fixed groove by the moving arm, the gold stripping body is moved to the fixed groove due to the contact between the gold stripping body and the outer ring under the action of gravity.

[0011] When the gold stripping body is moved, the extension rod is elongated, and when the wafer is stripped, the controller controls the driving of the rotating motor, the drive shaft of the rotating motor drives the extension rod to rotate, the extension rod drives the gold stripping body to rotate in the process of rotating, and the wafer stripping treatment is realized.

[0012] Preferably, the gold stripping body is composed of a fixed body and a fixed ring, the bottom of the fixed body is provided with the fixed ring, the outer wall of the fixed ring is in sliding connection with the inner part of the outer ring, the fixed body is provided with a rotating groove, and the fixed ring is provided with a plurality of gold stripping rings.

[0013] When the rotating motor is started, the fixed body rotates through the rotation of the extension rod, the fixed ring rotates in the process of rotating of the fixed body, and the rotating groove rotates under the driving of the fixed body.

[0014] Preferably, the fixed ring is further provided with a plurality of fixed rods, the plurality of gold stripping rings are provided with a plurality of moving grooves, the fixed rods extend into the moving grooves, the fixed rods are in sliding connection with the moving grooves, springs are arranged on the upper and lower sides of the fixed rods, one end of the spring is connected with the moving groove, and the other end of the spring is connected with the fixed rod.

[0015] In the process of rotating of the fixed ring, the fixed rods rotate due to the extension of the fixed rods into the moving grooves.

[0016] Due to the rotation of the dial lever wheel around the axis of the rotating shaft under the action of the bevel gear, the dial lever wheel is in contact with the top of the gold stripping ring in the process of rotating, and the dial lever wheel pushes the gold stripping ring to move when the dial lever wheel continues to rotate, so that the gold stripping ring moves to the side close to the fixed groove.

[0017] When the dial lever wheel compresses the stripping ring to the maximum stroke, the extrusion force of the dial lever wheel on the stripping ring decreases with the rotation of the dial lever wheel, and then the stripping ring resets under the action of the spring force, so that the stripping ring is always in the state of reciprocating up and down along the axis of the stripping ring.

[0018] Preferably, the rotating groove is provided with a rotating shaft, and the shaft wall of the rotating shaft is provided with a plurality of dial lever wheels, which are in one-to-one correspondence with the stripping rings and are rotatably connected with the stripping rings.

[0019] After the rotating groove is rotated under the influence of the fixed body, the rotating groove drives the rotating shaft to rotate, and the rotating shaft drives the plurality of dial lever wheels to rotate at the same time.

[0020] Preferably, the two ends of the rotating shaft are provided with bevel gears, and the top of the outer ring is provided with a tooth ring, and the bevel gears are in meshing transmission with the tooth ring.

[0021] Since the bevel gears are in meshing state with the tooth ring, the rotating groove drives the rotating shaft to rotate around the axis of the stripping body when the rotating groove rotates, so that the rotating shaft drives the bevel gears to rotate, and the bevel gears rotate around the axis of the stripping body while rotating in the meshing state with the tooth ring, so that the bevel gears rotate around the axis of the stripping body while rotating around the axis of the stripping body.

[0022] Preferably, the arrangement angles of the adjacent two dial lever wheels are different.

[0023] Since the arrangement angles of the adjacent two dial lever wheels are different, and the dial lever wheels are in one-to-one correspondence with the stripping rings, the dial lever wheels contact the top of the stripping ring when rotating and push the stripping ring to reciprocate up and down, so that the plurality of stripping rings present a wavy motion trajectory.

[0024] Preferably, the inside of the stripping ring is provided with a conveying groove, the adjacent two conveying grooves are communicated with each other, one side of the stripping ring close to the outer ring is provided with an inclined surface, the side of the stripping ring away from the outer ring is provided with an arc surface, the side of the stripping ring on the inclined surface is provided with a plurality of water injection ports, the water injection ports are communicated with the conveying grooves, the top of the outermost stripping ring is provided with a water inlet pipe, the water inlet pipe is communicated with the conveying grooves through a pipeline, and the machine body is provided with a water pump, and the water pump is communicated with the water inlet pipe through an extension pipe.

[0025] In the process of gold stripping treatment, the controller controls the water pump to start, and the water pump delivers the flushing liquid to the water inlet pipe through the telescopic pipe, and then the flushing liquid is delivered to the conveying groove through the pipeline, and because the two adjacent conveying grooves are communicated, the flushing liquid is delivered from the outermost gold stripping ring to the gold stripping ring in the center position, and finally the flushing liquid is delivered to the water outlet through the conveying groove, and is sprayed out of the wafer, thereby washing the metal film on the wafer surface, thereby realizing the effect of gold stripping.

[0026] In the process of flushing, the gold stripping rings are affected by the dial rod wheel and move up and down in the axial direction, and because the dial rod wheel has different arrangement angles, the gold stripping rings move in a wave shape in the radial direction, so that the distance between the bottom of the gold stripping ring and the wafer is constantly changing.

[0027] When the distance between the bottom of the outer gold stripping ring and the wafer is constantly reduced, the flushing liquid sprayed by the adjacent gold stripping ring will first meet the arc surface arranged on the bottom of the gold stripping ring, and then the flushing liquid will flow to the bottom of the outer gold stripping ring under the influence of the arc surface. Because the distance between the bottom of the outer gold stripping ring and the wafer is constantly reduced, the cross-sectional area of the flow passage through which the flushing liquid can flow is reduced, so that the flow rate of the flushing liquid at this time is increased, and the impact on the metal film on the wafer surface is also increased, thereby improving the effect of gold stripping treatment, thereby improving the effect of the metal film and the wafer surface, shortening the time of the metal film and the wafer surface, and improving the efficiency of the wafer gold stripping;

[0028] Through the wave-shaped reciprocating motion of the gold stripping rings, the flushing liquid constantly flows from the center of the wafer to the edge of the wafer, and in the process of the distance between the gold stripping ring and the wafer surface constantly reducing, the flow rate is gradually increased, thereby further improving the effect of the metal film from the wafer surface.

[0029] The flushing liquid flowing through the wafer surface is delivered outward through the delivery port arranged at the edge of the fixed groove, thereby forming the effect of circulating flushing.

[0030] A gold stripping process of an environmentally friendly wafer gold stripping device for a VCSEL chip,

[0031] The gold stripping process comprises the following specific steps:

[0032] S1, placing the chip wafer in the fixed groove;

[0033] S2, moving the outer ring to the side close to the fixed groove, and moving the gold stripping body with the movement of the outer ring;

[0034] S3, the fixed groove, the outer ring and the gold stripping body form a closed gold stripping space;

[0035] S4, the water pump delivers the flushing liquid to the gold stripping ring through the pipeline;

[0036] S5, the gold stripping ring performs the gold stripping treatment on the wafer in the form of wave-like reciprocating motion;

[0037] S6, after the gold stripping treatment is completed, the outer ring drives the gold stripping body to reset;

[0038] S7, the wafer is taken out from the fixed groove.

[0039] Compared with the prior art, the beneficial effects of the present application are:

[0040] In the process of flushing by the flushing liquid, the gold stripping rings are affected by the impact lever wheel to generate the reciprocating motion state in the axial direction, and due to the different arrangement angles of the impact lever wheel, the gold stripping rings generate the wave-like motion state in the radial direction, so that the distance between the bottom of the gold stripping ring and the wafer is constantly changed; through the wave-like reciprocating motion of the gold stripping rings, the flushing liquid constantly flows from the center of the wafer to the edge of the wafer, and in the process of constantly reducing the distance between the gold stripping ring and the wafer surface, the flow rate is gradually increased, which further enhances the effect of the metal film separating from the wafer surface. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 It is a perspective view of the present application;

[0042] Figure 2 It is a front view of the present application;

[0043] Figure 3 It is a structural schematic view of the gold stripping assembly;

[0044] Figure 4 It is an exploded view of the gold stripping assembly;

[0045] Figure 5 It is a schematic view of the internal structure of the gold stripping assembly;

[0046] Figure 6 It is a front view of the internal structure of the gold stripping assembly;

[0047] Figure 7 It is a schematic view of the structure of the helical gear and the tooth ring;

[0048] Figure 8 It is Figure 5 the enlarged view of A in the middle;

[0049] In the figure: 1, the machine body; 11, the moving arm; 12, the telescopic rod;

[0050] 2. Gold stripping assembly; 21. Fixing groove; 22. Outer ring; 221. Toothed ring; 23. Gold stripping body; 24. Fixing body; 25. Fixing ring; 251. Fixing rod; 26. Rotating groove; 27. Gold stripping ring; 271. Moving groove; 28. Rotating shaft; 281. Helical gear; 29. ​​Pulley wheel; 30. Conveying groove; 31. Water nozzle; 32. Water inlet pipe. Detailed Implementation

[0051] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0052] Example: Figures 1-8 As shown, the present invention provides an environmentally friendly wafer gold stripping device for VCSEL chips, including a body 1. The body 1 has a gold stripping component 2 inside. The gold stripping component 2 consists of a fixing groove 21, an outer ring 22 and a gold stripping body 23. The fixing groove 21 is located on the bottom surface of the body 1, the outer ring 22 is located above the fixing groove 21, and the gold stripping body 23 is disposed on the side of the outer ring 22 away from the fixing groove 21.

[0053] In one specific embodiment of the present invention, movable arms 11 are provided on both sides of the body 1. The movable arms 11 are connected to the outer wall of the outer ring 22. A movable motor is provided inside the movable arm 11. The drive shaft of the movable motor is provided with a transmission wheel. The transmission wheel is in frictional contact with the outer wall of the body 1. The outer ring 22 is slidably connected to the fixing groove 21.

[0054] In one specific embodiment of the present invention, a rotating motor is provided on the top of the machine body 1, and a telescopic rod 12 is provided on the drive shaft of the rotating motor. The side of the telescopic rod 12 near the fixed groove 21 is connected to the gold stripping body 23, and the gold stripping body 23 is in contact with the surface of the outer ring 22.

[0055] In one specific embodiment of the present invention, the gold stripping body 23 is composed of a fixing body 24 and a fixing ring 25. The fixing body 24 is provided with a fixing ring 25 at its bottom. The outer wall of the fixing ring 25 is slidably connected to the inside of the outer ring 22. The fixing body 24 is provided with a rotating groove 26. The fixing ring 25 is provided with a plurality of gold stripping rings 27. The plurality of gold stripping rings 27 are combined to form a concentric ring structure.

[0056] As a specific embodiment of the present application, a plurality of fixed rods 251 are arranged in the fixed ring 25, a plurality of moving grooves 271 are arranged in the gold stripping ring 27, the fixed rods 251 extend into the moving grooves 271, the fixed rods 251 are in sliding connection with the moving grooves 271, springs are arranged on the upper and lower sides of the fixed rods 251, one end of the spring is connected with the moving groove 271, and the other end of the spring is connected with the fixed rod 251.

[0057] As a specific embodiment of the present application, a rotating shaft 28 is arranged in the rotating groove 26, a plurality of lever wheels 29 are arranged on the shaft wall of the rotating shaft 28, the lever wheels 29 correspond to the gold stripping rings 27 one by one, and the lever wheels 29 are in rotating connection with the gold stripping rings 27.

[0058] As a specific embodiment of the present application, the arrangement angles of two adjacent lever wheels 29 are different.

[0059] As a specific embodiment of the present application, bevel gears 281 are arranged at the two ends of the rotating shaft 28, a tooth ring 221 is arranged at the top of the outer ring 22, and the bevel gears 281 are in meshing transmission with the tooth ring 221.

[0060] As a specific embodiment of the present application, a conveying groove 30 is arranged in the gold stripping ring 27, two adjacent conveying grooves 30 are in communication with each other, an inclined surface is arranged on the side of the gold stripping ring 27 close to the outer ring 22, an arc surface is arranged on the side of the gold stripping ring 27 away from the outer ring 22, a plurality of water injection ports 31 are arranged on the side of the gold stripping ring 27 close to the inclined surface, the water injection ports 31 are in communication with the conveying groove 30, a water inlet pipe 32 is arranged at the top of the outermost gold stripping ring 27, the water inlet pipe 32 is in communication with the conveying groove 30 through a pipeline, a water pump is arranged in the machine body 1, and the water pump is in communication with the water inlet pipe 32 through an extension pipe.

[0061] A gold stripping process of an environment-friendly wafer gold stripping device for a VCSEL chip,

[0062] The gold stripping process comprises the following specific steps.

[0063] S1, placing the chip wafer in the fixed groove 21;

[0064] S2, moving the outer ring 22 to the side close to the fixed groove 21, and moving the gold stripping body 23 along with the movement of the outer ring;

[0065] S3, the fixed groove 21, the outer ring 22 and the gold stripping body 23 form a closed gold stripping space;

[0066] S4, the water pump delivers the washing liquid to the gold stripping ring 27 through the pipeline;

[0067] S5, the gold stripping ring 27 is in the form of wave-like reciprocating motion to the wafer for gold stripping treatment;

[0068] S6, after the gold stripping treatment is completed, the outer ring 22 drives the gold stripping body 23 to reset;

[0069] S7, the wafer is taken out from the fixed groove 21.

[0070] The working principle of the present application:

[0071] The wafer is placed in the fixed groove 21, the moving arm 11 is located at the end of the machine body 1 away from the fixed groove 21, at this time, the outer ring 22 and the gold stripping body 23 are located above the fixed groove 21, and the outer ring 22 is separated from the fixed groove 21;

[0072] When the wafer is placed in the fixed groove 21, the controller controls the moving motor to start, the driving shaft of the moving motor drives the transmission wheel to rotate, and the transmission wheel is in frictional contact with the machine body 1, so that the transmission wheel drives the moving arm 11 to move, the moving arm 11 moves to the side close to the fixed groove 21, and at the same time, the moving arm 11 drives the outer ring 22 to move, so that the outer ring 22 moves to the fixed groove 21, and then the bottom of the outer ring 22 contacts the top of the fixed groove 21;

[0073] At the same time, the moving arm 11 drives the outer ring 22 to move close to the fixed groove 21, and because the gold stripping body 23 is in contact with the outer ring 22, the gold stripping body 23 moves with the outer ring 22 under the action of gravity, and then the gold stripping body 23 also moves to the side close to the fixed groove 21, when the outer ring 22 contacts the fixed groove 21, at this time, the fixed groove 21, the outer ring 22 and the gold stripping body 23 form a closed gold stripping space, which is isolated from the inside of the machine body 1;

[0074] At the same time, the moving arm 11 drives the outer ring 22 to move close to the fixed groove 21, and because the gold stripping body 23 is in contact with the outer ring 22, the gold stripping body 23 moves with the outer ring 22 under the action of gravity, and then the gold stripping body 23 also moves to the side close to the fixed groove 21, when the outer ring 22 contacts the fixed groove 21, at this time, the fixed groove 21, the outer ring 22 and the gold stripping body 23 form a closed gold stripping space, which is isolated from the inside of the machine body 1;

[0075] In the process of gold stripping treatment, the controller controls the water pump to start, the water pump delivers the washing liquid to the water inlet pipe 32 through the telescopic pipe, and then the washing liquid is delivered to the delivery groove 30 through the pipeline, because the adjacent two delivery grooves 30 are connected, the washing liquid is delivered from the outermost gold stripping ring 27 to the gold stripping ring 27 in the center position, finally the washing liquid is delivered to the plurality of water outlets 31 through the delivery groove 30, and is sprayed out of the wafer by the water outlet 31, so as to realize the effect of stripping the metal film on the surface of the wafer;

[0076] During the process of the flushing liquid flushing, the several stripping rings 27 are affected by the influence of the poking rod wheel 29 to produce the reciprocating movement state in the axial direction, and due to the different arrangement angles of the poking rod wheel 29, the stripping rings 27 present the wave-shaped movement state in the radial direction, so that the distance between the bottom of the stripping ring 27 and the wafer is constantly changing;

[0077] When the distance between the bottom of the outer stripping ring 27 and the wafer is constantly reduced, the flushing liquid sprayed by the adjacent stripping ring 27 will first meet the arc surface arranged at the bottom of the stripping ring 27, and then the flushing liquid will flow to the bottom of the outer stripping ring 27 under the influence of the arc surface, and due to the constantly reduced distance between the bottom of the outer stripping ring 27 and the wafer, the cross section of the flow passage through which the flushing liquid can flow is reduced, so that the flow rate of the flushing liquid at this time is increased, and then the impact on the metal film on the wafer surface is also greater, and then the effect of the stripping process is more obvious;

[0078] After the rotating motor is started, the fixed body 24 produces rotation through the rotation of the telescopic rod 12, and the fixed body 24 drives the fixed ring 25 to rotate in the process of rotation, and the fixed ring 25 drives the rotating groove 26 to rotate at the same time, and the fixed body 24 drives the rotating shaft 28 to rotate;

[0079] The fixed ring 25 drives the fixed rod 251 to rotate in the process of rotation, and due to the fact that the fixed rod 251 extends into the moving groove 271, the fixed rod 251 drives the several stripping rings 27 to rotate; after the rotating groove 26 is affected by the fixed body 24 to produce rotation, the rotating groove 26 drives the rotating shaft 28 to rotate, and the rotating shaft 28 drives the several poking rod wheels 29 to rotate at the same time, and at this time, the poking rod wheel 29 rotates around the axis of the fixed body 24;

[0080] Due to the fact that the poking rod wheel 29 rotates around the axis of the rotating shaft 28 under the action of the bevel gear 281, the poking rod wheel 29 contacts the top of the stripping ring 27 in the process of rotation, and then when the poking rod wheel 29 continues to rotate, the poking rod wheel 29 pushes the stripping ring 27 to move, so that the stripping ring 27 moves to the side close to the fixed groove 21, and at this time, the spring between the top of the moving groove 271 and the top of the fixed rod 251 is compressed, and the spring between the bottom of the moving groove 271 and the bottom of the fixed rod 251 is stretched;

[0081] When the poking rod wheel 29 compresses the stripping ring 27 to the maximum stroke, with the rotation of the poking rod wheel 29, the extrusion force of the poking rod wheel 29 on the stripping ring 27 is reduced, and then the stripping ring 27 is reset under the action of the spring force, so that the stripping ring 27 always presents the reciprocating movement state along the axis of the stripping ring 27;

[0082] Due to the engagement of the bevel gear 281 and the tooth ring 221, the rotation of the groove 26 drives the rotation shaft 28 to rotate around the axis of the gold stripping body 23, so that the rotation shaft 28 drives the bevel gear 281 to rotate, and the bevel gear 281 rotates around the axis of the gold stripping body 23 while being engaged with the tooth ring 221, so that the bevel gear 281 rotates around the axis of the gold stripping body 23 while being influenced by the tooth ring 221 to produce self-rotation, and then the bevel gear 281 drives the rotation shaft 28 to rotate, and the rotation shaft 28 drives the plurality of lever wheels 29 to rotate in the process of self-rotation;

[0083] Due to the difference in the arrangement angle of the adjacent two lever wheels 29 and the one-to-one correspondence between the lever wheel 29 and the gold stripping ring 27, the lever wheel 29 contacts the top of the gold stripping ring 27 and drives the gold stripping ring 27 to move up and down in the process of rotation, so that the plurality of gold stripping rings 27 present a wave-shaped movement track.

[0084] Through the wave-shaped reciprocating movement of the plurality of gold stripping rings 27, the flushing liquid continuously flows from the center of the wafer to the edge of the wafer, and in the process of continuously reducing the distance between the gold stripping ring 27 and the wafer surface, the flow rate is gradually increased, which further enhances the effect of the metal film separating from the wafer surface.

[0085] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and not restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and range of the equivalent elements of the claims are intended to be embraced in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.

Claims

1. An environmentally friendly wafer gold stripping device for a VCSEL chip, characterized by: The utility model provides a stripping gold body, stripping gold body is composed of fixed groove (21), outer ring (22) and stripping gold body (23), fixed groove (21) is located the bottom surface of body (1), outer ring (22) is located the top of fixed groove (21), and the side of outer ring (22) away from fixed groove (21) is provided with stripping gold body (23); The stripping gold body (23) is composed of a fixed body (24) and a fixed ring (25), the bottom of the fixed body (24) is provided with the fixed ring (25), the outer wall of the fixed ring (25) is slidably connected with the inner part of the outer ring (22), the fixed body (24) is provided with a rotating groove (26) inside, and the fixed ring (25) is provided with a plurality of stripping rings (27) inside, and the plurality of stripping rings (27) are combined into a concentric ring structure; The fixed ring (25) is also provided with a plurality of fixed rods (251) inside, the plurality of stripping rings (27) are provided with a plurality of moving grooves (271) inside, the fixed rods (251) extend into the moving grooves (271), the fixed rods (251) are slidably connected with the moving grooves (271), the upper and lower sides of the fixed rods (251) are both provided with springs, one end of the springs is connected with the moving grooves (271), and the other end of the springs is connected with the fixed rods (251); The rotating groove (26) is provided with a rotating shaft (28) inside, a plurality of lever wheels (29) are arranged on the shaft wall of the rotating shaft (28), the lever wheels (29) correspond to the stripping rings (27) one by one, and the lever wheels (29) are rotatably connected with the stripping rings (27); The two ends of the rotating shaft (28) are provided with bevel gears (281), the top of the outer ring (22) is provided with a toothed ring (221), and the bevel gears (281) are meshed and transmitted with the toothed ring (221); The arrangement angles of the two adjacent lever wheels (29) are different; The stripping rings (27) are provided with conveying grooves (30) inside, the two adjacent conveying grooves (30) are communicated with each other, the side of the stripping rings (27) close to the outer ring (22) is provided with an inclined surface, the side of the stripping rings (27) away from the outer ring (22) is provided with a curved surface, a plurality of water injection ports (31) are arranged on the side of the stripping rings (27) located on the inclined surface, the water injection ports (31) are communicated with the conveying grooves (30), the top of the outermost stripping ring (27) is provided with a water inlet pipe (32), the water inlet pipe (32) is communicated with the conveying grooves (30) through a pipeline, a water pump is arranged in the body (1), and the water pump is communicated with the water inlet pipe (32) through an extension pipe.

2. The environmentally friendly wafer gold stripping device for a VCSEL chip according to claim 1, characterized in that: The two sides of the body (1) are provided with moving arms (11), the moving arms (11) are connected with the outer wall of the outer ring (22), a moving motor is arranged in the moving arm (11), a driving shaft of the moving motor is provided with a transmission wheel, the transmission wheel is in frictional contact with the outer wall of the body (1), and the outer ring (22) is slidably connected with the fixed groove (21).

3. The environmentally friendly wafer gold stripping device for a VCSEL chip according to claim 1, characterized in that: The top of the machine body (1) is provided with a rotating motor, the drive shaft of the rotating motor is provided with a telescopic rod (12), the telescopic rod (12) is connected with a gold stripping body (23) near one side of the fixed groove (21), and the gold stripping body (23) is in surface contact with the outer ring (22).

4. A gold stripping process applied to the environment-friendly wafer gold stripping device for a VCSEL chip according to any one of claims 1-3, characterized in that: The gold stripping process comprises the following specific steps: S1, placing the chip wafer in the fixed groove (21); S2, moving the outer ring (22) to the side close to the fixed groove (21), and moving the gold stripping body (23) along with the movement of the outer ring; S3, the fixed groove (21), the outer ring (22) and the gold stripping body (23) form a closed gold stripping space; S4, the water pump delivers the washing liquid to the gold stripping ring (27) through the pipeline; S5, the gold stripping ring (27) performs gold stripping treatment on the wafer in the form of wave-like reciprocating motion; S6, after the gold stripping treatment is completed, the outer ring (22) drives the gold stripping body (23) to reset; S7, taking out the wafer from the fixed groove (21).

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