High-temperature-resistant acrylic foam tape and production process thereof
By combining modified acrylate polymers with high-temperature resistant monomers and modified monomers to form a three-dimensional cross-linked network, the problem of softening and failure of foam tape in high-temperature environments is solved, achieving stable adhesion performance and strong bonding strength in high-temperature environments, thus expanding its application range.
Patent Information
- Application Number
- CN202511067265.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-31
- Publication Date
- 2025-11-14
AI Technical Summary
Existing foam tapes are prone to softening, flowing, and failure in high-temperature environments, resulting in insufficient bonding strength and difficulty in maintaining stable adhesive performance and physical integrity in high-temperature environments, thus limiting their application in high-temperature environments.
Modified acrylate polymers were used as adhesives. By introducing high-temperature resistant monomers and modified monomers, a three-dimensional cross-linked network was formed to enhance the thermal stability and bonding strength of the material. High-temperature resistant acrylic foam tapes were prepared by using specific solvents and curing agents in appropriate proportions.
It improves the high-temperature resistance and bonding strength of the tape, making it suitable for extreme scenarios such as new energy vehicle battery packaging and heat dissipation of aerospace electronic equipment, while maintaining excellent long-term adhesion and mechanical properties.
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Figure CN120944468A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of foam tape, specifically to a high-temperature resistant acrylic foam tape and its manufacturing process. Background Technology
[0002] Foam tape, as an important functional adhesive material, is widely used in electronics, automotive manufacturing, aerospace, and architectural decoration due to its excellent cushioning, sealing, shock absorption, and filling capabilities. Especially in scenarios such as new energy vehicle battery module packaging, LED heat dissipation structure fixing, high-temperature electronic component assembly, and engine compartment wiring harness fixing, the tape must not only withstand long-term mechanical vibration and complex stress, but also maintain stable adhesive performance and physical integrity in high-temperature environments.
[0003] Most existing foam tapes utilize adhesives that are prone to softening, flowing, or even failing at high temperatures. Furthermore, most adhesives have low glass transition temperatures; at high temperatures, the increased movement of molecular chain segments can cause the adhesive layer to soften, rheologically change, or even decompose. When the temperature consistently exceeds a certain threshold, the colloid is prone to oxidative cross-linking or chain breakage, leading to a sharp decline in adhesive strength, collapse of cohesion, and ultimately, debonding failure. Besides low temperature limits, the adhesion strength retention rate of existing products in high-temperature environments is far from meeting industrial requirements. After a period of aging at high temperatures, the peel strength of conventional foam tapes decreases significantly, with some products even losing all adhesion. This decline stems from the thermal degradation of the polymer chains in the adhesive layer and the migration and precipitation of tackifying resins. Even under short-term high-temperature conditions, the tape's modulus drops sharply, leading to deterioration of interfacial wetting ability and difficulty in forming effective bonds, resulting in insufficient initial adhesion strength. In alternating hot and cold cycles, the mismatch in thermal expansion coefficients between the adhesive layer and the substrate generates internal stress, accelerating interfacial debonding and causing a cyclical decline in adhesion strength.
[0004] In summary, the deficiencies in high-temperature resistance and bonding strength of existing foam tapes severely restrict their application in special scenarios such as high-temperature operations and high-strength connections. With the increasing demands on material performance from industrial production and daily life, the development of new foam tapes with excellent high-temperature resistance and high bonding strength has become an urgent need for industry development, and is of great significance for promoting technological upgrades in related industries and improving product quality and safety. Summary of the Invention
[0005] The purpose of this invention is to provide a high-temperature resistant acrylic foam tape and its manufacturing process.
[0006] The objective of this invention can be achieved through the following technical solutions: A high-temperature resistant acrylic foam tape includes a release paper layer and an adhesive layer; the adhesive layer is made from the following raw materials measured in parts by weight: 32-50 parts of modified acrylate polymer, 0.5-1.8 parts of foaming agent, 0.4-1.2 parts of curing agent, 0.2-0.6 parts of dispersant, and 55-78 parts of first solvent.
[0007] Furthermore, the preparation method of the modified acrylate polymer includes the following steps: H1: Disperse the soft monomer, hard monomer, high-temperature resistant monomer, and modified monomer in three-quarters of the second solvent, and stir at 300-500 r / min for 30-45 min to obtain the reaction monomer solution. H2: Dissolve the initiator in one-quarter of the amount of the second solvent to obtain the initiator solution; H3: Add one-tenth of the reactant monomer solution to the reactor, heat to 85-90℃, add one-third of the initiator solution, stir and react for 1-1.5h, then add the remaining reactant monomer solution dropwise. After the dropwise addition is complete, add the remaining initiator solution, raise the temperature to 80-85℃, keep the reaction at this temperature for 10-12h, then cool to room temperature and discharge the material to obtain the modified acrylate polymer.
[0008] Furthermore, the mass ratio of the soft monomer, hard monomer, high-temperature resistant monomer, modified monomer, initiator, and second solvent is 40-62:5-10:2.8-4.5:2.5-4.2:0.2-0.5:95-195.
[0009] Further, the soft monomer is ethyl acrylate or butyl acrylate; the hard monomer is methyl methacrylate or vinyl acetate; the initiator is azobisisobutyronitrile or benzoyl peroxide; and the second solvent is ethyl acetate or toluene.
[0010] Furthermore, the preparation method of the high-temperature resistant monomer is as follows: Under nitrogen protection, N,N-dimethylformamide, N,N'-(1,4-phenylene)bismaleimide, 4,4'-diaminodiphenyl sulfone, and copper acetate were added to the reactor while stirring. The reaction solution was then heated to 120-125°C and reacted for 12-16 hours. After the reaction was completed, the insoluble matter and solvent were removed, and the mixture was purified and dried to obtain the high-temperature resistant monomer.
[0011] Furthermore, the molar ratio of 4,4'-diaminodiphenyl sulfone to N,N'-(1,4-phenylene)bismaleimide is 1:1.1-1.2.
[0012] Through the above technical solution, under the catalysis of copper acetate, the double bond in N,N'-(1,4-phenylene)bismaleimide undergoes Michael addition polymerization with the amino group in 4,4'-diaminodiphenyl sulfone. By controlling the excess of N,N'-(1,4-phenylene)bismaleimide, an alkenyl-terminated high-temperature resistant monomer is generated.
[0013] Furthermore, the method for preparing the modified monomer includes the following steps: S1: Add hydroxyapatite to acetic acid solution and stir for 10-15 min. Then add 3-(2,3-epoxypropoxy)propyltrimethoxysilane and heat the reaction solution to 80-85℃. React for 1.5-2 h. After the reaction is completed, centrifuge to separate the solid material, wash and dry it to obtain the ready-to-use material. S2: Under nitrogen protection, chloroform, spare material, and di(methacryloyloxyethyl) hydrogen phosphate are added to the reactor and stirred evenly. Then the temperature is raised to 50-60℃ and the reaction is carried out for 24-26 hours. After the reaction is completed, the reaction solution is centrifuged, purified, and the product is vacuum dried to obtain the modified monomer.
[0014] Furthermore, in step S1, the pH value of the acetic acid solution is 3.5-4.5.
[0015] Using the above technical solution, hydroxyapatite is modified with 3-(2,3-epoxypropoxy)propyltrimethoxysilane to graft epoxy groups onto the surface of hydroxyapatite, thus obtaining a ready-made product. Under high temperature conditions, the epoxy groups in the ready-made product undergo a ring-opening reaction with the phosphate groups in di(methacryloyloxyethyl) hydrogen phosphate, ultimately yielding hydroxyapatite with a large number of unsaturated alkenyl functional groups on its surface, i.e., the modified monomer.
[0016] Further, the foaming agent is any one of hydrazine derivatives, aminourea derivatives, azoformamides, and tetrazolium derivatives; the curing agent is an isocyanate curing agent or an epoxy curing agent; the dispersant is any one of fatty alcohols, ethylene oxide condensates, and sodium polyacrylate; and the first solvent is any one of ethyl acetate, dimethyl carbonate, toluene, and isopropanol.
[0017] A production process for high-temperature resistant acrylic foam tape includes the following steps: Step 1: Add the modified acrylate polymer, foaming agent, and dispersant to the first solvent and stir in a high-speed mixer at 3000-4000 r / min for 2.5-3.5 h. Then add the curing agent, disperse evenly, and let stand for 2-3 h to obtain the adhesive layer for later use. Step 2: Apply the adhesive layer to one side of the release paper layer, heat it in an oven at 90-95℃ for 5-6 hours to make acrylic foam tape.
[0018] The beneficial effects of this invention are: (1) The sulfone unit and imide structure in the high-temperature resistant monomer structure prepared by the present invention have rigid planar structure and high bond energy, which can effectively improve the glass transition temperature and heat distortion temperature of the material, significantly improve the thermal stability of the acrylate polymer, and thus make the acrylic foam tape have excellent high-temperature resistance and expand its application in a variety of high-temperature conditions.
[0019] (2) The terminal double bonds in the modified monomer structure prepared by the present invention can undergo free radical copolymerization with other monomers containing double bonds under the action of an initiator to form a three-dimensional cross-linked network. This combination can effectively improve the compatibility between hydroxyapatite and acrylate matrix. At the same time, the rigid hydroxyapatite core can restrict the high-temperature creep of molecular chains and enhance the intermolecular cohesion. The cross-linked network enhances the mechanical locking between molecular chains through chemical covalent bonds, thereby enabling the acrylic foam tape to maintain excellent adhesion for a long time and also has excellent tensile and other mechanical properties, which improves its market competitiveness.
[0020] (3) The foam tape of the present invention has excellent high temperature resistance, strong adhesion and tensile strength, and is suitable for extreme scenarios such as new energy vehicle battery packaging and heat dissipation of aviation electronic equipment.
[0021] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description
[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 The infrared spectrum of the high-temperature resistant monomer in Example 1 of this invention; Figure 2 The graph shows the thermogravimetric analysis of hydroxyapatite, spare material, and modified monomer in Example 1 of the present invention, where (A) is hydroxyapatite, (B) is spare material, and (C) is modified monomer. Detailed Implementation
[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0025] Example 1 A high-temperature resistant acrylic foam tape includes a release paper layer and an adhesive layer; the adhesive layer comprises the following raw materials in parts by weight: 32 parts modified acrylate polymer, 0.5 parts p-toluenesulfonyl hydrazine, 0.4 parts toluene-2,3-diisocyanate, 0.2 parts glyceryl monostearate, and 55 parts toluene; The manufacturing process of the acrylic foam tape includes the following steps: Step 1: Add the modified acrylate polymer, p-toluenesulfonyl hydrazine, and glyceryl stearate to toluene and stir in a high-speed mixer at 3000 r / min for 2.5 h. Then add toluene-2,3-diisocyanate, disperse evenly, and let stand for 2 h to obtain the adhesive layer for later use. Step 2: Apply the adhesive layer to one side of the release paper layer, heat it in a 90℃ oven for 6 hours, and the acrylic foam tape is produced.
[0026] The preparation method of the modified acrylate polymer includes the following steps: H1: Dissolve 42g ethyl acrylate, 6g methyl methacrylate, 4.2g high-temperature resistant monomer, and 2.8g modified monomer in 72g ethyl acetate, and stir at 400r / min for 40min to obtain the reaction monomer solution; H2: Dissolve 0.3g of benzoyl peroxide in 25g of ethyl acetate to obtain an initiator solution; H3: Add one-tenth of the reactant monomer solution to the reactor, heat to 85°C, add one-third of the initiator solution, stir and react for 1 hour, then add the remaining reactant monomer solution dropwise over 3 hours. After the addition is complete, add the remaining initiator solution, raise the temperature to 82°C, keep the reaction at this temperature for 11 hours, then cool to room temperature and discharge the product to obtain the modified acrylate polymer.
[0027] The specific method for preparing the high-temperature resistant monomer is as follows: Under nitrogen protection, 500 mL of N,N-dimethylformamide, 7.2 g of N,N'-(1,4-phenylene)bismaleimide, 5.3 g of 4,4'-diaminodiphenyl sulfone, and 0.7 g of copper acetate were added to the reactor while stirring. The mixture was then heated to 120 °C and reacted for 12 h. After the reaction was completed, the insoluble matter and solvent were removed, and the mixture was purified and dried to obtain the high-temperature resistant monomer.
[0028] Figure 1 The infrared spectrum of the high-temperature resistant monomer, with 3248 cm⁻¹ -1 The characteristic absorption peak for secondary amine nitrogen-hydrogen bonds is 3010 cm⁻¹. -1 The characteristic absorption peak of a carbon-carbon double bond is 3098 cm⁻¹. -13090cm -1 3078cm -1 The characteristic absorption peaks for carbon-hydrogen bonds in the benzene ring are 3000–2800 cm⁻¹. -1 The characteristic absorption peak for methylene C-H bonds is 1680 cm⁻¹. -1 The characteristic absorption peak of the carbonyl carbon-oxygen double bond of imide is 1362 cm⁻¹. -1 The characteristic absorption peak of the carbon-nitrogen bond in the imide ring is 1130 cm⁻¹. -1 The peak is a characteristic absorption peak of a sulfone-oxygen double bond.
[0029] The method for preparing the modified monomer includes the following steps: S1: Add 4.5g of hydroxyapatite to 300mL of acetic acid solution with pH 3.5, stir for 10min, then add 8.5g of 3-(2,3-epoxypropoxy)propyltrimethoxysilane, heat the reaction solution to 80℃, react for 1.5h, after the reaction is completed, centrifuge to separate the solid material, wash and dry it to obtain the ready-to-use material; S2: Under nitrogen protection, add 500 mL of chloroform, 6.3 g of spare material, and 4.1 g of di(methacryloyloxyethyl) hydrogen phosphate to the reactor, stir until homogeneous, then heat to 50 °C and react for 24 h. After the reaction is complete, centrifuge the reaction solution, purify it, and then vacuum dry the product to obtain the modified monomer.
[0030] Figure 2 The graphs show the thermogravimetric analysis (TGA) curves of hydroxyapatite, the spare material, and the modified monomer. (A) represents hydroxyapatite, (B) represents the spare material, and (C) represents the modified monomer. The graphs show that at 1200℃, the final mass retention rate of hydroxyapatite is 96.3%, with the loss due to the evaporation of its water of crystallization. The final mass retention rate of the spare material is 86.2%, with the loss due to the decomposition of the silane coupling agent grafted onto its surface. The final mass retention rate of the modified monomer is 78.2%, with the loss due to the decomposition of the organic matter grafted onto the surface of the hydroxyapatite.
[0031] Example 2 A high-temperature resistant acrylic foam tape includes a release paper layer and an adhesive layer; the adhesive layer comprises the following raw materials in parts by weight: 48 parts modified acrylate polymer, 0.6 parts p-toluenesulfonyl hydrazine, 0.6 parts toluene-2,3-diisocyanate, 0.4 parts glyceryl monostearate, and 60 parts toluene; The manufacturing process of the acrylic foam tape includes the following steps: Step 1: Add the modified acrylate polymer, p-toluenesulfonyl hydrazine, and glyceryl stearate to toluene and stir for 3 hours in a high-speed mixer at 3500 rpm. Then add toluene-2,3-diisocyanate, disperse evenly, and let stand for 2.5 hours to obtain the adhesive layer for later use. Step 2: Apply the adhesive layer to one side of the release paper layer and heat it in a 92℃ oven for 5.5 hours to produce acrylic foam tape.
[0032] The preparation method of the modified acrylate polymer is the same as in Example 1.
[0033] Example 3 A high-temperature resistant acrylic foam tape includes a release paper layer and an adhesive layer; the adhesive layer comprises the following raw materials in parts by weight: 50 parts modified acrylate polymer, 1.8 parts p-toluenesulfonyl hydrazine, 1.2 parts toluene-2,3-diisocyanate, 0.6 parts glyceryl monostearate, and 78 parts toluene; The manufacturing process of the acrylic foam tape includes the following steps: Step 1: Add the modified acrylate polymer, p-toluenesulfonyl hydrazine, and glyceryl stearate to toluene and stir in a high-speed mixer at 4000 r / min for 3.5 h. Then add toluene-2,3-diisocyanate, disperse evenly, and let stand for 3 h to obtain the adhesive layer for later use. Step 2: Apply the adhesive layer to one side of the release paper layer, heat it in a 95℃ oven for 5 hours, and the acrylic foam tape is produced.
[0034] The preparation method of the modified acrylate polymer is the same as in Example 1.
[0035] Comparative Example 1 A high-temperature resistant acrylic foam tape includes a release paper layer and an adhesive layer; the adhesive layer comprises the following raw materials in parts by weight: 48 parts modified acrylate polymer, 0.6 parts p-toluenesulfonyl hydrazine, 0.6 parts toluene-2,3-diisocyanate, 0.4 parts glyceryl monostearate, and 60 parts toluene; The manufacturing process of the acrylic foam tape includes the following steps: Step 1: Add the modified acrylate polymer, p-toluenesulfonyl hydrazine, and glyceryl stearate to toluene and stir for 3 hours in a high-speed mixer at 3500 rpm. Then add toluene-2,3-diisocyanate, disperse evenly, and let stand for 2.5 hours to obtain the adhesive layer for later use. Step 2: Apply the adhesive layer to one side of the release paper layer and heat it in a 92℃ oven for 5.5 hours to produce acrylic foam tape.
[0036] The preparation method of the modified acrylate polymer differs from that of Example 1 in that no high-temperature resistant monomer is added, but all other aspects are the same.
[0037] Comparative Example 2 A high-temperature resistant acrylic foam tape includes a release paper layer and an adhesive layer; the adhesive layer comprises the following raw materials in parts by weight: 48 parts modified acrylate polymer, 0.6 parts p-toluenesulfonyl hydrazine, 0.6 parts toluene-2,3-diisocyanate, 0.4 parts glyceryl monostearate, and 60 parts toluene; The manufacturing process of the acrylic foam tape includes the following steps: Step 1: Add the modified acrylate polymer, p-toluenesulfonyl hydrazine, and glyceryl stearate to toluene and stir for 3 hours in a high-speed mixer at 3500 rpm. Then add toluene-2,3-diisocyanate, disperse evenly, and let stand for 2.5 hours to obtain the adhesive layer for later use. Step 2: Apply the adhesive layer to one side of the release paper layer and heat it in a 92℃ oven for 5.5 hours to produce acrylic foam tape.
[0038] The preparation method of the modified acrylate polymer differs from that of Example 1 in that no modified monomer is added, but all other aspects are the same.
[0039] Comparative Example 3 A high-temperature resistant acrylic foam tape includes a release paper layer and an adhesive layer; the adhesive layer comprises the following raw materials in parts by weight: 48 parts acrylic resin, 0.6 parts p-toluenesulfonyl hydrazine, 0.6 parts toluene-2,3-diisocyanate, 0.4 parts glyceryl monostearate, and 60 parts toluene; The manufacturing process of the acrylic foam tape includes the following steps: Step 1: Add acrylic resin, p-toluenesulfonyl hydrazine, and glyceryl stearate to toluene and stir for 3 hours in a high-speed mixer at 3500 rpm. Then add toluene-2,3-diisocyanate, disperse evenly, and let stand for 2.5 hours to obtain an adhesive layer for later use. Step 2: Apply the adhesive layer to one side of the release paper layer and heat it in a 92℃ oven for 5.5 hours to produce acrylic foam tape.
[0040] The acrylic resin was purchased from Shanghai McLean Biochemical Technology Co., Ltd., with product number P815681.
[0041] Test case The acrylic foam tapes prepared in Examples 1-3 and Comparative Examples 1-3 were used as test samples. Peel strength was tested according to standard GB / T 2792-2014; tensile strength was tested according to standard GB / T 30776-2014. Test samples of the same batch and specifications were placed in an environment at 85℃ for 5 days, then removed and allowed to cool naturally before being tested for peel strength again. The test results are shown in the table below: Analysis of the test data shows that the acrylic foam tapes prepared in Examples 1-3 have good high-temperature resistance, bonding strength and tensile strength; Comparative Example 1 contains modified monomers, so its bonding strength and tensile strength are stronger than those of Comparative Example 2 and Comparative Example 3; Comparative Example 2 contains high-temperature resistant monomers, so its high-temperature resistance is stronger than that of Comparative Example 1 and Comparative Example 3; Comparative Example 3 contains neither high-temperature resistant monomers nor modified monomers, so it performs the worst in terms of high-temperature resistance, bonding strength and tensile strength.
[0042] The above description is merely an example and illustration of the concept of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the concept of the invention or exceed the scope defined in the claims, they should all fall within the protection scope of the present invention.
Claims
1. A high-temperature resistant acrylic foam tape, characterized in that, It includes a release paper layer and an adhesive layer; the adhesive layer is made from the following raw materials measured in parts by weight: 32-50 parts of modified acrylate polymer, 0.5-1.8 parts of foaming agent, 0.4-1.2 parts of curing agent, 0.2-0.6 parts of dispersant, and 55-78 parts of first solvent.
2. The high-temperature resistant acrylic foam tape according to claim 1, characterized in that, The method for preparing the modified acrylate polymer includes the following steps: H1: Disperse the soft monomer, hard monomer, high-temperature resistant monomer, and modified monomer in three-quarters of the second solvent, and stir at 300-500 r / min for 30-45 min to obtain the reaction monomer solution. H2: Dissolve the initiator in one-quarter of the amount of the second solvent to obtain the initiator solution; H3: Add one-tenth of the reactant monomer solution to the reactor, heat to 85-90℃, add one-third of the initiator solution, stir and react for 1-1.5h, then add the remaining reactant monomer solution dropwise. After the dropwise addition is complete, add the remaining initiator solution, raise the temperature to 80-85℃, keep the reaction at this temperature for 10-12h, then cool to room temperature and discharge the material to obtain the modified acrylate polymer.
3. The high-temperature resistant acrylic foam tape according to claim 2, characterized in that, The mass ratio of the soft monomer, hard monomer, high-temperature resistant monomer, modified monomer, initiator, and second solvent is 40-62:5-10:2.8-4.5:2.5-4.2:0.2-0.5:95-195.
4. A high-temperature resistant acrylic foam tape according to claim 2 or 3, characterized in that, The soft monomer is ethyl acrylate or butyl acrylate; the hard monomer is methyl methacrylate or vinyl acetate; the initiator is azobisisobutyronitrile or benzoyl peroxide; and the second solvent is ethyl acetate or toluene.
5. The high-temperature resistant acrylic foam tape according to claim 2, characterized in that, The specific method for preparing the high-temperature resistant monomer is as follows: Under nitrogen protection, N,N-dimethylformamide, N,N'-(1,4-phenylene)bismaleimide, 4,4'-diaminodiphenyl sulfone, and copper acetate were added to the reactor while stirring. The reaction solution was then heated to 120-125°C and reacted for 12-16 hours. After the reaction was completed, the insoluble matter and solvent were removed, and the mixture was purified and dried to obtain the high-temperature resistant monomer.
6. The high-temperature resistant acrylic foam tape according to claim 5, characterized in that, The molar ratio of 4,4'-diaminodiphenyl sulfone to N,N'-(1,4-phenylene)bismaleimide is 1:1.1-1.
2.
7. The high-temperature resistant acrylic foam tape according to claim 2, characterized in that, The method for preparing the modified monomer includes the following steps: S1: Add hydroxyapatite to acetic acid solution and stir for 10-15 min. Then add 3-(2,3-epoxypropoxy)propyltrimethoxysilane and heat the reaction solution to 80-85℃. React for 1.5-2 h. After the reaction is completed, centrifuge to separate the solid material, wash and dry it to obtain the ready-to-use material. S2: Under nitrogen protection, chloroform, spare material, and di(methacryloyloxyethyl) hydrogen phosphate are added to the reactor and stirred evenly. Then the temperature is raised to 50-60℃ and the reaction is carried out for 24-26 hours. After the reaction is completed, the reaction solution is centrifuged, purified, and the product is vacuum dried to obtain the modified monomer.
8. The high-temperature resistant acrylic foam tape according to claim 7, characterized in that, In step S1, the pH value of the acetic acid solution is 3.5-4.
5.
9. The high-temperature resistant acrylic foam tape according to claim 1, characterized in that, The foaming agent is any one of hydrazine derivatives, aminourea derivatives, azoformamides, and tetrazolium derivatives; the curing agent is an isocyanate curing agent or an epoxy curing agent; the dispersant is any one of fatty alcohols, ethylene oxide condensates, and sodium polyacrylate; and the first solvent is any one of ethyl acetate, dimethyl carbonate, toluene, and isopropanol.
10. A production process for high-temperature resistant acrylic foam tape as described in claim 1, characterized in that, Includes the following steps: Step 1: Add the modified acrylate polymer, foaming agent, and dispersant to the first solvent and stir in a high-speed mixer at 3000-4000 r / min for 2.5-3.5 h. Then add the curing agent, disperse evenly, and let stand for 2-3 h to obtain the adhesive layer for later use. Step 2: Apply the adhesive layer to one side of the release paper layer, heat it in an oven at 90-95℃ for 5-6 hours to make acrylic foam tape.
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