Water vapor control method, water vapor generating device, water vapor control device and PVD (Physical Vapor Deposition) equipment

Abstract

The invention relates to a water vapor control method, a water vapor generation device, a water vapor control device and PVD deposition equipment. The method is applied to a controller of a water vapor generating device, the water vapor generating device comprises a first pipeline, a second pipeline and a water storage module, the water storage module is provided with an air inlet and an air outlet, and carrier gas flows into the water storage module through the air inlet via the first pipeline, flows out of the air outlet and then flows into a battery coating process cavity through the second pipeline. The method comprises the following steps: acquiring a water vapor partial pressure value of a cavity body of a process cavity; and under the condition that the water vapor partial pressure value is out of a preset range, adjusting a to-be-adjusted parameter according to the water vapor partial pressure value based on an association relationship between the water vapor partial pressure value and the to-be-adjusted parameter until the adjusted water vapor partial pressure value is within the preset range. By adopting the method, the accuracy and the stability can be improved.

Description

Technical Field

[0001] This application relates to the field of battery manufacturing technology, and in particular to a water vapor control method, a water vapor generating device, a water vapor control device, and a PVD deposition equipment. Background Technology

[0002] PVD (Physical Vapor Deposition) coating is a technology that uses physical processes to transform materials from a solid state through evaporation or sputtering into a gaseous state, and then deposits them as a thin film on a substrate surface. In battery coating processes, the water vapor content within the cavity affects the performance of the thin film and the efficiency of heterojunction batteries; therefore, it is necessary to control the water vapor content within the cavity.

[0003] In related technologies, moisture is adsorbed from the environment and introduced into the cavity via a carrier plate and silicon wafer, then released under high temperature and sputtering conditions, with a cold trap used to control the moisture content within the cavity. However, this method is highly susceptible to the influence of the workshop environment, and the use of a combination of new and old carrier plates can lead to moisture imbalance within the cavity. This results in significant fluctuations in battery efficiency and ultimately, lower efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide a water vapor control method, water vapor generator, water vapor control device, and PVD deposition equipment that can improve the accuracy and stability of the above-mentioned technical problems.

[0005] In a first aspect, this application provides a water vapor control method, which is applied to a controller of a water vapor generating device. The water vapor generating device includes a first pipe, a second pipe, and a water storage module. The water storage module is provided with an air inlet and an air outlet. A carrier gas flows through the first pipe, enters the water storage module through the air inlet, and exits through the air outlet before flowing into the battery coating process chamber through the second pipe. The method includes:

[0006] Obtain the water vapor partial pressure value of the cavity of the process chamber;

[0007] If the water vapor partial pressure value is outside the preset range, the parameter to be adjusted is adjusted according to the correlation between the water vapor partial pressure value and the parameter to be adjusted, until the adjusted water vapor partial pressure value is within the preset range. The parameter to be adjusted includes at least one of the pressure of the water storage module, the flow rate of the carrier gas corresponding to the carrier gas, and the temperature corresponding to the water storage module.

[0008] In one embodiment, adjusting the parameter to be adjusted based on the water vapor partial pressure value includes:

[0009] Based on the adjustment priority of the parameter to be adjusted, the parameter to be adjusted is adjusted sequentially according to the water vapor partial pressure value, wherein the adjustment priority is determined based on the response time of the parameter to be adjusted and the correlation between the parameter to be adjusted and the parameters of the process chamber.

[0010] In one embodiment, the parameters to be adjusted include the pressure of the water storage module, the flow rate of the carrier gas, and the temperature of the water storage module. The adjustment of the parameters based on their adjustment priority, according to the water vapor partial pressure values, includes:

[0011] Based on the water vapor partial pressure value, the pressure of the water storage module, the flow rate of the carrier gas, and the temperature of the water storage module are adjusted sequentially.

[0012] In one embodiment, adjusting the parameter to be adjusted based on the water vapor partial pressure value includes:

[0013] When the water vapor partial pressure value is greater than the maximum value of the preset range, the pressure of the water storage module is increased by a first adjustment step; when the water vapor partial pressure value is less than the minimum value of the preset range, the pressure of the water storage module is decreased by a second adjustment step.

[0014] In one embodiment, adjusting the parameter to be adjusted based on the water vapor partial pressure value includes:

[0015] If the water vapor partial pressure is greater than the maximum value of the preset range, the carrier gas flow rate is reduced by a third adjustment step; if the water vapor partial pressure is less than the minimum value of the preset range, the carrier gas flow rate is increased by a fourth adjustment step.

[0016] In one embodiment, adjusting the parameter to be adjusted based on the water vapor partial pressure value includes:

[0017] If the water vapor partial pressure value is greater than the maximum value of the preset range, the temperature of the water storage module is decreased by the fifth adjustment step; if the water vapor partial pressure value is less than the minimum value of the preset range, the temperature of the water storage module is increased by the sixth adjustment step.

[0018] In one embodiment, after adjusting the parameter to be adjusted according to the water vapor partial pressure value, the method further includes:

[0019] If the parameter to be adjusted has been adjusted to a preset threshold and the water vapor partial pressure of the cavity is outside the preset range, a warning message is sent.

[0020] Secondly, this application also provides a water vapor generating device, the device including a controller, a first pipe, a second pipe, and a water storage module. The water storage module is provided with an air inlet and an air outlet. The carrier gas flows through the first pipe, enters the water storage module through the air inlet, and flows out through the air outlet and then enters the battery coating process chamber through the second pipe.

[0021] The controller is used to acquire the partial pressure of water vapor in the process chamber; if the partial pressure of water vapor is outside the preset range, the controller adjusts the parameter to be adjusted based on the correlation between the partial pressure of water vapor and the parameter to be adjusted, until the adjusted partial pressure of water vapor is within the preset range. The parameter to be adjusted includes at least one of the pressure of the water storage module, the flow rate of the carrier gas corresponding to the carrier gas, and the temperature corresponding to the water storage module.

[0022] Thirdly, this disclosure also provides a water vapor control device that controls a water vapor generating device, the water vapor control device comprising:

[0023] The acquisition module is used to acquire the water vapor partial pressure value of the cavity of the process chamber;

[0024] An adjustment module is used to adjust the parameter to be adjusted based on the correlation between the water vapor partial pressure value and the parameter to be adjusted when the water vapor partial pressure value is outside the preset range, until the adjusted water vapor partial pressure value is within the preset range. The parameter to be adjusted includes at least one of the pressure of the water storage module, the flow rate of the carrier gas corresponding to the carrier gas, and the temperature corresponding to the water storage module.

[0025] Fourthly, this disclosure also provides a PVD deposition apparatus, which includes a loading chamber, a process chamber, an unloading chamber, and a return mechanism. The return mechanism is in a sealed state, and the apparatus includes the water vapor generator described in this disclosure, wherein the water vapor generator is connected to the process chamber.

[0026] The aforementioned water vapor control method, water vapor generator, water vapor control device, and PVD deposition equipment acquire the water vapor partial pressure value of the process chamber. When the water vapor partial pressure value is outside a preset range, the parameters to be adjusted are adjusted based on the correlation between the water vapor partial pressure value and the parameters to be adjusted, until the adjusted water vapor partial pressure value is within the preset range. The adjustment parameters include at least one of the following: the pressure of the water storage module, the carrier gas flow rate, and the temperature of the water storage module. This achieves rapid and precise control of the water vapor content within the process chamber. In this embodiment, the water vapor generator introduces water vapor into the process chamber through a carrier gas flow through the water storage module. This eliminates the need for a carrier plate or silicon wafer to absorb water vapor and is unaffected by factors such as the age of the carrier plate. This effectively improves the accuracy and stability of water vapor content control within the process chamber and is suitable for more application scenarios. Furthermore, by adjusting the pressure, carrier gas flow rate, and temperature of the water storage module in multiple dimensions, the accuracy and reliability of water vapor content control within the process chamber are further ensured. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a flowchart illustrating a water vapor control method in one embodiment;

[0029] Figure 2 This is a schematic diagram of the structure of a water vapor generator in one embodiment;

[0030] Figure 3 This is a schematic diagram of the PVD deposition equipment in one embodiment;

[0031] Figure 4 This is a schematic diagram of a water vapor control method in one embodiment;

[0032] Figure 5 This is a structural block diagram of a water vapor control device in one embodiment. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0034] In one embodiment, such as Figure 1As shown, a water vapor control method is provided. The method is applied to the controller of a water vapor generator. The water vapor generator includes a first pipe, a second pipe, and a water storage module. The water storage module is provided with an air inlet and an air outlet. A carrier gas flows through the first pipe, through the air inlet into the water storage module, and flows out through the air outlet before flowing through the second pipe into the battery coating process chamber. The method includes:

[0035] Step S110: Obtain the water vapor partial pressure value of the process cavity;

[0036] For example, during battery coating, such as PVD coating, the moisture content within the process chamber affects the film performance. Therefore, this embodiment provides a moisture generator, including a first pipe, a second pipe, and a water storage module. The water storage module has an inlet and an outlet. The inlet is connected to the first pipe, and the outlet is connected to the second pipe, which connects to the battery coating process chamber. During coating, carrier gas flows in from the first pipe, through the inlet, through the water storage module, and out through the outlet before flowing into the battery coating process chamber via the second pipe. Because moisture is present in the water storage module, the carrier gas carries moisture into the battery coating process chamber as it flows through, ensuring that the moisture content within the process chamber meets the coating requirements. In some examples, the moisture generator is connected to the process chamber in a PVD deposition apparatus.

[0037] In some possible implementations, the water storage module stores a certain amount of water and also includes a heating unit to heat the water in the water storage module, so that there is a certain amount of water vapor in the water storage module, which is convenient for the carrier gas to carry to the process chamber.

[0038] Figure 2 This is a schematic diagram of a water vapor generating device according to an exemplary embodiment, with reference to... Figure 2 As shown, the carrier gas flows out from the gas distribution box, enters the inlet of the water storage module (i.e., the water tank) through the first pipe, carries water vapor through the outlet into the second pipe, and then flows into the process chamber. The first pipe is equipped with a mass flow controller to regulate the carrier gas flow rate; the water storage module is equipped with a heating wire to regulate its temperature; a vacuum pressure gauge is installed in the water storage module to measure its pressure; a pressure controller is installed on the second pipe to regulate its pressure; valves are also installed on the first and second pipes to control the flow and shut-off of the carrier gas; a residual gas analyzer is installed in the process chamber to measure the water vapor partial pressure within the chamber; and a vacuum pump is connected to the process chamber to create a vacuum environment.

[0039] Figure 3This is a schematic diagram of a PVD deposition apparatus according to one embodiment. The apparatus includes a loading chamber (C1 void-breaking chamber), an unloading chamber (C8 void-breaking chamber), a process chamber, and a return mechanism (lower return mechanism), wherein the return mechanism is sealed. In some examples, the apparatus also includes a loading rack, an unloading rack, a heating chamber, and a CDA for air compression. The process chamber is equipped with a residual gas analyzer for detecting moisture content. In some examples, there may be multiple process chambers for coating different locations of the battery film (e.g., front and back, upper and lower cathodes). Each process chamber is connected to a moisture generator (i.e., a moisture generator) to control the moisture content within the process chamber. Depending on the process requirements, different process chambers can correspond to different preset ranges of moisture content, which can be determined based on the actual application scenario. The heating chamber may also include a cold trap, which significantly improves the vacuum level through low-temperature adsorption, protecting the equipment and improving film quality.

[0040] In one embodiment, to further improve the accuracy and stability of moisture content control and reduce moisture adsorption by the carrier plate outside the cavity, specifically, the automated loading and unloading system and the main machine's bottom return transmission are sealed to prevent a large amount of external moisture from entering the bottom return transmission and automation. The main machine's bottom return transmission uses CDA purging, with the CDA pressure controlled at 4–6 MPa. This CDA purging minimizes moisture adsorption by the carrier plate during the bottom return transmission and automation. Simultaneously, moisture is removed from the carrier plate within the PVD heating chamber. In some examples, the heating temperatures of C2 and C3 are adjusted to 100–150°C, and the residence time of the carrier plate in the heating chamber is increased to 10–15 seconds. The cold trap strongly adsorbs water vapor, removing as much moisture as possible from the carrier plate in a short time, ensuring that the water vapor state of the new and old carrier plates is basically the same before entering the process chamber. In addition, water vapor is circulated and stably controlled in the process chamber. Water vapor is circulated into the process chamber through a water vapor generator, and the water vapor partial pressure in the chamber is monitored by an RGA. There is a closed-loop control between the RGA and the water vapor generator. The RGA feeds back to the water vapor generator to adjust the water flow rate (the variables for adjustment include carrier gas flow rate, water tank temperature, and water tank pressure), so that the water vapor partial pressure in the process chamber is always controlled within the process window required for PVD coating, maintaining the stability of cell efficiency during PVD production.

[0041] Optionally, the partial pressure of water vapor within the process chamber can be obtained. This partial pressure can be measured by a preset measurement unit, which may include an RGA (Residual Gas Analyzer). The partial pressure of water vapor characterizes the water vapor content in the mixed gas within the process chamber. A higher partial pressure indicates a higher water vapor content, while a lower partial pressure indicates a lower water vapor content.

[0042] Step S120: If the water vapor partial pressure value is outside the preset range, the parameter to be adjusted is adjusted according to the water vapor partial pressure value based on the correlation between the water vapor partial pressure value and the parameter to be adjusted, until the adjusted water vapor partial pressure value is within the preset range. The parameter to be adjusted includes at least one of the pressure of the water storage module, the flow rate of the carrier gas corresponding to the carrier gas, and the temperature corresponding to the water storage module.

[0043] For example, the obtained water vapor partial pressure value is evaluated. The preset range can be determined based on the actual application scenario. In some examples, the preset range can be set according to the process requirements of battery coating, and different battery coating scenarios can correspond to different preset ranges. When the water vapor partial pressure value is within the preset range, it can be considered that the water vapor content in the process cavity meets the current process requirements; when the water vapor partial pressure value is outside the preset range, it can be considered that the water vapor content in the process cavity does not meet the current process requirements and further adjustments are needed.

[0044] Optionally, if the water vapor partial pressure value is outside a preset range, the parameter to be adjusted is adjusted based on the correlation between the water vapor partial pressure value and the parameter to be adjusted. The parameter to be adjusted can be a device parameter affecting the water vapor content within the process chamber, and its specific value can be determined according to the actual application scenario. In some examples, the correlation between the water vapor partial pressure value and the parameter to be adjusted can include a qualitative relationship or a quantitative relationship. The parameter to be adjusted can include one or more parameters. If there are multiple parameters to be adjusted, they can be adjusted simultaneously or sequentially, depending on the actual application scenario.

[0045] For example, after adjusting the parameter to be adjusted, the water vapor partial pressure value is obtained again for judgment. If it is still outside the preset range, adjustment continues until the adjusted water vapor partial pressure value is within the preset range. In some examples, when adjusting the parameter to be adjusted, it can be adjusted step by step according to a preset step size to ensure the accuracy of the adjustment. In some examples, after the adjustment is completed, the water vapor partial pressure value in the cavity is continuously monitored.

[0046] This embodiment discloses a controller applied to a water vapor generator. It acquires the partial pressure of water vapor in the process chamber. When the partial pressure is outside a preset range, it adjusts the parameter based on the correlation between the partial pressure and the parameter to be adjusted, until the adjusted partial pressure falls within the preset range. The adjustment parameter includes at least one of the following: pressure of the water storage module, flow rate of the carrier gas, and temperature of the water storage module. This achieves rapid and precise control of the water vapor content within the process chamber. In this embodiment, the water vapor generator introduces water vapor into the process chamber through a carrier gas flow through the water storage module. This eliminates the need for a carrier plate or silicon wafer to absorb water vapor, and is unaffected by factors such as the age of the carrier plate. This effectively improves the accuracy and stability of water vapor content control within the process chamber, making it suitable for a wider range of applications. Furthermore, by adjusting the pressure, flow rate, and temperature of the water storage module, the accuracy and reliability of water vapor content control within the process chamber are further ensured.

[0047] In one embodiment, adjusting the parameter to be adjusted based on the water vapor partial pressure value includes:

[0048] Based on the adjustment priority of the parameter to be adjusted, the parameter to be adjusted is adjusted sequentially according to the water vapor partial pressure value, wherein the adjustment priority is determined based on the response time of the parameter to be adjusted and the correlation between the parameter to be adjusted and the parameters of the process chamber.

[0049] For example, different adjustable parameters correspond to different adjustment priorities. In some examples, the adjustment priority is determined based on the response time of the adjustable parameter and the correlation between the adjustable parameter and the parameters of the process chamber. In some possible implementations, the parameters of the process chamber may include the process parameters corresponding to the process chamber, such as the vacuum level, which can be determined according to the actual application scenario. When adjusting, efforts should be made to ensure that the parameters of the process chamber meet the process requirements.

[0050] In some examples, a longer response time indicates a slower response speed and a lower priority; a greater impact on the parameters of the process chamber also indicates a lower priority; by combining the response time and the impact on the parameters of the process chamber, the adjustment priority of the parameter to be adjusted is determined.

[0051] Optionally, when adjusting the parameters to be adjusted according to the adjustment priority, the next parameter to be adjusted can be adjusted when the current parameter to be adjusted is adjusted to the corresponding threshold and the water vapor partial pressure value is still outside the preset range; or multiple parameters to be adjusted can be adjusted sequentially according to a preset step size, which can be determined according to the actual application scenario.

[0052] In this embodiment, when adjusting the parameters to be adjusted, the parameters to be adjusted are adjusted sequentially based on their adjustment priority, which further improves the accuracy of water vapor content control in the process chamber. The adjustment priority is determined based on the response time of the parameters to be adjusted and the correlation between the parameters to be adjusted and the parameters of the process chamber, which takes into account both the timeliness of water vapor control response and the stability of the process chamber, and is applicable to more application scenarios.

[0053] In one embodiment, the parameters to be adjusted include the pressure of the water storage module, the flow rate of the carrier gas, and the temperature of the water storage module. The adjustment of the parameters to be adjusted based on their adjustment priority and according to the water vapor partial pressure values ​​includes:

[0054] Based on the water vapor partial pressure value, the pressure of the water storage module, the flow rate of the carrier gas, and the temperature of the water storage module are adjusted sequentially.

[0055] For example, the parameters to be adjusted can be set as the pressure of the water storage module, the flow rate of the carrier gas, and the temperature of the water storage module. When adjusting, the pressure of the water storage module, the flow rate of the carrier gas, and the temperature of the water storage module are adjusted sequentially.

[0056] Optionally, adjusting the pressure control of the water storage module has a fast response time and a short response duration, and has little impact on the parameters of the process chamber, so it has the highest adjustment priority; adjusting the carrier gas flow rate will affect the parameters of the process chamber (such as vacuum degree), but the response time is short, so it has the second highest adjustment priority; adjusting the temperature control of the water storage module has a slow response time and a long response duration, and is prone to fluctuation, so it has the lowest adjustment priority; that is, the pressure adjustment priority of the water storage module is greater than the carrier gas flow rate adjustment priority, which is greater than the temperature adjustment priority of the water storage module.

[0057] In this embodiment, the pressure, carrier gas flow rate, and temperature of the water storage module are adjusted sequentially, taking into account the accuracy of water vapor content regulation, the timeliness of response, and the stability within the process chamber. By adjusting multiple parameters sequentially, the efficiency and reliability of water vapor content regulation are improved, avoiding the problem of low efficiency caused by adjusting a single parameter, and making it suitable for more application scenarios.

[0058] In one embodiment, adjusting the parameter to be adjusted based on the water vapor partial pressure value includes:

[0059] When the water vapor partial pressure value is greater than the maximum value of the preset range, the pressure of the water storage module is increased by a first adjustment step; when the water vapor partial pressure value is less than the minimum value of the preset range, the pressure of the water storage module is decreased by a second adjustment step.

[0060] For example, the higher the pressure of the water storage module, the higher the boiling point of water, the lower the water vapor content in the water storage module, the less water vapor is carried from the carrier gas to the process chamber, and the lower the water vapor content in the process chamber, the lower the corresponding water vapor partial pressure value. During adjustment, if the water vapor partial pressure value exceeds the maximum value of the preset range, it indicates that the water vapor content in the process chamber is too high, and it is necessary to reduce the water vapor in the process chamber by adjusting the parameters to be adjusted. In this case, the pressure of the water storage module is increased according to the first adjustment step size to reduce the water vapor carried from the water storage module to the process chamber by the carrier gas. The first adjustment step size can be determined based on the actual application scenario.

[0061] Optionally, the lower the pressure of the water storage module, the lower the boiling point of water, the higher the water vapor content in the water storage module, the more water vapor the carrier gas carries from the water storage module to the process chamber, and the higher the water vapor content in the process chamber, the higher the corresponding water vapor partial pressure value. During adjustment, if the water vapor partial pressure value is less than the minimum value of the preset range, it indicates that the water vapor content in the process chamber is too low. It is necessary to increase the water vapor content in the process chamber by adjusting the parameters to be adjusted. In this case, the pressure of the water storage module is decreased according to the second adjustment step size to increase the water vapor carried from the water storage module to the process chamber by the carrier gas. The second adjustment step size can be determined based on the actual application scenario.

[0062] In some examples, a pressure gauge can be installed in the water storage module to detect its pressure. Pressure adjustments can be made using a pressure regulating unit, which can be a device selected based on the specific application scenario. In some examples, a pressure controller, i.e., a pressure regulating unit, can be installed on a second pipeline, allowing for pressure control of the water storage module.

[0063] In this embodiment, when the partial pressure of water vapor is high, the pressure of the water storage module is increased to reduce the water vapor carried into the process chamber by the carrier gas, thereby reducing the water vapor content. When the partial pressure of water vapor is low, the pressure of the water storage module is decreased to increase the water vapor carried into the process chamber by the carrier gas, thereby increasing the water vapor content. This achieves rapid and accurate adjustment of the water vapor content in the process chamber.

[0064] In one embodiment, adjusting the parameter to be adjusted based on the water vapor partial pressure value includes:

[0065] If the water vapor partial pressure is greater than the maximum value of the preset range, the carrier gas flow rate is reduced by a third adjustment step; if the water vapor partial pressure is less than the minimum value of the preset range, the carrier gas flow rate is increased by a fourth adjustment step.

[0066] For example, the smaller the carrier gas flow rate, the less water vapor is carried from the water storage module to the process chamber, resulting in a lower water vapor content in the process chamber and a lower corresponding water vapor partial pressure. During adjustment, if the water vapor partial pressure exceeds the maximum value of the preset range, it indicates that the water vapor content in the process chamber is too high, requiring adjustment of the parameters to be adjusted to reduce the water vapor content. In this case, the carrier gas flow rate is reduced according to the third adjustment step size to decrease the water vapor carried from the water storage module to the process chamber. The third adjustment step size can be determined based on the actual application scenario.

[0067] Optionally, a higher carrier gas flow rate results in more water vapor being carried from the water storage module to the process chamber, leading to a higher water vapor content and corresponding higher water vapor partial pressure. During adjustment, if the water vapor partial pressure is less than the minimum value within the preset range, it indicates that the water vapor content in the process chamber is too low. This necessitates increasing the water vapor content by adjusting the parameters to be adjusted. In this case, the carrier gas flow rate is increased according to the fourth adjustment step, thereby increasing the water vapor carried from the water storage module to the process chamber. The fourth adjustment step can be determined based on the actual application scenario.

[0068] In some examples, sensors can be installed in the first and / or second pipes to detect the carrier gas flow rate. Adjustments to the carrier gas flow rate can be made using a flow control unit, which can be a device determined based on the specific application scenario for flow regulation. In some examples, a mass flow controller, i.e., a flow control unit, can be installed on the first pipe to control the magnitude of the carrier gas flow rate.

[0069] In this embodiment, when the partial pressure of water vapor is high, the carrier gas flow rate is reduced to reduce the water vapor carried into the process chamber by the carrier gas, thereby reducing the water vapor content. When the partial pressure of water vapor is low, the carrier gas flow rate is increased to increase the water vapor carried into the process chamber by the carrier gas, thereby increasing the water vapor content. This achieves rapid and accurate adjustment of the water vapor content in the process chamber.

[0070] In one embodiment, adjusting the parameter to be adjusted based on the water vapor partial pressure value includes:

[0071] If the water vapor partial pressure value is greater than the maximum value of the preset range, the temperature of the water storage module is decreased by the fifth adjustment step; if the water vapor partial pressure value is less than the minimum value of the preset range, the temperature of the water storage module is increased by the sixth adjustment step.

[0072] For example, the lower the temperature of the water storage module, the less water vapor content in the water storage module, the less water vapor is carried from the carrier gas to the process chamber, and the lower the water vapor content in the process chamber, the lower the corresponding water vapor partial pressure value. During adjustment, if the water vapor partial pressure value exceeds the maximum value of the preset range, it indicates that the water vapor content in the process chamber is too high, and it is necessary to reduce the water vapor in the process chamber by adjusting the parameter to be adjusted. At this time, the temperature of the water storage module is lowered according to the fifth adjustment step, reducing the water vapor carried from the water storage module to the process chamber by the carrier gas. The fifth adjustment step can be determined based on the actual application scenario.

[0073] Optionally, the higher the temperature of the water storage module, the higher the water vapor content in the water storage module, the more water vapor the carrier gas carries from the water storage module to the process chamber, and the higher the water vapor content in the process chamber, the higher the corresponding water vapor partial pressure value. During adjustment, if the water vapor partial pressure value is less than the minimum value of the preset range, it indicates that the water vapor content in the process chamber is too low. It is necessary to increase the water vapor content in the process chamber by adjusting the parameter to be adjusted. In this case, the temperature of the water storage module is increased according to the sixth adjustment step, increasing the amount of water vapor carried from the water storage module to the process chamber by the carrier gas. The sixth adjustment step can be determined based on the actual application scenario.

[0074] In some examples, a temperature sensor can be installed in the water storage module to detect its temperature, which is the water temperature within the module. Adjustments to the water storage module's temperature can be made using a temperature control unit, which can be a device determined based on the specific application scenario to regulate the water temperature within the module. In some examples, a heating wire and a cooling unit (i.e., the temperature control unit) can be installed in the water storage module to control the water temperature.

[0075] In this embodiment, when the water vapor partial pressure is high, the temperature of the water storage module is reduced to decrease the water vapor content in the water storage module, thereby reducing the water vapor carried into the process cavity by the carrier gas and lowering the water vapor content. When the water vapor partial pressure is low, the temperature of the water storage module is increased to increase the water vapor content in the water storage module, thereby increasing the water vapor carried into the process cavity by the carrier gas and raising the water vapor content. This achieves rapid and accurate adjustment of the water vapor content in the process cavity.

[0076] In one embodiment, after adjusting the parameter to be adjusted according to the water vapor partial pressure value, the method further includes:

[0077] If the parameter to be adjusted has been adjusted to a preset threshold and the water vapor partial pressure of the cavity is outside the preset range, a warning message is sent.

[0078] For example, each parameter to be adjusted corresponds to a preset threshold. In some possible implementations, each parameter to be adjusted has two preset thresholds, corresponding to an upper limit and a lower limit, respectively. When adjusting the parameters to be adjusted, if all parameters to be adjusted have been adjusted to the preset threshold in the current adjustment direction (upward / downward), but the water vapor partial pressure is still outside the preset range, it can be considered that the device may be faulty and needs to be investigated, and an early warning message should be sent.

[0079] Optionally, different adjustable parameters correspond to different preset thresholds, which can be determined based on the actual application scenario. In some examples, the preset threshold can be determined based on the relationship between the adjustable parameter and the operating parameters of the water vapor generator. When the adjustable parameter exceeds the preset threshold, it can be considered that it may affect the operating state of the water vapor generator. Therefore, the adjustable parameter must be within the range corresponding to the preset threshold during adjustment.

[0080] In this embodiment, the parameter to be adjusted corresponds to a preset threshold. When the parameter to be adjusted is adjusted to the preset threshold but the water vapor partial pressure in the cavity is still outside the preset range, it can be considered that there may be a fault in the water vapor generating device or process cavity. An early warning message is sent to prompt relevant personnel to troubleshoot the fault in a timely manner, which effectively improves the stability and reliability of the water vapor control process and the battery coating process.

[0081] Figure 4 This is a schematic diagram illustrating a water vapor control method according to an exemplary embodiment, with reference to... Figure 4As shown, the water tank of the steam generator has a pressure gauge that monitors the pressure P1, with a range of 0.1–0.4 MPa. This gauge provides real-time feedback on the actual pressure changes in the water tank and monitors for leaks in the steam generator during standby. A heating wire is inserted into the water tank to control the water temperature T2; T2 is set to a temperature of 25–50°C. Carrier gas flows from the gas box on the first pipeline and its flow rate F is controlled by an MFC (mass flow controller) to enter the water tank. The MFC has a range of 0–1000 sccm, and each end of the MFC has a valve to control the gas flow. A PC100 (Pressure Control) pressure controller is located on the second pipe connected to the gas outlet. The PC100 controls the pressure P3 within the range of 5–150 kPa. By controlling the water tank pressure P2, the boiling point temperature T1 of the water can be controlled, thereby controlling the water vapor content in the water tank. The approximate empirical relationship between the water tank pressure P2 and the water boiling point temperature T1 is ln(P2) = 9.3876 - 3826.36 / (T2 - 45.47). There is also a valve at each end of the PC100 that can control the gas flow. The second pipe is wrapped with a heating tape and set to a temperature T3 to ensure that water vapor does not condense in the pipe. The T3 setting temperature is 45–65°C. The carrier gas carries the water vapor through the second pipe into the cavity for dissociation. The water vapor content in the cavity can be measured by an RGA residual gas analyzer. By changing the carrier gas flow rate F in the water vapor device, the PC100 pressure P3, and the water tank temperature T2, the water vapor content entering the cavity can be controlled.

[0082] During adjustment, a suitable process window (i.e., preset range) for the partial pressure of water vapor is set according to the actual process requirements. In some examples, the required partial pressure of H2O is N1. The fluctuation of N1 value by σ is defined as being within the normal process window range. N2 is the partial pressure of H2O in the chamber fed back by RGA in real time. When N2 > N1 + σ or N2 < N1 - σ, it will be fed back to the water vapor device for automatic parameter adjustment until N1 - σ < N2 < N1 + σ.

[0083] The automatic parameter adjustment sequence is as follows: PC100 (pressure), carrier gas flow rate, and water tank temperature (temperature of the water storage module). For example, when N2 > N1 + σ, the closed-loop program prioritizes increasing the PC100 pressure control P3 to increase the saturated vapor pressure of the water in the tank, thereby reducing the water vapor carried away by the carrier gas. The adjustment range of P3 is 0.5–2 kPa each time. When P3 is adjusted to its maximum range but N2 > N1 + σ is still present, the closed-loop program then controls the MFC to decrease the carrier gas flow rate F to reduce the amount of carrier gas and thus reduce the water vapor carried away. The adjustment range of F is 5–10 sccm each time. When F is adjusted to its maximum value of 5 sccm but N2 > N1 + σ is still present, the closed-loop program finally controls the reduction of the water tank temperature T2 to decrease the water vapor content in the tank and reduce the water vapor carried away by the carrier gas. The adjustment range of T2 is 1–5℃ each time, with a minimum adjustment value of 25℃. The adjustment logic is the same when N2 < N1 - σ, but the parameter adjustment direction is reversed.

[0084] By adjusting the three parameters in the aforementioned water vapor generator, N2 is adjusted to the range of N1-σ < N2 < N1+σ. If N2 > N1+σ or N2 < N1-σ is still present even when all three parameters are adjusted to their upper and lower limits, an alarm will be triggered on the host computer to check for problems in the entire closed-loop device.

[0085] In this embodiment, closed-loop control independently controls the water vapor content of the membrane at different locations, keeping the water vapor content stably within the process window and achieving stable control of battery efficiency.

[0086] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0087] Based on the same inventive concept, this application also provides a water vapor generating device. The solution provided by this device is similar to the solution described in the above method. Therefore, the specific limitations in the following embodiments can be found in the limitations of the water vapor control method above, and will not be repeated here. In an exemplary embodiment, a water vapor generating device is provided. The device includes a controller, a first pipe, a second pipe, and a water storage module. The water storage module is provided with an air inlet and an air outlet. The carrier gas flows through the first pipe, enters the water storage module through the air inlet, and exits through the air outlet before flowing into the battery coating process chamber through the second pipe.

[0088] The controller is used to acquire the partial pressure of water vapor in the process chamber; if the partial pressure of water vapor is outside the preset range, the controller adjusts the parameter to be adjusted based on the correlation between the partial pressure of water vapor and the parameter to be adjusted, until the adjusted partial pressure of water vapor is within the preset range. The parameter to be adjusted includes at least one of the pressure of the water storage module, the flow rate of the carrier gas corresponding to the carrier gas, and the temperature corresponding to the water storage module.

[0089] Based on the same inventive concept, this application also provides a water vapor control device for implementing the water vapor control method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations of one or more water vapor control device embodiments provided below can be found in the limitations of the water vapor control method above, and will not be repeated here.

[0090] In one exemplary embodiment, such as Figure 5 As shown, a water vapor control device 500 is provided, which controls the water vapor generating device as described in the above embodiment. The water vapor control device includes:

[0091] The acquisition module 510 is used to acquire the water vapor partial pressure value of the cavity of the process chamber;

[0092] The adjustment module 520 is used to adjust the parameter to be adjusted based on the correlation between the water vapor partial pressure value and the parameter to be adjusted when the water vapor partial pressure value is outside the preset range, until the adjusted water vapor partial pressure value is within the preset range. The parameter to be adjusted includes at least one of the pressure of the water storage module, the flow rate of the carrier gas corresponding to the carrier gas, and the temperature corresponding to the water storage module.

[0093] In one embodiment, the adjustment module is further configured to:

[0094] Based on the adjustment priority of the parameter to be adjusted, the parameter to be adjusted is adjusted sequentially according to the water vapor partial pressure value, wherein the adjustment priority is determined based on the response time of the parameter to be adjusted and the correlation between the parameter to be adjusted and the parameters of the process chamber.

[0095] In one embodiment, the parameters to be adjusted include the pressure of the water storage module, the flow rate of the carrier gas, and the temperature of the water storage module. The adjustment module is further configured to:

[0096] Based on the water vapor partial pressure value, the pressure of the water storage module, the flow rate of the carrier gas, and the temperature of the water storage module are adjusted sequentially.

[0097] In one embodiment, the adjustment module is further configured to:

[0098] When the water vapor partial pressure value is greater than the maximum value of the preset range, the pressure of the water storage module is increased by a first adjustment step; when the water vapor partial pressure value is less than the minimum value of the preset range, the pressure of the water storage module is decreased by a second adjustment step.

[0099] In one embodiment, the adjustment module is further configured to:

[0100] If the water vapor partial pressure is greater than the maximum value of the preset range, the carrier gas flow rate is reduced by a third adjustment step; if the water vapor partial pressure is less than the minimum value of the preset range, the carrier gas flow rate is increased by a fourth adjustment step.

[0101] In one embodiment, the adjustment module is further configured to:

[0102] If the water vapor partial pressure value is greater than the maximum value of the preset range, the temperature of the water storage module is decreased by the fifth adjustment step; if the water vapor partial pressure value is less than the minimum value of the preset range, the temperature of the water storage module is increased by the sixth adjustment step.

[0103] In one embodiment, the device is further used to:

[0104] If the parameter to be adjusted has been adjusted to a preset threshold and the water vapor partial pressure of the cavity is outside the preset range, a warning message is sent.

[0105] Each module in the aforementioned water vapor control device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0106] In one exemplary embodiment, a PVD deposition apparatus is also provided, the apparatus including a loading chamber, a process chamber, an unloading chamber, and a return mechanism, the return mechanism being in a sealed state, and the apparatus including the water vapor generator described in the embodiments of this disclosure, wherein the water vapor generator is connected to the process chamber.

[0107] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0108] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for controlling water vapor, characterized in that, The method is applied to the controller of a water vapor generator, which includes a first pipe, a second pipe, and a water storage module. The water storage module is provided with an air inlet and an air outlet. A carrier gas flows through the first pipe, enters the water storage module through the air inlet, exits through the air outlet, and then flows through the second pipe into the battery coating process chamber. The method includes: Obtain the water vapor partial pressure value of the cavity of the process chamber; If the water vapor partial pressure value is outside the preset range, the parameter to be adjusted is adjusted according to the correlation between the water vapor partial pressure value and the parameter to be adjusted, until the adjusted water vapor partial pressure value is within the preset range. The parameter to be adjusted includes at least one of the pressure of the water storage module, the flow rate of the carrier gas corresponding to the carrier gas, and the temperature corresponding to the water storage module.

2. The method according to claim 1, characterized in that, The adjustment of the parameter to be adjusted based on the water vapor partial pressure value includes: Based on the adjustment priority of the parameter to be adjusted, the parameter to be adjusted is adjusted sequentially according to the water vapor partial pressure value, wherein the adjustment priority is determined based on the response time of the parameter to be adjusted and the correlation between the parameter to be adjusted and the parameters of the process chamber.

3. The method according to claim 2, characterized in that, The parameters to be adjusted include the pressure of the water storage module, the flow rate of the carrier gas, and the temperature of the water storage module. The adjustment of these parameters based on their adjustment priority, according to the water vapor partial pressure values, includes: Based on the water vapor partial pressure value, the pressure of the water storage module, the flow rate of the carrier gas, and the temperature of the water storage module are adjusted sequentially.

4. The method according to claim 1, characterized in that, The adjustment of the parameter to be adjusted based on the water vapor partial pressure value includes: When the water vapor partial pressure value is greater than the maximum value of the preset range, the pressure of the water storage module is increased by a first adjustment step; when the water vapor partial pressure value is less than the minimum value of the preset range, the pressure of the water storage module is decreased by a second adjustment step.

5. The method according to claim 1, characterized in that, The adjustment of the parameter to be adjusted based on the water vapor partial pressure value includes: If the water vapor partial pressure is greater than the maximum value of the preset range, the carrier gas flow rate is reduced by a third adjustment step; if the water vapor partial pressure is less than the minimum value of the preset range, the carrier gas flow rate is increased by a fourth adjustment step.

6. The method according to claim 1, characterized in that, The adjustment of the parameter to be adjusted based on the water vapor partial pressure value includes: If the water vapor partial pressure value is greater than the maximum value of the preset range, the temperature of the water storage module is decreased by the fifth adjustment step; if the water vapor partial pressure value is less than the minimum value of the preset range, the temperature of the water storage module is increased by the sixth adjustment step.

7. The method according to claim 1, characterized in that, After adjusting the parameter to be adjusted according to the water vapor partial pressure value, the method further includes: If the parameter to be adjusted has been adjusted to a preset threshold and the water vapor partial pressure of the cavity is outside the preset range, a warning message is sent.

8. A water vapor generating device, characterized in that, The device includes a controller, a first pipe, a second pipe, and a water storage module. The water storage module is provided with an air inlet and an air outlet. The carrier gas flows through the first pipe, enters the water storage module through the air inlet, and exits through the air outlet before flowing into the battery coating process chamber through the second pipe. The controller is used to acquire the partial pressure of water vapor in the process chamber; if the partial pressure of water vapor is outside the preset range, the controller adjusts the parameter to be adjusted based on the correlation between the partial pressure of water vapor and the parameter to be adjusted, until the adjusted partial pressure of water vapor is within the preset range. The parameter to be adjusted includes at least one of the pressure of the water storage module, the flow rate of the carrier gas corresponding to the carrier gas, and the temperature corresponding to the water storage module.

9. A water vapor control device, characterized in that, The water vapor control device controls the water vapor generating device, wherein the water vapor generating device is the water vapor generating device as described in claim 8, and the water vapor control device comprises: The acquisition module is used to acquire the water vapor partial pressure value of the cavity of the process chamber; An adjustment module is used to adjust the parameter to be adjusted based on the correlation between the water vapor partial pressure value and the parameter to be adjusted when the water vapor partial pressure value is outside the preset range, until the adjusted water vapor partial pressure value is within the preset range. The parameter to be adjusted includes at least one of the pressure of the water storage module, the flow rate of the carrier gas corresponding to the carrier gas, and the temperature corresponding to the water storage module.

10. A PVD deposition apparatus, characterized in that, The device includes a loading chamber, a process chamber, an unloading chamber, and a return mechanism, wherein the return mechanism is in a sealed state, and the device includes the water vapor generator as described in claim 8, wherein the water vapor generator is connected to the process chamber.

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