Semiconductor static parameter test fixing structure

Abstract

The invention relates to the technical field of semiconductors, and discloses a semiconductor static parameter test fixing structure which comprises a placement table, a first clamping block, a second clamping block, a third clamping block, a fourth clamping block, a first cover plate and a second cover plate. The clamping block I, the clamping block II, the clamping block III and the clamping block IV can be matched together to clamp and position the semiconductor device on the upper surface of the placing table, and define a heat-conducting glue accommodating cavity with an opening in the top together with the semiconductor device; a first flow channel is formed in the third clamping block, a second flow channel is formed in the fourth clamping block, an inlet of the second flow channel penetrates through the end, facing the semiconductor device, of the fourth clamping block, a guide pipe communicated with the second flow channel is fixed to the lower surface of the fourth clamping block, two collecting bottles are arranged below the fourth clamping block, and bottle openings of the two collecting bottles are alternately communicated with the guide pipe; the top opening of the heat-conducting glue accommodating cavity can be closed and opened by closing and opening the cover plate I and the cover plate II; automatic and comprehensive cleaning of the upper surface of the semiconductor device is achieved, and automatic and comprehensive collection of the heat-conducting glue is achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, specifically to a fixed structure for testing semiconductor static parameters. Background Technology

[0002] Steady-state thermal resistance of semiconductor devices is one of the important static parameters for evaluating their performance. In existing technologies, when measuring the steady-state thermal resistance of semiconductor devices, thermally conductive adhesive is uniformly coated on the surface of the semiconductor device to facilitate heat conduction, and then a sensor is attached to the thermally conductive adhesive to collect data.

[0003] To ensure consistent thermal adhesive thickness during continuous testing of multiple semiconductor device parameters, grooves are typically provided for mounting the semiconductor devices. The thickness of the thermal adhesive is the height from the top surface of the semiconductor device to the groove opening. Due to the small thickness of the thermal adhesive and the small surface area of ​​the semiconductor device, the four corners of the semiconductor device easily become hard-to-reach operation dead angles. This makes the cleaning of the semiconductor device surface before applying the thermal adhesive and the recycling of the thermal adhesive more troublesome, thus affecting the testing efficiency and the recycling effect of the thermal adhesive. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a fixed structure for testing semiconductor static parameters, which can effectively solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a fixed structure for testing semiconductor static parameters, comprising: A placement stage for supporting semiconductor devices, clamping block one, clamping block two, clamping block three and clamping block four, cover plate one, and cover plate two; Clamping blocks 1, 2, 3, and 4 work together to clamp and position the semiconductor device on the upper surface of the placement platform, forming a thermally conductive adhesive cavity with an open top. Clamping block 3 has a first flow channel that runs through its upper and lower surfaces. A duct interface connecting the first flow channel is installed on the lower surface of clamping block 3. Clamping block 4 has a second flow channel. The inlet of the second flow channel runs through the upper end of clamping block 4 facing the semiconductor device, and the outlet of the second flow channel runs through the lower surface of clamping block 4. A conduit connecting the second flow channel is fixed on the lower surface of clamping block 4. Two collection bottles are placed below clamping block 4, and the mouths of the two collection bottles are alternately connected to the conduit. The lower end of the cover plate one is provided with a third flow channel, which is used to connect the first flow channel and the thermal conductive adhesive cavity; by closing and opening the cover plate one and the cover plate two, the top opening of the thermal conductive adhesive cavity can be closed and opened.

[0006] Preferably, the outlet of the second flow channel is inclined downwards toward the upper surface of the semiconductor device and can be divided in two by the plane on which the upper surface of the semiconductor device is located.

[0007] Preferably, a first driving member is installed on both clamping block one and clamping block two, and the two first driving members work together to drive clamping block one and clamping block two to open and close; a second driving member is installed on both clamping block three and clamping block four, and the second driving member is used to drive clamping block three and clamping block four to open and close.

[0008] Preferably, the second driving component includes a driving unit, two pushers, two push rods, and two driving slots; the driving unit is used to drive the two pushers to perform opening and closing actions; the two pushers are respectively fixedly connected to a push rod, the two driving slots are respectively opened in clamping block three and clamping block four and both extend along the opening and closing direction of clamping block three and clamping block four, the two push rods extend into the two driving slots respectively, and each driving slot is provided with a push block, the push block being fixedly connected to the push rod.

[0009] Preferably, the length of the drive groove is greater than the length of the push block, the width of the push block is greater than the diameter of the push rod, and cover plate one and cover plate two are respectively fixed to the upper ends of the two push frames.

[0010] Preferably, it also includes a mounting platform, limit pins, and spring pillars. The limit pins and spring pillars are both mounted on the mounting platform and there are two of each. The two limit pins are used to keep clamping blocks three and four in the open state after they are opened, and the two spring pillars are used to keep clamping blocks three and four in the closed state after they are closed.

[0011] Preferably, the drive groove located in the clamping block four is a T-shaped groove that extends through the lower end of the clamping block four. The lower end of the push block located in the clamping block four is fixed with a slot frame. A drive frame is installed in the slot frame. The drive frame extends out of the slot frame and can mesh with the gear on the rotating shaft.

[0012] Preferably, it also includes a lifting unit, which is used to drive the drive frame to slide vertically along the slot frame; the drive frame can move on the lifting unit along the opening and closing directions of clamping block three and clamping block four.

[0013] Compared with the prior art, the present invention provides a fixed structure for testing semiconductor static parameters, which has the following advantages: 1. Clamping blocks one, two, three and four work together to clamp and position the semiconductor device on the surface of the placement stage, and together with the semiconductor device, they form a thermally conductive adhesive cavity with an open top, which makes it easy to control the coating thickness of the thermally conductive adhesive and ensures the uniformity of the coating.

[0014] 2. The opening at the top of the thermally conductive adhesive cavity can be closed and opened by closing and opening the cover plate one and cover plate two, and the cover plate one and cover plate two perform two opening and closing actions; when closing for the first time, clean air is introduced into the thermally conductive adhesive cavity to clean the cavity, ensuring automatic and comprehensive cleaning of the upper surface of the semiconductor device, avoiding cleaning dead corners, and achieving high cleaning efficiency; when closing for the second time, clean air is introduced into the thermally conductive adhesive cavity to blow the thermally conductive adhesive away from the cavity, achieving complete removal of the thermally conductive adhesive and avoiding residue; it also prevents substances in the thermally conductive adhesive cavity from flying above the cavity and contaminating the testing environment.

[0015] 3. By using two collection bottles to collect the cleaned dust and thermal adhesive respectively, the automatic and comprehensive collection of thermal adhesive is achieved; the thermal adhesive recycling operation is highly efficient. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a partial structural unfolded diagram of the mounting box; Figure 3 A schematic diagram showing the fit between the mounting platform, the second drive unit, clamping block three, and clamping block four; Figure 4 Cross-sectional views of the mounting platform, clamping block three, and clamping block four; Figure 5 This is a cross-sectional view of clamping block three; Figure 6 This is a cross-sectional view of clamping block four; Figure 7 for Figure 3 Enlarged view of the structure at point A in the middle; Figure 8 This is a cross-sectional view of the transposition plate, transposition block, and stop block.

[0017] The components are as follows: 1. Mounting box; 2. Mounting platform; 201. Test chamber; 202. First mounting chamber; 203. Second mounting chamber; 3. Placement platform; 4. Clamping block one; 5. Clamping block two; 6. Clamping block three; 601. First flow channel; 61. Tracheal interface; 7. Clamping block four; 701. Second flow channel; 71. Guide tube; 72. Rotating shaft; 721. Mounting plate; 73. Collection bottle; 8. Cover plate one; 801. Third flow channel; 9. Cover plate II; 10. Push frame; 11. Push rod; 12. Push block; 13. Slot frame; 14. Drive frame; 141. Transmission column; 142. Lifting spring; 15. Gear; 16. Shift plate; 161. Shift slot; 17. Shift block; 18. Stop block; 19. Limit pin; 20. Spring column; 21. Threading plate; 22. Motor I; 23. Positive and negative threaded screw; 24. Motor II; 25. Transmission screw. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figures 1 to 8 A semiconductor static parameter testing fixing structure includes a mounting box 1, a mounting platform 2 is embedded at the upper end of the mounting box 1, and a wire guide plate 21 is fixed at the lower edge of the mounting platform 2. The wire guide plate 21 is embedded in the mounting box 1, and the wire guide hole on the wire guide plate 21 connects the inner and outer spaces of the mounting box 1.

[0020] A test cavity 201 is provided in the center of the mounting platform 2. A first mounting cavity 202 is provided on both sides opposite to the test cavity 201 in the mounting platform 2. A second mounting cavity 203 is provided on the other two sides opposite to the test cavity 201 in the mounting platform 2. The test cavity 201, the first mounting cavity 202, and the second mounting cavity 203 all penetrate the upper and lower surfaces of the mounting platform 2, and the test cavity 201 connects the first mounting cavity 202 and the second mounting cavity 203.

[0021] The lower part of the test cavity 201 is fixed with a placement stage 3. The placement stage 3 is used to place semiconductor devices, and multiple pins are fixed inside the placement stage 3. One end of the pin is electrically connected to the semiconductor device, and the other end of the pin is connected to an external semiconductor device testing device through a wire harness. The wire harness passes through the wire hole and exits the internal space of the mounting box 1.

[0022] By using an external semiconductor device testing device and PIN pins, pre-set test parameters are applied to the semiconductor device, causing it to heat up and enter a heat transfer state. The sensor in the external semiconductor device testing device moves to the top of the semiconductor device and adheres to the thermally conductive adhesive coated on the top of the semiconductor device to sample data from the semiconductor device.

[0023] Clamping block 4 and clamping block 5 are slidably installed in the two first mounting cavities 202 respectively, and clamping block 6 and clamping block 7 are slidably installed in the two second mounting cavities 203 respectively. Clamping block 4, clamping block 5, clamping block 6 and clamping block 7 can work together to clamp and position the semiconductor device on the upper surface of the placement stage 3, and together with the semiconductor device, form a thermally conductive adhesive cavity with an open top.

[0024] Both clamping block 4 and clamping block 5 reciprocate relative to the semiconductor device via a first driving member; that is, the two first driving members work together to drive clamping block 4 and clamping block 5 to open and close. It should be noted that the first driving member is a cylinder, electric push rod, hydraulic cylinder, or other first driving device capable of outputting linear reciprocating motion; such as... Figure 3 An example of a first driving component is provided, which includes a second motor 24 and a transmission screw 25 fixed on the output shaft of the second motor 24. The housing of the second motor 24 is fixed to the lower end of the mounting platform 2. The transmission screw 25 is connected to a first clamping block 4 or a second clamping block 5. The second motor 24 drives the transmission screw 25 to move forward and backward, thereby realizing the reciprocating linear movement of the first clamping block 4 or the second clamping block 5 relative to the semiconductor device.

[0025] Clamping blocks 3 (6) and 4 (7) are connected together by a second driving member, which drives clamping blocks 3 (6) and 4 (7) to open and close. It should be noted that the second driving member is a cylinder with two output ends, a motor with two output ends, or other second driving device that can simultaneously drive clamping blocks 3 (6) and 4 (7) to move and open and close. like Figure 2 , Figure 3 and Figure 4 An example of a second drive unit is provided, which includes a motor 22, a forward and reverse threaded rod 23, two pushers 10 and two push rods 11, wherein the housing of the motor 22 is fixed in the mounting box 1, the output end of the motor 22 is fixedly connected to the forward and reverse threaded rod 23, the two pushers 10 are respectively screwed to the two threads of the forward and reverse threaded rod 23, and a push rod 11 is fixedly connected to the inner side of each of the two pushers 10, and the two push rods 11 are respectively connected to the clamping block 6 and the clamping block 7 for transmission. The housing of motor 22 is fixed inside the mounting box 1. Motor 22 and the forward and reverse threaded rods 23 together form a drive unit for driving the two pushers 10 to open and close. The forward and reverse drive unit realizes the opening and closing of the two push rods 11 through the opening and closing of the two pushers 10, and then realizes the opening and closing of clamping block 6 and clamping block 7.

[0026] It should be noted that the connecting wires of motor 1 22 and motor 2 24 both pass through the wire holes on the wire guide plate 21 and exit the inner cavity of the mounting box 1, and are electrically connected to the external semiconductor device testing equipment.

[0027] As a further explanation of the above technical solution, since the upper surface of the semiconductor device needs to be cleaned before filling the thermal conductive adhesive cavity to ensure the accuracy of thermal conduction of the thermal conductive adhesive in the cavity, the semiconductor static parameter testing fixing structure also has the following settings.

[0028] like Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 8As shown, the upper surfaces of clamping block 1 4, clamping block 2 5, clamping block 3 6, and clamping block 4 7 are flush. Clamping block 3 6 and clamping block 4 7 are distributed opposite to each other. Cover plate 1 8 and cover plate 2 9 are slidably installed on the upper surfaces of clamping block 3 6 and clamping block 4 7, respectively. Cover plate 1 8 and cover plate 2 9 have the same thickness. By closing and opening cover plate 1 8 and cover plate 2 9, the top opening of the thermal conductive adhesive cavity can be closed and opened.

[0029] The clamping block 3 6 has a first flow channel 601 inside, which runs through the upper and lower surfaces of the clamping block 3 6. The lower surface of the clamping block 3 6 is equipped with an air pipe interface 61 that connects to the first flow channel 601. The air pipe interface 61 is connected to an external air source through an air pipe. The external air source is controlled by an external semiconductor device testing device. The lower end of the cover plate 8 is provided with a third flow channel 801, which is used to connect the first flow channel 601 and the thermally conductive adhesive cavity. A second flow channel 701 is provided inside the clamping block 4 7. The inlet of the second flow channel 701 passes through the end of the clamping block 4 7 facing the semiconductor device, and the outlet of the second flow channel 701 passes through the lower surface of the clamping block 4 7. A conduit 71 communicating with the second flow channel 701 is fixed on the lower surface of the clamping block 4 7. A rotating shaft 72 is rotatably mounted on the lower end of the clamping block 4 7. A mounting plate 721 is fixedly connected to the lower end of the rotating shaft 72. Two collection bottles 73 are mounted on the mounting plate 721. The bottle openings of the two collection bottles 73 are alternately connected to the conduit 71 by the rotation of the rotating shaft 72. The outlet of the second flow channel 701 is inclined downwards and points towards the upper surface of the semiconductor device, and can be divided in two by the plane on which the upper surface of the semiconductor device is located.

[0030] After the cover plate 8 and the cover plate 9 are closed to seal the top opening of the thermal conductive adhesive cavity, clean air is introduced into the thermal conductive adhesive cavity through an external air source, air pipe, air pipe interface 61, first flow channel 601 and third flow channel 801 to clean the thermal conductive cavity. The air and impurities enter one of the collection bottles 73 through the second flow channel 701 and the conduit 71.

[0031] Then, cover plate 8 and cover plate 9 are opened to open the top opening of the thermally conductive cavity. The semiconductor device is placed on the placement stage 3 through the opening, and the thermally conductive adhesive is filled in for the static parameter test of the semiconductor device.

[0032] After completing the static parameter test of the semiconductor device, the sensor is moved up by the thickness of cover plate 8. Then, cover plate 8 and cover plate 9 are closed again to seal the top opening of the thermal conductive adhesive cavity. The thermal conductive adhesive on the lower surface of the sensor is scraped off. After that, clean air is sent into the thermal conductive adhesive cavity again through the air source, and the thermal conductive adhesive is blown into another collection bottle 73 through the second flow channel 701 and the conduit 71.

[0033] Then, open cover plate 8 and cover plate 9 again, reopen the top opening of the thermal adhesive cavity, and remove the semiconductor device from the thermal adhesive cavity.

[0034] Through the above, the present invention achieves two closures and two openings of the top of the thermal conductive adhesive cavity by performing two opening and closing actions of cover plate 8 and cover plate 9. After the first closure, the upper surface of the semiconductor device is cleaned, and after the second closure, the upper surface of the semiconductor device is cleaned to remove the thermal conductive adhesive.

[0035] It should be noted that the air inside the collection bottle 73 is discharged when the collection bottle 73 is misaligned with the conduit 71. Furthermore, to prevent the dust collected inside the collection bottle 73 from being discharged with the air, an absorbent material capable of adsorbing dust is also provided inside the collection bottle 73. The thermally conductive adhesive collected inside the collection bottle 73, due to its own adhesiveness, will not be discharged outside the collection bottle 73 with the air.

[0036] As a further explanation of the above technical solution, in order to realize the two opening and closing actions of cover plate 8 and cover plate 9, this semiconductor static parameter testing fixing structure also has the following settings.

[0037] like Figure 4 , Figure 5 and Figure 6 As shown, two limit pins 19 and two spring posts 20 are installed on the mounting platform 2. The two spring posts 20 are located between the two limit pins 19. The two limit pins 19 are used to keep the clamping blocks 3 6 and 4 7 in the open state after they are opened. The two spring posts 20 are used to keep the clamping blocks 3 6 and 4 7 in the closed state after they are closed. Cover plate 1 8 and cover plate 2 9 are respectively fixed to the upper ends of the two pushers 10.

[0038] Both clamping blocks 3 6 and 4 7 are provided with driving grooves. Both driving grooves extend along the opening and closing direction of clamping blocks 3 6 and 4 7. Each driving groove is provided with a push block 12. The length of the driving groove is greater than the length of the push block 12. One push rod 11 passes through the end of the clamping block 3 6 away from the semiconductor device and extends into the drive groove; another push rod 11 passes through the end of the clamping block 4 7 away from the semiconductor device and extends into the drive groove; the two push rods 11 are fixedly connected to the two push blocks 12 respectively. The width of push block 12 is greater than the diameter of push rod 11.

[0039] When the drive unit drives the two pushers 10 to close, cover plate 1 8 and cover plate 2 9 first close, push rod 11 and push block 12 slide in the drive groove. When push block 12 abuts against the groove wall near the semiconductor device, clamping block 3 6 and clamping block 4 7 close. Cover plate 1 8 and cover plate 2 9 continue to close. After clamping block 3 6 and clamping block 4 7 close, one end of each of the two spring pillars 20 is embedded in clamping block 3 6 and clamping block 4 7 respectively, keeping clamping block 3 6 and clamping block 4 7 in the closed state. Cover plate 1 8 and cover plate 2 9 are in the closed state.

[0040] It should be noted that when clamping blocks 3 (6) and 4 (7) begin to close, clamping blocks 1 (4) and 2 (5) also begin to close, so that clamping blocks 1 (4), 2 (5), 3 (6), and 4 (7) can work together to clamp and position the semiconductor device at the upper center of the placement stage 3, so that the cover plates 1 (8) and 1 (9) in the closed state can work together to close the opening on the thermally conductive adhesive cavity.

[0041] After cleaning the upper surface of the semiconductor device, the two pushers 10 are opened by the drive unit, so that the push rod 11 and push block 12 slide in the drive groove and move away from the semiconductor device, thereby opening the cover plate 8 and cover plate 9. At this time, the clamping block 6 and clamping block 7 are kept in the closed state under the action of the spring column 20. After the push block 12 abuts against the groove wall of the drive groove away from the semiconductor device, the drive unit stops working.

[0042] After the semiconductor device test is completed, the sensor is moved up by the thickness of cover plate 8, and the drive unit drives the two pushers 10 to close, closing cover plate 8 and cover plate 9, and sealing the opening on the thermal conductive adhesive cavity again.

[0043] After removing the thermally conductive adhesive, when it is necessary to remove the semiconductor device, the two pushers 10 are pushed open by the drive unit, so that the cover plate 1 8 and the cover plate 2 8 are opened again. After the pusher 12 abuts against the groove wall of the drive groove away from the semiconductor device, the drive unit continues to work, driving the clamping block 3 6 and the clamping block 4 7 to open. The two motors 24 drive the clamping block 1 4 and the clamping block 2 5 to open.

[0044] As a further explanation of the above technical solution, the two collection bottles 73 in this invention are used to collect dust and air mixture and thermal conductive adhesive and air mixture, respectively. The main body of the rotating shaft 72 used to drive the two collection bottles 73 to alternately connect the conduit 71 is located between the collection bottle 73 and the clamping block 7, with a small surrounding space. The rotating shaft 72 should rotate during the closing of the cover plate 8 and the cover plate 9 to realize the exchange of positions of the two collection bottles 73. Therefore, this semiconductor static parameter test fixing structure also has the following settings.

[0045] like Figure 2 , Figure 3 , Figure 6 and Figure 8 As shown, the drive groove located in the clamping block 7 is a T-shaped groove that extends through the lower end of the clamping block 7. The lower end of the push block 12 located in the clamping block 7 is fixed with a slot frame 13. A drive frame 14 is installed in the slot frame 13. A vertical sliding connection is formed between the drive frame 14 and the slot frame 13. The drive frame 14 extends to the outside of the slot frame 13 and can mesh with the gear 15 on the rotating shaft 72. A lifting spring 142 is fixed between the lower end of the drive frame 14 and the slot frame 13, and the lifting spring 142 is in a pre-compressed state. A lifting unit is provided on one side of the slot frame 13. The lifting unit is used to drive the drive frame 14 to slide vertically along the slot frame 13, and the drive frame 14 can move on the lifting unit along the opening and closing direction of the clamping block 3 6 and the clamping block 4 7. The drive unit includes a shift plate 16, which is fixed to the bottom surface of the inner cavity of the mounting box 1. A shift groove 161 is provided on the upper part of the shift plate 16. The shift groove 161 horizontally passes through both ends of the shift plate 16 and passes through the side of the shift plate 16 facing the closing direction of the clamping block 4 7. The lower wall of the shift groove 161 and the side wall facing the closing direction of the clamping block 4 7 are distributed at an acute angle. A shifting block 17 is provided in the shifting slot 161. The shifting block 17 is connected to one end of the shifting plate 16 facing away from the drive frame 14 via a fixing plate. A stop block 18 is embedded on the lower side of the end of the shifting block 17 facing the side wall. A horizontal sliding connection is formed between the stop block 18 and the shifting block 17. A stop spring is fixed between the stop block 18 and the shifting block 17. The lower side of the end of the stop block 18 facing the side wall is parallel to the side wall. The upper side of the end of the stop block 18 facing the side wall is inclined to the side away from the side wall. A transmission column 141 is fixed on one end of the drive frame 14 facing the shift plate 16. The transmission column 141 can enter and exit the shift groove 161 along the opening and closing direction of the clamping block 3 6 and the clamping block 4 7, and move along the groove wall within the shift groove 161.

[0046] When cover plate 8 and cover plate 9 are in the open state, the transmission column 141 is located outside the shifting groove 161, and the drive frame 14 is at the same height as the gear 15 under the action of the lifting spring 142, and the drive frame 14 is spaced apart from the gear 15.

[0047] During the process of cover plate 18 and cover plate 29 closing and clamping block 36 and clamping block 47 remaining relatively stationary, the drive frame 14 performs the following movements: First, the drive frame 14 moves toward the gear 15 under the push of the push block 12 and the slot frame 13, driving the transmission column 141 to enter the switching slot 161 from above the switching block 17 and move along the upper wall of the switching slot 161. Then, the drive frame 14 meshes with the gear 15, driving the rotating shaft 72 to rotate. Afterwards, the drive frame 14 disengages from the gear 15, completes the rotation of the shaft 72, drives the transmission column 141 to move along the side wall, compresses the lifting spring 142, contacts and presses the stop block 18 into the shift block 17, and compresses the stop spring. Then, the drive frame 14 moves the transmission column 141 to below the stop block 18, and stops the transmission column 141 at the junction of the side wall and the lower wall.

[0048] It should be noted that during the multiple rotations, the rotation direction of the rotating shaft 72 remains unchanged, and the angle of each rotation is 180 degrees.

[0049] It should be noted that when the transmission column 141 is located below the stop block 18, the stop block 18 applies a downward force to the transmission column 141, so that the drive frame 14 is stably positioned below the gear 15 in the vertical direction.

[0050] During the process of cover plate 18 and cover plate 29 being opened and clamping block 36 and clamping block 47 being relatively stationary, the drive frame 14 performs the following movements: First, the drive frame 14 moves under the push of the push block 12 and the slot frame 13, and drives the transmission column 141 to move along the lower wall. After the transmission column 141 moves out of the shift slot 161, the drive frame 14 moves up under the push of the lifting spring 142, and returns to the state of being at the same height as the gear 15 and spaced apart from the gear 15.

[0051] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fixed structure for testing semiconductor static parameters, characterized in that, include: A placement stage (3) for carrying semiconductor devices, clamping block one (4), clamping block two (5), clamping block three (6) and clamping block four (7), cover plate one (8) and cover plate two (9); Among them, clamping block one (4), clamping block two (5), clamping block three (6) and clamping block four (7) can work together to clamp and position the semiconductor device on the upper surface of the placement stage (3), and together with the semiconductor device, they form a thermally conductive adhesive cavity with an open top; clamping block three (6) has a first flow channel (601) inside, the first flow channel (601) penetrates the upper and lower surfaces of clamping block three (6), and the lower surface of clamping block three (6) is equipped with an air pipe interface (61) that connects to the first flow channel (601). A second flow channel (701) is provided inside the clamping block four (7). The inlet of the second flow channel (701) passes through the end of the clamping block four (7) facing the semiconductor device, and the outlet of the second flow channel (701) passes through the lower surface of the clamping block four (7). A conduit (71) communicating with the second flow channel (701) is fixed on the lower surface of the clamping block four (7). Two collection bottles (73) are provided below the clamping block four (7). The bottle mouths of the two collection bottles (73) are alternately connected to the conduit (71). The lower end of the cover plate (8) is provided with a third flow channel (801), which is used to connect the first flow channel (601) and the thermal conductive adhesive cavity. The opening at the top of the thermal conductive adhesive cavity can be closed or opened by closing or opening the cover plate (8) and the cover plate (9).

2. The semiconductor static parameter testing fixing structure according to claim 1, characterized in that, The outlet of the second flow channel (701) is tilted downwards toward the upper surface of the semiconductor device and can be divided in two by the plane on which the upper surface of the semiconductor device is located.

3. The semiconductor static parameter testing fixing structure according to claim 1, characterized in that, Each of the clamping blocks 1 (4) and 2 (5) is equipped with a first driving component, and the two first driving components work together to drive the clamping blocks 1 (4) and 2 (5) to open and close; the clamping blocks 3 (6) and 4 (7) are equipped with a second driving component, which is used to drive the clamping blocks 3 (6) and 4 (7) to open and close.

4. The semiconductor static parameter testing fixing structure according to claim 3, characterized in that, The second driving component includes a driving unit, two pushers (10), two push rods (11), and two driving slots; the driving unit is used to drive the two pushers (10) to open and close; the two pushers (10) are fixedly connected to a push rod (11) respectively, the two driving slots are respectively opened in the clamping block three (6) and clamping block four (7) and both extend along the opening and closing direction of clamping block three (6) and clamping block four (7), the two push rods (11) extend into the two driving slots respectively, and each driving slot is provided with a push block (12), the push block (12) is fixedly connected to the push rod (11).

5. The semiconductor static parameter testing fixing structure according to claim 4, characterized in that, The length of the drive groove is greater than the length of the push block (12), the width of the push block (12) is greater than the diameter of the push rod (11), and the cover plate one (8) and the cover plate two (9) are respectively fixed to the upper ends of the two push frames (10).

6. The semiconductor static parameter testing fixing structure according to claim 5, characterized in that, It also includes a mounting platform (2), a limiting pin (19) and a spring column (20). The limiting pin (19) and the spring column (20) are both mounted on the mounting platform (2) and there are two of each. The two limiting pins (19) are used to keep the clamping blocks three (6) and four (7) in the open state after they are opened. The two spring columns (20) are used to keep the clamping blocks three (6) and four (7) in the closed state after they are closed.

7. The semiconductor static parameter testing fixing structure according to claim 6, characterized in that, The drive groove located in the clamping block four (7) is a T-shaped groove that extends through the lower end of the clamping block four (7). The lower end of the push block (12) located in the clamping block four (7) is fixed with a slot frame (13). A drive frame (14) is installed in the slot frame (13). The drive frame (14) extends to the outside of the slot frame (13) and can mesh with the gear (15) on the rotating shaft (72).

8. The semiconductor static parameter testing fixing structure according to claim 7, characterized in that, It also includes a lifting unit, which is used to drive the drive frame (14) to slide vertically along the slot frame (13); the drive frame (14) can move on the lifting unit along the opening and closing directions of clamping block three (6) and clamping block four (7).

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