An ultra-low capacitance electrostatic suppressor

Abstract

The application discloses an ultra-low-capacitance electrostatic suppressor and relates to the technical field of resistors. The ultra-low-capacitance electrostatic suppressor comprises an insulating base, end electrodes symmetrically arranged on the two sides of the base, an internal electrode embedded in the insulating base, a conductive polymer layer arranged on the upper end of the internal electrode and electrically connected with the internal electrode, and a plurality of groups of energy shunt ribs integrally formed on the upper surface of the internal electrode. The conductive polymer layer is of a gradient composite structure and comprises a high-conductivity bottom layer arranged on the upper end of the internal electrode and directly contacting the energy shunt ribs, an intermediate transition layer located on the upper end of the high-conductivity bottom layer, and a surface dissipation layer arranged on the upper end of the intermediate transition layer. The thickness of the high-conductivity bottom layer is greater than the height of the energy shunt ribs, so that the top of the energy shunt ribs is embedded in the high-conductivity bottom layer. The energy shunt ribs and the gradient composite conductive polymer layer are arranged to form a multi-stage energy dissipation structure, and the problem of high concentration of transient current on the surface of the electrode is effectively solved.

Description

Technical Field

[0001] This invention relates to the field of resistor-related technology, specifically to an ultra-low capacitance electrostatic suppressor. Background Technology

[0002] Static electricity (ESO) is typically generated by friction between two poor conductors, causing electrons to migrate from one conductor to the other. The ESO voltage can reach several kilovolts. Many electronic devices experience numerous plugging and unplugging operations between their input / output interfaces and external electronic storage devices, frequently resulting in ESO applied to these components. When this ESO discharges onto voltage-sensitive electronic components, it can damage them, thereby disrupting the entire electronic circuitry. The damage caused by ESO to electronic components and circuit systems is usually irreversible, rendering electronic products malfunction. Therefore, ESO suppressors are generally required in electronic circuits.

[0003] Patent document CN115359982A discloses a stacked electrostatic suppressor and its packaging method, including two external electrodes, multiple parallel internal electrodes connected to opposite sides of the two external electrodes, a polymer layer between the two external electrodes, and two external supports. Each external support has multiple corresponding through holes for the internal electrodes to pass through. One end of each internal electrode has a metal connecting piece electrically connected to the external electrode, the width of which is greater than the width of the through hole. The external electrodes are concave, and both inner walls of the concave shape have positioning grooves for positioning the ends of the external supports. The surface of each external support near the external electrode has multiple annular microwave welding layers connecting to the external electrodes. Multiple metal connecting pieces are located in the inner holes of the microwave welding layers, and the multiple metal connecting pieces in the same inner hole of the microwave welding layer are connected. The method described in this application greatly optimizes existing processing techniques, reduces steps, and makes processing extremely convenient.

[0004] However, in actual use, due to the coupling effect of temperature changes and transient high-voltage discharge, micro-displacement or connection detachment occurs between the internal electrodes and the conductive polymer layer due to thermal deformation and local ablation, resulting in structural instability and degradation of electrical conductivity. At the same time, the transient current is highly concentrated on the electrode surface, causing local high energy density areas and generating thermal-electric field coupling effects, which causes the temperature in the electrode area to rise sharply. This not only significantly increases surface roughness and affects signal integrity (such as reflection coefficient distortion and decreased signal stability), but also easily causes surface ablation, metal layer damage or even penetration. In severe cases, it can lead to device failure and ultimately damage its long-term reliability and service life. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides an ultra-low capacitance electrostatic suppressor.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] This invention provides an ultra-low capacitance electrostatic suppressor, comprising:

[0008] Insulating substrate;

[0009] Terminal electrodes are symmetrically disposed on both sides of the substrate;

[0010] Internal electrodes are embedded inside the insulating substrate;

[0011] A conductive polymer layer is disposed on the upper end of the internal electrode and electrically connected to the internal electrode;

[0012] The upper surface of the internal electrode is integrally formed with several sets of energy diversion ribs;

[0013] The conductive polymer layer is a gradient composite structure, comprising a high-conductivity bottom layer disposed on the upper end of the internal electrode and in direct contact with the energy shunt rib, an intermediate transition layer located on the upper end of the high-conductivity bottom layer, and a surface dissipation layer disposed on the upper end of the intermediate transition layer.

[0014] The thickness of the high-conductivity bottom layer is greater than the height of the energy diversion rib, so that the top of the energy diversion rib is embedded in the high-conductivity bottom layer.

[0015] As a preferred embodiment of the present invention, the energy diversion rib is a wavy arched protrusion structure that radiates from the center of the internal electrode to the edge.

[0016] As a preferred embodiment of the present invention, the energy shunt ribs are arranged in an edge-dense radial pattern. The distribution density of the energy shunt ribs gradually increases from the center region of the internal electrode to the edge region of the internal electrode. The spacing between the energy shunt ribs in the center region is 80-100 μm, and the spacing between the energy shunt ribs in the edge region is 50-70 μm.

[0017] As a preferred embodiment of the present invention, the size of the energy shunt ribs gradually varies from the center region of the internal electrode to the edge region of the internal electrode:

[0018] The height of the energy diversion rib increases from 0.15 mm in the central region to 0.25 mm in the edge region;

[0019] The maximum outer diameter of the energy diversion rib increases from 60 μm in the central region to 100 μm in the edge region.

[0020] As a preferred embodiment of the present invention, the high-conductivity substrate has a volume conductivity ≥50S / cm and a thickness of 0.25-0.35mm.

[0021] As a preferred embodiment of the present invention, the intermediate transition layer has a volume conductivity of 5~50 S / cm and a thickness of 0.2-0.3 mm.

[0022] As a preferred embodiment of the present invention, the volumetric conductivity of the surface dissipation layer is 1-5 S / cm, and the thickness is 0.15-0.25 mm.

[0023] As a preferred embodiment of the present invention, the surfaces of the internal electrode, the end electrode, and the energy shunt rib are provided with an anti-electro-erosion coating.

[0024] As a preferred embodiment of the present invention, the anti-electro-erosion coating is a TiN-ZrO2 composite coating with a thickness of 1.5-2.5 μm.

[0025] As a preferred embodiment of the present invention, the energy diversion rib is integrally formed with the electrode by a stamping process, and the material is copper foil or aluminum foil.

[0026] The beneficial effects of this invention are:

[0027] 1. This invention constructs a multi-level energy dissipation structure by setting energy shunt ribs and a gradient composite conductive polymer layer, which effectively solves the problem of high concentration of transient current on the electrode surface. The energy shunt ribs disperse the current into multiple fine paths, significantly reducing the local current density. The gradient composite conductive polymer layer, through its unique three-layer structure, realizes the gradual diffusion and dissipation of current, avoiding the generation of thermal-electric field coupling effect, and significantly improving the high-frequency performance and long-term reliability of the electrostatic suppressor.

[0028] 2. In this invention, by adopting an edge-densified radial distribution and a size-gradient design for the energy shunt ribs, it is possible to better adapt to the electric field distribution characteristics of different regions on the electrode surface. In the edge region with high electric field intensity, by increasing the distribution density and structural size of the energy shunt ribs, the current handling capacity and heat dissipation performance of the region are effectively enhanced, avoiding local overheating and ablation problems caused by current concentration in the edge region, and improving the overall stability of the device.

[0029] 3. The anti-electro-erosion coating in this invention provides additional surface protection, effectively preventing the deterioration of electrode materials under high electric field conditions. The TiN-ZrO2 composite coating has excellent arc corrosion resistance and stable conductivity, which can protect the energy shunt ribs and electrode surfaces from damage by transient discharge, ensuring the long-term stable operation of the multi-stage energy dissipation structure and significantly extending the service life of the electrostatic suppressor. Attached Figure Description

[0030] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0031] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0032] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle.

[0033] Figure 3 This is a schematic diagram of the distribution of energy diversion ribs.

[0034] In the figure: 1. Insulating substrate; 2. Terminal electrode; 3. Internal electrode; 4. Conductive polymer layer; 41. High conductivity bottom layer; 42. Intermediate transition layer; 43. Surface dissipation layer; 5. Energy shunt rib; 6. Anti-electro-erosion coating. Detailed Implementation

[0035] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. The components of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0036] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] Example 1

[0038] like Figures 1-3 As shown, an ultra-low capacitance electrostatic suppressor includes an insulating substrate 1, end electrodes 2, multiple internal electrodes 3, and a conductive polymer layer 4. The end electrodes 2 are symmetrically arranged on both sides of the substrate; the internal electrodes 3 are embedded inside the insulating substrate 1; and the conductive polymer layer 4 is disposed on the upper end of the internal electrodes 3 and electrically connected to the internal electrodes 3.

[0039] The upper surface of the internal electrode 3 is integrally formed with several sets of energy diversion ribs 5;

[0040] The conductive polymer layer 4 is a gradient composite structure. The conductive polymer layer 4 includes a high-conductivity bottom layer 41 disposed on the upper end of the internal electrode 3 and in direct contact with the energy shunt rib 5, an intermediate transition layer 42 located on the upper end of the high-conductivity bottom layer 41, and a surface dissipation layer 43 disposed on the upper end of the intermediate transition layer 42.

[0041] The thickness of the high-conductivity bottom layer 41 is greater than the height of the energy diversion rib 5, so that the top of the energy diversion rib 5 is embedded in the high-conductivity bottom layer 41.

[0042] In existing technologies, electrostatic suppressors have long faced structural stability issues caused by the coupling effect of transient high-voltage discharge and temperature changes. In traditional structures, the electrodes and conductive polymer layer 4 undergo micro-displacement due to thermal deformation, leading to deterioration of the contact interface. Transient currents are highly concentrated on the electrode surface, forming local high-energy-density regions, which triggers thermal-electric field coupling effects, causing surface ablation and electrical performance degradation. In high-frequency application scenarios, the problems of capacitance characteristic fluctuation and clamping performance deterioration are particularly prominent, seriously affecting the reliability of the device.

[0043] The insulating substrate 1 can be made of alumina ceramic or epoxy resin composite material to provide mechanical support and electrical isolation for the overall structure. The terminal electrode 2 can be made of silver paste sintering or electroplated copper-nickel layer to form an external electrical connection interface. The internal electrode 3 can be made of stamped copper foil or aluminum foil as the main structure for current transmission. The conductive polymer layer 4 forms a gradient conductivity distribution through a step-by-step coating process to achieve gradual current dissipation. The energy shunt rib 5 refers to the radial structure protruding from the electrode surface. It is integrally formed with the electrode through a stamping process to disperse the concentrated current into multiple transmission paths. The gradient composite structure guides the three-layer structure of the electropolymer layer 4 with conductivity increasing from top to bottom. This is achieved by adjusting the material ratio to ensure balanced diffusion of current in the lateral and longitudinal directions.

[0044] Specifically, the insulating substrate 1 serves as a support platform to support the symmetrically distributed end electrodes 2. The internal electrodes 3 are embedded inside the substrate to form a current path. The energy shunt rib 5 extends upward from the electrode surface, and its top is embedded with a high-conductivity bottom layer 41 to form a three-dimensional contact interface. The intermediate transition layer 42 connects the high-conductivity bottom layer 41 and the surface dissipation layer 43, forming a transition region with decreasing conductivity. When the transient current reaches the internal electrode 3, the energy shunt rib 5 divides the current into multiple branches. The high-conductivity bottom layer 41 promotes the lateral diffusion of the current, the intermediate transition layer 42 buffers the current density gradient, and the surface dissipation layer 43 completes the final energy conversion. The thickness relationship of each layer ensures that the energy shunt rib 5 and the high-conductivity bottom layer 41 form a mechanical interlock, effectively suppressing the micro-displacement of the interface.

[0045] Furthermore, such as Figure 2 As shown, the energy diversion rib 5 is a wavy arched protrusion structure that radiates from the center of the internal electrode 3 to the edge.

[0046] Among them, the wavy arched protrusion structure refers to a three-dimensional protrusion with a continuous undulating shape and a smooth arc cross-section. Specifically, it can be achieved by forming an approximately sinusoidal wave or arc-shaped geometric shape on the electrode surface using a stamping process. This structure reduces the current accumulation effect by eliminating sharp edges and corners and provides mechanical support when under pressure.

[0047] The edge-density radial distribution makes the arrangement density of the energy diversion ribs 5 gradually increase from the center of the electrode to the edge. Specifically, this can be achieved by adjusting the rib spacing parameters of the stamping die. This distribution mode is designed to enhance the high electric field intensity in the edge region and reduce the local current density by increasing the number of diversion paths.

[0048] Specifically, the wavy arched structure of the energy shunt rib 5 allows the transient current to diffuse evenly along the surface of the rib through a smooth geometric transition, avoiding the formation of current concentration points at the top of the rib. At the same time, its radial distribution pattern forms a dense current shunt network at the edge of the electrode, decomposing the current in the high electric field region into multiple low-density paths.

[0049] This structure reduces the risk of heat accumulation at the interface between the electrode and the polymer layer by optimizing the spatial distribution of current injection points, and suppresses connection detachment or material ablation caused by local overheating.

[0050] Furthermore, such as Figure 2 As shown, the energy shunt ribs 5 are arranged in a radial pattern with an edge-densified design. The distribution density of the energy shunt ribs 5 gradually increases from the central region of the internal electrode 3 to the edge region of the internal electrode 3. The spacing between the energy shunt ribs 5 in the central region is 80-100 μm, and the spacing between the energy shunt ribs 5 in the edge region is 50-70 μm.

[0051] The distribution density design of the energy shunt rib 5 is based on the non-uniform characteristics of the electric field distribution. During the operation of the electrostatic suppressor, the electric field strength in the edge region of the internal electrode 3 is significantly higher than that in the central region due to the special geometry. This phenomenon is called the edge effect. The edge effect will cause the current to be excessively concentrated in the edge region during transient discharge, generating local high temperature and thermal stress, which in turn leads to ablation of the electrode material and structural damage.

[0052] To address this, the present invention increases the distribution density of the energy shunt ribs 5 in the edge region, forming a denser current shunt path in this area. Specifically, in the central region of the internal electrode 3, the spacing between the energy shunt ribs 5 is maintained at a relatively large interval of 80-100 μm. This ensures basic current shunt capability while avoiding increased process complexity due to excessive density. In the edge region of the internal electrode 3, the spacing between the energy shunt ribs 5 is reduced to 50-70 μm, increasing the number of energy shunt ribs 5 per unit area by approximately 30%-40%, significantly improving the current shunt capability in this region.

[0053] During operation, when a transient high-voltage impact occurs, the current is first conducted through the terminal electrode 2 to the surface of the internal electrode 3. Due to the edge-densified distribution design, a denser network of energy shunt ribs 5 is formed in the edge region where the electric field strength is high. These energy shunt ribs 5 can effectively disperse the concentrated current into more shunt paths, significantly reducing the local current density. At the same time, in the central region where the electric field strength is relatively low, the moderately distributed energy shunt ribs 5 can ensure the necessary current shunt capacity while avoiding resource waste and unnecessary increase in process complexity.

[0054] Furthermore, such as Figure 2 As shown, the size of the energy shunt rib 5 gradually changes from the central region of the inner electrode 3 to the edge region of the inner electrode 3:

[0055] The height of the energy diversion rib 5 increases from 0.15 mm in the central region to 0.25 mm in the edge region;

[0056] The maximum outer diameter of the energy diversion rib 5 increases from 60 μm in the central region to 100 μm in the edge region.

[0057] Similarly, the size of the energy shunt 5 is similar to the arrangement of the energy shunt 5. The height of the energy shunt 5 increases linearly from 0.15 mm in the central region of the internal electrode 3 to 0.25 mm in the edge region, giving the energy shunt 5 in the edge region a larger height. This height gradient design allows the energy shunt 5 in the edge region to provide a larger side surface area, significantly increasing the contact area with the gradient composite conductive polymer layer 4, thereby improving the current injection capability and heat dissipation performance.

[0058] Meanwhile, the maximum outer diameter of the energy shunt 5 increases linearly from 60μm in the central region of the internal electrode 3 to 100μm in the edge region. This width gradient design gives the energy shunt 5 in the edge region a larger cross-sectional area and volume. The larger cross-sectional area provides better current conduction capability, while the larger volume means higher heat capacity, enabling the energy shunt 5 in the edge region to absorb and dissipate more transient heat energy and effectively prevent local overheating.

[0059] The gradually varying size distribution of the energy shunt ribs 5 also creates a good synergistic effect with the gradient composite conductive polymer layer 4. In the edge region, the larger energy shunt ribs 5 can be embedded more deeply into the high-conductivity bottom layer 41, providing a more stable mechanical connection and a more efficient current transmission path. At the same time, the larger energy shunt ribs 5 also provide better support for the high-conductivity bottom layer 41, preventing the polymer layer from deforming or falling off under high temperature and high pressure conditions.

[0060] Furthermore, the high-conductivity bottom layer 41 has a volume conductivity ≥ 50 S / cm and a thickness of 0.25-0.35 mm, the intermediate transition layer 42 has a volume conductivity of 5~50 S / cm and a thickness of 0.2-0.3 mm, and the surface dissipation layer 43 has a volume conductivity of 1-5 S / cm and a thickness of 0.15-0.25 mm.

[0061] Among them, the high-conductivity bottom layer 41 is made of polyaniline-based composite conductive material, which is doped with 15-20wt% silver nanowires (50nm in diameter, aspect ratio >100) or carbon nanotubes (10-20nm in diameter, aspect ratio >500). It is uniformly dispersed in the polyaniline matrix through solution blending process. The volume conductivity of the high-conductivity bottom layer 41 is ≥50S / cm, which ensures that it has excellent lateral current diffusion capability. Specifically, when transient current is injected into the high-conductivity bottom layer 41 through the top of the energy shunt rib 5, due to the extremely high volume conductivity of this layer, the current rapidly diffuses laterally along the horizontal plane, dispersing the current that may have been concentrated in a single path to the entire electrode surface.

[0062] The intermediate transition layer 42 has a volumetric conductivity of 5~50 S / cm and a thickness of 0.2-0.3 mm. This layer is doped with polypyrrole composite material. The conductivity can be precisely controlled by controlling the concentration of oxidant. During transient discharge, when the transversely diffused current enters the intermediate transition layer 42 from the high conductivity bottom layer 41, the current is forced to penetrate deeper into the Z-axis direction due to the decrease in conductivity, thus realizing the three-dimensional volumetric dispersion of energy.

[0063] The surface dissipation layer 43 has a volumetric conductivity of 1-5 S / cm and a thickness of 0.15-0.25 mm. This layer uses a low-concentration carbon black-filled epoxy resin system, in which the content of conductive filler is precisely controlled at 3-8 wt%. A uniform and stable composite material is formed through a thermosetting process. The volumetric conductivity of the surface dissipation layer 43, ranging from 1-5 S / cm, ensures that energy is converted into heat energy at a controllable rate, avoiding energy accumulation due to excessively low conductivity or excessively high conductivity leading to excessively rapid energy dissipation. Specifically, when current enters the surface dissipation layer 43 from the intermediate transition layer 42, due to the further reduction in conductivity, the current is forced to flow in a larger volume, uniformly dispersing the energy throughout the polymer volume.

[0064] The high-conductivity bottom layer 41, the intermediate transition layer 42, and the surface dissipation layer 43 form a complete energy dissipation system. In transient high-voltage discharge events, it exhibits a three-level cooperative working mechanism. In the initial stage, the current is injected into the high-conductivity bottom layer 41 through the energy shunt rib 5. The high volumetric conductivity (≥50S / cm) and appropriate thickness (0.25-0.35mm) of this layer ensure that the current completes lateral diffusion within 0.5ns, transforming the point heat source into a surface heat source. Subsequently, the diffused current enters the intermediate transition layer 42, which guides the current to the Z-axis direction to avoid reflection and secondary discharge. Finally, the current enters the surface dissipation layer 43. The low conductivity (1-5S / cm) and optimized thickness (0.15-0.25mm) of this layer enable the energy to be uniformly dissipated in the three-dimensional volume domain, converted into heat energy, and diffused into the environment. This three-level energy management mechanism completely solves the thermo-electric field coupling effect.

[0065] The manufacturing process of the gradient composite conductive polymer layer 4 adopts a step-by-step coating + step-curing technology to ensure that each layer forms a tight bond. First, the high-conductivity bottom layer slurry 41 is coated on the surface of the internal electrode 3 with energy shunt ribs 5, and the coating thickness is controlled at 0.25-0.35 mm. It is then partially cured (curing degree about 40%) to make it semi-fluid to completely wrap the energy shunt ribs 5. Then, the intermediate transition layer slurry 42 is coated, with a thickness controlled at 0.2-0.3 mm, and moderately cured (curing degree about 60%). Finally, the surface dissipation layer slurry 43 is coated, with a thickness controlled at 0.15-0.25 mm, and the entire layer is cured at high temperature (180℃, 2 hours) to form a tightly bonded whole.

[0066] Furthermore, such as Figure 2 As shown, the surfaces of the internal electrode 3, the terminal electrode 2, and the energy shunt rib 5 are provided with an anti-electro-erosion coating 6, which is a TiN-ZrO2 composite coating with a thickness of 1.5-2.5 μm.

[0067] The anti-electro-erosion coating 6 has a specific structure consisting of a TiN transition layer and a ZrO2 functional layer, forming a double-layer composite structure. The TiN transition layer has a thickness of 1.0-1.5 μm and is deposited using a multi-arc ion plating process, exhibiting high hardness (28 GPa) and excellent conductivity (volume conductivity of approximately 2.0 × 10⁻⁶). 5 The ZrO2 functional layer, with a thickness of 0.5-1.0 μm, is deposited using RF magnetron sputtering and features high dielectric strength (>15 MV / cm) and a wide bandgap (5.8 eV), effectively suppressing field electron emission. The total thickness of the TiN-ZrO2 composite coating is strictly controlled within the range of 1.5-2.5 μm: the lower limit of 1.5 μm ensures a pinhole density of <10 pins / cm², avoiding local electric field concentration; the upper limit of 2.5 μm prevents coating peeling caused by residual stress and avoids increasing unnecessary interfacial impedance.

[0068] The connection and positional relationship of the anti-electro-erosion coating 6 has a clear structural feature. The anti-electro-erosion coating 6 covers the energy shunt rib 5 and the electrode substrate surface, serving as its main protective layer and forming the first protective barrier on the electrode surface. Specifically, the coating is located between the energy shunt rib 5 and the gradient composite conductive polymer layer 4, serving as the interface layer between the two. Although it exists, due to the appropriate conductivity of the TiN-ZrO2 composite structure of the anti-electro-erosion coating 6 (overall volume conductivity of about 5.0×10³S / m), it will not significantly increase the interface impedance. In three-dimensional space, the anti-electro-erosion coating 6 forms a continuous thin layer, completely isolating the metal electrode and the conductive polymer, preventing electrochemical reactions caused by direct contact between the two under a high electric field.

[0069] Furthermore, the energy diversion rib 5 is integrally formed with the electrode through a stamping process, and the material is copper foil or aluminum foil. Copper foil or aluminum foil refers to a metal substrate material with ductility and conductivity. Specifically, it can be achieved by using rolled copper foil with a purity higher than 99.9% or soft aluminum foil that has undergone annealing. This material selection enables the energy diversion rib 5 to have excellent conductivity while being able to withstand plastic deformation during the stamping process without cracking, ensuring that a stable three-dimensional contact interface is subsequently formed with the conductive polymer layer 4.

[0070] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An ultra-low capacitance electrostatic suppressor, characterized in that, include: Insulating substrate (1); Terminal electrodes (2) are symmetrically disposed on both sides of the substrate; The internal electrode (3) is embedded inside the insulating substrate (1); A conductive polymer layer (4) is disposed on the upper end of the internal electrode (3) and electrically connected to the internal electrode (3); The upper surface of the internal electrode (3) is integrally formed with several sets of energy diversion ribs (5). The conductive polymer layer (4) is a gradient composite structure. The conductive polymer layer (4) includes a high conductivity bottom layer (41) disposed on the upper end of the internal electrode (3) and in direct contact with the energy shunt rib (5), an intermediate transition layer (42) located on the upper end of the high conductivity bottom layer (41), and a surface dissipation layer (43) disposed on the upper end of the intermediate transition layer (42). The thickness of the high-conductivity bottom layer (41) is greater than the height of the energy diversion rib (5), so that the top of the energy diversion rib (5) is embedded in the high-conductivity bottom layer (41); The energy diversion rib (5) is a wavy arched protrusion structure that radiates from the center of the internal electrode (3) to the edge; The energy diversion ribs (5) are arranged in a radial pattern with an edge-densified design. The distribution density of the energy diversion ribs (5) gradually increases from the central region of the internal electrode (3) to the edge region of the internal electrode (3). The size of the energy diversion rib (5) gradually changes from the central region of the internal electrode (3) to the edge region of the internal electrode (3); The surfaces of the internal electrode (3), the end electrode (2) and the energy shunt rib (5) are provided with an anti-electro-erosion coating (6). The energy diversion rib (5) is made of copper foil or aluminum foil.

2. The ultra-low capacitance electrostatic suppressor according to claim 1, characterized in that, The spacing between the energy diversion ribs (5) located in the central region is 80-100μm, and the spacing between the energy diversion ribs (5) located in the edge region is 50-70μm.

3. The ultra-low capacitance electrostatic suppressor according to claim 2, characterized in that, The height of the energy diversion rib (5) increases from 0.15 mm in the central region to 0.25 mm in the edge region; The maximum outer diameter of the energy diversion rib (5) increases from 60 μm in the central region to 100 μm in the edge region.

4. The ultra-low capacitance electrostatic suppressor according to claim 1, characterized in that, The high-conductivity bottom layer (41) has a volume conductivity ≥50S / cm and a thickness of 0.25-0.35mm.

5. The ultra-low capacitance electrostatic suppressor according to claim 4, characterized in that, The intermediate transition layer (42) has a volume conductivity of 5~50 S / cm and a thickness of 0.2-0.3 mm.

6. The ultra-low capacitance electrostatic suppressor according to claim 5, characterized in that, The surface dissipation layer (43) has a volume conductivity of 1-5 S / cm and a thickness of 0.15-0.25 mm.

7. The ultra-low capacitance electrostatic suppressor according to claim 6, characterized in that, The anti-electro-erosion coating (6) is a TiN-ZrO2 composite coating with a thickness of 1.5-2.5 μm.

8. The ultra-low capacitance electrostatic suppressor according to claim 7, characterized in that, The energy diversion rib (5) is integrally formed with the electrode through a stamping process.

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