Automatic film tearing mechanism used after wafer film pasting

Abstract

The invention discloses an automatic film tearing mechanism used after wafer film pasting, and relates to the technical field of glass processing. A clamping mechanism is arranged on the bottom plate and comprises two shaft rods and two limiting rings. The clamping mechanism is used for fixing a wafer and preventing the wafer from moving in the film tearing process, a driving motor on a bottom plate drives a first gear to rotate, a moving plate is meshed with the first gear, along with rotation of the first gear, the moving plate and first teeth on the moving plate can move, an adjusting plate is connected with a shaft rod through a first connecting rod, and when the moving plate moves, the adjusting plate can move along with the first connecting rod. When the adjusting plate moves, the adjusting plate correspondingly moves to push the first connecting rod, the first connecting rod pushes the shaft rod to move, the shaft rod rotates through the connecting shaft, the opening and closing angles of the two limiting rings are controlled, and wafers of different sizes are fixed according to different opening and closing angles.

Description

Technical Field

[0001] This invention relates to the field of glass processing technology, and more specifically to an automatic film-removing mechanism for wafers after film lamination. Background Technology

[0002] The automatic film removal mechanism used after wafer lamination is mainly used to process wafers during the semiconductor manufacturing process. It automatically removes the protective film, such as dicing film or protective film, attached to the wafer surface to facilitate subsequent semiconductor manufacturing or testing processes. Through automated operation, it reduces manual intervention, improves production efficiency, reduces production costs, ensures the accuracy and consistency of the film removal process, reduces defects caused by manual operation, improves wafer yield, and operates in a cleanroom environment to reduce dust and particle contamination of the wafer and protect the cleanliness of the wafer surface.

[0003] Chinese Patent Publication No. CN113478947B, entitled "Semiconductor Wafer Protective Film Removal Structure and Operation Method," includes a worktable and a film removal chamber. The film removal chamber is located above the worktable and is used to peel off the protective film on semiconductor wafers. In this invention, two pressure rollers rotate in the same direction to squeeze and assist the movement of semiconductor wafers on a strip conveyor belt. Adhesive tape sleeved on the surfaces of the pressure rollers and rotating rollers can adhere the squeezed semiconductor wafer protective film. The tape rotates in the same direction as the pressure rollers, but the semiconductor wafer protective film adhered to the tape can be moved upwards by the tape. The two pressure rollers cause the semiconductor wafer to move laterally on the strip conveyor belt, thereby achieving the goal of pulling and peeling off the semiconductor wafer protective film. The processing efficiency is high, allowing for continuous film removal operations on semiconductor wafers. The height of the pressure rollers is pre-adjusted via a hydraulic rod, eliminating the need for subsequent height adjustments and preventing adjustment errors caused by frequent roller adjustments, which could damage the semiconductor wafers due to compression.

[0004] The shortcomings of the above solution are as follows: Although the solution can prevent wafer compression, it cannot automatically transfer the wafer during use, nor can it clamp the wafer. In a cleanroom environment, manual operation makes it difficult to control the air cleanliness around the wafer, increasing the possibility of wafer contamination. If the wafer size or shape is diverse, manual operation is difficult to adapt to wafers of different specifications, which limits the technical problem of equipment versatility. Summary of the Invention

[0005] The purpose of this invention is to provide an automatic film-removing mechanism for wafers after film lamination, in order to solve the technical problems in the prior art where wafers cannot be automatically transferred and clamped during use. In cleanroom environments, manual operation makes it difficult to control the air cleanliness around the wafers, increasing the possibility of wafer contamination. If the wafers are of various sizes or shapes, manual operation is difficult to adapt to wafers of different specifications, thus limiting the versatility of the equipment.

[0006] The technical problem to be solved by this invention can be achieved through the following technical solution:

[0007] An automatic film-removing mechanism for wafers after film lamination includes a base plate;

[0008] The base plate is provided with a clamping mechanism, which includes two shafts and two limiting rings. A fixed bearing is connected to the base plate, and a connecting shaft is connected to the fixed bearing. The two shafts are rotatably and crosswise connected to the connecting shaft. The two limiting rings are respectively connected to the ends of the two shafts. A pushing mechanism is connected between the shafts and the base plate.

[0009] A connecting plate is connected to the end of the connecting shaft away from the fixed bearing. A sleeve plate is connected to the connecting plate. A telescopic plate is slidably connected inside the sleeve plate. A film peeler is connected to the end of the telescopic plate away from the sleeve plate. A transfer mechanism is provided on the base plate. An electric roller is provided on the base plate. A conveyor belt is connected to the electric roller. A cooling mechanism is connected to the side of the conveyor belt.

[0010] As a further aspect of the present invention, a heating plate is connected to the base plate.

[0011] As a further aspect of the present invention, the heating plate is provided with a placement plate.

[0012] As a further aspect of the present invention, the limiting ring is an arc-shaped structure.

[0013] As a further aspect of the present invention: the pushing mechanism includes a moving plate and a gear 1. A drive motor is connected to the base plate, the gear 1 is connected to the drive end of the drive motor, the moving plate is disposed on one side of the gear 1, and a plurality of teeth 1 are connected to the moving plate. The teeth 1 mesh with the gear 1. An adjusting plate is connected to one side of the moving plate, and two connecting rods 1 are connected to the end of the adjusting plate away from the moving plate. The ends of the two connecting rods 1 away from the adjusting plate are respectively connected to shafts.

[0014] As a further embodiment of the present invention: the transfer mechanism includes a rotating rod and a suction cup, a fixed bearing two is connected to the base plate, a rotating shaft is connected to the fixed bearing two, a tooth two is connected between the rotating shaft and the fixed bearing two, a gear two is connected to the fixed bearing two, the tooth two meshes with the gear two, the rotating rod is connected to the end of the rotating shaft away from the tooth two, the end of the rotating rod away from the rotating shaft is connected to an electric telescopic rod one, and the suction cup is connected to the telescopic end of the electric telescopic rod one.

[0015] As a further embodiment of the present invention: two sets of slide rails are connected to the base plate, and an electric telescopic rod 2 is slidably connected to the slide rails. The telescopic end of the electric telescopic rod 2 is connected to a connecting rod 2. The end of the connecting rod 2 away from the electric telescopic rod 2 is connected to a connecting frame. The end of the connecting frame away from the connecting rod 2 is connected to a dust removal roller.

[0016] As a further aspect of the present invention: a receiving box is connected to the side of the base plate.

[0017] As a further aspect of the present invention: a guide plate is connected between the receiving box and the conveyor belt.

[0018] As a further aspect of the present invention: the cooling mechanism includes two air outlet plates and multiple air outlets, the two air outlet plates are respectively connected to both sides of the conveyor belt, and the multiple air outlets are respectively disposed on the two air outlet plates.

[0019] The beneficial effects of this invention are:

[0020] 1. The clamping mechanism of this invention is used to fix wafers and prevent them from moving during the film removal process. The drive motor on the base plate drives gear 1 to rotate, and the moving plate meshes with gear 1. As gear 1 rotates, the moving plate and its teeth also move. The adjusting plate is connected to the shaft through connecting rod 1. When the moving plate moves, the adjusting plate also moves accordingly, thereby pushing connecting rod 1. Connecting rod 1 pushes the shaft to move, and the shaft rotates through the connecting shaft, thereby controlling the opening and closing angles of the two limiting rings. By different opening and closing angles, wafers of different sizes can be fixed. By adjusting the opening and closing angles of the limiting rings, the clamping mechanism can adapt to wafers of different diameters, improving the versatility and applicability of the equipment. Fixing the wafer can prevent it from moving during the film removal process and ensure stability during operation.

[0021] 2. In this invention, the rotating rod is connected to one end of the rotating shaft, which is connected to the fixed bearing and meshes with the gear through the teeth. When the gear rotates, it drives the rotating rod to rotate through the transmission system. The suction cup is connected to the telescopic end of the electric telescopic rod. The electric telescopic rod can move along the axial direction of the rotating rod. During operation, the suction cup can adsorb the film or wafer and transfer the film or wafer from the placement plate to the conveyor belt through the telescopic action of the electric telescopic rod. The conveyor belt on the electric roller is used to transfer the processed film or wafer from the transfer mechanism to the receiving box.

[0022] 3. The present invention has two sets of slide rails with slide tracks slidably connected to them, and two electric telescopic rods are slidably connected to the slide tracks. The telescopic movement of the electric telescopic rods can control the position of the connecting rods and the connecting frame, and is used to adjust the position of the dust removal roller on the connecting frame. It is used to remove dust and residues on the film or wafer during the transfer process. By effectively removing dust and residues on the film or wafer, the risk of contamination is reduced, the surface quality of the wafer is protected, and the yield of the product is improved. Attached Figure Description

[0023] The invention will now be further described with reference to the accompanying drawings.

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the overall structure of the present invention;

[0026] Figure 3 This is a top view of the structure of the present invention;

[0027] Figure 4 This is a side view of the structure of the present invention.

[0028] In the diagram: 1. Base plate; 2. Moving plate; 3. Gear 1; 4. Gear 1; 5. Adjusting plate; 6. Connecting rod 1; 7. Shaft; 8. Fixed bearing 1; 9. Connecting shaft; 10. Connecting plate; 11. Sleeve plate; 12. Telescopic plate; 13. Film peeler; 14. Fixed bearing 2; 15. Gear 2; 16. Gear 2; 17. Rotating shaft; 18. Rotating rod; 19. Electric telescopic rod 1; 20. Suction cup; 21. Receiving box; 22. Electric roller; 23. Air outlet plate; 25. Air outlet; 26. Conveyor belt; 27. Slide rail; 28. Slide track; 29. ​​Electric telescopic rod 2; 30. Connecting frame; 31. Limiting ring; 32. Dust removal roller; 34. Connecting rod 2; 35. Placement plate; 36. Heating plate; 37. Guide plate. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] like Figures 1-4As shown, an automatic film-removing mechanism for wafer lamination includes a base plate 1, a heating plate 36 connected to the base plate 1, a placement plate 35 on the heating plate 36, and a clamping mechanism connected between the placement plate 35 and the base plate 1. The clamping mechanism includes two shafts 7 and two limiting rings 31. A fixed bearing 8 is connected to the base plate 1, and a connecting shaft 9 is connected to the fixed bearing 8. The two shafts 7 are rotatably and crosswise connected to the connecting shaft 9. The two limiting rings 31 are respectively connected to the ends of the two shafts 7, and the limiting rings 31 have an arc-shaped structure. A pushing mechanism is connected between the shaft 7 and the base plate 1. The pushing mechanism includes a moving plate 2 and a gear 4. A drive motor is connected to the base plate 1. The gear 4 is connected to the drive end of the drive motor. The moving plate 2 is located on one side of the gear 4. Multiple teeth 3 are connected to the moving plate 2. The teeth 3 mesh with the gear 4. An adjusting plate 5 is connected to one side of the moving plate 2. Two connecting rods 6 are connected to the end of the adjusting plate 5 away from the moving plate 2. The ends of the two connecting rods 6 away from the adjusting plate 5 are respectively connected to the shaft 7.

[0031] The connecting shaft 9 is connected to a connecting plate 10 at the end away from the fixed bearing 8. A sleeve 11 is connected to the connecting plate 10. A telescopic plate 12 is slidably connected inside the sleeve 11. A membrane peeler 13 is connected to the end of the telescopic plate 12 away from the sleeve 11.

[0032] The base plate 1 is provided with a transfer mechanism, which includes a rotating rod 18 and a suction cup 20. A fixed bearing 14 is connected to the base plate 1. A rotating shaft 17 is connected to the fixed bearing 14. A tooth 15 is connected between the rotating shaft 17 and the fixed bearing 14. A gear 16 is connected to the fixed bearing 14. The tooth 15 and the gear 16 are meshed. The rotating rod 18 is connected to the end of the rotating shaft 17 away from the tooth 15. An electric telescopic rod 19 is connected to the end of the rotating rod 18 away from the rotating shaft 17. The suction cup 20 is connected to the telescopic end of the electric telescopic rod 19.

[0033] Two sets of slide rails 27 are connected to the base plate 1. The two sets of slide rails 27 are slidably connected to a slide rail 28, and an electric telescopic rod 29 is slidably connected to it. The telescopic end of the electric telescopic rod 29 is connected to a connecting rod 34. The end of the connecting rod 34 away from the electric telescopic rod 29 is connected to a connecting frame 30. The end of the connecting frame 30 away from the connecting rod 34 is connected to a dust removal roller 32.

[0034] An electric roller 22 is provided on the base plate 1, and a conveyor belt 26 is connected to the electric roller 22. A receiving box 21 is connected to the side of the base plate 1, and a guide plate 37 is connected between the receiving box 21 and the conveyor belt 26. A cooling mechanism is connected to the side of the conveyor belt 26. The cooling mechanism includes two air outlet plates 23 and multiple air outlets 25. The two air outlet plates 23 are respectively connected to both sides of the conveyor belt 26, and the multiple air outlets 25 are respectively arranged on the two air outlet plates 23.

[0035] The working principle of this invention: The heating plate 36 on the base plate 1 heats the placement plate 35 to soften the thin film attached to the wafer, facilitating subsequent film removal. The wafer is placed on the heated placement plate 35. A clamping mechanism is used to fix the wafer and prevent it from moving during the film removal process. The drive motor on the base plate 1 drives gear 4 to rotate. The moving plate 2 meshes with gear 4. As gear 4 rotates, the moving plate 2 and its teeth 3 also move. The adjusting plate 5 is connected to the shaft 7 via a connecting rod 6. When the moving plate 2 moves, the adjusting plate 5 also moves accordingly, thereby pushing the connecting rod 6. The connecting rod 6 pushes the shaft 7 to move, and the shaft 7 rotates through the connecting shaft 9, thereby controlling the opening and closing angles of the two limiting rings 31. By different opening and closing angles, wafers of different sizes are fixed. The telescopic plate 12 slides inside the sleeve 11, and one end of it is connected to the film peeler 13. When the telescopic plate 12 slides inside the sleeve 11, the film peeler 13 will move along the edge of the wafer and peel the film off the wafer. The connecting shaft 9 connects the fixed bearing 8 and the sleeve 11 to ensure that the movement trajectory of the telescopic plate 12 and the film peeler 13 is correct, which can ensure that the film is peeled off from the wafer evenly and completely, while maintaining the cleanliness and integrity of the wafer.

[0036] A rotating rod 18 is connected to one end of a rotating shaft 17, which is connected to a fixed bearing 14 and meshes with a gear 16 via a toothed gear 15. When the gear 16 rotates, it drives the rotating rod 18 to rotate via a transmission system. A suction cup 20 is connected to the telescopic end of an electric telescopic rod 19, which can move axially along the rotating rod 18. During operation, the suction cup 20 can adsorb films or wafers and transfer them from the placement plate 35 to the conveyor belt via the telescopic movement of the electric telescopic rod 19. On 26, the conveyor belt 26 on the electric roller 22 is used to transfer the processed film or wafer from the transfer mechanism to the receiving box 21. The side of the conveyor belt 26 is connected to a cooling mechanism, including two air outlets 23 and multiple air outlets 25. The cooling mechanism blows out cooling air through the air outlets 23 and air outlets 25 to cool the film or wafer on the conveyor belt 26 to stabilize its temperature and prevent deformation or damage caused by temperature changes. The wafer is conveyed by the conveyor belt 26 and transported to the receiving box 21 through the guide plate 37.

[0037] The entire workflow is a continuous automated process, from heating and softening the film, peeling, transferring, positioning, dust removal, to conveying and cooling. Each step is precisely controlled by corresponding mechanical and electric devices to ensure the quality and efficiency of wafer and film processing.

[0038] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. An automatic film-removing mechanism for wafers after film lamination, comprising a base plate (1); characterized in that: The base plate (1) is provided with a clamping mechanism, which includes two shafts (7) and two limiting rings (31). A fixed bearing (8) is connected to the base plate (1), and a connecting shaft (9) is connected to the fixed bearing (8). The two shafts (7) are rotatably and crosswise connected to the connecting shaft (9). The two limiting rings (31) are respectively connected to the ends of the two shafts (7). A pushing mechanism is connected between the shafts (7) and the base plate (1). The connecting shaft (9) is connected to a connecting plate (10) at the end away from the fixed bearing (8). A sleeve plate (11) is connected to the connecting plate (10). A telescopic plate (12) is slidably connected inside the sleeve plate (11). A film peeler (13) is connected to the end of the telescopic plate (12) away from the sleeve plate (11). A transfer mechanism is provided on the base plate (1). An electric roller (22) is provided on the base plate (1). A conveyor belt (26) is connected to the electric roller (22). A cooling mechanism is connected to the side of the conveyor belt (26).

2. The automatic film peeling mechanism for wafer lamination according to claim 1, characterized in that, A heating plate (36) is connected to the base plate (1).

3. An automatic film peeling mechanism for wafer lamination according to claim 2, characterized in that, The heating plate (36) is provided with a placement plate (35).

4. An automatic film peeling mechanism for wafer lamination according to claim 1, characterized in that, The limiting ring (31) has an arc-shaped structure.

5. An automatic film peeling mechanism for wafer lamination according to claim 1, characterized in that, The pushing mechanism includes a moving plate (2) and a gear (4). A drive motor is connected to the base plate (1). The gear (4) is connected to the drive end of the drive motor. The moving plate (2) is located on one side of the gear (4). Multiple teeth (3) are connected to the moving plate (2). The teeth (3) mesh with the gear (4). An adjusting plate (5) is connected to one side of the moving plate (2). Two connecting rods (6) are connected to the end of the adjusting plate (5) away from the moving plate (2). The ends of the two connecting rods (6) away from the adjusting plate (5) are respectively connected to the shaft (7).

6. An automatic film peeling mechanism for wafer lamination according to claim 1, characterized in that, The transfer mechanism includes a rotating rod (18) and a suction cup (20). A fixed bearing (14) is connected to the base plate (1). A rotating shaft (17) is connected to the fixed bearing (14). A toothed gear (15) is connected between the rotating shaft (17) and the fixed bearing (14). A gear (16) is connected to the fixed bearing (14). The toothed gear (15) meshes with the gear (16). The rotating rod (18) is connected to the end of the rotating shaft (17) away from the toothed gear (15). An electric telescopic rod (19) is connected to the end of the rotating rod (18) away from the rotating shaft (17). The suction cup (20) is connected to the telescopic end of the electric telescopic rod (19).

7. An automatic film peeling mechanism for wafer lamination according to claim 1, characterized in that, Two sets of slide rails (27) are connected to the base plate (1). The two sets of slide rails (27) are slidably connected to a slide rail (28), and an electric telescopic rod (29) is slidably connected to it. The telescopic end of the electric telescopic rod (29) is connected to a connecting rod (34). The end of the connecting rod (34) away from the electric telescopic rod (29) is connected to a connecting frame (30). The end of the connecting frame (30) away from the connecting rod (34) is connected to a dust removal roller (32).

8. An automatic film peeling mechanism for wafers after film lamination according to claim 1, characterized in that, The bottom plate (1) is connected to a receiving box (21) on its side.

9. An automatic film peeling mechanism for wafer lamination according to claim 8, characterized in that, A guide plate (37) is connected between the receiving box (21) and the conveyor belt (26).

10. An automatic film peeling mechanism for wafers after film lamination according to claim 1, characterized in that, The cooling mechanism includes two air outlet plates (23) and multiple air outlets (25). The two air outlet plates (23) are respectively connected to both sides of the conveyor belt (26), and the multiple air outlets (25) are respectively arranged on the two air outlet plates (23).

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