A control method for adjusting a film tearing angle

Abstract

The application provides a control method for adjusting a film tearing angle, and belongs to the technical field of film tearing, and comprises the following steps: based on a preset film material characteristic database, initial film tearing angle data and tension setting value data are obtained; based on wafer size and debonding process parameters, an expected angle sequence is obtained; real-time film tearing tension data is obtained based on a force sensor, and real-time film tearing angle data is obtained based on an angle sensor; film tearing abnormality flag bits are obtained based on the real-time film tearing tension data and the real-time film tearing angle data; an angle deviation amount is obtained based on the real-time angle data and the expected angle sequence; an angle compensation amount is obtained according to the angle deviation amount, a tension compensation amount is obtained based on the film tearing abnormality flag bits; total angle adjustment instructions are obtained based on the angle compensation amount and the tension compensation amount, and the total angle adjustment instructions are executed, and steps S2 to S5 are cycled, the film tearing angle and the tension are controlled in real time, and the problem of film tearing angle mismatch is reduced.

Description

Technical Field

[0001] This invention belongs to the field of film-tearing technology, and more specifically, relates to a method for controlling the adjustment of the film-tearing angle. Background Technology

[0002] In the debonding process of semiconductor wafer manufacturing, the film peeling operation is the core step to separate the wafer from the carrier substrate. The film peeling angle directly affects the stress state of the film and the separation effect, and is directly related to whether the film breaks, whether there is a residual adhesive layer on the wafer surface, and whether the wafer edge circuit is damaged.

[0003] As semiconductor technology advances towards larger wafer sizes and more diverse film materials, the physical properties of different film materials vary significantly. The requirements for tear-off angles also differ drastically depending on the wafer size. Thick film materials require smaller angles to avoid overload, while thin film materials require larger angles to ensure complete separation. However, traditional methods for setting tear-off angles often rely on operators' past experience to set fixed tear-off angle data, or adjustments are made only based on a single film material type. Fixed initial tear-off angle data is set only during the processing steps, without dynamic adjustment of the tear-off angle based on real-time monitoring data. This makes it difficult to adapt to the changing conditions in complex production scenarios, easily leading to problems such as film breakage and residual adhesive on the wafer surface. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a control method for adjusting the film-tearing angle. This solves the problem that in the prior art, traditional methods for setting the film-tearing angle often rely on the operator's past experience to set fixed film-tearing angle data, which is difficult to adapt to the real-time changing working conditions in complex production scenarios and is prone to film breakage and residual adhesive on the wafer surface.

[0005] The purpose and effectiveness of the method for adjusting the film-tearing angle of the present invention are achieved by the following specific technical means:

[0006] A method for adjusting the film-tearing angle includes the following steps:

[0007] S1: Based on the preset film material characteristic database, perform film tearing process parameter matching operation to obtain initial film tearing angle data and tension setting value data; based on wafer size and debonding process parameters, perform film tearing trajectory planning operation to obtain film tearing path and desired angle sequence;

[0008] S2: Real-time film tearing tension data is obtained based on a force sensor, and real-time film tearing angle data is obtained based on an encoder and an angle sensor;

[0009] S3: Based on real-time film tearing tension data and real-time film tearing angle data, perform peeling status assessment to obtain film tearing abnormality markers; based on real-time angle data and the expected angle sequence, obtain the angle deviation.

[0010] S4: Calculate the angle compensation amount based on the angle deviation to obtain the angle compensation amount; perform compensation based on the tear film abnormality flag to obtain the tension compensation amount; obtain the total angle adjustment command based on the angle compensation amount and the tension compensation amount.

[0011] S5: Based on the total angle adjustment command, perform servo system control operation to obtain the film tearing angle adjustment action and cycle through steps S2 to S5.

[0012] According to a preferred embodiment, the step of performing a film-tearing process parameter matching operation based on a preset film material characteristic database to obtain initial film-tearing angle data and tension setting value data; and performing a film-tearing trajectory planning operation based on wafer size and debonding process parameters to obtain the film-tearing path and desired angle sequence, including:

[0013] Obtain membrane type, thickness and adhesion parameters from the membrane property database, and query the standard tear angle range corresponding to the membrane type as the initial tear angle data;

[0014] The initial tear angle setting is determined based on the film thickness and adhesion parameters. When the film thickness is ≥50μm, the first tear angle is used, and when the film thickness is ≤20μm, the second tear angle is used. The first tear angle is smaller than the second tear angle. When the film thickness is in the range of (20, 50)μm, a linear transition angle is used. The linear transition angle means that the higher the film thickness, the closer the tear angle is to the first tear angle, and the lower the film thickness, the closer the tear angle is to the second tear angle.

[0015] The tension safety threshold is set according to the adhesion force parameters. The tension safety threshold includes an upper limit to prevent breakage and a lower limit to prevent residue.

[0016] The wafer dimensions and debonding process parameters are obtained, and a spiral trajectory starting from the edge of the wafer is generated as the moving path of the film-peeling module.

[0017] Path points are set every 1 mm along the moving path, and the expected tear angle data of each path point is defined. An expected angle sequence is formed based on the expected tear angles of multiple path points.

[0018] According to a preferred embodiment, the step of acquiring real-time film tearing tension data based on a force sensor and acquiring real-time film tearing angle data based on an encoder and an angle sensor includes:

[0019] Based on the force sensors installed on the film-tearing module and the film-pressing roller, the vertical peeling force and the horizontal shearing force are collected simultaneously.

[0020] The resultant force of peeling force and shear force is used as the real-time film tearing tension data;

[0021] The encoder and angle sensor integrated into the servo lifting module are used to obtain the Z-axis height of the film-tearing module to obtain real-time film-tearing angle data.

[0022] According to a preferred embodiment, the peeling state assessment operation based on real-time film tearing tension data and real-time film tearing angle data to obtain a film tearing abnormality flag; and the acquisition of angle deviation based on real-time angle data and a desired angle sequence, including:

[0023] The real-time film tearing tension data is compared with the set tension safety threshold to obtain the film tearing abnormality flag.

[0024] Among them, when the real-time film tearing tension data exceeds the upper limit threshold to prevent breakage, the film tearing abnormality flag is indicated as "over-tension" abnormality;

[0025] When the real-time film tearing tension data is lower than the lower limit threshold for preventing residue, the film tearing abnormality flag indicates a "low tension" abnormality.

[0026] Angle compliance checks are performed based on real-time angle data and the expected angle sequence to obtain the angle deviation.

[0027] According to a preferred embodiment, the angle compliance check operation based on real-time angle data and a desired angle sequence to obtain the angle deviation includes:

[0028] Based on real-time film tearing angle data, path points at the same moment are extracted from the expected angle sequence. The real-time angle data is compared with the expected film tearing angle data of the path points. When the angle deviation exceeds ±5°, a film tearing abnormality flag bit represented as "angle deviation" is obtained.

[0029] The deviation between the real-time angle data and the expected film-tearing angle data at the path point is calculated to obtain the angle deviation.

[0030] According to a preferred embodiment, the step of calculating the angle compensation amount based on the angle deviation to obtain the angle compensation amount; performing a compensation operation based on the tear film abnormality flag to obtain the tension compensation amount; and obtaining a total angle adjustment command based on the angle compensation amount and the tension compensation amount includes:

[0031] Based on the angle deviation, the angle compensation is calculated using a PID control algorithm, including proportional, integral, and derivative terms.

[0032] Tension compensation is performed based on the abnormal tear film marker to obtain the tension compensation amount;

[0033] Specifically, when the tear film abnormality flag indicates an "over-tension" abnormality, the initial tear film angle data is reduced.

[0034] When the tear film abnormality flag indicates a "low tension" abnormality, add the initial tear film angle data;

[0035] When the tear film abnormality flag indicates an "angle deviation" abnormality, the initial tear film angle data is directly corrected.

[0036] The weighting coefficients of the angle compensation and tension compensation are adjusted according to the membrane material type, and a weighted fusion calculation is performed to obtain the total angle adjustment command and output to the servo driver.

[0037] According to a preferred embodiment, the step of performing servo system control operation based on the total angle adjustment command, obtaining the film tearing angle adjustment action, and cyclically performing steps S2 to S5 includes:

[0038] Based on the overall angle adjustment command, the height of the film-tearing module is adjusted via the servo lifting module to adjust the initial film-tearing angle data;

[0039] The process of steps S2 to S5 is repeated, and the adjusted real-time film tearing tension data and real-time film tearing angle data are obtained through force sensor and angle sensor.

[0040] Among them, the film tearing operation continues if no abnormal tearing indicator appears;

[0041] If the film tearing abnormality flag appears in three consecutive cycles, the emergency stop mechanism will be triggered and an alarm will be sounded.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] 1. In the initial parameter setting stage, the type, thickness, and adhesion parameters of the current film material are extracted from the film material characteristic database. The standard tear angle range of the corresponding film material is queried, and the initial tear angle setting value is determined according to the thickness difference and adhesion magnitude. At the same time, the spiral tearing path is planned in combination with the wafer size and debonding process parameters, and the desired tear angle at each point along the path is set to form a desired angle sequence. This setting method no longer relies on subjective experience, but is based on the physical properties of the film material and the production process requirements. It ensures that the initial angle can not only match the tensile strength and separation requirements of the film material, but also conform to the stress characteristics of different positions on the wafer, reducing the film material breakage or wafer residue problems caused by the mismatch of tear angles.

[0044] 2. By controlling the film-tearing angle and tension in real time, the system addresses the changing working conditions in complex production scenarios. During the film-tearing process, force sensors installed on the film-tearing module and the pressure rollers simultaneously collect vertical peeling force and horizontal shearing force, calculating the resultant force as real-time film-tearing tension data. The encoder and angle sensor integrated into the servo lifting module acquire the Z-axis height of the film-tearing module in real time, thereby obtaining real-time film-tearing angle data. These real-time data are compared with the tension safety threshold and the desired angle sequence to obtain film-tearing anomaly flags and generate targeted compensation schemes. Specifically, the film-tearing angle is reduced to decrease the stress on the film material when there is excessive tension, and the film-tearing angle is increased to ensure complete separation when there is low tension. When there is an angle deviation, the angle is directly corrected. At the same time, a PID control algorithm is used to calculate the angle compensation amount, and the compensation weight is adjusted in combination with the film material type to form a total angle adjustment command, dynamically correcting angle deviation and tension anomalies, avoiding film-tearing problems caused by changes in working conditions under the traditional fixed angle mode.

[0045] 3. After the servo system is controlled based on the total angle adjustment command, steps S2 to S5 are repeated. The angle adjustment effect is verified by a new round of sensor data. If no abnormality flag is detected, the film removal operation continues. If the abnormality still occurs after 3 consecutive cycles, the system will trigger an emergency stop mechanism and alarm, and cut off the power supply to the relevant drive components in time. This closed-loop mechanism can continuously verify the effectiveness of the angle adjustment and avoid the accumulation of deviations that may lead to film breakage or residual adhesive. The emergency stop warning can prevent the abnormality from expanding and causing further damage to the wafer or equipment when conventional compensation cannot solve the problem, thus ensuring the safety of the film removal process. Attached Figure Description

[0046] Figure 1 This is a flowchart of the steps of the present invention.

[0047] Figure 2 This is a flowchart of the steps in this invention to obtain initial film tearing angle data, tension set value data and desired angle sequence. Detailed Implementation

[0048] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but should not be used to limit the scope of protection of the present invention.

[0049] Example:

[0050] As attached Figures 1 to 2 As shown:

[0051] This invention provides a method for controlling the film-tearing angle, comprising the following steps:

[0052] S1: Based on the preset film material characteristic database, perform film tearing process parameter matching operation to obtain initial film tearing angle data and tension setting value data; based on wafer size and debonding process parameters, perform film tearing trajectory planning operation to obtain film tearing path and desired angle sequence;

[0053] Specifically, obtaining the initial film tearing angle data, tension setpoint data, and desired angle sequence includes:

[0054] S100: Obtain the membrane type, thickness, and adhesion parameters from the membrane material properties database, and query the standard tear angle range corresponding to the membrane type as the initial tear angle data. The membrane material properties database needs to be pre-entered with basic membrane material information for different application scenarios, covering membrane type, full-specification thickness parameters, adhesion test results under different ambient temperatures, and the standard tear angle range of each membrane type that has been verified through long-term experiments. When using it, the operator enters the model of the membrane material to be processed, extracts the corresponding type, thickness, and adhesion parameters from the membrane material properties database, and then matches the preset standard tear angle range according to the membrane type. The setting of this range is determined by the physical properties of different membrane materials. The standard angle range is larger for tough membrane materials and smaller for brittle membrane materials. Its function is to provide a scientific reference range for the initial tear angle and avoid the angle exceeding the reasonable range due to relying solely on experience.

[0055] For example, when processing a 50μm thick high-adhesion UV film used on a 12-inch wafer, after the operator inputs the film material model, the system extracts the film type as high-adhesion UV film, thickness as 50μm, and adhesion force as 6N / 25mm from the film material characteristic database. Then, it finds that the standard tear angle range for the high-adhesion UV film is 30°-45°. This range is used as the initial tear angle data to provide a basis for determining the specific initial value later. The above data is only used for logical reference, and the specific data should be determined according to the specific situation.

[0056] S101: Determine the initial tear angle setting value based on the film thickness and adhesion parameters. Specifically, when the film thickness is ≥50μm, a first tear angle is used; when the film thickness is ≤20μm, a second tear angle is used. The first tear angle is smaller than the second tear angle. When the film thickness is in the range of (20, 50)μm, a linear transition angle is used. The linear transition angle means that the higher the film thickness, the closer the tear angle is to the first tear angle; the lower the film thickness, the closer the tear angle is to the second tear angle. Specifically, when the film thickness is ≥50μm, due to its weak tensile strength, if the tear angle is too large, the vertical peeling force on the film material during tearing will increase, easily leading to transverse tearing. Therefore, the first tear angle is used to reduce the force. When the film thickness is ≤20μm... Because of its good flexibility but relatively small contact area with the wafer surface, if the tearing angle is too small, the film material may not separate completely from the wafer, leaving residue. Therefore, a second tearing angle is required to enhance the peeling effect. For film materials with a thickness in the range of (20, 50) μm, the initial angle is adjusted linearly according to the thickness value. The closer the thickness is to 50 μm, the closer the initial angle is to the first tearing angle. The closer the thickness is to 20 μm, the closer the initial angle is to the second tearing angle. At the same time, the adhesion force parameter is finely adjusted: for film materials with high adhesion force, the angle is appropriately reduced on the basis of the corresponding thickness to avoid excessive force. For film materials with low adhesion force, the angle is appropriately increased to ensure complete separation. Its function is to make the initial tearing angle setting value accurately match the thickness and adhesion force of the current film material, rather than arbitrarily selecting it within the standard range.

[0057] For example, a 50μm thick high-adhesion UV film has a relatively high adhesion of 6N / 25mm. Within the standard range of 30°-45°, the system selects the smaller value of 35° as the initial tear angle setting. This not only meets the requirement of a smaller first tear angle, but also appropriately reduces the angle due to the high adhesion to avoid the film material being subjected to stress beyond its tolerance limit. The above data is only for logical reference, and the specific data should be determined according to the specific situation.

[0058] S102: Set the tension safety threshold according to the adhesion parameters. The tension safety threshold includes an upper limit threshold to prevent breakage and a lower limit threshold to prevent residue. The upper limit threshold to prevent breakage should be set with reference to the tensile breaking strength of the film material. It is usually set to a value slightly lower than the tensile breaking strength of the film material to ensure that the real-time tearing tension during the film removal process does not exceed this threshold and to avoid the film material breaking due to excessive force. The lower limit threshold to prevent residue should be set higher than the adhesion of the film material. It is usually 1.1-1.2 times the adhesion force to ensure that the real-time tearing tension is sufficient to overcome the adhesion between the film material and the wafer surface, so that the film material completely detaches from the wafer and leaves no residue. Its function is to provide a clear judgment standard for real-time monitoring of tearing tension in subsequent steps.

[0059] For example, a 50μm thick high-adhesion UV film has an adhesion force of 6N / 25mm. The tensile breaking strength of this film material is tested to be 9N. Therefore, the upper limit for preventing breakage is set to 8N, with a safety margin of 1N. The lower limit for preventing residue is set to 7.2N, forming a tension safety threshold range. Subsequent real-time tension data must be between 7.2N and 8N to meet the requirements. The above data is only for logical reference, and the specific data should be determined according to the specific situation.

[0060] S103: Obtain wafer dimensions and debonding process parameters to generate a spiral trajectory starting from the wafer edge as the moving path of the film-peeling module. The wafer size determines the radius of the spiral trajectory. Larger wafers require a larger trajectory radius to cover the entire area from the edge to the center, while smaller wafers require a smaller trajectory radius, necessitating control of the trajectory density to avoid repeated film peeling. Debonding process parameters include debonding temperature and pressing pressure. At higher debonding temperatures, the adhesion between the film and the wafer decreases slightly, allowing for a slight increase in the spiral trajectory pitch to improve peeling efficiency. At lower debonding temperatures, the adhesion is higher, requiring a decrease in the pitch to ensure complete film separation. Similarly, a decrease in pitch is necessary when the pressing pressure is high. The trajectory starts from the wafer edge because the bonding force between the film and the substrate is relatively weak at the wafer edge. Starting peeling from the edge reduces initial peeling resistance and avoids localized force concentration caused by peeling directly from the center. Its function is to ensure that the moving path of the film-peeling module conforms to the wafer shape and process requirements, resulting in uniform force on the film during peeling.

[0061] For example, with a 12-inch wafer and a debonding temperature of 60°C, the system generates a spiral trajectory starting 2mm from the wafer edge. The trajectory radius gradually decreases from 150mm to 0mm, and the pitch is set to 4mm. This pitch ensures complete film removal coverage without reducing the film removal efficiency due to an excessively small pitch. The above data is for logical reference only, and the specific data should be determined according to the specific situation.

[0062] S104: Set a path point every 1mm along the moving path, define the expected film tearing angle data for each path point, and form an expected angle sequence based on the expected film tearing angles of multiple path points. Setting a path point every 1mm along the moving path is to ensure that the path point density is high enough to cover every position during the movement of the film tearing module, and to avoid some areas lacking angle reference due to sparse path points. The expected film tearing angle of each path point needs to be defined according to the stress characteristics of that position. The film material in the wafer edge area is easy to separate, and the expected angle can be consistent with the initial film tearing angle setting value. When it is close to the center area, the film material covers a large area and is more tightly bonded to the wafer, and the stress is relatively large. The expected angle needs to be appropriately reduced to reduce the stress and avoid film material breakage in the center area. After the definition is completed, arrange all path points in the moving order, with each path point corresponding to an expected film tearing angle, forming an expected angle sequence. Its function is to provide a standard angle corresponding to the position for subsequent real-time film tearing angle monitoring, which is convenient for judging whether the angle of different positions is deviated.

[0063] For example, when using a 12-inch wafer and a 50μm thick high-viscosity UV film, along a spiral trajectory with a pitch of 4mm, a path point is set every 1mm, generating approximately 470 path points. The expected tearing angle for the edge path point (X: 150mm, Y: 0mm) is defined as 35°; for the path point 50mm from the edge (X: 100mm, Y: 0mm), the expected angle is defined as 34°; for the path point 100mm from the edge (X: 50mm, Y: 0mm), the expected angle is defined as 33°; and for the path point near the center (X: 10mm, Y: 0mm), the expected angle is defined as 30°. These expected angles are then arranged in the trajectory order to form a complete expected angle sequence. The above data is for logical reference only; specific data should be determined based on specific circumstances. When the tearing module moves to the corresponding path point, the real-time angle can be compared with the expected angle at that point to determine if there is any deviation.

[0064] Furthermore, in the initial parameter setting stage, the entire process eliminates the need for operators to input angle, tension, or path parameters based on experience. Instead, it is entirely based on objective data from the film material characteristic database and the actual needs of the wafer and process parameters. The system automatically matches and calculates the parameters, from extracting the film material type, thickness, and adhesion to determine the initial angle and tension threshold, to planning the spiral path and desired angle sequence based on wafer size and process parameters. Each step is based on the physical properties of the film material and the requirements of the production process, ensuring that the initial film-tearing angle is suitable for the tensile strength of the film material to avoid film breakage due to excessive angle, and also meets the separation requirements between the film material and the wafer to prevent residual adhesive due to insufficient angle. At the same time, the setting of the desired angle sequence is tailored to the stress characteristics of different positions on the wafer, providing a precise reference for subsequent real-time angle adjustments, reducing various problems caused by mismatched film-tearing angles from the initial stage.

[0065] S2: Real-time film tearing tension data is obtained based on a force sensor, and real-time film tearing angle data is obtained based on an encoder and an angle sensor;

[0066] Specifically, force sensors need to be installed on the inner side of the clamping end of the film-tearing module and the shaft end of the pressure roller, respectively. The inner side of the clamping end of the film-tearing module directly contacts the film material to be torn off. The force sensor here is used to collect the vertical peeling force when the film material is torn off the wafer surface. The shaft end of the pressure roller makes rolling contact with the film material to help fix the film material and transmit the horizontal force. The force sensor here is used to collect the horizontal shearing force generated between the film material and the wafer surface when the film-tearing module moves laterally. The two sets of force sensors are connected to the control unit through wires to ensure that the data of the two forces are collected synchronously during the film-tearing process, so as to avoid deviations in force analysis due to asynchronous collection time. After collecting the vertical peeling force and the horizontal shearing force, the control unit will calculate the resultant force of the two according to the vector synthesis principle. Specifically, it calculates the square root of the sum of the square of the peeling force and the square of the shearing force using the Pythagorean theorem. This resultant force is used as the real-time film-tearing tension data. This method can completely reflect the actual stress state of the film material in three-dimensional space. Compared with collecting force data in only one direction, it can avoid missing the local stress concentration in the lateral or longitudinal direction.

[0067] For example, a 50μm thick high-viscosity UV film has a higher rigidity, so the horizontal shear force during the tearing process will be significantly greater than that of a 20μm thick high-viscosity UV film. If only the vertical peel force is monitored, it may be mistakenly judged that the overall stress on the film material is within a safe range. However, by calculating the combined force, it is possible to detect in time that the overall tension exceeds the standard due to excessive shear force, and prevent the transverse tearing of the film material in advance.

[0068] When acquiring real-time film-peeling angle data using an encoder and angle sensor integrated into the servo lifting module, the encoder needs to be installed on the motor output shaft of the servo lifting module. The motor rotation drives the film-peeling module to rise and fall along the Z-axis. The encoder calculates the real-time Z-axis height of the film-peeling module by recording the number of motor rotations and combining this with the corresponding lead screw feed per motor rotation. The angle sensor is installed next to the guide rail of the servo lifting module and directly monitors the angle between the film-peeling module and the wafer surface using laser or infrared detection. This helps confirm the accuracy of the encoder's calculation results and avoids deviations in Z-axis height calculation due to motor transmission backlash. The film-peeling angle is the angle formed between the film-peeling module and the wafer surface, and its size is directly related to the Z-axis height of the film-peeling module. When the Z-axis height increases, the angle between the film-peeling module and the wafer surface increases; when the Z-axis height decreases, the angle decreases. The control unit calculates the real-time film-peeling angle data based on the real-time Z-axis height and the horizontal length of the film-peeling module, using the trigonometric function tangent equal to the Z-axis height divided by the horizontal projected length of the film-peeling module. This data reflects the rationality of the film peeling direction.

[0069] For example, when processing the 50μm thick high-viscosity UV film, if the Z-axis height of the film-tearing module is unexpectedly reduced due to mechanical vibration of the servo lifting module, the real-time film-tearing angle will decrease accordingly, which may lead to incomplete separation of the film material from the wafer. Through the coordinated monitoring of the angle sensor and the encoder, this change can be captured in time, providing a basis for subsequent anomaly assessment.

[0070] S3: Based on real-time film tearing tension data and real-time film tearing angle data, perform peeling status assessment to obtain film tearing abnormality markers; based on real-time angle data and the expected angle sequence, obtain the angle deviation.

[0071] Specifically, the control unit first receives real-time data collected in S2. The real-time film-tearing tension data is obtained by force sensors installed on the film-tearing module and the pressure roller synchronously collecting vertical peeling force and horizontal shear force, and then the control unit calculates the resultant force according to the vector synthesis principle. The real-time film-tearing angle data is obtained by the encoder and angle sensor integrated in the servo lifting module monitoring the Z-axis height of the film-tearing module and converting it into the angle between the film-tearing module and the wafer surface. Then, the control unit calls the tension safety threshold set in S1 and compares the real-time film-tearing tension data with the upper limit of the breakage prevention threshold and the lower limit of the residue prevention threshold one by one to obtain the film-tearing abnormality flag. The function of this flag is to clarify whether there is a risk in the current film-tearing tension and provide a basis for the abnormality type for subsequent compensation operations.

[0072] When the real-time tear tension data exceeds the upper limit threshold to prevent breakage, it means that the current stress on the membrane material is close to or has reached the tensile breaking strength. Continuing to maintain this tension will easily lead to transverse tearing of the membrane material. Therefore, the tear abnormality flag is indicated as "over-tension" abnormality.

[0073] When the real-time tear film tension data is lower than the lower limit threshold for preventing residue, it indicates that the tensile force on the film material is insufficient to completely overcome its adhesion to the wafer surface, which can easily lead to incomplete film separation and residual adhesive layer on the wafer surface. Therefore, the tear film abnormality flag is indicated as "low tension" abnormality.

[0074] For example, the tension safety threshold for a 50μm thick high-viscosity UV film is a lower limit of 7.2N to prevent residue and an upper limit of 8N to prevent breakage. If the real-time tear-off tension data is 8.5N, the control unit will determine that it exceeds the upper limit and generate an "over-tension" abnormal flag. If the real-time tear-off tension data is 7N, which is lower than the lower limit, an "under-tension" abnormal flag will be generated. The above data is only for logical reference, and the specific data should be determined according to the specific situation.

[0075] Furthermore, in the angle evaluation stage, the control unit extracts the path point corresponding to the same time or position from the expected angle sequence generated in S1 based on the acquisition timestamp of the real-time film tearing angle data or the real-time position of the film tearing module. The control unit searches for the path point corresponding to the coordinate in the expected angle sequence to confirm the expected film tearing angle data of the path point. The purpose of this matching method is to ensure that the comparison between the real-time angle and the expected angle has positional correlation and avoid evaluation errors caused by comparing angles at different positions. Subsequently, the control unit calculates the difference between the real-time film tearing angle data and the expected film tearing angle data of the path point. When the calculated angle deviation exceeds ±5°, it indicates that the current angle of the film tearing module has deviated from the preset reasonable range, which is likely to cause uneven stress on the film material. Therefore, a film tearing abnormality flag bit represented as "angle deviation" is obtained. At the same time, the control unit records the specific difference between the real-time film tearing angle data and the expected film tearing angle data. This difference is the angle deviation amount. The purpose of the angle deviation amount is to provide a quantitative basis for the calculation of the angle compensation amount in S4, ensuring that the compensation operation can accurately correct the angle deviation.

[0076] S4: Calculate the angle compensation amount based on the angle deviation to obtain the angle compensation amount; perform compensation based on the tear film abnormality flag to obtain the tension compensation amount; obtain the total angle adjustment command based on the angle compensation amount and the tension compensation amount.

[0077] Specifically, when calculating the angle compensation amount using the PID control algorithm based on the angle deviation, the control unit first extracts the angle deviation obtained from S3, and then calculates the proportional, integral, and derivative terms of the PID: the proportional term is obtained by multiplying the angle deviation by a preset proportional coefficient, and its function is to quickly respond to the current angle deviation and avoid the deviation from continuing to increase. For example, if the proportional coefficient is set to 0.8, and the angle deviation is -5°, the proportional term output is -5° × 0.8 = -4°; the integral term is obtained by accumulating the sum of the angle deviations of 5 consecutive sampling periods and then multiplying it by the integral coefficient 0.3, and its function is to eliminate long-term small cumulative deviations; the derivative term is obtained by calculating the rate of change of the angle deviation between two adjacent periods and then multiplying it by the derivative coefficient 0.2, and its function is to predict the trend of deviation changes and prevent over-adjustment; then the results of the proportional, integral, and derivative terms are added together to obtain the angle compensation amount.

[0078] When obtaining the tension compensation amount based on the tear film abnormality flag, the control unit will adjust the initial tear film angle according to different abnormality types. This is because the tear film angle is directly related to the force on the film material. A smaller angle will reduce the vertical peeling force, thereby reducing the total tension; a larger angle will increase the peeling force and increase the total tension. When the tear film abnormality flag indicates an "over-tension" abnormality, the initial tear film angle data will be reduced, and the real-time tear film tension will be reduced back to the safe threshold by reducing the peeling force.

[0079] For example, when a 50μm thick high-viscosity UV film experiences an over-tension of 8.5N, the initial 35° tear angle is reduced to decrease the vertical peeling force. When the tear abnormality flag indicates a "low tension" abnormality, the initial tear angle data is increased to raise the tension to a safe range by increasing the peeling force. If the film tension drops to a low tension of 7N, the 35° angle is appropriately increased. When the tear abnormality flag indicates an "angle deviation" abnormality, the initial tear angle data is directly corrected to bring the real-time angle back to the desired angle. The above data is for logical reference only; specific data should be determined based on the specific circumstances.

[0080] The weighting coefficients for angle compensation and tension compensation are adjusted according to the membrane material type because different membrane materials have different sensitivities to angle and tension. Brittle membrane materials are more sensitive to changes in angle, so the weight of angle compensation needs to be increased; tough membrane materials are more adaptable to changes in tension, so the weight of tension compensation can be increased. The total weighting coefficient is 1.

[0081] For example, a 50μm thick high-viscosity UV film is a medium-toughness film material. The angle compensation weight is set to 0.6 and the tension compensation weight is set to 0.4. Then, a weighted fusion calculation is performed: Total angle adjustment command = angle compensation amount × angle weight + angle adjustment value corresponding to tension compensation amount × tension weight. After the calculation is completed, the total angle adjustment command is output to the servo driver to guide the servo lifting module to adjust the Z-axis height of the film tearing module to achieve angle correction. The above data is only used for logical reference, and the specific data should be determined according to the specific situation.

[0082] Furthermore, the entire process responds to changes in working conditions through real-time control. During film peeling, force sensors installed on the film peeling module and pressure rollers synchronously collect vertical peeling force and horizontal shear force, calculating the resultant force as real-time film peeling tension data. The encoder and angle sensor integrated into the servo lifting module obtain the Z-axis height of the film peeling module and calculate the real-time film peeling angle data. The control unit compares these data with the tension safety threshold and the desired angle sequence to accurately obtain the film peeling abnormality flag and generate a targeted compensation scheme—reducing the angle to reduce the force on the film material when there is excessive tension, increasing the angle to increase the force when there is low tension, and directly correcting the angle when there is an angle deviation. At the same time, the angle compensation amount is calculated through the PID algorithm, and the weight is adjusted according to the film material type to form a total angle adjustment command, dynamically correcting the angle deviation and tension abnormality, avoiding the film material breakage or residual adhesive problems caused by changes in working conditions such as local adhesion force and mechanical vibration in the traditional fixed angle mode, ensuring the stability of the film peeling process.

[0083] S5: Based on the total angle adjustment command, perform servo system control operation to obtain the film tearing angle adjustment action and cycle through steps S2 to S5.

[0084] Specifically, when adjusting the height of the film-tearing module based on the total angle adjustment command, the servo driver first receives the total angle adjustment command output by S4. This command includes the amount of Z-axis height change that the film-tearing module needs to adjust. The servo driver sends a drive signal to the motor of the servo lifting module according to the command, controlling the motor to rotate in a preset direction. The rotation of the motor drives the film-tearing module to move along the Z-axis direction through the lead screw transmission structure. During the process, the encoder integrated into the servo lifting module records the number of motor rotations in real time and converts it into the actual Z-axis height change of the film-tearing module to ensure that the actual adjustment amount is consistent with the command requirements. The purpose of this operation is to correct the film-tearing angle to the desired range, and at the same time, indirectly optimize the real-time film-tearing tension through angle adjustment, so that both meet the process requirements.

[0085] When steps S2 to S5 are repeated, after one servo adjustment is completed, the control unit immediately triggers the loop mechanism: S2 is executed again, and new vertical peeling force and horizontal shear force are collected by force sensors installed on the film tearing module and the pressure roller. The adjusted real-time film tearing tension data is calculated, and new real-time film tearing angle data is obtained through encoder and angle sensor; then S3 is executed, and the new data is compared with the tension safety threshold and the expected angle sequence to evaluate whether there is still a film tearing abnormality flag; then S4 is executed. If there is an abnormality, a new compensation amount and total angle adjustment command are calculated. If there is no abnormality, the current parameters are maintained; finally, S5 is returned to execute a new adjustment or continue film tearing. The purpose of this loop is to verify the angle adjustment effect in real time, avoid the accumulation of deviations due to a single incomplete adjustment, and ensure the continuous stability of the film tearing process.

[0086] If no abnormal tearing flag is detected, the tearing operation continues. Specifically, when the S3 evaluation result in the cycle shows that the real-time tearing tension data is between the upper limit to prevent breakage and the lower limit to prevent residue, and the deviation between the real-time tearing angle data and the path point corresponding to the expected angle sequence does not exceed ±5°, the control unit determines that the current tearing status is normal. It does not generate a new total angle adjustment command, but controls the tearing module to continue moving according to the preset tearing path, and processes the tearing operation of subsequent path points in sequence to ensure the continuous operation of the production process.

[0087] When the film-tearing abnormality flag is detected in three consecutive cycles, an emergency stop mechanism is triggered and an alarm is sounded. The control unit counts the abnormal results of each cycle. If an abnormality occurs in the first cycle, and still occurs after adjustment in the second cycle, and then occurs again in the third cycle, it is determined that the current abnormality cannot be eliminated by conventional compensation. At this time, the control unit immediately sends a power-off signal to the servo lifting module and the film-tearing module drive motor to cut off the power supply to the relevant components, stop the film-tearing action, and at the same time, the alarm light on the control equipment flashes continuously and emits an intermittent alarm sound through the buzzer to prompt the operator to check the cause of the abnormality. The purpose of this mechanism is to prevent the abnormality from continuing to cause the film material to break, residual adhesive on the wafer surface, or damage to the wafer edge, thereby reducing the risk of defective products and equipment damage.

[0088] For example, when using a 12-inch wafer and a 50μm thick high-viscosity UV film, the tension safety threshold is 7.2N-8N. The desired tearing angle at a certain path point is 34°. If the total angle adjustment command output by S4 is to reduce the Z-axis height by 0.4mm, corresponding to an angle decrease from 37° to 34°, the servo driver receives the command and controls the servo lifting module motor to reverse, driving the tearing module's Z-axis height from 14.6mm to 14.2mm via the lead screw. The encoder confirms the actual height reaches 14.2mm, and the angle is corrected to 34°. Then, the loop continues, and S2 collects the adjusted real-time tearing tension data as 7.8N and the real-time tearing angle data. The angle is 34°. S3 assessment shows no abnormalities. Continue processing the next path point along the spiral trajectory. If the real-time film-tearing tension is still 8.1N (over-tension) after the first adjustment, and after adjusting the angle to 33° in the second cycle, the tension is still 8.05N (over-tension), and after adjusting the angle to 32° in the third cycle, the tension is still 8.2N (over-tension). The control unit immediately triggers an emergency stop, cutting off the power to the servo lifting module. The film-tearing module stops moving, the alarm light flashes, and the buzzer sounds, prompting the operator to check if there are any areas of high adhesion in the 50μm thick high-adhesion UV film, or if the force sensor is malfunctioning. The above data is for logical reference only; specific data should be determined based on the specific situation.

[0089] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A control method for adjusting a film tearing angle, characterized by: The method comprises the following steps: S1: based on the preset film material characteristic database, perform film tearing process parameter matching operation to obtain initial film tearing angle data and tension setting value data; Based on the wafer size and the debonding process parameters, perform film tearing trajectory planning operation to obtain the film tearing path and the expected angle sequence; S2: based on the force sensor, obtain real-time film tearing tension data, based on the encoder and the angle sensor, obtain real-time film tearing angle data; S3: based on the real-time film tearing tension data and the real-time film tearing angle data, perform peeling state evaluation operation to obtain a film tearing abnormality flag; based on the real-time angle data and the expected angle sequence, obtain an angle deviation amount; S4: based on the angle deviation amount, perform angle compensation amount calculation operation to obtain an angle compensation amount; Based on the film tearing abnormality flag, perform compensation operation to obtain a tension compensation amount; Based on the angle compensation amount and the tension compensation amount, obtain a total angle adjustment instruction; S5: based on the total angle adjustment instruction, perform servo system regulation and control operation to obtain film tearing angle adjustment actions and perform cycles on steps S2 to S5; The real-time film tearing tension data and the real-time film tearing angle data are used to perform peeling state evaluation operation to obtain a film tearing abnormality flag; Based on the real-time angle data and the expected angle sequence, obtain an angle deviation amount, which comprises: Compare the real-time film tearing tension data with the set tension safety threshold to obtain a film tearing abnormality flag; When the real-time film tearing tension data exceeds the upper limit anti-breakage threshold, the film tearing abnormality flag indicates "over-tension" abnormality; When the real-time film tearing tension data is lower than the lower limit anti-residue threshold, the film tearing abnormality flag indicates "low tension" abnormality; Based on the real-time film tearing angle data, extract the path point at the same time from the expected angle sequence, and compare the real-time angle data with the expected film tearing angle data of the path point; when the angle deviation exceeds ±5°, obtain a film tearing abnormality flag indicating "angle deviation"; Calculate the deviation amount of the real-time angle data and the expected film tearing angle data of the path point to obtain the angle deviation amount; The angle compensation amount calculation operation based on the angle deviation amount obtains an angle compensation amount; the compensation operation based on the film tearing abnormality flag obtains a tension compensation amount; and the total angle adjustment instruction based on the angle compensation amount and the tension compensation amount comprises: Based on the angle deviation amount, use a PID control algorithm to calculate the angle compensation amount, including a proportional term, an integral term and a differential term; Based on the film tearing abnormality flag, perform tension compensation to obtain a tension compensation amount; When the film tearing abnormality flag indicates "over-tension" abnormality, decrease the initial film tearing angle data; When the film tearing abnormality flag indicates "low tension" abnormality, increase the initial film tearing angle data; When the film tearing abnormality flag indicates "angle deviation" abnormality, directly correct the initial film tearing angle data; According to the film material type, adjust the weight coefficients of the angle compensation amount and the tension compensation amount, perform weighted fusion calculation to obtain a total angle adjustment instruction and output the total angle adjustment instruction to a servo driver.

2. The control method of adjusting the film tearing angle according to claim 1, wherein The film tearing process parameter matching operation based on the preset film material characteristic database obtains initial film tearing angle data and tension setting value data; The film tearing trajectory planning operation is performed based on the wafer size and the debonding process parameters, and a film tearing path and a desired angle sequence are obtained, including: Obtaining the film material type, thickness and adhesion force parameters in the film material characteristic database, querying the standard film tearing angle range corresponding to the film material type as the initial film tearing angle data; Determining the initial film tearing angle set value according to the film layer thickness and the adhesion force parameters, wherein when the film layer thickness is greater than or equal to 50 μm, a first film tearing angle is adopted, when the film layer thickness is less than or equal to 20 μm, a second film tearing angle is adopted, the first film tearing angle is less than the second film tearing angle, when the film layer thickness is in the interval (20, 50) μm, a linear transition angle is adopted, and the linear transition angle is represented as the film layer thickness is higher, the film tearing angle is closer to the first film tearing angle, and the film layer thickness is lower, the film tearing angle is closer to the second film tearing angle; Setting a tension safety threshold according to the adhesion force parameter, the tension safety threshold including an upper limit fracture prevention threshold and a lower limit residual prevention threshold; Obtaining the wafer size and the debonding process parameters, and generating a spiral trajectory starting from the wafer edge as the moving path of the film tearing module; Setting a path point every 1 mm along the moving path, defining the desired film tearing angle data of each path point, and forming a desired angle sequence based on the desired film tearing angles of multiple path points.

3. The control method of adjusting the film tearing angle according to claim 1, wherein, The real-time film tearing tension data is obtained based on the force sensor, and the real-time film tearing angle data is obtained based on the encoder and the angle sensor, including: Based on the force sensor installed on the film tearing module and the film pressing roller, the peeling force in the vertical direction and the shear force in the horizontal direction are synchronously collected; The resultant force of the peeling force and the shear force is taken as the real-time film tearing tension data; Based on the encoder and the angle sensor integrated in the servo lifting module, the Z-axis height of the film tearing module is obtained to obtain the real-time film tearing angle data.

4. The control method of adjusting the film tearing angle according to claim 1, wherein, The servo system control operation is performed based on the total angle adjustment instruction, the film tearing angle adjustment action is obtained, and steps S2 to S5 are cycled, including: Based on the total angle adjustment instruction, the height of the film tearing module is adjusted by the servo lifting module to adjust the initial film tearing angle data; And steps S2 to S5 are cycled, and the adjusted real-time film tearing tension data and real-time film tearing angle data are obtained by the force sensor and the angle sensor; When the film tearing abnormal flag bit does not appear, the film tearing operation continues; When the film tearing abnormal flag bit appears in the continuous 3 cycles, the emergency stop mechanism is triggered and an alarm is given.

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