An apparatus and method for making a wafer frosted film transparent.

Abstract

This invention discloses a device for making a wafer frosted film transparent, comprising a module base plate with mounting holes; a glass plate mounted in the mounting holes, forming a water tank on the module base plate; a feeding mechanism including a first feeding unit and a second feeding unit disposed on both sides of the module base plate, the first and second feeding units operating independently to drive different sides of the wafer to move vertically relative to the water tank; a negative pressure suction component disposed on the module base plate, the negative pressure suction component being connected to the water tank; a wafer iron ring horizontally placed on the feeding mechanism, the feeding mechanism being controlled by separate side drives to allow the blue film to gradually adhere to the liquid surface in the lateral direction; after the blue film is fully adhered to the liquid surface, the negative pressure suction component extracts the liquid from the water tank to form a uniform water film between the blue film and the glass plate. This application solves the problem of the blue film sagging causing the wafer surface to exceed the microscope depth of field, eliminating the need for product flipping, simplifying the equipment process, and improving operational efficiency and yield.

Description

Technical Field

[0001] The present invention relates to the field of wafer inspection technology, and in particular to an apparatus and method for making a wafer frosted film transparent. Background Technology

[0002] Before dicing, the wafer needs to be adhered to a blue film and fixed to a wafer ferrule to ensure dicing precision and integrity. After dicing, there is a risk of defects such as edge chipping and microcracks on the back side of the wafer. These defects are usually located on the bottom of the wafer and are difficult to observe directly through front-side microscopic imaging.

[0003] To detect defects on the back side of a wafer, current techniques commonly employ a method of rotating an iron ring 180° and spraying a transparent liquid onto the surface of a blue film. This liquid fills the frosted structure on the back of the blue film, achieving a temporary optical transparency effect for microscopic observation. However, this method has the following significant drawbacks:

[0004] The center of the flipped wafer lacks support and is prone to sagging deformation of 0.5mm to 2mm, causing the wafer surface to fall out of the effective depth of field of the microscope and affecting the imaging quality.

[0005] Because the blue film comes into contact with the liquid by "direct spraying", it is easy for air bubbles to form at the bonding interface, which affects the transparency and may even interfere with the results of microscopic detection.

[0006] The entire process relies on manual operation, making it difficult to automate in batches, which affects testing efficiency and yield.

[0007] Therefore, there is an urgent need for a wafer transparency device and method that can provide stable support, enable the blue film to gradually adhere to the liquid and effectively vent air, and can be used for automated microscopic inspection, in order to solve the problems of insufficient structural support, incomplete transparency, and low degree of automation in existing solutions. Summary of the Invention

[0008] To address the aforementioned problems in the prior art, the present invention provides an apparatus and method for making a wafer frosted film transparent, thereby solving the above-mentioned technical problems.

[0009] According to a first aspect of the present invention, an apparatus for making a wafer frosted film transparent is provided, comprising:

[0010] The module base plate has mounting holes.

[0011] A glass plate is installed in the mounting hole, and a water tank for containing liquid is formed on the bottom plate of the module.

[0012] The feeding mechanism includes a first feeding unit and a second feeding unit disposed on both sides of the module base plate. The first feeding unit and the second feeding unit work independently to drive different sides of the wafer to move up and down relative to the water tank in the vertical direction.

[0013] The module base plate is equipped with a negative pressure suction component, which is connected to the water tank;

[0014] The wafer's metal ring is placed horizontally on the feeding mechanism, which is controlled by a split-side drive to gradually adhere the blue film to the liquid surface in the lateral direction. Once the blue film is fully adhered to the liquid surface, a negative pressure suction component extracts the liquid from the water tank, forming a uniform water film between the blue film and the glass plate. This device controls the blue film to gradually adhere to the liquid surface from one side and expels air, preventing bubble formation and creating a uniform water film. This makes the blue film transparent, eliminating the need for flipping, simplifying the wafer backside microscopic inspection process, and improving operational efficiency and yield.

[0015] In some specific embodiments, the outer ring of the mounting hole is also provided with an O-ring retaining groove, and an O-ring is placed in the O-ring retaining groove. This feature improves the sealing performance between the glass plate and the module base plate, preventing liquid leakage.

[0016] In some specific embodiments, there is a height difference of 0.1-0.3 mm between the upper surface of the glass plate and the upper surface of the module base plate. Controlling the liquid level in the water tank ensures stable liquid coverage of the blue film, improving adhesion uniformity and transparency.

[0017] In some specific embodiments, both the first and second feeding units of the feeding mechanism include a driving component, a guiding component, and a supporting component. The supporting component is fixedly connected to the module base plate, and the driving component and the guiding component are disposed on the supporting component. This arrangement improves the accuracy of wafer placement, driving, and guiding, ensuring smooth lifting and good fit consistency.

[0018] In some specific embodiments, the load-bearing support component includes a vertical plate and corner brackets, with the vertical plate fixedly mounted on the module base plate via the corner brackets.

[0019] In some specific embodiments, the drive unit includes a drive motor, a cam, and a bearing, with the drive motor connected to the cam and the bearing engaging with the cam.

[0020] In some specific embodiments, the guide assembly includes an LM guide rail, a slider plate, and a bearing mounting plate. The slider plate is provided with a support seat for supporting the iron ring of the wafer. The slider plate and the bearing mounting plate are slidably fitted on the LM guide rail, and the slider plate and the bearing mounting plate are connected by a tension spring.

[0021] According to a second aspect of the present invention, a method for making a wafer frosted film transparent is provided, applied to the apparatus as described above, comprising:

[0022] S1: Inject a transparent liquid into the water tank formed by the module base plate and the glass plate;

[0023] S2: Place the wafer's metal ring horizontally above the support base of the feeding mechanism;

[0024] S3: Control the operation of the first feeding unit so that the blue film side contacts the liquid surface first;

[0025] S4: Control the second feeding unit to then operate so that the blue film gradually adheres to the liquid surface in the lateral direction, so as to expel the air between the blue film and the liquid;

[0026] S5: After the blue film is applied, start the negative pressure suction component to extract the excess liquid in the water tank and form a water film of uniform thickness between the blue film and the glass plate.

[0027] In some specific embodiments, the frosted structure on the surface of the blue film is filled with a water film to make the blue film transparent, enabling microscopic inspection of the back side of the wafer.

[0028] In some specific embodiments, after the detection is completed, the first and second feeding units are simultaneously controlled to rise, and positive pressure gas is introduced into the water tank to cause the blue film to detach from the glass plate surface.

[0029] The invention provides an apparatus and method for making a wafer frosted film transparent. By embedding a glass plate in the module base plate to form a water tank, and using a feeding unit with independent left and right control, the wafer blue film can be gradually attached to the liquid surface in the lateral direction, effectively expelling interface gas and avoiding residual air bubbles. After attachment, a water film of uniform thickness is formed by negative pressure suction, filling the frosted structure on the surface of the blue film and achieving a transparent effect. This allows for high-precision microscopic inspection without flipping the wafer and maintaining its flat support, significantly improving inspection efficiency and imaging quality, and possessing good automation adaptability and process stability. Attached Figure Description

[0030] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the invention. Other embodiments and many anticipated advantages of the embodiments will be readily recognized as they become better understood through reference to the following detailed description. Other features, objects, and advantages of this application will become more apparent from reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0031] Figure 1 This is a schematic diagram of a device for making a wafer frosted film transparent, according to an embodiment of the present invention.

[0032] Figure 2 This is a schematic diagram of the module base plate according to a specific embodiment of the present invention;

[0033] Figure 3 This is a schematic diagram of the structure of the feeding assembly according to a specific embodiment of the present invention;

[0034] Figure 4 This is a schematic diagram of the operation of the feeding assembly according to a specific embodiment of the present invention;

[0035] Figure 5 This is a schematic diagram of water film formation according to a specific embodiment of the present invention;

[0036] Figure 6 This is a flowchart of a method for making a wafer frosted film transparent, according to an embodiment of the present invention.

[0037] Reference numerals: 1. Module base; 11. Mounting hole; 12. O-ring fixing groove; 13. Vacuum drainage groove; 14. O-ring; 2. Glass plate; 3. Feeding assembly; 31. Vertical plate; 32. Corner code; 33. Drive motor; 34. Cam; 35. Bearing; 36. LM guide rail; 37. Slider horizontal plate; 38. Bearing mounting plate; 39. Support seat; 310. Tension spring; 4. Wafer iron ring; 41. Wafer; 42. Blue film; 43. Water film; 5. Air blowing assembly; 6. Air pipe connector. Detailed Implementation

[0038] In the description of this invention, it should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0039] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "installation," "connection," and "fixation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0040] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0041] Figure 1 A schematic diagram of a device for making a wafer frosted film transparent, according to an embodiment of the present invention, is shown. Figure 1 As shown, the device includes a module base 1, a glass plate 2, a feeding assembly 3, a wafer ring 4, an air blowing assembly 5, and an air pipe connector 6. The module base 1 serves as the supporting foundation for the entire device, and it has a water tank structure for holding transparent liquid. The feeding assembly 3 is located on the left and right sides of the module base 1, and is used to support and drive the wafer ring 4 to move vertically up and down, controlling the gradual contact between the blue wafer film and the liquid surface in the water tank. The wafer ring 4 is placed horizontally on the feeding assembly 3, and a wafer body is disposed inside it. The air blowing assembly 5 is used to peel the blue film off the surface of the glass plate 2 by blowing in positive pressure gas after wafer inspection. The air pipe connector 6 is used to connect to an external negative pressure suction system or a positive pressure gas source to realize functions such as liquid extraction or airflow control within the system.

[0042] Figure 2 A schematic diagram of the module base plate according to a specific embodiment of the present invention is shown, as follows: Figure 2 As shown, the module base 1 has mounting holes 11 for mounting glass plates 2. The glass plates 2 are placed inside the mounting holes 11, with their upper surface lower than the upper surface of the module base 1, thus forming a water tank structure between them. An O-ring fixing groove 12 is provided around the outer ring of the mounting holes 11, and a sealing ring (such as...) is embedded in the fixing groove 12. Figure 5 O-ring 14 (in the middle). O-ring 14 is used to seal the contact interface between glass plate 2 and module base 1 to prevent liquid leakage and ensure the sealing and stability of the water tank structure.

[0043] Figure 3 A schematic diagram of the feeding assembly according to a specific embodiment of the present invention is shown, as follows: Figure 3As shown, the feeding assembly 3 includes a first feeding unit and a second feeding unit disposed on both sides of the module base 1. The two units operate independently and are used to drive the two sides of the wafer iron ring 4 to rise and fall vertically, thereby achieving separate side control for the gradual contact between the blue film and the liquid surface. Each feeding unit includes three main parts: a driving assembly, a guiding assembly, and a supporting assembly. The supporting assembly includes a vertical plate 31 and a corner bracket 32. The corner bracket 32 ​​is used to fix the vertical plate 31 to the module base 1, forming a vertical frame structure and providing a rigid support foundation for the entire feeding unit 3. The driving assembly includes a driving motor 33, a cam 34, and a bearing 35. The driving motor 33 is fixedly mounted on the vertical plate 31, and its output shaft is connected to the cam 34. The cam 34 and the bearing 35 cooperate to convert the rotational motion into a lifting motion, driving one side of the wafer iron ring 4 to move downwards and closer to the liquid surface. The water tank; the guide assembly includes multiple sets of LM guide rails 36, slider horizontal plates 37 and bearing mounting plates 38. The LM guide rails 36 are mounted on the vertical plate 31 to limit the direction of movement and provide guiding accuracy. The slider horizontal plates 37 and bearing mounting plates 38 are slidably fitted on the LM guide rails 36. The slider horizontal plates 37 are provided with support seats 39 to support the wafer iron rings 4. In addition, the slider horizontal plates 37 and bearing mounting plates 38 are connected by a tension spring 310. The tension spring 310 has an elastic reset function, which can cause the assembly to return to the initial position after the drive is released, thereby enhancing the stability and rebound performance of the mechanism.

[0044] Figure 4 A schematic diagram of the operation of the feeding assembly according to a specific embodiment of the present invention is shown. Figure 5 A schematic diagram of water film formation according to a specific embodiment of the present invention is shown, as follows: Figure 4 and 5 As shown, the wafer support ring 4 carries the wafer 41, and a blue film 42 is adhered to the back of the wafer 41. The wafer support ring 4 is placed horizontally on the support base 39 of the feeding assembly 3. When the device is working, one side (such as...) is controlled first. Figure 4 The left-side feeding assembly 3 moves, causing the left side of the wafer iron ring 4 to slowly descend, and the left side of the blue film 42 first contacts the water surface on the glass plate 2. Then, the right-side feeding assembly gradually drives the blue film 42 to progressively adhere to the liquid surface from left to right in a lateral direction, expelling air between the blue film and the water surface and preventing bubble formation. Once the blue film 42 is fully adhered to the liquid surface, the negative pressure system connected through the air pipe connector 6 is activated, and the vacuum drain tank 13 extracts excess liquid from the tank, forming a uniformly thick water film 43 between the blue film 42 and the glass plate 2. This water film 43 fills in the frosted texture of the blue film 42 surface, changing the blue film 42 from a diffuse reflection state to a light-transmitting state, thus achieving a transparent effect. This facilitates clear imaging and defect detection of the back side of the wafer 41 using a microscope.

[0045] This invention provides a device for making a frosted film on a wafer transparent. Through independently controlled left and right feeding units, the blue wafer film gradually adheres to the surface of the liquid in the water tank along the lateral direction, effectively expelling interfacial air and preventing bubble formation. Simultaneously, combined with the water tank structure formed by the concave glass plate and the negative pressure suction component, a uniformly thick water film is formed between the blue film and the glass plate, filling in the frosted texture and achieving transparency. While ensuring the wafer's support is flat, this device improves the clarity of microscopic imaging and solves the problems of wafer sagging and incomplete transparency in traditional flipping methods. It exhibits good stability, automation adaptability, and detection effect.

[0046] Continue to refer to Figure 6 , Figure 6 A flowchart of a method for making a wafer frosted film transparent according to an embodiment of the present invention is shown, as follows: Figure 6 As shown, the method specifically includes:

[0047] S1: Inject a transparent liquid into the water tank formed by the module base plate and the glass plate;

[0048] S2: Place the wafer's metal ring horizontally above the support base of the feeding mechanism;

[0049] S3: Control the operation of the first feeding unit so that the blue film side contacts the liquid surface first;

[0050] S4: Control the second feeding unit to then operate so that the blue film gradually adheres to the liquid surface in the lateral direction, so as to expel the air between the blue film and the liquid;

[0051] S5: After the blue film is applied, start the negative pressure suction component to extract the excess liquid in the water tank and form a water film of uniform thickness between the blue film and the glass plate.

[0052] In a specific embodiment, a water film is used to fill the frosted structure on the surface of the blue film, making the blue film transparent for microscopic inspection of the back side of the wafer. After the inspection is completed, the first and second feeding units are simultaneously raised, and positive pressure gas is introduced into the water tank to cause the blue film to detach from the glass plate surface.

[0053] The above method controls the blue film on the wafer to gradually adhere to the liquid surface of the water tank from one side, effectively eliminating interfacial air and preventing the formation of bubbles. After the adhesion is completed, negative pressure suction is used to form a water film of uniform thickness, filling the frosted structure on the surface of the blue film and making it transparent. This allows back-side microscopic inspection to be performed without flipping the wafer and ensuring its flat support. After the inspection, the blue film is smoothly detached through synchronous lifting and positive pressure blowing, improving the stability of operation, the accuracy of inspection, and the degree of automation of the entire process.

[0054] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0055] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

[0056] The specific embodiments of the present invention described above do not constitute a limitation on the scope of protection of the present invention. Any other corresponding changes and modifications made in accordance with the technical concept of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. An apparatus for transparentizing a wafer lapping film, comprising: The application relates to a wafer detection device. The device comprises a module base plate, a glass plate, a liquid discharging mechanism and a negative pressure suction assembly. The module base plate is provided with mounting holes. The glass plate is mounted on the mounting holes and forms a water tank on the module base plate for containing liquid. The liquid discharging mechanism comprises a first liquid discharging unit and a second liquid discharging unit arranged on both sides of the module base plate. The first liquid discharging unit and the second liquid discharging unit independently drive different sides of the wafer to move vertically relative to the water tank.

2. The apparatus for transparentizing a wafer lapping film of claim 1, wherein, The module base plate is provided with a negative pressure suction assembly which is communicated with the water tank.

3. The apparatus for transparentizing a wafer lapping film of claim 1, wherein, The iron ring of the wafer is horizontally placed on the liquid discharging mechanism.

4. The apparatus for transparentizing a wafer lapping film of claim 1, wherein, The liquid discharging mechanism is controlled by separate side driving to make the blue film gradually adhere to the liquid surface in the transverse direction.

5. The apparatus for transparentizing a wafer lapping film of claim 4, wherein, After the blue film completely adheres to the liquid surface, the negative pressure suction assembly extracts the liquid in the water tank to form a uniform water film between the blue film and the glass plate.

6. The apparatus for transparentizing a wafer lapping film of claim 5, wherein, The outer circle of the mounting hole is further provided with an O-ring fixing groove.

7. The apparatus for transparentizing a wafer lapping film of claim 6, wherein, The upper surface of the glass plate has a height difference of 0.1-0.3mm relative to the upper surface of the module base plate.

8. A method for transparentizing a wafer lapping film applied to the apparatus of any one of claims 1-7, characterized by, The first liquid discharging unit and the second liquid discharging unit of the liquid discharging mechanism each comprise a driving assembly, a guide assembly and a bearing support assembly. The bearing support assembly is fixedly connected with the module base plate. The driving assembly and the guide assembly are arranged on the bearing support assembly. The bearing support assembly comprises a vertical plate and an angle code. The driving assembly comprises a driving motor, a cam and a bearing. The guide assembly comprises an LM guide rail, a slider horizontal plate and a bearing mounting plate.

9. The method of claim 8, wherein, The slider horizontal plate is provided with a support seat for supporting the iron ring of the wafer.

10. The method of claim 9, wherein, The slider horizontal plate and the bearing mounting plate are slidingly fitted on the LM guide rail. The slider horizontal plate and the bearing mounting plate are connected by a tension spring. The application also discloses a wafer detection method. S1: transparent liquid is injected into the water tank formed by the module base plate and the glass plate. S2: the iron ring of the wafer is horizontally placed above the support seat of the liquid discharging mechanism. S3: the first liquid discharging unit is controlled to move so that one side of the blue film first contacts the liquid surface. S4: the second liquid discharging unit is controlled to move subsequently so that the blue film gradually adheres to the liquid surface in the transverse direction to discharge the air between the blue film and the liquid. S5: after the blue film is adhered, the negative pressure suction assembly is started to extract the excess liquid in the water tank to form a water film with uniform thickness between the blue film and the glass plate. The frosted structure on the surface of the blue film is filled by the water film to make the blue film transparent, and microscopic detection is performed on the back of the wafer. After the detection is completed, the first liquid discharging unit and the second liquid discharging unit are synchronously controlled to rise, and positive pressure gas is introduced into the water tank to make the blue film separate from the surface of the glass plate.

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