Clamping mechanism, bearing assembly and wafer cleaning equipment

Abstract

The invention discloses a clamping mechanism, a bearing assembly and wafer cleaning equipment, and relates to the technical field of semiconductor preparation, and the clamping mechanism comprises a driving disc, a plurality of clamping parts and a plurality of synchronous transmission mechanisms; the driving disc is used for being rotationally connected with the bearing disc, the multiple clamping parts are arranged at intervals in the circumferential direction of the bearing disc, the synchronous transmission mechanisms and the clamping parts are arranged in a one-to-one correspondence mode, and the synchronous transmission mechanisms comprise shaft parts and are rotationally connected with the bearing disc through the shaft parts so that the first ends and the second ends, opposite to each other, of the synchronous transmission mechanisms can relatively rotate in the axial direction of the shaft parts; the first end is connected with the driving disc, and the second end is connected with the clamping part; under the condition that the bearing disc and the driving disc rotate relatively, the driving disc respectively drives the plurality of clamping parts to synchronously get close to or get away from the bearing disc along the radial direction of the bearing disc through the plurality of synchronous transmission mechanisms, so that the plurality of clamping parts can uniformly apply clamping force on a wafer, and the stability of the wafer when the wafer is placed on the bearing disc is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor fabrication technology, and in particular to a clamping mechanism, a carrier component, and a wafer cleaning device. Background Technology

[0002] In the wafer manufacturing process, wet cleaning equipment is used to clean the wafers to ensure the cleanliness of the wafer surface. The chuck is the carrier tool in the wet cleaning equipment, and the multiple clamping parts set around the chuck can clamp or release the wafer.

[0003] In related technologies, each clamping part is equipped with a corresponding cylinder to drive it. Each set of cylinders and clamping parts operates independently, which is relatively complex. Moreover, when multiple clamping parts move, there is a problem of poor synchronization, which results in uneven clamping force applied to the wafer by multiple clamping parts, affecting the stability of the wafer when placed in the chuck, and may even lead to wafer breakage. Summary of the Invention

[0004] This application discloses a clamping mechanism, a carrier component, and a wafer cleaning device to solve the problem of poor synchronization when the clamping part clamps the wafer in the related technology.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application disclose a clamping mechanism for cooperating with a carrier disk. The disclosed clamping mechanism includes: a drive disk, multiple clamping parts, and multiple synchronous transmission mechanisms.

[0007] The drive disk is rotatably connected to the carrier disk. A plurality of clamping parts are arranged at intervals along the circumference of the carrier disk. The synchronous transmission mechanism is provided in one-to-one correspondence with the clamping parts. The synchronous transmission mechanism includes a shaft and is rotatably connected to the carrier disk through the shaft, so that the first and second ends of the synchronous transmission mechanism, which are opposite to each other, rotate relative to each other about the axial direction of the shaft. The first end is connected to the drive disk, and the second end is connected to the clamping part.

[0008] When the carrier disk and the drive disk rotate relative to each other, the drive disk drives the multiple clamping parts to move synchronously closer to or further away from the carrier disk along the radial direction of the carrier disk through multiple synchronous transmission mechanisms.

[0009] Secondly, embodiments of this application disclose a support component, which includes a support disk and the aforementioned clamping mechanism.

[0010] Thirdly, embodiments of this application disclose a wafer cleaning apparatus, which includes a cleaning chamber and the aforementioned support assembly, wherein the support assembly is disposed in the cleaning chamber.

[0011] The technical solution adopted in this application can achieve the following technical effects:

[0012] The clamping mechanism disclosed in this application improves upon related technologies by utilizing a drive disk to simultaneously drive multiple synchronous transmission mechanisms. These mechanisms drive their respective clamping parts to synchronously approach or move away from the carrier disk along its radial direction, thus clamping and releasing the wafer above the carrier disk. Because the drive disk can drive multiple synchronous transmission mechanisms to move synchronously, it can also drive multiple clamping parts to move synchronously, allowing them to apply clamping force evenly to the wafer. This improves the stability of the wafer when placed on the carrier disk and reduces the risk of wafer breakage due to uneven force. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the assembly structure of the carrier component and the wafer disclosed in an embodiment of this application;

[0014] Figure 2 Appendix to this application specification Figure 1 Enlarged view of point a in the middle;

[0015] Figure 3 This is a top view of the carrier component disclosed in the embodiments of this application;

[0016] Figure 4 Appendix to this application specification Figure 3 Enlarged view of point b in the middle;

[0017] Figure 5 This is an exploded view of the synchronous transmission mechanism disclosed in the embodiments of this application;

[0018] Figure 6 This is a schematic diagram of the structure of the connector disclosed in the embodiments of this application;

[0019] Figure 7 This is a schematic diagram of the structure of the first transmission component disclosed in an embodiment of this application;

[0020] Figure 8 This is a partial cross-sectional view of the first transmission assembly disclosed in an embodiment of this application;

[0021] Figure 9 This is a schematic diagram of the structure of the second transmission assembly disclosed in an embodiment of this application;

[0022] Figure 10 This is a partial cross-sectional view of the second transmission assembly disclosed in an embodiment of this application;

[0023] Figure 11 This is a schematic diagram of the structure of the third transmission component disclosed in the embodiments of this application;

[0024] Figure 12 This is a partial cross-sectional view of the third transmission assembly disclosed in an embodiment of this application;

[0025] Figure 13 This is a schematic diagram of the assembly structure of the carrier disk and the drive disk disclosed in the embodiments of this application;

[0026] Figure 14 Appendix to this application specification Figure 13 Cross-sectional view along the AA direction.

[0027] Explanation of reference numerals in the attached figures:

[0028] 110-Carrier plate, 120-Drive plate, 121-Drive plate body, 1211-Mounting part, 122-Drive mechanism, 130-Clamping part, 131-Connecting seat, 132-Clamping head, 133-Arc-shaped guide structure, 140-Synchronous transmission mechanism, 141-First transmission assembly, 1411-First sleeve, 1412-First sliding rod, 1413-Rotating arm, 1414-Busset, 1415-Bearing seat, 1416-First linear bearing, 1417-Connecting piece, 1418-Connecting flange, 1419-First elastic element, 142-Second transmission assembly, 1421-Shaft, 1422-Fixed seat, 1423-Transmission rod, 143-Third transmission assembly, 1431-Second sleeve, 1432-Second sliding rod, 1433-Second elastic element, 1434-Second linear bearing, 150-Wafer. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0030] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and are not limited in number; for example, a first object can be one or more.

[0031] The technical solutions disclosed in the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0032] In related technologies, during wet cleaning processes, a chuck is used to hold the wafers to be cleaned. To secure the wafers on the chuck, multiple clamping shafts are arranged around the chuck's circumference. Cylinders control these shafts to move closer to or away from the wafers, thus clamping or releasing them. When driving the clamping shafts, each cylinder corresponds to one shaft, and each set of cylinders and shafts operates independently. This structure is relatively complex, and the multiple clamping shafts exhibit poor synchronization during movement. This results in uneven clamping forces applied to the wafer by the various shafts, affecting the wafer's stability when placed in the chuck and potentially causing wafer breakage.

[0033] Based on the above, please refer to Figures 1 to 14 This application discloses a clamping mechanism for cooperating with a carrier disk 110. The carrier disk 110 has a bearing surface and is mainly used to hold a wafer 150. The carrier disk 110 can achieve rotation and lifting functions by a drive device (motor, cylinder, etc.) to improve the flexibility of the wafer 150 cleaning process. The disclosed clamping mechanism may include a drive disk 120, multiple clamping parts 130, and multiple synchronous transmission mechanisms 140.

[0034] Multiple clamping parts 130 are arranged at intervals along the circumference of the carrier disk 110. The clamping parts 130 can be columnar, plate-shaped, etc. The multiple clamping parts 130 form a clamping space. When the wafer 150 is placed on the carrier surface of the carrier disk 110 and is located within the clamping space formed by the clamping parts 130, the multiple clamping parts 130 can move closer to or further away from the carrier disk 110 by moving radially along the carrier disk 110, and abut or separate from the edge of the wafer 150 to clamp or release the wafer 150.

[0035] like Figure 3 As shown, the clamping part 130 has three position states: initial position, ready position, and clamping position. In the initial position, the diameter of the clamping space enclosed by the multiple clamping parts 130 is small, and the wafer 150 cannot be placed on the bearing surface of the carrier disk 110. When the multiple clamping parts 130 move away from the carrier disk 110 and are in the ready position, the diameter of the clamping space enclosed by the multiple clamping parts 130 is large, and the wafer 150 can be placed smoothly on the bearing surface of the carrier disk 110. However, there is a certain gap between the multiple clamping parts 130 and the edge of the wafer 150, and the wafer 150 is prone to shaking. The multiple clamping parts 130 can be controlled to move closer to the carrier disk 110 and reach the clamping position. When in the clamping position, the multiple clamping parts 130 abut against the edge of the wafer 150, thereby achieving the clamping of the wafer 150. When it is necessary to remove or replace the wafer 150 from the carrier plate 110, the multiple clamping parts 130 can be switched from the clamping position to the ready position.

[0036] In the actual process, the three position states of the clamping part 130 can be switched in the following order: initial position → preparatory position → clamping position, clamping position → preparatory position → initial position, and so on to achieve continuous operation.

[0037] The movement of the clamping part 130 can be controlled by the drive disk 120 and the synchronous transmission mechanism 140, specifically, as follows: Figures 1 to 4 As shown, the drive disk 120 is rotatably connected to the support disk 110, and the drive disk 120 and the support disk 110 can be coaxially arranged. The drive disk 120 is located on the side of the support disk 110 facing away from the support surface. A bearing is provided at the connection between the drive disk 120 and the support disk 110 so that the drive disk 120 and the support disk 110 can rotate relative to each other. The synchronous transmission mechanism 140 and the clamping part 130 are equal in number and are arranged in a one-to-one correspondence. The synchronous transmission mechanism 140 can be composed of sliding parts, connecting rods and other components combined by hinges, sleeves or other means. The synchronous transmission mechanism 140 can convert the rotational force generated by the drive disk 120 into a linear force and apply it to the clamping part 130 to drive the clamping part 130 to synchronously move closer to or away from the support disk 110 along the radial direction of the support disk 110.

[0038] The synchronous transmission mechanism 140 includes a shaft portion 1421, which can be located in the middle of the synchronous transmission mechanism 140. The synchronous transmission mechanism 140 is rotatably connected to the bearing disk 110 through the shaft portion 1421. The first and second ends of the synchronous transmission mechanism 140, which are opposite to each other, can rotate relative to each other around the axial direction of the shaft portion 1421. The first end of the synchronous transmission mechanism 140 is connected to the drive disk 120, and the second end of the synchronous transmission mechanism 140 is connected to the clamping portion 130. The specific connection method can be bolt connection, snap-fit, riveting, etc.

[0039] When the carrier disk 110 and the drive disk 120 rotate relative to each other, the drive disk 120 first drives the first end of the synchronous transmission mechanism 140 to move. Since the synchronous transmission mechanism 140 needs to rotate around the shaft 1421, the second end of the synchronous transmission mechanism 140 also moves synchronously, thereby driving multiple clamping parts 130 to move synchronously closer to or further away from the carrier disk 110 along the radial direction of the carrier disk 110.

[0040] As described above, the clamping mechanism disclosed in this application improves upon related technologies by utilizing a drive disk 120 to simultaneously drive multiple synchronous transmission mechanisms 140. These mechanisms 140 respectively drive their corresponding clamping parts 130 to synchronously approach or move away from the carrier disk 110 along its radial direction, thereby clamping and releasing the wafer 150 on the carrier disk 110. Since the drive disk 120 can drive multiple synchronous transmission mechanisms 140 to move synchronously, it can also drive multiple clamping parts 130 to move synchronously, allowing the clamping parts 130 to apply clamping force evenly to the wafer 150. This improves the stability of the wafer 150 when placed on the carrier disk 110 and reduces the risk of breakage due to uneven force distribution.

[0041] Furthermore, such as Figures 1 to 4 As shown, the aforementioned synchronous transmission mechanism 140 may include a first transmission assembly 141, a second transmission assembly 142, and a third transmission assembly 143. These three components can be assembled from sliding parts, connecting rods, or other parts via hinges, sleeves, or other means. The drive disk 120 can be connected to the second transmission assembly 142 via the first transmission assembly 141. One end of the second transmission assembly 142 is rotatably connected to the first transmission assembly 141, and the other end is rotatably connected to the third transmission assembly 143. A shaft portion 1421 is mounted on the second transmission assembly 142, and the third transmission assembly 143 is connected to the clamping portion 130.

[0042] The rotational force applied by the drive disk 120 to the first transmission assembly 141 can be transmitted to the second transmission assembly 142. Since one opposite end of the second transmission assembly 142 can rotate relative to the other end of the shaft 1421, the rotational force of the drive disk 120 can be transmitted to the other end of the second transmission assembly 142, and further to the third transmission assembly 143. This causes the clamping part 130 to move synchronously closer to or further away from the support disk 110 along the radial direction of the support disk 110, thereby clamping or releasing the wafer 150. In this process, the function of the first transmission assembly 141 is to convert the rotational force generated by the drive disk 120 into a linear force and apply it to one end of the second transmission assembly 142. The second transmission assembly 142 transmits the linear force to the other end of the second transmission assembly 142 by rotating around the shaft 1421, and drives the third transmission assembly 143 to move linearly.

[0043] like Figures 5 to 8As shown, the first transmission assembly 141 may include a first sleeve 1411, a first sliding rod 1412, and a rotating arm 1413. The first sleeve 1411 is sleeved on and slidably connected to the first sliding rod 1412. One end of the first sliding rod 1412 is connected to the drive disc 120. A portion of the rotational force applied by the drive disc 120 can be used to drive the first sliding rod 1412 and the first sleeve 1411 to slide relative to each other. The rotating arm 1413 is rotatably connected to the outer wall of the first sleeve 1411. One end of the second transmission assembly 142 is connected to the rotating arm 1413. Another portion of the rotational force applied by the drive disc 120 can be used to drive the rotating arm 1413 to rotate relative to the first sleeve 1411, thereby transmitting the rotational force to the second transmission assembly 142. By employing the cooperation of the first sleeve 1411, the first sliding rod 1412, and the rotating arm 1413, the rotational force applied by the drive disc 120 can be stably transmitted to the second transmission assembly 142, thereby improving the stability of the synchronous transmission mechanism 140.

[0044] like Figures 7 to 8 As shown, the rotating arm 1413 and the first sleeve 1411 can be rotatably connected through structures such as a rotating shaft, hinge, and flexible connector 1417. In this embodiment, the rotating arm 1413 can adopt a U-shaped structure, including two ends. Bushings 1414 can be respectively provided at both ends of the rotating arm 1413, and bearing seats 1415 can be respectively provided on opposite sides of the first sleeve 1411. The bearing seats 1415 protrude from the outer surface of the first sleeve 1411. The bushings 1414 are fitted onto the bearing seats 1415, so that both ends of the rotating arm 1413 are rotatably connected to the outer wall of the first sleeve 1411, resulting in good connection reliability. In addition, to reduce friction, a bearing can be provided between the bearing seats 1415 and the bushings 1414 to ensure smooth rotation of the bearing seats 1415 and the bushings 1414.

[0045] like Figures 7 to 8 As shown, for ease of assembly, the first sleeve 1411 can adopt a split structure, dividing it into two sub-sleeves along the axial direction of the first sleeve 1411. The first sliding rod 1412 can be placed in one of the sub-sleeves first, and then the two sub-sleeves can be assembled into a complete first sleeve 1411 by means of bolt connection, snap-fit, etc.

[0046] like Figure 8 As shown, considering that there is a large friction between the outer surface of the first sliding rod 1412 and the inner wall of the first sleeve 1411 when the first sleeve 1411 and the first sliding rod 1412 slide relative to each other, a first linear bearing 1416 can be provided between the first sleeve 1411 and the first sliding rod 1412 to convert the sliding friction between the first sleeve 1411 and the first sliding rod 1412 into rolling friction, thereby improving the service life of the first sleeve 1411 and the first sliding rod 1412.

[0047] like Figures 1 to 5 As shown, one end of the first sliding rod 1412 is connected to the drive disk 120. To facilitate assembly, a connector 1417 can be added between the first sliding rod 1412 and the drive disk 120. Simultaneously, a connecting flange 1418 is provided at one end of the first sliding rod 1412, and a protruding mounting portion 1211 is provided on the edge of the drive disk 120. The connector 1417 is connected to both the connecting flange 1418 and the mounting portion 1211, thus assembling the first sliding rod 1412 with the drive disk 120. The connection method between the connector 1417, the connecting flange 1418, and the mounting portion 1211 can be bolted, snap-fitted, riveted, welded, etc.

[0048] Regarding the driving method of the clamping part 130, the clockwise or counterclockwise rotation of the drive disk 120 can respectively drive the clamping part 130 to move away from or towards the support disk 110 radially. Specifically, as shown... Figures 1 to 4 As shown in the figure, the solid arrows indicate the movement of each component when the clamping part 130 moves away from the carrier plate 110, and the dashed arrows indicate the movement of each component when the clamping part 130 moves closer to the carrier plate 110. When the drive plate 120 rotates clockwise, the first sleeve 1411 will move along the direction of the solid arrow ( Figure 2 and Figure 4 The solid arrow on the left approaches the drive disc 120, thereby pulling the second transmission assembly 142 to rotate clockwise around the shaft 1421, and the third transmission assembly 143 rotates in the direction of the solid arrow ( Figure 2 and Figure 4 The solid arrow on the right moves away from the drive disk 120, thereby driving the clamping part 130 to move away from the support disk 110 radially.

[0049] When the clamping part 130 approaches the support plate 110 radially, the drive plate 120 can be controlled to rotate counterclockwise, so that the first sleeve 1411, the second transmission assembly 142 and the third transmission assembly 143 can move in the direction shown by the dashed arrow in the figure.

[0050] To improve the switching speed of the clamping part 130 between the wafer clamping mode and the wafer detachment mode, in this embodiment, the first transmission assembly 141 may further include a first elastic element 1419. The first elastic element 1419 is sleeved on the first sliding rod 1412 and elastically supported between the connecting flange 1418 and the first sleeve 1411. When the drive disk 120 rotates clockwise, the first sleeve 1411 will move along the direction of the solid arrow (…). Figure 2 and Figure 4The solid arrow on the left approaches the drive disk 120 and compresses the first elastic element 1419. After the driving force of the drive disk 120 is removed, the first elastic element 1419 releases its elastic potential energy, causing the first sleeve 1411, the second transmission assembly 142, and the third transmission assembly 143 to move in the direction shown by the dashed arrow in the figure. This drives the clamping part 130 to approach the support disk 110 radially. When the clamping part 130 is in the clamping position, the wafer 150 can be clamped. Furthermore, the first elastic element 1419 can also apply a pre-tightening force to the wafer 150 during the clamping process, further improving the stability of the wafer 150 clamping.

[0051] like Figure 5 , Figure 9 and Figure 10 As shown, the second transmission assembly 142 may include a fixed base 1422, a transmission rod 1423, and a shaft 1421. The fixed base 1422 is fixedly connected to the bearing plate 110, specifically to the side of the bearing plate 110 facing away from the bearing surface. The connection between the fixed base 1422 and the bearing plate 110 can be by bolting, snapping, riveting, welding, etc. The shaft 1421 is located on the side of the fixed base 1422 facing away from the bearing plate 110. The middle part of the transmission rod 1423 is hinged to the fixed base 1422 through the shaft 1421, so that one opposite end and the other end of the transmission rod 1423 can rotate around the shaft 1421. One end of the transmission rod 1423 is rotatably connected to the first transmission assembly 141, and the other end of the transmission rod 1423 is rotatably connected to the third transmission assembly 143. Based on the specific structure of the first transmission assembly 141, the connection relationship can be refined. One end of the transmission rod 1423 is connected to the rotating arm 1413. Utilizing the relative rotation of the rotating arm 1413 and the first sleeve 1411, one end of the transmission rod 1423 can also rotate relative to the first sleeve 1411. To avoid motion interference between one end of the transmission rod 1423 and the rotating arm 1413, a hinged connection can also be used for assembly.

[0052] When the drive disc 120 rotates clockwise, the first sleeve 1411 will move in the direction of the solid arrow ( Figure 2 and Figure 4 The solid arrow on the left is close to the drive disc 120, thereby causing one end of the transmission rod 1423 to rotate clockwise around the shaft 1421 via the rotating arm 1413. The other end of the transmission rod 1423 also rotates clockwise around the shaft 1421, driving the third transmission assembly 143 to move in the direction of the solid arrow. Figure 2 and Figure 4 The solid arrow on the right moves away from the drive disk 120, thereby driving the clamping part 130 to move away from the support disk 110 radially.

[0053] like Figure 5 , Figure 11 and Figure 12 As shown, the third transmission assembly 143 described above may include a second sleeve 1431 and a second sliding rod 1432. The bearing plate 110 is fixedly connected to the second sleeve 1431. Specifically, the second sleeve 1431 may be connected to the side of the bearing plate 110 facing away from the bearing surface. The connection method between the second sleeve 1431 and the bearing plate 110 may be bolt connection, snap-fit, riveting, welding, etc. The second sleeve 1431 is sleeved on the second sliding rod 1432 and slidably connected to the second sliding rod 1432. One end of the second sliding rod 1432 is rotatably connected to the second transmission assembly 142, and the other end of the second sliding rod 1432 is fixedly connected to the clamping part 130. According to the specific structure of the second transmission assembly 142 described above, the connection relationship can be refined. The other end of the transmission rod 1423 is rotatably connected to one end of the second sliding rod 1432. Specifically, the rotatable connection can be achieved through the cooperation of the shaft and the shaft hole, or through the flexible connector 1417.

[0054] When the drive disc 120 rotates clockwise, the first sleeve 1411 will move in the direction of the solid arrow ( Figure 2 and Figure 4 The solid arrow on the left is close to the drive disc 120, thereby causing one end of the transmission rod 1423 to rotate clockwise around the shaft 1421 via the rotating arm 1413. The other end of the transmission rod 1423 also rotates clockwise around the shaft 1421, driving the second sliding rod 1432 to move in the direction of the solid arrow. Figure 2 and Figure 4 (The solid arrow on the right) moves away from the drive disk 120, thereby driving the clamping part 130 to move away from the support disk 110 radially. In addition, since the second sleeve 1431 is fixed on the support disk 110, it can limit the second sliding rod 1432, so that it can only slide relative to the second sleeve 1431 along its own axis. This drives the clamping part 130 to move away from or closer to the support disk 110 radially. When clamping the wafer 150, the clamping force applied by the clamping part 130 to the wafer 150 is directed towards the center of the wafer 150, which makes it less likely to generate irreconcilable internal forces inside the wafer 150 and can prevent the wafer 150 from being damaged.

[0055] like Figure 12 As shown, considering that there is a large friction between the outer surface of the second sliding rod 1432 and the inner wall of the second sleeve 1431 when the second sleeve 1431 and the second sliding rod 1432 slide relative to each other, a second linear bearing 1434 can be provided between the second sleeve 1431 and the second sliding rod 1432 to convert the sliding friction between the second sleeve 1431 and the second sliding rod 1432 into rolling friction, thereby improving the service life of the second sleeve 1431 and the second sliding rod 1432.

[0056] In the above scheme, by adding a first elastic element 1419 to the first sliding rod 1412, the elastic force of the first elastic element 1419 drives the clamping part 130 to move from the preparatory position to the clamping position. For example... Figure 5 , Figure 9 and Figure 10 As shown, to further improve the response speed of the clamping part 130, a second elastic element 1433 can be provided on the third transmission assembly 143. The second elastic element 1433 is sleeved on the second sliding rod 1432 and elastically supported between one end of the second sliding rod 1432 connecting the second transmission assembly 142 and the second sleeve 1431. It should be noted that a limiting structure can be provided at one end of the second sliding rod 1432 to prevent the second elastic element 1433 from dislodging from the second sliding rod 1432.

[0057] When the drive disc 120 rotates clockwise, the first sleeve 1411 will move in the direction of the solid arrow ( Figure 2 and Figure 4 The solid arrow on the left approaches the drive disc 120 and compresses the first elastic element 1419. The first sleeve 1411 pulls one end of the transmission rod 1423 to rotate clockwise around the shaft 1421 via the rotating arm 1413. The other end of the transmission rod 1423 also rotates clockwise around the shaft 1421, driving the second sliding rod 1432 to move in the direction of the solid arrow. Figure 2 and Figure 4 The solid arrow on the right moves away from the drive disk 120 and compresses the second elastic element 1433, thereby driving the clamping part 130 to move away from the carrier disk 110 radially. After the driving force of the drive disk 120 is removed, the first elastic element 1419 and the second elastic element 1433 simultaneously release elastic potential energy, causing the first sleeve 1411, the transmission rod 1423, and the second sliding rod 1432 to move in the direction shown by the dashed arrow in the figure, thereby driving the clamping part 130 to move closer to the carrier disk 110 radially. When the clamping part 130 is in the clamping position, the wafer 150 can be clamped. Furthermore, the first elastic element 1419 and the second elastic element 1433 can also apply a preload force to the wafer 150 during the clamping process, further improving the stability of the wafer 150 clamping.

[0058] The drive disk 120 can be driven manually. In this embodiment, for example... Figure 13 and Figure 14 As shown, a drive mechanism 122 can be configured to control the drive disk 120. The drive disk 120 may include a drive disk body 121 and a drive mechanism 122. The drive disk body 121 is rotatably connected to the carrier disk 110. The drive mechanism 122 is connected to both the drive disk body 121 and the carrier disk 110, thereby driving the drive disk body 121 to rotate relative to the carrier disk 110. The drive mechanism 122 may include a motor, a cylinder, etc.

[0059] like Figure 2 and Figure 5 As shown, the clamping part 130 is used to contact the edge of the wafer 150. Specifically, the clamping part 130 may include a connecting seat 131 and a clamping head 132. The clamping head 132 is located on top of the connecting seat 131 and may have a spherical structure. When the carrier disk 110 and the drive disk 120 rotate relative to each other, multiple clamping heads 132 synchronously approach or move away from the carrier disk 110 radially. When the clamping part 130 is in the clamping position, the clamping head 132 abuts against the edge of the wafer 150, thereby clamping the wafer 150. The connecting seat 131 is connected to the second end of the synchronous transmission mechanism 140, specifically to the other end of the second sliding rod 1432. The second sliding rod 1432 and the connecting seat 131 can be assembled by bolt connection, snap-fit, riveting, or other methods.

[0060] like Figure 2 and Figure 5 As shown, when the clamping part 130 approaches the support plate 110 radially, the connecting seat 131 will come into contact with the support plate 110. In order to avoid large contact stress between the connecting seat 131 and the support plate 110, a raised arc-shaped guide structure 133 can be provided on the side of the connecting seat 131. When the clamping part 130 moves radially along the support plate 110, the arc-shaped guide structure 133 will make frictional contact with the edge of the support plate 110. The arc surface on the arc-shaped guide structure 133 can smoothly guide the transition with the edge of the support plate 110. By using the guiding cooperation between the arc-shaped guide structure 133 and the support plate 110, the clamping part 130 can smoothly approach or move away from the support plate 110.

[0061] Please refer to Figures 1 to 14 This application also discloses a carrier assembly, which includes a carrier disk 110 and the aforementioned clamping mechanism. With the cooperation of the carrier disk 110 and the clamping mechanism, the drive disk 120 can simultaneously drive multiple synchronous transmission mechanisms 140. Each of the multiple synchronous transmission mechanisms 140 drives its corresponding clamping part 130 to synchronously approach or move away from the carrier disk 110 radially, thereby clamping and releasing the wafer 150 on the carrier disk 110. Since the drive disk 120 can drive multiple synchronous transmission mechanisms 140 to move synchronously, it can also drive multiple clamping parts 130 to move synchronously, allowing the multiple clamping parts 130 to apply clamping force evenly to the wafer 150. This improves the stability of the wafer 150 when placed on the carrier disk 110 and also reduces the risk of breakage due to uneven force on the wafer 150.

[0062] Please refer to Figures 1 to 14This application also discloses a wafer cleaning device, which includes a cleaning chamber and the aforementioned support component, wherein the support component is disposed in the cleaning chamber.

[0063] When the wafer cleaning equipment uses the aforementioned carrier component to carry the wafer 150, the drive disk 120 can simultaneously drive multiple synchronous transmission mechanisms 140. Each synchronous transmission mechanism 140 drives its corresponding clamping part 130 to synchronously approach or move away from the carrier disk 110 radially, thus clamping and releasing the wafer 150 on the carrier disk 110. Since the drive disk 120 can drive multiple synchronous transmission mechanisms 140 to move synchronously, it can also drive multiple clamping parts 130 to move synchronously, allowing the multiple clamping parts 130 to apply clamping force evenly to the wafer 150. This improves the stability of the wafer 150 when placed on the carrier disk 110 and reduces the risk of damage to the wafer 150 due to uneven force.

[0064] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different technical features between the various embodiments are not contradictory, they can be combined to form more specific embodiments. For the sake of brevity, they will not be described in detail here.

[0065] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A clamping mechanism for cooperating with a carrier plate (110), characterized in that, The clamping mechanism includes: a drive disk (120), multiple clamping parts (130), and multiple synchronous transmission mechanisms (140); The drive disk (120) is rotatably connected to the support disk (110). A plurality of clamping parts (130) are arranged at intervals along the circumference of the support disk (110). The synchronous transmission mechanism (140) is provided in a one-to-one correspondence with the clamping parts (130). The synchronous transmission mechanism (140) includes a shaft (1421) and is rotatably connected to the support disk (110) through the shaft (1421) so that the first end and the second end of the synchronous transmission mechanism (140) opposite to each other rotate relative to each other around the axial direction of the shaft (1421). The first end is connected to the drive disk (120), and the second end is connected to the clamping part (130). When the carrier disk (110) and the drive disk (120) rotate relative to each other, the drive disk (120) drives the multiple clamping parts (130) to move synchronously toward or away from the carrier disk (110) along the radial direction of the carrier disk (110) through the multiple synchronous transmission mechanisms (140).

2. The clamping mechanism according to claim 1, characterized in that, The synchronous transmission mechanism (140) includes a first transmission component (141), a second transmission component (142), and a third transmission component (143); The drive disk (120) is connected to the second transmission assembly (142) via the first transmission assembly (141). One end of the second transmission assembly (142) is rotatably connected to the first transmission assembly (141), and the other end of the second transmission assembly (142) is rotatably connected to the third transmission assembly (143). The shaft portion (1421) is disposed on the second transmission assembly (142) so that one opposite end and the other end of the second transmission assembly (142) rotate relative to each other around the axial direction of the shaft portion (1421). The third transmission assembly (143) is connected to the clamping portion (130).

3. The clamping mechanism according to claim 2, characterized in that, The first transmission assembly (141) includes a first sleeve (1411), a first sliding rod (1412), and a rotating arm (1413); The first sleeve (1411) is sleeved on the first sliding rod (1412) and is slidably connected to the first sliding rod (1412). One end of the first sliding rod (1412) is connected to the drive disk (120). The rotating arm (1413) is rotatably connected to the outer wall of the first sleeve (1411), and one end of the second transmission assembly (142) is connected to the rotating arm (1413).

4. The clamping mechanism according to claim 3, characterized in that, The rotating arm (1413) has bushings (1414) at both ends, and bearing seats (1415) are provided on opposite sides of the first sleeve (1411). The bushings (1414) are fitted onto the bearing seats (1415) so that the two ends of the rotating arm (1413) are rotatably connected to the outer wall of the first sleeve (1411).

5. The clamping mechanism according to claim 3, characterized in that, A first linear bearing (1416) is provided between the first sleeve (1411) and the first sliding rod (1412).

6. The clamping mechanism according to claim 3, characterized in that, The first transmission assembly (141) further includes a connector (1417), one end of the first sliding rod (1412) is provided with a connecting flange (1418), the edge of the drive disc (120) is provided with a protruding mounting part (1211), and the connector (1417) is connected to the connecting flange (1418) and the mounting part (1211) respectively.

7. The clamping mechanism according to claim 6, characterized in that, The first transmission assembly (141) further includes a first elastic element (1419), which is sleeved on the first sliding rod (1412) and elastically supported between the connecting flange (1418) and the first sleeve (1411).

8. The clamping mechanism according to claim 2, characterized in that, The second transmission assembly (142) includes a fixed base (1422), a transmission rod (1423) and the shaft portion (1421). The fixed base (1422) is fixedly connected to the bearing plate (110). The transmission rod (1423) is hinged to the fixed base (1422) through the shaft portion (1421). One end of the transmission rod (1423) is rotatably connected to the first transmission assembly (141), and the other end of the transmission rod (1423) is rotatably connected to the third transmission assembly (143).

9. The clamping mechanism according to claim 2, characterized in that, The third transmission assembly (143) includes a second sleeve (1431) and a second sliding rod (1432). The bearing plate (110) is fixedly connected to the second sleeve (1431). The second sleeve (1431) is sleeved on the second sliding rod (1432) and slidably connected to the second sliding rod (1432). One end of the second sliding rod (1432) is rotatably connected to the second transmission assembly (142), and the other end of the second sliding rod (1432) is fixedly connected to the clamping part (130).

10. The clamping mechanism according to claim 9, characterized in that, A second linear bearing (1434) is provided between the second sleeve (1431) and the second sliding rod (1432).

11. The clamping mechanism according to claim 9, characterized in that, The third transmission assembly (143) further includes a second elastic element (1433), which is sleeved on the second sliding rod (1432) and elastically supported between one end of the second sliding rod (1432) that connects the second transmission assembly (142) and the second sleeve (1431).

12. The clamping mechanism according to claim 1, characterized in that, The drive disk (120) includes a drive disk body (121) and a drive mechanism (122). The drive disk body (121) is rotatably connected to the carrier disk (110). The drive mechanism (122) is connected to both the drive disk body (121) and the carrier disk (110) and is used to drive the drive disk body (121) to rotate relative to the carrier disk (110).

13. The clamping mechanism according to claim 1, characterized in that, The clamping part (130) includes a connecting seat (131) and a clamping head (132). The clamping head (132) is disposed on the top of the connecting seat (131). The connecting seat (131) is connected to the second end of the synchronous transmission mechanism (140). The clamping head (132) is used to contact the wafer (150). When the carrier disk (110) and the drive disk (120) rotate relative to each other, a plurality of clamping heads (132) synchronously move closer to or away from the carrier disk (110) along the radial direction of the carrier disk (110).

14. The clamping mechanism according to claim 13, characterized in that, The side of the connecting seat (131) is provided with a raised arc-shaped guide structure (133), which is guided and cooperates with the bearing plate (110).

15. A load-bearing component, characterized in that, It includes a support plate (110) and a clamping mechanism as described in any one of claims 1-14.

16. A wafer cleaning device, characterized in that, include: A cleaning chamber and a support assembly as described in claim 15, wherein the support assembly is disposed in the cleaning chamber.

Images