Heat dissipation device and semiconductor device having the same

Abstract

The application provides a heat dissipation device and a semiconductor device with the same, wherein the heat dissipation device is immersed in refrigerant, and the heat dissipation device comprises a shell, a heating element is arranged on the outer surface of the shell to conduct the heat generated by the heating element, the side of the shell is provided with a first inlet, the top of the shell is provided with a first outlet, and the shell is provided with a containing portion which is in communication with the first inlet and the first outlet; a first flow guide pipe is arranged on the shell, the first end of the first flow guide pipe is a second inlet, the second end of the first flow guide pipe is a second outlet, the second outlet is arranged in communication with the first inlet, so that the refrigerant flows into the first flow guide pipe, and the second inlet is arranged upward. The technical scheme of the application effectively solves the problem that the probability of the gas flowing out of the lower heat sink entering the upper heat sink is relatively large in the related art, and in the case of applying the heat dissipation device to the heat dissipation of the power element in the converter, the heat dissipation effect of the power element can be guaranteed to be better.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation structure of a converter, in particular to a heat dissipation device and a semiconductor device with the same. BACKGROUND

[0002] The heat flux density of the existing high-power semiconductor device is high. In order to realize the cooling of the semiconductor device, the semiconductor device and the heat sink can be immersed in the cooling liquid. The semiconductor device can be a converter. The heat generating element and the heat sink each include a plurality of heat generating elements and a plurality of heat sinks. The plurality of heat generating elements are arranged in the height direction of the heat sink. The plurality of heat sinks are arranged in the height direction of the heat sink. The plurality of heat generating elements and the plurality of heat sinks are arranged one by one. The heat generating element and the heat sink corresponding to the heat generating element are arranged in close contact.

[0003] In the prior art, the bottom of the heat sink is provided with an inlet hole, and the top of the heat sink is provided with an outlet hole. After the cooling liquid is heated, it changes from a liquid to a gas. This causes the cooling liquid in the lower heat sink to change phase and flow out of the lower heat sink. When the gas flows upward, it enters the upper heat sink. The gas entering the upper heat sink results in a higher gas fraction of the cooling liquid entering the upper heat sink, and the temperature of the gas is higher. This heats the liquid in the upper heat sink, resulting in a decrease in the effectiveness of the liquid in the upper heat sink absorbing heat from the heat generating element. That is, it results in a decrease in the heat dissipation effect of the heat generating element corresponding to the upper heat sink. SUMMARY

[0004] The main purpose of the present application is to provide a heat dissipation device and a semiconductor device with the same, in order to solve the problem that the gas flowing out of the lower heat sink enters the upper heat sink with a high probability in the related art.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the present application, a heat dissipation device is provided, the heat dissipation device is immersed in a refrigerant, and the heat dissipation device comprises: a shell, a heat generating element is arranged on the outer surface of the shell to conduct the heat generated by the heat generating element, a first inlet is arranged on the side of the shell, a first outlet is arranged on the top of the shell, and a containing portion is arranged in the shell and communicates with the first inlet and the first outlet; a first flow guide pipe is arranged on the shell, a second inlet is arranged on the first end of the first flow guide pipe, a second outlet is arranged on the second end of the first flow guide pipe, the second outlet is arranged in communication with the first inlet, so that the refrigerant flows into the first flow guide pipe, and the second inlet is arranged upward.

[0006] Further, the first flow guide pipe has a preset included angle between the axis and the vertical plane, and the preset included angle is greater than 0° and less than or equal to 180°.

[0007] Further, the end surface of the first end of the first flow guide pipe is higher than the end surface of the second end of the first flow guide pipe.

[0008] Further, the first drainage pipe is further provided with a commutation hole, and the commutation hole is upwardly arranged.

[0009] Further, the accommodating portion comprises a first accommodating space and a second accommodating space in communication with the first accommodating space, the second accommodating space is located below the first accommodating space, the first inlet is arranged in communication with the second accommodating space, the cross-sectional area of the second accommodating space is greater than the cross-sectional area of the first accommodating space, and the heating element is arranged at the outer periphery of the first accommodating space.

[0010] Further, the shell comprises a bottom plate, a first side plate, a second side plate, a third side plate and a fourth side plate, the first side plate, the second side plate, the third side plate and the fourth side plate are sequentially arranged at the outer periphery of the bottom plate and are connected with the bottom plate, the top of the first side plate, the top of the second side plate, the top of the third side plate and the top of the fourth side plate form the first outlet, the bottom plate, the first side plate, the second side plate, the third side plate and the fourth side plate form the accommodating portion, and the first inlet is arranged on the first side plate.

[0011] Further, the second side plate comprises a plate body and a protruding portion, the protruding portion is arranged on the surface of the plate body facing the fourth side plate, the protruding portion is arranged in spaced relation with the bottom plate, the side surface of the protruding portion, the first side plate, the third side plate and the fourth side plate form the first accommodating space, and the bottom plate, the bottom surface of the protruding portion, the plate body, the first side plate, the third side plate and the fourth side plate form the second accommodating space.

[0012] Further, the thickness of the plate body is H1, the thickness of the protruding portion is H2, the sum of the thickness H1 of the plate body and the thickness H2 of the protruding portion is H3, and H1 and H3 satisfy: 0.2≤H1 / H3≤0.5.

[0013] Further, the distance L between the first end of the first drainage pipe and the side wall of the shell and the diameter Φ of the heating element satisfy: 0.5≤L / Φ≤1.5.

[0014] Further, the heat dissipation device further comprises a second drainage pipe, the first end of the second drainage pipe is a third inlet, the third outlet is arranged upwardly, the second end of the second drainage pipe is the third outlet, so that the refrigerant flows into the second drainage pipe, the side portion of the shell is provided with a fourth inlet in communication with the accommodating portion, the second end of the second drainage pipe is connected with the shell and is arranged in communication with the fourth inlet.

[0015] Further, in the thickness direction of the shell, the axis of the second drainage pipe and the axis of the first drainage pipe are spaced.

[0016] Further, the shell further comprises a support structure, and the support structure comprises a plurality of support columns, and the plurality of support columns are arranged in spaced relation in the first accommodating space.

[0017] Further, the heat dissipation device further comprises: a driving structure arranged on the shell; and a pushing structure arranged in the accommodating portion, the driving structure and the pushing structure being drivingly matched, so that the pushing structure is capable of moving along the height direction of the shell to push out the refrigerant in the accommodating portion, the pushing structure comprising a plurality of push plates arranged at intervals, the plurality of support columns being arranged in M rows and N columns, and one column of support columns being arranged between two adjacent push plates; wherein M and N are both positive integers greater than or equal to 1, at least one of M and N is greater than 1, each row of support columns comprises at least one support column, and each column of support columns comprises at least one support column; the pushing structure has a pushing state and an avoiding state, when the pushing structure is in the pushing state, the pushing structure moves from the bottom of the shell to the top of the shell, and when the pushing structure is in the avoiding state, the pushing structure moves from the top of the shell to the bottom of the shell, and at least part of the structure of the push plate and the inner wall of the shell form an overflow space.

[0018] According to another aspect of the present application, a semiconductor device is provided, comprising a heat generating element and a heat dissipation device, the heat generating element being arranged on the outer surface of the shell of the heat dissipation device, and the heat dissipation device being the heat dissipation device described above.

[0019] Further, the semiconductor device comprises a plurality of semiconductor assemblies, the plurality of semiconductor assemblies being arranged at intervals along the height direction of the shell of the heat dissipation device, each semiconductor assembly comprising a plurality of heat dissipation devices and a plurality of heat generating elements, the plurality of heat generating elements in one semiconductor assembly being arranged at intervals along the thickness direction of the heat generating elements, and one heat generating element being arranged between two adjacent heat dissipation devices in one semiconductor assembly.

[0020] The technical scheme of the present application is applied to the heat dissipation device immersed in the refrigerant, the heat dissipation device comprising a shell and a first flow guide pipe. The heat generated by the heating element can be conducted to the containing portion through the outer surface of the shell, and then the cold coal in the containing portion can absorb the heat conducted to the containing portion, and then the refrigerant can change from liquid to gas, and the gas can flow out of the first outlet, and then the heat is taken out. The refrigerant can enter the first flow guide pipe from the first end of the first flow guide pipe, and then flow into the first inlet from the second end of the first flow guide pipe, and flow into the containing portion through the first inlet, so as to facilitate the refrigerant to absorb the heat conducted to the containing portion. The refrigerant can flow out of the first outlet, realizing the flow of the refrigerant. The first inlet is arranged on the side of the shell, and the first flow guide pipe corresponding to the first inlet is arranged, which can reduce the probability of the gas below entering the shell through the first inlet, and then can reduce the influence of the gas flowing out of the heat dissipation device below on the heat dissipation effect of the refrigerant in the shell above. The second inlet is arranged upward, and the gas flowing out of the heat dissipation device below can continue to flow upward along the first flow guide pipe and the side wall of the shell, reducing the probability of the gas flowing out of the heat dissipation device below entering the first flow guide pipe through the second inlet. Therefore, the technical scheme of the present application effectively solves the problem that the probability of the gas flowing out of the heat dissipation device below entering the heat dissipation device above is large in the related art. BRIEF DESCRIPTION OF DRAWINGS

[0021] The drawings accompanying the specification of the present application form a part thereof, serve to provide further understanding of the present application, and together with the specification explain the present application, and do not limit the present application in any manner. In the drawings:

[0022] Figure 1 A perspective structural schematic view of an embodiment of the heat dissipation device according to the present application is shown;

[0023] Figure 2 A sectional view schematic view of a first position of the heat dissipation device of Figure 1 ;

[0024] Figure 3 A sectional view schematic view of a shell of the heat dissipation device of Figure 1 ;

[0025] Figure 4 A sectional view schematic view of a second position of the heat dissipation device of Figure 1 when the push-up structure is in a push-up state;

[0026] Figure 5 A local enlarged schematic view of A of the heat dissipation device of Figure 4 ;

[0027] Figure 6 A perspective structural schematic view of the heat dissipation device of Figure 1 when the second plate segment of the push plate and the stop plate segment stop each other;

[0028] Figure 7 a perspective view of the connection seat of the heat dissipation device of Figure 1 ;

[0029] Figure 8 a sectional view of the second reset part of the heat dissipation device of Figure 1 ;

[0030] Figure 9 a perspective view of the third top plate of the heat dissipation device of Figure 1 after rotation relative to the first plate segment;

[0031] Figure 10 a sectional view of the third position of the push-up structure of the heat dissipation device of Figure 1 when in a push-up state;

[0032] Figure 11 a partial enlarged view of B of the heat dissipation device of Figure 10 ;

[0033] Figure 12 a perspective view of the third top plate of the heat dissipation device of Figure 1 in contact with the support column;

[0034] Figure 13 a sectional view of the push-up structure of the heat dissipation device of Figure 1 when in a retreat state;

[0035] Figure 14 a partial enlarged view of C of the heat dissipation device of Figure 13 ;

[0036] Figure 15 a side view of the heat dissipation device of Figure 13 ;

[0037] Figure 16 a perspective view of an embodiment of a semiconductor device according to the present application;

[0038] Figure 17 a top view of the semiconductor device of Figure 16 .

[0039] wherein the above figures include the following reference signs:

[0040] 1, heating element; 10, shell; 11, first inlet; 12, first outlet; 13, containing part; 131, first containing space; 132, second containing space; 14, bottom plate; 15, first side plate; 16, second side plate; 161, plate body main body; 162, protruding part; 17, third side plate; 18, fourth side plate; 19, fourth inlet; 110, support structure; 1101, support column; 111, sliding groove; 112, avoiding groove; 113, guide groove; 20, first drainage pipe; 21, second inlet; 22, commutation hole; 30, second drainage pipe; 31, third inlet; 40, driving structure; 41, driving screw; 50, pushing structure; 51, push plate; 511, first plate segment; 512, second plate segment; 513, stop plate segment; 52, second reset part; 521, first top plate; 522, second top plate; 53, third top plate; 54, connecting seat; 541, seat body main body; 542, guide block; 543, limiting part; 100, semiconductor assembly. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. The description of the at least one exemplary embodiment is actually only illustrative, but not intended to limit the present application and its application or use in any way. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0042] It should be noted that the terms used herein are only intended to describe specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise, and it should also be understood that when the terms "comprise" and / or "include" are used in the specification, there is a feature, step, operation, device, component and / or combination thereof.

[0043] The relative arrangement of parts and steps, numerical expressions, and numerical values set forth in the examples are not intended to limit the scope of the application unless specifically so stated. It is to be understood that the drawings are not necessarily to scale as the dimensions of the parts shown are for the purpose of illustration and do not present a limitation of the application. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered as part of the specification, where appropriate. In all examples shown and discussed herein, any specific values should be interpreted as merely illustrative and not as a limitation. Thus, other examples of exemplary embodiments can have different values. It should be noted that like reference numerals and letters refer to like items in the several views of the drawings, and, as such, further discussion of such items is not necessary in the subsequent views.

[0044] As shown in Figure 1 and Figure 2 The heat dissipation device of the present embodiment is immersed in the refrigerant, and the heat dissipation device comprises a housing 10 and a first flow guide pipe 20. A heat generating element 1 is arranged on the outer surface of the housing 10 to conduct the heat generated by the heat generating element 1 out, the side of the housing 10 is provided with a first inlet 11, the top of the housing 10 is provided with a first outlet 12, and a containing portion 13 is arranged in the housing 10 and communicates with the first inlet 11 and the first outlet 12. The first flow guide pipe 20 is arranged on the housing 10, the first end of the first flow guide pipe 20 is a second inlet 21, and the second end of the first flow guide pipe 20 is a second outlet, which is arranged in communication with the first inlet 11, so that the refrigerant flows into the first flow guide pipe 20, and the second inlet 21 is arranged upward.

[0045] The technical scheme is applied, the heat dissipation device is immersed in the refrigerant, the heat dissipation device comprises a shell 10 and a first flow guide pipe 20. The heat generated by the heating element 1 can be conducted to the containing portion 13 through the outer surface of the shell 10, and then the cold coal located in the containing portion 13 can absorb the heat conducted to the containing portion 13, and then the refrigerant can change from liquid to gas, and the gas can flow out of the first outlet 12, and then the heat is taken out. The refrigerant can enter the first flow guide pipe 20 from the first end of the first flow guide pipe 20, and then flow into the first inlet 11 from the second end of the first flow guide pipe 20, and flow into the containing portion 13 through the first inlet 11, so that the refrigerant can absorb the heat conducted to the containing portion 13. The refrigerant can flow out of the first outlet 12, realizing the flow of the refrigerant. The first inlet 11 is arranged on the side of the shell 10, and the first flow guide pipe 20 corresponding to the first inlet 11 is arranged, which can reduce the probability of the gas below entering the shell 10 through the first inlet 11, and then the influence of the gas flowing out of the heat dissipation device below on the heat dissipation effect of the refrigerant in the shell 10 above can be reduced. The second inlet 21 is arranged upward, the gas flowing out of the heat dissipation device below can continue to flow upward along the side wall of the first flow guide pipe 20 and the shell 10, reducing the probability of the gas flowing out of the heat dissipation device below entering the first flow guide pipe 20 through the second inlet 21. Therefore, the technical scheme of the embodiment effectively solves the problem that the probability of the gas flowing out of the heat dissipation device below entering the heat dissipation device above is large in the related art.

[0046] It should be noted that the second inlet 21 is arranged upward, that is, the second inlet 21 is arranged towards the plane where the top surface of the shell is located. As shown in Figure 3 The end surface of the first flow guide pipe 20 and the vertical plane have a first included angle, and the first included angle is greater than 0° and less than 180°. The first included angle can be 5°, 10°, 20°, 30°, 45°, 50°, 80°, 90°, 110°, 120°, 135°, 150°, 170° or 175°. Preferably, the first included angle is greater than or equal to 30° and less than or equal to 150°.

[0047] The first flow guide pipe 20 is arranged obliquely upward. The first flow guide pipe 20 is a straight pipe. The axis of the first inlet 11 and the axis of the first flow guide pipe 20 are coaxially arranged. In this way, the refrigerant can flow into the first inlet 11 from the second outlet, and then enter the containing portion 13 through the first inlet 11.

[0048] Specifically, the refrigerant refers to fluorinated liquid, or other liquid with phase change characteristics, which can change from liquid to gas when heated.

[0049] The heat dissipation device of the embodiment is a two-phase cooling gas-liquid separation heat dissipation device. The bottom of the shell 10 is closed, which can block the external gas from entering the shell 10 through the bottom of the shell 10. The arrangement of the first outlet 12 is conducive to the rapid overflow of the gas in the containing portion 13.

[0050] As shown in Figure 1 and Figure 3 In the embodiment, the first drain pipe 20 has a preset angle between the axis and the vertical plane, and the preset angle is greater than 90° and less than or equal to 180°. By limiting the preset angle between the axis of the first drain pipe 20 and the vertical plane, the setting position of the first drain pipe 20 is more reasonable, and the probability of the gas flowing out of the lower heat dissipation device entering the first drain pipe 20 through the second inlet 21 can be further reduced.

[0051] The preset angle can be 95°, 110°, 120°, 130°, 135°, 150°, 170°, 175°, or 180°. Preferably, the preset angle is greater than or equal to 120° and less than or equal to 170°.

[0052] As shown in Figures 1 to 3 In the embodiment, the end surface of the first end of the first drain pipe 20 is higher than the end surface of the second end of the first drain pipe 20. By limiting the relative position of the end surface of the first end of the first drain pipe 20 and the end surface of the second end of the first drain pipe 20, the gas flowing out of the lower heat dissipation device first flows to the height where the second end of the first drain pipe 20 is located, and then flows to the height where the first end of the first drain pipe 20 is located. The distance between the first end of the first drain pipe 20 and the lower heat dissipation device is increased, the moving path of the gas flowing through the second inlet 21 is increased, and part of the heat of the gas can be absorbed by the refrigerant when the gas moves. When the gas flows upward from the lower heat dissipation device, the gas first contacts the outer surface of the first drain pipe 20, rather than first contacting the first end of the first drain pipe 20, thereby further reducing the probability of the gas entering the first drain pipe 20 through the second inlet 21, i.e., reducing the probability of the gas entering the shell 10 through the first inlet 11.

[0053] As shown in Figure 1 and Figure 2 In the embodiment, the first drain pipe 20 is further provided with a flow conversion hole 22, and the flow conversion hole 22 is upwardly arranged. The shell outer refrigerant can enter the first drain pipe 20 through the flow conversion hole 22, thereby increasing the path of the refrigerant flowing into the first drain pipe 20 and increasing the area of the channel of the refrigerant entering the first drain pipe 20. Part of the gas in the shell 10 can also flow out of the shell through the flow conversion hole 22, thereby increasing the flow path of the gas. By arranging the flow conversion hole 22 upwardly, when the gas flows through the first drain pipe 20, the gas moves upwardly along the surface of the first drain pipe 20, thereby reducing the probability of the gas entering the first drain pipe 20 through the flow conversion hole 22. If the flow conversion hole 22 is arranged downwardly or toward the side, the probability of the gas flowing into the first drain pipe 20 through the flow conversion hole 22 is relatively large.

[0054] It should be noted that the "commutation hole 22 is arranged upwardly" means that the commutation hole 22 is arranged towards the plane where the top of the shell 10 is located at one end of the outer surface of the first flow guide pipe 20.

[0055] As shown in the drawings, Figures 2 to 4 In the present embodiment, the accommodating portion 13 includes a first accommodating space 131 and a second accommodating space 132 in communication with the first accommodating space 131, the second accommodating space 132 is located below the first accommodating space 131, the first inlet 11 is arranged in communication with the second accommodating space 132, the cross-sectional area of the second accommodating space 132 is larger than that of the first accommodating space 131, and the heating element 1 is arranged at the outer periphery of the first accommodating space 131. The first accommodating space 131 and the second accommodating space 132 can both accommodate refrigerant. The cross-sectional area of the second accommodating space 132 is larger than that of the first accommodating space 131, so that the second accommodating space 132 can accommodate more refrigerant, and the refrigerant in the second accommodating space 132 can flow into the first accommodating space 131 in time after the refrigerant in the first accommodating space 131 becomes gas. The heating element 1 is arranged at the outer periphery of the first accommodating space 131, so that the refrigerant entering the second accommodating space 132 can gradually distribute uniformly during the process of flowing between the second accommodating space 132 and the first accommodating space 131, and then contact the heat conducted into the accommodating portion 13, thereby more effectively absorbing heat, so that the heat dissipation effect of the heat dissipation device is better. The heating element 1 is arranged at the outer periphery of the first accommodating space 131, so that most of the heat conducted to the shell 10 is located at the first accommodating space 131, facilitating the gas to flow out of the shell 10 from the first outlet 12, and not affecting the refrigerant entering the accommodating portion 13 from the first flow guide pipe 20.

[0056] It should be noted that, as shown in the drawings, Figure 15 The cross-sectional area refers to the area of the cross section in the length direction or the width direction of the shell.

[0057] The first inlet 11 is located at the lower part of the shell 10, which reduces the probability of gas in the accommodating portion 13 flowing into the first flow guide pipe 20 through the first inlet 11. The first inlet 11 is located at the lower part of the shell 10, which means that the communication part of the first inlet 11 and the accommodating portion 13 is located in the second accommodating space 132.

[0058] As shown in the drawings, Figures 2 to 4As shown in the figure, in the embodiment, the shell 10 comprises a bottom plate 14, a first side plate 15, a second side plate 16, a third side plate 17 and a fourth side plate 18, the first side plate 15, the second side plate 16, the third side plate 17 and the fourth side plate 18 are sequentially arranged around the outer periphery of the bottom plate 14 and are connected with the bottom plate 14, the top of the first side plate 15, the top of the second side plate 16, the top of the third side plate 17 and the top of the fourth side plate 18 form the first outlet 12, the bottom plate 14, the first side plate 15, the second side plate 16, the third side plate 17 and the fourth side plate 18 form the accommodating portion 13, and the first inlet 11 is arranged on the first side plate 15. The bottom plate 14, the first side plate 15, the second side plate 16, the third side plate 17 and the fourth side plate 18 can form the shell 10, and form the first outlet 12 and the accommodating portion 13.

[0059] It should be noted that the bottom plate 14, the first side plate 15, the second side plate 16, the third side plate 17 and the fourth side plate 18 form a cubic structure, that is, the shell 10 has a cubic structure. The first side plate 15 is arranged opposite to the third side plate 17. The second side plate 16 is arranged opposite to the fourth side plate 18.

[0060] As shown in the figure, Figure 4 and Figure 15 As shown in the figure, in the embodiment, the second side plate 16 comprises a plate body 161 and a protruding portion 162, the protruding portion 162 is arranged on the surface of the plate body 161 facing the fourth side plate 18, the protruding portion 162 is arranged spaced apart from the bottom plate 14, the side surface of the protruding portion 162, the first side plate 15, the third side plate 17 and the fourth side plate 18 form the first accommodating space 131, and the bottom plate 14, the bottom surface of the protruding portion 162, the plate body 161, the first side plate 15, the third side plate 17 and the fourth side plate 18 form the second accommodating space 132. The arrangement of the protruding portion 162 on the plate body 161 makes the structure of the position where the second side plate 16 is provided with the protruding portion 162 stronger, so that the load-bearing capacity of the second side plate 16 is better. The second side plate 16 comprises the plate body 161 and the protruding portion 162 arranged on the surface of the plate body 161 facing the fourth side plate 18, and the protruding portion 162 is arranged spaced apart from the bottom plate 14, that is, the thickness of the second side plate 16 is designed to be non-uniform, so that the thickness of the lower part of the second side plate 16 is smaller, the thermal resistance between the upper part of the second side plate 16 and the lower part of the second side plate 16 can be increased, the heat transfer from the upper part of the second side plate 16 to the lower part of the second side plate 16 is hindered, the temperature of the refrigerant in the second accommodating space 132 is reduced, and the amount of gas generated in the second accommodating space 132 can be reduced.

[0061] It should be noted that the second accommodating space 132 can only conduct limited heat through the heat conduction of the surfaces of the plate body 161 and the protruding portion 162, and the temperature rise of the refrigerant in the second accommodating space 132 is limited, so that the second accommodating space 132 is not easy to generate gas.

[0062] The refrigerant located at the lower part of the plate body 161 and outside the shell 10 can only conduct limited heat under the heat conduction of the surfaces of the plate body 161 and the protruding part 162, and is not easy to produce gas. Even if gas is produced, it can move upward along the outer surface of the shell 10 and is not easy to enter the first drainage pipe 20 and the second drainage pipe 30.

[0063] Specifically, the structure of the fourth side plate 18 can be the same as or different from that of the second side plate 16.

[0064] As shown in Figure 4 and Figure 15 In the present embodiment, the thickness of the plate body 161 is H1, the thickness of the protruding part 162 is H2, the sum of the thickness H1 of the plate body 161 and the thickness H2 of the protruding part 162 is H3, and H1 and H3 satisfy: 0.2≤H1 / H3≤0.5. By limiting H1 and H3, not only the load-bearing capacity of the second side plate 16 can be ensured, but also the thermal resistance between the upper part of the second side plate 16 and the lower part of the second side plate 16 can be more reasonable.

[0065] It should be noted that the value of H1 / H3 can be 0.2, 0.3, 1 / 3, 0.35, 0.4 or 0.5. In the present embodiment, the value of H1 / H3 is 1 / 3.

[0066] As shown in Figure 3 and Figure 17 In the present embodiment, the distance L between the first end of the first drainage pipe 20 and the side wall of the shell 10 and the diameter Φ of the heat generating element 1 satisfy: 0.5≤L / Φ≤1.5. By the above setting, the first drainage pipe 20 can have a certain length, so that the second inlet 21 is located in a region with lower refrigerant temperature, and a certain supercooling degree can be ensured.

[0067] It should be noted that the value of L / Φ can be 0.5, 0.7, 0.8, 0.9, 1, 1.2, 1.4 or 1.5. In the present embodiment, the value of L / Φ is 1, i.e. the distance L is equal to the diameter of the heat generating element 1.

[0068] The distance L between the first end of the first drainage pipe 20 and the side wall of the shell 10 is the maximum distance between the first end of the first drainage pipe 20 and the side wall of the shell 10.

[0069] The distance L between the first end of the first drainage pipe 20 and the side wall of the shell 10 is the maximum distance between the first end of the first drainage pipe 20 and the side wall of the shell 10.

[0070] As shown in Figure 1 and Figure 2As shown, in the embodiment, the heat dissipation device further comprises a second flow guide pipe 30, a first end of the second flow guide pipe 30 is a third inlet 31, the third inlet 31 is arranged upward, a second end of the second flow guide pipe 30 is a third outlet, so that the refrigerant flows into the second flow guide pipe 30, a side of the shell 10 is provided with a fourth inlet 19 which communicates with the containing portion 13, the second end of the second flow guide pipe 30 is connected with the shell 10 and is arranged in communication with the fourth inlet 19. The refrigerant can flow into the second flow guide pipe 30 from the third inlet 31 and flow into the fourth inlet 19 through the third outlet, and then can enter into the containing portion 13.

[0071] It should be noted that the fourth inlet 19 is arranged in communication with the second containing space 132. The fourth inlet 19 is arranged on the third side plate 17. The axis of the fourth inlet 19 is coaxially arranged with the axis of the second flow guide pipe 30. In this way, the refrigerant can flow into the fourth inlet 19 from the third outlet and enter into the containing portion 13 through the fourth inlet 19.

[0072] The second flow guide pipe 30 has the same structure as the first flow guide pipe 20. From the bottom of the shell 10 to the top of the shell 10, the distance between the first flow guide pipe 20 and the second flow guide pipe 30 gradually increases.

[0073] As shown in Figure 16 and Figure 17 As shown in the embodiment, in the thickness direction of the shell 10, the axis of the second flow guide pipe 30 and the axis of the first flow guide pipe 20 have a spacing. In this way, when multiple heat dissipation devices are arranged in the height direction of the shell 10, the first flow guide pipe 20 of the upper heat dissipation device and the second flow guide pipe 30 of the lower heat dissipation device are arranged staggered, which can reduce the probability of the gas entering the shell 10 of the upper heat dissipation device.

[0074] It should be noted that the thickness direction of the shell 10 is the width direction of the shell 10.

[0075] As shown in Figure 4 In the embodiment, the shell 10 further comprises a support structure 110, the support structure 110 comprises a plurality of support columns 1101, the plurality of support columns 1101 are arranged in the first containing space 131 in a spaced manner. The plurality of support columns 1101 are arranged to make the structural strength of the shell 10 better, and thus make the bearing capacity of the shell 10 better. The plurality of support columns 1101 can also increase the heat exchange effect of the shell 10 and increase the contact area of the shell 10 with the refrigerant.

[0076] It should be noted that the first end of each support column 1101 is connected with the second side plate 16, and the second end of each support column 1101 is connected with the fourth side plate 18.

[0077] As shown in Figure 4 and Figures 7 to 11As shown, in the embodiment, the heat dissipation device further comprises a driving structure 40 and a pushing structure 50. The driving structure 40 is arranged on the shell 10. The pushing structure 50 is arranged in the accommodating portion 13, and the driving structure 40 is in driving cooperation with the pushing structure 50, so that the pushing structure 50 can move along the height direction of the shell 10 to push out the refrigerant in the accommodating portion 13. The pushing structure 50 comprises a plurality of pushing plates 51 arranged at intervals, and the plurality of support columns 1101 are arranged in M rows and N columns, and a column of support columns 1101 is arranged between two adjacent pushing plates 51. Wherein, M and N are both positive integers greater than or equal to 1, at least one of M and N is greater than 1, each row of support columns 1101 comprises at least one support column 1101, and each column of support columns 1101 comprises at least one support column 1101. The pushing structure 50 has a pushing state and an avoiding state. When the pushing structure 50 is in the pushing state, the pushing structure 50 moves from the bottom of the shell 10 to the top of the shell 10. When the pushing structure 50 is in the avoiding state, the pushing structure 50 moves from the top of the shell 10 to the bottom of the shell 10. At least part of the structure of the pushing plate 51 and the inner wall of the shell 10 form a flow space. When the pushing structure 50 is in the pushing state, the driving structure 40 drives the pushing structure 50 to move from the bottom of the shell 10 to the top of the shell 10, so that the pushing structure 50 can push out the refrigerant in the accommodating portion 13. At the same time, the refrigerant with lower temperature outside the shell 10 can enter the accommodating portion 13 through the first drainage pipe 20 and the second drainage pipe 30, realizing the replacement of the refrigerant, so that the heat dissipation effect of the heat dissipation device is better. When the pushing structure 50 is in the avoiding state, the driving structure 40 drives the pushing structure 50 to move from the top of the shell 10 to the bottom of the shell 10. At the same time, part of the structure of the pushing plate 51 can form a flow space with the inner wall of the shell 10, facilitating the flow of the refrigerant below the pushing plate 51 to the above of the pushing plate 51, reducing the total amount of the refrigerant and gas pushed out of the shell 10 by the pushing plate 51 and flowing back to the shell 10 through the first outlet 12, avoiding affecting the heat dissipation of the heating element 1.

[0078] It should be noted that the axes of a column of support columns 1101 can be located in the same plane or different planes. In the length direction of the shell 10, the axes of a column of support columns 1101 can have intervals.

[0079] Specifically, the push plate 51 comprises a first plate segment 511 and a second plate segment 512, the first plate segment 511 is hingedly connected with the second plate segment 512, a first end of the first plate segment 511 is movably arranged on an inner wall of the shell 10 along a height direction of the shell 10, a first end of the second plate segment 512 is hingedly connected with a second end of the first plate segment 511, and a second end of the second plate segment 512 is a free end, when the push structure 50 is in the pushing state, under the pressure of the refrigerant above the push plate 51, the first end of the second plate segment 512 can be kept in close contact with the second end of the first plate segment 511 to avoid the rotation of the second plate segment 512 relative to the first plate segment 511, when the push structure 50 is in the avoiding state, under the pressure of the refrigerant below the second plate segment 512, the second plate segment 512 can rotate upward relative to the first plate segment 511, the first end of the second plate segment 512 is out of contact with the second end of the first plate segment 511, the second end of the second plate segment 512 is higher than the first end of the second plate segment 512, and a flow space is formed between the side of the second plate segment 512 away from the first plate segment 511 and the inner wall of the shell 10, so that the refrigerant can flow between the second plate segment 512 and the inner wall of the shell 10, and then the refrigerant below the first plate segment 511 can flow above the push plate 51.

[0080] Specifically, part of the structure of the push plate 51 can form a flow space with the inner wall of the shell 10, that is, a flow space is formed between the side of the second plate segment 512 facing the second side plate 16 and the second side plate 16.

[0081] As shown in Figure 5 and Figure 6 , the push plate 51 further comprises a stop plate segment 513 arranged on the upper surface of the first plate segment 511, when the push structure 50 is in the avoiding state, the stop plate segment 513 can be in stop cooperation with the second plate segment 512, that is, the upper surface of the second plate segment 512 is in close contact with the stop plate segment 513.

[0082] As shown in Figure 15 , when the stop plate segment 513 can be in stop cooperation with the second plate segment 512, the second included angle between the second plate segment 512 and the vertical plane is greater than 0° and less than 10°, so that the second plate segment 512 can rotate downward under the action of gravity until the first end of the second plate segment 512 is in close contact with the second end of the first plate segment 511. The second included angle can be 1°, 2°, 5°, 6°, 8° or 10°.

[0083] The push structure 50 further comprises a first reset part arranged between the first plate segment 511 and the second plate segment 512, the first reset part is a first elastic member, and the first elastic member is a torsion spring. So that the second end of the first plate segment 511 can keep in contact with the first end of the second plate segment 512.

[0084] AsFigure 8 As shown, the push-up structure 50 further comprises a second reset portion 52, the second reset portion 52 comprises a first top plate 521 and a second top plate 522, the first top plate 521 and the second top plate 522 are both slidably arranged on the bottom plate 14, the sliding directions of the first top plate 521 and the second top plate 522 are arranged vertically, the first end of the first top plate 521 is located below the second end of the first top plate 521, the second end of the first top plate 521 is in push-up cooperation with the first end of the second top plate 522, and the second end of the second top plate 522 is in push-up cooperation with the second plate segment 512. The second reset portion has a reset state and a retracted state, when the second reset portion is in the reset state, the first end of the first top plate 521 is in contact with the bottom plate 14, under the action of the bottom plate 14, the first top plate 521 moves upward, and then the first top plate 521 pushes the second top plate 522 to move towards the direction of being close to the second plate segment 512, and then the second top plate 522 applies a downward rotating force to the second plate segment 512, when the second reset portion is in the retracted state, the second top plate 522 is out of contact with the second plate segment 512.

[0085] The first top plate 521 slides along the height direction of the shell 10, and the second top plate 522 slides along the width direction of the shell 10.

[0086] The push-up structure 50 further comprises a third reset portion arranged between the first top plate 521 and the first plate segment 511, the third reset portion is a second elastic member, and the second elastic member is a tensile spring or a compression spring. In this way, the first end of the first top plate 521 can protrude out of the first plate segment 511, the first end of the first top plate 521 is facilitated to be in contact with the bottom plate 14, and the first top plate 521 will not move upward during the movement of the push plate 51.

[0087] When the push-up structure 50 is in the avoiding state, the pressure applied by the refrigerant located below the first plate segment 511 to the first top plate 521 is smaller than the elastic force of the second elastic member, so that the refrigerant located below the first plate segment 511 can avoid extruding the first top plate 521 to the top of the shell, thereby preventing the first top plate 521 from moving.

[0088] It should be noted that, as shown in the figures, Figure 2 As shown, the inner wall of the shell 10 is further provided with a sliding groove 111, the sliding groove 111 extends along the height direction of the shell 10, and the sliding groove 111 is arranged on the fourth side plate 18.

[0089] The first plate segment 511 is movably arranged on the fourth side plate 18 or the second side plate 16, in this embodiment, the first plate segment 511 is movably arranged on the fourth side plate 18.

[0090] As shown in the figures, Figure 4 , Figure 9 , Figure 10 and Figures 12 to 15As shown, the pushing structure 50 further comprises at least one third top plate 53, one third top plate 53 is arranged between two adjacent pushing plates 51, the third top plate 53 arranged between two adjacent pushing plates 51 is hingedly connected with the side wall of one of the two pushing plates 51, the third top plate 53 is arranged corresponding to the column of support columns 1101 between the two pushing plates 51, the third top plate 53 has a first upward moving state, a second upward moving state, a first downward moving state and a second downward moving state, when the third top plate 53 is in the first upward moving state, the third top plate 53 is arranged parallel to the pushing plate 51 and moves upward synchronously, when the third top plate 53 moves to contact the support column 1101, under the extrusion of the support column 1101, the third top plate 53 rotates relative to the pushing plate 51, the third top plate 53 rotates to avoid the support column 1101, the third top plate 53 switches to the second upward moving state, when the third top plate 53 is in the second upward moving state, the third top plate 53 slides upward in the sliding groove 111, when the third top plate 53 switches from the second upward moving state to the first downward moving state, the third top plate 53 switches from upward sliding to downward sliding, when the third top plate 53 is in the first downward moving state, the third top plate 53 slides downward in the sliding groove 111, when the third top plate 53 switches from the first downward moving state to the second downward moving state, the third top plate 53 gradually separates from the support column 1101, the third top plate 53 rotates upward relative to the pushing plate 51, when the third top plate 53 is in the second downward moving state, the third top plate 53 is arranged parallel to the pushing plate 51 and moves downward synchronously. The third top plate 53 is arranged, so that when the pushing structure 50 is located below the support structure 110, the pushing structure 50 can have a larger pushing area, that is, the sum of the area of the upper surface of the pushing plate and the area of the upper surface of the third top plate is the pushing area, so that the refrigerant in the containing portion 13 can be pushed out to the maximum extent.

[0091] As shown in Figure 9 , the rotation axis of the third top plate 53 is arranged perpendicular to the rotation axis of the first plate segment 511. The rotation axis of the first plate segment 511 is arranged parallel to the direction of the first side plate 15 to the third side plate 17. The direction of the first side plate 15 to the third side plate 17 is the length direction of the shell 10.

[0092] As shown in Figure 9 , the rotation axis of the first plate segment 511 is the first rotation axis, and the first rotation axis is arranged coincident with the lower surface of the first plate segment 511. The rotation axis of the second plate segment 512 is arranged coincident with the upper surface of the second plate segment 512. The rotation axis of the third top plate 53 is the second rotation axis, and the second rotation axis is arranged coincident with the lower surface of the first plate segment 511.

[0093] The pushing structure 50 further comprises a fourth reset portion arranged between the third top plate 53 and the first plate segment 511, the fourth reset portion is a fourth elastic piece to keep the third top plate 53 and the first plate segment 511 in close contact. The fourth elastic piece is a torsion spring.

[0094] It should be noted that, as shown in Figure 2 The inner wall of the shell 10 is also provided with a relief groove 112, which is correspondingly and continuously arranged with the sliding groove 111. The relief groove 112 includes a plurality of relief grooves 112, which are correspondingly arranged with the plurality of third top plates 53. When the third top plate 53 rotates, part of the structure of the third top plate 53 is located in the relief groove 112, that is, the relief groove 112 is used to avoid part of the structure of the third top plate 53.

[0095] As shown in Figure 4 and Figure 5 When the push-up structure 50 is in the push-up state, the second end of the first plate segment 511 of the push plate 51 is in abutting arrangement with the first end of the second plate segment 512. The third top plate 53 is first in the first upward moving state. When the third top plate 53 contacts the support column 1101, the third top plate 53 gradually switches to the second upward moving state, until the top of the push plate 51 moves to the top of the shell 10, and then the push-up structure 50 switches from the push-up state to the relief state.

[0096] As shown in Figure 14 and Figure 15 When the push-up structure 50 is in the relief state, the second plate segment 512 rotates upward relative to the first plate segment 511, the second end of the first plate segment 511 is out of contact with the first end of the second plate segment 512, and a flow space is formed between the side of the second plate segment 512 away from the first plate segment 511 and the inner wall of the shell 10. The third top plate 53 is first in the first downward moving state, and the third top plate 53 slides downward in the sliding groove 111. When the third top plate 53 moves to gradually out of contact with the support column 1101, the third top plate 53 rotates upward relative to the push plate 51, until the third top plate 53 is parallel to the push plate 51, and the third top plate 53 switches to the second downward moving state, until the third top plate 53 and the push plate 51 move to the bottom of the shell 10.

[0097] As shown in Figure 14 and Figure 15 When the third top plate 53 is in the first downward moving state, part of the first end of the push plate 51 abuts against the inner wall of the shell 10, and part of the first end of the push plate 51 has a third included angle with the inner wall of the shell 10. When the third top plate 53 is in the second downward moving state, the first end of all the push plates 51 abuts against the inner wall of the shell 10.

[0098] Specifically, when the third top plate 53 is in the first downward moving state, part of the push plate abutting against the inner wall of the shell 10 is not connected with the third top plate 53, and part of the push plate 51 having a third included angle with the inner wall of the shell 10 is connected with the third top plate 53.

[0099] It should be noted that the pushing structure 50 further comprises a connecting seat 54 movably arranged on the inner wall of the shell 10 along the height direction of the shell 10, and the first plate segment 511 is hingedly connected with the connecting seat 54. The first plate segment 511 is rotatably arranged on the connecting seat 54.

[0100] In the embodiment, the hingedly connected refers to the connection between two connected structures through a rotating shaft.

[0101] As shown in Figure 7 , Figure 10 and Figure 11 , the connecting seat 54 comprises a seat body 541 and a guide block 542 connected with the seat body, and the inner wall of the shell 10 is further provided with a guide groove 113, and the guide block 542 is movably arranged in the guide groove 113 along the height direction of the shell 10. The first plate segment 511 is hingedly connected with the seat body 541.

[0102] The connecting seat 54 is movably arranged on the fourth side plate 18 along the height direction of the shell 10, that is, the seat body 541 is movably arranged on the fourth side plate 18 along the height direction of the shell 10.

[0103] The connecting seat 54 further comprises a limiting portion 543 arranged on the outer surface of the seat body 541 to limit the downward rotation angle of the first plate segment 511, so as to avoid that the first plate segment 511 is rotated to be in close contact with the inner wall of the shell 10 under the pressure of the refrigerant.

[0104] As shown in Figure 9 , the driving structure 40 comprises a driving assembly and a plurality of driving screws 41, the driving assembly and the plurality of driving screws 41 are drivingly matched, and the plurality of driving screws 41 are arranged one by one with the plurality of connecting seats 54. Each driving screw 41 extends along the height direction of the shell 10.

[0105] The driving assembly comprises a driving member, a transmission chain and a plurality of transmission wheels, the driving member is drivingly matched with the transmission chain, the plurality of transmission wheels are all meshingly driven with the transmission chain, each transmission wheel is rotatably arranged in the shell 10, and the plurality of transmission wheels are arranged one by one with the plurality of driving screws. The driving member can be a driving motor.

[0106] The heat dissipation device of the embodiment can reduce the probability of the gas flowing out of the lower heat dissipation device into the shell 10 of the upper heat dissipation device, and will not affect the refrigerant entering the first flow guide pipe 20, the refrigerant entering the second flow guide pipe 30 and the rising of the gas in the upper heat dissipation device, thereby improving the heat dissipation condition of the upper heat dissipation device and realizing phase change cooling and heat dissipation of the plurality of semiconductor assemblies 100 arranged at intervals along the height direction of the shell 10, that is, realizing phase change heat dissipation of a multi-layer structure, wherein one semiconductor assembly 100 is one layer.

[0107] As shown in Figure 16 and Figure 17 , the semiconductor device of the embodiment includes a heat generating element 1 and a heat dissipation device, the heat generating element 1 is arranged on the outer surface of the shell 10 of the heat dissipation device, and the heat dissipation device is the heat dissipation device described above. The first inlet 11 of the heat dissipation device described above is arranged at the side of the shell 10, and the first flow guide pipe 20 corresponding to the first inlet 11 is arranged, the second inlet 21 of the first flow guide pipe 20 is arranged upward, the gas flowing out of the lower heat dissipation device can continue to flow upward along the first flow guide pipe 20 and the side wall of the shell 10, thereby reducing the probability of the gas flowing out of the lower heat dissipation device entering the first flow guide pipe 20 through the second inlet 21, and further reducing the influence of the gas flowing out of the lower heat dissipation device on the heat dissipation effect of the refrigerant in the upper shell 10. The semiconductor device with the heat dissipation device described above also has the advantages described above.

[0108] It should be noted that the heat generating element 1 is a power device, and the semiconductor device is a converter.

[0109] The power device can be a full-control power device or a half-control power device, wherein the full-control power device can be a GTO (Gate Turn-Off Thyristor), a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), a GTR (Gate Turn-Off Transistor), an IGCT (Integrated Gate-Commutated Thyristor) and an MCT (MOS Controlled Thyristor), etc., and the half-control power device can be an SCR (Thyristor) and its derivative devices, such as a TRIAC (Triode for Alternating Current), an ASCR (Asymmetric Thyristor), an RCT (Reverse-Conducting Thyristor), etc.

[0110] As shown in Figure 16 and Figure 17As shown, in the embodiment, the semiconductor device comprises a plurality of semiconductor assemblies 100, the plurality of semiconductor assemblies 100 are arranged in the height direction of the shell 10 of the heat dissipation device, each semiconductor assembly 100 comprises a plurality of heat dissipation devices and a plurality of heat generating elements 1, the plurality of heat generating elements 1 in one semiconductor assembly 100 are arranged in the thickness direction of the heat generating element 1, and one heat generating element 1 is arranged between two adjacent heat dissipation devices in one semiconductor assembly 100. Through the above arrangement, the heat dissipation device can more effectively play a heat dissipation role, and the relative position of the heat dissipation device and the heat generating element 1 is more reasonable.

[0111] The thickness direction of the heat generating element 1 is parallel to the width direction of the shell 10.

[0112] The semiconductor device further comprises a plurality of pressing frames, the plurality of pressing frames are arranged one-to-one with the plurality of semiconductor assemblies, that is, the heat generating element 1 is a press-in type power device.

[0113] It should be noted that the first drain pipe 20 of the upper heat dissipation device and the second drain pipe 30 of the lower heat dissipation device are arranged in a staggered manner in the width direction of the shell, so that the probability of the gas flowing out of the lower heat dissipation device contacting the first drain pipe 20 and the second drain pipe 30 of the upper heat dissipation device is reduced, and the probability of the gas entering the shell of the upper heat dissipation device through the first drain pipe 20 and the second drain pipe 30 is further reduced.

[0114] In the description of the present application, it should be understood that "a plurality of" means two or more. The orientation words such as "front, rear, upper, lower, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate and imply that the devices or elements referred to must have a specific orientation or be constructed and operated in a specific orientation, therefore cannot be understood as a limitation on the protection scope of the present application; the orientation words "inner, outer" refer to the inner and outer relative to the contour of each component.

[0115] For purposes of the description hereinafter, the orientations in the various drawings will be described as shown in the drawings. However, it will be understood that the device can assume different orientations, e.g. viewed from the bottom, based on the application. Accordingly, the illustrative terms such as "above", "below", "upper", "lower", and the like are used as a shorthand notations to convey the relative positions of an object or feature as shown in the figures. It will be further appreciated that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if the device described is turned over, then a depiction that was previously described as "above" other parts or steps would then be oriented "below" other parts or steps. Thus, the exemplary term "above" can encompass both an "above" and "below" position depending on the particular orientation being referred to. Similarly, the terms "above" and "below" can include vertical orientations of the device as well as horizontal orientations of the device. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0116] In addition, it should be noted that the use of "first", "second", and the like words of comparison are used herein to describe various elements in the example embodiments. Such words of comparison are not intended to limit the scope of the present application to the specific elements to which they are referring to unless otherwise indicated. Such words of comparison are used to distinguish one element from another element in the example embodiments.

[0117] The preferred embodiments of the present application have been described herein. The skilled person will understand that modifications and variations can be made to the described embodiments without departing from the spirit and scope of the present application. Any modification, equivalent replacement, improvement, and the like made within the spirit and principle of the present application shall be included in the scope of the present application.

Claims

1. A heat dissipating device which is immersed in a coolant, characterized by comprising: The heat dissipation device comprises: a housing (10), a heating element (1) is arranged on the outer surface of the housing (10) to conduct the heat generated by the heating element (1) out, a first inlet (11) is arranged on the side of the housing (10), a first outlet (12) is arranged on the top of the housing (10), and a containing part (13) is arranged in the housing (10) and communicates with the first inlet (11) and the first outlet (12); a first flow guide pipe (20) is arranged on the housing (10), the first end of the first flow guide pipe (20) is a second inlet (21), the second end of the first flow guide pipe (20) is a second outlet, the second outlet is arranged in communication with the first inlet (11) to make the refrigerant flow into the first flow guide pipe (20), and the second inlet (21) is arranged upward; the containing part (13) comprises a first containing space (131) and a second containing space (132) in communication with the first containing space (131), the second containing space (132) is located below the first containing space (131), the first inlet (11) is arranged in communication with the second containing space (132), the cross-sectional area of the second containing space (132) is greater than that of the first containing space (131), and the heating element (1) is arranged at the outer periphery of the first containing space (131); the housing (10) comprises a bottom plate (14), a first side plate (15), a second side plate (16), a third side plate (17) and a fourth side plate (18), the first side plate (15), the second side plate (16), the third side plate (17) and the fourth side plate (18) are sequentially arranged at the outer periphery of the bottom plate (14) and are connected with the bottom plate (14), the top of the first side plate (15), the top of the second side plate (16), the top of the third side plate (17) and the top of the fourth side plate (18) form the first outlet (12), the bottom plate (14), the first side plate (15), the second side plate (16), the third side plate (17) and the fourth side plate (18) form the containing part (13), and the first inlet (11) is arranged on the first side plate (15).

2. The heat dissipating device according to claim 1, wherein The first flow guide pipe (20) has a preset included angle between the axis and the vertical plane, the preset included angle is greater than 90° and less than or equal to 180°.

3. The heat dissipating device according to claim 1 or 2, characterized in that The end face of the first end of the first flow guide pipe (20) is higher than that of the second end of the first flow guide pipe (20).

4. The heat dissipating device according to claim 1 or 2, wherein The first flow guide pipe (20) is further provided with a flow changing hole (22), and the flow changing hole (22) is arranged upward.

5. The heat dissipating device of claim 1, wherein The second side plate (16) comprises a plate body (161) and a protruding portion (162) arranged on the surface of the plate body (161) facing the fourth side plate (18), the protruding portion (162) is arranged in a spaced manner with the bottom plate (14), and the first containing space (131) is formed between the side surface of the protruding portion (162), the first side plate (15), the third side plate (17) and the fourth side plate (18). The second containing space (132) is formed between the bottom plate (14), the bottom surface of the protruding portion (162), the plate body (161), the first side plate (15), the third side plate (17) and the fourth side plate (18).

6. The heat dissipating device according to claim 5, wherein The thickness of the plate body (161) is H1, the thickness of the protruding portion (162) is H2, the sum of the thickness H1 of the plate body (161) and the thickness H2 of the protruding portion (162) is H3, and the H1 and the H3 satisfy: 0.2≤H1 / H3≤0.

5.

7. The heat dissipating device according to claim 1 or 2, wherein The distance L between the first end of the first drainage pipe (20) and the side wall of the shell (10) and the diameter Φ of the heating element (1) satisfy: 0.5≤L / Φ≤1.

5.

8. The heat dissipating device according to claim 1 or 2, wherein The heat dissipation device further comprises a second drainage pipe (30), the first end of the second drainage pipe (30) is a third inlet (31), the third inlet (31) is arranged upward, and the second end of the second drainage pipe (30) is a third outlet, so that the refrigerant flows into the second drainage pipe (30), the side of the shell (10) is provided with a fourth inlet (19) communicating with the containing portion (13), the second end of the second drainage pipe (30) is connected with the shell (10) and is arranged in communication with the fourth inlet (19).

9. The heat dissipating device of claim 8, wherein, In the thickness direction of the shell (10), the axis of the second drainage pipe (30) and the axis of the first drainage pipe (20) have a spacing.

10. The heat dissipating device of claim 1, wherein The shell (10) further comprises a support structure (110), and the support structure (110) comprises a plurality of support columns (1101) arranged in a spaced manner in the first containing space (131).

11. The heat dissipating device of claim 10, wherein, The heat dissipation device further comprises: a driving structure (40) arranged on the shell (10); a pushing structure (50) arranged in the containing portion (13), the driving structure (40) and the pushing structure (50) are drivingly matched, so that the pushing structure (50) can move in the height direction of the shell (10) to push out the refrigerant in the containing portion (13), the pushing structure (50) comprises a plurality of spaced pushing plates (51), a plurality of the support columns (1101) are arranged in M rows and N columns, and a column of the support columns (1101) is arranged between adjacent two pushing plates (51); wherein, M and N are both positive integers greater than or equal to 1, at least one of M and N is greater than 1, each row of the support column (1101) comprises at least one support column (1101), and each column of the support column (1101) comprises at least one support column (1101); The push structure (50) has a pushing state and an avoiding state, when the push structure (50) is in the pushing state, the push structure (50) moves from the bottom of the shell (10) to the top of the shell (10), when the push structure (50) is in the avoiding state, the push structure (50) moves from the top of the shell (10) to the bottom of the shell (10), and at least part of the structure of the push plate (51) and the inner wall of the shell (10) form a flow space.

12. A semiconductor device comprising a heat generating element (1) and a heat dissipating means, characterized in that, The heat generating element (1) is arranged on the outer surface of the shell (10) of the heat dissipation device, and the heat dissipation device is any one of the heat dissipation devices in claims 1-11.

13. The semiconductor device of claim 12, wherein, The semiconductor device comprises a plurality of semiconductor components (100), and the plurality of semiconductor components (100) are arranged at intervals along the height direction of the shell (10) of the heat dissipation device, each semiconductor component (100) comprises a plurality of heat dissipation devices and a plurality of heat generating elements (1), the plurality of heat generating elements (1) in one semiconductor component (100) are arranged at intervals along the thickness direction of the heat generating element (1), and one heat generating element (1) is arranged between two adjacent heat dissipation devices in one semiconductor component (100).

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