Test assembly and test system

Abstract

The invention provides a test assembly. The test assembly comprises a substrate, an interface conversion card, a cable and a light guide column, the interface conversion card is provided with a first end and a second end, and the first end of the interface conversion card is arranged on the substrate. The cable is provided with a first end and a second end, the first end of the cable is electrically connected with the second end of the interface conversion card, and the second end of the cable is arranged on the substrate. The light guide column is arranged on the substrate, and one side of the light guide column is adjacent to the interface conversion card or the cable. Wherein the substrate is provided with a first surface, the interface conversion card is provided with a second surface, and the second surface is actually perpendicular to the first surface.

Description

Technical Field

[0001] This invention relates to a test component and a test system, and more particularly to a test component and test system that can be used for image testing. Background Technology

[0002] Image extraction cards used in semiconductor component testing systems pre-decode image signals acquired by imaging components (such as cameras) before transmitting them to back-end image processing devices for processing. Therefore, image testing is a crucial part of current semiconductor component testing projects. To meet the demands of ultra-high image quality, the signal transmission bandwidth of semiconductor component testing systems must also be increased. Since cables have low or no light leakage characteristics, signal transmission loss is reduced; therefore, using cables as the signal transmission medium can increase transmission bandwidth. Furthermore, the use of cables can shorten the signal transmission distance on the physical printed circuit board (PCB) of the testing system, thus reducing signal loss during PCB transmission. Considering these advantages, current semiconductor component testing systems frequently use cables to transmit signals.

[0003] In existing test system architectures, multiple cables are detachably mounted on the test components, allowing test signals acquired by the components to be transmitted to the backend for processing. However, the cables occupy considerable space on the test components, reducing the number of test positions that can be tested simultaneously and thus decreasing test efficiency. Furthermore, the cable setup presents installation inconveniences; for example, when different objects have electrical test points at different locations, the cables must be disassembled and reinstalled to the corresponding new test points, often causing inconvenience in use.

[0004] In view of this, the present invention provides an improved test component or test system to solve the above-mentioned problems. Summary of the Invention

[0005] One object of the present invention is to provide a test component comprising: a substrate, at least one interface conversion card, at least one cable, and at least one light guide post. The at least one interface conversion card has a first end and a second end, the first end of which is disposed on the substrate. The at least one cable has a first end and a second end, the first end of which is electrically connected to the second end of the at least one interface conversion card, and the second end of which is disposed on the substrate. The at least one light guide post is disposed on the substrate, and at least one side of the at least one light guide post is adjacent to either the at least one interface conversion card or the at least one cable. The substrate has a first surface, and the at least one interface conversion card has a second surface, which is substantially perpendicular to the first surface.

[0006] Another object of the present invention is to provide a testing system comprising: a testing component, at least one interface conversion card, at least one cable, and at least one light guide post. The testing component has a substrate. The at least one interface conversion card has a first end and a second end, the first end of the at least one interface conversion card being disposed on the substrate of the testing component. The at least one cable is electrically connected to the second end of the at least one interface conversion card. The at least one light guide post is disposed on the substrate of the testing component, and at least one side of the at least one light guide post is adjacent to the at least one interface conversion card. The substrate has a first surface, and the at least one interface conversion card has a second surface, the second surface being substantially perpendicular to the first surface. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of the basic architecture of a test system according to an embodiment of the present invention.

[0008] Figure 2 This is a schematic diagram of the test component of the first architecture of the present invention.

[0009] Figure 3 This is a schematic diagram of the test component of the second architecture of the present invention.

[0010] Figure 4 This is a schematic diagram of a test system according to another embodiment of the present invention.

[0011] Figure 5 This is a schematic diagram of the test component of the third architecture of the present invention.

[0012] Figure 6 This is a schematic diagram of a test system according to another embodiment of the present invention.

[0013] Figure 7 This is a schematic diagram of a test system according to another embodiment of the present invention.

[0014] Figure 8 This is a schematic diagram of a test system according to another embodiment of the present invention.

[0015] The meanings of the reference numerals in the above figures are as follows:

[0016] Test System 100

[0017] Test Component 1

[0018] Test head 2

[0019] Light source 3

[0020] Platform 4

[0021] Bridge plate 5

[0022] Data Extraction Card 6

[0023] Test Item 7

[0024] Support component 9

[0025] Substrate 10

[0026] Probe 11

[0027] Interface conversion card 20

[0028] Cable 30

[0029] Light guide column 40

[0030] First end 20a, 30a, 40a

[0031] Second end 20b, 20b, 40b

[0032] Side 40s

[0033] Interface 25, 35

[0034] First surface F1

[0035] Second surface F2

[0036] Height h1

[0037] Active Region A

[0038] Surrounding Area B Detailed Implementation

[0039] The following will illustrate the implementation and operating principle of the image testing system and image extraction card of the present invention through several embodiments. Those skilled in the art will understand the features and effects of the present invention through the above embodiments, and therefore can combine, modify, substitute, or repurpose them based on the spirit of the present invention.

[0040] The terms "connection," "coupling," or "electrical connection" used in this article include both direct and indirect connections, and are not limiting. The terms "when..." or "...time" in this article mean "at the moment, before, or after," and are not limiting.

[0041] The ordinal numbers used in this article, such as "first" and "second", are used to modify request components. They do not imply or represent any previous ordinal number of the request component, nor do they represent the order of one request component with another request component, or the order of manufacturing methods. The use of these ordinal numbers is only to make it clear that one request component with a certain name can be distinguished from another request component with the same name.

[0042] Figure 1 This is a schematic diagram of the basic architecture of a test system 100 according to an embodiment of the present invention. Figure 1 As shown, the test system 100 may include a test component 1. Furthermore, the test system 100 also includes a test head 2, a light source 3, a stage 4, at least one bridge board 5, and at least one data extraction card 6, and is not limited thereto. The light source 3 may be disposed on or integrated into the test head 2, and is used to provide the light required for testing. The test component 1 can be used to contact a device under test (DUT) 7, wherein the DUT 7 may be a wafer or other semiconductor component requiring electrical testing. The DUT 7 may be placed on the stage 4. The test head 2 can provide an electrical testing program to the test component 1. The test component 1 can acquire a test signal from the DUT 7. The bridge board 5 may be electrically connected to the test component 1. Data extraction card 6 can be electrically connected to test component 1 via bridge board 5 to obtain test signals and extract the required data, such as image data, from the test signal. For example, if the test object 7 is an image sensor, data extraction card 6 can extract the image data captured by the test object 7 from the test signal and convert the image data into a data format applicable to a back-end image processing component (e.g., an external computer or processor). If the test object 7 is a display processing chip, data extraction card 6 can also extract the image data being played on the display from the test signal and convert the image data into a data format applicable to the back-end image processing component. The above examples are merely illustrative and not limiting.

[0043] The test head 2 can be equipped with various adapter cards that provide the required test programs, such as electronic integration cards (PE cards), device power supply cards (DPS cards), sequence test cards (SEQ cards), etc., and is not limited to these.

[0044] Test component 1 may be a single-pin tester and include a probe card, or test component 1 itself may be a probe card, and is not limited thereto. Test component 1 may be provided with multiple probes 11, which can contact the pins of the device under test (DUT) 7, thereby allowing test head 2 to perform electrical tests on DUT 7. Furthermore, test component 1 can also be used to convert the signal transmission format of test signals. Light source 3 may be a tube-type light source supply device, and is not limited thereto. In one embodiment, light source 3 can provide light to illuminate DUT 7 (e.g., an integrated circuit with multiple image sensors in a wafer) to test the actual receiving range of the image sensors of DUT 7 for comprehensive image detection, and test component 1 can acquire test signals from the image sensors of DUT, wherein the test signals are, for example, port physical layer (PHY) signals, but are not limited thereto. Furthermore, in one embodiment, data extraction card 6 may be an image extraction card for Mobile Industry Processor Interface (MIPI), but is not limited thereto.

[0045] One of the features of this invention is the improvement of the test component 1. In this embodiment, the test component 1 may further include a substrate 10, at least one interface conversion card 20, at least one cable 30, and at least one light guide post 40. The details of the test component 1 will be described in more detail below.

[0046] Figure 2 This is a schematic diagram of the test component 1 of the first architecture of the present invention, and please also refer to... Figure 1 .like Figure 2 As shown, the test component 1 may include a substrate 10, multiple interface conversion cards 20, multiple cables 30, and multiple light guide pillars 40.

[0047] The interface conversion card 20 may have a first end 20a and a second end 20b, with the second end 20b opposite to the first end 20a. The first end 20a of the interface conversion card 20 may be disposed on the substrate 10. In one embodiment, the substrate 10 may have a plurality of interfaces 25 corresponding to the first end 20a of the interface conversion card 20, and the first end 20a of the interface conversion card 20 may be connected to the interfaces 25, for example, by snap-fit ​​or insertion, and is not limited thereto. In another embodiment, the first end 20a of the interface conversion card 20 may be fixed to the interfaces 25, for example, by soldering, locking, etc., and is not limited thereto. In one embodiment, the interface 25 may be a slot, port, bus, snap-fit, locking point, or solder joint.

[0048] The cable 30 may have a first end 30a and a second end 30b, with the second end 30b opposite to the first end 30a. The second end 30b of the cable 30 may be electrically connected to the second end 20b of the interface conversion card 20. The first end 30a of the cable 30 may be disposed on the substrate 10. In one embodiment, the substrate 10 may have a plurality of interfaces 35 corresponding to the first ends 30a of the cable 30. The first end 30a of the cable 30 may be detachably connected to the interfaces 35, for example, by snap-fit ​​or insertion, and is not limited thereto. In another embodiment, the first end 30a of the cable 30 may also be fixed to the interfaces 35, for example, by locking or soldering, and is not limited thereto. In one embodiment, the interface 35 may be a slot, port, bus, snap-fit, locking, or solder joint.

[0049] The light guide post 40 may have a first end 40a and a second end 40b, with the second end 40b facing the first end 40a. The second end 40b of the light guide post 40 may be closer to the light source 3 than the first end 40a, and a support member 9 may be provided between the light source 3 and the light guide post 40. The first end 40a of the light guide post 40 may be disposed on the substrate 10, for example, detachably disposed or fixedly disposed, and is not limited thereto. In addition, at least one side 40s of the light guide post 40 may be disposed adjacent to at least one interface conversion card 20. Here, "adjacent" means, for example, that the distance between the at least one side 40s of the light guide post 40 and the at least one interface conversion card 20 is less than the distance between the at least one side 40s of the light guide post 40 and another light guide post 40, and the at least one side 40s of the light guide post 40 and the at least one interface conversion card 20 do not necessarily have to be in contact with each other, and is not limited thereto.

[0050] Additionally, the substrate 10 may have a first surface F1, and the interface conversion card 20 may have a second surface F2. The first surface F1 and the second surface F2 may be substantially perpendicular. Here, "substantially perpendicular" means that there may be an angle between the extension line of the projection of the first surface F1 onto a plane (e.g., the XZ plane) and the extension line of the projection of the second surface F2 onto the same plane (e.g., the XZ plane). This angle may be equal to 90 degrees, but an offset angle less than or equal to 30 degrees is permissible, and the invention is not limited thereto. In one embodiment, the first surface F1 may be parallel to the plane formed by the first direction X and the second direction Y (XY plane), and the second surface F2 may be parallel to the plane formed by the second direction Y and the third direction Z (YZ plane), and the invention is not limited thereto. Therefore, the interface conversion card 20 of the present invention is, for example, vertically mounted on the substrate 10. Thus, compared to the common practice in the prior art of horizontally mounting the interface conversion card 20 on the substrate 10, the substrate 10 of the present invention can have more free space. Because the substrate 10 has more space, it can have more test positions, thereby improving the test efficiency of the test system 100.

[0051] Furthermore, in this invention, the second end 30b of the cable 30 is disposed on the second end 20b of the interface conversion card 20 and does not need to be disposed on the substrate 10. Therefore, compared with the prior art, the substrate 10 of this invention can have more free space. Thus, the test component 1 of this invention not only has the effect of reducing loss and increasing transmission bandwidth by transmitting signals through the cable 30, but the arrangement of the cable 30 also does not occupy too much space on the substrate 10, thereby solving the problems of the prior art.

[0052] Next, we will explain the details of the components in test component 1.

[0053] Regarding substrate 10. In one embodiment, substrate 10 may be a printed circuit board, but is not limited thereto.

[0054] Regarding the interface conversion card 20: In one embodiment, the interface conversion card 20 may be provided with a first transmission interface (not shown), an interface conversion circuit (not shown), and a second transmission interface (not shown). The interface conversion card 20 can be used to convert the transmission interface of a signal. For example, the test signal obtained by the probe 11 is transmitted in a first signal transmission form. The first transmission interface can be used to transmit the test signal in the first signal transmission form. The interface conversion circuit can be used to convert the transmission interface of the test signal from the first signal transmission form to a second signal transmission form. The second transmission interface can be used to transmit the test signal in the second signal transmission form, and this is not limited to this. In one embodiment, the first transmission interface may be a physical layer interface (MIPI PHY interface) of an industrial processor interface, and this is not limited to this. In one embodiment, the first transmission interface may be various types of PHY interfaces, and this is not limited to this. In one embodiment, the second transmission interface may be a high-speed logic interface and include multiple pairs of high-speed logic signal channels, wherein each pair of high-speed logic signal channels may be differential logic signal channels, and this is not limited to this.

[0055] Regarding cable 30, in one embodiment, cable 30 may have the characteristics of no light leakage or low light leakage.

[0056] Regarding the light guide post 40: In one embodiment, the light guide post 40 can be fixed by the support member 9, and the light source 3 can rest on the support member 9, thus the light source 3 can be positioned above the light guide post 40 through the support member 9. In one embodiment, the support member 9 may include a light-transmitting material or a light-guiding structure, allowing the light source 3 to be evenly distributed on the support member 9 at positions corresponding to the light guide post 40. Therefore, the light provided by the light source 3 can penetrate the support member 9 and enter the light guide post 40. However, in another embodiment, the material of the support member 9 may also include an opaque material, but the support member 9 is provided with a channel for light to pass through or a channel for fixing the light guide post 40. Therefore, the light provided by the light source 3 can enter the light guide post 40 through the channel or the light guide post 40 can directly receive the light from the light source 3, and is not limited to this. In one embodiment, the material of the light guide post 40 may include glass or plastic, and is not limited to this. In one embodiment, the light guide post 40 may have total internal reflection characteristics. For example, when the light provided by the light source 3 enters from the second end 40b of the light guide post 40 and exits from the first end 40a of the light guide post 40, the intensity of the light entering the light guide post 40 may be substantially equal to the intensity of the light leaving the light guide post 40. Here, "substantially equal to" means that the difference between the two is less than or equal to 10%, but is not limited thereto. In one embodiment, the light guide post 40 may be erected on the substrate 10, and the light guide post 40 may extend a height h1 in the normal direction (Z direction) of the first surface F1. In one embodiment, the height h1 may be between 6 and 15 cm (6 cm ≤ h1 ≤ 15 cm), but is not limited thereto. In one embodiment, the height h1 may be between 8 and 10 cm (8 cm ≤ h1 ≤ 10 cm), but is not limited thereto.

[0057] To increase the effective use of space, light guide pillars 40 can be arranged adjacently between the light source 3 and the substrate 10, so there is at least a height h1 between the light source 3 and the substrate 10, and there is a certain distance between each light guide pillar 40. Therefore, there is still a certain space in the gaps between the light guide pillars 40 between the light source 3 and the substrate 10, where an interface conversion card 20 or a cable 30 can be installed to effectively utilize the space between the light source 3 and the substrate 10. The light source 3 can receive light from the light source through each light guide pillar 40 and synchronously transmit light to the object under test, overcoming the problem of light intensity attenuation caused by the increase in distance. The method of receiving light from the light source 3 using light guide pillars 40 is roughly the same as the effect of the object under test 7 directly receiving light from the light source 3 at a shorter distance. In addition, each light guide pillar 40 can be designed in a modular way, so that each light guide pillar 40 can be moved simultaneously or disassembled on the substrate 10. For example, each The light guide pillars 40 can be interconnected by fasteners, and can be synchronously fixed to or removed from the substrate 10. In conjunction with various interfaces (25 or 35) provided on the substrate 10, the interface conversion card 20 or cable 30 can be installed or removed with the corresponding interface (25 or 35) before or after the light guide pillars 40 are installed on the substrate, which greatly shortens the installation time of the test system 100. In addition to maintaining sufficient light energy for testing the test object 7, the cooperation between the light guide pillars 40 and the light source 3 can also increase the space utilization between the light source 3 and the substrate 10. With the modular design of the light guide pillars 40, the interface conversion card 20 or cable 30 can be connected to the substrate 10, so that the interface conversion card 20 or cable 30 can be placed between the light source 3 and the substrate 10 and between each light guide pillar 40, so as to achieve better space utilization of the test system 100 and shorten the installation time of each component, thereby improving the overall test efficiency.

[0058] In one embodiment, the light guide post 40 and the interface conversion card 20 can be arranged in an array on the first surface F1 of the substrate 10. In one embodiment, the light guide post 40 and the interface conversion card 20 can be staggered, but are not limited thereto. In one embodiment, the substrate 10 may have a main region A and a peripheral region B, with the peripheral region B surrounding the main region A. The light guide post 40 and the interface conversion card 20 can be disposed in the main region A, while the second end 30b of the cable 30 and the bridging plate 5 can be disposed adjacent to each other in the peripheral region B. The probe 11 can be disposed corresponding to the main region A, thereby shortening the signal transmission path between the probe 11, the substrate 10, and the interface conversion card 20 (e.g., the transmission path of the test signal from the probe 11 to the interface conversion card 20 via the substrate 10), thus reducing signal loss. In the peripheral region B, the interface 35 corresponding to the cable 30 and the bridging plate 5 are also disposed adjacent to each other, shortening the transmission path from the interface 35 to the bridging plate 5 in the substrate 10, which also similarly reduces signal loss.

[0059] In one embodiment, the signal transmission path between probe 11 and interface conversion card 20 can be between 2 and 5 cm (2 cm ≤ the signal transmission path ≤ 5 cm), and is not limited thereto. This design significantly shortens the signal transmission path on substrate 10, reducing high-frequency signal reflection and interference, thus minimizing signal loss along the transmission path. Furthermore, after conversion by interface conversion card 20, the test signal can be transmitted externally via low-loss cable 30. Therefore, the entire test assembly 1 can maintain low-loss signal transmission. Furthermore, cable 30 has good anti-interference performance and can be used to transmit higher frequency signals. Combined with shortening the signal transmission path on substrate 10, this increases the overall bandwidth of the signal transmission path from probe 11, substrate 10, interface conversion card 20 to cable 30, making it suitable for high-frequency signal transmission. The high-frequency signal can be a differential signal, and the overall bandwidth of the signal transmission path can reach 3.5 GHz or a frequency range exceeding 3.5 GHz. When the test system 100 increases the bandwidth of the signal transmission path, it can transmit test signals using high-frequency signals, thereby increasing transmission speed, reducing signal transmission time, and reducing interference during signal transmission. In one embodiment, the length of the signal transmission path on substrate 10 is shorter than the signal transmission path of cable 30, enabling the transmission of high-frequency signals in test component 1.

[0060] In the test component 1 of the first architecture, the interface conversion card 20, cable 30, and light guide post 40 are all disposed on the substrate 10. Therefore, when the test system 100 replaces the substrate 10, the interface conversion card 20, cable 30, and light guide post 40 can be replaced simultaneously without adjusting their configuration, thus simplifying installation. Furthermore, the substrate 10 of the first architecture has ample space, allowing the test component 1 to provide a wider range of test positions. Therefore, the test component 1 can simultaneously support the test positions required by various different test objects 7 without frequently adjusting the configuration of the interface conversion card 20, cable 30, and light guide post 40 according to the location of the electrical test points of different test objects 7.

[0061] Therefore, the present invention can solve a number of problems in the prior art.

[0062] Figure 3 This is a schematic diagram of test component 1 of the second architecture of the present invention, and please also refer to... Figure 1 and Figure 2 Second architecture ( Figure 3 Most features of test component 1 are applicable to the first architecture ( Figure 2 Therefore, the following text will mainly focus on the differences.

[0063] like Figure 3As shown, at least one side 40s of the light guide post 40 can be disposed adjacent to at least one cable 30. For example, at least one interface 35 corresponding to the cable 30 can be disposed adjacent to at least one side 40 of the light guide post 40, but this is not limited to this. In addition, the light guide post 40, the interface 35 corresponding to the cable 30, and the first end 30a of the cable 30 can be disposed in the main region A of the substrate 10, while the interface conversion card 20 and the second end 30b of the cable 30 can be disposed in the peripheral region B of the substrate 10. In one embodiment, the light guide posts 40 can be arranged in an array on the first surface F1 of the substrate 10, but this is not limited to this.

[0064] exist Figure 3 In this embodiment, the signal transmission path between probe 11, substrate 10, and cable 30 can be shortened (e.g., the transmission path of the test signal from probe 11 through substrate 10 to cable 30). Furthermore, since interface conversion card 20 and bridge board 5 are both located in peripheral area B, the signal transmission path between interface conversion card 20, substrate 10, and bridge board 5 can also be shortened. In one embodiment, the length of the signal transmission path on substrate 10 is shorter than the signal transmission path on cable 30, which can significantly reduce various interferences and energy attenuation during signal transmission on substrate 10. Therefore, Figure 3 The embodiment has the effect of reducing signal transmission loss.

[0065] Furthermore, in the second architecture, the interface conversion card 20, cable 30, and light guide post 40 are all disposed on the substrate 10. Therefore, when the test device 100 replaces the substrate 10, the interface conversion card 20, cable 30, and light guide post 40 can be replaced at the same time without adjusting the configuration of the interface conversion card 20, cable 30, and light guide post 40. Thus, the test component 1 of the second architecture also has the effect of easy installation.

[0066] The testing system 100 of the present invention may also have different implementation forms. Figure 4 This is a schematic diagram of a test system 100 according to another embodiment of the present invention, and please also refer to... Figures 1 to 3 . Figure 4 Most of the features of the embodiments are applicable Figure 1 The following description focuses on the differences in the embodiments.

[0067] like Figure 4 As shown, the test system 100 may include a test component 1, a test head 2, a light source 3, a stage 4, at least one bridge board 5, at least one data extraction card 6, at least one interface conversion card 20, at least one cable 30, and at least one light guide post 40. The test component 1 may include a substrate 10 and a probe 11.

[0068] Unlike Figure 1In this embodiment, the interface conversion card 20, cable 30 and light guide post 40 are disposed outside the test component 1. For example, the interface conversion card 20 and cable 30 can be disposed on the bridge board 5 or the data extraction card 6, and are not limited thereto.

[0069] Figure 5 This is a schematic diagram of the test component 1 of the third architecture of the present invention, used for illustration. Figure 4 The test system 100 may include the implementation forms of test component 1 and other components, and please also refer to... Figures 1 to 4 The third architecture ( Figure 5 Most of the features of ) can be applied to the first architecture ( Figure 2 Therefore, the following text will mainly focus on the differences.

[0070] like Figure 5 As shown, the interface conversion card 20 has a first end 20a and a second end 20b, and the first end 20a of the interface conversion card 20 can be disposed on the substrate 10. The cable 30 has a first end 30a and a second end 30b, and the second end 30b of the cable 30 is electrically connected to the second end 20b of the interface conversion card 20. The first end 30a of the cable 30 can be disposed on the bridge board 5. In one embodiment, the interface 35 corresponding to the first end 30a of the cable 30 can be disposed on the bridge board 5, the data extraction card 6, or an external component. The light guide post 40 may have a first end 40a and a second end 40b, and the first end 40a of the light guide post 40 is used to be disposed on the substrate 10.

[0071] The configuration method of the interface conversion card 20 in this embodiment is the same as that of the interface conversion card 20 in this embodiment. Figure 2 The embodiments are similar, but the second end 30b of the cable 30 is adjusted to be directly mounted on the bridge board 5, data extraction card 6 or external component outside the test component 1.

[0072] In one embodiment, the light guide post 40 and the interface conversion card 20 can be disposed in the main area A, while the second end 30b of the cable 30 and the bridging plate 5 can be disposed in the peripheral area B. The probe 11 can be disposed corresponding to the main area A, thereby shortening the signal transmission path between the probe 11, the substrate 10, and the interface conversion card 20 (e.g., the path from the test signal obtained by the probe 11 and transmitted to the interface conversion card 20 via the substrate 10), and the test signal can then be directly transmitted to the bridging plate 5 and / or the data extraction card 6 via the cable 30, thus reducing signal loss. In one embodiment, the signal transmission path between the probe 11, the substrate 10, and the interface conversion card 20 can be between 2 and 5 cm (2 cm ≤ the signal transmission path ≤ 5 cm), and is not limited thereto.

[0073] Furthermore, in the test component 1 of the third architecture, the first end 30a of the cable 30 is set on the interface conversion card 20 instead of the substrate 10, while the second end 30b of the cable 30 is directly set on the bridge board 5. Therefore, the available space on the substrate 10 can be increased, and the test component 1 can provide more test positions. The cable 30 replaces the original function of the substrate 10 in providing signals to the bridge board 5. The length of the signal transmission path on the substrate 10 can be shortened, making the length of the signal transmission path on the substrate 10 less than the signal transmission path of the cable 30. This can significantly reduce various interferences and energy attenuation of the signal transmission on the substrate 10, and enable the signal to be transmitted in a high-frequency manner.

[0074] Therefore, test component 1 of the third architecture can be understood.

[0075] The testing system 100 of the present invention may also have different implementation forms. Figure 6 This is a schematic diagram of a test system 100 according to another embodiment of the present invention, and please also refer to... Figures 1 to 5 . Figure 6 Most of the features of the embodiments are applicable Figure 4 The following description focuses on the differences in the embodiments.

[0076] like Figure 6 As shown, the data extraction card 6 in this embodiment can be integrated into the interface conversion card 20, thus enabling centralized data processing. For example, after the interface conversion card 20 converts the signal transmission interface, the data extraction card 6 integrated into the interface extraction card 20 can then process the converted signal, thereby shortening the total data processing time. Furthermore, since the data extraction card 6 can be integrated into the interface conversion card 20, this design also reduces the assembly procedures for each component in the test system 100, thereby improving test efficiency.

[0077] Furthermore, in one embodiment, in the Z direction, the probe 11 and the interface conversion card 20 are respectively disposed on opposite sides of the substrate 10, and the positions of at least one probe 11 and at least one interface conversion card 20 can correspond to each other, for example, their positions in the X direction can be practically the same or close. Therefore, the probe 11 and the interface conversion card 20 can be connected together with a shorter distance (compared to the prior art), thus providing better signal transmission quality and reducing signal distortion, interference, and attenuation caused by excessively long signal transmission paths.

[0078] The testing system 100 of the present invention may also have different implementation forms. Figure 7 This is a schematic diagram of a test system 100 according to another embodiment of the present invention, and please also refer to... Figures 1 to 6 . Figure 7 Most of the features of the embodiments are applicable Figure 4The following description focuses on the differences in the embodiments.

[0079] like Figure 7 As shown, the data extraction card 6 in this embodiment can be disposed between at least two light guide pillars 40 or on one side of at least one light guide pillar 40, and is adjacent to the interface conversion card 20. With this design, the data extraction card 6 can effectively utilize the space between the light guide pillars 40, thereby improving space utilization. Furthermore, the data extraction card 6 can be electrically connected to the interface conversion card 20 via a cable or wiring on the substrate 10. Since the data extraction card 6 and the interface conversion card 20 are disposed adjacent to each other, the signal transmission path between them is shorter (compared to the prior art), thus maintaining better signal transmission quality and reducing signal distortion, interference, and attenuation caused by excessively long signal transmission paths.

[0080] The testing system 100 of the present invention may also have different implementation forms. Figure 8 This is a schematic diagram of a test system 100 according to another embodiment of the present invention, and please also refer to... Figures 1 to 7 . Figure 8 Most of the features of the embodiments are applicable Figure 6 The following description focuses on the differences in the embodiments.

[0081] like Figure 8 As shown, the data extraction card 6 in this embodiment can be integrated into the interface conversion card 20, and the interface conversion card 20 can be electrically connected to the test head 2 via the cable 30. In this design, after processing the signal extracted by the probe, the data extraction card 6 and the interface conversion card 20 can directly transmit the acquired data to the test head 2 via the cable 30. Since the cable 30 replaces the function of the original bridge board 5, the bridge board 5 in the aforementioned embodiment is reduced, ensuring that the transmitted data does not pass through multiple components, shortening the transmission distance and reducing the transmission time, thereby maintaining signal quality and reducing the equipment's construction cost. The length of the signal transmission path on the substrate 10 is shorter than the signal transmission path of the cable 30, which can significantly reduce various interferences and energy attenuation during signal transmission on the substrate 10, and enable high-frequency signal transmission.

[0082] This invention can at least use the presence or absence of components or the connection relationship between components as the basis for determining whether a product falls within the protection scope of this invention, but is not limited thereto.

[0083] The above configuration methods are merely examples, and the test system 100 or test component 1 of the present invention may have more configuration methods. Furthermore, the various embodiments can be combined and matched with each other, as long as it is feasible.

[0084] Therefore, the present invention provides an improved testing system and testing components that can reduce signal loss during test transmission. Alternatively, the testing components of the present invention can provide more test positions than existing technologies even when using cables, thereby improving testing efficiency. Alternatively, the testing components of the present invention offer the advantage of simple installation.

[0085] The above embodiments are merely illustrative examples for ease of explanation. The scope of the claims made in this invention should be determined by the claims themselves, and not limited to the above embodiments.

Claims

1. A test component, comprising: A substrate (10); At least one interface conversion card (20) has a first end (20a) and a second end (20b), the first end (20a) of the at least one interface conversion card (20) being disposed on the substrate (10). At least one cable (30) has a first end (30a) and a second end (30b), the second end (30b) of the at least one cable (30) being electrically connected to the second end (20b) of the at least one interface adapter card (20), and the first end (30a) of the at least one cable (30) being disposed on the substrate (10); and At least one light guide post (40) is disposed on the substrate (10), and at least one side (40s) of the at least one light guide post (40) is disposed adjacent to the at least one interface conversion card (20) or the at least one cable (30); Its features are, The substrate (10) has a first surface (F1), and the at least one interface conversion card (20) has a second surface (F2), and the second surface (F2) is actually perpendicular to the first surface (F1).

2. The test component according to claim 1, characterized in that, The at least one interface conversion card (20) is a plurality of interface conversion cards (20), the at least one cable (30) is a plurality of cables (30), the at least one light guide post (40) is a plurality of light guide posts (40), and the plurality of light guide posts (40) are arranged in an array, and at least one side (40s) of each light guide post (40) is adjacent to one of the plurality of interface conversion cards (20) or one of the plurality of cables (30).

3. The test component according to claim 2, characterized in that, At least one side (40s) of each light guide post (40) is disposed adjacent to one of the plurality of interface conversion cards (20), and the plurality of interface conversion cards (20) are arranged in an array.

4. The test component according to claim 2, characterized in that, The substrate (10) has a main region (A) and a peripheral region (B) surrounding the main region (A), wherein the plurality of light guide pillars (40) are disposed in the main region (A), and the plurality of interface conversion cards (20) or the plurality of cables (30) are disposed in the main region (A).

5. The test component according to claim 4, characterized in that, The surrounding area (B) is provided with at least one bridging plate (5) for electrical connection to at least one of the plurality of cables (30) and at least one data retrieval card (6).

6. A testing system, comprising: A test component (1) having a substrate (10); At least one interface conversion card (20) has a first end (20a) and a second end (20b), the first end (20a) of the at least one interface conversion card (20) being disposed on the substrate (10) of the test assembly (1); At least one cable (30) is electrically connected to the second end (20b) of the at least one interface adapter card (20); and At least one light guide post (40) is disposed on the substrate (10) of the test component (1), and at least one side (40s) of the at least one light guide post (40) is disposed adjacent to the at least one interface conversion card (20); Its features are, The substrate (10) has a first surface (F1), and the at least one interface conversion card (20) has a second surface (F2), and the second surface (F2) is actually perpendicular to the first surface (F1).

7. The testing system according to claim 6, characterized in that, The at least one interface conversion card (20) is a plurality of interface conversion cards (20), the at least one cable (30) is a plurality of cables (30), the at least one light guide (40) is a plurality of light guides (40), and the plurality of light guides (40) are arranged in an array, and at least one side (40s) of each light guide (40) is adjacent to one of the plurality of interface conversion cards (20).

8. The testing system according to claim 7, characterized in that, The multiple interface conversion cards (20) are arranged in an array.

9. The testing system according to claim 7, characterized in that, The substrate (10) has a main region (A) and a peripheral region (B) surrounding the main region (A), wherein the plurality of light guide pillars (40) and the plurality of interface conversion cards (20) are disposed in the main region (A).

10. The testing system according to claim 9, characterized in that, It also includes at least one bridging board (5) and at least one data extraction card (6) disposed in the surrounding area (B), the at least one bridging board (5) being used for electrical connection with at least one of the plurality of cables (30) and the at least one data extraction card (6).

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