An automatic industrial control system for copper-embedding process of printed circuit board

Abstract

This invention discloses an automated industrial control system for the copper embedding process of printed circuit boards (PCBs), relating to the field of PCB manufacturing technology. Based on PCB design files, the system divides the layout into multiple functional areas and constructs a set of board-level physical characteristic parameters, including wiring density, to generate an initial target current density distribution map. The system monitors the total current of each board and the copper ion concentration in the electroplating solution in real time. Combining physical characteristics, it dynamically predicts the current density deviation risk of each functional area. When the risk exceeds a preset threshold, a closed-loop correction control unit generates a current correction factor and allocates it to the corresponding anode area to correct the output current, thereby achieving dynamic and precise control of the current density of each functional area. This invention, through a combination of forward-looking risk prediction and closed-loop correction, significantly improves plating uniformity, product consistency, and yield, achieving full-process automation and improving production efficiency and stability.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, and in particular to an automated industrial control system for the copper embedding process of printed circuit boards. Background Technology

[0002] Printed circuit boards (PCBs), serving as the carriers of electronic components and the hubs of circuit connections, are indispensable basic components in the modern electronics industry. The quality of their manufacturing process directly determines the performance, reliability, and lifespan of the final electronic products. Among the many manufacturing stages of PCBs, electroplating (or copper plating) is a key step in forming conductive patterns and achieving electrical interconnections. Its core objective is to form a copper metal layer with uniform thickness and stable performance on the substrate.

[0003] In traditional PCB electroplating processes, the core parameter for controlling electroplating quality is current density, as it directly determines the deposition rate of copper ions, thus affecting the thickness and microstructure of the plating layer. However, existing electroplating process control technologies generally suffer from the following technical shortcomings:

[0004] Low control precision and poor uniformity: Traditional control methods typically employ a "holistic" or "uniform" control approach. Operators set the total current of the plating tank based on the total area of ​​the PCB to be processed and empirical values. However, on a complex PCB, the circuit pattern (wiring) density varies greatly in different areas. For example, power and ground network areas have dense wiring, while high-frequency signal areas may be relatively sparse. Using a single total current for control cannot provide differentiated local currents for different areas, resulting in a significant deviation between the actual current density and the ideal value in each area. This leads to thinner plating in densely wired areas and thicker plating in sparsely wired areas, severely affecting the uniformity of the overall plating thickness and consequently impacting the PCB's impedance control and electrical performance.

[0005] Heavy reliance on human experience and insufficient stability: The setting of the current depends to a large extent on the personal experience and estimation of senior operators, lacking scientific quantitative basis, resulting in poor repeatability of the production process.

[0006] Lack of dynamic real-time response and lagging control logic: Electroplating is a dynamic electrochemical process. During electroplating, copper ions in the plating solution near the PCB surface are continuously consumed, causing changes in local ion concentration, which in turn affects local conductivity and the actual current distribution. Traditional control methods are "open-loop" controls, meaning that once a current value is set, it remains constant throughout the entire electroplating cycle, failing to monitor and respond to dynamic changes in the chemical environment within the plating tank in real time.

[0007] The monitoring methods are limited and cannot obtain key process data: Existing monitoring methods are usually limited to monitoring the total output current and voltage of the electroplating power supply, and periodically sampling and testing the electroplating solution. These methods cannot provide real-time current distribution information at different locations on a single PCB board, nor can they capture instantaneous changes in local ion concentrations in the electroplating solution. The lack of data makes a deep understanding and precise control of the electroplating process impossible.

[0008] In summary, as electronic products develop towards higher density, higher integration, and higher reliability, the requirements for PCB manufacturing precision are becoming increasingly stringent. The existing PCB copper embedding process suffers from low control precision, poor uniformity, reliance on manual experience, and inability to dynamically respond to process changes, which have become major technical bottlenecks restricting PCB product yield and production stability. Therefore, there is an urgent need for a PCB copper embedding process system capable of automated, precise, dynamic, and predictive control to solve these technical challenges. Summary of the Invention

[0009] The purpose of this invention is to provide an automated industrial control system for the copper embedding process of printed circuit boards, thereby solving the above-mentioned technical problems.

[0010] The objective of this invention can be achieved through the following technical solutions:

[0011] An automated industrial control system for the copper embedding process of printed circuit boards includes:

[0012] The feature modeling and target setting unit is used to divide the layout of each printed circuit board into multiple functional areas based on the design file of the printed circuit board to be processed; based on the division result, it generates a set of board-level physical feature parameters including the wiring density of each functional area and the total electroplating area of ​​each board; based on the set of board-level physical feature parameters, it constructs an initial target current density distribution map for each functional area as a reference setting value for the electroplating process.

[0013] The dynamic status monitoring unit is used to monitor the real-time total current of each printed circuit board on the electroplating rack, as well as the real-time copper ion concentration of the electroplating solution at multiple monitoring points in the electroplating tank, forming a dynamic status parameter set.

[0014] The current density offset risk prediction unit is used to couple the board-level physical characteristic parameter set with the dynamic state parameter set to dynamically predict the predicted current density of each functional area; compare the predicted current density with the initial target current density distribution map, and calculate the current density deviation index characterizing the offset risk.

[0015] A closed-loop correction control unit is used to generate a current correction factor for the corresponding functional area when the current density deviation index exceeds a preset safety threshold; according to the spatial correspondence between the functional area and multiple independently controllable anode areas in the electroplating tank, the current correction factor is allocated to one or more of the anode areas to correct their output current, thereby dynamically maintaining the current density of each functional area within the safety threshold.

[0016] As a further aspect of the present invention, the functional area includes at least one of a power supply area, a high-frequency signal area, and a grounding network area; and the wiring density is obtained by calculating the ratio of the wiring coverage area in each functional area to the total area of ​​the functional area.

[0017] As a further aspect of the present invention, when constructing the initial target current density distribution map, the feature modeling and target setting unit, based on the batch production average target current density set by the process specification, combines the difference between the wiring density of each functional area and the average wiring density of all printed circuit boards on the fixture, and adjusts it through a preset response coefficient to calculate a differentiated target current density for each functional area. The set of these target current densities constitutes the initial target current density distribution map.

[0018] As a further aspect of the present invention, the dynamic state parameter set includes: the average measured current density of the single board, which is calculated by dividing the real-time total current of the single board by the corresponding total electroplating area; and the ion concentration consumption index, which is calculated by comparing the real-time copper ion concentration of the electroplating solution with a preset standard working concentration and a preset minimum threshold concentration; the average measured current density of the single board and the ion concentration consumption index are used together in the current density deviation risk prediction unit.

[0019] As a further aspect of the present invention, when predicting the predicted current density of each functional area, the current density offset risk prediction unit adjusts the current density of each functional area based on the average measured current density of the single board of the printed circuit board in which it is located. The adjustment amount is determined by multiplying the ion concentration consumption index of the monitoring point closest to the functional area by a preset weighting factor, thereby obtaining the predicted current density.

[0020] As a further aspect of the present invention, when calculating the current density deviation index, the current density deviation risk prediction unit compares the predicted current density with the target current density of the corresponding functional area in the initial target current density distribution map, and determines the current density deviation index as the ratio of the difference between the two to the target current density.

[0021] As a further aspect of the present invention, the closed-loop correction control unit uses proportional-integral control logic to generate a current correction factor, wherein the current correction factor consists of two parts: one part is proportional to the current density deviation index at the current moment, and the other part is proportional to the time cumulative value of the current density deviation index.

[0022] As a further aspect of the present invention, when the closed-loop correction control unit corrects the output current of the anode region, it identifies the set of printed circuit board functional areas that mainly affect each anode region; it performs a weighted summation of the current correction factors of each functional area within the set of printed circuit board functional areas and the geometric position correspondence of the anode region; and finally, based on the weighted summation result, it adjusts the current output current of the anode region to generate the corrected output current.

[0023] The beneficial effects of this invention compared to the prior art are as follows:

[0024] 1. Significantly improves plating uniformity and product consistency. This invention achieves differentiated and precise adjustment of current density in each functional area through refined modeling of PCB physical characteristics and real-time monitoring of the electroplating environment, combined with predictive closed-loop control. This overcomes the plating thickness variations caused by uneven current distribution in traditional processes, significantly improving the uniformity of the product plating and batch-to-batch consistency, thereby enhancing product yield and electrical performance.

[0025] 2. Achieve end-to-end automation, improving production efficiency and stability. The system replaces traditional manual experience intervention with data-driven closed-loop control, achieving end-to-end automation from feature analysis and target setting to dynamic control. This not only greatly reduces reliance on operator skills and ensures the standardization and repeatability of the production process, but also reduces human error and significantly improves production efficiency and overall stability.

[0026] 3. Establish proactive risk control to reduce scrap rates. The core risk prediction model of this invention elevates the control logic from traditional "post-event remediation" to "pre-event prediction." The system can predict the risk of current density deviation and make timely corrections before electroplating quality problems actually occur. This ability to intervene in advance reduces the generation of defects at the source and lowers the scrap rate.

[0027] 4. Ensuring the stability and reliability of the control system. This invention employs a classic PI control algorithm and an intelligent correction allocation strategy, ensuring a fast response and smooth operation of the control system, effectively avoiding oscillations and instability during the control process. This technical solution combines advancement and robustness, guaranteeing high reliability and stability in large-scale, continuous production applications. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of a module of an automated industrial control system for the copper embedding process of a printed circuit board according to the present invention. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1

[0031] Please see Figure 1 As shown, this invention is an automated industrial control system for the copper embedding process of printed circuit boards, specifically:

[0032] Feature Modeling and Target Setting Unit. Before production begins, the system acquires the Gerber design file of the PCB to be processed. By parsing this file, the system can automatically identify the PCB layout structure and divide it into multiple key functional areas according to preset rules. Next, the system calculates the wiring density (i.e., the copper coverage rate in that area) and the total plating area required for each PCB board. These parameters together constitute a set of board-level physical characteristic parameters. Finally, based on this parameter set, the system calculates a theoretically optimal initial current density for each functional area on the mounting fixture. The set of these target values ​​constitutes the initial target current density distribution map.

[0033] This unit enables automated and refined analysis of PCB physical characteristics, replacing traditional manual estimation. By presetting differentiated target current densities for functional areas with different wiring structures, it provides scientific and reliable benchmark settings for subsequent precise control, ensuring the accuracy of the control target from the source. This is the theoretical basis for achieving ±10% safety window control.

[0034] Dynamic Status Monitoring Unit. Inside the electroplating tank, the system monitors the real-time total current flowing through each PCB board using high-precision shunts and micro-current sensors deployed on each hook path. Simultaneously, a distributed ion concentration sensor array deployed in layers and zones within the tank collects real-time copper ion concentration data at key monitoring points. These two sets of data constitute the dynamic status parameter set.

[0035] This invention enables real-time, distributed monitoring of key parameters in the electroplating process. Compared to traditional total current control or timed sampling and analysis, this invention can capture local, instantaneous current fluctuations and ion consumption, providing timely and accurate input data for dynamic prediction and closed-loop correction of the system.

[0036] Current density deviation risk prediction unit. This unit establishes a coupled model that fuses the "static" set of plate-level physical characteristic parameters with the "dynamic" set of dynamic state parameters. Through a specific algorithm, it can dynamically predict the predicted current density to be formed in each functional area under the current anode output. This predicted value is compared with the baseline value in the initial target current density distribution map to calculate the current density deviation index, which characterizes the risk of the electroplating quality in that area deviating from the process window.

[0037] By integrating static features and dynamic data, this unit can predict potential deviations in current density in advance, shifting the control timing from after a problem occurs to before it does. This "preemptive intervention" capability is key to achieving high-precision, high-stability control, significantly reducing the generation of defective products.

[0038] Closed-loop correction control unit. Once the current density deviation index of any functional zone is detected to be about to exceed the preset safety threshold, this unit immediately calculates a current correction factor for that zone. The system has prior knowledge of the spatial correspondence between each functional zone and each independently controllable anode zone within the tank. Based on this relationship, the system intelligently allocates the correction factor to one or more of the most relevant anode zones, updating their output current commands.

[0039] In this embodiment, the system achieves distributed, differentiated closed-loop correction. Current regulation is no longer applied to the entire electroplating tank, but is precisely targeted to specific functional areas, achieved through intelligent zone control of the anode. This approach provides rapid response and precise positioning, ultimately ensuring that the current density of each PCB and its functional areas on the mounting bracket is dynamically maintained within the optimal safety window, achieving precise, stable, and automated control of the entire system.

[0040] Example 2

[0041] Please see Figure 1 Specifically, the functional area includes:

[0042] The functional area includes at least one of a power supply area, a high-frequency signal area, and a grounding network area; and the wiring density is obtained by calculating the ratio of the wiring coverage area in each functional area to the total area of ​​the functional area.

[0043] The functional areas are clearly defined as power supply areas, high-frequency signal areas, and grounding network areas. These areas, due to their different electrical functions, naturally have different requirements for wiring density and copper thickness, making them key targets for differentiated control. Furthermore, the calculation method for wiring density is clarified: the ratio of the wiring coverage area within a functional area to the total area of ​​that functional area. This is a dimensionless, normalized parameter, facilitating subsequent calculations.

[0044] In this embodiment, the system makes the feature modeling process clearer and more operable, provides specific technical guidance for the subsequent establishment of accurate physical models, and enhances the practicality of the technical solution.

[0045] Example 3

[0046] Please see Figure 1 Specifically, when constructing the initial target current density distribution map, the feature modeling and target setting unit, based on the preset batch production average target current density, combines the difference between the wiring density of each functional area and the average wiring density of all printed circuit boards on the fixture, and adjusts it through a preset response coefficient to calculate a differentiated target current density for each functional area. The set of these target current densities constitutes the initial target current density distribution map.

[0047] The algorithm uses a preset "batch production average target current density" (set by process specifications) as the base value. It dynamically adjusts the target current density based on the difference between the actual wiring density of each functional area and the average wiring density of all PCBs on the mounting fixture, using a "response coefficient." Areas with denser wiring will have their target current density increased, and vice versa.

[0048] Formula and parameter explanation: The calculation formula is as follows:

[0049] ;

[0050] in: : No. The first PCB Target current density (unit: A / m²) for each functional zone.

[0051] The average target current density (unit: A / m²) for this batch of production is the process setting value.

[0052] The response coefficient (dimensionless) of wiring density to current demand was obtained through experimental calibration.

[0053] : No. The first PCB Wiring density of each functional area (dimensionless).

[0054] Average wiring density of all PCBs on the mounting bracket (dimensionless).

[0055] Dimensional verification: right side of the formula The dimension of is A / m². (The text inside the parentheses is missing.) , , , All parameters are dimensionless. Therefore, the overall dimension on the right is A / m², which is the same as that on the left. The dimensions are consistent.

[0056] In this embodiment, the system provides a scientific and quantitative target setting method, so that the initial target value is no longer a single empirical value, but a differentiated distribution map closely linked to the physical characteristics of the PCB itself, which greatly improves the accuracy of the control benchmark.

[0057] Example 4

[0058] Please see Figure 1 Specifically, the dynamic state parameter set further includes: the average measured current density of the single board, which is calculated by dividing the real-time total current of the single board by the corresponding total electroplating area; and the ion concentration consumption index, which is calculated by comparing the real-time copper ion concentration of the electroplating solution with a preset standard working concentration and a preset minimum threshold concentration; the average measured current density of the single board and the ion concentration consumption index are used together in the current density deviation risk prediction unit.

[0059] The raw monitoring data was further processed into two core indicators: the average measured current density per board and the ion concentration consumption index. The former is obtained by dividing the real-time total current of the board by its total electroplating area; the latter is obtained by comparing the real-time copper ion concentration with the standard working concentration and the minimum threshold concentration. This index intuitively reflects the degree of consumption of the local plating solution.

[0060] Formula and parameter descriptions:

[0061] Average measured current density per board:

[0062] ;

[0063] : No. Average measured current density of a PCB block (unit: A / m²).

[0064] : The monitored flow through the first Real-time total current of the PCB (unit: A).

[0065] : No. Total electroplating area of ​​the PCB (unit: m²). (Dimensional verification: [A / m²] = [A] / [m²], correct.)

[0066] Ion concentration consumption index:

[0067] ;

[0068] : No. Ion concentration consumption index (dimensionless) at each monitoring point.

[0069] Standard working concentration of electroplating solution (unit: mol / L).

[0070] : No. Real-time copper ion concentration of electroplating solution at each monitoring point (unit: mol / L).

[0071] : Minimum permissible threshold concentration (unit: mol / L). (Dimensional verification: Both numerator and denominator are mol / L, the ratio is dimensionless, correct).

[0072] In this embodiment, the system processes the raw, multi-dimensional monitoring data into standardized core indicators with clear physical meaning, which simplifies the complexity of the subsequent prediction model and improves the robustness and accuracy of the model.

[0073] Example 5

[0074] Please see Figure 1 Specifically, when predicting the predicted current density, the current density offset risk prediction unit adjusts the average measured current density of the single board of the printed circuit board in which each functional area is located. The adjustment amount is determined by multiplying the ion concentration consumption index of the monitoring point closest to the functional area by a preset weighting factor, thereby obtaining the predicted current density.

[0075] The algorithm is based on the average measured current density of a single plate and uses the ion concentration consumption index to locally correct it. The logic of the correction is: if the plating solution near a functional area is severely consumed (i.e., the consumption index is high), it is believed that the actual current density in that area will be suppressed and needs to be adjusted downward from the average value.

[0076] Formula and parameter descriptions:

[0077] ;

[0078] in:

[0079] The predicted first The first PCB Predicted current density for each functional zone (unit: A / m²).

[0080] : No. Average measured current density of a PCB block (unit: A / m²).

[0081] Distance from functional area Recent Ion concentration consumption index (dimensionless) at monitoring point No.

[0082] The weighting factor (dimensionless) for the effect of concentration consumption on current density was obtained through regression analysis of experimental data.

[0083] Dimensional verification: right side of the formula The dimension is A / m², and all terms within the parentheses are dimensionless. Therefore, the overall dimension on the right side is A / m², which is consistent with the dimension on the left side.

[0084] In this embodiment, the system for the first time couples the macroscopic electrical state (average current) of a single board with the microscopic chemical environment (local ion concentration), achieving accurate and dynamic prediction of current density at the functional area level. This is the core technology for achieving "pre-intervention".

[0085] Example 6

[0086] Please see Figure 1 Specifically, when calculating the current density deviation index, the current density deviation risk prediction unit compares the predicted current density with the target current density of the corresponding functional area in the initial target current density distribution map, and determines the current density deviation index as the ratio of the difference between the two to the target current density.

[0087] This index is defined as the percentage difference between the predicted current density and the target current density, relative to the target current density. It is a relative error that intuitively reflects the severity of the deviation from the process window.

[0088] Formula and parameter descriptions:

[0089] ;

[0090] in:

[0091] : No. The first PCB Current density deviation index of each functional zone (dimensionless).

[0092] Predicted current density (unit: A / m²).

[0093] Target current density (unit: A / m²).

[0094] Dimensional verification: The dimensions of the numerator and denominator are both A / m², and the ratio is dimensionless, which is correct.

[0095] In this embodiment, the system provides a standardized risk assessment index. When If the value exceeds a preset safety threshold (such as 0.1), the system can trigger a correction action, making the control logic have a basis for action.

[0096] Example 7

[0097] Please see Figure 1 Specifically, the closed-loop correction control unit uses proportional-integral control logic to generate a current correction factor, wherein the current correction factor consists of two parts: one part is proportional to the current density deviation index at the current moment, and the other part is proportional to the time cumulative value of the current density deviation index.

[0098] Employing a classic PI control algorithm, the correction action combines speed and stability. The proportional term (P) ensures a rapid response to the current deviation, while the integral term (I) eliminates long-term steady-state errors, ensuring an accurate return to the target value.

[0099] Formula and parameter descriptions:

[0100] ;

[0101] in:

[0102] :exist Time for functional area The calculated current correction factor (dimensionless).

[0103] and : These are the gain coefficients for proportional and integral control, respectively. Dimensionless The unit is 1 / s, used to adjust the speed and stability of the correction.

[0104] :exist Current density deviation index at time (dimensionless).

[0105] Dimensional verification: The term is dimensionless; The dimension of the term is [1 / s] * [dimensionless] * [s], resulting in a dimensionless term. The two parts have the same dimension, consistent with the dimensionless property of the correction factor.

[0106] In this embodiment, the system adopts a mature PI control algorithm, which ensures the dynamic performance of the closed-loop correction process. It can respond quickly to deviations and avoid system oscillations, thus ensuring stable and reliable control.

[0107] Example 8

[0108] Please see Figure 1 Specifically, when the closed-loop correction control unit corrects the output current of the anode region, it identifies the set of printed circuit board functional areas that mainly affect each anode region; it performs a weighted summation of the current correction factors of each functional area in the set with the geometric position correspondence of the anode region; and finally, based on the weighted summation result, it adjusts the current output current of the anode region to generate the corrected output current.

[0109] This method identifies the set of functional zones that are primarily affected by each anode region. The correction factors for all functional zones within this set are then weighted and summed based on their geometric correspondence with the anode region (i.e., correction weights). This final weighted sum is used to adjust the output current of the anode.

[0110] Formula and parameter descriptions:

[0111] ;

[0112] in:

[0113] Anode area Corrected output current (unit: A).

[0114] Anode area Current output current (unit: A).

[0115] Anode area The set of PCB functional areas that are primarily affected.

[0116] Functional Area The current correction factor (dimensionless).

[0117] Functional Area For the anode region The corrected weight (dimensionless), calculated based on geometric position, in a preferred embodiment, is this weight. Can be used with functional areas Geometric center to anode region The weight is inversely proportional to the square of the distance between the geometric centers. The closer the distance, the greater the influence and the higher the weight value. Of course, those skilled in the art can design more complex weight calculation models based on factors such as anode shape and electroplating tank flow field, such as Gaussian distribution model or empirical lookup table method. These are all within the scope of protection of this invention.

[0118] Dimensional verification: The dimension is A, and all items within the parentheses are dimensionless. Therefore, the overall dimension on the right side is A, which is consistent with the dimension on the left side.

[0119] In this embodiment, the system establishes an intelligent allocation strategy from logical correction quantities to physical execution quantities. It accurately and weightedly maps the virtual corrections for functional areas to the physical anodes, realizing distributed and differentiated current regulation, which is the ultimate guarantee for the accurate implementation of the entire closed-loop control.

[0120] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the present invention should still fall within the scope of the present invention.

Claims

1. An automated industrial control system for the copper embedding process of printed circuit boards, characterized in that, include: The feature modeling and target setting unit is used to divide the layout of each printed circuit board into multiple functional areas based on the design file of the printed circuit board to be processed. Based on the division result, a set of board-level physical characteristic parameters is generated, which includes the wiring density of each functional area and the total electroplating area of ​​each board; based on the set of board-level physical characteristic parameters, an initial target current density distribution map is constructed for each functional area as a reference setting value for the electroplating process. The dynamic status monitoring unit is used to monitor the real-time total current of each printed circuit board on the electroplating rack, as well as the real-time copper ion concentration of the electroplating solution at multiple monitoring points in the electroplating tank, forming a dynamic status parameter set. The current density offset risk prediction unit is used to couple the board-level physical characteristic parameter set with the dynamic state parameter set to dynamically predict the predicted current density of each functional area; compare the predicted current density with the initial target current density distribution map, and calculate the current density deviation index characterizing the offset risk. A closed-loop correction control unit is used to generate a current correction factor for the corresponding functional area when the current density deviation index exceeds a preset safety threshold. Based on the spatial correspondence between the functional area and multiple independently controllable anode areas in the electroplating tank, the current correction factor is allocated to one or more of the anode areas to correct their output current, thereby dynamically maintaining the current density of each functional area within the safety threshold.

2. The automated industrial control system for copper embedding process of printed circuit boards according to claim 1, characterized in that, The functional area includes at least one of a power supply area, a high-frequency signal area, and a grounding network area; and the wiring density is obtained by calculating the ratio of the wiring coverage area in each functional area to the total area of ​​the functional area.

3. The automated industrial control system for copper embedding process of printed circuit boards according to claim 1, characterized in that, When constructing the initial target current density distribution map, the feature modeling and target setting unit, based on the batch production average target current density set by the process specification, and combined with the difference between the wiring density of each functional area and the average wiring density of all printed circuit boards on the fixture, adjusts the target current density through a preset response coefficient to calculate a differentiated target current density for each functional area. The set of these target current densities constitutes the initial target current density distribution map.

4. The automated industrial control system for copper embedding process of printed circuit boards according to claim 1, characterized in that, The dynamic state parameter set includes: the average measured current density of the single board, which is calculated by dividing the real-time total current of the single board by the corresponding total electroplating area; and the ion concentration consumption index, which is calculated by comparing the real-time copper ion concentration of the electroplating solution with the preset standard working concentration and the preset minimum threshold concentration. The average measured current density of the single board and the ion concentration consumption index are used together in the current density deviation risk prediction unit.

5. The automated industrial control system for copper embedding process of printed circuit boards according to claim 4, characterized in that, When predicting the predicted current density of each functional area, the current density offset risk prediction unit adjusts the current density of each functional area based on the average measured current density of the single board of the printed circuit board in which it is located. The adjustment amount is determined by multiplying the ion concentration consumption index of the monitoring point closest to the functional area by a preset weighting factor, thereby obtaining the predicted current density.

6. The automated industrial control system for copper embedding process of printed circuit boards according to claim 5, characterized in that, When calculating the current density deviation index, the current density deviation risk prediction unit compares the predicted current density with the target current density of the corresponding functional area in the initial target current density distribution map, and determines the current density deviation index as the ratio of the difference between the two to the target current density.

7. The automated industrial control system for copper embedding process of printed circuit boards according to claim 1, characterized in that, The closed-loop correction control unit uses proportional-integral control logic to generate a current correction factor, which consists of two parts: one part is proportional to the current density deviation index at the current moment, and the other part is proportional to the time cumulative value of the current density deviation index.

8. The automated industrial control system for copper embedding process of printed circuit boards according to claim 7, characterized in that, When correcting the output current of the anode region, the closed-loop correction control unit identifies the set of printed circuit board functional areas that mainly affect each anode region; it performs a weighted summation of the current correction factors of each functional area within the set of printed circuit board functional areas and the geometric position correspondence of the anode region; and finally, based on the weighted summation result, it adjusts the current output current of the anode region to generate the corrected output current.

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